CN101950725A - Automatic packing equipment control system - Google Patents
Automatic packing equipment control system Download PDFInfo
- Publication number
- CN101950725A CN101950725A CN201010242105XA CN201010242105A CN101950725A CN 101950725 A CN101950725 A CN 101950725A CN 201010242105X A CN201010242105X A CN 201010242105XA CN 201010242105 A CN201010242105 A CN 201010242105A CN 101950725 A CN101950725 A CN 101950725A
- Authority
- CN
- China
- Prior art keywords
- controller
- press
- automatic
- control
- manipulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses an automatic packing equipment control system, which comprises a control center computer, wherein the control center computer is communicated with a feeding controller, a discharge controller, a press controller, a manipulator controller and a channel removal controller through an Ethernet respectively; and the feeding controller, the discharge controller, the press controller, the manipulator controller and the channel removal controller are intercommunicated through the Ethernet. The full automatic equipment integrates automatic control technology, automatic packing equipment and semiconductor device packing process, and integrates multiple process controls such as temperature control, pressure control, pressure intensity control and the like. The system can automatically finish the whole process from plate (lead frame) charging, pre-heating, feeding (plastic packing material), die assembly packing, discharging (packed products), die cleaning and de-gluing to receiving and the like.
Description
Technical field
The present invention relates to a kind of automatic encapsulation control field, especially a kind of automatic sealed in unit control system.
Technical background
Automatically package system is the back processing apparatus in integrated circuit/semiconductor device produced in series link.The full armrest dynamic compressor of current domestic microelectronics Packaging industry is finished the work, and the dependence of the product confrontation equipment of encapsulating products requires than higher, and high-end more product sealed in unit requires high more.High-end product is harsh especially to environmental requirement, and dustless, this is that manual package system can't be finished.In addition, manually package system is also powerless to the runner processing, must join except that the runner machine manually rewinding.
Summary of the invention
The purpose of this invention is to provide a kind of automatic sealed in unit control system that can realize electronic component and the full-automatic encapsulation of chip.
The technical scheme of technical solution problem of the present invention is: a kind of automatic sealed in unit control system, comprise control centre's computer, control centre's computer by Ethernet respectively with material loading controller, blanking controller, press controller, manipulator controller, remove the runner controller and communicate by letter, material loading controller, blanking controller, press controller, manipulator controller, remove between the runner controller by the mutual communication of Ethernet.
The present invention compared with prior art, the present invention integrates automatic control technology, automatically sealed in unit, semiconductor packages technology, various procedures such as the control of collection temperature, pressure control, pressure control are controlled in the fully-automatic equipment of one.The present invention can finish automatically from whole operation actions such as last slice (lead frame), preheating, charging (plastic packaging material), material loading (plastic packaging material), matched moulds encapsulation, discharging (product of encapsulation), clear mould, the rewindings of removing photoresist.
Description of drawings
Fig. 1 is a circuit block diagram of the present invention.
Embodiment
A kind of automatic sealed in unit control system, comprise control centre's computer 1, control centre's computer 1 by Ethernet respectively with material loading controller 2, blanking controller 3, press controller 4, manipulator controller 5, remove runner controller 6 and communicate by letter, material loading controller 2, blanking controller 3, press controller 4, manipulator controller 5, remove between the runner controller 6 by the mutual communication of Ethernet, as shown in Figure 1.The Ethernet of technical grade can be realized between a plurality of controllers, high speed communication between a plurality of controller and the control centre's computer 1.
In conjunction with Fig. 1, described material loading controller 2, blanking controller 3, press controller 4, manipulator controller 5 and remove runner controller 6 and all adopt Programmable Logic Controller.Described press controller 4 comprises first, second, third and fourth press controller, all independent and extraneous communications by Ethernet of first, second, third and fourth press controller.The present invention controls a plurality of controllers with control centre's computer 1, again by a plurality of controller control servomotors, servomotor is respectively feeding manipulator (X-axis, Y-axis), blanking manipulator (X-axis, Y-axis), magazine lift, screening machinery system hand, resin permutation, the collection manipulator that removes photoresist, the lifting of collection magazine, press unit motor (every two motors of forcing press motor).
In conjunction with Fig. 1, the present invention also comprises monitor 7, monitor 7 by Ethernet respectively with control centre computer 1, material loading controller 2, blanking controller 3, press controller 4, manipulator controller 5, remove runner controller 6 and intercom mutually, as shown in Figure 1.Monitor 7 real-time display device work at present states, each mold temperature value, clamping pressure, curing time etc.; Select operating mode empty runs, automatic, semi-automatic, the local operation of input module, the local operation of output module, clear mould etc.; Set encapsulation parameter, mold temperature, clamping pressure, injection multistage speed, injection pressure, inject time, curing time etc.; The storage of system parameters and download, encapsulation parameter, motor operating parameter etc.; The display device operation is reported to the police and is reported to the police in the past; The report of generation parameter, packaging technology parameter, error report, Action Events report, SPC, SQC etc.Utilize man-machine dialog interface to carry out parameter setting, production tracking, fault demonstration and maintenance, by sound, light, electric alarm signal realization safeguard protection.
Claims (4)
1. automatic sealed in unit control system, it is characterized in that: comprise control centre's computer (1), control centre's computer (1) by Ethernet respectively with material loading controller (2), blanking controller (3), press controller (4), manipulator controller (5), remove runner controller (6) and communicate by letter, material loading controller (2), blanking controller (3), press controller (4), manipulator controller (5), remove and pass through the mutual communication of Ethernet between the runner controller (6).
2. automatic sealed in unit control system according to claim 1, it is characterized in that: also comprise monitor (7), monitor (7) by Ethernet respectively with control centre's computer (1), material loading controller (2), blanking controller (3), press controller (4), manipulator controller (5), remove runner controller (6) and intercom mutually.
3. automatic sealed in unit control system according to claim 1 and 2 is characterized in that: described material loading controller (2), blanking controller (3), press controller (4), manipulator controller (5) and remove runner controller (6) and all adopt Programmable Logic Controller.
4. automatic sealed in unit control system according to claim 1 and 2, it is characterized in that: described press controller (4) comprises the, two, three, four press controllers, first, second, third and fourth press controller all by Ethernet independent with extraneous communication.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010242105XA CN101950725A (en) | 2010-07-20 | 2010-07-20 | Automatic packing equipment control system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010242105XA CN101950725A (en) | 2010-07-20 | 2010-07-20 | Automatic packing equipment control system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101950725A true CN101950725A (en) | 2011-01-19 |
Family
ID=43454169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010242105XA Pending CN101950725A (en) | 2010-07-20 | 2010-07-20 | Automatic packing equipment control system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101950725A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111268409A (en) * | 2020-03-25 | 2020-06-12 | 铜陵富仕三佳机器有限公司 | Automatic plastic packaging system and automatic plastic packaging process by utilizing cooperative robot |
| CN116013813A (en) * | 2023-01-06 | 2023-04-25 | 苏州赛肯智能科技有限公司 | Full-automatic packaging system |
| CN117075555A (en) * | 2023-08-24 | 2023-11-17 | 太极半导体（苏州）有限公司 | System-in-package equipment operation supervision system based on Internet of things |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1149526A (en) * | 1995-08-23 | 1997-05-14 | 山田尖端技术株式会社 | Automatic molding machine using release film |
| KR20010068229A (en) * | 2000-01-03 | 2001-07-23 | 윤종용 | System for controlling a manufacturing semiconductor |
| US6347655B1 (en) * | 1999-11-02 | 2002-02-19 | Mitsubishi Denki Kabushiki Kaisha | Die bonding device and semiconductor device |
| US20040105909A1 (en) * | 2002-11-29 | 2004-06-03 | Shigeyuki Tofukuji | Resin molding machine |
-
2010
- 2010-07-20 CN CN201010242105XA patent/CN101950725A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1149526A (en) * | 1995-08-23 | 1997-05-14 | 山田尖端技术株式会社 | Automatic molding machine using release film |
| US6347655B1 (en) * | 1999-11-02 | 2002-02-19 | Mitsubishi Denki Kabushiki Kaisha | Die bonding device and semiconductor device |
| KR20010068229A (en) * | 2000-01-03 | 2001-07-23 | 윤종용 | System for controlling a manufacturing semiconductor |
| US20040105909A1 (en) * | 2002-11-29 | 2004-06-03 | Shigeyuki Tofukuji | Resin molding machine |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111268409A (en) * | 2020-03-25 | 2020-06-12 | 铜陵富仕三佳机器有限公司 | Automatic plastic packaging system and automatic plastic packaging process by utilizing cooperative robot |
| CN116013813A (en) * | 2023-01-06 | 2023-04-25 | 苏州赛肯智能科技有限公司 | Full-automatic packaging system |
| CN116013813B (en) * | 2023-01-06 | 2023-10-10 | 苏州赛肯智能科技有限公司 | Full-automatic packaging system |
| CN117075555A (en) * | 2023-08-24 | 2023-11-17 | 太极半导体（苏州）有限公司 | System-in-package equipment operation supervision system based on Internet of things |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103660138B (en) | The manufacture method of polychrome formed products and injection molding system | |
| CN101989535B (en) | All-in-one machine of semiconductor device for testing, sorting, marking and braiding and one-stop processing method | |
| CN1082425C (en) | Injection molding apparatus and method | |
| CN103522289B (en) | Multi-shaft mechanical arm control method and control device | |
| CN104890197A (en) | Automatic cutting system and method for gate of injection part | |
| CN201741028U (en) | Control system of automatic encapsulation device | |
| CN101950725A (en) | Automatic packing equipment control system | |
| CN110497577A (en) | A kind of semiconductor components and devices encapsulation automation adapted to injection system and its working method | |
| CN110112454B (en) | Full-automatic soft-package Bluetooth button battery packaging equipment and packaging technology thereof | |
| CN102089130B (en) | For equipment and the method for sawing electronic components | |
| CN105014871A (en) | Doll injection molding equipment and automatic feeding and discharging injection molding method thereof | |
| CN103722663A (en) | Precision hardware processing device and processing method | |
| CN208033658U (en) | Die Casting Workshop | |
| JP2932136B2 (en) | Method and apparatus for resin sealing molding of electronic parts | |
| CN106426728A (en) | Automatic injection molding production system and method for toothbrush handles | |
| CN102962968B (en) | Framework and control method of configuring manipulator on more than two injection moulding machines for production | |
| JP2021031302A (en) | System and method for smart automatically exchanging metal-die | |
| CN105094023A (en) | Servo injection molding machine control system and method | |
| CN206327612U (en) | A kind of steamed stuffed bun packing linear system system based on robot | |
| CN207415347U (en) | The light loading robotics people of double-circuit | |
| CN212723228U (en) | Full-automatic detection equipment for miniature armature core | |
| CN107538473A (en) | The light loading robotics people of double-circuit and double-circuit switching control method | |
| CN111354651A (en) | Semiconductor plastic package automatic feeding system and control method thereof | |
| JP2932137B2 (en) | Method and apparatus for resin sealing molding of electronic parts | |
| CN206259367U (en) | A kind of solar silicon wafers are counted and plastic packaging integral system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110119 |