CN101924542A - 电容式微机电系统开关及其制造方法 - Google Patents
电容式微机电系统开关及其制造方法 Download PDFInfo
- Publication number
- CN101924542A CN101924542A CN2010102033209A CN201010203320A CN101924542A CN 101924542 A CN101924542 A CN 101924542A CN 2010102033209 A CN2010102033209 A CN 2010102033209A CN 201010203320 A CN201010203320 A CN 201010203320A CN 101924542 A CN101924542 A CN 101924542A
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- China
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- semiconductor substrate
- conductor
- electrode
- end conductor
- unsettled
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H59/00—Electrostatic relays; Electro-adhesion relays
- H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
- B81C1/00246—Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/01—Switches
- B81B2201/012—Switches characterised by the shape
- B81B2201/014—Switches characterised by the shape having a cantilever fixed on one side connected to one or more dimples
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
- B81C2203/0707—Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure
- B81C2203/0714—Forming the micromechanical structure with a CMOS process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Micromachines (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18632809P | 2009-06-11 | 2009-06-11 | |
US61/186,328 | 2009-06-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101924542A true CN101924542A (zh) | 2010-12-22 |
CN101924542B CN101924542B (zh) | 2012-06-13 |
Family
ID=43305673
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010102033209A Active CN101924542B (zh) | 2009-06-11 | 2010-06-11 | 电容式微机电系统开关及其制造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8460962B2 (zh) |
CN (1) | CN101924542B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103547335A (zh) * | 2013-03-20 | 2014-01-29 | 华为终端有限公司 | 电容式开关、信号收发装置及制造方法 |
CN103733304A (zh) * | 2011-06-29 | 2014-04-16 | 因文森斯公司 | 其中一部分暴露在环境下并且带有竖直集成电子器件的气密封mems设备 |
CN110212805A (zh) * | 2019-05-30 | 2019-09-06 | 上海集成电路研发中心有限公司 | 一种改善翘曲程度的mems结构 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8389317B2 (en) * | 2009-05-28 | 2013-03-05 | Shanghai Lexvu Opto Microelectronics Technology Co., Ltd. | MEMS device and method of fabricating the same |
US9221677B2 (en) * | 2010-12-20 | 2015-12-29 | Rf Micro Devices, Inc. | Composite sacrificial structure for reliably creating a contact gap in a MEMS switch |
JP5813471B2 (ja) * | 2011-11-11 | 2015-11-17 | 株式会社東芝 | Mems素子 |
US8592876B2 (en) | 2012-01-03 | 2013-11-26 | International Business Machines Corporation | Micro-electro-mechanical system (MEMS) capacitive OHMIC switch and design structures |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1092918A (zh) * | 1992-07-24 | 1994-09-28 | 户田耕司 | 超声波触摸系统 |
US5508700A (en) * | 1994-03-17 | 1996-04-16 | Tanisys Technology, Inc. | Capacitance sensitive switch and switch array |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE33691E (en) * | 1984-12-21 | 1991-09-17 | General Electric Company | Piezoelectric ceramic switching devices and systems and method of making the same |
GB9309327D0 (en) * | 1993-05-06 | 1993-06-23 | Smith Charles G | Bi-stable memory element |
US5629794A (en) * | 1995-05-31 | 1997-05-13 | Texas Instruments Incorporated | Spatial light modulator having an analog beam for steering light |
US5696662A (en) * | 1995-08-21 | 1997-12-09 | Honeywell Inc. | Electrostatically operated micromechanical capacitor |
US5638946A (en) * | 1996-01-11 | 1997-06-17 | Northeastern University | Micromechanical switch with insulated switch contact |
US6115231A (en) * | 1997-11-25 | 2000-09-05 | Tdk Corporation | Electrostatic relay |
US6100477A (en) * | 1998-07-17 | 2000-08-08 | Texas Instruments Incorporated | Recessed etch RF micro-electro-mechanical switch |
US6143997A (en) * | 1999-06-04 | 2000-11-07 | The Board Of Trustees Of The University Of Illinois | Low actuation voltage microelectromechanical device and method of manufacture |
US6452124B1 (en) * | 2000-06-28 | 2002-09-17 | The Regents Of The University Of California | Capacitive microelectromechanical switches |
WO2003028059A1 (en) * | 2001-09-21 | 2003-04-03 | Hrl Laboratories, Llc | Mems switches and methods of making same |
US20060223215A1 (en) * | 2003-06-26 | 2006-10-05 | Rj Mears, Llc | Method for Making a Microelectromechanical Systems (MEMS) Device Including a Superlattice |
US7101724B2 (en) * | 2004-02-20 | 2006-09-05 | Wireless Mems, Inc. | Method of fabricating semiconductor devices employing at least one modulation doped quantum well structure and one or more etch stop layers for accurate contact formation |
US7335611B2 (en) * | 2005-08-08 | 2008-02-26 | Applied Materials, Inc. | Copper conductor annealing process employing high speed optical annealing with a low temperature-deposited optical absorber layer |
TWI301023B (en) * | 2005-11-22 | 2008-09-11 | Inst Information Industry | Wireless communication system, method for transmitting frame, and computer readable medium thereof |
GB0523715D0 (en) * | 2005-11-22 | 2005-12-28 | Cavendish Kinetics Ltd | Method of minimising contact area |
-
2010
- 2010-06-11 CN CN2010102033209A patent/CN101924542B/zh active Active
- 2010-06-11 US US12/813,832 patent/US8460962B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1092918A (zh) * | 1992-07-24 | 1994-09-28 | 户田耕司 | 超声波触摸系统 |
US5508700A (en) * | 1994-03-17 | 1996-04-16 | Tanisys Technology, Inc. | Capacitance sensitive switch and switch array |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103733304A (zh) * | 2011-06-29 | 2014-04-16 | 因文森斯公司 | 其中一部分暴露在环境下并且带有竖直集成电子器件的气密封mems设备 |
CN103733304B (zh) * | 2011-06-29 | 2016-08-17 | 因文森斯公司 | 其中一部分暴露在环境下并且带有竖直集成电子器件的气密封mems设备 |
CN103547335A (zh) * | 2013-03-20 | 2014-01-29 | 华为终端有限公司 | 电容式开关、信号收发装置及制造方法 |
WO2014146264A1 (zh) * | 2013-03-20 | 2014-09-25 | 华为终端有限公司 | 电容式开关、信号收发装置及制造方法 |
US8907720B2 (en) | 2013-03-20 | 2014-12-09 | Huawei Device Co., Ltd. | Capacitive switch, apparatus for transceiving signal, and manufacturing method thereof |
EP2814174A4 (en) * | 2013-03-20 | 2016-01-27 | Huawei Device Co Ltd | CAPACITIVE SWITCH, SIGNAL RECEIVING AND SENDING DEVICE, AND METHOD OF MANUFACTURING |
CN103547335B (zh) * | 2013-03-20 | 2016-05-25 | 华为终端有限公司 | 电容式开关、信号收发装置及制造方法 |
CN110212805A (zh) * | 2019-05-30 | 2019-09-06 | 上海集成电路研发中心有限公司 | 一种改善翘曲程度的mems结构 |
Also Published As
Publication number | Publication date |
---|---|
US8460962B2 (en) | 2013-06-11 |
CN101924542B (zh) | 2012-06-13 |
US20100314669A1 (en) | 2010-12-16 |
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GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SHANGHAI LIHENG LIGHT MICROELECTRONICS TECHNOLOGY Free format text: FORMER OWNER: JIANGSU LIHENG ELECTRONICS CO., LTD. Effective date: 20120504 |
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Free format text: CORRECT: ADDRESS; FROM: 212009 ZHENJIANG, JIANGSU PROVINCE TO: 201203 PUDONG NEW AREA, SHANGHAI |
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TR01 | Transfer of patent right |
Effective date of registration: 20120504 Address after: 201203, Shanghai Zhangjiang hi tech park, 3000 East Road, No. 5 building, room 501B Patentee after: Shanghai Lexvu Opto Mircoelectrics Technology Co., Ltd. Address before: 212009 Zhenjiang hi tech Industrial Development Zone, Jiangsu Province, No. twelve, No. 211, room 668 Patentee before: Jiangsu Liheng Electronic Co., Ltd. |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160407 Address after: 710075, arc building, No. 60, West Avenue, new industrial park, hi tech Zone, Shaanxi, Xi'an, 204 Patentee after: Xi'an Yisheng Photoelectric Technology Co., Ltd. Address before: 201203, Shanghai Zhangjiang hi tech park, 3000 East Road, No. 5 building, room 501B Patentee before: Shanghai Lexvu Opto Mircoelectrics Technology Co., Ltd. |