CN102081188A - Light guide plate and manufacturing method thereof - Google Patents

Light guide plate and manufacturing method thereof Download PDF

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Publication number
CN102081188A
CN102081188A CN 201110003956 CN201110003956A CN102081188A CN 102081188 A CN102081188 A CN 102081188A CN 201110003956 CN201110003956 CN 201110003956 CN 201110003956 A CN201110003956 A CN 201110003956A CN 102081188 A CN102081188 A CN 102081188A
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light guide
guide plate
surface
direction
optical
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CN 201110003956
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Chinese (zh)
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李佳真
李信坤
李国成
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苏州向隆塑胶有限公司
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Abstract

The invention relates to a light guide plate and a manufacturing method thereof. The light guide plate provided by the invention is provided with a surface, the surface has a first direction and a second direction, and an included angle is formed between the first direction and the second direction. The light guide plate comprises an optical assembly array and a scoring line, wherein the optical assembly array is arranged on the surface of the light guide plate and extends in the first direction; and the scoring line is arranged on the surface of the light guide plate and extends in the second direction. The invention has the advantages that the optical assembly array and the scoring line can be easily formed on the surface of the light guide plate; and particularly, the manufacturing method of the light guide plate is applicable to the formation of the optical assembly array and the scoring line on an ultrathin light guide plate.

Description

导光板及其制作方法 The light guide plate and manufacturing method thereof

技术领域 FIELD

[0001] 本发明涉及一种导光板,尤其涉及该导光板的制作方法。 [0001] The present invention relates to a light guide plate, and particularly to the production method of the light guide plate.

背景技术 Background technique

[0002] 在精密加工的领域中,通常是利用刀具对于各样导光板进行切割来形成光学微结构。 [0002] In the field of precision machining, it is usually cut by the cutter to form the light guide plate for every optical microstructures. 以导光板的表面处理为例,当欲在导光板上制作导光微结构时,可利用单一刀具来回地在导光板的表面上进行沟槽的刻划。 In the surface treatment of the light guide plate, for example, when desiring to create a light guiding microstructure on the light guide plate, a single cutter may be utilized fro scribed grooves on the surface of the light guide plate. 然而,这样的做法会有以下的缺点: However, such an approach will have the following disadvantages:

[0003] 首先,刀具的寿命会缩短。 [0003] First, the tool life will be shortened. 在进行刻划沟槽的过程中,由于刀具持续地与导光板直接磨擦,而使刀具容易产生磨损、变形、因高热而硬度降低、断裂等问题;并且,当刀具产生损毁的情形时,所刻划出的沟槽的精密度也会随之下降,造成导光板的良率无法提升。 Performing the process of scribing groove, since the tool is continuously direct friction with the light guide plate, so that the tool is easy to wear, deformation due to heat and decrease in hardness, fracture problems; and, when the tool is generated in the case of damage, the It depicts the trenches precision will drop, causing the yield of the light guide plate can not be improved.

[0004] 再者,上述加工方法的速度极慢。 [0004] Further, the machining speed is very slow process. 由于每一沟槽均以单一刀具不断来回进行刻划工作,所以当沟槽数量很多或所刻划的面积相当大时,整体加工时间会拉长。 Since each trench are constantly back and forth scoring single tool work, so when a lot of the number of grooves or scoring area is quite large, the overall processing time will be stretched. 从一方面来看,也可尝试利用缩短刀具的单一行程的时间的做法,来提升加工速度,但是这样的方式会因刀具进行高速移动而产生瞬间高热,反而缩短刀具的使用寿命。 On the one hand, but also try to use practices to shorten the time of travel of a single tool to enhance the processing speed, but because of the tool in such a way to produce high-speed mobile instant heat, but shorten the life of the tool.

[0005] 还有,上述的刀具不适合特殊形状的微结构加工与大量生产。 [0005] Further, the above-described microstructure machining tool is not suitable for mass production with a special shape. 当使用者想要制作具有特殊几何形状的沟槽时,必须分别更换不同的刀具来进行。 When the user wants to create a groove having a special geometry, a different tool must be replaced separately performed. 更详细而言,具有第一种微结构的第一凹槽需利用第一种刀具来进行刻划,具有第二种微结构的第二凹槽需以第二种刀具来进行刻划。 More specifically, a first groove having a first microstructure need to use a first scribing tool, a second groove having a second microstructure needs to be scribed in a second tool. 如此一来,将导致刀具的加工路径、换刀顺序变得极为复杂,而难以大量制造导光板。 Which could lead to machining path of the tool, the tool change sequence become extremely complex, difficult to manufacture a large number of the light guide plate.

[0006] 特别是,利用上述单一刀具来制作导光板的导光微结构的方式,将导致导光微结构的精密度不佳的问题。 [0006] In particular, the use of a single tool to make the above-described embodiment of the light guide plate light guiding microstructure, causes problems of poor precision light guiding microstructure. 由上述可知,开发一种能够解决现有问题的导光板的制作方法是有其必要的。 From the foregoing, development of a method for manufacturing the light guide plate capable of solving the conventional problems is its necessity.

发明内容 SUMMARY

[0007] 本发明需要解决的技术问题是提供了一种导光板的制作方法,旨在解决上述的问题。 [0007] The present invention requires the technical problem is to provide a method for manufacturing a light guide plate, to solve the above problems.

[0008] 本发明还提供了采用上述制作方法的导光板。 [0008] The present invention further provides the above-described manufacturing method of the light guide plate.

[0009] 为了解决上述技术问题,本发明是通过以下技术方案实现的: [0009] To solve the above problems, the present invention is achieved by the following technical solution:

[0010] 本发明的导光板的制作方法是通过以下步骤实现的: [0010] The manufacturing method of the light guide plate of the present invention are achieved by the following steps:

[0011] 提供至少一导光板,该导光板具有一表面,该表面具有一第一方向与一第二方向, 该第一方向与该第二方向之间夹一角度; [0011] providing at least one light guide plate having a surface, said surface having a first direction and a second direction, the first direction and a second direction between the angle clips;

[0012] 提供至少一切割工具,所述的切割工具包括:一基部;所述的基部具有一旋转轴; 至少一切割部;所述的切割部设置于该基部上、且沿着该旋转轴的延伸方向而排列;多个微结构;所述的微结构设置于该切割部上; [0012] providing at least one cutting tool, said cutting tool comprising: a base portion; said base having a rotational axis; at least one cutting portion; of the cutting portion disposed on the base portion, and along the rotational axis They are arranged in the extending direction; a plurality of microstructures; the microstructure disposed on the cutting portion;

[0013] 使该切割工具进行旋转而切割该导光板,其中,被切割后的该导光板包括:一光学组件阵列;所述的光学组件阵列设置于该导光板的该表面上、且于该第一方向中延伸;以及一刻划线;所述的刻划线设置于该导光板的该表面上、且于该第二方向中延伸。 [0013] The cutting tool is rotated to cut the light guide plate, wherein the light guide plate after being cut comprising: an array of optical components; said array of optical components disposed on the surface of the light guide plate, and in that extending in a first direction; and scribing moment; the score line disposed on the surface of the light guide plate, and extending in the second direction.

[0014] 本发明的导光板:具有一表面,该表面具有一第一方向与一第二方向,该第一方向与该第二方向之间夹一角度,该导光板包括:一光学组件阵列;所述的光学组件阵列设置于该导光板的该表面上、且于该第一方向中延伸;以及一刻划线;所述的刻划线设置于该导光板的该表面上、且于该第二方向中延伸。 [0014] The light guide plate according to the present invention: having a surface, the surface having a first direction and a second direction, the first direction and a second direction between the clip angle, the light guide comprising: an array of optical components ; said array of optical components disposed on the surface of the light guide plate, and extending in the first direction; and scribing moment; the score line disposed on the surface of the light guide plate, and in that extending in a second direction.

[0015] 与现有技术相比,本发明的有益效果是:可以在导光板的表面上轻易地形成光学组件阵列与刻划线;尤其是,该导光板的制作方法适合在厚度极薄的导光板上形成光学组件阵列以及刻划线。 [0015] Compared with the prior art, the beneficial effects of the present invention is that: the optical assembly can be easily formed with an array of lines scribed on a surface of the light guide plate; in particular, the production method of the light guide plate for extremely thin in thickness forming an array of optical assemblies and a scribe line on the light guide plate.

附图说明 BRIEF DESCRIPTION

[0016] 图1为本发明实施例的一种导光板的立体示意图、及导光板表面的光学微结构的示意图。 [0016] FIG. 1 is a schematic perspective view of an optical microstructure of the embodiments A light guide, the light guide plate and the surface of the embodiment of the present invention.

[0017] 图2为本发明实施例的一种导光板的制作方法的制作流程示意图。 [0017] FIG. 2 is a schematic production process of a method for making the light guide plate according to an embodiment of the present invention.

[0018] 图3为本发明实施例的一种切割工具的示意图。 [0018] FIG. 3 is a schematic A cutting tool according to an embodiment of the present invention.

[0019] 图4为本发明实施例的另一种切割工具的示意图。 [0019] FIG. 4 is a schematic view of the cutting tool of another embodiment of the present invention.

[0020] 图5为本发明实施例的再一种切割工具的示意图。 [0020] Figure 5 a schematic view of yet another embodiment of the cutting tool of the present embodiment of the invention.

[0021] 图6为本发明一实施例的切割工具的微结构的示意图。 [0021] FIG. 6 is a schematic view of the microstructure of the cutting tool according to an embodiment of the present invention.

[0022] 图7为本发明另一实施例的切割工具的微结构的示意图。 [0022] FIG. 7 is a schematic microstructure of a cutting tool according to another embodiment of the present invention.

[0023] 图8为利用本发明实施例所述的切割工具对于导光板进行切割的示意图。 [0023] FIG. 8 is a schematic diagram illustrating the use of a cutting tool for cutting the light guide plate embodiment of the present invention.

[0024] 图9为利用本发明实施例所述的切割工具对于导光板进行表面处理的示意图。 [0024] FIG. 9 is a schematic diagram illustrating the use of a cutting tool for the surface treatment of the present embodiment of the invention the light guide plate.

[0025] 图10为本发明实施例的一种切割工具模块的示意图。 [0025] FIG. 10 schematic diagram of an embodiment of the cutting tool module embodiment of the invention.

具体实施方式 detailed description

[0026] 下面结合附图与具体实施方式对本发明作进一步详细描述: [0026] The present invention will be described in further detail in conjunction with the accompanying drawings DETAILED DESCRIPTION:

[0027] 本发明提供一种导光板,具有光学组件阵列,且还具有能提升导光板的光学效果的刻划线。 [0027] The present invention provides a light guide plate having an array of optical components, and can further enhance the optical effect of the light guide plate having a scribe line.

[0028] 本发明提供一种导光板的制作方法,利用新颖的切割工具,而能够制作上述的导光板。 [0028] The present invention provides a method for manufacturing a light guide plate, using a novel cutting tool, it is possible to produce the above-described light guide plate.

[0029] 本发明提出一种导光板,具有一表面,该表面具有第一方向与第二方向,该第一方向与该第二方向之间夹一角度。 [0029] The present invention provides a light guide plate having a surface, the surface having a first and second directions, an angle between the first direction and the second direction clips. 此导光板包括:光学组件阵列以及刻划线。 This light guide plate comprising: a scribe line and the array of optical components. 光学组件阵列设置于导光板的表面上、且在第一方向中延伸。 Array of optical components disposed on an upper surface of the light guide plate, and extending in the first direction. 刻划线设置于导光板的表面上、且于第二方向中延伸。 Scribe line on the surface of the light guide plate is provided, and extending in a second direction.

[0030] 本发明又提出一种导光板的制作方法。 [0030] The present invention further provides a method of making a light guide plate. 首先,提供至少一导光板,该导光板具有一表面,该表面具有第一方向与第二方向,该第一方向与该第二方向之间夹一角度。 First, at least a light guide plate having a surface which has first and second directions, an angle between the first direction and the second direction clips. 再来,提供至少一切割工具,其中,每一切割工具包括:基部、至少一切割部以及多个微结构。 Again, providing at least one cutting tool, wherein, each cutting tool comprising: a base, at least a cutting portion and a plurality of microstructures. 基部具有一旋转轴。 A base having an axis of rotation. 切割部设置于基部上、且沿着旋转轴的延伸方向而排列。 Cutting portion disposed on the base, and are arranged along the extending direction of the axis of rotation. 微结构设置于切割部上。 Microstructures disposed on the cutting portion. 之后,使切割工具进行旋转而切割导光板,其中,被切割后的该导光板包括:光学组件阵列以及刻划线。 Thereafter, the rotation of the cutting tool to cut the light guide plate, wherein the light guide plate after being cut comprising: an array of optical assemblies and a score line. 光学组件阵列设置于导光板的该表面上、且在第一方向中延伸。 Array of optical components disposed on the surface of the light guide plate, and extending in the first direction. 刻划线设置于导光板的该表面上、且在第二方向中延伸。 Score line disposed on the surface of the light guide plate, and extending in a second direction. [0031] 在本发明的一实施例中,上述的刻划线分布于该表面的同一水平/垂直基准在线、或不同的水平/垂直基准在线。 [0031] In an embodiment of the present invention, the above-mentioned score line located in the same level as the surface / vertical reference line, or a different horizontal / vertical reference line.

[0032] 在本发明的一实施例中,上述的角度为90士10度。 [0032] In an embodiment of the present invention, the above-described angle of 90 ± 10 degrees. 在本发明的一实施例中,上述的表面包括:该导光板的入光面、出光面或反光面。 In an embodiment of the present invention, the above-described surface comprising: a light incident surface of the light guide plate, the reflective surface or surfaces.

[0033] 在本发明的一实施例中,上述的光学组件阵列包括:多个光学微透镜,突出于导光板的表面,且光学微透镜的形状是选自于半圆形、V字形、R沟及其组合。 [0033] In an embodiment of the present invention, the above optical array assembly comprising: a plurality of optical microlenses, projecting on the surface of the light guide plate, and the shape of the microlenses is selected optical semicircular, V-shape, R ditch and combinations thereof.

[0034] 在本发明的一实施例中,上述的光学组件阵列包括:多个光学微透镜,内凹于导光板的表面,且光学微透镜的形状是选自于半圆形、V字形、R沟及其组合。 [0034] In an embodiment of the present invention, the above-described optical assembly array comprising: a plurality of optical microlenses, on the concave surface of the light guide plate, and the shape of the microlenses is selected optical semicircular, V-shape, R ditch, and combinations thereof.

[0035] 在本发明的一实施例中,上述的光学组件阵列包括:多个光学微透镜,这些光学微透镜彼此之间的尺寸为相同或不相同。 [0035] In an embodiment of the present invention, the above-described optical assembly array comprising: a plurality of optical microlenses, the optical size between each microlens is the same or different.

[0036] 在本发明的一实施例中,上述的切割部沿着旋转轴的延伸方向而同轴排列。 [0036] In an embodiment of the present invention, the above-described cutting portion coaxially arranged along the extending direction of the rotary shaft.

[0037] 在本发明的一实施例中,上述的切割部沿着旋转轴的延伸方向而螺旋排列。 [0037] In an embodiment of the present invention, the aforementioned cutting portion and arranged along the extending direction of the helical axis of rotation.

[0038] 在本发明的一实施例中,上述的基部与切割部为一体成型、或为彼此组装。 [0038] In an embodiment of the present invention, the above-described base portion and the cutting portion are integrally formed, or assembled to each other.

[0039] 在本发明的一实施例中,上述的微结构突出于切割部,且微结构的形状是选自于半圆形、V字形、R沟及其组合,且微结构的形状互补于光学组件阵列的光学微透镜的形状。 [0039] In an embodiment of the present invention, the above-described microstructure projecting cutting portion and the shape of the microstructure are selected from semi-circular, V-shaped, R ditch, and combinations thereof, and is complementary to the shape of the microstructures shape of optical components of the optical micro-lens array.

[0040] 在本发明的一实施例中,上述的微结构内凹于切割部,微结构的形状是选自于半圆形、V字形、R沟及其组合,且微结构的形状互补于光学组件阵列的光学微透镜的形状。 [0040] In an embodiment of the present invention, the above-described microstructure concave shape in the cutting portion, the microstructure is selected from semicircular, V-shape, R ditch, and combinations thereof, and is complementary to the shape of the microstructures shape of optical components of the optical micro-lens array.

[0041] 在本发明的一实施例中,上述的微结构彼此之间的尺寸为相同或不相同。 [0041] In an embodiment of the invention, the size between each of the above-described microstructures are the same or different.

[0042] 基于上述,本发明的导光板具有光学组件阵列与刻划线,其中,刻划线可提供雾化光线的光学效果。 [0042] Based on the above, the light guide plate assembly of the present invention is an optical array score line, wherein the score line can provide optical effect atomization of light. 利用本发明实施例所述的切割工具对于导光板进行切割或表面处理,可以于导光板的表面上轻易地形成光学组件阵列与刻划线。 With the present embodiment of the invention the cutting tool for cutting or surface treatment of the light guide plate, the array of optical components can be formed easily on the scribe line on the surface of the light guide plate. 尤其是,该导光板的制作方法适合在厚度极薄的导光板上形成光学组件阵列以及刻划线。 In particular, the method of manufacturing the light guide plate suitable for forming an array of optical components and a scribe line on a thin thickness light guide plate.

[0043][导光板] [0043] [light guide plate]

[0044] 图1为本发明实施例的一种导光板的立体示意图、及导光板表面的光学微结构的示意图。 [0044] FIG. 1 is a schematic perspective view of an optical microstructure of the embodiments A light guide, the light guide plate and the surface of the embodiment of the present invention. 请参照图1,导光板LGP具有一表面Sl (S2或S3),该表面Sl (S2或S3)具有第一方向Dl以及与第一方向Dl夹一角度θ的第二方向D2。 Referring to FIG 1, a light guide plate having a surface LGP Sl (S2 or S3), the surface Sl (S2 or S3) having a first and a second direction Dl Dl clamp the first direction at an angle θ of D2. 在一实施例中,导光板LGP的表面Sl可以是入光面,该导光板LGP的表面S2可以是出光面,而该导光板LGP的表面S3可以是反光面。 In one embodiment, the surface Sl into the light guide plate may be a surface of the LGP, the LGP surface S2 of the light guide plate may be a surface, and the surface S3 of the light guide plate LGP may be reflecting surface. 该角度θ可为90士10度、较佳为90度。 The angle θ may be 90 ± 10 degrees, preferably 90 degrees.

[0045] 上述导光板LGP的光学微结构可包括:光学组件阵列OPA以及刻划线CL。 [0045] The light guide plate of the LGP optical microstructures may comprise: an array of optical components and OPA scribe line CL. 光学组件阵列OPA可设置于导光板LGP的表面Si、S2、S3上、且于第一方向Dl中延伸。 OPA array of optical components may be disposed on a surface of the light guide plate of the LGP Si, S2, the S3, and extends in the first direction Dl.

[0046] 更详细而言,光学组件阵列OPA可包括:多个光学微透镜LEN,内凹于导光板LGP 的表面,且光学微透镜LEN的形状是选自于半圆形、V字形、R沟及其组合(互补于后续图6 所示的突出于切割部120的微结构130)。 [0046] More specifically, the optical assembly may OPA array comprising: a plurality of optical microlenses LEN, concave surface of the light guide plate on the LGP, and the shape of the optical micro-lens LEN is selected from semicircular, V-shape, R and a combination groove (complementary to the microstructure shown in FIG. 6 projecting cutting portion 120 of FIG subsequent 130).

[0047] 另外,光学组件阵列OPA也可包括:多个光学微透镜LEN,突出于导光板LGP的表面,且光学微透镜LEN的形状可选自于半圆形、V字形、R沟及其组合(互补于后续图7所示的内凹于切割部120的微结构130)。 [0047] Further, the optical assembly may also OPA array comprising: a plurality of optical microlenses LEN, projecting on the surface of the light guide plate LGP, and the optical microlenses LEN selected from the semicircular shape, V-shape, R gulley composition (complementary to concave as shown in FIG. 7 subsequent to the cutting portion 120 of the microstructure 130). 再者,光学组件阵列OPA的多个光学微透镜LEN的彼此之间的尺寸可为相同或不相同,其中尺寸相同或不相同是指面积相同或不相同,或者是体积的相同或不相同。 Furthermore, the size of an array of optical components to each other between a plurality of optical microlenses OPA LEN may be the same or different, wherein the same or different dimensions refer to the same or not the same area, or the volume of the same or different. 光学组件阵列OPA可以是规律地、或随机地排列在导光板LGP的表面Si、S2、S3上,端看所需的光学效果。 OPA array of optical components may be regularly or randomly arranged on the surface of the light guide plate LGP of Si, S2, S3, see the end of the optical effect desired. [0048] 请再参照图1,刻划线CL可设置于导光板LGP的表面S1、S2、S3上、且于第二方向D2中延伸。 [0048] Referring again to FIG 1, the scribe line CL may be provided on the surface S1 of the light guide plate LGP, the S2, S3, and extends in the second direction D2. 更详细而言,可在导光板LGP的至少一表面S1、S2或S3,或者全部表面S1、S2、 S3上形成光学组件阵列OPA以及刻划线CL。 More specifically, the light guide at least one surface of the LGP S1, S2 or S3, or all of the surfaces S1, S2, formed array of optical components OPA and the scribe line CL S3.

[0049] 再者,刻划线CL可随机地分布于该表面S1、S2、S3上,亦即,刻划线CL可分布于表面Sl的同一水平/垂直基准线(未绘示)上、或不同的水平/垂直基准在线。 [0049] Moreover, the scribe line CL may be randomly distributed on the surface S1, S2, S3, i.e., scribe line CL may be distributed at the same horizontal surface Sl / vertical reference line (not shown) on, or different horizontal / vertical reference line. 更详细而言, 表面Sl可具有多条水平基准线,且将水平基准线转90度来看即可视为多条垂直基准线,而刻划线CL可位于同一条水平基准线的位置(规律设置),或位于不同一条水平基准线的位置(随机设置),使得可由刻划线CL的设置而造成雾面的光学效果。 More specifically, the surface Sl may have a plurality of horizontal reference line, and the horizontal reference line of view may be regarded as 90 degrees plurality of vertical reference line, and the scribe line CL may be located in the same horizontal reference line ( law setting), or a horizontal reference line at different positions (randomly set), so that the scribe line CL may be caused by the optical effect provided matte.

[0050] 以下,将进一步说明本发明之导光板的制作方法。 [0050] Hereinafter, the method for manufacturing the light guide plate will be further described in the present invention.

[0051][导光板的制作方法] [Production Method of the light guide plate] [0051]

[0052] 图2为本发明实施例的一种导光板的制作方法的制作流程示意图。 [0052] FIG. 2 is a schematic production process of a method for making the light guide plate according to an embodiment of the present invention. 图3为本发明实施例的一种切割工具的示意图。 3 schematic diagram of a cutting tool according to an embodiment of the present invention. 请同时参照图1、图2与图3来理解本发明的导光板的制作方法MlOO。 Referring to FIGS. 1, 2 and 3 to understand the method of manufacturing the light guide plate of the present invention MlOO. 由图2可知,导光板的制作方法MlOO包括步骤SllO〜S130。 It is seen from FIG. 2, the light guide plate manufacturing method comprising the steps of MlOO SllO~S130.

[0053] 首先,在步骤SllO中,提供如图1所示的至少一导光板LGP,该导光板LGP具有一表面S1、S2、S3,该表面S1、S2、S3具有第一方向Dl以及与第一方向Dl夹一角度θ的第二方向D2。 [0053] First, in step SllO provided at least one guide plate LGP shown in FIG. 1, the guide plate having a surface LGP S1, S2, S3, the surface S1, S2, S3, and having a first direction Dl and a first direction Dl clip angle θ in a second direction D2.

[0054] 再来,在步骤S120中,提供如图3所示的至少一切割工具100,其中,每一切割工具100包括:基部110、至少一切割部120以及多个微结构130。 [0054] again, in step S120, as shown in FIG. 3 provides at least a cutting tool 100 as shown, wherein each of the cutting tool 100 comprising: 110, at least a cutting portion 120 and a plurality of microstructures of the base 130. 基部110具有一旋转轴110a。 Base 110 having a rotary shaft 110a. 切割部120设置于基部110上、沿着旋转轴IlOa的延伸方向L而排列。 Cutting portion 120 is provided on the base 110, L are arranged along the extending direction of the rotary shaft IlOa. 微结构130设置于切割部120上。 Microstructures 130 disposed on the cutting portion 120. 切割部120的数量、长度、排列于基部110的位置等都可变化,亦即根据导光板LGP所需的光学效果来进行设计。 The cutting portion 120 may change the number, length, arranged in a position like the base 110, i.e. be designed in accordance with the desired optical effect of the light guide plate LGP.

[0055] 之后,在步骤S130中,使切割工具100进行旋转而切割导光板LGP,其中,被切割后的如图1所示的导光板LGP包括:光学组件阵列OPA以及刻划线CL。 After [0055] In step S130, the cutting tool 100 is rotated to cut the light guide plate LGP, wherein the LGP light guide plate as shown in FIG 1 after being cut comprising: an array of optical components and OPA scribe line CL. 光学组件阵列OPA设置于导光板LGP的该表面S1、S2、S3上、且于第一方向Dl中延伸。 OPA array of optical components disposed on the surface S1 of the light guide plate LGP, the S2, S3, and extends in the first direction Dl. 刻划线CL设置于导光板LGP的该表面S1、S2、S3上、且于第二方向D2中延伸。 Scribe line CL light guide plate disposed on the surface of the LGP S1, the S2, S3, and extends in the second direction D2.

[0056] 值得注意的是,可利用切割工具100在导光板LGP的至少一表面Si、S2或S3,或者全部表面S1、S2、S3上进行切割或表面处理,而形成光学组件阵列OPA以及刻划线CL。 [0056] Notably, the use of the cutting tool 100 for cutting or surface treatment on at least one surface of the light guide plate LGP Si, S2, or S3, or all of the surface S1, S2, S3, form an array of optical components and engraved OPA crossed CL.

[0057] 可注意到,图3绘示了三个切割部120,然而,切割部120的数量可随着实际的使用需求而进行调整,并非仅限定于三个。 [0057] It may be noted, FIG. 3 shows the three cutting portion 120, however, the number of the cutting portions 120 may be used as the actual demand to adjust, not only limited to three. 并且,可在各切割部120上分别设置彼此相同或彼此不同形态的微结构130,以制作出具有特定形态的微结构130的组合的切割工具100。 Further, the same as each other or may be provided separately from each other different forms of microstructures 130 on each of the cutting portions 120, to produce a cutting tool having a particular combination of morphological microstructure 130 100.

[0058] 上述的切割工具100由在切割部120上设置微结构130,使得当切割工具100在进行高速旋转时,微结构130可在切割工具100的旋转方向R的切线上、对与微结构130接触的导光板LGP进行切割或刻划工作。 [0058] The tangential cutting tool 100 described above is provided when the microstructure 130 on the cutting section 120, so that when the cutting tool 100 during high speed rotation, the microstructures 130 may be in the rotation direction R of the cutting tool 100, of the microstructure the light guide plate 130 of the contact LGP scoring or cutting work. 结果是,在切割导光板LGP同时,可自然地在导光板LGP的切割面上形成光学组件阵列OPA与刻划线CL,且光学组件阵列OPA的光学微透镜LEN 的形状与切割工具100的微结构130的形状彼此为互补。 As a result, at the same time cutting the light guide plate LGP may be formed naturally array of optical components OPA score line CL and the cutting surface of the LGP light guide, and an array of micro-optical components of the optical microlenses LEN OPA the shape of the cutting tool 100 shaped structure 130 is complementary to each other.

[0059] 请再参照图3,切割部120可沿着旋转轴IlOa的延伸方向L而同轴排列。 [0059] Referring again to FIG. 3, the cutting portion 120 may be aligned coaxially L along the extending direction of the rotary shaft IlOa. 在另一实施例中,切割部120也可以采用其它的排列方式。 In another embodiment, the cutting portion 120 may use other arrangements. 图4为本发明实施例的另一种切割工具的示意图。 FIG 4 is a schematic of another embodiment of the cutting tool embodiment of the present invention. 请参照图4,此切割工具102与图3的切割工具100相同的组件标示以相同的符号。 Referring to FIG. 4, the same components of this cutting tool 102 and the cutting tool 100 of Figure 3 labeled with the same reference numerals. 可注意到,在此实施例中,切割部120沿着旋转轴IlOa的延伸方向而螺旋排列。 It may be noted, in this embodiment, the cutting portions 120 are arranged along the extending direction of the helical axis of rotation IlOa in this embodiment. 由同轴排列或螺旋排列的方式,可以使切割部120上的多处微结构130均能够进行切割或表面刻划的效果,使得切割工具100适于进行具有大面积的工件的切割或表面处理。 Coaxially aligned or arranged in a spiral manner, the cutting portion 120 of the multiple microstructures 130 each capable of cutting or scoring the surface effect, such that the cutting tool 100 is adapted to cut a surface having a large area or processing a workpiece . 如此一来,可解决现有技术中利用单一刀具进行重复切割所引起之刀具损毁的问题。 Thus, the prior art can solve using a single tool for cutting due to the repeated questions tool damaged.

[0060] 请再参照图3,基部110与切割部120为一体成型,也就是说,可以利用精密机械加工、或电加工切割,直接在一圆柱体(未绘示)上形成切割部120,使切割部120与基部110 是一体连接的。 [0060] Referring again to FIG. 3, the cutting portion 120 of the base 110 are integrally formed, that is, precision machining can be used, or EDM cutting, the cutting unit 120 directly (not shown) is formed on a cylinder, the cutting portion 120 and the base 110 are integrally connected.

[0061] 在另一实施例中,基部110与切割部120也可以采用其它的连接方式。 [0061] In another embodiment, the base 110 of the cutting portion 120 may use other connections. 图5为本发明实施例的再一种切割工具的示意图。 FIG 5 a schematic view of yet another embodiment of the cutting tool of the present embodiment of the invention. 请参照图5,此切割工具104与图3的切割工具100 相同的组件标示以相同的符号。 Referring to FIG. 5, the same components of this cutting tool 104 and 100 in FIG. 3, the cutting tool designated by the same reference numerals. 可注意到,在此实施例中,基部110与切割部120为彼此组装。 It may be noted, in this embodiment, the base 110 of the cutting portion 120 assembled to each other. 更详细而言,基部110与切割部120是分开制作的,并且,可利用黏接或特殊的嵌合结构等方式使切割部120固定到基部110上,以使切割工具104在高速旋转时,切割部120不会从基部110上脱离。 More specifically, the cutting portion 120 of the base 110 are produced separately, and the bonding can be used or special fitting structure, etc. of the cutting portion 120 is fixed to the base 110, so that the cutting tool 104 rotates at high speed, cutting portion 120 is not detached from the base 110.

[0062] 图6为本发明一实施例的切割工具的微结构的示意图。 [0062] FIG. 6 is a schematic view of the microstructure of the cutting tool according to an embodiment of the present invention. 请参照图6,将切割部120 的区域A进行放大后,可看到微结构130的形状。 Referring to FIG 6, the cutting portion region A 120 is amplified, can see the shape of the micro structure 130. 请继续参照图6,在一实施例中,上述的微结构130可突出于切割部120,且微结构130的形状可以是选自于半圆形、V字形、R沟及其组合,亦即,如图6所绘示的半圆形微结构130a、V字形微结构130b、R沟微结构130c、130d。 Still referring to FIG. 6, in one embodiment, the microstructures 130 may protrude to the cutting portion 120, and the shape of the microstructure 130 may be selected to be semi-circular, V-shaped, R ditch, and combinations thereof, i.e. , 6 semicircular microstructure depicted in FIG. 130a, V-shaped microstructures 130b, 130c R microstructure groove, 130d. 利用图6所示的突出于切割部120的微结构130,可在导光板LGP的表面上切割出内凹于导光板LGP表面的光学微透镜LEN。 The cutting portion protruding microstructures 120 as shown by FIG 6130, can cut an optical microlenses LEN concave surface of the light guide plate LGP upper surface of the light guide plate in the LGP.

[0063] 图7为本发明另一实施例的切割工具的微结构的示意图。 [0063] FIG. 7 is a schematic microstructure of a cutting tool according to another embodiment of the present invention. 请参照图7,在另一实施例中,将切割部120的区域B进行放大后,可看到微结构130是内凹于切割部120,且微结构130的形状可以是选自于半圆形、倒V字形、R沟及其组合,亦即,如图7所绘示的半圆形微结构130a、V字形微结构130b、R沟微结构130c、130d。 Referring to FIG 7, in another embodiment, the B region after the cutting portion 120 amplifies the microstructure 130 can be seen in the cutting portion 120 is recessed, and the shape of the microstructure 130 may be selected from semicircular shaped, inverted V-shape, R ditch, and combinations thereof, i.e., 7 semicircular microstructure depicted in FIG. 130a, the V-shaped microstructures 130b, 130c R microstructure groove, 130d. 利用图7所示的内凹于切割部120 的微结构130,可在导光板LGP的表面上切割出突出于导光板LGP表面的光学微透镜LEN。 Using the concave 130 shown in FIG. 7, on a surface of the light guide plate may be cut out of the LGP LEN projection optical microlenses on the light guide plate LGP microstructured surface 120 of the cutting unit.

[0064] 上述各种微结构130a〜130d彼此之间的尺寸可为相同或不相同,例如,可以采用具有不同尺寸的R沟微结构130c、130d,或是多个尺寸相同的半圆形微结构130a等。 [0064] The dimensions of the various microstructures 130a~130d each other may be the same or different, for example, micro structure 130c having different sizes of the groove R, the same 130d, semi-circular or a plurality of micro size 130a and other structures. 所述技术领域具有通常知识的,可以根据设计需要组合微结构130a〜130d的种类、尺寸等。 Having ordinary skill in the art to can be combined as desirable microstructure 130a~130d the type, size, etc. according to the design. 如此一来,可以直接于切割部120上组合各式各样的微结构130,而可解决以往需要更换不同刀具所引起之刀具的加工路径、换刀顺序变得极为复杂的问题。 Thus, a wide variety of combinations may be directly to the microstructure 130 on the cutting portion 120, and resolves the need to replace the conventional machining route caused by the different tools of the tool, the tool change sequence becomes extremely complicated.

[0065] 图8为利用本发明实施例所述的切割工具对于导光板进行切割的示意图。 [0065] FIG. 8 is a schematic diagram illustrating the use of a cutting tool for cutting the light guide plate embodiment of the present invention. 请参见图8,切割工具100可以在可在旋转方向R上高速旋转,以在切割方向C上对于单片或多片堆栈的导光板LGP进行切割。 Referring to FIG. 8, the cutting tool 100 may be in the rotation direction R rotating at high speed for cutting sheet stack for single or multi-light guide in the cutting direction LGP C. 值得注意的是,由于切割工具100的切割部120设置了微结构130,所以在对于导光板LGP进行切割的同时,可于导光板LGP的表面Sl (入光面)形成如图1所示的光学组件阵列OPA以及刻划线CL。 It is noted that, due to the cutting tool 100. Cutting portion 120 of the microstructure 130 is provided, so that while cutting the LGP light guide plate, the light guide plate may be on the surface Sl of the LGP (light incident surface) are formed as shown in FIG. 1 OPA array of optical components and the scribe line CL.

[0066] 承上述,可利用切割工具100可对于多层堆栈的导光板LGP进行快速切削,不但可缩短切割导光板LGP的制程时间,也可导光板LGP的表面Sl (入光面)上形成所需的光学组件阵列OPA以及刻划线CL。 [0066] Bearing the above, the cutting tool 100 may be utilized for quick cutting of the light guide plate LGP multilayer stack, not only shorten the process of cutting the light guide plate LGP time, the surface of the light guide plate may Sl is the LGP (light incident surface) formed OPA array of optical components required, and the scribe line CL. 特别是,对于厚度相当薄的导光板LGP而言,利用切割工具100可以容易地于导光板LGP的表面Sl (入光面)刻划出光学组件阵列ΟΡΑ。 In particular, the thickness of the relatively thin guide plate LGP, the use of the cutting tool 100 may be easily on the surface Sl of the light guide plate LGP (light incident surface) depicts the array of optical components ΟΡΑ.

[0067] 图9为利用本发明实施例所述的切割工具对于导光板进行表面处理的示意图。 [0067] FIG. 9 is a schematic diagram illustrating the use of a cutting tool for the surface treatment of the present embodiment of the invention the light guide plate. 请参照图9,可使切割工具100高速旋转,再使导光板LGP在输送带(未绘示)上于输送方向D上进行传送,切割部120上的微结构130会与导光板LGP的表面S2 (出光面)或S3 (反光面)接触,而刻划出光学组件阵列OPA以及刻划线CL。 Referring to FIG. 9, the cutting tool 100 enable high speed rotation, then the light guide plate LGP conveyor belt (not shown) in the conveying direction D is transmitted, the light guide plate 130 and the surface microstructure of the LGP 120 on the cutting portion S2 (the surface) or S3 (reflecting surface) in contact, and depicts the array of optical components and OPA scribe line CL. 所形成的光学组件阵列OPA例如是透镜微阵列(lens array),可提供所需的光学效果,而刻划线CL可以用来雾化光线。 OPA array of optical components, for example, is formed a microarray lens (lens array), can provide the desired optical effect, while the scribe line CL light fogging can be used.

[0068] 图10为本发明实施例的一种切割工具模块的示意图。 [0068] FIG. 10 schematic diagram of an embodiment of the cutting tool module embodiment of the invention. 请参照图10,切割工具模块200包括:多个上述的切割工具100,其中,这些切割工具100在旋转轴IlOa的延伸方向L上进行排列。 Referring to FIG 10, the cutting tool 200 module comprising: a plurality of cutting tool 100 described above, wherein the cutting tool 100 are arranged in the extending direction of the rotation axis L of IlOa.

[0069] 如图9所示,仅绘示一个切割工具100进行表面处理的示意图,然而,本发明并不仅限于使用一个切割工具100。 [0069] As shown in FIG. 9, a schematic diagram 100 only shows a tool for cutting a surface treatment, however, the present invention is not limited to use a cutting tool 100. 更详细而言,当导光板LGP的面积增大时,可利用多个切割工具100所构成的切割工具模块200轻易地对于大面积的导光板LGP进行切割或表面处理。 More specifically, when the light guide plate increases the area of ​​the LGP, the cutting tool may utilize a plurality of modules 100 constituting the cutting tool 200 is easily cut or a surface treatment for a large area of ​​the light guide plate LGP.

[0070] 另外,可拼装出对应于该特定尺寸的导光板LGP的切割工具模块200,以对于该特定尺寸的导光板LGP进行切割或表面处理。 [0070] In addition, the assembled corresponding to the specific dimensions of the light guide plate LGP cutting tool module 200 to the light guide plate for this particular size LGP cutting or surface treatment. 再者,当切割工具模块200中的任一个切割工具100损坏时,可直接抽换该损坏的切割工具100,有利于维修效率的提升。 Further, when any one of a cutting tool module 200 cutting tool 100 is damaged, the damage can be directly removable cutting tool 100, conducive to improve maintenance efficiency.

[0071] 特别是,也可任意组合具有各种不同的微结构130的切割工具100〜104,来形成切割工具模块200。 [0071] In particular, any combination may be a cutting tool having various microstructures 100~104 130, module 200 to form the cutting tool. 如此一来,可制作各种形态的光学组件阵列ΟΡΑ。 In this way, it can be made in various forms array of optical components ΟΡΑ.

[0072] 综上所述,本发明的导光板及其制作方法至少具有以下优点: [0072] In summary, the light guide plate and the manufacturing method of the present invention has at least the following advantages:

[0073] 利用本发明实施例所述的切割工具对于导光板进行切割或表面处理,可以于导光板的表面上形成光学组件阵列与刻划线,其中,刻划线可提供雾化光线的光学效果。 [0073] With the present embodiment of the invention the cutting tool for cutting or surface treatment of the light guide plate, the array of optical components may be formed scribe line on the surface of the light guide plate, wherein the scribe lines may be provided an optical fogging light effect. 并且, 该导光板的制作方法适合在厚度极薄的导光板上形成光学组件阵列以及刻划线。 Further, the method for manufacturing the light guide plate and an array of optical components suitable for forming a scribe line on a thin thickness light guide plate.

[0074] 当进行切割或表面处理时,在切割部上设置的多个微结构可对于导光板进行刻划,能够提升切割工具的加工速度、延长切割工具的寿命。 [0074] When cutting or surface treatment, a plurality of microstructures disposed on the cutting section can be scored for the light guide plate, it is possible to enhance the processing speed of the cutting tool, cutting tool life extended. 另外,由在切割部上形成各式各样的微结构,而可以在导光板上形成所需的任意光学组件阵列,而适合特殊形状的光学组件阵列的加工。 Further, on the cutting portion is formed by a wide range of microstructures, and can be formed in any desired array of optical components in the light guide plate, and for processing a special shape of the array of optical components.

[0075] 虽然本发明已以实施例揭露如上,然其并非用以限定本发明,任何所属技术领域中具有通常知识的,在不脱离本发明之精神和范围内,当可作些许之更动与润饰,故本发明之保护范围当视后附之权利要求范围所界定的为准。 [0075] Although the present invention has been disclosed in the above embodiments, they are not intended to limit the present invention, any person having ordinary knowledge in the technical field, and without departing from the spirit and scope of the invention, various omissions, substitutions can be made to the and variations, so that the scope of the present invention when the rear view of the scope of the appended claims as appended and their equivalents.

Claims (17)

  1. 1. 一种导光板,其特征在于:具有一表面,该表面具有一第一方向与一第二方向,该第一方向与该第二方向之间夹一角度,该导光板包括:一光学组件阵列;所述的光学组件阵列设置于该导光板的该表面上、且于该第一方向中延伸;以及一刻划线;所述的刻划线设置于该导光板的该表面上、且于该第二方向中延伸。 1. A light guide, comprising: having a surface, said surface having a first direction and a second direction, the first direction and a second direction between the clip angle, the light guide comprising: an optical array assembly; said array of optical components disposed on the surface of the light guide plate, and extending in the first direction; and scribing moment; the score line disposed on the surface of the light guide plate, and extending in the second direction.
  2. 2.根据权利要求1所述的导光板,其特征在于:该刻划线分布于该表面的同一水平/ 垂直基准在线、或不同的水平/垂直基准在线。 2. The light guide plate according to claim 1, characterized in that: the scribe line located in the same level as the surface / vertical reference line, or a different horizontal / vertical reference line.
  3. 3.根据权利要求1所述的导光板,其特征在于:该角度为90士 10度。 3. The light guide plate according to claim 1, wherein: the angle is 90 ± 10 degrees.
  4. 4.根据权利要求1所述的导光板,其特征在于:该表面包括:该导光板的入光面、出光面或反光面。 4. The light guide plate according to claim 1, wherein: the surface comprises: a light incident surface of the light guide plate, the reflective surface or surfaces.
  5. 5.根据权利要求1所述的导光板,其特征在于:该光学组件阵列包括:多个光学微透镜;所述的多个光学微透镜突出于该导光板的该表面,且该些光学微透镜的形状是选自于半圆形、V字形、R沟及其组合。 The light guide plate according to claim 1, wherein: the optical assembly array comprising: a plurality of optical microlenses; said plurality of optical microlenses protruding from the surface of the light guide plate, and the plurality of optical micro shape of the lens is selected from semicircular, V-shape, R ditch, and combinations thereof.
  6. 6.根据权利要求1所述的导光板,其特征在于:该光学组件阵列包括:多个光学微透镜;所述的多个光学微透镜内凹于该导光板的该表面,且该些光学微透镜的形状是选自于半圆形、V字形、R沟及其组合。 6. The light guide plate according to claim 1, wherein: the optical assembly array comprising: a plurality of optical microlenses; said plurality of optical microlenses on the concave surface of the light guide plate, and the plurality of optical shape of the microlens is selected from semi-circular, V-shaped, R ditch, and combinations thereof.
  7. 7.根据权利要求1所述的导光板,其特征在于:该光学组件阵列包括:多个光学微透镜,该些光学微透镜彼此之间的尺寸为相同或不相同。 7. The light guide plate according to claim 1, wherein: the optical assembly array comprising: a plurality of optical microlenses, the plurality of optical microlenses dimension between the same or different from each other.
  8. 8. 一种导光板的制作方法,是通过以下步骤实现的:提供至少一导光板,该导光板具有一表面,该表面具有一第一方向与一第二方向,该第一方向与该第二方向之间夹一角度;提供至少一切割工具,所述的切割工具包括:一基部;所述的基部具有一旋转轴;至少一切割部;所述的切割部设置于该基部上、且沿着该旋转轴的延伸方向而排列;多个微结构;所述的微结构设置于该切割部上;使该切割工具进行旋转而切割该导光板,其中,被切割后的该导光板包括:一光学组件阵列;所述的光学组件阵列设置于该导光板的该表面上、且于该第一方向中延伸;以及一刻划线;所述的刻划线设置于该导光板的该表面上、且于该第二方向中延伸。 8. A method of manufacturing a light guide plate, is achieved by the steps of: providing at least one light guide plate having a surface, said surface having a first direction and a second direction, the first direction and the second sandwiched between two directions at an angle; providing at least one cutting tool, said cutting tool comprising: a base portion; said base having a rotational axis; at least one cutting portion; of the cutting portion disposed on the base portion, and are arranged along the extending direction of the rotating shaft; a plurality of microstructures; the microstructure disposed on the cutting portion; so that the cutting tool rotates to cut the light guide plate, wherein the light guide plate after being cut comprising : an array of optical components; said array of optical components disposed on the surface of the light guide plate, and extending in the first direction; and scribing moment; the score line disposed on the surface of the light guide plate on, and extends in the second direction.
  9. 9.根据权利要求8所述的导光板的制作方法,其中,该刻划线分布于该表面的同一水平/垂直基准在线、或不同的水平/垂直基准在线。 9. The manufacturing method of the light guide plate according to claim 8, wherein the scribe line located in the same level as the surface / vertical reference line, or a different horizontal / vertical reference line.
  10. 10.根据权利要求8所述的导光板的制作方法,其中,该角度为90士 10度。 10. The manufacturing method of the light guide plate according to claim 8, wherein the angle is 90 ± 10 degrees.
  11. 11.根据权利要求8所述的导光板的制作方法,其中,该表面包括:该导光板的入光面、 出光面或反光面。 11. The manufacturing method of the light guide plate according to claim 8, wherein the surface comprising: a light incident surface of the light guide plate, the reflective surface or surfaces.
  12. 12.根据权利要求8所述的导光板的制作方法,其中,该切割部沿着该旋转轴的延伸方向而同轴排列。 12. The manufacturing method of the light guide plate as claimed in claim 8, wherein the cutting portion coaxially arranged along the extending direction of the rotating shaft.
  13. 13.根据权利要求8所述的导光板的制作方法,其中,该切割部沿着该旋转轴的延伸方向而螺旋排列。 13. The manufacturing method of the light guide plate as claimed in claim 8, wherein the cutting portion extends helically arranged along the direction of the rotating shaft.
  14. 14.根据权利要求8所述的导光板的制作方法,其中,该基部与该切割部为一体成型、 或为彼此组装。 14. A manufacturing method of the light guide plate according to claim 8, wherein the base portion and the cutting portion is integrally formed, or assembled to each other.
  15. 15.根据权利要求8所述的导光板的制作方法,其中,该些微结构突出于该切割部,该些微结构的形状是选自于半圆形、V字形、R沟及其组合,且该些微结构的形状互补于该光学组件阵列的光学微透镜的形状。 15. The manufacturing method of the light guide plate as claimed in claim 8, wherein the micro structures protruding from the cutting portion, the shape of the micro structures selected from semicircular, V-shape, R ditch, and combinations thereof, and the slightly shaped configuration complementary to the shape of the optical micro-lens array of the optical assembly.
  16. 16.根据权利要求8所述的导光板的制作方法,其中,该些微结构内凹于该切割部,该些微结构的形状是选自于半圆形、V字形、R沟及其组合,且该些微结构的形状互补于该光学组件阵列的光学微透镜的形状。 16. The manufacturing method of the light guide plate as claimed in claim 8, wherein the micro structure of the cutting portion recessed in the shape of the micro structures selected from semicircular, V-shape, R ditch, and combinations thereof, and the shape of the micro structures is complementary to the shape of the optical micro-lens array of the optical assembly.
  17. 17.根据权利要求8所述的导光板的制作方法,其中,该些微结构彼此之间的尺寸为相同或不相同。 17. A manufacturing method of the light guide plate according to claim 8, wherein the dimension between the micro structures to one another is the same or different.
CN 201110003956 2011-01-10 2011-01-10 Light guide plate and manufacturing method thereof CN102081188A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105345274A (en) * 2015-11-22 2016-02-24 苏州光韵达光电科技有限公司 Light guide plate machining device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040114346A1 (en) * 1999-02-23 2004-06-17 Parker Jeffery R. Light redirecting films and film systems
CN1657978A (en) * 2005-01-14 2005-08-24 陈健 Method for producing light board, used equipment and produced light board
CN201917677U (en) * 2011-01-10 2011-08-03 苏州向隆塑胶有限公司 The light guide plate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040114346A1 (en) * 1999-02-23 2004-06-17 Parker Jeffery R. Light redirecting films and film systems
CN1657978A (en) * 2005-01-14 2005-08-24 陈健 Method for producing light board, used equipment and produced light board
CN201917677U (en) * 2011-01-10 2011-08-03 苏州向隆塑胶有限公司 The light guide plate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105345274A (en) * 2015-11-22 2016-02-24 苏州光韵达光电科技有限公司 Light guide plate machining device
CN105345274B (en) * 2015-11-22 2017-07-07 苏州光韵达光电科技有限公司 A light guide processing equipment

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