CN102034722A - Mold for PLCC (plastic leaded chip carrier) - Google Patents
Mold for PLCC (plastic leaded chip carrier) Download PDFInfo
- Publication number
- CN102034722A CN102034722A CN 201010540652 CN201010540652A CN102034722A CN 102034722 A CN102034722 A CN 102034722A CN 201010540652 CN201010540652 CN 201010540652 CN 201010540652 A CN201010540652 A CN 201010540652A CN 102034722 A CN102034722 A CN 102034722A
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- Prior art keywords
- plcc
- hole
- vias
- sets
- mold
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- Moulds For Moulding Plastics Or The Like (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
The invention discloses a mold for a PLCC (plastic leaded chip carrier), comprising the PLCC, an upper mold, a lower mold and a locating pin for locating the PLCC. The PLCC is provided with a first through hole, a first through hole group which forms a right angled isosceles triangle with the first through hole, and a second through hole group which forms a right angled un-isosceles triangle with the first through hole. The PLCC is located by the locating pin passing through the first through hole and the second through hole group. The lower mold and the upper mold are respectively provided with holes corresponding to the first through hole and the second through hole group. By utilizing the mold, the PLCC can be located fast and accurately, and the scrapping of the PLCC can be prevented simultaneously.
Description
Technical field
The present invention relates to mould, especially the mould of using for a kind of PLCC.
Background technology
Be special pin Chip Packaging, it is a kind of of paster encapsulation, the pin of this encapsulation curves inwardly in chip bottom and draws from four sides of encapsulation, be tee T, be plastic products, therefore in the vertical view of chip, cannot see chip pin, generally be used for circuit such as logic LSI, DLD now.
During processing PLCC, because location hole left-right symmetric before, operating personnel are put back part easily, so that produce mistake processing.
Summary of the invention
At the problems referred to above, main purpose of the present invention provides a kind of mould that can locate PLCC fast.
The technical solution used in the present invention is: the mould that a kind of PLCC uses, the pilot pin that it comprises PLCC, upper die and lower die and is used to locate PLCC, have first through hole on the PLCC, constitute first sets of vias of isosceles right triangle and constitute second sets of vias of non-right-isosceles triangle with first through hole with first through hole, pilot pin offers on counterdie and the patrix and first through hole and the corresponding hole of second sets of vias by first through hole and second sets of vias location PLCC.
Further, second sets of vias is two holes, and two holes of second sets of vias and first through hole are positioned at any three of four angles of PLCC.
Further, first through hole is the oval hole.
Further, second sets of vias is two circular holes.
The present invention adopts above structure, and operating personnel can correctly locate the position of PLCC fast, prevent from PLCC is put back, and also can not cause the mistake processing of product.
Description of drawings
Accompanying drawing 1 is the structural representation of mould of the present invention.
Accompanying drawing 2 is the vertical view of PLCC of the present invention.
In the above accompanying drawing: 1, patrix; 2, counterdie; 3, pilot pin; 4, PLCC; 5, first through hole; 6, second sets of vias; 7, second sets of vias.
Embodiment
, the plastic chip carrier of band lead-in wire, one of surface attaching type encapsulation, profile is square, the encapsulation of 32 pin, pin is drawn from four sides of encapsulation, is T-shaped, is plastic products, and overall dimension is more much smaller than the DIP encapsulation.The PLCC encapsulation is fit to have the advantage that overall dimension is little, reliability is high with SMT surface mounting technology installation wiring on PCB.
During processing PLCC, with pilot pin PLCC is positioned usually.Pilot pin is used for the location to part, offers corresponding hole usually on upper die and lower die, to obtain location more accurately.
Below in conjunction with embodiment shown in the drawings the present invention is further described:
The mould that a kind of PLCC uses, the pilot pin 3 that it comprises PLCC4, patrix 1, counterdie 2 and is used to locate PLCC4, offer the first oval through hole 5 on the PLCC4, constitute first sets of vias 7 of isosceles right triangles and constitute second sets of vias 6 of non-right-isosceles triangles with the first oval through hole 5 with the first oval through hole 5, pilot pin offers on counterdie 1 and the patrix 2 and the first oval through hole 5 and second sets of vias, 6 corresponding holes by first oval through hole 5 and second sets of vias, 6 location PLCC4.Second sets of vias 6 is two circular holes, any three places at four angles that two circular holes of described second sets of vias 6 and the described first oval through hole 5 are arranged in PLCC4.
Tradition is to position by the first oval through hole 5 and first sets of vias 7 to the location of PLCC4, but, if operating personnel with PLCC4 put back to, when being about to the placement of PLCC4 Rotate 180 degree, PLCC4 still can be placed in the counterdie 2, and operating personnel are difficult for perceiving the operate miss of oneself, when processing machine adds man-hour according to routine, will make PLCC4 produce and scrap, cause economic loss to company.
Mould by the PLCC4 after improving, when PLCC4 snaps in counterdie 2 by the first oval through hole 5 and second sets of vias, 6 location, be that PLCC4 is in position correct in the mould, when operating personnel produce misoperation, when oppositely being placed on PLCC4 Rotate 180 degree on the counterdie 2, part can be protruding, can't snap in the counterdie 2, be that PLCC4 is in wrong position, also can't carry out next step processing simultaneously PLCC4.
In sum, this mould can be located PLCC rapidly and accurately, prevents to produce scrapping of PLCC simultaneously.
The foregoing description only is explanation technical conceive of the present invention and characteristics, and its purpose is to allow the personage who is familiar with this technology can understand content of the present invention and enforcement according to this, can not limit protection scope of the present invention with this.All equivalences that spirit is done according to the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (4)
1. mould that PLCC uses, it comprises PLCC(4), patrix (1), counterdie (2) and be used to locate PLCC(4) pilot pin (3), described PLCC(4) offers first through hole (5) on, constitute first sets of vias (7) of isosceles right triangle and constitute second sets of vias (6) of non-right-isosceles triangle with described first through hole (5) with described first through hole (5), it is characterized in that: described pilot pin (3) is by described first through hole (5) and second sets of vias (6) location PLCC(4), offer on described counterdie (2) and the described patrix (1) and described first through hole (5) and the corresponding hole of second sets of vias (6).
2. the mould that PLCC as claimed in claim 1 uses, it is characterized in that: described second sets of vias (6) is two holes, and two holes and described first through hole (5) of described second sets of vias (6) lay respectively at described PLCC(4) any three places in four angles.
3. the mould that PLCC as claimed in claim 1 or 2 uses is characterized in that: described first through hole (5) is the oval hole.
4. the mould that PLCC as claimed in claim 1 or 2 uses is characterized in that: described second sets of vias (6) is two circular holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105406526A CN102034722B (en) | 2010-11-12 | 2010-11-12 | Mold for PLCC (plastic leaded chip carrier) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105406526A CN102034722B (en) | 2010-11-12 | 2010-11-12 | Mold for PLCC (plastic leaded chip carrier) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102034722A true CN102034722A (en) | 2011-04-27 |
| CN102034722B CN102034722B (en) | 2012-11-07 |
Family
ID=43887430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105406526A Expired - Fee Related CN102034722B (en) | 2010-11-12 | 2010-11-12 | Mold for PLCC (plastic leaded chip carrier) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102034722B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04164362A (en) * | 1990-10-29 | 1992-06-10 | Nec Corp | Plcc type hybrid integrated circuit device |
| US5213512A (en) * | 1992-07-24 | 1993-05-25 | Hughes Aircraft Company | PLCC socket mateable connection |
| CN1913135A (en) * | 2005-08-11 | 2007-02-14 | 安华高科技Ecbuip(新加坡)私人有限公司 | PLCC package with integrated lens and method for making the package |
-
2010
- 2010-11-12 CN CN2010105406526A patent/CN102034722B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04164362A (en) * | 1990-10-29 | 1992-06-10 | Nec Corp | Plcc type hybrid integrated circuit device |
| US5213512A (en) * | 1992-07-24 | 1993-05-25 | Hughes Aircraft Company | PLCC socket mateable connection |
| CN1913135A (en) * | 2005-08-11 | 2007-02-14 | 安华高科技Ecbuip(新加坡)私人有限公司 | PLCC package with integrated lens and method for making the package |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102034722B (en) | 2012-11-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121107 Termination date: 20151112 |
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| EXPY | Termination of patent right or utility model |