CN101962774A - Etching device and etching method - Google Patents
Etching device and etching method Download PDFInfo
- Publication number
- CN101962774A CN101962774A CN2009103048374A CN200910304837A CN101962774A CN 101962774 A CN101962774 A CN 101962774A CN 2009103048374 A CN2009103048374 A CN 2009103048374A CN 200910304837 A CN200910304837 A CN 200910304837A CN 101962774 A CN101962774 A CN 101962774A
- Authority
- CN
- China
- Prior art keywords
- etched
- etching
- jet pipe
- etching solution
- etching system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention relates to an etching device and an etching method. The etching device comprises a spray pipe and a liquid scrapping device, wherein the spray pipe is provided with a plurality of spray heads; the plurality of spray heads are used for spraying etching liquid to a surface to be etched of a circuit substrate; and the liquid scrapping device is used for scrapping the etching liquid deposited in a center area of the surface to be etched out of the surface to be etched in a sliding mode. The etching method comprises the following steps of: using the plurality of spray heads arranged on the spray pipe to spray the etching liquid towards the surface to be etched of the circuit substrate; and using the liquid scrapping device to scrap the etching liquid deposited in the center area of the surface to be etched out of the surface to be etched in a sliding mode. The etching method can avoid generating water pit effect.
Description
Technical field
The present invention relates to the etching technique field, relate in particular to a kind of etching system and engraving method that is used for the circuit card etch process.
Background technology
Etching process is the basic working procedure of board production, is meant to adopt etching solution that circuit substrate is not etched away by the copper that resist layer is protected, and finally forms the process of conducting wire.
Develop rapidly along with electronic technology, the circuit card integrated level is more and more higher, the conducting wire of circuit card makes more and more meticulouslyr, and this requires the tolerance of dimension of conducting wire of same circuit card as far as possible little, and promptly the etch effect in the etch process need be consistent as far as possible.
The level of automation of the wet production line of level is higher, and cost is lower, is extensive use of in board production.This process using horizontal roller drives circuit substrate, utilizes the linear jet tube etching system that is provided with a plurality of shower nozzles to spray etching solution simultaneously to the circuit substrate upper and lower surface.
Yet, when using this etching system,, etching solution is flowed out outside the plate from the marginarium of circuit substrate, and accumulate at the circuit substrate middle section because unanimity is pressed in the spray of each shower nozzle to the circuit substrate etching, form the pond, produce pool effect.This pool effect can make the etching solution of circuit substrate middle section upgrade slower, the etching liquid film that accumulates can reduce the erosion amount of stinging to circuit, the circuit etching deficiency takes place easily, and the etching solution velocity of flow of circuit substrate marginarium part is fast, upgrade comparatively fast, circuit takes place easily cross erosion.That is, this pool effect can cause the circuit substrate etching inhomogeneous, causes the line width inequality of the circuit card that finally makes especially easily, and the conducting wire line of middle section.For obtaining enough live widths, have to the circuit in board edge district is reserved unnecessary live width, greatly reduce the line density of circuit card.
Therefore, be necessary to provide a kind of etching system and engraving method of avoiding producing the puddle effect.
Summary of the invention
Below be a kind of etching system and engraving method that improves etch uniformity and leveling board etching precision of example explanation with embodiment.
This etching system comprises the jet pipe that is provided with a plurality of shower nozzles and scrapes liquid device.A plurality of shower nozzles are used for etching solution is injected into the surface to be etched of circuit substrate.This is scraped the etching solution that liquid device will be deposited on this surface to be etched middle section slidably and scrapes this surface to be etched.
This engraving method comprises: utilize a plurality of shower nozzles of being located at jet pipe to spray etching solution to the circuit substrate surface to be etched; Utilization is scraped the etching solution that liquid device will be deposited on this surface to be etched middle section slidably and is scraped this surface to be etched.
Compared with prior art, the etching system that the technical program provides adopts in real time to be scraped the etching solution that liquid device will be deposited on the circuit substrate middle section slidably and scrapes this etching face, avoid pool effect to produce, the renewal speed of etching solution is identical everywhere thereby guarantee to treat etched surfaces by circuit substrate, the etching speed unanimity.
Description of drawings
Fig. 1 is the synoptic diagram of the etching system that provides of the technical program first embodiment.
Fig. 2 is the synoptic diagram of the etching system that provides of the technical program second embodiment.
Fig. 3 is the synoptic diagram of the etching system that provides of the technical program the 3rd embodiment.
Fig. 4 utilizes etching system shown in Figure 1 etching solution to be injected into the synoptic diagram of circuit substrate.
Embodiment
Below in conjunction with drawings and Examples etching system and the engraving method that the technical program provides is elaborated.
Consult Fig. 1, the etching system 100 that the technical program first embodiment provides comprises 10, four jet pipes 20 of two tubings, pump 11a, 11b, and valve 12a, 12b scrape liquid device 30 and control device 40.
This two tubings 10 relatively and be arranged in parallel.Each tubing 10 communicates with liquid storage tank (figure does not show), carries etching solution by pump 11a, 11b in four jet pipes 20 respectively.
These four jet pipes 20 are arranged in parallel, and the two ends of every jet pipe 20 communicate with a tubing 10 respectively, make thus etching solution can be from liquid storage tank via tubing 10 streams from jet pipe 20.Every jet pipe 20 is provided with a plurality of shower nozzles 21, is used for etching solution is sprayed onto the circuit substrate surface to be etched.
Scrape liquid device 30 and comprise anchor 31 and scraping fluid part 32.Anchor 31 is skeleton construction, and it comprises the many bodies of rod that are arranged in parallel 311.Scraping fluid part 32 is fixed in the same side of each body of rod 311, and it is the same direction extend perpendicular away from the body of rod 311 from the body of rod 311 courts.Scraping fluid part 32 is done the time spent being subjected to external force, and the reversibility elastic deformation can take place.In the present embodiment, scraping fluid part 32 is the hairbrush shape.Under the drive unit driving of (figure does not show), scraping liquid device 30 can be with respect to shower nozzle 21 motion.For example, scrape the below that liquid device 30 can move to jet pipe 20 earlier, and relative jet pipe 20 is done the motion of any direction in two tubings 10 and four jet pipes 20 surround the space of formation.
In addition, in the etching system 100 of present embodiment, the radical of tubing 10 and jet pipe 20, the mutual alignment relation of many tubings 10, the mutual alignment relation of many jet pipes 20, tubing 10 is not limited thereto with the interconnected relationship of jet pipe 20, as long as tubing 10 communicates with jet pipe 20, can satisfy etching solution from tubing 10 stream from jet pipe 20, and eject from shower nozzle 21 and to get final product.
Referring to Fig. 2, the technical program second embodiment provides etching system 200 to have the structure roughly the same with etching system 100, and its difference is that etching system 200 further comprises pressurizing device 250 and the 3rd jet pipe 260.The 3rd jet pipe 260 connects how much central parts of each jet pipe 220 in each jet pipe 220, and communicates with each jet pipe 220.Pressurizing device 250 is a pump, and it injects etching solution by the 3rd jet pipe 260 in jet pipe 220, thereby improves the spraying pressure of jet pipe 220 central parts, further avoids etching solution to be deposited on the middle section of circuit substrate surface to be etched.
In addition, can also utilize pressurizing device 250 in jet pipe 220, to inject air, oxygen etc. and can promote the gas that etching reaction carries out, thereby make the spraying pressure of the shower nozzle relative be higher than the spraying pressure relative with this surface to be etched fringe region with circuit substrate surface to be etched middle section by the 3rd jet pipe 260.Thus, the etching solution that contains above-mentioned gas that is injected into circuit substrate surface to be etched middle section has stronger etch capabilities, and etching speed is faster, thereby further eliminates the puddle effect of surface to be etched middle section.
Referring to Fig. 3, the technical program the 3rd embodiment provides etching system 300 similar to etching system 200, and difference is that pressurizing device 350 is a resistance wire, and it is wound in jet pipe 320 and the relative position of circuit substrate surface to be etched middle section.When flowing through etching solution in the jet pipe 320,350 pairs of corresponding with it etching solutions of pressurizing device heat, make its temperature high slightly, thereby make this partially-etched liquid expanded by heating increased pressure, be located at the shower nozzle jet velocity at this surface to be etched middle section relative position place comparatively fast, corresponding, the etching solution turnover rate of surface to be etched middle section is accelerated, etching speed increases, and can offset the puddle effect.
In addition, pressurizing device 350 is not limited to resistance wire, can be common other in this area and has the device of heating function, as long as can heat the interior etching solution of the part jet pipe relative with circuit substrate surface to be etched middle section 320.
More than etching system that the technical program is provided have been described in detail, will be example to adopt etching system 100 etched circuit substrates 500 below, the engraving method that the technical program provides is described.This circuit substrate 500 has surface to be etched 501, and its defeated material direction is the R direction as shown in Figure 4.
Please in the lump referring to Fig. 1,4, the engraving method that present embodiment provides may further comprise the steps:
The first step: utilize shower nozzle 21 to treating etched circuit substrate 500 jet surface etching solutions.
Particularly, need at first Open valve 12a, 12b utilizes control device 40 control pump 11a, and 11b carries etching solution through tubing 10 in jet pipe 20 in a certain predetermined amount of time.In case circuit substrate 500 moves to shower nozzle 21 belows, utilize shower nozzle 21 that surface to be etched 501 is sprayed etching solution immediately.When the time that shower nozzle 21 sprays etching solutions exceeds this predetermined amount of time, valve-off 12a immediately, 12b.For the circuit card etch process, often adopt cuprous chloride solution as etching solution.
Second step: utilize and to scrape the etching solution that liquid device 30 will be deposited on surface to be etched 501 middle sections slidably and scrape surface to be etched 501.
Particularly, in case valve-off 12a, 12b, control device 40 is controlled the driving mechanism of scraping liquid device 30 immediately, make and scrape liquid device 30 and move between shower nozzle 21 and the circuit substrate 500, and towards near the direction motion for the treatment of etched circuit substrate 500, contact with surface to be etched 501 until scraping fluid part 32, scraping fluid part 32 is slided in this surface to be etched 501.Wherein, scraping fluid part 32 can slide along the direction identical with defeated material direction R, also can also can do the slip of any direction in surface to be etched 501 along sliding with the vertical direction of defeated material direction R.Thus, scraping fluid part 32 can scrape surface to be etched 501 with being deposited on the etching solution for the treatment of etched circuit substrate 500 central authorities, avoids producing the puddle effect.
After treating that scraping fluid part 32 is finished the scraping fluid action, scraping liquid device 30 will be under the driving of drive unit, and slippage goes out surface to be etched 501.In case scraping fluid part 32 shifts out surface to be etched 501, shower nozzle 21 sprays etching solutions to surface to be etched 501 immediately once more, so circulation, thus make and treat etched surfaces by circuit substrate the renewal speed of etching solution is identical everywhere, the etching speed unanimity.
What deserves to be mentioned is, when etching system 300 etched circuit substrates that the etching system 200 that adopts the technical program second embodiment to provide or the 3rd embodiment provide, this engraving method further comprises and utilizes pressurizing device 250,350 increase jet pipe 220, pressure in 320, make the spraying pressure of the shower nozzle relative greater than the spraying pressure of the shower nozzle relative with surface to be etched 501 fringe regions with surface to be etched 501 middle sections, jet pipe 220 thus, the etching solution that 320 shower nozzles relative with surface to be etched 501 middle sections spray is more obvious to the erosion effect on circuit substrate surface, the etching solution turnover rate of surface to be etched 501 middle sections improves, etching speed improves, but the puddle effect of raising bucking circuit plate 16 middle bodies of this partially-etched speed, thereby obtain uniform etch effect at circuit substrate 500 whole surfaces to be etched 501.If inject air or oxygen, the existence of oxygen can be quickened the carrying out of etching reaction, also can offset the puddle effect thus.
More than the etching system and the engraving method of the technical program are described in detail, but can not be interpreted as it is restriction to the technical program design.For the person of ordinary skill of the art, can make other various corresponding changes and distortion, and all these change the protection domain that all should belong to the application's claim with distortion according to the technical conceive of the technical program.
Claims (9)
1. etching system, it comprises the jet pipe that is provided with a plurality of shower nozzles, these a plurality of shower nozzles are used for etching solution is injected into the circuit substrate surface to be etched, it is characterized in that, this etching system also comprises scrapes liquid device, and this is scraped the etching solution that liquid device will be deposited on this surface to be etched middle section slidably and scrapes this surface to be etched.
2. etching system as claimed in claim 1 is characterized in that, this scrapes the scraping fluid part that liquid device comprises anchor and is fixed in this anchor.
3. etching system as claimed in claim 2 is characterized in that this anchor comprises the many bodies of rod, and each body of rod is fixed with a plurality of scraping fluid parts.
4. etching system as claimed in claim 1 is characterized in that this etching system further comprises control device, and this control device is used for these a plurality of shower nozzles of control and this scrapes alternately running of liquid device.
5. etching system as claimed in claim 1, it is characterized in that, this is scraped liquid device and further comprises pressurizing device, this pressurizing device links to each other with jet pipe, be used to increase the spraying pressure in the jet pipe, so that the spraying pressure of the shower nozzle relative with this surface to be etched middle section is higher than the spraying pressure of the shower nozzle relative with this surface to be etched fringe region.
6. etching system as claimed in claim 5 is characterized in that this pressurizing device is a well heater, is installed on jet pipe and surface to be etched middle section opposite position, and this well heater is used to heat the etching solution in the jet pipe, thereby increases the spraying pressure in the jet pipe.
7. engraving method, comprise and utilize a plurality of shower nozzles of being located at jet pipe to spray etching solution to the circuit substrate surface to be etched, it is characterized in that this engraving method also comprises utilizing to be scraped the etching solution that liquid device will be deposited on the surface to be etched middle section slidably and scrape this surface to be etched.
8. engraving method as claimed in claim 7 is characterized in that, this engraving method comprises that further adopting control device these a plurality of shower nozzles of control and this to scrape liquid device alternately operates.
9. engraving method as claimed in claim 7, it is characterized in that, this engraving method further comprises and utilizes pressurizing device to increase pressure in this jet pipe, makes the spraying pressure of the shower nozzle relative with this surface to be etched middle section greater than the spraying pressure of the shower nozzle relative with the surface to be etched fringe region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910304837A CN101962774B (en) | 2009-07-24 | 2009-07-24 | Etching device and etching method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910304837A CN101962774B (en) | 2009-07-24 | 2009-07-24 | Etching device and etching method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101962774A true CN101962774A (en) | 2011-02-02 |
| CN101962774B CN101962774B (en) | 2012-10-17 |
Family
ID=43515820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910304837A Expired - Fee Related CN101962774B (en) | 2009-07-24 | 2009-07-24 | Etching device and etching method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101962774B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105195381A (en) * | 2015-10-28 | 2015-12-30 | 深圳市华星光电技术有限公司 | Spray apparatus and method thereof |
| CN106900140A (en) * | 2015-12-21 | 2017-06-27 | 上海申和热磁电子有限公司 | One kind keeps covering the uniform method of copper particle spacing dimension and substrate on copper ceramic substrate |
| CN111508874A (en) * | 2020-04-27 | 2020-08-07 | 南昌欧菲显示科技有限公司 | Spray pipe mounting assembly and etching device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4985111A (en) * | 1990-03-02 | 1991-01-15 | Chemcut Corporation | Process and apparatus for intermittent fluid application |
| DE19524562A1 (en) * | 1995-07-06 | 1997-01-09 | Schmid Gmbh & Co Geb | Device for treating flexible plate or sheet-shaped objects, in particular printed circuit boards |
| CN101113523B (en) * | 2006-07-28 | 2010-10-06 | 富葵精密组件(深圳)有限公司 | Etching liquid injection apparatus and etching method |
-
2009
- 2009-07-24 CN CN200910304837A patent/CN101962774B/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105195381A (en) * | 2015-10-28 | 2015-12-30 | 深圳市华星光电技术有限公司 | Spray apparatus and method thereof |
| CN106900140A (en) * | 2015-12-21 | 2017-06-27 | 上海申和热磁电子有限公司 | One kind keeps covering the uniform method of copper particle spacing dimension and substrate on copper ceramic substrate |
| CN106900140B (en) * | 2015-12-21 | 2019-03-05 | 上海申和热磁电子有限公司 | The uniform method of copper particle spacing dimension and substrate on copper ceramic substrate are covered in a kind of holding |
| CN111508874A (en) * | 2020-04-27 | 2020-08-07 | 南昌欧菲显示科技有限公司 | Spray pipe mounting assembly and etching device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101962774B (en) | 2012-10-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102357541A (en) | Method and system for cleaning surface of strip steel through hot-water circulation | |
| CN101962774A (en) | Etching device and etching method | |
| KR100713235B1 (en) | Apparatus for treating surface of thin plate | |
| CN103255416B (en) | A kind of engraving method and etch-polish liquid used thereof | |
| KR101335885B1 (en) | Substrate processing apparatus with a non-contact floating transfer system | |
| CN102615830A (en) | Rapid molding method based on electrorheological fluid, and apparatus thereof | |
| KR101572340B1 (en) | Film removal method, film removal nozzle, and film removal device | |
| CN102921663A (en) | Method and device for cleaning nozzles of alignment film printer | |
| CN104275276A (en) | Slit nozzle and method of manufacturing display apparatus using the same | |
| CN101113522A (en) | Spraying device for printed circuit board etching | |
| JP2016094645A (en) | Etching device | |
| CN103731996A (en) | Etching method and device for workpiece conducting reciprocating motion in etching region | |
| CN104786630B (en) | A kind of gravure, its production method and application | |
| CN102256447B (en) | Etching device and circuit board etching method | |
| JPH0645733A (en) | Apparatus for supply of fluid to substrate and substrate treatment method | |
| KR20180028979A (en) | Descaler | |
| TWI312816B (en) | Approach and apparatus for etching a substrate in an etching fluid | |
| Liu et al. | Receding dynamics of droplet deposition on a smooth surface from a central jet to secondary droplet emission | |
| CN103964700B (en) | Applying device and coating method | |
| CN105170984A (en) | Three-dimensional printing device and control method thereof | |
| CN206716576U (en) | Wet etching cleaning device and wet etching equipment | |
| TWI439197B (en) | Etching apparatus and etching method | |
| JP2003045844A (en) | Substrate treatment apparatus | |
| JPH0448085A (en) | Etching and developing method | |
| CN202983958U (en) | Plate material surface processing device used for wet manufacture procedure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent for invention or patent application | ||
| CB02 | Change of applicant information |
Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant after: Fuku Precision Components (Shenzhen) Co.,Ltd. Co-applicant after: Zhending Technology Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co.,Ltd. Co-applicant before: Honsentech Co., Ltd. |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO Free format text: FORMER OWNER: FUKUI PRECISION ASSEMBLY (SHENZHEN) CO., LTD. Effective date: 20140904 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518103 SHENZHEN, GUANGDONG PROVINCE TO: 066000 QINHUANGDAO, HEBEI PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20140904 Address after: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Patentee after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Patentee after: Zhending Technology Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co.,Ltd. Patentee before: Zhending Technology Co., Ltd. |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20161228 Address after: 225000 Jiangsu city in Yangzhou Province Economic Development Zone Gaoyou Ling Road Patentee after: Jiangsu Transimage Technology Co.,Ltd. Address before: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Patentee before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Patentee before: Zhen Ding Tech. Co.,Ltd. |
|
| CB03 | Change of inventor or designer information |
Inventor after: Zou Weimin Inventor after: Mao Wuyun Inventor after: Meng Yuting Inventor before: Bai Yaowen Inventor before: Tang Pan Inventor before: Li Xiaoping |
|
| COR | Change of bibliographic data | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121017 Termination date: 20170724 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |