CN102153044A - Micro electro-mechanical system encapsulation module - Google Patents

Micro electro-mechanical system encapsulation module Download PDF

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Publication number
CN102153044A
CN102153044A CN 201010115747 CN201010115747A CN102153044A CN 102153044 A CN102153044 A CN 102153044A CN 201010115747 CN201010115747 CN 201010115747 CN 201010115747 A CN201010115747 A CN 201010115747A CN 102153044 A CN102153044 A CN 102153044A
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CN
China
Prior art keywords
chamber
spacer
carrier
carrier plate
micro
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CN 201010115747
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Chinese (zh)
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CN102153044B (en
Inventor
叶人铨
田烔岳
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菱生精密工业股份有限公司
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Priority to CN201010115747.3A priority Critical patent/CN102153044B/en
Publication of CN102153044A publication Critical patent/CN102153044A/en
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Abstract

The invention discloses a micro electro-mechanical system encapsulation module. The micro electro-mechanical system encapsulation module comprises a support plate, a close cover for covering the support plate, a spacer arranged between the support plate and the close cover, and a chip which is arranged on the spacer and electrically connected with the support plate, wherein the close cover is provided with a cavity and a receiving hole communicated with the outside; the spacer is provided with a curved channel communicated with the cavity and the receiving hole; and the chip is positioned in the cavity of the close cover and corresponds to the curved channel so that an outside signal can be transmitted to the chip through the receiving hole of the close cover and the curved channel of the spacer. Therefore, the micro electro-mechanical system encapsulation module fulfills the aims of simplifying the process and improving the yield rate of products at the same time.

Description

微机电封装模块 MEMS package module

技术领域 FIELD

[0001] 本发明涉及微机电封装模块,特别是指一种可简化工艺且提高产品良率的微机电封装模块。 [0001] The present invention relates to micro-electromechanical package module, particularly to a simplified process and product yield improved MEMS package module.

背景技术 Background technique

[0002] 为了提高微机电封装模块的性能,必须在封装时考虑到机械支持与环境因素如噪声干扰的问题,其中,有些微机电封装模块的构造较为特殊,以微机电麦克风为例,由芯片的下方接收外界的信号,故基板必须形成一曲折通道与微机电麦克风的芯片相通,以达到接收信号的目的。 [0002] In order to improve the performance MEMS module package, the package must be considered a problem when environmental factors such as mechanical support and noise, wherein the configuration of some MEMS package module more specific to the MEMS microphone as an example, by the chip below the chip to receive external signals, it is necessary to form the substrate with a MEMS microphone tortuous passage communicates, to achieve the purpose of the received signal.

[0003] 以现有技术而言,基板必须由多个板体堆叠而成,才能形成出曲折通道,但是此种结构设计不仅制造成本高,同时会让基板的厚度增加,连带影响微机电封装模块的整体体积。 [0003] In the prior art, the substrate must be formed by stacking a plurality of plates, in order to form a tortuous path, but this design is not only expensive to manufacture, at the same time will increase the thickness of the substrate, also affect MEMS package overall volume of the module. 另外还有一种设计是将导线架当作基板使用,但是在使用前必须先将镂空处填补绝缘胶,工艺同样相当复杂,并且在回焊的过程中容易变形,导致产品的良率降低。 There is also a lead frame design is used as a substrate, but the insulating plastic must be filled at first hollow before use, the same process is quite complex, and is easily deformed during the reflow, resulting in decreased product yield.

发明内容 SUMMARY

[0004] 本发明的主要目的在于提供一种微机电封装模块,其可减少整体厚度以降低制造成本,并可简化工艺以提升产品良率。 [0004] The main object of the present invention is to provide a microelectromechanical package module, which may reduce the overall thickness to reduce manufacturing costs, and simplify the process to improve the product yield.

[0005] 为了达成上述目的,本发明的微机电封装模块包含有一载板、一封盖、一间隔件, 以及一芯片。 [0005] To achieve the above object, a micro-electromechanical package module according to the present invention comprises a carrier plate, a cover, a spacer member, and a chip. 该封盖盖合于该载板的表面,并具有一腔室与一连通外界的接收孔;该间隔件设于该载板与该封盖之间,并于内部具有一连通该腔室与该接收孔的曲折通道;该芯片设于该间隔件而对应于该曲折通道,同时位于该封盖的腔室内并与该载板电性连接,使得外界信号能够经由该封盖的接收孔与该间隔件的曲折通道而传递至该芯片。 The closure cap bonded to the surface of the carrier plate, and having a receiving bore with a chamber in communication with the outside; the spacer member disposed between the carrier plate and the cover and having an inside communicating with the chamber the tortuous passage receiving bore; the chip is disposed on the spacer and corresponding to the tortuous path, while the closure is located in the chamber and connected electrically to the carrier plate, so that the external signals can be received through the aperture and closure the tortuous path spacer member is transmitted to the chip.

[0006] 通过上述的设计,本发明的微机电封装模块确实能够达到减少整体厚度,降低制造成本,简化制造过程,以及提升产品良率的目的。 [0006] By the above-described design, MEMS package module according to the present invention does reduce the overall thickness can be achieved, reducing the manufacturing cost, simplify the manufacturing process, and the purpose of enhancing product yield.

附图说明 [0007] 图1为本发明第一较佳实施例的剖视图; [0008] 图2为本发明第二较佳实施例的剖视图。 BRIEF DESCRIPTION OF sectional view of a first preferred embodiment of the [0007] present invention, FIG. 1; a second cross-sectional view of a preferred embodiment [0008] FIG. 2 of the present invention. [0009] 【主要元件符号说明】 [0010] 「第一实施例」 [0011] 微机电封装模块10 载板20[0012] 封盖30 腔室32[0013] 柱体;34 接收孔;342[0014] 间隔件40 曲折通道42[0015] 水平段422 垂直段似4[0016] 芯片50[0017] 「第二实施例」 [0009] The main reference numerals DESCRIPTION [0010] [0011] MEMS package module carrier 10 20 [0012] 30 the closure chamber 32 [0013] column "First embodiment"; 34 receiving aperture; 342 [ 0014] 422 vertical segment tortuous path spacers 40 42 [0015] 4-like horizontal section [0016] 50 chip [0017] "second embodiment"

[0018] 微机电封装模块60 [0018] MEMS package module 60

[0019] 凹陷72 [0019] 72 recess

[0020] 曲折通道82 [0020] tortuous passage 82

具体实施方式 Detailed ways

[0021] 为了详细说明本发明的结构、特征及功效所在,兹列举一较佳实施例并配合下列图式说明如后。 [0021] In order to specify the structure of the present invention, features and effects of location, hereby exemplified with a preferred embodiment and as will be described following the drawings.

[0022] 请参阅图1,为本发明第一较佳实施例所提供的微机电封装模块10,包含有一载板20、一封盖30、一间隔件40,以及一芯片50。 [0022] Referring to FIG. 1, a first micro-electromechanical package module of the preferred embodiment of the present invention to provide 10, 20 comprises a closure plate 30 a carrier, a spacer 40, and a chip 50.

[0023] 载板20可为陶瓷基板或者由双层板体堆叠而成,本实施例是以陶瓷基板为例。 [0023] The carrier plate 20 may be a ceramic substrate or a stack of two-layer board is made, according to the present embodiment is a ceramic substrate as an example.

[0024] 封盖30的周缘盖合于载板20的表面,并具有一腔室32与一柱体34,柱体34由腔室32的顶壁向下延伸而出,并具有一连通外界的接收孔342。 [0024] The periphery of the closure cap 30 is bonded to surface 20 of the carrier plate, and having a chamber 32 and a cylinder 34, the cylinder 34 extends downwardly from the top wall of the chamber 32 is out of communication with the outside and having a receiving hole 342.

[0025] 间隔件40设置于载板20与封盖30之间,并于内部具有一曲折通道42,曲折通道42区分为一水平段422与二垂直段424,该二垂直段似4位于水平段422的两端,并分别连通封盖30的腔室32与接收孔342。 [0025] spacer 40 disposed between the carrier 20 and the cover plate 30, and the internal passage 42 has a meandering, tortuous passage 42 is divided into a horizontal section 422 and two vertical sections 424, like the two vertical segments 4 in a horizontal end sections 422, and the lid 30 are in communication with the receiving chamber 32 of the aperture 342.

[0026] 芯片50设于间隔件40而对应于曲折通道42的其中一垂直段424,同时位于封盖30的腔室32内并与载板20电性连接,使得外界信号能够从封盖30的接收孔342经由间隔件40的曲折通道42传递至封盖30的腔室32内让芯片50接收。 [0026] The chip 50 disposed on the spacer 40 corresponding to the tortuous passage 42 wherein a vertical section 424, while the closure 30 is positioned within the chamber 32 and electrically connected to the carrier 20, so that the signals can be from outside the lid 30 receiving hole 342 is transmitted via the tortuous passage 42 of the spacer 40 to the chamber 30 of the closure 32 so that chip 50 receives.

[0027] 经由上述结构可知,本发明的微机电封装模块10采用单层陶瓷基板或双层板体作为结构稳固的载板20,并采用厚度相当薄的间隔件40而在其内部形成曲折通道42,并非使用由多个堆叠而成的板体或者导线架作为基板,可确实达到减少整体厚度、降低制造成本、简化制造过程,以及提高产品良率的目的。 [0027] The configuration can be seen via the MEMS package module according to the present invention, the ceramic substrate 10 of a single-layer or double-layer plate as structurally sound carrier plate 20, and a relatively thin with a thickness of the spacer member 40 is formed meandering passage in its interior 42, rather than using a stack of a plurality of plate bodies formed as the substrate or a lead frame, can indeed achieve reduced overall thickness, reducing the manufacturing cost, simplify the manufacturing process, as well as the purpose of improving product yield.

[0028] 请再参阅图2,为本发明第二较佳实施例所提供的微机电封装模块60,其主要结构与上述实施例大致相同,惟其差异在于载板70的表面形成一凹陷72与间隔件80的曲折通道82连通,如此便能扩大曲折通道82的容积供外界信号通过,以同样达到本发明的目的。 [0028] Please refer to FIG 2, micro-electromechanical package module 60 of the second preferred embodiment of the present invention is provided, the main structure of the above embodiment is substantially the same, but their difference is that the surface of the carrier plate 70 is formed with a recess 72 the spacer 80 communicates tortuous passage 82, thus making it possible to expand the volume of the tortuous passage 82 for external signal, in order to achieve the same purposes of the present invention.

[0029] 本发明于前揭实施例中所揭露的构成元件,仅为举例说明,并非用来限制本案的范围,其它等效元件的替代或变化,亦应为本案的申请专利范围所涵盖。 Constituent elements disclosed in the embodiment [0029] The present invention is in the above-mentioned technical embodiments are merely illustrative, not to limit the scope of the case, replace, or change other equivalent element, as the case should be covered by the scope of the patent.

载板70 间隔件80 The carrier plate 70 of the spacer 80

Claims (6)

1. 一种微机电封装模块,其特征在于包含有: 一载板;一封盖,盖合于该载板的表面,并具有一腔室与一连通外界的接收孔; 一间隔件,设于该载板与该封盖之间,并于内部具有一曲折通道,该曲折通道以其两端分别连通该腔室与该接收孔;以及一芯片,设于该间隔件而对应于该曲折通道,同时位于该封盖的腔室内并与该载板电性连接。 1. A micro-electromechanical package module, characterized by comprising: a carrier; a cover lid bonded to a surface of the carrier plate, and having a receiving bore with a chamber in communication with the outside world; a spacer member disposed between the carrier plate and the cover and having an internal tortuous path, the tortuous passage opposite ends thereof in communication with the chamber of the receiving aperture; and a chip disposed on the spacer and corresponding to the meander channel, while the closure is located in the chamber and connected electrically to the carrier plate.
2.如权利要求1所述的微机电封装模块,其特征在于,该封盖具有一柱体,该柱体由该腔室的顶壁延伸而出,并具有该接收孔。 MEMS package 2. The module according to claim 1, wherein the closure has a cylinder that extends out from the top wall of the chamber, and having the receiving hole.
3.如权利要求1所述的微机电封装模块,其特征在于,该曲折通道具有一水平段与二垂直段,该二垂直段位于该水平段的两端而分别连通该接收孔与该腔室。 3. The micro-electromechanical package module according to claim 1, wherein the meandering channel has a horizontal section and two vertical segments, the two vertical segments located at both ends of the horizontal section of the receiving hole communicating respectively with the chamber room.
4.如权利要求1所述的微机电封装模块,其特征在于,该载板的表面形成一连通该曲折通道的凹陷。 Encapsulating said MEMS module as claimed in claim 1, characterized in that the surface of the carrier plate is formed a recess communicating with the tortuous passage.
5.如权利要求1所述的微机电封装模块,其特征在于,该载板为陶瓷基板。 5. The micro-electromechanical package module according to claim 1, wherein the carrier is a ceramic substrate.
6.如权利要求1所述的微机电封装模块,其特征在于,该载板由双层板体堆叠而成。 Encapsulating said MEMS module as claimed in claim 1, characterized in that the carrier plates are stacked together by a double plate.
CN201010115747.3A 2010-02-12 2010-02-12 Micro electro-mechanical system encapsulation module CN102153044B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107005756A (en) * 2014-10-29 2017-08-01 罗伯特·博世有限公司 Microphone package with the distance piece being molded

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2626974Y (en) * 2003-05-16 2004-07-21 中国科学院上海微系统与信息技术研究所 Structure realizing gas tight packaging of micro-electro-mechanical system device
CN101189180A (en) * 2005-03-17 2008-05-28 许密特有限公司 Thin package for a micro component
CN101301993A (en) * 2007-05-11 2008-11-12 北京大学 MEMS device vacuum encapsulation method
WO2009038692A1 (en) * 2007-09-19 2009-03-26 Akustica, Inc. A mems package

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2626974Y (en) * 2003-05-16 2004-07-21 中国科学院上海微系统与信息技术研究所 Structure realizing gas tight packaging of micro-electro-mechanical system device
CN101189180A (en) * 2005-03-17 2008-05-28 许密特有限公司 Thin package for a micro component
CN101301993A (en) * 2007-05-11 2008-11-12 北京大学 MEMS device vacuum encapsulation method
WO2009038692A1 (en) * 2007-09-19 2009-03-26 Akustica, Inc. A mems package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107005756A (en) * 2014-10-29 2017-08-01 罗伯特·博世有限公司 Microphone package with the distance piece being molded
CN107005756B (en) * 2014-10-29 2019-11-01 罗伯特·博世有限公司 Microphone package with the spacer being molded

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