CN102164006B - Dual-channel compact small from-factor pluggable circuit - Google Patents

Dual-channel compact small from-factor pluggable circuit Download PDF

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Publication number
CN102164006B
CN102164006B CN201110061924.9A CN201110061924A CN102164006B CN 102164006 B CN102164006 B CN 102164006B CN 201110061924 A CN201110061924 A CN 201110061924A CN 102164006 B CN102164006 B CN 102164006B
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China
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signal
chip
optical
transceiver
circuit
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CN201110061924.9A
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CN102164006A (en
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陈钢
赵家闯
宛明
周美娜
赵迎春
曹阳
陈慧
黄晓雷
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成都新易盛通信技术股份有限公司
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Publication of CN102164006B publication Critical patent/CN102164006B/en

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Abstract

The invention discloses a dual-channel compact small from-factor pluggable circuit, which relates to an optical communication technology, in particular to an optical module circuit realizing photoelectric signal conversion in optical communication. The designing key points of the circuit are that: the circuit comprises an interface circuit, a microcontroller, a first bi-directional optical sub-assembly, a second bi-directional optical sub-assembly, a first integrated transceiver chip, a second integrated transceiver chip and a power starting circuit, wherein the first bi-directional optical sub-assembly and the first integrated transceiver chip form a first optical channel; the second bi-directional optical sub-assembly and the second integrated transceiver chip form a second optical channel; the electric signal output ends of the bi-directional optical sub-assemblies of each optical channel are connected with the electric signal receiving ends of the integrated transceiver chips of the same optical channel; and the interface circuit is used for realizing the communication of the microcontroller, signal interfaces of the two integrated transceiver chips and the power starting circuit with an upper computer. The dual-channel compact small from-factor pluggable circuit has the advantages of low cost, simple circuit structure and small size.

Description

A kind of Dual-channel compact small from-factor pluggable circuit
Technical field
The present invention relates to optical communication technique, relate in particular to a kind of compact pluggable light transceiving module circuit structure.
Background technology
Abbreviation definition:
BOSA:(Bi-directional Optical Sub-Assembly) optical transceiver module interface module;
CSFP:(Compact Small From-Factor Pluggable) compact small from-factor pluggable;
SFP:(Small From-Factor Pluggable) SFP optical module;
MSA:(Multi-Source Agreement) multi-source agreement;
PLC:(Planar optical waveguide) planar optical waveguide;
PCB:(Printed Circuit Board) printed circuit board;
TO38/TO56/TO46: the packing forms of the different mechanical dimensions of optical device chip, more expensive being of little use of the less price of TO38 size wherein, TO56 and TO46 are conventional mechanical dimension's structure;
DDM:(Digital Diagnostic Monitor) digital diagnostic monitoring.
Along with the development of optical fiber communication, optical transmission system is had higher requirement to optical module.Optical module is gradually to low cost, small size, large capacity future development.In order to reach large capacity and undersized requirement, CSFP MSA(Multi Source Agreement) League of Nations has proposed to adopt traditional SFP industrial standard overall dimensions single channel SFP MSA mechanical structure domestic demand to realize the requirement of the CSFP optical module of binary channels transfer of data, thereby and then makes original SFP panel space obtain double utilization to have improved port utilization ratio.
To in single pass SFP module, place twin-channel CSFP, the size of twin-channel CSFP, integrated level are had higher requirement.For the selection of binary channels CSFP optical device, employing scheme is in the industry for adopting PLC technique or adopting small-sized package BOSA, as adopted the BOSA that encapsulation specification is TO38.
But it is high that currently used PLC technology light transmitting-receiving subassembly exists encapsulation technology to require, the shortcoming such as the higher and design flexibility of cost is poor, meanwhile, the monopolization of Jun You overseas enterprise is produced and sold to this light transmitting-receiving subassembly.In addition, adopt PLC technique, laser and light signal receiving terminal chip all need to be arranged on the fixed position of fiber waveguide, if need, changing chip model need to newly research and develop whole optical transceiver module interface module, can not meet customization requirement.
Although the free space coupling optical transceiver module interface module size of TO38 encapsulation is less, TO38 size optical chip generally can not used in conventional SFP optical module, and this has also caused the features such as its price is higher, and encapsulation technology is immature.Meanwhile, utilizing the BOSA structure of this TO38 size encapsulation is also offbeat form, has further increased the cost of optical module.
At optical device, drive and optical signal amplifying broad aspect, the traditional method of optical module manufacturer is the dual chip scheme that adopts laser driver element and limited range enlargement unit to separate in the industry.But due to the restriction of mechanical dimension aspect, twin-channel CSFP has higher requirement to selected chip size and function, dual chip scheme can not meet CSFP design needs.For digital diagnostic monitoring module, conventionally adopt in the industry microcontroller to carry out analog-to-digital conversion to all analog quantitys of monitoring that need, and result is carried out to computing conversion and outputed to host computer.The analog-to-digital conversion of the method need to increase a large amount of external component and increase the difficulty of algorithm, and then increases the cost of optical module.
Summary of the invention
The object of the invention is to provide a kind of for deficiency of the prior art and meet binary channels CSFP consensus standard, low cost, integrated level is high, circuit structure is simple, volume is little, have great receiving terminal power monitoring dynamic range, highly sensitive binary channels compact SFP optical module (being designated hereinafter simply as optical module) circuit.
The technical solution used in the present invention is such: a kind of Dual-channel compact small from-factor pluggable circuit, comprise interface circuit, microcontroller, the first optical transceiver module assembly and the second optical transceiver module assembly, it is characterized in that, also comprise the first transceiver chip and the second transceiver chip, power starting circuit; Described power starting circuit is used for to microcontroller and two groups of transceiver chip power supplies; The electrical signal of the first optical transceiver module assembly is connected with the signal of telecommunication receiving terminal of the first transceiver chip, and the laser of the first transceiver chip drives signal output part to drive signal receiving end to be connected with the laser of the first optical transceiver module assembly; The electrical signal of the second optical transceiver module assembly is connected with the signal of telecommunication receiving terminal of the second transceiver chip, and the laser of the second transceiver chip drives signal output part to drive signal receiving end to be connected with the laser of the second optical transceiver module assembly; Described microcontroller has signal line to be connected with the first transceiver chip with the second transceiver chip respectively; Described interface circuit is for realizing these three circuit modules of signaling interface of microcontroller, two groups of transceiver chips and communicating by letter of host computer.
Preferably, described power starting circuit is power supply soft-start circuit; Host computer provides input power by interface circuit to power supply soft-start circuit.
Preferably, the described first or second optical transceiver module assembly also comprises received signal strength indicator output, optical output power of laser pilot signal output;
The described first or second transceiver chip internal comprises: chip configuration and signal gathering unit, limited range enlargement unit and laser driver element, transmitting terminal Signal Fail index signal output; The first or second transceiver chip is also lost index signal by interface circuit to host computer output receiving end signal;
Microcontroller has signal to be connected with chip configuration and the collecting unit of two groups of transceiver chips;
In every group of transceiver chip, chip configuration and collecting unit also have signal to be connected with limited range enlargement unit, laser driver element respectively;
The chip configuration of described the first transceiver chip and signal gathering unit receive received signal strength indicator and the optical output power of laser pilot signal of the first optical transceiver module assembly output, the limited range enlargement cell signal input of the first transceiver chip is connected with the electrical signal of the first optical transceiver module assembly, and the limited range enlargement unit electrical signal of the first transceiver chip is connected with host computer by interface circuit; The laser driver element signal output part of the first transceiver chip drives signal receiving end to be connected with the laser of the first optical transceiver module assembly, and the laser driver element electric signal input end of the first transceiver chip is connected with host computer by interface circuit;
The chip configuration of described the second transceiver chip and signal gathering unit receive received signal strength indicator and the optical output power of laser pilot signal of the second optical transceiver module assembly output; The limited range enlargement cell signal input of the second transceiver chip is connected with the electrical signal of the second optical transceiver module assembly, and the limited range enlargement unit electrical signal of the second transceiver chip is connected with host computer by interface circuit; The laser driver element signal output part of the second transceiver chip drives signal receiving end to be connected with the laser of the second optical transceiver module assembly, and the laser driver element electric signal input end of the second transceiver chip is connected with host computer by interface circuit.
Preferably, also comprise module inefficacy decision unit; Described module inefficacy decision unit is for receiving the transmitting terminal Signal Fail index signal of the first transceiver chip and the second transceiver chip output, and described module inefficacy decision unit is output as the result that transmitting terminal Signal Fail index signal that the first transceiver chip and the second transceiver chip export is made exclusive disjunction; And the output signal of module inefficacy decision unit transfers to host computer by interface circuit.
Preferably, also comprise the first filter and the second filter;
Described first and second optical transceiver module component internal comprises laser diode, optical detection diode and trans-impedance amplifier; Wherein, laser diode is for transforming into the signal of telecommunication sending from transceiver integrated chip light signal output; Optical detection diode is for being converted into faint current signal by the light signal of input; Trans-impedance amplifier is converted into voltage signal for the current signal that optical detection diode is exported, and by this voltage signal output;
Between the input of the limiting amplifier in the output of the trans-impedance amplifier of described the first optical transceiver module assembly and the first transceiver chip, be connected to the first filter;
Between the input of the limiting amplifier in the output of the trans-impedance amplifier of described the second optical transceiver module assembly and the second transceiver chip, be connected to the second filter.
Preferably, also comprise the first filter and the second filter;
The first filter accesses in the signal path between the first optical transceiver module assembly and the first transceiver chip, the noise for filtering the first optical transceiver module assembly to the signal of telecommunication of the first transceiver chip output;
The second filter accesses in the signal path between the second optical transceiver module assembly and the second transceiver chip, the noise for filtering the second optical transceiver module assembly to the signal of telecommunication of the second transceiver chip output.
Preferably, the described first or second filter is Bessel filter.
Preferably, also comprise temperature collecting cell, described temperature collecting cell is for being converted to the signal of telecommunication by temperature signal, and by this electric signal transmission to microcontroller.
Preferably, described microcontroller, interface circuit, two groups of transceiver chips, temperature collection circuit, low pass filter and module inefficacy decision units are arranged on a pcb board.
Preferably, described two groups of optical transceiver module assemblies communicate by the impedance matching transmission line that arranges on soft board and transceiver chip and the filter on pcb board.
In sum, owing to having adopted technique scheme, the invention has the beneficial effects as follows:
Transceiver chip internal integrated clipping amplifier unit and laser driver element that the present invention adopts, have advantages of that circuit structure is simple, integrated level is high;
The intensity of input optical power when the design adopts microcontroller configuration transceiver chip to lose so that receiving end signal to be set, and then convenient production and debugging.
The present invention disturbs by increasing Bezier low pass filter filtered signal bandwidth high-frequency noise in addition in the signal path between each group optical transceiver module assembly and transceiver chip, optical module sensitivity has been improved to 1~3dB, improved the jamproof performance of optical receiver.
The transceiver chip that the present invention adopts adopts trans-impedance amplifier that the current signal of the received signal strength indicator of optical transceiver module interface module output is converted into voltage signal, and this voltage analog signal is transformed into digital signal and deposited in chip internal register with the collection of the receiving end luminous power that achieves a butt joint by the analog to digital conversion circuit of transceiver built-in chip type.Adopt similar mode, transceiver chip utilizes chip internal integrated analog digit converter to gather laser bias current, optical output power of laser and chip voltage, and deposits transformation result in chip internal corresponding register.Micro controller unit by and transceiver chip between I2C bus read the transformation result of chip internal storage.The register of the correspondence position that meanwhile, microcontroller is simply changed acquisition transformation result and stored into according to CSFP MSA.The I2C bus access microcontroller of host computer by 20PIN electrical interface is to obtain the numerical diagnostic result of CSFP optical module.
In the present invention, micro controller unit is realized A0H, B0H, A2H, the B2H register mappings of CSFP MSA definition by software.For the design of digital diagnostic monitoring (DDM), existing universal method is directly by the collection of microcontroller and the information such as transmitting optical power, received optical power, module temperature, module voltage and bias current of D/A conversion unit acquisition optical module.For single pass SFP, this method for designing can meet the demands substantially, but for twin-channel CSFP, if adopt collection and the translation burden of universal method microcontroller in the industry to double, microcontroller performance and program complexity had higher requirement.In the present invention, except temperature information, other all collection of simulant signal gathers by transceiver chip, and then has reduced greatly programming complexity, has reduced peripheral components.
Compare with traditional optical module, the all indexs that need debugging of CSFP in the present invention (comprise power index, extinction ratio index, dropout amplitude arrange etc.) all can arrange by computer automation software and be convenient to mass automatic production, and then the cost that has further reduced module has improved the reliability of module.
Accompanying drawing explanation
Examples of the present invention will be described by way of reference to the accompanying drawings, wherein:
Fig. 1 is schematic block circuit diagram of the present invention.
Fig. 2 is light channel structure and signal transmission schematic diagram in the present invention.
Fig. 3 is the front of 20PIN electrical interface circuit board of the present invention.
Fig. 4 is the reverse side of 20PIN electrical interface circuit board of the present invention.
Embodiment
Disclosed all features in this specification, or the step in disclosed all methods or process, except mutually exclusive feature and/or step, all can combine by any way.
Disclosed arbitrary feature in this specification (comprising any accessory claim, summary and accompanying drawing), unless narration especially all can be replaced by other equivalences or the alternative features with similar object.That is,, unless narration especially, each feature is an example in a series of equivalences or similar characteristics.
As Fig. 1, binary channels compact optical module of the present invention comprises that the interface circuit, power starting circuit, microcontroller, two groups of transceiver chips, two-way general light transceiver module assembly, module inefficacy decision unit, the temperature collecting cells that meet CSFP MSA definition form.
Described power starting circuit is the power supply soft-start circuit by electric capacity, gate circuit mix proportion, and the power supply that enters to hold of power supply soft-start circuit is provided by host computer, and its power supply output is connected with two groups of transceiver chips and microcontroller chip respectively.After optical module connecting system, the slow start unit of this power supply affects to reduce in powered on moment capacitive load follow-up transceiver chip and microcontroller chip power-on delay on the power generation of host computer.
Optical transceiver module assembly adopts the BOSA of traditional TO56/TO46 encapsulation.Its inside comprises laser diode, optical detection diode and trans-impedance amplifier.Wherein, laser diode transforms into the signal of telecommunication sending from transceiver integrated chip light signal and outputs to external fiber; Optical detection diode will be converted into faint current signal from the light signal of optical fiber input, then by trans-impedance amplifier thereafter, current signal will be converted into voltage signal, and by this voltage signal output.
Temperature collecting cell is transferred to microcontroller after the temperature signal of collection is converted to the signal of telecommunication; The major function of microcontroller is by I2C bus and host computer communicates and two groups of integrated chips, temperature collection circuits are configured according to the configuration information of host computer by I2C bus, the state information of this three part and temperature information is transferred to host computer simultaneously.
As Fig. 2, it is the composition of one of them passage of binary channels CSFP.Transceiver chip comprises chip configuration and signal gathering unit, limited range enlargement unit and laser driver element, transmitting terminal Signal Fail index signal output; Described chip configuration and collecting unit have signal to be connected with limited range enlargement unit, laser driver element respectively; Chip configuration and collecting unit are for maintaining the necessary configuration effort of its normal work according to the configuration information of controller to the limited range enlargement unit of chip internal, laser driver element; Chip configuration and collecting unit also receive received signal strength indicator and the optical output power of laser pilot signal from the output of optical transceiver module assembly.
By receiving, the signal of telecommunication further amplifies and the signal after amplifying is transferred to host computer in limiting amplifier unit in transceiver chip.Laser driver unit is that the voltage signal transmitting from host computer is converted into the modulated current signal of drive laser and modulated current signal is transferred to the laser diode optical transceiver module assembly, produces light signal output.
Transceiver chip is also lost index signal to host computer output receiving end signal; Transceiver chip has transmitting terminal Signal Fail index signal output, for exporting transmitting terminal Signal Fail index signal.
Transceiver chip adopts trans-impedance amplifier that the current signal of the received signal strength indicator of optical transceiver module interface module output is converted into voltage signal, and this voltage analog signal is transformed into digital signal and deposited in chip internal register with the collection of the receiving end luminous power that achieves a butt joint by the analog to digital conversion circuit of transceiver built-in chip type.Adopt similar mode, transceiver chip utilizes chip internal integrated analog digit converter to gather laser bias current, optical output power of laser and chip voltage, and deposits transformation result in chip internal corresponding register.Micro controller unit by and transceiver chip between I2C bus read the transformation result of chip internal storage.Meanwhile, the register of the correspondence position that microcontroller is simply changed acquisition transformation result and stored into according to CSFP MSA, microcontroller is realized A0H, B0H, A2H, the B2H register mappings of CSFP MSA definition by software.The I2C bus access microcontroller of host computer by 20PIN electrical interface is to obtain the numerical diagnostic result of CSFP optical module.
Dual-channel compact small from-factor pluggable circuit disclosed by the invention is provided with the first transceiver chip, the second transceiver chip, the first optical transceiver module assembly, the second optical transceiver module assembly.The first optical channel is comprised of the first transceiver chip and the first optical transceiver module assembly; The second optical channel is comprised of the second transceiver chip and the second optical transceiver module assembly.
The chip configuration of described the first transceiver chip and signal gathering unit receive received signal strength indicator and the optical output power of laser pilot signal of the first optical transceiver module assembly output, the limited range enlargement cell signal input of the first transceiver chip is connected with the electrical signal of the first optical transceiver module assembly, the signal of telecommunication after the limited range enlargement unit of the first transceiver chip amplifies to host computer output by interface circuit; The laser driver element signal output part of the first transceiver chip drives signal receiving end to be connected with the laser of the first optical transceiver module assembly; The laser driver element signal of the first transceiver chip receives the signal of telecommunication to be sent of host computer output by interface circuit.
In the second optical channel, the second transceiver chip is identical with the connected mode of first passage with second annexation of optical transceiver module assembly, at this, is no longer repeated in this description.
Module inefficacy decision unit is for receiving the transmitting terminal Signal Fail index signal of the first transceiver chip and the second transceiver chip output, and described module inefficacy decision unit is output as the result that transmitting terminal Signal Fail index signal that the first transceiver chip and the second transceiver chip export is made exclusive disjunction; And the output signal of module inefficacy decision unit transfers to host computer.
In described microcontroller, two groups of transceiver chips, the slow start unit of power supply and module inefficacy decision unit four parts, all interfaces that need to set up communication with host computer or be electrically connected to are all connected with host computer by interface circuit.As Fig. 4, described interface circuit is the 20PIN electric interface unit of CSFP MSA definition.The 20PIN electric interface unit that the present invention adopts and traditional SFP pin compatibility, can use binary channels CSFP optical module of the present invention and conventional single channel SFP module instead and not produce any problem.
In optical module design, one of principal element that affects optical module sensitivity is cross-interference issue.The present invention can increase low pass filter between the electrical signal of optical transceiver module assembly of every group of optical channel and the signal of telecommunication receiving terminal of transceiver chip, particularly, be that the high-frequency noise increasing between the output of trans-impedance amplifier of optical transceiver module assembly and the input stage of the limiting amplifier in transceiver chip beyond Bezier low pass filter filtered signal bandwidth disturbs.
As the execution mode of optical module circuit of the present invention, interface circuit, microprocessor, two groups of transceiver chips, temperature collection circuit, low pass filter and module inefficacy decision units can be arranged on a pcb board.In every group of optical channel, the reception of optical transceiver module assembly communicates by the impedance matching transmission line that arranges on soft board and transceiver chip and the filter on pcb board.With respect to prior art, the present invention has only retained necessary welding pin in soft board design process, has further reduced soft board and has welded shared space.
The present invention is not limited to aforesaid embodiment.The present invention expands to any new feature or any new combination disclosing in this manual, and the arbitrary new method disclosing or step or any new combination of process.

Claims (9)

1. a Dual-channel compact small from-factor pluggable circuit, comprise interface circuit, microcontroller, the first optical transceiver module assembly and the second optical transceiver module assembly, it is characterized in that, also comprise the first transceiver chip and the second transceiver chip, power starting circuit; Described power starting circuit is used for to microcontroller and two groups of transceiver chip power supplies; The electrical signal of the first optical transceiver module assembly is connected with the signal of telecommunication receiving terminal of the first transceiver chip, and the laser of the first transceiver chip drives signal output part to drive signal receiving end to be connected with the laser of the first optical transceiver module assembly; The electrical signal of the second optical transceiver module assembly is connected with the signal of telecommunication receiving terminal of the second transceiver chip, and the laser of the second transceiver chip drives signal output part to drive signal receiving end to be connected with the laser of the second optical transceiver module assembly; Described microcontroller has signal line to be connected with the first transceiver chip with the second transceiver chip respectively; Described interface circuit is for realizing these three circuit modules of signaling interface of microcontroller, two groups of transceiver chips and communicating by letter of host computer;
The described first or second transceiver chip internal comprises: limited range enlargement unit and laser driver element;
The limited range enlargement cell signal input of the first transceiver chip is connected with the electrical signal of the first optical transceiver module assembly, and the limited range enlargement unit electrical signal of the first transceiver chip is connected with host computer by interface circuit; The laser driver element signal output part of the first transceiver chip drives signal receiving end to be connected with the laser of the first optical transceiver module assembly, and the laser driver element electric signal input end of the first transceiver chip is connected with host computer by interface circuit;
The limited range enlargement cell signal input of the second transceiver chip is connected with the electrical signal of the second optical transceiver module assembly, and the limited range enlargement unit electrical signal of the second transceiver chip is connected with host computer by interface circuit; The laser driver element signal output part of the second transceiver chip drives signal receiving end to be connected with the laser of the second optical transceiver module assembly, and the laser driver element electric signal input end of the second transceiver chip is connected with host computer by interface circuit;
Described power starting circuit is power supply soft-start circuit; Host computer provides input power by interface circuit to power supply soft-start circuit.
2. a kind of Dual-channel compact small from-factor pluggable circuit according to claim 1, is characterized in that, the described first or second optical transceiver module assembly also comprises received signal strength indicator output, optical output power of laser pilot signal output;
The described first or second transceiver chip internal also comprises: chip configuration and signal gathering unit, transmitting terminal Signal Fail index signal output; The first or second transceiver chip is also lost index signal by interface circuit to host computer output receiving end signal;
Microcontroller has signal to be connected with chip configuration and the signal gathering unit of two groups of transceiver chips;
In every group of transceiver chip, chip configuration and signal gathering unit also have signal to be connected with limited range enlargement unit, laser driver element respectively;
The chip configuration of described the first transceiver chip and signal gathering unit receive received signal strength indicator and the optical output power of laser pilot signal of the first optical transceiver module assembly output;
The chip configuration of described the second transceiver chip and signal gathering unit receive received signal strength indicator and the optical output power of laser pilot signal of the second optical transceiver module assembly output.
3. a kind of Dual-channel compact small from-factor pluggable circuit according to claim 2, is characterized in that, also comprises module inefficacy decision unit; Described module inefficacy decision unit is for receiving the transmitting terminal Signal Fail index signal of the first transceiver chip and the second transceiver chip output, and described module inefficacy decision unit is output as the result that transmitting terminal Signal Fail index signal that the first transceiver chip and the second transceiver chip export is made exclusive disjunction; And the output signal of module inefficacy decision unit transfers to host computer by interface circuit.
4. a kind of Dual-channel compact small from-factor pluggable circuit according to claim 3, is characterized in that, also comprises the first filter and the second filter;
Described first and second optical transceiver module component internal comprises laser diode, optical detection diode and trans-impedance amplifier; Wherein, laser diode is for transforming into the signal of telecommunication sending from transceiver integrated chip light signal output; Optical detection diode is for being converted into faint current signal by the light signal of input; Trans-impedance amplifier is converted into voltage signal for the current signal that optical detection diode is exported, and by this voltage signal output;
Between the input of the limiting amplifier in the output of the trans-impedance amplifier of described the first optical transceiver module assembly and the first transceiver chip, be connected to the first filter;
Between the input of the limiting amplifier in the output of the trans-impedance amplifier of described the second optical transceiver module assembly and the second transceiver chip, be connected to the second filter.
5. a kind of Dual-channel compact small from-factor pluggable circuit according to claim 1, is characterized in that, also comprises the first filter and the second filter;
The first filter accesses in the signal path between the first optical transceiver module assembly and the first transceiver chip, the noise for filtering the first optical transceiver module assembly to the signal of telecommunication of the first transceiver chip output;
The second filter accesses in the signal path between the second optical transceiver module assembly and the second transceiver chip, the noise for filtering the second optical transceiver module assembly to the signal of telecommunication of the second transceiver chip output.
6. according to a kind of Dual-channel compact small from-factor pluggable circuit described in claim 4 or 5, it is characterized in that, the described first or second filter is Bessel filter.
7. a kind of Dual-channel compact small from-factor pluggable circuit according to claim 6, is characterized in that, also comprises temperature collecting cell, and described temperature collecting cell is for being converted to the signal of telecommunication by temperature signal, and by this electric signal transmission to microcontroller.
8. a kind of Dual-channel compact small from-factor pluggable circuit according to claim 7, it is characterized in that, described microcontroller, interface circuit, two groups of transceiver chips, temperature collection circuit, low pass filter and module inefficacy decision units are arranged on a pcb board.
9. a kind of Dual-channel compact small from-factor pluggable circuit according to claim 8, it is characterized in that, described two groups of optical transceiver module assemblies communicate by the impedance matching transmission line that arranges on soft board and transceiver chip and the filter on pcb board.
CN201110061924.9A 2011-03-15 2011-03-15 Dual-channel compact small from-factor pluggable circuit CN102164006B (en)

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103516432A (en) * 2012-06-25 2014-01-15 杭州通兴电子有限公司 Continuous optical receiver
CN104348549A (en) * 2013-08-08 2015-02-11 杨泽清 Slave node circuit for plastic optical fiber communication
CN104836621A (en) * 2015-05-25 2015-08-12 博为科技有限公司 Optical network equipment
JP6733912B2 (en) * 2015-09-30 2020-08-05 日本電気株式会社 Pluggable optical module and optical communication system
CN105572821B (en) * 2016-03-21 2018-04-06 四川新易盛通信技术有限公司 A kind of double transmitting SFP optical modules of low rate
CN107517083A (en) * 2016-06-17 2017-12-26 中兴通讯股份有限公司 A kind of method and device of data transfer
US10484100B2 (en) 2017-08-25 2019-11-19 Source Photonics (Chengdu) Co. Ltd. Optical module, optical module system and monitor method using the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2836342Y (en) * 2005-11-03 2006-11-08 黄兰 Single-fiber bidirectional burst-mode optical module
CN201314962Y (en) * 2008-11-25 2009-09-23 青岛海信宽带多媒体技术股份有限公司 Optical module capable of receiving multipath optical signal
CN201392411Y (en) * 2009-03-12 2010-01-27 苏州旭创科技有限公司 Novel low power consumption 10G SFP+LR optical module

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2836342Y (en) * 2005-11-03 2006-11-08 黄兰 Single-fiber bidirectional burst-mode optical module
CN201314962Y (en) * 2008-11-25 2009-09-23 青岛海信宽带多媒体技术股份有限公司 Optical module capable of receiving multipath optical signal
CN201392411Y (en) * 2009-03-12 2010-01-27 苏州旭创科技有限公司 Novel low power consumption 10G SFP+LR optical module

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