CN102069452B - System for evaluating and/or improving performance of CMP pad dresser - Google Patents

System for evaluating and/or improving performance of CMP pad dresser Download PDF

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Publication number
CN102069452B
CN102069452B CN 201010299911 CN201010299911A CN102069452B CN 102069452 B CN102069452 B CN 102069452B CN 201010299911 CN201010299911 CN 201010299911 CN 201010299911 A CN201010299911 A CN 201010299911A CN 102069452 B CN102069452 B CN 102069452B
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superabrasive particles
plurality
cmp pad
superabrasive
substrate
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CN 201010299911
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Chinese (zh)
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CN102069452A (en )
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宋健民
白阳亮
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宋健民
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/18Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
    • B24B49/186Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools taking regard of the wear of the dressing tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING, OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28Resins or natural or synthetic macromolecular compounds

Abstract

本发明提供识别及/或提高化学机械研磨(CMP)垫修整器性能的方法及系统。 The present invention provides an identification and / or improved method and system for chemical mechanical polishing (CMP) pad dresser performance. 在一方面中,举例而言,一种识别一CMP垫修整器中的过度侵蚀性超研磨颗粒的方法可包括:将一具有多个超研磨颗粒的CMP垫修整器定置于一指示基板上,以使该CMP垫修整器的多个超研磨颗粒的至少一部分接触该指示基板,及在一第一方向上移动该CMP垫修整器经过该指示基板,以使该多个超研磨颗粒的该部分在该基板上产生一第一标记图案,其中该第一标记图案自该多个超研磨颗粒中识别多个工作超研磨颗粒。 In one aspect, for example, a method of identifying a CMP pad dresser in excessive erosion of the superabrasive particles may method comprising: a CMP pad dresser having a plurality of superabrasive particles disposed on a given substrate indication, contacting at least a portion of the CMP pad conditioner so that a plurality of superabrasive particles indication of the portion of the substrate, and moved in a first direction through the CMP pad conditioner indication substrate, so that the plurality of superabrasive particles generating a first marker pattern on the substrate, wherein the first marker pattern recognition work plurality of superabrasive particles from the plurality of superabrasive particles.

Description

识别和/或提高化学机械研磨垫修整器性能的系统及方法 System and method for identifying and / or enhance the chemical mechanical polishing pad conditioner performance

[0001] 本申请主张2009年9月29日申请的美国临时专利申请第61/246,816号的权利,该临时专利申请是以引用的方式并入本文中。 Way [0001] This application claims priority to September 29, 2009 of US Provisional Patent Application No. 61 / No. 246,816, which provisional patent application is incorporated by reference herein.

技术领域 FIELD

[0002] 本发明涉及对硅晶片的化学机械研磨,尤其涉及识别及/或提高化学机械研磨(CMP)垫修整器性能的方法及系统。 [0002] The present invention relates to chemical mechanical polishing of a silicon wafer, and particularly to identification and / or improved chemical mechanical polishing (CMP) pad dresser and system performance.

背景技术 Background technique

[0003]目前半导体工业每年花费超过十亿美元来制造具有极平坦及光滑的表面的硅晶片,目前有非常多种可使硅晶片的表面达到平坦、光滑的效果的已知技术。 [0003] The semiconductor industry is currently over a billion dollars are spent each year to manufacture a silicon wafer having an extremely flat and smooth surface, there are a large variety can reach the surface of the silicon wafer flat, smooth effect known techniques. 这些技术中最常见者为化学机械研磨(ChemicalMechanical Polishing(CMP))的方法,其包括使用研磨垫与研磨浆料的组合。 These techniques were the most common chemical mechanical polishing (ChemicalMechanical Polishing (CMP)) a method which comprises using a combination of the polishing pad and the polishing slurry. 所有CMP方法的中心重点为在诸如以下的方面中达到高性能水准:经研磨晶片的表面均一性、IC电路的光滑度、与晶片的生产率极为相关的材料移除率以及就经济效益而言,CMP方法中所使用的消耗品的寿命等。 All central focus CMP process to achieve high performance in terms of standards, such as the following: The surface smoothness uniformity of the polished wafer, the IC circuit, a highly relevant productivity of wafer material removal rate and regards cost, the method used in the CMP consumables life.

发明内容 SUMMARY

[0004] 本发明提供评估及提高CMP垫修整器性能的方法及系统。 [0004] The present invention provides evaluation and improve the performance of the CMP pad conditioner system and a method. 在一方面中,举例而言,提供一种识别一CMP垫修整器中的过度侵蚀性超研磨颗粒的方法。 In one aspect, for example, a method of identifying a CMP pad dresser in excessive erosion of the superabrasive particle method. 该种方法可包括将一具有多个超研磨颗粒的CMP垫修整器定置于一指示基板上,以使该CMP垫修整器的该多个超研磨颗粒的至少一部分接触该指示基板。 Contacting at least a portion of the substrate indicates that the method may include a plurality of superabrasive particles having a CMP pad conditioner disposed on a given substrate indication, so that the CMP pad dresser of the plurality of superabrasive particles. 该方法可进一步包括在一第一方向上移动该CMP垫修整器经过该指示基板,以使该多个超研磨颗粒的该部分在该基板上产生一第一标记图案,其中该第一标记图案自该多个超研磨颗粒中识别多个工作超研磨颗粒。 The method may further comprise moving the CMP pad conditioner through the substrate indicates a first direction, so that the portion of the plurality of superabrasive particles generating a first marker pattern on the substrate, wherein the first marker pattern from the plurality of superabrasive particles in a plurality of work identifying superabrasive particles. 在另一方面中,该方法可包括在一第二方向上移动该CMP垫修整器经过该指示基板,以使该多个超研磨颗粒的该部分产生一第二标记图案,该第二方向大致上处于该第一方向的横向,其中该第二标记图案与该第一标记图案相互对照并提供该多个工作超研磨颗粒的定位信息。 In another aspect, the method may include moving the CMP pad conditioner through the substrate indicates a second direction, such that the portion of the plurality of superabrasive particles produces a second marker pattern, the second direction substantially in the direction transverse to the first, wherein the second marker pattern control and provide positioning information of the plurality of superabrasive particles each work with the first marker pattern. 另外,在一方面中,该多个超研磨颗粒相对于该CMP垫修整器具有至少一个校正定位方向,且该第一方向并非该至少一个校正定位方向。 Further, in one aspect, the plurality of superabrasive particles with respect to the CMP pad conditioner having at least one locating direction correction, and the first direction is not the direction locating the at least one correction.

[0005] 其亦可利用物理方式标记CMP垫修整器上的多个工作超研磨颗粒。 [0005] CMP pad which can mark a plurality of superabrasive particles on the work dresser using physical means. 因此,在一方面中,指示基板可包括指示标记物,其用于当CMP垫修整器移动经过指示基板时标记多个工作超研磨颗粒。 Accordingly, in one aspect, the substrate may include an indication indicating a marker, for, when a plurality of work of superabrasive particles through the mark indicating moving substrate CMP pad conditioner. 可涵盖各种指示标记物,且能够标记过度侵蚀性超研磨颗粒的任何指示标记物应视为属于本发明范畴。 May encompass a variety of markers indicate, and can be marker excessive erosion of superabrasive particles of any label shall be deemed to indicate scope of the invention. 非限制性实例包括颜料标记物、萤光标记物、化学标记物、放射性标记物,及其类似物。 Non-limiting examples include pigment markers, fluorescent labels, chemiluminescent labels, radioactive labels, and the like.

[0006] 在本发明的另一方面中,提供一种增加工作超研磨颗粒在CMP垫修整器中的比例的方法。 [0006] In another aspect of the present invention, there is provided a method of increasing the working ratio of superabrasive particles in a CMP pad dresser of the pad. 该种方法可包括将一具有多个超研磨颗粒的CMP垫修整器定置于一指示基板上,以使该CMP垫修整器的该多个超研磨颗粒的至少一部分接触该指示基板,及在一第一方向上移动该CMP垫修整器经过该指示基板,以使该多个超研磨颗粒的该部分在该基板上产生一第一标记图案。 Contacting at least a portion of the substrate indicates that the method may comprise a CMP pad dresser having a plurality of superabrasive particles disposed on a given substrate indication, so that the CMP pad dresser of the plurality of superabrasive particles, and a moving in a first direction through the CMP pad conditioner indicates the substrate, so that the portion of the plurality of superabrasive particles generating a first marker pattern on the substrate. 该第一标记图案自该多个超研磨颗粒中识别多个过度侵蚀性超研磨颗粒。 The first marker pattern identification excessive erosion of the plurality of superabrasive particles from the plurality of superabrasive particles. 该方法亦可包括除去该多个过度侵蚀性超研磨颗粒的至少一部分,以增加工作超研磨颗粒在CMP垫修整器中之比例。 The method may also include removing at least a portion of the plurality of superabrasive particles excessive erosion to increase the operating ratio of superabrasive particles in the dresser of the CMP pad.

[0007] 该方法可进一步包括识别在经过除去程序之后的工作超研磨颗粒。 [0007] The method may further include identifying elapsed after removing the work program superabrasive particles. 因此,在一方面中,可将CMP垫修整器定置于下一指示基板上,以使CMP垫修整器的多个超研磨颗粒的至少一部分接触该下一指示基板。 Accordingly, in one aspect, the CMP pad dresser may be placed on the next indication given substrate to contact with at least a portion of the plurality of superabrasive particles CMP pad dresser indicating the next substrate. 接着可在第一方向上移动CMP垫修整器经过该下一指示基板,以使该多个超研磨颗粒的该部分在该基板上产生一后生标记图案,其中该后生标记图案自该多个超研磨颗粒中识别随后产生的多个工作超研磨颗粒。 Then the movable CMP pad conditioner through the next indication substrate such that the portion of the plurality of superabrasive particles epigenetic mark generating a pattern on the substrate in a first direction, wherein the epigenetic marker pattern from the plurality of super a plurality of abrasive particles work identified subsequently generated superabrasive particles.

[0008] 本发明另外提供一种CMP垫修整器修整轮廓。 [0008] The present invention further provides a CMP pad conditioner conditioning profile. 该种修整轮廓可包括修整图案,其自CMP垫修整器的多个超研磨颗粒中识别多个工作超研磨颗粒。 This kind of profile may include a trimming pattern trimming, which identifies a plurality of superabrasive particles work from a plurality of superabrasive particles in a CMP pad dresser. 可涵盖各种格式的修整图案,且输送相关信息的任何格式可视为属于本发明范畴。 Trimming pattern may encompass a variety of formats, and transport-related information in any format can be considered part of the scope of the present invention. 非限制性实例可包括电子表示、指示基板上的标记图案、标记图案的图解表示、标记图案的数值表示、展示多个工作超研磨颗粒的位置的CMP垫修整器图,及其类似的形式。 Non-limiting examples include electronic representation, illustrating indication mark pattern on the substrate, the marking pattern represents a numerical representation of the marking pattern, showing a plurality of work positions CMP superabrasive particle FIG dresser, and the like in the form of a pad. 在一特定方面中,修整图案为指示基板上的标记图案,其包括由多个工作超研磨颗粒在第一方向上移动经过指示基板而产生的第一标记图案,且进一步包括由多个工作超研磨颗粒在第二方向上移动经过指示基板而产生的第二标记图案。 In a particular aspect, the trim indicator pattern is a pattern on a substrate, comprising moving a first flag indicative of the substrate through the pattern generated in a first working direction by a plurality of superabrasive particles, and further comprising a plurality of operating over abrasive particles move through the pattern of the second marker indicating the substrate generated in the second direction. 第二方向可至少大致上处于第一方向的横向。 It may be at least substantially in a second direction transverse to the first direction.

[0009] 本发明另外提供一种整平CMP垫修整器中的多个超研磨颗粒尖端的方法。 [0009] The present invention further provides a CMP pad conditioner entire plurality of superabrasive particles in a method flat tip. 在一方面中,该种方法可包括暂时将多个超研磨颗粒耦接至一工具基板且抵靠一指示基板定置该多个超研磨颗粒,以使该多个超研磨颗粒的至少一部分接触该指示基板。 In one aspect, the method may include temporarily plurality of superabrasive particles coupled to a tool and the substrate against a substrate indicative of the plurality of set superabrasive particles, such that contact with at least a portion of the plurality of superabrasive particles in the It indicates the substrate. 该方法可进一步包括移动该多个超研磨颗粒经过该指示基板,以使该多个超研磨颗粒的该部分在该指示基板上产生一标记图案。 The method may further comprise moving the plurality of superabrasive particles through the indicated substrate, so that the portion of the plurality of superabrasive particles produced in a marking pattern on the substrate indicates. 该标记图案自该多个超研磨颗粒中识别多个过度侵蚀性超研磨颗粒。 The pattern recognition mark excessive erosion of the plurality of superabrasive particles from the plurality of superabrasive particles. 该方法亦可包括相对于该工具基板调整该多个过度侵蚀性超研磨颗粒的尖端以改变工作超研磨颗粒与非工作超研磨颗粒的比例,且使该多个超研磨颗粒永久耦接至该工具基板。 The method may also include adjusting the substrate relative to the tool tip excessive erosion of the plurality of superabrasive particles in order to change the ratio of the working and non-working superabrasive particles superabrasive particles, and so that the plurality of superabrasive particles coupled to the permanent tool substrate.

[0010] 尽管本发明涵盖各种使超研磨颗粒永久耦接至基板的方法,但在一方面中用有机基质使多个超研磨颗粒永久耦接至工具基板。 [0010] While the present invention contemplates that the various superabrasive particles permanently coupled to the substrate method, in one aspect the organic matrix with a plurality of superabrasive particles permanently coupled to the tool substrate. 有机基质材料的非限制性实例包括胺基树月旨、丙烯酸酯树脂、醇酸树脂、聚酯树脂、聚酰胺树脂、聚酰亚胺树脂、聚胺基甲酸酯树脂、酚醛树脂、酚系/乳胶树脂、环氧树脂、异氰酸酯树脂、异氰尿酸酯树脂、聚硅氧烷树脂、反应性乙烯基树脂、聚乙烯树脂、聚丙烯树脂、聚苯乙烯树脂、苯氧基树脂、茈树脂、聚砜树脂、丙烯腈-丁二烯-苯乙烯树脂、丙烯酸树脂、聚碳酸酯树酯及其组合。 Non-limiting examples of matrix materials include organic amine tree months purpose, acrylate resins, alkyd resins, polyester resins, polyamide resins, polyimide resins, polyurethane resins, phenol resins, phenol-based / latex resins, epoxy resins, isocyanate resins, isocyanurate resins, polysiloxane resins, reactive vinyl resins, polyethylene resins, polypropylene resins, polystyrene resins, phenoxy resins, perylene resins , polysulfone resin, an acrylonitrile - butadiene - styrene resins, acrylic resins, polycarbonate resins, and combinations thereof.

[0011] 本发明另外提供一种识别CMP垫修整器中的工作超研磨颗粒的系统。 [0011] The present invention further provides a system for identifying the CMP pad dresser working superabrasive particles. 该种系统可包括一指示基板及一具有多个超研磨颗粒的CMP垫修整器,其中该多个超研磨颗粒的一部分与该指示基板接触。 This kind of system may comprise a substrate and an indication of the plurality of superabrasive particles having a CMP pad conditioner, wherein the plurality of superabrasive particles in contact with a portion of the indicating substrate. 该系统可进一步包括由该多个超研磨颗粒的该部分切入该指示基板中所得的标记图案,其中该标记图案自该多个超研磨颗粒中识别多个工作超研磨颗粒。 The system may further comprise an indication of the resulting substrate by the marking pattern of the portion of the plurality of superabrasive particles of cut, wherein the marker pattern identification work plurality of superabrasive particles from the plurality of superabrasive particles.

[0012] 本发明亦提供一种识别CMP垫修整器中的工作超研磨颗粒的方法。 [0012] The present invention also provides a method of identifying the CMP pad dresser working methods superabrasive particles. 该种方法可包括将一悬置于一框架内的塑胶片压至一具有多个超研磨颗粒的CMP垫修整器上,以至于该多个超研磨颗粒的至少一部分使该塑胶片变形。 The method may comprise a plastic film suspended within a frame to a press having a plurality of superabrasive particles on the CMP pad conditioner, the plurality of superabrasive particles such that at least a portion of the plastic sheet so that the deformation. 随后可观测该变形的塑胶片以自该多个超研磨颗粒中识别多个工作超研磨颗粒。 It may then be observed to the deformable plastic sheet from the plurality of the plurality of superabrasive particles work of superabrasive particles identified. 在一些方面中,塑胶片可为至少半反射的以帮助识别该多个工作超研磨颗粒。 In some aspects, the plastic film may be at least semi-reflective work to help identify the plurality of superabrasive particles. [0013] 此外,本发明亦揭露一种能在研磨一抛光垫时识别且分级超研磨颗粒尖端高度的方法,其包含让最闻尖端闻于次闻尖端20微米以内。 [0013] Further, the present invention also discloses a method capable of classifying and identifying the height of the tip of superabrasive particles in a polishing pad during polishing, so that the most audible tip comprising heard in time tip smell within 20 microns. 在一方面,该方法可进一步包含识别超研磨颗粒总数如10%的最闻尖端闻于平均闻度尖端80微米之内的情况。 In one aspect, the method may further comprise identifying superabrasive particles such as 10% of the total number of the most heard in the case where the average tip smell audibility of the tip 80 microns. 在另一方面,该方法可进一步包含识别最闻尖端闻于次闻尖端15微米以内,且超研磨颗粒总数如10%的最闻尖端闻于平均闻度尖端70微米之内的情况。 In another aspect, the method may further include identifying the most sophisticated smell smell smell in the sub-tip 15 microns or less, and the total number of superabrasive particles such as 10% of the most heard in the case where the average tip smell audibility of the tip 70 microns. 在又一方面,该方法可进一步包含去除最高的超研磨颗粒以增加工作超研磨颗粒的数量。 In yet another aspect, the method may further include removing the highest superabrasive particles to increase the number of work superabrasive particles. 在另一方面,该方法可进一步包含使用超研磨颗粒尖端的高度与刮痕线的数据来评估品质或是作为给客户的凭证。 In another aspect, the method may further comprise using a data superabrasive particles and the height of the tip line to assess the quality of scratches or as vouchers to customers.

[0014] 如此已相当概括地描述了本发明的各种特征,以便可更好地理解以下实施方式,且可更好地了解本发明对此技术的贡献。 [0014] As has been outlined, rather broadly various features of the described invention, it may be better understood so that the following embodiments, and may be better understanding of the contribution of this art of the present invention. 根据本发明的以下实施方式、附图及权利要求书,本发明的其他特征将变得更清楚,或可通过实施本发明来了解。 According to the embodiment of the invention, the accompanying drawings and claims, other features of the present invention will become more apparent, or may be learned by practice of the present invention.

附图说明 BRIEF DESCRIPTION

[0015] 图1为根据本发明的一具体实例的定置于指示基板上的CMP垫修整器的横截面视图。 [0015] FIG. 1 is a cross-sectional view of a CMP pad disposed conditioner on the substrate in accordance with an indication given of a specific example of the present invention.

[0016] 图2为根据本发明的另一具体实例的在指示基板上的标记图案的影像。 [0016] Figure 2 is an image of the marking pattern on the substrate according to another embodiment of the present invention indicated.

[0017] 图3为根据本发明的又一具体实例的定置于指示基板上的CMP垫修整器的横截面视图。 [0017] FIG. 3 is a cross-sectional view of a CMP pad disposed conditioner on the substrate in accordance with an indication given to still another specific example of the present invention.

[0018] 应了解,上述各图仅用于说明性目的,以增进对本发明的理解。 [0018] It should be appreciated, the above figures are only for illustrative purposes to enhance the understanding of the present invention. 另外,所述附图可能并非按比例绘制,因此尺寸、粒度及其他方面可能会且一般被放大以使其图示更清楚。 Further, the drawings may not be drawn to scale, the size, and other aspects of the particle size may be enlarged and generally to make it clearer illustration. 因此,应了解,可能会且很可能会与图中所示的特定尺寸及方面有偏离。 Thus, it should be appreciated that the specific dimensions and aspects may be illustrated and likely to deviate from the figures.

具体实施方式 Detailed ways

[0019] 在揭示并描述本发明之前,应了解,本发明不限于本文揭示的特定结构、方法步骤或材料,而是可扩展至如可由所属领域的普通技术人员识别的其等效形式。 [0019] Before the present invention is disclosed and described, it should be understood that the invention is not limited to a particular structure disclosed herein, the method steps, or materials, but may be extended to as one of ordinary skill in the art recognize their equivalents. 亦应了解,本文中所使用的术语仅用于描述特定具体实例的目的,而不意欲具有限制性。 It should also be understood that the terminology used herein is for the purpose of describing particular specific example and is not intended to be limiting.

[0020] 必须指出,除非上下文中另外清楚地指定,否则如本说明书及权利要求书中所使用的单数形式“一(a,an)”及“该(the) ”包括多个指示物。 [0020] It must be noted, unless the context clearly dictates otherwise, as used in this specification and the appended singular forms used Requirements "(a, an)" and "the (The)" include plural referents. 因此,举例而言,提及“一超研磨颗粒(a superabrasiveparticle) ”可包括一或多个所述颗粒。 Thus, for example, reference to "a superabrasive particle (a superabrasiveparticle)" may include one or more of said particles.

[0021] 定义 [0021] defined

[0022] 在描述及主张本发明时,将根据下文所阐述的定义使用以下术语。 [0022] In describing and claiming the present invention, the following terminology will be used in accordance with the definitions set forth below.

[0023] 如本文中所使用,术语“大致上(substantially) ”是指某一作用、特征、性质、状态、结构、物品或结果的完全或接近完全的范围或程度。 [0023] As used herein, the term "substantially (Substantially)" refers to the complete or nearly complete extent or degree of a certain action, characteristic, property, state, structure, item, or result. 举例而言,“大致上”被封闭的物件将意谓该物件被完全封闭或接近完全地被封闭。 For example, "substantially" enclosed object will be completely enclosed or nearly completely enclosed meant the object. 与绝对完全性的确切可容许的偏差度可在一些情况下视特定情形而定。 Depending on the particular case may be, in some cases the exact degree of deviation from absolute completeness may be permitted. 然而,一般而言,完成的接近度所具有的总结果,与达到绝对及完全的完成时是相同的。 However, in general, it has completed the proximity of overall results, and achieve absolute and full completion of the same.

[0024] 当用于否定含义时,“大致上”的使用同样适用于指完全或接近完全地缺乏某一作用、特征、性质、状态、结构、物品或结果。 [0024] When used in a negative connotation, using the "substantially" is equally applicable to refer to complete or near complete lack of a certain action, characteristic, property, state, structure, item, or result. 举例而言,“大致上不含(substantially freeof)”颗粒的组成物将完全无颗粒,或非常接近完全地无颗粒以致效果与完全无颗粒时相同。 For example, "substantially free of (substantially freeof)" composition will be completely free of particulate particles, or very nearly completely free of particles so that the same effect when the particle completely. 换言之,“大致上不含”某一成份或元素的组成物实际上仍可含有该物品,只要其不存在可量测的影响即可。 In other words, "substantially free" of a composition of a component or element may still actually contain the article, can affect the measurement can be as long as it does not exist.

[0025] 如本文中所使用,“工作超研磨颗粒(working superabrasiveparticle) ”为在修整或调节程序期间接触CMP垫的超研磨颗粒。 [0025] As used herein, "superabrasive particles work (working superabrasiveparticle)" is adjusted during the procedure or in the dressing in contact with superabrasive particles CMP pad. 此接触可自表面移除碎屑,其可使表面造成弹性或塑性变形,或其可切割表面以产生凹槽。 This contacting may remove debris from the surface, which can cause an elastic or plastic deformation, or a grooved surface to create a cutting surface. 在一特定方面中,在修整程序期间工作超研磨颗粒可切入CMP垫中,且其深度超过约10微米。 In a particular aspect, the working procedure during dressing superabrasive particles in a CMP pad may be cut, and the depth of more than about 10 microns.

[0026] 如本文中所使用,“非工作超研磨颗粒(non-working superabrasiveparticle)”为CMP垫修整器中不会明显地触及衬垫而不足以自表面移除碎屑、使表面变形、自表面切出凹槽的超研磨颗粒。 [0026] As used herein, "non-working superabrasive particles (non-working superabrasiveparticle)" is a CMP pad conditioner does not reach the cushion and clearly insufficient to remove debris from the surface, the surface deforms from surface cut out groove superabrasive particles.

[0027] 如本文中所使用,“过度侵蚀性超研磨颗粒(overly-aggressive superabrasiveparticle) ”为CMP垫修整器中会侵蚀性修整或调节CMP垫的超研磨颗粒。 [0027] As used herein, "excessive erosion of superabrasive particles (overly-aggressive superabrasiveparticle)" is a CMP pad conditioner will trim or adjust the erosion superabrasive particles in a CMP pad. 在一方面中,侵蚀性超研磨颗粒为在修整程序期间切入CMP垫中深度超过约50微米的超研磨颗粒。 In one aspect, the superabrasive particles to erosion cut superabrasive particles more than about 50 microns depth of CMP pad dressing during application. 在另一方面中,侵蚀性超研磨颗粒可自CMP垫移除至少1/5的材料。 In another aspect, the superabrasive particles may be erosive CMP pad removing material from at least 1/5. 在又一方面中,侵蚀性超研磨颗粒可自CMP垫移除至少1/2的材料。 In yet another aspect, aggressive superabrasive particles can be removed from the CMP pad material is at least 1/2.

[0028] 如本文中所使用,“指示基板(indicator substrate) ”是指上面可定置CMP垫修整器的超研磨颗粒的一部分且可移动以产生指示工作超研磨颗粒的标记的基板材料。 [0028] As used herein, "indicating substrate (indicator substrate)" refers to a set-top may be movable portion and CMP pad dresser superabrasive particles to generate indicating work superabrasive particle labeled substrate material.

[0029] 如本文中所使用,“标记图案(marking pattern) ”是指通过移动超研磨颗粒经过指示基板而在指示基板上产生的图案。 [0029] As used herein, "marker pattern (marking pattern)" refers to the pattern of the substrate through the indication on the indicator generated by moving the substrate superabrasive particles. 该标记可为已知的任何可侦测标记,包括切口、刮痕、凹陷、材料沉积(例如颜料标记物、化学标记物、萤光标记物、放射性标记物等)。 The marker can be any detectable label known, it comprises a cut, scratches, dents, material deposition (e.g., pigment markers, chemical markers, fluorescent markers, radioactive markers, etc.).

[0030] 如本文中所使用,“横向(transverse)”是指与参考轴交叉的方向定位。 [0030] As used herein, "lateral (Transverse)" refers to the location and direction of the reference axis intersects. 在一方面中,“横向”可包括相对于参考轴至少呈大致上直角的方向定位。 In one aspect, the "transverse" with respect to the reference axis may comprise at least substantially form a right angle direction positioning.

[0031] 如本文中所使用,“校正定位方向(alignment orientation direction) ”是指多个超研磨颗粒的对准轴的方向。 [0031] As used herein, "the correctional direction (alignment orientation direction)" refers to a direction aligned with the plurality of superabrasive particles shaft. 举例而言,以格网形式对准的多个超研磨颗粒将具有至少两个对准轴:行方向上的对准轴及与行方向呈90°定位的列方向上的对准轴。 For example, a plurality of superabrasive particles aligned to form a grid having at least two alignment axes: the axis alignment axis aligned in the row direction and positioned at 90 ° to the row direction and the column direction.

[0032] 如本文中所使用,“除去(ablate或ablating) ”是指自CMP垫修整器移除超研磨颗粒或减少超研磨颗粒的突出,从而降低超研磨颗粒与指示基板之间的接触程度的方法。 [0032] As used herein, a "remove (ablate or ablating)" refers to the removal from the CMP pad conditioner superabrasive grit or reduce superabrasive particle protrudes, thereby reducing the degree of contact between the superabrasive particles and the substrate indication Methods.

[0033] 如本文中所使用超研磨区段(superabrasive segment) ”是指一种工具主体,其具有多个与其结合的超研磨颗粒。在一些方面中,超研磨区段可包括如切割元件的超研磨多晶材料。 [0033] The superabrasive segment (superabrasive segment) As used herein, "refers to a tool body having a plurality of superabrasive particles bonded thereto. In some aspects, the superabrasive section may include a cutting element as superabrasive polycrystalline material.

[0034] 如本文中所使用,“工具基板(tool substrate) ”是为垫调节器的一部分并支撑研磨材料,且研磨材料及/或载运研磨材料的超研磨区段可固定于其上。 [0034] As used herein, "tool substrate (tool substrate)" is part of the regulator and supports the abrasive pad, and the abrasive and / or superabrasive abrasive material carrying section may be fixed thereto. 适用于本发明的基板可具有各种形状、厚度、或材料,其能够以足以提供适用于预期目的的垫调节器的方式支撑研磨材料。 A substrate suitable for the present invention may have various shapes, thickness, or material, which can be sufficient to provide a cushion suitable for the intended purpose of the regulator supported abrasive material. 基板可为固体材料、在加工时变成固体的粉末材料、或可挠性材料。 The substrate may be a solid material into a solid powder material during processing, or flexible material. 典型基板材料的实例包括(但不限于)金属、金属合金、陶瓷、相对硬的聚合物或其他有机材料、玻璃,及其混合物。 Examples of typical substrate materials include (but are not limited to) metal, metal alloys, ceramics, a relatively stiff polymer or other organic materials, glass, and mixtures thereof. 另外,基板可包括有助于使研磨材料附着于基板上的材料,包括(但不限于)硬焊合金材料、烧结助剂及其类似物。 Further, the substrate may comprise an abrasive material adhered to contribute to material on the substrate, including (but not limited to) an alloy brazing material, a sintering aid and the like.

[0035] 如本文中所使用,“超研磨(superabrasive) ”可用于指任何结晶或多晶材料,或所述材料的混合物,其具有约8或8以上的莫氏硬度(Mohr' s hardness)。 [0035] As used herein, a "superabrasive (superabrasive)" may be used to refer to, mixtures of any of the crystalline or polycrystalline material, or material having more than 8 or about 8 Mohs hardness (Mohr 's hardness) . 在一些方面中,莫氏硬度可为约9. 5或9. 5以上。 In some aspects, the Mohs hardness of about 9.5 or 9.5 above. 所述材料包括(但不限于)钻石、多晶钻石(PCD)、立方氮化硼(cBN)、多晶立方氮化硼(PcBN)、刚玉及蓝宝石,以及本领域技术人员已知的其他超硬材料。 Such materials include (but are not limited to) the diamond, polycrystalline diamond (the PCD), cubic boron nitride (the cBN), polycrystalline cubic boron nitride (PcBN), corundum and sapphire, and other ultra-known to the skilled person hard material. 超研磨材料可以各种形式并入本发明中,包括颗粒、粗砂、膜、层、片、区段等等。 Superabrasive material may be incorporated into the present invention in various forms including particles, grit, films, layers, sheets, sections and the like. 在一些情况下,超研磨材料呈多晶超研磨材料的形式,诸如PCD及PcBN材料。 In some cases, the superabrasive material is in the form of a polycrystalline superabrasive material, such as PCD and PcBN material.

[0036] 如本文中所使用,“有机基质(organic matrix)”或“有机材料(organi cmater ia I) ”是指有机化合物的半固体或固体复合物或混合物。 [0036] As used herein, "organic matrix (organic matrix)" or "organic material (organi cmater ia I)" refers to organic compounds a semisolid or solid complex or mixtures thereof. 因而,“有机材料层(organic material layer) ” 与“有机材料基质(organicmaterial matrix) ”可互换使用,且意指一层或一块有机化合物的半固体或固体复合非晶形混合物,包括树脂、聚合物、胶状物等等。 Thus, "the organic material layer (organic material layer)" and "Organic material matrix (organicmaterial matrix)" are used interchangeably and mean one or more organic compounds a semisolid or solid complex amorphous mixture, including resin, polymerized was gum and the like. 较佳地,有机材料为由一或多种单体的聚合反应所形成的聚合物或共聚物。 Preferably, the organic material is a polymer or copolymer of one or more monomers polymerization is formed. 在一些情况下,该有机材料可为粘着剂。 In some cases, the organic material may be an adhesive.

[0037] 如本文中所使用,假如给定值可“稍微高于”或“稍微低于”端点,则使用术语“约(about) ”来提供关于数值范围端点的灵活性。 [0037] As used herein, if a given value may be "a little above" or "a little below" the endpoint, the term "about (About)" to provide flexibility with respect to a numerical range endpoint.

[0038] 如本文中所使用,为方便起见,可将多个物品、结构元件、组成元件及/或材料呈现于共同清单中。 [0038] As used herein, for convenience, a plurality of items, structural elements, compositional elements, and / or materials present in the common list. 然而,这些清单应被理解为好似该清单的每一成员经个别识别为个别及唯一的成员。 However, these lists should be understood as if each member of the list by an individual identified as a separate and unique member. 因此,若无相反指示,则该清单中的个别成员均不应仅仅基于其在共同组中的呈现而理解为同一清单中的任何其他成员的实际等效形式。 Therefore, the absence of indications to the contrary, the list of individual members should not be solely based on their presentation and are understood to be any real equivalent in the form of other members of the same list in a common group.

[0039] 浓度、量及其他数值数据在本文中可以范围格式表示或呈现。 [0039] Concentrations, amounts, and other numerical data may be expressed or presented in a range format herein. 应了解,该种范围格式仅为方便及简单起见而使用,且因此应灵活地解释为不但包括明确在该范围界限内所列的数值,而且包括涵盖于彼范围内的所有个别数值或子范围,就如同明确列出每一数值及子范围般。 It should be appreciated, this kind of range format is merely for convenience and simplicity to use, and thus should be interpreted flexibly to include not only the numerical values ​​explicitly listed within the limits of the range, but also to include all the individual numerical values ​​or sub-ranges encompassed within the scope Consists , just as explicitly list each value and sub-range like. 举例而言,“约I至约5 (about I to about 5) ”的数值范围应解释为不但包括约I至约5的明确所列值,而且包括所指范围内的个别值及子范围。 For example, "about I to about 5 (about I to about 5)" numerical range should be interpreted to include not only the explicitly listed value from about I to about 5, but also include individual values ​​and sub-ranges within the indicated range. 因此,在此数值范围内包括诸如2、3及4的个别值以及诸如I至3、2至4及3至5等的子范围,以及个别的1、 Thus, in this numerical range include individual values ​​such as 2, 3 and 4 and sub-ranges such as I to 3,2 to 4 and 3 to 5 and the like, as well as an individual,

2、3、4及5。 3, 4 and 5. 所述的此原理同样适用于仅列出一个数值(如最小值或最大值)的范围。 According to this principle also applies to the lists only a value (e.g., minimum or maximum) range. 此夕卜,该种解释应不管范围的宽度或所描述的特征如何而均适用。 Bu this evening, the explanations shall width or characteristic described regardless of how the range apply.

[0040] 本发明 [0040] The present invention

[0041] 本发明使用一种CMP垫修整器来修整或调节CMP垫,通过移除污垢及碎屑以及在垫表面中产生粗糙度等修整程序,以便于研磨程序期间,该垫表面能够确实与化学浆料相互配合作用。 [0041] The present invention uses a CMP pad conditioner for CMP pad dressing or adjustment, and by removing the dirt and debris produced in the roughness of the pad surface conditioning procedures in order during the milling process, the surface of the pad can be surely and chemical pulp cooperating with each other. 由于超研磨颗粒不易被磨平,因此在CMP垫修整器中仅定置较小百分比的超研磨颗粒以便刺入或切入CMP垫中。 Since the superabrasive particles can not easily be polished, in CMP pad conditioner so only a small percentage of the set-superabrasive particles in order to puncturing or cutting of the CMP pad. 当此较小百分比的超研磨颗粒变得磨损后,则CMP垫的塑性变形量变得较CMP垫被切割的量为大。 When this small percentage of the superabrasive particles become worn, the amount of plastic deformation CMP pad CMP pad becomes relatively large amount of cut. 因此,该垫高度变形并累积污垢,并导致CMP垫的研磨率降低,且晶片或工件的刮痕率增加。 Thus, the highly deformable pad and dirt accumulate and lead to reduced polishing rate of the CMP pad and increases the scratches of the wafer or workpiece.

[0042] 发明人已发现了用以识别可包括非工作、工作、及过度侵蚀性超研磨颗粒的数目及位置的CMP垫修整器的切割特征的新技术。 [0042] The inventors have found a new technique for identifying may include a non-operating, position and number of the CMP operation, and excessive erosion of the superabrasive particle pad dresser cutting characteristics. 根据该种特征,可测定CMP垫修整器的切割效率。 According to this kind of feature, cutting efficiency can be measured CMP pad dresser. 可对已使用及未使用的CMP垫修整器执行该技术。 This technique can be performed on the CMP pad dresser used and unused.

[0043] CMP垫通常由软质的聚合物(诸如聚胺基甲酸酯)制成。 [0043] CMP pads are typically made of a soft polymer (such as polyurethane). 由于CMP垫与CMP垫修整器相互啮合,因此聚合物材料首先经弹性应变变形,随后经塑性应变变形。 Since the CMP pad and a CMP pad dresser mesh with each other, so that the polymer material is first deformed by elastic strain, plastic strain deformation subsequently. 最终,经变形的材料中的应变能超过键能密度(亦即该垫的硬度)且聚合物材料断裂。 Finally, the deformable material by the strain energy density than bond energy (i.e., the hardness of the pad) and the polymer material breaks. 因此,超研磨颗粒在CMP垫修整器中的功能为经由此变形过程通过破坏聚合物的键结来修整CMP垫材料。 Thus, the pad functions superabrasive particles in a CMP pad dresser is deformed through this process ends CMP pad conditioning material to bond by destruction of the polymer. 应注意到尖锐的超研磨颗粒尖端可刺入CMP垫材料而不会导致过度变形。 It is noted that the sharp tip of the superabrasive particles can pierce the CMP pad material without causing excessive deformation. 因而,超研磨颗粒的尖锐度可定义为与断裂之前的变形体积成反比。 Accordingly, the sharpness of superabrasive particles may be defined as the volume is inversely proportional to deformation before fracture. 换言之,在切割之前变形体积越小,切割尖端越尖。 In other words, the smaller the volume of deformation before the cutting, the tip of the cutting tip. 此变形信息可用来测定CMP垫修整器中超研磨颗粒的尖锐度。 This modification information is used to determine the sharpness of the super abrasive particles dresser CMP pad. [0044] 另外,尖端具有较小尖端半径的超研磨颗粒(诸如具有破角的情况)可比尖端半径较大的超研磨颗粒以较少变形更干净俐落地切入CMP垫中。 [0044] Further, the tip superabrasive particles (such as the case of having broken corners) having a smaller tip radius larger than the tip radius of superabrasive particles with a small modification cleaner cut cleanly CMP pad. 因此,不规则形状的超研磨颗粒尖端可比具有相对于CMP垫为钝角的自形超研磨角更尖锐。 Thus, the tip of superabrasive particles having an irregular shape CMP pad than an obtuse angle from the sharper shaped superabrasive respect. 此亦适用于超研磨颗粒角相比于超研磨颗粒面之间的差异。 Also goes superabrasive particles suitable angle as compared to the differences between the superabrasive particles surface.

[0045] 因此,注意到,尖锐的超研磨颗粒尖端可以较小变形及材料应变来切割CMP垫材料。 [0045] Thus, it is noted sharp tip superabrasive particles smaller deformation and material strain can be cut CMP pad material. 相反地,钝的超研磨颗粒可变形而非切割CMP垫材料,因为应变能并未超过聚合材料的键能密度。 Rather, the superabrasive particles may be blunt rather than cut CMP pad deformable material, since the bond energy does not exceed the strain energy density of the polymeric material. 由于所述颗粒的尖端磨损,因此聚合材料与颗粒之间的接触面积增加。 Since the tip of the wear particles, thus increasing the contact area between the particles and the polymeric material. 此接触面积的增加导致垫的变形体积增加。 This increased contact area leads to an increase deformation volume of the pad. 由于随该变形体积的增加,聚合材料断裂需要的应变能增加,因此在CMP方法期间切割聚合材料的超研磨颗粒的数目将相对于钝化程度而减少。 Since this deformation increases with the volume, it requires polymeric material strain fracture energy increases, and therefore the number of superabrasive particle will reduce the polymeric material with respect to the degree of rounding cutting during the CMP process.

[0046] CMP垫修整程序亦可受CMP垫修整器中工作超研磨颗粒的比例及过度侵蚀性切割超研磨颗粒的比例的影响。 [0046] CMP pad conditioning procedures may be affected in the CMP pad dresser working superabrasive particles and the proportion of excessive erosion cleavage superabrasive particle scale. 举例而言,典型CMP垫修整器可具有大于10,000个超研磨颗粒。 For example, a typical CMP pad dresser may have greater than 10,000 superabrasive particles. 在这些10,000个颗粒中,在一些情况下可仅有约100个实际能切割CMP垫的工作超研磨颗粒。 10,000 of these particles, and in some cases may be only about 100 actual CMP pad can cut the work superabrasive particles. 另外,在100个工作超研磨颗粒中,可能存在大约10个过度侵蚀性超研磨颗粒,其在调节期间切割超过所使用的整个垫的50%,且在一些情况下可移除总垫材料的25%以上。 Further, in the work of superabrasive particles 100, there may be excessive erosion of about 10 superabrasive particles, which is used throughout the cutting pad than 50% during the adjustment, and in some cases the overall pad material may be removed more than 25%. 此不均匀的工作负荷分布可导致不稳定的CMP性能,且可导致CMP垫过度消耗、可刮伤晶片的过度侵蚀性超研磨颗粒碎裂、晶片移除率不可预测、晶片表面平坦化不均匀、CMP垫修整器寿命缩短、CMP垫与碎屑压紧,及其类似情况。 This uneven distribution of the workload can result in an unstable performance of CMP, and the CMP pad may result in excessive consumption can be excessive erosion of superabrasive particles broken, scratched wafer wafer removal rate unpredictable, uneven wafer surface planarized , shorten the life of the CMP pad conditioner, the CMP pad debris and pressing, and the like.

[0047] 因此,提供一种识别CMP垫修整器中的过度侵蚀性超研磨颗粒的方法。 [0047] Thus, excessive erosion of the superabrasive particles a method of identifying the CMP pad conditioner. 该方法可包括将具有多个超研磨颗粒的CMP垫修整器定置于指示基板上,以使CMP垫修整器的多个超研磨颗粒的至少一部分接触指示基板,及在第一方向上移动CMP垫修整器经过指示基板以使多个超研磨颗粒的该部分在基板上产生第一标记图案。 Contacting at least a portion of the substrate indicates the method may comprise CMP pad dresser having a plurality of superabrasive particles placed on the indication given substrate to CMP pad dresser of the plurality of superabrasive particles, and moved in a first direction CMP pad after the dresser indicates the portion of the substrate such that the plurality of superabrasive particles generating a first mark pattern on the substrate. 因而,第一标记图案自多个超研磨颗粒中识别多个工作超研磨颗粒。 Thus, a plurality of first marker pattern recognition work of superabrasive particles from the plurality of superabrasive particles.

[0048] 传统的超研磨颗粒尖端整平法典型地自CMP垫修整器的背面量测所述尖端的高度。 [0048] The conventional superabrasive particles typically tip leveling off from the back surface of the CMP pad dresser of sensing the amount of the height of the tip. 由于CMP垫修整器基板的厚度变化及在制造过程中出现的变化,该量测可能不提供超研磨颗粒尖端相对于CMP垫的水平度的精确估计。 Since the substrate thickness variation conditioner and variations occurring in the manufacturing process of the CMP pad, the measuring superabrasive particles may not provide an accurate estimate of the tip with respect to the level of a CMP pad. 另外,在修整期间CMP垫修整器可能不与CMP垫的表面精确平行。 Further, during the touch-up CMP pad dresser may not be exactly parallel to the surface of the CMP pad. 因此,在超研磨颗粒的尖端处量测的尖端高度变化可以提供更精确的切割特征。 Thus, the amount of change in tip height over the tip of the abrasive particles may provide a more accurate measurement of the cut characteristics.

[0049] 因此,可以固定负荷将CMP垫修整器压在指示基板上,且加以移动经过该基板以产生切割图案。 [0049] Thus, the load can be fixed CMP pad dresser is pressed against the indicated substrate and to be moved through the substrate to produce a cutting pattern. 因此,与指示基板接触的超研磨颗粒将偏斜,随后按与其尖端高度、尖锐度等的比例刺入该基板。 Thus, the superabrasive particles in contact with the substrate indicates the skew, then its tip in proportion to the height, sharpness and the like piercing the substrate. 如图1中所示,举例而言,以固定负荷将CMP垫修整器12压于指示基板14中。 As shown in FIG. 1, for example, a fixed load of CMP pad dresser 12 is pressed against the substrate 14 to the instruction. 过度侵蚀性超研磨颗粒16刺入指示基板14最深,接着为工作超研磨颗粒18,其与过度侵蚀性超研磨颗粒相比刺入程度较小。 Excessive erosion of the superabrasive particles 16 pierce deepest indicating substrate 14, followed by the work of superabrasive particles 18, as compared with the superabrasive particles excessive erosion of penetration to a lesser extent. 非工作超研磨颗粒20经展示未明显刺入指不基板14。 Inoperative superabrasive particles 20 by the puncturing means not explicitly show the substrate 14 is not.

[0050] 随后可移动CMP垫修整器经过指示基板的表面以产生如图2中所示的刮痕图案。 [0050] The CMP pad may then be moved through the conditioner to produce a surface of the substrate indicated scratch pattern shown in FIG. 2. 超研磨颗粒刮擦指示基板的程度将与颗粒的突出及尖锐度相关。 Superabrasive particles indicates the degree of scratching the substrate associated with the particles protruding and sharpness. 移动方向可为任何方向,但在一些方面中,在与多个超研磨颗粒的校正定位不一致的方向上移动CMP垫修整器可能有益。 Movement direction may be any direction, but in some aspects, the movement is inconsistent with the plurality of superabrasive particles in the correctional direction CMP pad dresser may be beneficial. 换言之,若CMP垫修整器具有以格网形式定位的超研磨颗粒,则CMP垫修整器不应在与超研磨颗粒格网对准的方向上被移动经过指示基板。 In other words, if the CMP pad dresser having superabrasive particles positioned in a grid form, the CMP pad conditioner is not to be moved past the substrate in a direction indicated superabrasive particle alignment grid. 此是因为许多超研磨颗粒将沿指示基板上的相同凹槽图案对准,且将极难分辨哪些或甚至多少超研磨颗粒接触指示基板以产生刮痕图案。 This is because many of the superabrasive particles are aligned in the same groove pattern on the substrate indicates, and extremely difficult to identify which and how many contact instruction superabrasive particles to the substrate even scratches pattern.

[0051] 在一方面中,可在第二方向上移动CMP垫修整器经过指示基板,以使多个超研磨颗粒的该部分产生第二标记图案。 [0051] In one aspect, it is movable in a second direction through the CMP pad conditioner indication substrate, so that the portion of the plurality of superabrasive particles generating a second marker pattern. 第二方向应大致上处于第一方向的横向。 It should be in the second direction substantially transverse to the first direction. 意欲将处于参考方向横向的方向定义为与参考方向交叉的任何方向。 It is intended to refer to the direction transverse to the direction defined as any direction intersecting the reference direction. 因此,交叉地可包括与参考方向交叉的任何方向。 Thus, it may comprise any crosswise direction intersecting with the reference direction. 在一方面中,横向可为垂直于。 In one aspect, transversely to the vertical. 在另一方面中,横向可为关于参考方向在 In another aspect, the transverse direction may be the reference for the on

O。 O. 与90。 90. 之间的任何角度。 Any angle between. 非限制性实例可包括10°、30。 Non-limiting examples include 10 °, 30. 、45。 45. 、60。 60. 及其类似角度。 And similar angle. 在其他信息内容中,第二标记图案与第一标记图案相比可提供多个工作超研磨颗粒的定位信息。 In other information content, the second marker pattern may be compared with the first pattern marking provide positioning information in a plurality of superabrasive particles work. 因此举例而言,在第一方向上比在第二方向上切割出较宽线的超研磨颗粒可能在第一方向上以边缘或面切割而在第二方向上以尖端切割。 Thus for example, while in a second direction to the cutting tip than a superabrasive particle wider cut line in the second direction or may face in the cutting edge in the first direction in a first direction. 如图2中可见,刮痕线改变方向的点显不CMP垫修整器方向自第一方向改变至第二方向。 2 seen in the direction of the scratch line changing point CMP pad conditioner does not significantly change the direction from the first direction to a second direction. 亦应注意,如同第一方向,第二方向与多个超研磨颗粒的校正定位不一致可能为有益的。 Should also be noted, as in the first direction, the second direction and a plurality of superabrasive particles positioned correcting inconsistencies may be beneficial.

[0052] 可涵盖各种指示基板材料,且应注意到能够根据本发明的方面起作用的任何材料应视为属于本发明范畴。 [0052] The various instructions may encompass the substrate material, and shall be deemed to be noted that the present invention can be any material aspect of the scope of the present invention to function. 非限制性实例可包括诸如塑胶或其他聚合物、蜡、结晶材料、陶瓷及其类似物的材料。 Non-limiting examples include materials such as plastic or other polymers, waxes, crystalline materials, ceramics and the like. 聚合物所构成的指示基板的一特定实例为聚对苯二甲酸乙二醇酯(PET)透明片。 Indicating a particular example the substrate is a polymer composed of polyethylene terephthalate (PET) transparent sheet. 亦可预期压敏性电子显示器亦可用作根据本发明的方面的指示基板。 Expected electronic display may also be used as a pressure-sensitive aspects of the invention according to an instruction of the substrate.

[0053] 在一方面中,指示基板可包括指示标记物,其在使修整器移动经过基板时在刮擦指示基板的超研磨颗粒上产生标记。 [0053] In one aspect, the substrate may include an indication indicating a marker, which produces marking on moving indication that the dresser substrate when the substrate passes the scraper superabrasive particles. 此可使CMP垫修整器上的工作及/或过度侵蚀性超研磨颗粒更易于识别。 This can work on a CMP pad conditioner and / or excessive erosion of the superabrasive particles more easily identified. 可涵盖各种指示标记物,包括(但不限于)颜料及墨水标记物、萤光标记物、化学标记物、放射性标记物,及其类似物。 It may encompass various instructions markers, including (but not limited to) a pigment and ink markers, fluorescent labels, chemiluminescent labels, radioactive labels, and the like. 举例而言,可使用现有印表机将颜料印刷于PET透明片的表面上。 For example, the printer may use conventional pigment printed on the surface of a transparent PET sheet. 刮擦透明片的经颜料涂覆的表面的超研磨颗粒被颜料标记,因此可易于在CMP垫修整器的表面上识别出。 Superabrasive particles coated pigment surface by wiping sheet is transparent pigment marker therefore may be easily identified on the surface of the CMP pad dresser.

[0054] 在另一方面中,本发明另外提供一种增加工作超研磨颗粒在CMP垫修整器中的比例的方法。 [0054] In another aspect, the present invention further provides a method of increasing the working ratio of superabrasive particles in a CMP pad dresser of the pad. 该方法可包括将具有多个超研磨颗粒的CMP垫修整器定置于指示基板上,以使CMP垫修整器的多个超研磨颗粒的至少一部分接触指示基板,及在第一方向上移动CMP垫修整器经过指示基板以使多个超研磨颗粒的该部分在基板上产生第一标记图案。 Contacting at least a portion of the substrate indicates the method may comprise CMP pad dresser having a plurality of superabrasive particles placed on the indication given substrate to CMP pad dresser of the plurality of superabrasive particles, and moved in a first direction CMP pad after the dresser indicates the portion of the substrate such that the plurality of superabrasive particles generating a first mark pattern on the substrate. 如已讨论,第一标记图案自多个超研磨颗粒中识别多个工作超研磨颗粒。 As already discussed, the first marker pattern recognition work plurality of superabrasive particles from the plurality of superabrasive particles. 该方法亦可包括自多个工作超研磨颗粒中识别多个过度侵蚀性超研磨颗粒。 The method may also include identifying a plurality of superabrasive particles excessive erosion from a plurality of work of superabrasive particles. 该识别可易于经由检查标记图案的刮擦图案特征而实现。 This can be readily identified by inspection pattern features scratch mark pattern is achieved. 其次,该方法可包括除去多个过度侵蚀性超研磨颗粒的至少一部分以增加工作超研磨颗粒在CMP垫修整器中的比例。 Secondly, the method may include working to increase the proportion of at least a portion of the superabrasive particles in a CMP pad dresser of removing excessive erosion of the plurality of superabrasive particles.

[0055] 如图3中所示,自CMP垫修整器24中除去过度侵蚀性超研磨颗粒22的效果可用来增加工作超研磨颗粒26的数目及这些超研磨颗粒可刺入指示基板28的深度(与图1相比)。 Depth [0055] As shown in FIG. 3, since the CMP pad dresser 24 for removing excessive erosion effect superabrasive particles 22 may be used to increase the number of work of superabrasive particles 26 and the superabrasive particles can pierce the substrate 28 indicated (as compared to FIG. 1). 通过除去具有最高突出的超研磨颗粒,亦即过度侵蚀性超研磨颗粒22,可使较大比例的工作超研磨颗粒26与指示基板28接触,且因此较大数目的超研磨颗粒能够在修整操作期间调节CMP垫。 By removing the highest protruding superabrasive grit, i.e., excessive erosion of superabrasive particles 22, make contact with a larger proportion of the work of superabrasive particles 26 and substrate 28 indication, and thus a greater number superabrasive particles can be in the trimming operation CMP pad adjustment period.

[0056] 可通过各种技术进行除去超研磨颗粒,且能够选择性除去此类颗粒的任何技术应视为属于本发明范畴。 [0056] may be removed by various techniques superabrasive particles, and any technique capable of selectively removing such particles be considered as belonging to the scope of the invention. 举例而言,摆针或其他结构可用来除去特定超研磨颗粒。 For example, put a needle or other structures may be used to remove specific superabrasive particles. 诸如钻石的超研磨颗粒倾向于为脆性的,且因此使用该技术将破裂。 Such as diamond superabrasive particles tend to be brittle, and therefore the use of this technology will be broken. 类似地可使用激光来除去超研磨颗粒。 Similarly, a laser may be used to remove the superabrasive particles. 又,利用热塑性树脂作为支撑基质的CMP垫修整器可围绕超研磨颗粒被局部加热,且该颗粒会自该基质脱离。 Further, as the thermoplastic resin support matrix CMP pad dresser may be locally heated around the superabrasive particles, and the particles will be disengaged from the matrix. [0057] 然而,注意在CMP垫修整器中存在非工作超研磨颗粒30。 [0057] However, note that the presence of non-operation of superabrasive particles 30 in the CMP pad dresser. 在一些方面中,调节CMP垫可通过使所有多个超研磨颗粒中的一定比例为无效的而改进。 In some aspects, the CMP pad may be adjusted invalid improved by a certain percentage of all the plurality of superabrasive particles. 此状况在移动浆料的工作晶体与排出污垢及碎屑的工作晶体之间提供空间。 This situation provides a space between the working movement of the crystal slurry and the discharge of dirt and debris up of the crystal. 因此,有益情况可为增加CMP垫修整器中工作超研磨颗粒的数目,同时仍留下一定比例的非工作超研磨颗粒以允许浆料、污垢及碎屑移动。 Thus, the case may be advantageous to increase the number of CMP pad dresser working superabrasive particles, while still leave a certain proportion of non-operation to allow the slurry to superabrasive particles, dirt and debris to move.

[0058] 亦可通过除去程序来延长CMP垫修整器的寿命。 [0058] also to extend the life of the CMP pad conditioner by removing procedures. 因为大多个过度侵蚀性切割超研磨颗粒为CMP垫修整器中的超研磨颗粒的总数目的少数,且因为侵蚀性及过度侵蚀性切割倾向于更快速钝化颗粒,所以效率降低的修整器实际上可似乎为未经使用或稍经使用的工具。 Because excessive erosion of large multiple super abrasive particles to cut the total number of minority CMP pad dresser of super abrasive particles and because of erosion and excessive erosion of cutting tend to be more rapid passivation particles, so reducing the efficiency of the dresser in fact It may appear to be unused or little used by the tool. 此是因为超研磨颗粒(包括非过度侵蚀性颗粒)上的磨损可能并非显而易见。 This is because the wear on the super abrasive particles (including non-excessive erosion particles) may not be obvious. 通过在指示基板上产生CMP垫修整器的标记图案,可识别目前钝化的过度侵蚀性颗粒或过度侵蚀性颗粒。 CMP pad conditioner by generating on board mark indicating a pattern, excessive erosion particles may identify current or excessive erosion passivated particles. 除去这些钝化超研磨颗粒使得迄今更尖锐的工作超研磨颗粒与CMP垫更有效地相互作用,因此延长寿命或“再调节”该修整器。 These particles are removed such that the passivation superabrasive work so far sharper superabrasive particles more effectively interact with the CMP pad, thus prolonging the life or "reconditioning" of the dresser.

[0059] 在除去所有或一些过度侵蚀性超研磨颗粒之后,可通过遵循上述程序再次产生修整轮廓。 [0059] After removal of all or some of the excessive erosion superabrasive particles, can be produced by following the above procedure again trimmed contour. 举例而言,在一方面中,可将CMP垫修整器定置于下一指示基板上以使CMP垫修整器的多个超研磨颗粒的至少一部分接触该下一指示基板,及可在第一方向上移动CMP垫修整器经过下一指示基板以使多个超研磨颗粒的该部分在基板上产生后生标记图案。 Contacting at least a portion of the example, in one aspect, the CMP pad dresser may be placed on a given substrate to the next indication that the CMP pad conditioner plurality of superabrasive particles to the substrate indicates the next, and the first party may CMP pad conditioner is moved upward through the substrate to the next indication that the plurality of superabrasive particles produced in the portion of epigenetic mark pattern on the substrate. 如同先前方面一样,后生标记图案自多个超研磨颗粒中识别随后的多个工作超研磨颗粒。 As with the previous aspects, like the subsequent pattern recognition epigenetic marking work plurality of superabrasive particles from the plurality of superabrasive particles. 亦应注意,在一些方面中,可使用先前的指示基板而非使用下一指示基板来比较先前超研磨颗粒组态与随后的超研磨颗粒组态的切割图案。 It should also be noted, in some aspects, the substrate may be used instead of using the previous indication indicating a next substrate to compare the previous configuration and superabrasive particles superabrasive particles subsequent cutting pattern configuration. 另外,可使用独立指示基板通过比较刮擦图案来进行该比较。 Further, the substrate may be used independently to indicate the comparison performed by comparing the pattern of scraping. 举例而言,可使两个PET透明片相互平行对准以便可比较两个标记图案。 For example, PET can two transparent sheets aligned parallel to each other so as to be compare two mark patterns.

[0060] 在许多类型的CMP垫修整器下可使用根据本发明的各种方面的技术。 [0060] In many types of CMP pad conditioner may use various aspects of the techniques of the present invention. 举例而言,在一方面中,超研磨颗粒可为单晶超研磨颗粒,诸如天然或合成钻石、立方氮化硼及其类似物。 For example, in one aspect, the superabrasive particles may be a single crystal superabrasive particles, such as natural or synthetic diamonds, cubic boron nitride and the like. 在另一方面中,超研磨颗粒可为多晶颗粒,诸如多晶钻石、多晶立方氣化砸等等。 In another aspect, the superabrasive particles may be polycrystalline particles, such as polycrystalline diamond, polycrystalline cubic gasification hit the like. 在又一方面中,超研磨颗粒可于其上面定置有研磨层的超研磨区段,其中该研磨层可包括单晶材料、多晶材料或其组合。 In yet another aspect, the superabrasive particles can be placed thereon above a given abrasive segment superabrasive layer, wherein the abrasive layer may include a single crystal material, polycrystalline material, or combinations thereof. 另外,CMP垫修整器可包括诸如硬焊金属、有机聚合物、烧结金属、陶瓷及其类似物的基质材料。 Further, the CMP pad dresser may comprise a matrix material such as brazing metals, organic polymers, sintered metal, ceramics and the like. 各种CMP垫修整器的实例可见于以下文献:1997年4月4日申请的美国专利第6,039,641号;1998年11月4日申请的美国专利第6,193,770号;1999年9月20日申请的美国专利第6,286,498号;2001年8月22日申请的美国专利第6,679,243号;2002年4月、9月27日申请的美国专利第7,124,753号;2000年4月26日申请的美国专利第6,368,198号;2002年3月27日申请的美国专利第6,884,155号;2004年9月29日申请的美国专利第7,201,645号;及2004年12月30日申请的美国专利第7,258,708号,所述文献各自以引用的方式并入本文中。 Examples of various CMP pad conditioner can be found in the following references: US Patent No. 6,039,641 on April 4, 1997 filed; US Patent No. 6,193,770 on November 4, 1998 filed; 1999 US Patent No. September 20 application No. 6,286,498; US Patent No. 6,679,243 on August 22, 2001 filed; application in April 2002, September 27 of US Patent No. 7 No. 124,753; US Patent No. 6,368,198 April 26, 2000 filed; US Patent No. 6,884,155 March 27, 2002 filed; September 29, 2004 filed U.S. Patent No. 7,201,645; and U.S. Patent No. 7,258,708 on December 30, 2004 application, in each of the documents incorporated by reference herein. 另外,各种CMP垫修整器的实例可见于以下文献:2006年2月17日申请的美国专利申请第11/357,713号;2006年11月16日申请的美国专利申请第11/560,817号;2007年4月10日申请的美国专利申请第11/786,426号;2005年9月9日申请的美国专利申请第11/223,786号;2007年5月16日申请的美国专利申请第11/804,221号;2007年3月14日申请的美国专利申请第11/724,585号;2008年11月7日申请的美国专利申请第12/267,172号;2007年11月15日申请的美国专利申请第11/940,935号;2008年7月5日申请的美国专利申请第12/168,110号;及2008年10月22日申请的美国专利申请第12/255,823号,所述文献各自以引用的方式并入本文中。 In addition, various examples CMP pad dresser can be found in the following documents: US Pat February 17, 2006 Application No. 11 / 357,713; US Patent November 16, 2006 Application No. 11 / 560,817 ; US Patent application April 10, 2007 application No. 11 / 786,426; US Patent application September 9, 2005 application No. 11 / 223,786; application May 16, 2007 US Patent application Serial No. 11 / No. 804,221; US ​​Patent application March 14, 2007 application No. 11 / 724,585; US Patent application 2008, November 7 application No. 12 / 267,172; November 15, 2007 U.S. Patent application No. 11 / 940,935; U.S. Patent application filed July 5, 2008 Serial No. 12 / 168,110; application and October 22, 2008, U.S. Patent application Serial No. 12 / 255,823, the Document each of which is incorporated by reference herein. [0061] 在本发明的另一方面中,提供一种CMP垫修整器修整轮廓。 [0061] In another aspect of the present invention, there is provided a CMP pad conditioner conditioning profile. 该修整轮廓可包括修整图案,其自CMP垫修整器的所有多个超研磨颗粒中识别多个工作超研磨颗粒及/或多个过度侵蚀性超研磨颗粒。 The profile may include a trimming pattern trimming, all from a plurality of superabrasive particles in a CMP pad dresser working identifying a plurality of superabrasive particles and / or excessive erosion of the plurality of superabrasive particles. 修整图案可以多种格式提供,且应了解本发明范畴包括所有所述格式。 Trimming pattern may provide a variety of formats, and the scope of the invention should be understood to include all the formats. 非限制性实例包括电子表示、指示基板上的标记图案、标记图案的图解表示、标记图案的数值表示、展示多个工作超研磨颗粒的位置的CMP垫修整器图,及其组合。 Non-limiting examples include electronic representation, illustrating indication mark pattern on the substrate, the marking pattern represents a numerical representation of the marking pattern, showing a plurality of work positions CMP superabrasive particle FIG pad conditioner, and combinations thereof. 在一特定方面中,修整图案为指示基板上的标记图案。 In a particular aspect, a pattern trim pattern marked on the indicator substrate. 该种标记图案可包括由多个工作超研磨颗粒在第一方向上移动经过指示基板而产生的第一标记图案,及由多个工作超研磨颗粒在第二方向上移动经过指示基板而产生的第二标记图案。 The markers may comprise a first pattern by a plurality of marker pattern of superabrasive particles moving through the work indicates the substrate generated in a first direction, and a plurality of moving a work of superabrasive particles in a second direction through the substrate is generated indicating a second marker pattern. 该种CMP垫修整器修整轮廓可适用于使CMP垫修整器上的超研磨颗粒与修整器在CMP研磨程序期间的性能相互关联。 The CMP pad dresser dressing seed contour adapted to cause performance of a superabrasive particle and CMP dresser on the dresser during CMP polishing pad interrelated programs. 该修整轮廓可由新修整器提供,其可使用新修整器来产生,或其可在修整器的使用寿命期间制得。 Trimming the new contour may be formed to provide a dresser which can be used to generate new dresser, or can be prepared during the service life of the dresser.

[0062] 本发明另外提供一种识别CMP垫修整器中的工作超研磨颗粒的系统。 [0062] The present invention further provides a system for identifying the CMP pad dresser working superabrasive particles. 该种系统可包括指示基板及具有多个超研磨颗粒的CMP垫修整器,其中该多个超研磨颗粒的一部分与指示基板接触。 This kind of system may include an indication of a substrate and a CMP pad dresser having a plurality of superabrasive particles, wherein a portion of the plurality of superabrasive particles in contact with the substrate indicated. 该系统可另外包括由多个超研磨颗粒的该部分切入指示基板中所得的标记图案,其中标记图案自多个超研磨颗粒中识别多个工作超研磨颗粒。 The system may further comprise cutting the resulting substrate is indicated by a plurality of superabrasive particles of the marking pattern portion, wherein the plurality of pattern recognition mark work of superabrasive particles from the plurality of superabrasive particles. 正如上文所描述,指示基板可包括指示标记物以标记多个工作超研磨颗粒。 As described above, the substrate may include an indication indicating label to mark a plurality of superabrasive particles work.

[0063] 本发明的技术亦可用于制造CMP垫修整器。 [0063] The techniques of this invention may also be used for manufacturing a CMP pad conditioner. 在一方面中,举例而言,提供一种整平CMP垫修整器中的多个超研磨颗粒尖端的方法。 In one aspect, for example, a plurality of CMP pad dresser of superabrasive particles in a process for flattening the tip. 该种方法可包括暂时将多个超研磨颗粒耦接于工具基板、抵靠指示基板定置该多个超研磨颗粒,以使多个超研磨颗粒的至少一部分接触指示基板,及移动多个超研磨颗粒经过指示基板,以使多个超研磨颗粒的该部分在指示基板上产生标记图案。 The method may include a plurality of superabrasive particles temporarily coupled to the tool substrate, the substrate abuts against the set-indicating that the plurality of superabrasive particles, the plurality of superabrasive particles such that at least a portion of the substrate contact indication, and a plurality of superabrasive mobile after the substrate particles indication, so that the portion of the plurality of superabrasive particles generated marking pattern on the indicator substrate. 因此该标记图案可自多个超研磨颗粒中识别过度侵蚀性超研磨颗粒。 So that the marking pattern from a plurality of superabrasive particles can be identified in excessive erosion of the superabrasive particles. 随后可相对于工具基板调整过度侵蚀性超研磨颗粒的突出部以改变该工具中存在的工作超研磨颗粒与非工作超研磨颗粒的比例。 It may then be adjusted relative to the tool substrate over the protruding portion of erosive superabrasive particles present in the tool to change the working and non-working superabrasive particles superabrasive particle ratio. 必要时可重复整平过程。 If necessary repeat the leveling process. 在整平之后,可将多个超研磨颗粒永久耦接至工具基板。 After leveling, a plurality of superabrasive particles may be permanently coupled to the tool substrate. 通过调节工作超研磨颗粒的比例,随后永久固定所述颗粒于CMP垫修整器中,可提高调节性能。 By adjusting the proportion of working superabrasive particles, the particles are then permanently fixed in the CMP pad dresser may be adjusted to improve performance.

[0064] 本发明另外提供一种识别CMP垫修整器中的工作超研磨颗粒的方法,由此在修整器上进行颗粒的识别。 [0064] The present invention further provides a method of identifying the CMP pad dresser working methods superabrasive particles, thereby identifying particles on the dresser. 在一方面中,举例而言,该种方法可包括将一悬置于一框架内的塑胶片压至一具有多个超研磨颗粒的CMP垫修整器上,以至于该多个超研磨颗粒的至少一部分使该塑胶包覆物变形。 In one aspect, for example, the method may comprise a plastic film suspended within a frame to a press having a plurality of superabrasive particles on the CMP pad conditioner, so that the plurality of superabrasive particles the plastic coating at least a portion thereof deformable. 随后,可观测该变形的塑胶片以自该多个超研磨颗粒中识别多个工作超研磨颗粒。 Subsequently, the plastic film can be observed from the plurality of deformable to identify a plurality of superabrasive particles work of superabrasive particles. 换言之,因为塑胶片在框架上被拉伸,所以一旦塑胶片被压至CMP垫修整器上后,则该塑胶片的变形将具有对应于超研磨颗粒的突出的变形尺寸。 In other words, since the plastic sheet is stretched in the frame, so that once the plastic sheet is pressed onto the CMP pad conditioner, the deformation of the deformable plastic sheet having a size corresponding to the projection of the superabrasive particles. 因此,过度侵蚀性较大且因此较突出远离CMP垫修整器的颗粒将在塑胶片中产生较大变形。 Thus, excessive erosion of the more prominent the larger particles and thus away from the CMP pad conditioner will have a greater deformation in the plastic sheet. 随后可标记塑胶片以指示过度侵蚀性颗粒的位置。 Plastic sheet may then be marked to indicate the location of excessive erosion of the particles. 另外,在一方面中,塑胶片可为至少半反射的以帮助识别工作超研磨颗粒及过度侵蚀性超研磨颗粒。 Further, in one aspect, the plastic sheet may be at least semi-reflective to help identify the work of superabrasive particles and excessive erosion of the superabrasive particles.

[0065] 虽然上述的方法是基于刮擦平板塑胶(包含用于制造CMP垫的聚氨酯),例如PET薄板,用于本发明的概念亦包含以一光学机器评估钻石颗粒尖端的位置。 [0065] While the above methods are based on plastic scraper plates (comprising for producing a polyurethane CMP pad), for example a PET sheet, the concept of the present invention also includes a tip position of the optical evaluation machine diamond particles. 举例而言,FRT公司制造钻石颗粒分析,其是着重于不同光波长的距离。 For example, the FRT manufactured diamond particle analysis, which is focused on the distance of the different wavelengths of light. FRT的机器可扫描整个钻石碟盘,并且量测所有钻石颗粒尖端的位置,包含量测已损毁的钻石颗粒。 FRT machine can scan the entire diamond disk, and all the measurement position of the tip of diamond particles containing diamond particles measured have been damaged. 该机器的软件可决定这些尖端的共同平面,该平面可能不同于基板背面。 The machine's software to decide the tip joint plane, which may be different from the back surface of the substrate. 接着,每一钻石晶体的尖端高度根据该共同平面进行标记。 Subsequently, the height of the tip of each diamond crystal labeled according to the common plane. 因此,FRT机器可识别钻石颗粒尖端且根据这些尖端的高度与分布来绘制图形。 Thus, FRT machine can recognize these diamond particles and a tip height of the tip to draw distribution pattern. 因为只有少数的钻石颗粒尖端在CMP操作期间能够真正贯穿抛光垫,因此能够非常便利地判断这些少数晶体位于钻石碟盘平面上的高度与位置。 Because only a few particles of diamond tip during the CMP operation can actually penetrate the polishing pad, it is possible to conveniently determine those few crystals located at a height position on a diamond disk plane. 该信息(高度与位置)成为判断该抛光垫修整器品质的关键侦测数据。 This information (height and location) to be judged critical data to detect the polishing pad dresser quality.

[0066] 许多CMP研究者已发现最高一群的少数晶体导致昂贵的晶片产生缺陷。 [0066] Many researchers have found that the highest group of CMP few crystal defects lead to costly wafer. 举例而言,ARACA公司已分析许多钻石碟盘,并且提出报告指出抛光垫修整程序仅通过少数侵略性的最高晶体来完成。 For example, ARACA company has analyzed many diamond disc, and report pointed out that the polishing pad trimmer only be done by a small number of the most aggressive crystals. 他们其中一份报告宣称抛光垫超过50%的部分是通过10个最富侵略性的晶体的切割而完成修整。 They report which claimed that more than 50% of the polishing pad part is accomplished by trimming 10 of the most aggressive cut crystal. 事实上,单一个最富侵略性的晶体修整了抛光20%到50%的部分。 In fact, a single crystal dressing most aggressive polishing 20% ​​to 50% portion. 因此,这类“杀手钻石颗粒”就在少数最闻晶体之中。 Therefore, these "killer diamond particles" in the minority among the most heard crystals. 若是最闻的晶体远闻于第_■闻的晶体,尤其是当该最高的晶体远离其他次高的晶体,则该杀手钻石颗粒会过度深入地穿进该抛光垫。 If the smell of crystal far the most heard in the first _ ■ smell of crystals, especially when the highest the second highest crystal away from other crystal, the killer diamond particles will wear excessively deep into the pad. 杀手钻石过深的·穿入不仅会形成抛光垫的深隧道,也会不必要地向上推挤变形的抛光垫。 · Diamond killer too deep penetration will not only form a deep tunnel polishing pad, will unnecessarily push up the deformation of the polishing pad. 此会造成所谓的“杀手粗糙度”而刮伤脆弱的晶片。 This will result in so-called "killer roughness" and scratch the fragile wafers. 更糟的是,这些杀手钻石颗粒遭受过度挤压而崩出缺口。 Worse, these killers diamond particles are subjected to excessive compression and collapse the gap. 钻石颗粒出现缺口后会产生钻石碎片而嵌入相对软的抛光垫内。 It will produce diamonds from the diamond particles embedded in a gap and a relatively soft polishing pad inside. 在制造钻石碟盘的热循环期间亦会制造钻石的微小碎片。 It will manufacture tiny diamond fragments during thermal cycling manufacture of diamond disc. 此散乱的超硬材料碎片必定会深深地刮伤晶片。 Superhard materials scattered fragments of this will certainly deeply scratched wafer.

[0067] 因此,辨识出可能会损毁或是产生杀手粗糙度的杀手钻石颗粒是极为重要的。 [0067] Thus, identified may be damaged or generate killer killer roughness diamond particles is extremely important. 除了上述的刮擦方法,光学方法或是其他的方法(使用在塑胶模造材料中的辨识方法)可用来分级最闻钻石颗粒的尖端闻度。 In addition to the scraping method, an optical method, or other methods (making use of the plastic molding material identification method) may be used to grade the best smell tip diamond particles audibility. 较佳者,该最闻晶体闻于次闻晶体20微米以内,且晶体的前10%的最高尖端高于平均高度尖端80微米之内。 Preferably who smell the most heard in the crystal within the crystal sub-audible 20 microns, and the top 10% of the crystals is higher than the average height of the highest tip of the tip 80 microns. 若如此设计,预期可有更多的工作晶体来修整抛光垫,且可避免少数杀手钻石颗粒深度切割该抛光垫。 If so designed, is expected to have more work to trim crystal polishing pad, and can avoid a few killer diamond particles to cut the depth of polishing pads.

[0068] 对于制造程序,上述方法不仅提供产品的品质量测,亦可识别能够自钻石碟盘去除的杀手钻石颗粒。 [0068] For the manufacturing process, the above-described method not only provides the product quality measurements, also possible to identify the diamond particles from the diamond disk killer removed. 举例而言,可以金属推挤的方式粉碎该杀手钻石颗粒,亦可于推挤辅以超声波震动。 For example, the metal may be pulverized manner pushing the killer diamond particles, supplemented by the ultrasonic vibration can push on. 亦可以激光(YAG:钕)照射方式蒸发该杀手钻石颗粒。 Laser may also (YAG: Nd) irradiation method evaporated killer diamond particles. 一旦去除了杀手钻石,次闻的晶体则变成最闻。 Once removed the killer diamond, once the smell of the crystal becomes most smell. 若新的最闻晶体仍闻于次闻的晶体,则继续去除。 If the new smell of most crystals still smell the smell in times of crystals, it continues to remove. 可重复去除程序直到没有杀手钻石。 Remove Programs can be repeated until no killer diamonds. 该后处理程序可使得不合格的钻石碟盘合格,故通过消除杀手钻石晶体可增加工作晶体数量。 The postprocessor may make qualified unqualified diamond disk, it can increase the number of work by eliminating killer crystal diamond crystals. 因此,不仅通过以更多晶体均分工作负载的方式来增加抛光垫修整器的寿命,亦可通过抛光垫粗糙度的更高数量而使得CMP抛光程序更有效率。 Accordingly, not only to increase the life of the polishing pad dresser to more crystals by way of sharing the work load, a higher number also by roughness of the polishing pad so that the CMP process more efficient. 当然,通过减少晶片上的刮痕以及过度抛光部位可提高昂贵晶片的产率。 Of course, by reducing scratching and excessive polishing of the portion of the wafer may increase the yield of an expensive wafer.

[0069] 上述两方法,静态光学方法以及动态刮擦方法,可单独执行或是彼此配合执行。 [0069] The above-described two methods, optical methods static and dynamic scraping method, may be performed separately or performed with each other. 本发明主要是减少在修整CMP垫时的杀手钻石颗粒以及杀手粗糙度。 The present invention is mainly to reduce killer diamond particles in the CMP pad and trim killer roughness. 该测试数据可用于向客户提供钻石碟盘的品质凭证。 The test data can be used to provide a quality certificate diamond disc to customers.

[0070] 应了解,上述配置仅说明本发明的原理的应用。 [0070] It should be appreciated, the above arrangement merely illustrative of the application of the principles of the present invention. 本领域的普通技术人员可在不脱离本发明的精神及范畴下设计出许多变体及替代性配置,且所附权利要求书意欲涵盖所述变体及配置。 Those of ordinary skill in the art may devise many variations and alternative configurations without departing from the spirit and the scope of the invention, and the appended claims are intended to cover the variations and configurations. 因此,虽然在上文中已结合目前视为本发明的最实用及较佳的具体实例的内容精确及详细地描述了本发明,但所属领域的普通技术人员可显而易知的是,在不脱离本文阐述的原理及概念的情况下可进行许多修改,包括(但不限于)在尺寸、材料、形状、形式、功能及操作方式、装配及使用方面作出改变。 Thus, although above in connection with the current contents of the most practical and preferred specific examples of the present invention is considered accurate and described the present invention in detail, but those of ordinary skill in the art may be apparent that, without departing from the principles and concepts in the case set forth herein may be many modifications, including (but not limited to) make changes in size, materials, shape, form, function and operation, assembly and use of.

Claims (15)

  1. 1.一种用于识别CMP垫修整器中的超研磨颗粒的方法,其包含: 将一具有多个超研磨颗粒的CMP垫修整器定置于一指示基板上,以使该CMP垫修整器的该多个超研磨颗粒的至少一部分接触该指示基板;及在一第一方向上移动该CMP垫修整器经过该指示基板,以使该多个超研磨颗粒的该部分在该指示基板上产生一第一标记图案,其中该第一标记图案自该多个超研磨颗粒中识别多个工作超研磨颗粒; 其中工作超研磨颗粒为在修整或调节程序期间接触CMP垫的超研磨颗粒。 CLAIMS 1. A method for identifying CMP conditioner superabrasive particles pad, comprising: a plurality of superabrasive particles having a CMP pad conditioner disposed on a given substrate indication, so that the CMP pad dresser the plurality of superabrasive particles in contact with at least a portion of the indicating substrate; and moving the portion of the CMP pad conditioner through the substrate indicates a first direction, so that the generated plurality of superabrasive particles on a substrate, the indication a first marker pattern, wherein the first marker pattern recognition work plurality of superabrasive particles from the plurality of superabrasive particles; wherein the superabrasive particles are working in dressing superabrasive particles or the contact during the adjustment procedure CMP pad.
  2. 2.根据权利要求1所述的识别CMP垫修整器的超研磨颗粒的方法,其进一步包含在一第二方向上移动该CMP垫修整器经过该指示基板,以使该多个超研磨颗粒的该部分产生一第二标记图案,该第二方向大致上处于该第一方向的横向,其中该第二标记图案与该第一标记图案相比提供该多个工作超研磨颗粒的定位信息。 The method for recognizing CMP pad conditioner superabrasive particles according to claim 1, further comprising a second movable in the direction of the CMP pad conditioner through the indicated substrate, so that the plurality of superabrasive particles the second part generates a marker pattern, the second direction is substantially transverse to the first direction, wherein the second marker pattern compared to the first location information of the mark pattern provides a plurality of superabrasive particles work.
  3. 3.根据权利要求1所述的识别CMP垫修整器的超研磨颗粒的方法,其中该指示基板包括一指示标记物,其在使该CMP垫修整器移动经过该指示基板时标记该多个工作超研磨颗粒。 The method for recognizing CMP pad conditioner superabrasive particles according to claim 1, wherein the substrate includes an indicator indicating a marker, which marker of the plurality of operating in so that the CMP conditioner indication moves through the substrate pad superabrasive particles.
  4. 4.根据权利要求3所述的识别CMP垫修整器的超研磨颗粒的方法,其中该指示标记物包括一选自由颜料标记物、萤光标记物、化学标记物、放射性标记物、及其组合组成的群的成员。 The method for recognizing CMP pad conditioner superabrasive particles according to claim 3, wherein the indicator composition comprises a pigment selected from the group consisting of markers, fluorescent labels, chemiluminescent labels, radioactive labels, and combinations thereof members of the group.
  5. 5.根据权利要求1所述的识别CMP垫修整器的超研磨颗粒的方法,其中该多个超研磨颗粒相对于该CMP垫修整器具有至少一个校正定位方向,且其中该第一方向并非该至少一个校正定位方向; 其中校正定位方向是指多个超研磨颗粒的对准轴的方向。 The method for recognizing CMP pad conditioner superabrasive particles according to claim 1, wherein the plurality of superabrasive particles with respect to the direction of the CMP pad conditioner having at least one correctional, and wherein the first direction is not the positioning at least one correction direction; wherein the correctional direction refers to a direction aligned with the plurality of superabrasive particles shaft.
  6. 6.根据权利要求1所述的识别CMP垫修整器的超研磨颗粒的方法,其进一步包含自该多个工作超研磨颗粒中识别及除去过度侵蚀性超研磨颗粒; 其中过度侵蚀性超研磨颗粒为CMP垫修整器中会侵蚀性修整或调节CMP垫的超研磨颗粒。 6. The method of claim superabrasive particle identification CMP pad conditioner as claimed in claim, further comprising a plurality of work from the superabrasive particles and the identified remove excessive erosion of superabrasive particles; wherein excessive erosion of superabrasive particles CMP pad conditioner as erosion will trim or adjust the superabrasive particles in a CMP pad.
  7. 7.根据权利要求1所述的识别CMP垫修整器的超研磨颗粒的方法,其中该多个超研磨颗粒为多个超研磨区段,且该多个工作超研磨颗粒为多个工作超研磨区段; 其中超研磨区段是指一种工具主体,其具有多个与其结合的超研磨颗粒。 The method for recognizing CMP pad conditioner superabrasive particles according to claim 1, wherein the plurality of superabrasive particles into a plurality of superabrasive segments, and the plurality of operating a plurality of superabrasive particles to the work of superabrasive section; wherein the superabrasive segment refers to a tool body having a plurality of superabrasive particles bonded thereto.
  8. 8.一种提高工作超研磨颗粒在一CMP垫修整器中的比例的方法,其包含: 将一具有多个超研磨颗粒的CMP垫修整器定置于一指示基板上,以使该CMP垫修整器的该多个超研磨颗粒的至少一部分接触该指示基板; 在一第一方向上移动该CMP垫修整器经过该指示基板,以使该多个超研磨颗粒的该部分在该基板上产生一第一标记图案,其中该第一标记图案自该多个超研磨颗粒中识别多个工作超研磨颗粒; 自该多个工作超研磨颗粒中识别多个过度侵蚀性超研磨颗粒;及除去该多个过度侵蚀性超研磨颗粒的至少一部分,以增加工作超研磨颗粒在该CMP垫修整器中的比例; 其中过度侵蚀性超研磨颗粒为CMP垫修整器中会侵蚀性修整或调节CMP垫的超研磨颗粒;其中工作超研磨颗粒为在修整或调节程序期间接触CMP垫的超研磨颗粒。 A method of operating ratio of superabrasive particles in a CMP pad dresser is increased, comprising: a CMP pad dresser having a plurality of superabrasive particles disposed on a given substrate indication, so that the CMP pad dresser contacting at least the plurality of superabrasive particle is an indication of a portion of the substrate; the mobile portion of the CMP pad conditioner through the substrate indicates a first direction, so that the plurality of superabrasive particles on the substrate produces a a first marker pattern, wherein the first marker pattern recognition work plurality of superabrasive particles from the plurality of superabrasive particles; excessive erosion of identifying a plurality of superabrasive particles from the plurality of superabrasive particles in the work; and removing the multi- a over at least a portion erosive superabrasive particles to increase the proportion of working superabrasive particles in the CMP pad conditioner; wherein excessive erosion of superabrasive particles CMP pad conditioner will aggressive trimming or adjusting the CMP pad super abrasive particles; wherein the superabrasive particles work as trimming or adjusting the superabrasive particle contact the CMP pad during the procedure.
  9. 9.一种CMP垫修整器的修整轮廓,其包含一修整图案,其自一CMP垫修整器的多个超研磨颗粒中识别多个工作超研磨颗粒; 其中工作超研磨颗粒为在修整或调节程序期间接触CMP垫的超研磨颗粒; 其中该修整图案为一指示基板上的一标记图案,其包括由该多个工作超研磨颗粒在一第一方向上移动经过该指示基板而产生的一第一标记图案,且进一步包括由该多个工作超研磨颗粒在一第二方向上移动经过该指示基板而产生的一第二标记图案,其中该第二方向至少大致上处于该第一方向的横向。 A CMP pad dresser contour conditioner, comprising a trimming pattern, which identifies a plurality of superabrasive particles work from a plurality of superabrasive particles CMP pad conditioner; wherein superabrasive particles in the working or trimming adjustment contacting the CMP pad during program superabrasive particles; wherein the trim pattern is a marker indicating a pattern on a substrate including a first plurality of the work of superabrasive particles moves through the instruction generated in the substrate in a first direction a marker pattern, and further comprising a second marker pattern by the plurality of superabrasive particles moves through the work indicates the substrate generated in a second direction, wherein the second direction is at least substantially transverse to the first direction .
  10. 10.一种提高CMP垫修整器性能的方法,其用于整平一CMP垫修整器中的多个超研磨颗粒尖端,其包含: 暂时将多个超研磨颗粒耦接至一工具基板; 抵靠一指示基板定置该多个超研磨颗粒,以使该多个超研磨颗粒的至少一部分接触该指不基板; 移动该多个超研磨颗粒经过该指示基板,以使该多个超研磨颗粒的该部分在该指示基板上产生一标记图案,其中该标记图案自该多个超研磨颗粒中识别多个过度侵蚀性超研磨颗粒; 相对于该工具基板调整该多个过度侵蚀性超研磨颗粒的尖端以改变工作超研磨颗粒与非工作超研磨颗粒的比例;及使该多个超研磨颗粒永久耦接至该工具基板; 其中过度侵蚀性超研磨颗粒为CM`P垫修整器中会侵蚀性修整或调节CMP垫的超研磨颗粒; 其中工作超研磨颗粒为在修整或调节程序期间接触CMP垫的超研磨颗粒; 其中非工作超研磨颗粒为 10. A CMP pad conditioner method of improving the performance for a plurality of superabrasive particles Ping entire tip of the CMP pad conditioner, comprising: a plurality of superabrasive particles temporarily coupled to a tool substrate; against the substrates of set indicating a plurality of superabrasive particles, such that contact with at least a portion of the plurality of superabrasive particles in the substrate means not; moving the plurality of superabrasive particles through the indicated substrate, so that the plurality of superabrasive particles generating a token portion of the pattern on the substrate indicates, wherein the marker pattern identification excessive erosion of the plurality of superabrasive particles from the plurality of superabrasive particles; tool tip relative to the substrate a plurality of adjusting the excessive erosion of superabrasive particles to change the ratio of the working and non-working superabrasive particles superabrasive particles; and a plurality of superabrasive particles such that the permanently coupled to the tool substrate; wherein excessive erosion of superabrasive particles CM`P pad dresser dressing will erosion adjusting the superabrasive particles or CMP pad; superabrasive particles wherein the work during the trimming or adjustment procedure superabrasive particle contact the CMP pad; wherein the superabrasive particles are inoperative CMP垫修整器中不会明显地触及衬垫而不足以自表面移除碎屑、使表面变形、自表面切出凹槽的超研磨颗粒。 Without significantly touching the CMP pad conditioner and the pad is insufficient to remove debris from the surface, the surface modification, the surface was cut out from the recess superabrasive particles.
  11. 11.根据权利要求10所述的提高CMP垫修整器性能的方法,其中用一有机基质使该多个超研磨颗粒永久耦接至该工具基板,该有机基质包括一选自由以下组成的群的成员:胺基树脂、丙烯酸酯树脂、醇酸树脂、聚酯树脂、聚酰胺树脂、聚酰亚胺树脂、酚醛树脂、酚系/乳胶树脂、环氧树脂、异氰酸酯树脂、异氰尿酸酯树脂、聚硅氧烷树脂、反应性乙烯基树脂、聚乙烯树脂、聚丙烯树脂、聚苯乙烯树脂、苯氧基树脂、聚砜树脂、丙烯腈-丁二烯-苯乙烯树脂、丙烯酸树脂及其组合。 11. The improved method of claim 10 CMP conditioner properties pad, wherein the organic matrix with a plurality of superabrasive particles such that the permanently coupled to the tool substrate, the organic matrix comprises one selected from the group consisting of members: amino resins, acrylate resins, alkyd resins, polyester resins, polyamide resins, polyimide resins, phenolic resins, phenolic / latex resins, epoxy resins, isocyanate resins, isocyanurate resins , silicone resins, reactive vinyl resins, polyethylene resins, polypropylene resins, polystyrene resins, phenoxy resin, polysulfone resin, an acrylonitrile - butadiene - styrene resin, an acrylic resin, and combination.
  12. 12.根据权利要求10所述的提高CMP垫修整器性能的方法,其中该多个超研磨颗粒为多个超研磨区段,且该多个工作超研磨颗粒为多个工作超研磨区段; 其中超研磨区段是指一种工具主体,其具有多个与其结合的超研磨颗粒。 12. The improved CMP method according to claim 10, performance of the pad dresser, wherein the plurality of superabrasive particles into a plurality of superabrasive segments, and the plurality of operating a plurality of superabrasive particles to the work of superabrasive segments; wherein the superabrasive segment refers to a tool body having a plurality of superabrasive particles bonded thereto.
  13. 13.一种评估CMP垫修整器性能的系统,其用于识别一CMP垫修整器中的工作超研磨颗粒,其包含: 一指不基板; 一具有多个超研磨颗粒的CMP垫修整器,其中该多个超研磨颗粒的一部分与该指示基板接触;及一由该多个超研磨颗粒的该部分切入该指示基板中所得的标记图案,其中该标记图案自该多个超研磨颗粒中识别多个工作超研磨颗粒; 其中工作超研磨颗粒为在修整或调节程序期间接触CMP垫的超研磨颗粒。 13. A method of assessing the performance of the CMP pad conditioner system, for identifying the work of superabrasive particles in a pad CMP conditioner, comprising: means not a substrate; a plurality of superabrasive particles having a CMP pad conditioner, wherein the plurality of superabrasive particles in contact with the portion of the substrate direction; and a resultant cutting of the substrate indicates the portion of the marking pattern by the plurality of superabrasive particles, wherein the marker pattern identification from the plurality of superabrasive particles a plurality of work superabrasive particles; wherein the superabrasive particles work as trimming or adjusting the superabrasive particles contacting the CMP pad during the procedure.
  14. 14.根据权利要求13所述的评估CMP垫修整器性能的系统,其中该指示基板包括一指示标记物,其用以标记该多个工作超研磨颗粒。 14. Evaluation of the CMP pad conditioner according to claim 13 performance of the system, wherein the substrate includes an indicator indicating a marker, which marker for the plurality of superabrasive particles work.
  15. 15.根据权利要求14所述的评估CMP垫修整器性能的系统,其中该指示标记物包括一选自由颜料标记物、萤光标记物、化学标记物、放射性标记物、及其组合组成的群的成员。 15. Assessment Group 14 of the CMP pad conditioner as claimed in claim system performance, wherein the indicator composition comprises a pigment selected from the group consisting of markers, fluorescent labels, chemiluminescent labels, radioactive labels, and combinations thereof a member of.
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