CN102121689B - LED light source module heat dissipation method - Google Patents
LED light source module heat dissipation method Download PDFInfo
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- CN102121689B CN102121689B CN2010105726717A CN201010572671A CN102121689B CN 102121689 B CN102121689 B CN 102121689B CN 2010105726717 A CN2010105726717 A CN 2010105726717A CN 201010572671 A CN201010572671 A CN 201010572671A CN 102121689 B CN102121689 B CN 102121689B
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- light source
- source module
- metal substrate
- section bar
- led light
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- 238000000034 method Methods 0.000 title claims abstract description 25
- 230000017525 heat dissipation Effects 0.000 title abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 57
- 239000002184 metal Substances 0.000 claims abstract description 50
- 238000005516 engineering process Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 description 11
- 239000000084 colloidal system Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 230000008030 elimination Effects 0.000 description 3
- 238000003379 elimination reaction Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
本发明涉及半导体照明技术，尤其涉及一种LED光源模块散热方法，该LED光源模块包括金属基板，金属基板正面设置LED灯泡，LED灯泡通过底座连接于金属基板；该LED光源模块还包括透镜，透镜入光一侧具有由裙边界定而成的凹坑，透镜扣设于LED灯泡及底座，LED灯泡及底座沉入凹坑，裙边包围于底座；该LED光源模块还包括型材，型材具有腔体，型材顶面具有孔，金属基板设置于腔体内部，透镜通过所述孔突出于型材顶面；型材具有一个顶面和两个侧壁；该散热方法的热传递路径如下：LED灯泡à底座à金属基板à型材顶面à型材侧壁。本发明提供一种散热效率高的LED光源模块散热方法。
The present invention relates to semiconductor lighting technology, and in particular to a heat dissipation method for an LED light source module, wherein the LED light source module comprises a metal substrate, an LED bulb is arranged on the front of the metal substrate, and the LED bulb is connected to the metal substrate through a base; the LED light source module also comprises a lens, a light-entering side of the lens has a pit defined by a skirt edge, the lens is buckled on the LED bulb and the base, the LED bulb and the base are sunken into the pit, and the skirt edge surrounds the base; the LED light source module also comprises a profile, the profile has a cavity, the top surface of the profile has a hole, the metal substrate is arranged inside the cavity, and the lens protrudes from the top surface of the profile through the hole; the profile has a top surface and two side walls; the heat transfer path of the heat dissipation method is as follows: LED bulb à base à metal substrate à profile top surface à profile side wall. The present invention provides a heat dissipation method for an LED light source module with high heat dissipation efficiency.
Description
Technical field
The present invention relates to the semiconductor lighting technology, relate in particular to a kind of led light source module heat dissipating method.
Background technology
The semiconductor lighting technology has become the main flow in light source market because it has energy-conservation and characteristics long service life.
The led light source module substantially all comprises a metal substrate, to strengthen heat-conducting effect.The LED illuminator is arranged at the front of metal substrate, and thermal component is attached at the reverse side of metal substrate.Its heat transfer path all need intactly be passed metal substrate.
Such as Chinese patent literature CN101625081A in disclosed a kind of led light source module on January 13rd, 2010, this led light source module comprises LED illuminating module and module pedestal, this led light source module also comprises the optics cover plate, described optics cover plate is fixedly arranged on described module pedestal, define a closed space with described module pedestal, described LED illuminating module is arranged at described closed space; Described optics cover plate outer surface is plane or smooth excessive cambered surface, and described optics cover plate inner surface has several inner sunken faces; Described LED illuminating module has several LED illuminators, each LED illuminator the place ahead described inner sunken face that all distributes accordingly.
Chinese patent literature CN101101103A is in disclosed a kind of LED street lamp on January 9th, 2008 for another example, this LED street lamp comprises lamp body and LED bulb, lamp body comprises head section, stage casing, rear, and the head section is docked setting with the stage casing, and the other end in stage casing docks setting with rear; Be provided with sealing gasket between head section and the stage casing, the head section is connected with the stage casing by securing member; Be provided with sealing gasket between rear and the stage casing, rear is connected with the stage casing by securing member; The stage casing is a kind of section bar, and along the profile length direction, diverse location has identical cross section; Section bar has substrate, and substrate is tabular, and substrate extends along the profile length direction, and substrate has two faces, obverse and reverse; Two positive edges arrange respectively side plate, and several radiating fins are set on the reverse side; The LED bulb is arranged on a face of conductive sole plate, consists of the LED showing plate, has printed circuit on the conductive sole plate, and the front that the one side that conductive sole plate does not arrange the LED bulb is close to the substrate in lamp body stage casing arranges; The LED street lamp also comprises secondary optical lens, and secondary optical lens is arranged on the lens base plate by button bit, and lens base plate and LED showing plate be arranged in parallel, the corresponding secondary optical lens of each LED bulb; The lens base plate has some contour supporting positions towards a side of LED showing plate, supporting position butt conductive sole plate, and lens base plate, conductive sole plate are fixedly connected on substrate front side by securing member; The head section of lamp body has the first transverse slat, and the first transverse slat is arranged on an end that docks with the stage casing; Rear has the second transverse slat, and the second transverse slat is arranged on an end that docks with the stage casing; The first transverse slat, the second transverse slat, the side plate at positive two edges, stage casing, the front in stage casing define a cavity altogether, the front in stage casing consists of the end of cavity, the side plate at positive two edges of the first transverse slat, the second transverse slat, stage casing consists of the wall of cavity, and the cavity wall is provided with step for accommodating lampshade away from the end at the end; The head section has one section pipe, and the axle center of pipe is vertical with the first transverse slat, and the first transverse slat is provided with a wire hole that leads in the pipe, and the sidewall of pipe has the screwed hole that connects tube wall; Head section, stage casing, rear all adopt Heat Conduction Material to make; The LED street lamp also comprises lampshade, and lampshade is arranged in the described step, is provided with sealing gasket between lampshade and the lamp body.
The heat transfer path of prior art has also determined the limitation of its radiating effect, patent documentation is the same as the aforementioned, in the prior art, after the heat that LED when work produces is passed to metal substrate from the front of metal substrate, pass to thermal component from the reverse side of metal substrate, the tediously long radiating efficiency that determined of heat transfer path is low.
Summary of the invention
The object of the invention is to overcome above-mentioned the deficiencies in the prior art part and provide a kind of radiating efficiency high led light source module heat dissipating method.
The led light source module that provides a kind of radiating efficiency high is provided secondary objective of the present invention.
Purpose of the present invention can be achieved through the following technical solutions:
A kind of led light source module heat dissipating method, this led light source module comprises metal substrate, and the metal substrate front arranges the LED bulb, and the LED bulb is connected in metal substrate by base; This led light source module also comprises lens, and lens light inlet one side has by the shirt rim and defines the pit that forms, and the lens button is located at LED bulb and base, and LED bulb and base sink to pit, and the shirt rim is surrounded on base; This led light source module also comprises section bar, and section bar has cavity, and the section bar end face has the hole, and metal substrate is arranged at inside cavity, and lens protrude from the section bar end face by described hole; Section bar has an end face and two sidewalls; The heat transfer path that it is characterized in that this heat dissipating method is as follows: LED bulb à base à metal substrate à section bar end face à section bar sidewall.
Led light source module heat dissipating method, it is characterized in that: an end face and two sidewalls define described cavity jointly, the tail end of two sidewalls has respectively a groove, this led light source module also comprises a pressing plate, the both sides of pressing plate are placed in respectively two grooves, pressing plate is provided with screw, and the front end of screw is connected to the reverse side of described metal substrate.
Led light source module heat dissipating method is characterized in that: section bar sidewall outside also has the heat radiation rib, and the heat radiation rib is along the length direction setting of section bar; Heat transfer path further is defined as: the section bar sidewall passes through the heat radiation rib to outside space heat elimination.
Led light source module heat dissipating method is characterized in that: the two side of section bar also has respectively the thread Pilot hole that arranges along the profile length direction.
Led light source module heat dissipating method is characterized in that: this led light source module also comprises the mount pad that is arranged at the section bar two ends; Mount pad is connected by screw in the screw bottom outlet.
Led light source module heat dissipating method is characterized in that: section bar, pressing plate, mount pad, metal substrate, screw define an enclosure space jointly, are full of colloid in this enclosure space.
Led light source module heat dissipating method is characterized in that: pressing plate and metal substrate be arranged in parallel.
Led light source module heat dissipating method is characterized in that: the width of a wherein sidewall of section bar is greater than the width of another sidewall, and the tail end of a wider sidewall extends outside the groove.
Led light source module heat dissipating method, it is characterized in that: described section bar has an end face and two sidewalls, an end face and two sidewalls define described cavity jointly, the tail end of two sidewalls has respectively a groove, this led light source module also comprises a pressing plate, the both sides of pressing plate are placed in respectively two grooves, and pressing plate is provided with screw, and the front end of screw is connected to the reverse side of described metal substrate.
Led light source module heat dissipating method, it is characterized in that: described section bar has an end face and two sidewalls, an end face and two sidewalls define described cavity jointly, the tail end of two sidewalls has respectively a groove, this led light source module also comprises a pressing plate, the both sides of pressing plate are placed in respectively two grooves, and pressing plate is provided with screw, and the front end of screw is connected to the reverse side of described metal substrate; Section bar sidewall outside also has the heat radiation rib, and the heat radiation rib is along the length direction setting of section bar; Heat transfer path further is defined as: the section bar sidewall passes through the heat radiation rib to outside space heat elimination; The two side of section bar also has respectively the thread Pilot hole that arranges along the profile length direction; This led light source module also comprises the mount pad that is arranged at the section bar two ends; Mount pad is connected by screw in the screw bottom outlet; Section bar, pressing plate, mount pad, metal substrate, screw define an enclosure space jointly, are full of colloid in this enclosure space; Pressing plate and metal substrate be arranged in parallel; The width of a wherein sidewall of section bar is greater than the width of another sidewall, and the tail end of a wider sidewall extends outside the groove; Described section bar has an end face and two sidewalls, an end face and two sidewalls define described cavity jointly, the tail end of two sidewalls has respectively a groove, this led light source module also comprises a pressing plate, the both sides of pressing plate are placed in respectively two grooves, pressing plate is provided with screw, and the front end of screw is connected to the reverse side of described metal substrate.
A kind of led light source module heat dissipating method is characterized in that may further comprise the steps S1: in the front of metal substrate the LED bulb is set; S2: the front at metal substrate arranges thermal component.Further, thermal component is a segment type material, and the end face of section bar and metal substrate front are sticked, and the section bar sidewall has the heat radiation rib.Again further, metal substrate is arranged in the section bar, and the LED bulb is by the hole bright dipping of section bar end face.Further, the heat transfer path of this led light source module heat dissipating method is: the LED bulb à metal substrate à section bar end face à section bar sidewall à rib that dispels the heat.
Led light source module heat dissipating method of the present invention, heat transfer path is: LED bulb à base à metal substrate à section bar end face à section bar sidewall.Metal substrate is arranged at cavity of sectional material inside, lens protrude from the section bar end face, so the front of substrate directly contacts with section bar, the heat that produces during the work of LED bulb need not to pass whole metal substrate, and the metal substrate front directly is passed to section bar from the metal substrate front again after LED receives heat.Compared with prior art, good heat dissipation effect.
Description of drawings
Fig. 1 is the schematic perspective view of first embodiment of the invention.
Fig. 2 is the lens of first embodiment of the invention, reaches metal substrate, base, LED bulb assembly schematic diagram.
Fig. 3 is the generalized section of first embodiment of the invention.
Fig. 4 is the perspective exploded view of first embodiment of the invention.
Fig. 5 is the heat transfer path schematic diagram of first embodiment of the invention.
The specific embodiment
The invention will be further described below in conjunction with accompanying drawing.
Referring to figs. 1 to Fig. 5, first embodiment of the invention is a kind of led light source module heat dissipating method, comprises metal substrate 103, and metal substrate 103 fronts arrange LED bulb 101, and LED bulb 101 is connected in metal substrate 103 by base 102; This led light source module also comprises lens 104, lens 104 light inlets one side has by shirt rim 1042 and defines the pit 1041 that forms, lens 104 buttons are located at LED bulb 101 and base 102, and LED bulb 101 and base 102 sink to pit 1041, and shirt rim 1042 is surrounded on around the base 102; This led light source module also comprises section bar 105, and section bar 105 has cavity, and the section bar end face has hole 1051, and metal substrate 103 is arranged at inside cavity, and lens 104 protrude from the end face of section bar 105 by described hole 1051; Section bar has an end face and two sidewalls; The heat transfer path of this heat dissipating method is as follows: LED bulb à base à metal substrate à section bar end face à section bar sidewall.
In the present embodiment, described section bar 105 has an end face and two sidewalls, an end face and two sidewalls define described cavity jointly, the tail end of two sidewalls has respectively a groove 1053, this led light source module also comprises a pressing plate 107, the both sides of pressing plate 107 are placed in respectively two grooves 1053, and pressing plate is provided with screw 108, and the front end of screw 108 is connected to the reverse side of described metal substrate 103;
In the present embodiment, the section bar 105 sidewalls outside also has heat radiation rib 1052, and heat radiation rib 1052 refers again to Fig. 5 along the length direction setting of section bar, and in the present embodiment, heat transfer path further is defined as: the section bar sidewall passes through the heat radiation rib to outside space heat elimination.Heat radiation rib 1052 herein also can be understood as radiating fin or radiating fin; The two side of section bar 105 also has respectively the thread Pilot hole 1054 that arranges along the profile length direction; This led light source module also comprises the mount pad 106 that is arranged at the section bar two ends; Mount pad 106 is connected by screw in screw bottom outlet 1054.
In the present embodiment, section bar 105, pressing plate 107, mount pad 106, metal substrate 103, screw 108 define an enclosure space jointly, are full of colloid 109 in this enclosure space; Colloid 109 can be selected silica gel, but is not limited to this, the colloid that also can select other to be easy to injecting glue and to have water-proof function; Certainly, colloid 109 is optional, as a kind of conversion scheme of the present embodiment, also colloid 109 can be set.
In the present embodiment, described section bar 105 has an end face and two sidewalls, an end face and two sidewalls define described cavity jointly, the tail end of two sidewalls has respectively a groove 1055, this led light source module also comprises a pressing plate 107, the both sides of pressing plate 107 are placed in respectively two grooves 1055, and pressing plate is provided with screw 108, and the front end of screw 108 is connected to the reverse side of described metal substrate 103.
In the present embodiment, pressing plate 107 be arranged in parallel with metal substrate 103; The width of a wherein sidewall of section bar 105 is greater than the width of another sidewall, and the tail end 1055 of a wider sidewall extends outside the groove 1053.
Claims (1)
1. led light source module heat dissipating method, this led light source module comprises metal substrate, and the metal substrate front arranges the LED bulb, and the LED bulb is connected in metal substrate by base; This led light source module also comprises lens, and lens light inlet one side has by the shirt rim and defines the pit that forms, and the lens button is located at LED bulb and base, and LED bulb and base sink to pit, and the shirt rim is surrounded on base; This led light source module also comprises section bar, and section bar has cavity, and the section bar end face has the hole, and metal substrate is arranged at inside cavity, and lens protrude from the section bar end face by described hole; Section bar has an end face and two sidewalls; The heat transfer path that it is characterized in that this heat dissipating method is as follows: LED bulb → base → metal substrate → section bar end face → section bar sidewall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105726717A CN102121689B (en) | 2010-12-03 | 2010-12-03 | LED light source module heat dissipation method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105726717A CN102121689B (en) | 2010-12-03 | 2010-12-03 | LED light source module heat dissipation method |
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| Publication Number | Publication Date |
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| CN102121689A CN102121689A (en) | 2011-07-13 |
| CN102121689B true CN102121689B (en) | 2013-01-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010105726717A Expired - Fee Related CN102121689B (en) | 2010-12-03 | 2010-12-03 | LED light source module heat dissipation method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US11655948B2 (en) * | 2020-01-27 | 2023-05-23 | Signify Holding B.V. | Linear modular luminaire |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101123289A (en) * | 2007-09-05 | 2008-02-13 | 昌鑫光电（东莞）有限公司 | Bidirectional light-emitting heat-radiating light-emitting diode |
| CN101373062A (en) * | 2008-08-22 | 2009-02-25 | 张春涛 | LED lamp with cooling fins and manufacturing method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005183531A (en) * | 2003-12-17 | 2005-07-07 | Sharp Corp | Semiconductor light emitting device |
| JP5077693B2 (en) * | 2008-08-28 | 2012-11-21 | 東芝ライテック株式会社 | lighting equipment |
| CN101684931A (en) * | 2008-09-26 | 2010-03-31 | 富准精密工业(深圳)有限公司 | Light-emitting diode lamp |
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2010
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101123289A (en) * | 2007-09-05 | 2008-02-13 | 昌鑫光电（东莞）有限公司 | Bidirectional light-emitting heat-radiating light-emitting diode |
| CN101373062A (en) * | 2008-08-22 | 2009-02-25 | 张春涛 | LED lamp with cooling fins and manufacturing method thereof |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2005-183531A 2005.07.07 |
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Effective date of registration: 20171103 Address after: 523565 Guangdong city of Dongguan province Changping Zhen Heng Jiang Jiang Xia Heng Industrial Road, set up a file Patentee after: KINGSUN OPTOELECTRONIC CO., LTD. Address before: 523000 Guangdong city of Dongguan province Changping Zhen Heng Jiang set up a file Patentee before: Dongguan Qinshang Photoelectric Co., Ltd. |
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Granted publication date: 20130102 Termination date: 20171203 |
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