CN102076185B - 壳体的制作方法及由该方法制得的壳体 - Google Patents

壳体的制作方法及由该方法制得的壳体 Download PDF

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CN102076185B
CN102076185B CN200910310126.8A CN200910310126A CN102076185B CN 102076185 B CN102076185 B CN 102076185B CN 200910310126 A CN200910310126 A CN 200910310126A CN 102076185 B CN102076185 B CN 102076185B
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housing
metal film
plastic substrate
conducting metal
plastic
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CN102076185A (zh
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姜传华
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Shenzhen Futaihong Precision Industry Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/06—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects
    • B05D5/067—Metallic effect
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
    • B05D3/141—Plasma treatment
    • B05D3/142—Pretreatment
    • B05D3/144—Pretreatment of polymeric substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/14—Surface shaping of articles, e.g. embossing; Apparatus therefor by plasma treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2081/00—Use of polymers having sulfur, with or without nitrogen, oxygen or carbon only, in the main chain, as moulding material
    • B29K2081/04—Polysulfides, e.g. PPS, i.e. polyphenylene sulfide or derivatives thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]

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  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
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Abstract

本发明提供一种壳体的制作方法及以该方法所制得的壳体。该壳体的制作方法包括如下步骤：提供一塑料基体，该塑料基体的材质为聚苯硫醚；对该塑料基体表面进行等离子体表面处理；在经等离子体表面处理后的塑料基体表面形成一不导电金属膜。该壳体包括一塑料基体及一形成于塑料基体表面的不导电金属膜，所述塑料基体的材质为聚苯硫醚，该不导电金属膜在该塑料基体表面的附着力的强度在3B以上。

Description

壳体的制作方法及由该方法制得的壳体
技术领域
本发明是关于一种壳体的制作方法及由该方法制得的壳体。
背景技术
现有电子产品(如手机、PDA等)的壳体常被镀覆一金属层或具有金属效果的膜层而使产品的外观具有金属光泽，从而吸引消费者的眼球。该应用于电子产品的壳体，首先要满足不能干扰电子信号的条件，以保持产品正常的功能。因此，现有技术通常采用不导电真空镀膜技术在壳体上形成一不导电金属膜，以达到装饰的效果且同时不干扰电子信号的目的。
聚苯硫醚是一种综合性能超群的热塑性结晶树脂，其具有耐高温、耐腐蚀及耐辐射的特点，且无毒，机械性能优异，制品的尺寸稳定性好，可用多种方法进行成型加工。然而聚苯硫醚的表面自由能较低(约为34MJ/m2)，不导电金属膜在该聚苯硫醚基材表面基本无任何的附着力，即使是在聚苯硫醚基材上先喷涂一油漆层作为过渡层亦无济于事，因为该油漆层亦无法附着于聚苯硫醚基材上。因此，具有上述优良性能的聚苯硫醚塑材于电子产品壳体的应用受到了极大的限制。
发明内容
鉴于此，有必要提供一种可使镀膜层较好的附着于聚苯硫醚基体上的壳体的制作方法，以开拓聚苯硫醚塑材在电子产品壳体领域的应用。
另外，还有必要提供一种由上述方法所制得的壳体。
一种壳体的制作方法，其包括如下步骤：
提供一塑料基体，该塑料基体的材质为聚苯硫醚；
对该塑料基体表面进行等离子体表面处理，以提高该塑料基体的表面平整度；
在经等离子体表面处理后的塑料基体表面形成一不导电金属膜。
一种壳体，其包括一塑料基体及一形成于塑料基体表面的不导电金属膜，所述塑料基体的材质为聚苯硫醚，该不导电金属膜在该塑料基体表面的附着力的强度在3B以上，该塑料基体表面经过等离子体表面处理后，该塑料基体的表面平整度提高。
相较于现有技术，本发明壳体的制作方法通过对聚苯硫醚塑料基体进行等离子体表面处理后再于该基体表面形成不导电金属膜，该等离子体表面处理可有效改善聚苯硫醚塑料基体的表面性能，如表面自由能、表面活性等，从而使不导电金属膜可牢固地附着于聚苯硫醚塑料基体的表面，达到装饰的效果。本发明开拓了聚苯硫醚塑材在电子产品壳体领域的应用，使得所述壳体在具有聚苯硫醚优良性能的同时又具有美丽的外观，大大提高了产品的使用价值及附加价值。
附图说明
图1为本发明一较佳实施方式壳体的剖视示意图。
具体实施方式
本发明一较佳实施方式壳体的制作方法包括如下步骤：
提供一塑料基体，该塑料基体的材质为聚苯硫醚。该塑料基体可以注塑成型的方式制成。
对该塑料基体表面进行等离子体表面处理。提供一等离子体发生仪。该等离子体发生仪可为感应耦合式等离子体发生仪、微波表面波等离子体发生仪、大气辉光等离子体发生仪或直流等离子体发生仪。该等离子体发生仪所用的源气体可为氧气或氮气。将该塑料基体置于该等离子体发生仪中，该等离子体发生仪所产生的等离子体即作用于塑料基体的表面，破坏该基体表面分子间原有的化学键，同时与该塑料基体的表面分子进行反应生成产物分子，该产物分子继而解析形成气相从基体表面脱离，而基体表面由于分子间化学键的改变其性能也发生改变，使得该基体表面自由能增强。经该等离子体表面处理后的塑料基体的表面自由能可达到50MJ/m2以上。该等离子体表面处理同时可使塑料基体表面更加清洁、表面平整度更高。
在经等离子体表面处理的塑料基体表面进行油漆喷涂以形成一底漆层。喷涂所述底漆层所用的油漆可为丙烯酸树脂漆或紫外光固化漆。该底漆层的厚度可为1-30μm。底漆层喷涂后进行流平、烘烤及固化处理。由于塑料基体经等离子体表面处理后其表面自由能增加，表面极性增强，因而底漆层可牢固的附着于该塑料基体的表面。经附着力测试证明，该底漆层在所述塑料基体表面的附着力可在3B以上(测试条件为：百格刀测试，11×11格，每格长宽为1mm×1mm)。
在所述底漆层上以不导电真空镀膜的方式形成一不导电金属膜。镀覆该不导电金属膜的靶材可选自为铟、锡、钛、铜、不锈钢、铝及铝硅等材料中的任意一种。该不导电金属膜具有金属质感的外观，其厚度在10-100nm之间。由于不导电金属膜的不导电性，其对无线射频的传输或接收不会产生干扰，即不会干扰电子信号。
在所述不导电金属膜上喷涂一中漆层。该中漆层可为透明的紫外光固化漆，且可添加彩色颜料，以使壳体呈现彩色的外观。该中漆层的厚度在1-20μm之间。
在所述中漆层上喷涂一面漆层。该面漆层为一透明的保护漆膜，其厚度可为10-50μm。该面漆层可为透明的紫外光固化漆，其具有较高的硬度以起到较好的表面保护作用。所述面漆层中亦可添加彩色颜料，以使壳体的外观更加美观。
可以理解的，所述底漆层可以省略，即不导电金属膜直接形成于塑料基体的表面。该直接形成于塑料基体表面的不导电金属膜在基体表面的附着力亦在3B以上。
可以理解的，当所述不导电金属膜具有较高的耐磨性时，所述中漆层及面漆层均可以省略。
请参阅图1所示，其为本发明以上述方法所制得的壳体10。该壳体10包括一塑料基体11及依次形成于塑料基体11表面的底漆层13、不导电金属膜15、中漆层17及面漆层19。本实施例中，所述塑料基体11的材质为聚苯硫醚，该形成于塑料基体11表面的镀膜层在塑料基体11表面的附着力在3B以上。
本发明壳体的制作方法通过对聚苯硫醚塑料基体进行等离子体表面处理后再于该基体表面形成不导电金属膜，该等离子体表面处理可有效改善聚苯硫醚塑料基体的表面性能，如表面自由能、表面活性等，从而使不导电金属膜可牢固地附着于聚苯硫醚塑料基体的表面，达到装饰的效果。本发明开拓了聚苯硫醚塑材在电子产品壳体领域的应用，使得所述壳体在具有聚苯硫醚优良性能的同时又具有美丽的外观，大大提高了产品的使用价值及附加价值。

Claims (10)

1.一种壳体的制作方法，其包括如下步骤：
提供一塑料基体，该塑料基体的材质为聚苯硫醚；
对该塑料基体表面进行等离子体表面处理，以提高该塑料基体的表面平整度；
在经等离子体表面处理后的塑料基体表面形成一不导电金属膜。
2.如权利要求1所述的壳体的制作方法，其特征在于：所述等离子体表面处理的步骤在一等离子体发生仪中进行；该等离子体发生仪为感应耦合式等离子体发生仪、微波表面波等离子体发生仪、大气辉光等离子体发生仪或直流等离子体发生仪。
3.如权利要求1所述的壳体的制作方法，其特征在于：所述不导电金属膜的材质为铟、锡、钛、铜、不锈钢、铝及铝硅材料中的任意一种。
4.如权利要求3所述的壳体的制作方法，其特征在于：所述不导电金属膜的厚度在10-100nm之间。
5.如权利要求1所述的壳体的制作方法，其特征在于：所述方法还包括在形成不导电金属膜之前在基体表面喷涂一底漆层的步骤。
6.如权利要求1所述的壳体的制作方法，其特征在于：所述方法还包括在不导电金属膜上形成一中漆层的步骤。
7.如权利要求6所述的壳体的制作方法，其特征在于：所述方法还包括在中漆层上形成一面漆层的步骤。
8.一种壳体，其包括一塑料基体及一形成于塑料基体表面的不导电金属膜，其特征在于：所述塑料基体的材质为聚苯硫醚，该不导电金属膜在该塑料基体表面的附着力的强度在3B以上，该塑料基体表面经过等离子体表面处理后，该塑料基体的表面平整度提高。
9.如权利要求8所述的壳体，其特征在于：所述壳体还包括一底漆层，该底漆层形成于塑料基体与不导电金属膜之间。
10.如权利要求8所述的壳体，其特征在于：所述壳体还包括形成于不导电金属膜表面的一中漆层及一面漆层。
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