CN1020245C - 输入/输出电路 - Google Patents
输入/输出电路 Download PDFInfo
- Publication number
- CN1020245C CN1020245C CN90110193A CN90110193A CN1020245C CN 1020245 C CN1020245 C CN 1020245C CN 90110193 A CN90110193 A CN 90110193A CN 90110193 A CN90110193 A CN 90110193A CN 1020245 C CN1020245 C CN 1020245C
- Authority
- CN
- China
- Prior art keywords
- input
- circuits
- circuit
- output
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 abstract description 28
- 239000000758 substrate Substances 0.000 abstract description 6
- 238000013461 design Methods 0.000 description 9
- 238000013459 approach Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/90—Masterslice integrated circuits
- H10D84/998—Input and output buffer/driver structures
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
- G11C7/1051—Data output circuits, e.g. read-out amplifiers, data output buffers, data output registers, data output level conversion circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
- G11C7/1078—Data input circuits, e.g. write amplifiers, data input buffers, data input registers, data input level conversion circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Layout of the interconnection structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/471,892 | 1990-01-29 | ||
| US07/471,892 US4988636A (en) | 1990-01-29 | 1990-01-29 | Method of making bit stack compatible input/output circuits |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1053863A CN1053863A (zh) | 1991-08-14 |
| CN1020245C true CN1020245C (zh) | 1993-04-07 |
Family
ID=23873400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN90110193A Expired - Fee Related CN1020245C (zh) | 1990-01-29 | 1990-12-27 | 输入/输出电路 |
Country Status (9)
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69322855T2 (de) * | 1993-04-28 | 1999-05-20 | Stmicroelectronics S.R.L., Agrate Brianza, Mailand/Milano | Modulare integrierte Schaltungsstruktur |
| US5691218A (en) * | 1993-07-01 | 1997-11-25 | Lsi Logic Corporation | Method of fabricating a programmable polysilicon gate array base cell structure |
| US5552333A (en) * | 1994-09-16 | 1996-09-03 | Lsi Logic Corporation | Method for designing low profile variable width input/output cells |
| US5548747A (en) * | 1995-02-10 | 1996-08-20 | International Business Machines Corporation | Bit stack wiring channel optimization with fixed macro placement and variable pin placement |
| US5760428A (en) * | 1996-01-25 | 1998-06-02 | Lsi Logic Corporation | Variable width low profile gate array input/output architecture |
| US5698873A (en) * | 1996-03-08 | 1997-12-16 | Lsi Logic Corporation | High density gate array base cell architecture |
| US6725439B1 (en) * | 1998-01-29 | 2004-04-20 | International Business Machines Corporation | Method of automated design and checking for ESD robustness |
| US6086627A (en) * | 1998-01-29 | 2000-07-11 | International Business Machines Corporation | Method of automated ESD protection level verification |
| US6073343A (en) * | 1998-12-22 | 2000-06-13 | General Electric Company | Method of providing a variable guard ring width between detectors on a substrate |
| JP4629826B2 (ja) * | 2000-02-22 | 2011-02-09 | パナソニック株式会社 | 半導体集積回路装置 |
| US6879023B1 (en) * | 2000-03-22 | 2005-04-12 | Broadcom Corporation | Seal ring for integrated circuits |
| US6550047B1 (en) * | 2000-10-02 | 2003-04-15 | Artisan Components, Inc. | Semiconductor chip input/output cell design and automated generation methods |
| FR2817657B1 (fr) * | 2000-12-06 | 2003-09-26 | St Microelectronics Sa | Circuit integre a couplage par le substrat reduit |
| US7350160B2 (en) * | 2003-06-24 | 2008-03-25 | International Business Machines Corporation | Method of displaying a guard ring within an integrated circuit |
| US7253012B2 (en) * | 2004-09-14 | 2007-08-07 | Agere Systems, Inc. | Guard ring for improved matching |
| US7496877B2 (en) * | 2005-08-11 | 2009-02-24 | International Business Machines Corporation | Electrostatic discharge failure avoidance through interaction between floorplanning and power routing |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3798606A (en) * | 1971-12-17 | 1974-03-19 | Ibm | Bit partitioned monolithic circuit computer system |
| US3999214A (en) * | 1974-06-26 | 1976-12-21 | Ibm Corporation | Wireable planar integrated circuit chip structure |
| US3968478A (en) * | 1974-10-30 | 1976-07-06 | Motorola, Inc. | Chip topography for MOS interface circuit |
| US4006492A (en) * | 1975-06-23 | 1977-02-01 | International Business Machines Corporation | High density semiconductor chip organization |
| DE3177249D1 (de) * | 1980-11-24 | 1991-08-08 | Texas Instruments Inc | Pseudo-mikroprogrammsteuerung in einem mikroprozessor mit komprimiertem steuerfestwertspeicher und mit bandanordnung von sammelschienen, alu und registern. |
| JPS57211248A (en) * | 1981-06-22 | 1982-12-25 | Hitachi Ltd | Semiconductor integrated circuit device |
| JPS58137229A (ja) * | 1982-02-09 | 1983-08-15 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置 |
| US4613940A (en) * | 1982-11-09 | 1986-09-23 | International Microelectronic Products | Method and structure for use in designing and building electronic systems in integrated circuits |
| WO1985002062A1 (en) * | 1983-10-31 | 1985-05-09 | Storage Technology Partners | Cmos integrated circuit configuration for eliminating latchup |
| JPH063826B2 (ja) * | 1985-04-22 | 1994-01-12 | 日本電気株式会社 | スタンダ−ドセルの周辺ブロツク配置方法 |
| US4731643A (en) * | 1985-10-21 | 1988-03-15 | International Business Machines Corporation | Logic-circuit layout for large-scale integrated circuits |
| US4746966A (en) * | 1985-10-21 | 1988-05-24 | International Business Machines Corporation | Logic-circuit layout for large-scale integrated circuits |
| JPS63108733A (ja) * | 1986-10-24 | 1988-05-13 | Nec Corp | 半導体集積回路 |
-
1990
- 1990-01-29 US US07/471,892 patent/US4988636A/en not_active Expired - Fee Related
- 1990-11-30 JP JP2337039A patent/JPH073668B2/ja not_active Expired - Lifetime
- 1990-12-27 CN CN90110193A patent/CN1020245C/zh not_active Expired - Fee Related
- 1990-12-27 KR KR1019900022552A patent/KR930006723B1/ko not_active Expired - Fee Related
- 1990-12-28 MY MYPI90002295A patent/MY106061A/en unknown
- 1990-12-28 AU AU68557/90A patent/AU631709B2/en not_active Ceased
-
1991
- 1991-01-04 EP EP91300076A patent/EP0440332B1/en not_active Expired - Lifetime
- 1991-01-04 SG SG1996000215A patent/SG44408A1/en unknown
- 1991-01-04 DE DE69128434T patent/DE69128434D1/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP0440332A3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1994-01-19 |
| JPH073668B2 (ja) | 1995-01-18 |
| AU6855790A (en) | 1991-08-01 |
| JPH03252871A (ja) | 1991-11-12 |
| SG44408A1 (en) | 1997-12-19 |
| EP0440332B1 (en) | 1997-12-17 |
| KR930006723B1 (ko) | 1993-07-23 |
| AU631709B2 (en) | 1992-12-03 |
| CN1053863A (zh) | 1991-08-14 |
| KR910015043A (ko) | 1991-08-31 |
| US4988636A (en) | 1991-01-29 |
| EP0440332A2 (en) | 1991-08-07 |
| DE69128434D1 (de) | 1998-01-29 |
| MY106061A (en) | 1995-03-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C15 | Extension of patent right duration from 15 to 20 years for appl. with date before 31.12.1992 and still valid on 11.12.2001 (patent law change 1993) | ||
| OR01 | Other related matters | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 19930107 Termination date: 20100127 |