CN101927603B - 打印头系统 - Google Patents

打印头系统 Download PDF

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CN101927603B
CN101927603B CN2010102425633A CN201010242563A CN101927603B CN 101927603 B CN101927603 B CN 101927603B CN 2010102425633 A CN2010102425633 A CN 2010102425633A CN 201010242563 A CN201010242563 A CN 201010242563A CN 101927603 B CN101927603 B CN 101927603B
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pumping chamber
nozzle
print head
nozzle plate
printhead
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CN101927603A (zh
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安德烈亚斯·比布尔
梅尔文·L·比格斯
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富士胶卷迪马蒂克斯股份有限公司
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Abstract

本发明涉及一种打印头系统,其包括打印头模块,该打印头模块包括打印头体(102),喷嘴板(110)和一个或多个压电致动器(120)。打印头体包括一个或多个增压室(104),其中每个增压室包括用以从打印液体源接收打印液体的接收端和用以将打印液体从增压室中喷出的喷射端。喷嘴板包括形成为通过所述喷嘴板的一个或多个喷嘴(112)。每个喷嘴可与增压室流体连通并接收从喷嘴喷出的打印液体。所述一个或多个压电致动器与喷嘴板相连。压电致动器设置于每个增压室上方并包括构造成偏转并使增压室增压的压电材料,以便从与增压室的喷射端流体连通的相应喷嘴喷射打印液体。

Description

打印头系统

[0001] 本申请是名称为“打印头模块”、申请日为2005年12月16日、申请号为200580048360. 8 (PCT 申请号:PCT/US2005/045672 ;第一次分案申请号:200810179776. 9)的发明专利申请的分案申请。

技术领域

[0002] 以下描述涉及包含一个或多个喷嘴的打印头组件。背景技术

[0003] 喷墨打印机通常包括从墨水源到墨水喷嘴组件的墨水路径,所述组件包括喷出墨滴的喷嘴。通过利用例如可以是压电偏转器,热气泡喷注发生器,或静电偏转元件的致动器使墨水路径中的墨水增压以控制墨滴喷射。典型的打印头具有具备相应的墨水路径阵列和相关致动器的喷嘴线,并可独立控制每个喷嘴的墨滴喷射。在所谓的“基于要求滴落”的打印头中,当打印头和打印介质相对彼此移动时,启动每个致动器以选择性地将墨滴喷射在图像的特定像素位置。在高性能打印头中,喷嘴典型地具有50微米或更小(例如25微米)的直径,并以每英寸100-300喷嘴的间距分开,且提供近乎1至70皮米(pi)或更小的墨滴尺寸。墨滴喷射频率通常为IOKHz或更高。

[0004] 打印头包括半导体打印头和压电致动器,例如,Hoisington等人的美国专利No. 5,265,315中所描述的打印头。打印头体可由硅制成,其被刻蚀以限定墨水腔。喷嘴可由安装在硅体上的单独喷嘴板限定。压电致动器具有根据施加的电压改变几何结构或进行弯曲的压电材料层。压电层的弯曲对沿着墨水路径安置的增压室内的墨水加压。

[0005] 打印准确度受许多因素影响,包括打印机中的打印头或多个打印头中喷嘴所喷射的墨滴的尺寸和速度的均勻性。墨滴尺寸和墨滴速度的均勻性反过来受一些因素影响,如墨水路径的尺寸均勻性,声波干扰效应,墨水流路中的污物,以及致动器产生的压力脉冲的均勻性。墨水流中的污物或碎片通过在墨水流路中使用一个或多个过滤器来减少。

发明内容

[0006] 本发明描述包含一个或多个喷嘴的打印头组件。通常,在一个方面中,本发明以包含打印头体、喷嘴板和一个或多个压电致动器的打印头为特色。打印头体包括一个或多个增压室,其中每个增压室包括构造用以从打印液体源接收打印液体的接收端和用于喷射增压室中打印液体的喷射端。喷嘴板包括形成通过喷嘴板的一个或多个喷嘴。每个喷嘴与增压室流体连通并从增压室的喷射端接收打印液体以从喷嘴进行喷射。一个或多个压电致动器与喷嘴板相连。压电致动器位于每个增压室上方并包括构造以偏转并对增压室增压的压电材料,以便从与增压室喷射端流体连通的相应喷嘴喷射打印液体。

[0007] 本发明的实施可包括一个或多个以下特征。打印头模块包含在打印头系统中,所述系统包括与打印头模块的喷嘴面相连的柔性电路。柔性电路与一个或多个压电致动器电连接以便为一个或多个压电致动器提供信号,以选择性地对一个或多个增压室增压进而启动一个或多个相应喷嘴。

[0008] 打印头模块包括与喷嘴板相连且包括与形成通过喷嘴板的一个或多个喷嘴相连的一个或多个孔的盖。所述盖被构造以覆盖一个或多个压电致动器同时为一个或多个致动器中包含的压电材料在激励时提供足够的间隙。

[0009] 打印头模块包括打印液体供给组件,其中打印液体供给组件包括与增压室的接收端流体连通的容器。打印头体包括基本平行于与喷嘴板相连的喷嘴面的背面。打印液体供给组件与打印头体的背面相连,并且增压室的接收端包括打印头体背面上与容器流体连通的开口。

[0010] 打印头模块包括多个增压室,并且还包括至少一个形成在打印头体背面中的打印液体通道。打印液体通道与增压室的开口以及容器流体连通。打印液体从容器进入打印液体通道并被引入增压室的开口。在一种实施方式中,打印液体通道包括朝向增压室的开口成角度的至少两个侧边。

[0011] 实施本发明以实现一个或多个以下优点。以比现有技术的打印头模块使用较少的硅和更少的制造步骤制造打印头模块,例如,相比于打印头体的喷嘴面,打印头模块包括位于打印头体背面上的压电层。能够减少所需的刻蚀时间,进而减少了制造时间。例如,相比于消耗较长时间的Bosch工艺,可利用KOH刻蚀工艺刻蚀打印头模块中包含的墨水通道。根据其他特征,打印头体的喷嘴面上的压电层可从打印头体的背面上去除。例如,加热器可集成在打印头体的背面中。

[0012] 相比于沿着打印头体的侧边,墨水源能从背面将墨水送进打印头体内包含的增压室。从打印头体的背面将墨水送入增压室内促进了增压室的注入,正如增压室可通过毛细管作用填充。另外,从墨水源进入增压室的路径长度比如果墨水通过增压室的侧面进入要短,进而提供了提高的响应频率。此外,相比于在侧面,在背面上设置墨水通道能促进打印头模块在外壳上的粘合。利用较少的层制造打印头模块,进而减少跨越模块的厚度变化。

[0013] 在以下附图和说明中阐述一个或更多实施的细节。根据说明和附图以及权利要求使得其他特征和优点变得清楚。

附图说明

[0014] 参照以下附图详细描述这些和其他方面。

[0015] 图1示出了部分的打印头。

[0016] 图2以打印头体顶面上部分喷嘴板的剖视图示出了图1中部分打印头体的剖视图。

[0017] 图3A示出了包括其上具有电连接器部分的压电层的部分打印头组件,所述压电层位于图2中部分打印头体和喷嘴板的顶部上。

[0018] 图;3B为图3A的打印头组件沿线A-A的截面图。

[0019] 图3C为图3A的打印头组件沿线B-B的截面图。

[0020] 图4示出了图3A中打印头的喷嘴面。

[0021] 图5A示出了图3A中打印头的背面。

[0022] 图5B示出了图5A中所示的背面的放大部分。

[0023] 图6示出了与图3A中打印头组件相连的柔性电路。[0024] 图7A和7B示出了包含图3A中打印液体源组件、柔性电路和打印头组件的打印头模块的透视图。

[0025] 图7C示出了图7B中的打印头模块沿线C-C的透视截面图。

[0026] 图7D示出了图7B中的打印头模块沿线D-D的透视截面图。

[0027] 图8A-8Q说明了制造打印头体的工艺。

[0028] 图9为示出了图8A-8Q中所说明的工艺步骤的流程图。

[0029] 图10为示出了用于组装打印头模块的流程图。

[0030] 图11为包括盖的打印头的部分截面图侧视图。[0031 ] 各个附图中的相同参考标记表示相同元件。

具体实施方式

[0032] 下面描述包括加压的增压室以选择从喷嘴喷射打印液体的打印头模块。典型的打印液体是墨水,为说明目的,以下将墨水用作打印液体描述打印头模块。可是,应当理解,打印液体可以是其他液体,例如液晶显示器制造中所使用的电致发光材料或电路板制造中使用的液态金属。

[0033] 打印头模块包括可选择启动以对增压室增压并从相应喷嘴喷射墨水的致动器。例如,在一个实施例中,通过对置于增压室上的压电材料施加电压启动致动器。所施加的电压引起压电材料偏转并对增压室增压,进而迫使增压室内的墨水从相应的喷嘴喷射出。电路为致动器提供驱动信号以控制喷嘴的喷射。压电材料和至少一些电路与喷嘴一样被设置在打印头模块的相同侧面上。打印头模块可包括打印头体、柔性电路和墨水供给组件。

[0034] 参照图1,示出了一个实施例的部分打印头体102。打印头体102由基底101、喷嘴板和压电层形成。基底101可以是半导体,例如MEMS硅片。在所示实施例中,打印头体102包括用于保持并通过多个喷嘴,例如300个喷嘴泵浦墨水的多个增压室104(仅示出了几个多重增压室)。应当理解,可包括更多或更少的喷嘴。

[0035] 利用现有技术熟知的刻蚀技术将增压室104刻蚀进入打印头体102。每个增压室104包括与墨水源流体连通的墨水接收端106,以及与喷嘴流体连通的墨水喷射端108。墨水通过墨水接收端106中的开口(未示出)进入增压室104。借助增压室104的增压,迫使墨水离开墨水喷射端108并从相应的喷嘴喷射出。以下将还描述用于对增压室104增压以“启动”喷嘴的示例性装置和示例性墨水供给组件。

[0036] 参照图2,示出了打印头体102的剖视图。示出了喷嘴板110位于基底101的顶部上,并且还以剖视图示出。喷嘴板Iio限定了多个喷嘴112。另外,厚度减少区域114形成在位于增压室104上方的喷嘴板110中。为说明目的,厚度减少的区域114被表示为喷嘴板110的开口,其中喷嘴板110最上层已经被切除。喷嘴112位于增压室104的墨水喷射端108上方并与其流体连通。阻抗部件(impedance feature) 105,如图2中所示的示例性柱子,可产生阻力以减少进入增压室104外部墨水的能量数量,以便防止增压室104的墨水回流,并且引导墨水流朝向并通过喷嘴112。

[0037] 图3A示出了打印头体102的剖视图,其包括基底101、喷嘴板110和位于喷嘴板110上的压电层116。示出了驱动接触122和驱动电极120位于压电层116的顶部上。每对驱动接触122和驱动电极120对应形成于基底101内的增压室104。在一个实施例中,驱动接触122和驱动电极120是金属迹线(trace),如金的迹线。如图所示,对应增压室104的位置切断压电层116。接地电极层117形成在喷嘴板110的顶表面,其具有切除区域以暴露喷嘴112。接地电极层117由金属,例如金形成,并为接地电极层117施加电压以在接地电极层117和驱动电极120之间产生电压差。

[0038] 驱动接触122能接收驱动信号以跨越压电层116施加电压以启动喷嘴。喷嘴板110的厚度减少区域114在每个增压室104上提供薄的隔板。通过驱动接触122接收的驱动信号引起对驱动电极120施加电压,进而跨越压电层施加电压。为接地电极层117施加不同的电压,例如较低的电压。驱动电极120和下面区域的接地电极层117之间的电压差引起喷嘴板中厚度减少区域114上的压电材料偏转并对下面增压室104内的墨水加压。

[0039] 图:3B为图3A中打印头组件沿线A-A的截面图。示出增压室104形成在基底101内并由喷嘴板110所包围。喷嘴板110在厚度减少区域114中的增压室104实体(substantial)部分上较薄。喷嘴112形成通过喷嘴板110并与增压室104流体连通。接地电极层117位于喷嘴板110和压电层116之间。如上所述,为驱动电压120施加电压以引起压电层116偏转,进而偏转厚度减少区域114中的喷嘴板110并对增压室104增压,迫使墨水通过喷嘴112。

[0040] 示出了增压室的墨水接收端106中的开口 107。槽形墨水通道128通入开口 107内,以将墨水供给到增压室104。墨水通道1¾从墨水源接收墨水,以下还描述。图3C是图3A中打印头组件沿线B-B的截面图。示出了接地电极层117层置于喷嘴板110的上面,喷嘴板位于基底101的顶部上。示出了其上层叠有驱动电极120的截取的压电层116。

[0041] 图4示出了打印头体102的喷嘴面124。图5A和5B示出了打印头体102的背面126。图5A示出了整个背面126,同时图5B示出了打印头102的背面的放大端部。沿着打印头体102背面126的两边长度是两个槽形墨水通道128。借助形成在增压室104墨水接收端106中形成的开口 107,每个墨水通道128与沿着打印头体102喷嘴面124的对应侧边设置的增压室104流体连通。可以使用墨水通道128的其他构造,例如弯曲表面。槽形构造朝增压室104的墨水接收端106中的开口引导墨水。可选地,适于增压室104的每个开口 107通过单独的墨水通道,而不是共享的连续墨水通道与墨水源相连。

[0042] 墨水通道1¾与墨水源流体连通。定位墨水源,使得墨水路径例如,相比于墨水路径通过打印头体102的侧边,自打印头体102的背面1¾从墨水源引入(direct)增压室的墨水接收端106的开口内。这种构造促进了增压室104和打印头体102的注入。在一种实施方式中,借助毛细管作用使墨水进入增压室104,并且不必使增压室104增压以移动墨水接收端106的墨水以便填充增压室104。

[0043] 可选地,加热器127位于打印头体102上或其背面126内部。加热器127使打印头体102变热,进而使得增压室104内的墨水变热。在一个实施例中,如图5A和5B所示,导电材料,如镍铬合金被喷溅在打印头体102的背面1¾上并被光刻刻蚀成所需图案,如所示的延长区域。借助电接触1¾为导电材料施加电压以便控制导电材料的温度和加热器127发出的热量。在另一实施例中,导电材料被刻蚀成蛇形区域,并可选地,蛇形区域内的转弯频率朝向打印头体102的端部增加,以补偿端部通常产生的热损耗。

[0044] 图6示出了与打印头体102组装的柔性电路130。柔性电路130在打印头体102的喷嘴面124附近卷绕。包含在柔性电路130上一个或两个翼134上的集成电路132与输出导线(未示出)相连,所述导线从相应的集成电路132延伸到与打印头体102的喷嘴面124相接触的柔性电路130的内表面。输出引线与压电层116上的驱动接触122电连接。进而,借助输出引线使得驱动信号从集成电路132到驱动接触122以便激活压电材料并选择地开启喷嘴112。

[0045] 集成电路132通过翼134与外部信源相连,所述外部信源借助通过柔性电路130与集成电路132电连接的输入引线(未示出)提供驱动信号。例如,外部信源可以是包含在集成打印模块的打印装置的处理器。在一个实施例中,设有5个集成电路132,每个集成电路132将信号输送给对应300个喷嘴122的300驱动接触整体中的60个驱动接触122。可以使用更多或更少的集成电路132。可选地,对于相对少喷嘴的打印头模块,电路可直接设置得通过分柔性电路130并能去除全部或一些的集成电路132。

[0046] 在一种实施方式中,柔性电路130另外包括薄片136,其固定在打印头体102的至少一个端部上方。薄片136与电子接触129电连接以控制加热器127的温度。

[0047] 图7A-D示出了打印头模块150,其包括置于与打印头相连的柔性电路130内的墨水供给组件140。参照图7A,示出了自喷嘴面IM的视图。柔性电路130在打印头体102的喷嘴面124附近卷绕,但包括开口 138以暴露喷嘴板110以及形成在其中的喷嘴112。可选地,柔性电路130可由在打印头体102喷嘴面124的一侧附近卷绕的第一部分和在打印头体102喷嘴面的另一侧卷绕的第二部分形成,所述第一和第二部分在喷嘴面上不相遇。因此,形成在喷嘴板110上的喷嘴112暴露在柔性电路130的第一部分和第二部分之间。图7B示出了自背面126的视图。在所示墨水供给组件140的实施例中,存在两个可从远处墨水源接收墨水的墨水入口 14¾和142b。可选地,如果墨水通过打印头模块150再循环,一个可用作墨水入口,例如142a,而另一个142b可用作墨水出口。

[0048] 图7C示出了打印头模块150沿图7B中所示的线C-C截取的截面图。所示的墨水供给组件140的实施例包括用于接收墨水的容器144。通过使墨水供给组件的外壳143与打印头体102的背面1¾邻接来形成容器144。过滤器146可形成再容器144中以在墨水进入打印头体102之前滤除墨水中的污物。墨水从容器流入形成在打印头体102背面1¾中的墨水通道128。

[0049] 图7D示出了打印头模块150沿图7B中所示的线D-D截取的截面图。所示的墨水供给组件140的实施例包括与容器144流体连通的第一入口 14¾和第二入口 142b。容器144包括由过滤器146分隔的上下腔。墨水可自由地流过支撑柱147。如果通过打印头模块150再循环墨水,那么墨水入口 142a、142b之一可作为墨水入口操作而另一个可作为墨水出口操作,并且支撑柱147可构造成防止上腔的两部分之间的流动。

[0050] 制造方法

[0051] 根据以下描述的工艺制造打印头模块150,所述工艺包括在基底101和喷嘴板110中刻蚀流路的特性。压电层116、基底101和喷嘴板110被粘合在一起以形成打印头体102。随后,将柔性电路130安装在打印头体102上。图9为示出了用于制造打印头模块150的工艺400的流程图,以下参照图3B、3C和8A-Q描述该工艺。

[0052] 参照图8A,基底101由硅基底200形成。硅基底200具有前侧面210和后侧面215,并在一个实施例中具有大约600微米的整体厚度。在基底200的前侧面210和后侧面215上存在分别为大约1微米厚的热氧化层203、208。硅基底200在硫磺酸/预氧化氢的电解槽中被过氧硫酸清洁以移除有机物。基底可以是具有平行于前后侧面210、215的平面的单晶硅的硅层。

[0053] 借助通过被构图以形成掩模的光致抗蚀剂层的刻蚀加工硅基底200以形成增压室104和阻抗部件105。为了预备用于光致抗蚀剂层的硅基底200,基底200被放置在六甲基二硅氮烷(圓此)烟雾中以便为光致抗蚀剂层准备好热氧化层203(步骤40¾。参照图8B,正光致抗蚀剂层225 (Clariant AZ300T)被旋压在基底200的前侧面210上。软烘烤光致抗蚀剂层225,并通过铬掩模以Karl Suss曝光,以及被显影以形成限定增压室104的位置和阻抗部件105的掩模。

[0054] 参照图8C,借助电感耦合反应例子刻蚀(ICP RIE)等离子刻蚀硅基底200的前侧面以移除热氧化层203的曝光部分;硅基底200未被刻蚀。随后利用Bosch工艺深反应例子刻蚀(DRIE)技术刻蚀硅基底200,以形成增压室104和阻抗部件105,如图8D所示(步骤 404)。

[0055] 参照图8E,光致抗蚀剂层239被旋压在硅基底200的后侧面215上并被构图氧化物208以限定墨水通道128的位置。利用ICP RIE移除热氧化层208并随后利用利用KOH的各向异性刻蚀工艺刻蚀硅基底(步骤406)。参照图8F,从基底上剥去光致抗蚀剂239,前氧化物203和后氧化物208,并且过氧硫酸清洁和RCA清洁基底200,完成基底101 (步骤408)。可选地,例如,通过将镍铬合金喷溅在硅基底200的后侧面215上并进行光刻刻蚀以构图加热器127,在基底101的后侧面1¾上形成加热器或多个加热器127。

[0056] 参照图8G,喷嘴板110由绝缘体上硅的基底300(S0I300)形成(步骤410)。S0I300包括喷嘴硅层板110,埋入的氧化层302和处理层306。在将S0I300粘合在基底110上之前,通过基底300内利用KOH的各向异性刻蚀形成锥形壁134和厚度减少区域114。在一个实施例中,喷嘴板110可以是接近10微米厚。适于喷嘴112的孔仅以部分地刻蚀到喷嘴板110中,如5微米,并且不延伸到埋入的氧化层302。

[0057] 参照图8H,对准S0I300和基底101,并通过退火使其相互粘合以产生S熔接(步骤41幻。可使用另一接合技术,其包括苯丙环丁烯(BCB)粘合增进剂。参照图81,处理层306接地并被刻蚀,并从喷嘴板110剥去埋入氧化层302 (步骤414)。对喷嘴板110施加光致抗蚀剂层237并对其进行刻蚀以限定喷嘴112的位置。喷嘴板110被刻蚀(例如,DRIE)以形成喷嘴开口,如图8J所示(步骤416)。剥去光致抗蚀剂层237并且以1100°C烘烤基底101和喷嘴板110的组件大约4小时以移除任何的聚合物或有机物。

[0058] 参照图8K,具有暴露喷嘴112的切除区域的接地电极层117沉积在喷嘴板110上。在一种实施方式中,可通过屏蔽包括喷嘴112的区域(例如,提供物理障碍,如带),以及在喷嘴板110的暴露区域上沉积导电材料,例如金,来形成接地电极层117。掩模可从包含喷嘴112的区域移除以暴露喷嘴112。

[0059] 参照图8L,压电层116由大约Imm厚的预激发的压电材料块所形成(步骤418)。所述块被研磨(ground)大约65微米以形成平坦均勻的结晶表面并在的氢硼酸(HBF4)中清洁以移除由于磨光(grinding)所引起的表面损坏。利用BCB粘合增进剂层将压电层116粘合在牺牲的硅基底502上,将使其固化大约40小时。

[0060] 例如,以钛-钨层512金属化压电层的暴露表面,如图8L所示(步骤420)。金属层512与形成在喷嘴板110上的金属接地电极层117相接合和电连接,如上所述。BCB粘合增进剂层514层叠在金属层512的顶面上,以准备与喷嘴板110粘合的压电层116。

[0061] 在将压电层116粘合在喷嘴板110上之前,压电材料被切断(section)以产生多个致动器部分(步骤420)。图8M示出了在压电层116已经被切断以产生多个致动器部分之后,压电层116和硅基底502的部分顶视图。每个致动器部分对应基底101中单独的增压室104。注意到,相比于图8L的截面侧视图中所示的压电层的近似一半的宽度,在图8M中示出了压电层116的整个宽度。为了形成致动器部分,对压电材料进行切割以在对应喷嘴板112中所形成的喷嘴112的区域上方形成隔离区域148以及形成通道503。压电层116未被刻蚀穿透至牺牲硅基底502,而是在近似10微米处停止。

[0062] 参照图8N,对准压电层116和打印头体102与喷嘴板110 (其上形成有接地电极层117)的组件并将其接合在一起,以便隔离切割148位于喷嘴112上方并且通道切割503位于分隔相邻增压室104的壁的上方。例如用EV粘合剂将压电层116和组件粘合在一起(步骤422),以形成打印头体102。打印头体102置于200°C的石英炉中大于40小时以使BCB层514聚合。

[0063] 图80示出了图8N中所示组件沿进入页面的平面的线D-D截取的截面图。切割进入压电层116的通道503与分隔打印头体102中所形成的增压室104的壁相对准。接地电极层117通过BCB层514与形成在压电层116上的金属层512电连接。在此示意图中,示出了压电层116和牺牲硅基底502之间的BCB粘合剂层。

[0064] 参照图8P,通过磨光移除了硅处理层502和部分的压电层116(步骤424)。压电层116再次接地并在氢硼酸中清洁。在完成处理时压电层116为大约15微米。通过喷溅金属层,例如钛-钨和/或金层,在压电层116的暴露表面上沉积金属层118。随后,光刻刻蚀金属层118以形成驱动接触122和马区动电极120。

[0065] 图8Q示出了已经刻蚀金属层118而形成驱动电极120和驱动接触122之后,图8P中所示的组件沿进入页面的平面的线E-E所截取的截面图。压电层116夹在诸如钛-钨的金属层512,其与金属接地电极层117电连接,与形成驱动接触122和驱动电极120的诸如金的金属层之间。通过为接地电极层117和驱动电极120施加不同的电压,激活增压室104上方的压电层116区域。也就是说,电压差引起压电层116弯曲,进而压迫增压室104中的墨水。

[0066] 通常,利用商业可购买的设备以常规的等离子刻蚀选择地刻蚀硅和氧化硅层。对于直侧壁的硅刻蚀特性,可以使用Bosch工艺,其中利用SF6和C4F8的刻蚀以11秒周期与沉积聚合物交替。光致抗蚀剂层可以是商业可获得的正UV光致抗蚀剂系统。在-20°C实行所述处理以提高刻蚀选择性并延长光致抗蚀剂层的使用寿命。

[0067] 参照图10,根据以下步骤组装打印头模块150。打印头体102,例如基底101、喷嘴板110和压电层116,可以与柔性电路130连接(步骤60幻。执行电气测试以确保信号从柔性电路130到达打印头体102(步骤604)。墨水供给组件140借助已安装的柔性电路130与打印头体102相连(步骤606)以便完成打印头模块150。实行压力测试和漏泄测试以确保墨水通过打印头模块150行进而没有泄漏(步骤608)。实行打印测试以确保打印头模块150按照需求打印墨水(步骤610)。

[0068] 参照图11,在另一实施例中,打印头模块518可包括形成在喷嘴面和压电层116上的硅盖520。硅盖520比形成在增压室104和压电层116上的相对薄的硅隔板更薄且更坚固,以提供保护罩。类似于图8P中所示的示意图,图11示出了部分打印头模块518的截面侧视图。通路(通孔)522形成得通过硅盖520而到达驱动接触122。通路覆盖有导电材料以提供驱动接触122和柔性电路之间的电连接,所述柔性电路与硅盖520的外部连接,以为驱动接触122提供信号。在硅盖520中形成凹部524以提供适于压电层116在被驱动接触122和驱动电极120激活时弯曲的空间。可选地,加热器524,例如镍铬合金加热器,可包含在凹部524内,其可以是模块中包含的另一加热器之外的或替换另一加热器。喷嘴的形状可由通过硅盖520的通路528的形状确定。在一种实施方式中,喷嘴可形成在硅盖520中,在此情况中,通路528比较宽以便与喷嘴内部的宽度相一致。可利用包含上述技术的刻蚀技术形成硅盖520,并使其粘结在打印头模块518的喷嘴面上。

[0069] 如上所述,墨水只是打印液体的一个实例。应当理解,将墨水作为打印液体的参考仅是用于说明目的,并且以上利用修饰语“墨水”描述的打印头模块内元件的参考也是说明性的。也就是说,将通道或供给组件称作“墨水通道,,或“墨水供给组件”是为了说明目的的,并且可使用更多的通常参考,如“打印液体通道”或“打印液体供给组件”。此外,整个说明书和权利要求中,诸如“前”和“后”以及“顶部”和“底部”的术语的使用仅是为了说明的目的,以便区分在此描述的打印头模块的各个组件和其他元件。“前”和“后”以及“顶部”和“底部”的使用并不暗示打印头模块的特殊取向。

[0070] 尽管以上已经详细描述了几个实施例,但其他修改也是可能的。其他实施例也处于以下权利要求的范围内。

[0071] 相关申请的交叉参考

[0072] 本申请要求2004年12月17日递交的、标题为“单用墨滴喷射模块”、系列号为No. 60/637,254的未决美国临时申请的优先权,其全部内容在此包含引作参考,并要求2005年7月13日递交的、标题为“单用墨滴喷射模块”的系列号为No. 60/699,134的未决美国临时申请的优先权,其全部内容在此包含引作参考。本申请同时还涉及Andreas Bibl,John A. Higginson,Kevin Von Essen和Antai Xu同时递交的标题为“单用墨滴喷射模块”的美国申请。

Claims (5)

1. 一种打印头系统,其包括:打印头模块,所述打印头模块包括:打印头体,其包括一个或多个增压室,其中,每个增压室包括构造成用以从打印液体源接收打印液体的接收端和用于喷射增压室中打印液体的喷射端;喷嘴板,其包括形成为通过所述喷嘴板的一个或多个喷嘴,其中,一喷嘴与每个增压室流体连通并从增压室的喷射端接收打印液体以从喷嘴进行喷射;与喷嘴板相连的一个或多个压电致动器,其中,压电致动器位于每个增压室上方并包括构造成偏转并对增压室增压的压电材料,以便从与增压室的喷射端流体连通的相应喷嘴喷射打印液体;与喷嘴板相连的盖,且所述盖包括与形成为通过所述喷嘴板的一个或多个喷嘴相连的一个或多个孔,其中,所述盖被构造成覆盖一个或多个压电致动器,同时为所述一个或多个压电致动器中包含的压电材料提供足够的间隙,所述盖还包括:涂敷有使盖外表面与所述一个或多个压电致动器相连的导电层的一个或多个通路;和柔性电路,其与打印头模块的盖的外表面相连并借助所述一个或多个通路与所述一个或多个压电致动器电耦接,以便为所述一个或多个压电致动器提供信号,以选择性地对所述一个或多个增压室增压进而启动相应的所述一个或多个喷嘴。
2.根据权利要求1所述的打印头系统,其中,所述打印头模块还包括:打印液体供给组件,其中,所述打印液体供给组件包括与增压室的接收端流体连通的容器;其中:打印头体包括一背面,该背面平行于与喷嘴板相连的喷嘴面;所述打印液体供给组件与所述打印头体的背面相连;以及所述增压室的接收端包括在所述打印头体背面上与容器流体连通的开口。
3.根据权利要求2所述的打印头系统,其中,所述打印头模块包括多个增压室,所述打印头模块还包括:至少一个形成在打印头体背面中的打印液体通道,所述至少一个打印液体通道与多个增压室的开口以及容器流体连通,其中打印液体从容器进入所述至少一个打印液体通道并被引入所述多个增压室的开口。
4.根据权利要求3所述的打印头系统,其中,所述至少一个打印液体通道包括朝向所述多个增压室的开口成角度的至少两个侧边。
5.根据权利要求1所述的打印头系统,其中:所述喷嘴板包括厚度减少的一个或多个区域,并且每个所述区域的内表面形成所述一个或多个增压室中的每一个的内表面;并且所述压电材料设置在第一和第二电极之间,且所述第一电极设置在所述压电材料和所述喷嘴板的厚度减少的区域中的一个区域的外表面之间。
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TWI353929B (en) 2011-12-11
KR20070087010A (ko) 2007-08-27
WO2006066102A1 (en) 2006-06-22
EP1831026B1 (en) 2012-02-22
TWI343323B (en) 2011-06-11
HK1127578A1 (en) 2009-10-02
AT526167T (de) 2011-10-15
KR101340633B1 (ko) 2013-12-11
KR101274631B1 (ko) 2013-06-13
US7494209B2 (en) 2009-02-24
EP1848592A1 (en) 2007-10-31
TW200630233A (en) 2006-09-01
JP2008524031A (ja) 2008-07-10
EP1831026A1 (en) 2007-09-12
CN101927603A (zh) 2010-12-29
JP5013478B2 (ja) 2012-08-29
KR20070087658A (ko) 2007-08-28
US20060158486A1 (en) 2006-07-20
US20060158489A1 (en) 2006-07-20
HK1147974A1 (en) 2011-08-26
JP4767262B2 (ja) 2011-09-07
JP2008524032A (ja) 2008-07-10

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