CN101916050B - Lithographic apparatus and device manufacturing method - Google Patents

Lithographic apparatus and device manufacturing method Download PDF

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Publication number
CN101916050B
CN101916050B CN2010102497928A CN201010249792A CN101916050B CN 101916050 B CN101916050 B CN 101916050B CN 2010102497928 A CN2010102497928 A CN 2010102497928A CN 201010249792 A CN201010249792 A CN 201010249792A CN 101916050 B CN101916050 B CN 101916050B
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gas
substrate
volume
optical projection
base station
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CN101916050A (en
Inventor
J·洛夫
J·C·H·穆肯斯
J·J·S·M·梅坦斯
A·J·范德米特
R·范德哈姆
N·拉勒曼特
M·贝克斯
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ASML Netherlands BV
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ASML Netherlands BV
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70933Purge, e.g. exchanging fluid or gas to remove pollutants
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2041Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70341Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus

Abstract

A lithographic projection apparatus and device manufacturing method are disclosed. The apparatus includes an illumination system configured to condition a beam of radiation, and a support structure configured to support a patterning device. The patterning device serves to impart the beam of radiation with a pattern in its cross-section. The apparatus also includes a substrate table configured to hold a substrate, a projection system configured to project the patterned beam onto a target portion of the substrate, and a fluid supply system configured to provide a fluid to a volume. The volume includes at least a portion of the projection system and/or at least a portion of the illumination system. The apparatus further includes a coupling device configured to couple the fluid supply system to the substrate table, substrate, support structure, patterning device, or any combination thereof.

Description

Lithographic equipment and device making method
Technical field
The present invention relates to a kind of lithographic equipment and device making method.
Background technology
Lithographic equipment is a kind of required pattern to be applied to device in base target section.Lithographic equipment can be used for for example manufacturing of integrated circuit (IC).In this case, patterning device, can be used for producing circuit pattern corresponding to an individual course of IC as mask, this pattern can be imaged in the target section of the substrate (for example silicon wafer) that has applied radiation-sensitive materials (resist) layer (for example comprising a part, one or more tube core).Usually, single substrate will comprise the grid of the adjacent target section of exposure in succession.Known lithographic equipment comprises so-called ledex, wherein by whole pattern being exposing in target section and each target section of radiation, known lithographic equipment also comprises so-called scanner, by scan described pattern along given direction (" scanning " direction) under projecting beam, and come each target section of radiation along or antiparallel direction synchronous scanning substrate parallel with this direction simultaneously.
Be used for irradiation and may cause the optical element of optical projection system such as lens to be degenerated with the radiation of the substrate of pollutant (it may be to introduce by the getter action of for example suprabasil photoresist layer and by the surrounding air that enters lithographic equipment), this can cause losing the consistance of total transmission and the loss substrate irradiation of light beam.
, in order to address this problem, developed multiple cleaning system.The effect of cleaning system such as purification cover (purge hood) is the chemical contamination that prevents or reduce some element in optical projection system and/or irradiation system.Usually this can realize by the surperficial blow gas along outside surface or element in optical projection system, thus at the exposure slit place according to for example usually greater than the concentration of 1000 the unwanted preparation of factor dilution.Yet according to type, system specification and gas property of for example lithographic equipment etc., dilution gfactor can change between 100 to 1000.
In cleaning system, when the inner member in optical projection system and irradiation system purifies satisfactorily, because they are arranged in the compartment of sealing, remain a problem so degenerate, it be by pollutant particularly on first and last optical element of optical projection system (namely when the first optical element of projecting beam process during by optical projection system and optical element finally) surface the pollutant of generation cause.The pollutant that may cause optical element performance to be degenerated in optical element comprises the starlike crystal salt body structure of for example growing on optical element surface.For example, optical element will become and be polluted by the salt body structure after standing a period of time the intense radiation of (normally several years).Therefore, conventional purification cover is positioned to the gas that provides cleaning along surface and the top lens surface of outer bottom usually.Conventional purification cover is arranged on fixed position, for example, is fixed to optical projection system or Reference Architecture (for example metrology frame).As mentioned above, the performance of purification cover represents with dilution gfactor usually, and dilution gfactor is to purify the inside and outside pollutant ratio of volume, usually in 1000 magnitudes.
Yet conventional purification cover may have multiple shortcoming.Especially, the performance of purification cover may be subjected between purification cover and substrate and/or purification cover and substrate retainer between the negative effect in gap.Therefore, the performance of purification cover depends on the position of substrate retainer, and it is also provided to regulate the impact of the gas shower of the interferometry parts in lithographic equipment.For example, when the substrate retainer was not provided, for example when at the bottom of transform-based, the performance of measuring with dilution method may be very low.In addition, the dynamic disturbance that is caused by purification cover (as the vibration of flowing and causing) may affect the performance of optical projection system.Conventional dilution gfactor may be not enough to the humidity level on optical element surface is reduced to much smaller than 10/1000000ths (ppm) (, corresponding to less than an individual layer, having been found that the formation that this helps to prevent the salt body structure).
In addition,, due to the tolerance between base station and optical projection system, may not obtain gratifying minim gap between substrate and purification cover.Similarly situation also may run in immersion lithography apparatus, wherein will obtain a minim gap between liquid-supplying system and substrate, at least part of gap-fill a kind of liquid.In addition, base station may move up when losing servocontrol, thereby can damage substrate when the gap smaller between substrate and purification cover or liquid-supplying system.
Also may produce similar problem between irradiator and supporting construction.
Summary of the invention
One aspect of the present invention is to solve the problems referred to above that for example run in the purification cover of routine, or the problems referred to above that run in the available very limited space of lithographic equipment solves the liquid-supplying system of immersion lithographic method.
According to an aspect of the present invention, provide a kind of lithographic equipment, it comprises that one is configured to regulate the irradiation system of radiation laser beam, and a supporting construction that is configured to support patterning device, and this patterning device is given to radiation laser beam at the xsect of radiation laser beam with pattern.This device also comprises that one is configured to keep the base station of substrate, and one is configured to patterned light beam projecting to the optical projection system in the target section of substrate, and a fluid feed system that is configured to fluid is offered a volume.This volume comprises at least a portion optical projection system and/or at least a portion irradiation system.This device also comprises that one is configured to fluid feed system is connected to the link of base station, substrate, supporting construction, patterning device or its any combination.In this way, can reduce the interference that the noise that causes by flowing produces at least one of optical projection system and irradiation system.
In one embodiment, fluid feed system comprises that one is configured to provide gas to the gas purge system that purifies volume, and this purification volume comprises at least a portion optical projection system, at least a portion irradiation system, perhaps above-mentioned both.In this way, can reduce the interference that the noise that causes by flowing causes in gas purge system.
In one embodiment, fluid feed system comprises that one is configured to liquid carrying is fed to the liquid-supplying system in the space between the regional area of optical projection system and substrate.In this way, can reduce the interference that the noise that causes by flowing causes in fluid feed system.
In one embodiment, base station, substrate, supporting construction, patterning device or its any combination are arranged in a zone that is limited by the first and second different directions, wherein fluid feed system is along third direction and base station, substrate, supporting construction, patterning device or its any being connected, and this third direction and above-mentioned zone extend at angle.
In addition, first, second, and third direction is mutually vertical substantially.In another embodiment, in use fluid feed system along third direction, around the sense of rotation of first direction be connected the sense of rotation of second direction and be connected flexibly with base station, substrate, supporting construction, patterning device or its any combination.In this way, fluid feed system can be arranged to along third direction immediately following substrate/patterning device.In addition, protective device can be provided in order to prevent collision between base station, substrate, supporting construction, patterning device or its any combination and fluid feed system.
In one embodiment, in use fluid feed system is connected with optical projection system, irradiation system, Reference Architecture or its any combination rigidly along first direction, second direction and the sense of rotation of third direction of being connected.In this way, fluid feed system can be installed securely and reduce simultaneously optical projection system, irradiation system or the two interference, also at third direction, allows to a certain degree flexible.
In one embodiment, link comprises a gas bearing.In this way, can obtain stable gap between fluid feed system and base station, substrate, supporting construction, patterning device or its any combination, and not need high tolerance.In addition, gas bearing can allow fluid feed system to locate very near base station, substrate, supporting construction, patterning device or its any combination, and there is no the danger of collision, thereby in other zone of lithographic equipment as larger space is provided in the zone around optical projection system and irradiation system.
In one embodiment, gas bearing is configured to provide a sealing,, in order to prevent that fluid from overflowing fluid feed system, prevents that perhaps ambient gas from entering into fluid feed system.In this way, can obtain minimum clearance between fluid feed system and base station, substrate, supporting construction, patterning device or its any combination, thereby the dilution gfactor of increase is provided, for example greater than 10000 dilution gfactor.
In addition, at fluid feed system, comprise in the situation of gas purge system, a sealing can be guaranteed gas shower not interference in volume.In addition, sealing allows to increase dilution gfactor in the base station exchange process with a closure plate.High dilution gfactor can make the optical element of moisture away from optical projection system and irradiation system, and keeps enough low level in " doing " etching system of routine, for example parts per million (ppm) (ppm).Can improve the efficiency of the cleaning system in this etching system like this.
In one embodiment, gas bearing is configured to provide a fluid compartment of sealing substantially.In this way, can further improve dilution gfactor.
In one embodiment, base station, supporting construction or above-mentionedly both have a dimple that is configured to hold respectively substrate and patterning device.In addition, this dimple has a degree of depth, and it equals respectively in substrate and patterning device the thickness of at least one substantially.In addition, in use, the substrate surface that is arranged to receive patterned light beam substantially with the flush of base station.In this way, in the exposure process of patterning device, fluid feed system can be equally well mobile in base station and substrate, and needn't carry out any adjusting to link.In addition, in use, be arranged to the received radiation light beam patterning device surface basically with the flush of supporting construction.By this way, in the exposure process of patterning device, fluid feed system can be equally well mobile on supporting construction and patterning device, and needn't carry out any adjusting to link.
In one embodiment, in use gas bearing can provide at least one stable and small gap between the substrate surface that is arranged to receive patterned light beam and fluid feed system.In this way, can improve fluid feed system and the particularly collision probability between substrate., by small and stable gap is provided, can more easily carry out effective fluid and supply with.
In one embodiment, in use gas bearing can provide at least one stable and small gap between the patterning device surface that is arranged to the received radiation light beam and fluid feed system.In this way, can improve fluid feed system and the particularly collision probability between patterning device., by small and stable gap is provided, can more easily carry out effective fluid and supply with.
In one embodiment, gas bearing comprises that one is configured to the control element of adjusting gas flow and/or pressure, in order to control, is arranged to receive the substrate surface of projecting beam and the gap size between fluid feed system.In this way, can improve and namely reduce fluid feed system and the particularly collision probability between substrate.
In one embodiment, gas bearing comprises that one is configured to the control element of adjusting gas flow and/or pressure, in order to control, is arranged to the patterning device surface of received radiation light beam and the gap size between fluid feed system.In this way, can improve and namely reduce fluid feed system and the particularly collision probability between substrate.
In one embodiment, gas bearing comprises that one is configured to provide gas to supply with to the gas of gas bearing, be configured to remove from gas bearing at least part of vacuum of gas, and one be configured to control that gas is supplied with and the control element of vacuum at least partly, the third direction that makes fluid feed system edge and a zone extend at angle floats and has on the substrate of enough hardness, base station or both surfaces, described zone is limited by first direction and second direction, wherein is furnished with base station.In this way, can be connected at fluid feed system substrate or above-mentionedly provide stable connection between the two with base station, and not need very large adjusting, and the complexity that can not increase greatly device.
In one embodiment, gas bearing comprises that one is configured to provide gas to supply with to the gas of gas bearing, be configured to remove from gas bearing at least part of vacuum of gas, and one be configured to control that gas is supplied with and the control element of vacuum at least partly, the third direction that makes cleaning system edge and a zone extend at angle floats at least on the surface of patterning device and the supporting construction with enough hardness, described zone is limited by first direction and second direction, wherein is furnished with supporting construction.In this way, can be connected at fluid feed system patterning device or above-mentionedly provide stable connection between the two with supporting construction, and not need very large adjusting, and the complexity that can not increase greatly device.
In one embodiment, cleaning system comprises a purification cover, gas bearing comprises that one is configured to promote along third direction the actuating device of purification cover, wherein third direction along and zone direction at angle extend, arranged base station, supporting construction or both in this zone.In this way, when needed, for example when carrying out base station or substrate exchange, can promote expediently purification cover.
In one embodiment, cleaning system comprises a purification cover, this device also comprises an actuating device in conjunction with the link layout, thereby along third direction, promote purification cover, wherein third direction along and zone direction at angle extend, arranged in this zone base station, supporting construction or above-mentioned both.In this way, can promote expediently purification cover, and can not increase greatly the complexity of device.In one embodiment, actuating device promotes purification cover with magnet.
In one embodiment, first, second, and third direction corresponds respectively to X, Y and Z direction.In addition, Y-direction can be direction of scanning, and directions X and Y-direction can limit a plane, wherein arranged base station, substrate or above-mentioned both.In use, the Z direction is extended along vertical with this plane substantially direction.
In one embodiment, cleaning system comprises a purification cover, wherein link is configured to purification cover is connected with base station or supporting construction, make purification cover closely follow base station and substrate or supporting construction and patterning device respectively along the movement of third direction, this third direction, along with zone direction at angle, extending, has been arranged respectively base station and supporting construction in this zone.In this way, can avoid collision.
In one embodiment, gas bearing comprises a gas vent, by this gas vent, can provide gas-pressurized to join domain.In this way, can realize sufficient connection.
In one embodiment, gas bearing comprises a part of vacuum, by this partial vacuum, can remove gas-pressurized from join domain.In this way, can realize sufficient connection.
In one embodiment, link comprises a gas bearing, and a control element is provided,, in order to provide a minimum clearance between base station, substrate, supporting construction, patterning device or its any combination and cleaning system, thereby make, purify volume and surrounding environment isolation.In this way, prevent from purifying volume and pollute surrounding environment and surrounding environment removing pollutant volume.
In one embodiment, liquid-supplying system comprises that one is configured to reduce at least the seal element of the fluid of revealing from the optical projection system below.In one embodiment, sealing element and base station, substrate, supporting construction, patterning device or its any being connected.
According to an aspect of the present invention, provide a kind of device making method, it comprises that the optical projection system of using lithographic equipment projects to patterned radiation laser beam the target section of substrate; And use a fluid feed system to provide fluid to a volume.This volume comprise at least a portion optical projection system, at least a portion irradiation system or above-mentioned both.The method also comprises supporting construction or its any being connected of fluid feed system and substrate, the base station that keeps substrate, the patterning device that is used to form patterned light beam, maintenance patterning device.
Although in this application, can be specifically with reference to lithographic equipment for the manufacture of IC, but should be appreciated that lithographic equipment described herein may have other application, for example, it can be used for manufacturing integration optical system, the guiding that is used for magnetic domain memory and check pattern, liquid crystal display (LCD), thin-film head etc.It will be understood by those skilled in the art that in this interchangeable purposes scope, the use of any term " wafer " or " tube core " here should be thought respectively and more common term " substrate " or " target section " synonym.Before or after exposure, can carry out various processing to the substrate of mentioning here at for example track device (usually resist layer is acted on substrate and with a kind of instrument of the resist development that exposed) or metering outfit or the instruments of inspection.In applicable place, disclosure herein can be applicable to this and other base treatment instruments.In addition, for example, in order to form multilayer IC, can repeatedly process substrate, so the terminology used here substrate also can refer to comprise the substrate of a plurality of layers of having processed.
Term used herein " radiation " and " light beam " comprise all types of electromagnetic radiation, comprise that ultraviolet (UV) radiation (for example has 365,248,193,157 or the wavelength of 126nm) and extreme ultraviolet (EUV) radiation (for example having the wavelength in the 5-20nm scope), and ion beam, for example ion beam or electron beam.
Term used herein " patterning device " should broadly be interpreted as and can give the device of pattern in its cross section to projecting beam, thereby forms pattern in the target section of substrate.Should be noted that the pattern of giving projecting beam can be not with base target section in required pattern accurately consistent.Usually, give the pattern of projecting beam corresponding with the specific function layer of the device that forms such as integrated circuit in target section.
Patterning device can be transmission or the reflection.The example of patterning device comprises mask, array of programmable mirrors, and Programmable LCD plate.Mask is known in photoetching, it comprises the mask-type as binary type, alternating phase-shift type and attenuating phase-shift type, and various hybrid mask types.An example of array of programmable mirrors has adopted the matrix of tiny mirror to arrange, and each catoptron can tilt independently, thereby reflects the radiation laser beam of incident along different directions; In this manner, the light beam of reflection carried out composition.In each example of patterning device, supporting construction can be framework or worktable, for example described structure can be as required fix or movably, and can guarantee that patterning device for example is positioned at the position of expectation with respect to optical projection system.Here the use of any term " reticle " or " mask " can be thought and more common term " patterning device " synonym.
Terminology used here " optical projection system " should broadly be interpreted as comprising various types of optical projection systems, comprises dioptric system, reflective optics, and catadioptric optical systern, as be suitable for exposing radiation used, perhaps be suitable for other aspects, as using immersion liquid or using vacuum.Here the use of any term " lens " can be thought and more common term " optical projection system " synonym.
Irradiation system can also comprise various types of opticses, comprises that reflection and reflexed are penetrated optics for the refraction of guiding, shaping or control radiation projecting beam, and this parts also can jointly or individually be called " lens " hereinafter.
Lithographic equipment can be the type with two (two platforms) or a plurality of base station (and/or two or more mask platform).In this " how desk-top " device, can walk abreast and use these additional stations, perhaps can carry out preparation process on one or more platform, and one or more other be used for exposure.
Lithographic equipment can also be one type, and wherein substrate is immersed in the liquid such as water with relatively high refractive index, thereby fills last element of optical projection system and the space between substrate.Also immersion liquid can be applied to other space of lithographic equipment, for example between the first element of mask and optical projection system.The infiltration technology is being known in the art, and it is for increasing the numerical aperture of optical projection system.
Description of drawings
, only by the mode of example, with reference to the schematic diagram of enclosing, describe embodiment of the present invention now, in accompanying drawing, corresponding reference marker represents corresponding parts, wherein:
Fig. 1 shows the lithographic equipment according to one embodiment of the invention;
Fig. 2 shows the lithographic equipment that comprises a gas purge system according to one embodiment of the invention;
Fig. 3 shows the lithographic equipment that comprises a gas purge system according to another embodiment of the invention;
Fig. 4 shows the details according to the gas purge system of Fig. 2 of one embodiment of the invention and 3;
Fig. 5 shows the lithographic equipment that comprises a gas purge system according to another embodiment of the invention;
Fig. 6 shows the lithographic equipment that comprises a gas purge system according to another embodiment of the invention;
Fig. 7 shows the lithographic equipment that comprises a gas purge system according to another embodiment of the invention;
Fig. 8 shows the lithographic equipment that comprises a gas purge system according to another embodiment of the invention.
Embodiment
Fig. 1 has schematically described the lithographic equipment of the present invention's one specific embodiments.This device comprises: irradiation system (irradiator) IL is used for providing radiation projecting beam PB (for example UV or EUV radiation); The first supporting construction (for example mask platform) MT, be used for to support patterning device (for example mask) MA, and be used for this patterning device is connected with respect to pinpoint the first locating device PM of object PL; Base station (for example wafer station) WT, be used for to keep substrate (for example applying the wafer of resist) W, and be used for substrate is connected with respect to pinpoint the second locating device PW of object PL; And optical projection system (for example refraction projection lens) PL, be used for being imaged on by the pattern that patterning device MA is given to projecting beam PB the C of target section (for example comprising one or more tube cores) of substrate W.
As noted here, this device belongs to transmission-type (for example adopting transmission mask).Perhaps, this device can belong to reflection-type (for example or adopt array of programmable mirrors above-mentioned).
Irradiator IL receives the radiation laser beam from radiation source S O.Radiation source and lithographic equipment can be mechanisms independently, for example when radiation source is excimer laser.In this case, do not think that radiation source forms the part of lithographic equipment, radiation laser beam is transferred to irradiator IL by means of beam Propagation system BD from source SO, and described beam Propagation system comprises for example suitable directional mirror and/or beam expander.In other cases, radiation source can be the ingredient of device, for example when source is mercury lamp.Source SO and irradiator IL, can be known as radiating system together with beam delivery system BD if necessary.
Irradiator IL can comprise regulating device AM, is used for regulating the angle intensity distributions of light beam.Outer and/or the interior radius vector that usually, can be adjusted at least intensity distributions on the irradiator pupil plane (is called σ-outer and σ-Nei) usually.In addition, irradiator IL generally comprises various other parts, as integrator IN and condenser CO.Irradiator provides the adjusting light beam of radiation, is called projecting beam PB, and this light beam has required uniformity coefficient and intensity distributions on its xsect.
Projecting beam PB incides on the mask MA that remains on mask table MT.By after crossing mask MA, projecting beam PB is by system PL, and this system focuses on light beam on the C of target section of substrate W.Under the second locating device PW and position transducer IF (for example interferometric measuring means) auxiliary, base station WT can accurately move, thus the different C of target section in location in the light path of light beam PB for example.Similarly, for example after machinery takes out mask MA from the mask storehouse or in scan period, can use the first locating device PM with another position transducer (clearly not illustrating in Fig. 1), the light path of the relative light beam PB of mask MA accurately to be located.Usually, by means of long stroke module (coarse positioning) and short stroke module (fine positioning), can realize target platform MT and the movement of WT, the part of long stroke module and short stroke module formation locating device PM and PW wherein., in the situation of ledex (relative with scanister), mask table MT only is connected with the short stroke actuating device, and is perhaps fixing.Mask MA can use mask alignment mark M1, M2 and substrate alignment mark P1, P2 to aim at substrate W.
Shown device can be according to following preferred pattern using:
1. step mode, mask table MT and base station WT keep motionless substantially, and the whole pattern of giving projecting beam is once projected the C of target section upper (being single static exposure).Then move base station WT along X and/or Y-direction, thus the C of target section that can expose different.In step mode, the full-size of exposure field has limited the size of the C of target section of imaging in single static exposure.
2. scan pattern, when the pattern of giving projecting beam is projected onto the C of target section (single dynamic exposure), synchronous scanning mask table MT and base station WT.Wafer station WT determines by amplification (dwindling) and the image inversion characteristic of optical projection system PL with respect to speed and the direction of mask table MT.In scan pattern, the full-size of exposure field has limited at the hit width (along non-direction of scanning) of section of single dynamic exposure, and the mobile length of scanning is determined the height (along direction of scanning) of target section.
3. other patterns, when the pattern that will give projecting beam projected the C of target section when upper, mask table MT keeps fixedly keeping patterning device able to programme substantially, and base station WT was moved or scanned this moment.In this pattern, generally adopt impulse radiation source, and after base station WT is each mobile, perhaps upgrade as required patterning device able to programme between scan period two pulses of radiation in succession.This operator scheme can easily be applied to adopt in the maskless lithography of patterning device able to programme, and described patterning device able to programme is array of programmable mirrors type as mentioned above.
Can also adopt combination and/or the variation of above-mentioned pattern used, perhaps adopt diverse pattern.Shown in Figure 1 is a fluid feed system in addition, for example gas purge system 10 or with reference to figure 2-8 liquid-supplying system in greater detail.Hereinafter especially the routine that comprises gas purge system 10 " is done " lithographic equipment and describe one or more embodiment of the present invention.Yet one or more embodiments of the present invention can be applied to comprise the immersion lithography apparatus of liquid-supplying system equally.Especially, liquid-supplying system can comprise a seal element, and it is configured to comprise at least partly liquid between last element of optical projection system and substrate.In addition, the sealing element can with base station, substrate, supporting construction, patterning device or its any being connected.
Fig. 2 shows a lithographic equipment, and it comprises the gas purge system 10 according to one embodiment of the invention.Especially, Fig. 2 shows the cleaning system 10 as comprising purification cover 11.This cleaning system 10 is arranged to provide the gas cleaning of layering substantially to flow in purifying volume 20.Cleaning system 10 purification cover 11 in particular is connected with optical projection system PL rigidly by the parts 18 that are rigidly connected, and makes purification cover 11 usually be limited in X, Y and Rz direction relative to moving of optical projection system PL.In another embodiment, purification cover 11 can with lithographic equipment in another parts be connected rigidly, for example with reference to or the metrology frame (not shown).As shown in Figure 2, it is an axle vertical with the plane that is limited by X and Y-axis to the Z direction.In addition, its common direction of propagating corresponding to projecting beam substantially.The Rz direction is one and is used for the conventional sign of expression around the sense of rotation of Z axis.Cleaning system 10 can also be connected with optical projection system PL with the Ry direction at Z, Rx flexibly by flexible joint parts, and wherein as shown in Figure 2, they correspond respectively to around the conventional sign of the sense of rotation of X and Y-axis for Rx and Ry direction.In another embodiment, flexible link 16 can be connected with another parts in lithographic equipment, for example reference or metrology frame (not shown).
In addition, with the form of gas bearing 12 or randomly with the form of at least part of vacuum 14, implement to provide a junction spare 12,14 so that with purification cover 11 and substrate W, base station WT or above-mentioned both be connected.As hereinafter discussing more in detail, in the embodiment shown in Fig. 2, gas bearing shows with reference number 12, vacuum reference number 14 demonstrations.Yet, according to special embodiment, can the exchanging gas bearing and the position separately of vacuum.For example, in another embodiment,, by arranging vacuum on purification volume 20 1 sides at purification cover 11 and arrange gas bearing on surrounding environment 25 1 sides of purification cover 11, can reduce purified gas or prevent that it from entering into surrounding environment 25.This is favourable, because have been found that the purified gas of the environment that enters into lithographic equipment may affect measuring system, and interferometer measuration system IF shown in Figure 1 for example.In one embodiment, provide a vacuum ring, so that the inward flange of sealing purification cover, this edge is near vacuum 20.In this way, can remove purified gas prevents from or reduces gas from gas bearing entering into and purifying volume 20 simultaneously.Outward flange and surrounding environment 25 sealings that in addition, can provide the external vacuum ring to make purification cover.In this way, seldom or there is no purified gas or from the gas of gas bearing, can enter surrounding environment 25, be provided with sensing unit in this environment, for example interferometric measuring means IF.Therefore, in one embodiment, the vacuum link and being configured to that is configured to seal the inward flange of purification cover seals the outer peripheral vacuum link of purification cover and arranges and constitute vacuum ring.
Supply with 52 by gas gas is offered link 12,14, then from a gas outlet 53, discharge.Link 12,14 is by a normally regulator control of control element 26.Control element 26 is arranged to control and flow to cleaning system 10 and flowing and/or pressure from cleaning system 10 effluent airs randomly.Typically, control element is controlled the connection between cleaning system and base station, substrate, supporting construction, patterning device or its any combination.In one embodiment, control element is arranged to provide a minimal air gap between base station WT, substrate W, supporting construction MT, patterning device MA or its any combination and cleaning system 10, thereby make, purifies volume and surrounding environment isolation.
In addition, control element 26 can be controlled gas bearing 12,, so that by controlling gaseous tension and/or the vacuum that is offered this connection by gas bearing, provide a predetermined air gap between cleaning system 10 and base station WT, substrate W, supporting construction MT, patterning device MA or its any combination.
In one embodiment, one purification cover 11 is provided, at least a portion vacuum or a gas outlet wherein are provided on the either side of gas bearing 12, that is to say, one downtake pipe is arranged towards the purification volume 20 of purification cover 11, another gas outlet is arranged towards the ambient side 25 of purification cover 11, and a gas bearing 12 is provided between this downtake pipe and second exhaust pipe.In this way, can prevent or reduce purified gas and flow into environment 25, prevent that gas bearing any gas used from contacting with one or more optical elements of optical projection system.Therefore, can use for gas bearing 12 gas of high purification.In addition, can prevent or reduce the impact of environment, as prevent that pollutant from entering purification volume 20.
In one embodiment, link 12,14 is connected base station WT or above-mentioned between the two along Z, Rx provide a flexible connection with a direction in the Ry direction at least with substrate W at purification cover 11.By this flexible joint is provided, purification cover 11 can be followed substrate W or the base station WT any movement along the Z direction.In other words, purification cover 11 floats at the top of the base station WT with enough hardness along the Z direction, can avoid particularly any damage collision of substrate W with base station WT.As described in detail later,, by using gas such as purified gas as the gas bearing between substrate W and purification cover 11, provide a stable gap 22., in order to increase flexible joint 12,14 rigidity, can also provide an at least part of vacuum 14.In this way, can increase the stability of connection, can or above-mentionedly obtain stable gap 22 between the two at purification cover and substrate W, base station WT, and not need high tolerances in design.Additionally, when purified gas can not be discharged in environment, this at least part of vacuum 14 can be used for be discharged purified gas, because it may affect the measuring system in lithographic equipment, and interferometer measuration system IF shown in Figure 1 for example.
In Fig. 2, provide near the zone the part of optical projection system PL and purify volume 20.Projecting beam PB leaves optical projection system PL by the surface 21 of optical projection system PL, and this surface 21 is special parts of optical projection system PL, and purified gas is provided for it.In this way, can reduce the concentration of pollutant possible in the zone of the exit surface 21 of optical projection system PL, thereby avoid polluting optical projection system PL.Typically, the free space between purification cover 11 and optical projection system P1 is the order of magnitude of several millimeters.As Fig. 5 further in detail as shown in, by nozzle 52, purified gas is sprayed in purification cover 11.
Fig. 3 shows a kind of lithographic equipment, and it comprises the gas purge system according to another embodiment of the invention.Especially, in Fig. 3, with other gas bearing 30,31,32,33 replace as shown in Figure 2 be rigidly connected 18.Gas vent 32 can provide flow of pressurized gas 33 in order to gas bearing is provided.In addition, provide at least part of vacuum 30 supply and exhausts 31, increase thus by outlet 32 bearing rigidities that provide.Therefore, the gas bearing 30,31,32 of rigidity, 33 can provide being rigidly connected of purification cover 11 and optical projection system PL along X, Y and Rz direction.In addition, as described in detail later, provide a sealing between purification volume 20 and environment 25.Also provide a sealing between purification volume 20 and gas-pressurized 33.This layout is favourable in embodiments, and wherein gas-pressurized is as lower in the cleanliness of the CDA of purification than purified gas in the cleanliness of the dry air (CDA) of cleaning.Therefore, in this special embodiment, can prevent or reduce the gas-pressurized removing pollutant volume 20 than low cleaning.In one embodiment, can provide gas to pass through chamber 30 according to special applications and the bearing that needs, and from chamber 32, discharge.
One gas vent 34 can be provided to purified gas 35 and purify in volume 20.One at least part of vacuum 36 can be discharged purified gas 37 from purifying volume 20.And in Fig. 2, gas bearing 12,14 comprises single gas vent 12 and at least part of vacuum 14 in another embodiment shown in Fig. 3, provides a plurality of gas vents 12 and a plurality of at least part of vacuum 14.In this way, can further control the stability of gas bearing and flexible.In addition, can minimize being arranged near the interference of the measuring system of purification cover 11, and can keep the control to the gas cleanliness that are used for purification volume 20.In the embodiment that illustrates, gas vent 12 can be provided to flow of pressurized gas 13 in gap 22, and adjacent at least part of vacuum gas entrance 14 is expelled to small part air-flow 15.Similarly, gas vent 12 also provides air-flow subsequently, and adjacent at least part of vacuum gas entrance 14 is expelled to small part air-flow 15 subsequently.In the example that illustrates, two gas vents 12 and two gas accesses 14 are arranged, yet gas bearing 12,14 can comprise one or more gas vents and/or gas access.Can optimize the position of (a plurality of) outlet/(a plurality of) entrance, thereby prevent from or reduce gas 17 on every side entering purification volume 20, prevent that perhaps gas 13 from entering purification volume 20 and being discharged in its environment that may affect measuring system.
Gas bearing 12,14 can form a sealing 44 between the purification volume 20 that purifies with purified gas 35 and environment 25.Similarly, gas bearing 30,31,32,33 can also provide a sealing between purification volume 20 and environment 25.In this way, purified gas due to for example its to the impact of other parts in lithographic equipment or usually to the impact of environment, it may not a feasible selection, it can be used as purified gas, because according to one embodiment of the invention, purify volume 20 sealed, thereby the purification compartment of sealing substantially can be provided.These purified gas can be for example that poisonous gas maybe may disturb the gas of the performance of interferometer system IF.
Randomly, as shown in Figure 3, provide additional vacuum chamber 36 to remove most of purified gas before purified gas enters gas bearing vacuum inlet 14.In addition, can make the gas recirculation of discharge.
In one embodiment, do not use one or two chamber 12,14 that has respectively an excess pressure and vacuum, the function of gas bearing is provided with any array of chambers with pressure and vacuum, sealing and interpolation/removal purified gas.In one embodiment, this array can arrange to make flow direction opposite.Especially, make mobile inside from purification volume 20 towards environment 25 orientations.In one embodiment, can arrange the combination of flow direction.In this way, according to the flow direction of selecting, hope according to the user, it for example can be respectively determined by the character of the gas of purified gas and gas bearing, and, according to environment, can effectively control from the sealing of the gas flow environment purification of environment or from the sealing of the gas flow environment of environment purification.
Chamber can also replace with porosint zone, and this porosint is arranged in the surface 19 of contiguous substrate W, base station WT or the two purification cover, thereby consistent and stable gas flow are provided.Typically, simulation model for mixing gases flows fully.In this way, can further control gas bearing, and the relative stiffness of control bearing and/or flexible.In one embodiment, chamber can be the ring with a plurality of apertures.This layout is suitable for gas-pressurized.In one embodiment, wherein gas bearing 30,31, and 32,33 are rigidly connected 18 replaces, and as shown in Figure 2, perhaps, in order further to improve the sealing that purifies between volume and environment 25, can also provide a flexible seal 46.
Fig. 4 shows the details according to the gas purge system of one embodiment of the invention.Especially, Fig. 4 shows the surface 19 of purification cover 11 as shown in Figure 2, its faces substrate W, base station WT or above-mentioned both.Especially, the zone 42 that gas-pressurized is provided is set in surface 19, and the zone 40 that at least part of vacuum is provided is set in this surface.Zone 40 as shown in Figure 4,42 can be annular.Therefore, can provide vacuum ring to be connected ring with gas seals respectively and is connected purification cover in the position of expectation.Inward flange and the outward flange that as previously mentioned, can provide vacuum ring 40 to seal respectively purification cover.Gas is supplied with ring 42 in purification cover and substrate W, base station WT or the above-mentioned gap that forms between the two.This ring can center arrangement.In one embodiment, purified gas is sprayed into and purifies volume 20, then by gas outlet and/or vacuum, remove.In a special embodiment, inner most vacuum ring 40 is particularly suitable as the gas outlet of purified gas.In this way, prevent or reduce the purified gas entered environment.In addition, can improve performance, because can be according to the vacuum control flow pattern that applies by vacuum ring.
Be used for providing the zone 42 of gas-pressurized to comprise that a plurality of gas vents 12 (also can be expressed as gas chamber 12) can provide gas-pressurized by this gas chamber.Be used for providing the zone 40 of at least part of vacuum to comprise a plurality of entrances 14, also can be expressed as vacuum chamber 14, by this vacuum chamber can be from gap 22 Exhaust Gas.Similarly, zone 41 is corresponding to the purified gas gas outlet, and it comprises that a plurality of entrances 36 (also can be expressed as vacuum chamber) can be from purifying volume 20 Exhaust Gas by this vacuum chamber.As mentioned above, zone 40,42 can also or replacedly comprise the zone of porosint.The size of factor of porosity depends on the gas bearing of expectation.The factor of porosity of for example supplying with the zone 42 of gas-pressurized can be greater than the factor of porosity of vacuum area 40.In the embodiment that illustrates, gas vent 12 has the sectional area less than gas access 14 usually.In this way, can accurately control the gaseous tension of supply.Similarly, outlet 12 distributions with respect to entrance 14 can also change.For example,, in order to control the gaseous tension of being supplied with by bearing, can provide with respect to entrance 14 outlet 12 of larger density.In the embodiment that illustrates, the distribution of gas vent 12 is roughly identical with the distribution of gas access 14.In the embodiment that illustrates, the surface 19 of contiguous substrate W, base station WT or the two purification cover 11 is circular substantially.Yet the shape on surface 19 can change according to the design of particular purification cover 11.Provide hole 45 in surperficial 19 centers, projecting beam is by this hole before projecting beam PB incides substrate W.In the embodiment that illustrates, hole 45 is circular substantially.Yet for example according to the projecting beam of being carried by optical projection system PL and the design of purification cover, hole 45 can have different shapes.In Fig. 4, show the zone 49 between two chambers.In this zone 49, purification cover 11 and substrate/base station are arranged to such an extent that be close together, and a small gap 22 makes it separately.In this way, can be at the high flow velocity of this region generating.The sealing effectiveness between purification cover 11 and environment 25 can also be further improved in the zone 49 of this high flow rate.
Fig. 5-8 show a kind of lithographic equipment, and it comprises a gas purge system according to another embodiment of the invention.With reference to figure 5-7, for example in scan period, the purification cover 11 in use can so be arranged and make the contiguous base station WT of its part and the contiguous substrate W of part.In order to address this problem, the surface 51 of the base station WT of contiguous purification cover 11 is smooth in one embodiment.In addition, the height on base station WT surface 51 flushes with the surface 54 of substrate W in one embodiment substantially when its contiguous purification cover 11.That is to say, the surface elevation of base station WT and the surface elevation of substrate W are identical substantially.This can realize by a dimple 50 that is arranged to hold substrate is provided in the embodiment shown in Fig. 5-7, this substrate is arranged in base station WT.This dimple 50 has substantially the measure-alike degree of depth with substrate W on the Z direction, namely identical with the thickness of substrate W substantially.This substrate W is arranged in dimple.When dimple 50 so being set making substrate W fill most of area of dimple, substrate just needn't be filled dimple 50 fully., for the substrate that allows to have different size is contained in same dimple 50, around the gap 55 of substrate W, allow.May produce and reveal between the side of dimple 50 and substrate or base station.This leakage may cause surrounding air to enter the purification volume or purified gas is leaked to environment from purifying volume, for example when moving on the edge of purification cover 11 in substrate W.Provide gas access/outlet array to address this problem by the side around dimple 50, wherein purified gas can be blown into or sucking-off by the inlet/outlet array around dimple 50 sides.In addition, Fig. 5 shows gas and supplies with 52, by this gas supply with gas that purified gas, gas bearing can be provided or above-mentioned both.In the embodiment that illustrates, purified gas and gas bearing gas all provide by same supply 52.
Fig. 6 shows another embodiment, and wherein lithographic equipment is scanning and/or exposing operation.When scanning, purification cover 11 moves on substrate W.In case substrate W, by radiant exposure, is just carried out base station WT exchange, the base station that wherein is furnished with substrate wherein is furnished with another base station WT replacement of another substrate W.This step can for example carried out in two desk-top lithographic equipments.Perhaps,, in case a substrate W is completed scanning, just from dimple 50, remove substrate.Then, will be arranged in dimple 50 for the next substrate W of scanning subsequently.
In Fig. 6-8, show the example of base station WT exchange., for exchange base base frame WT, optionally can remove the vacuum of purification cover 11; Yet this not necessarily.As described below,, for the embodiment of wherein having used closure plate, usually keep vacuum exchange base base frame WT simultaneously always.In addition, perhaps replacedly, as shown in Figure 6, provide one or more actuating devices 60.By a junction spare 62, actuating device 60 is connected with optical projection system PL, and by another link 64, actuating device is connected with purification cover 11.When carrying out base station WT exchange, the actuating of actuating device 60 can promote purification cover 11.In one embodiment, actuating device can use the layout of magnet selectively to promote purification cover when needed, and allows base station WT or substrate W exchange.
Fig. 7 shows and is receiving the lithographic equipment of operation, and wherein base station WT moves relative to optical projection system PL and cleaning system 10, thereby allows to carry out the exchange of base station WT.In order to protect optical projection system PL to avoid polluting between base station WT commutation period, a closure plate is provided, be used for covering the hole 45 between purification cover 11 and optical projection system PL.Especially, moistening between base station WT commutation period in order to keep optical projection system, a closure plate is provided in the immersion lithographic method.Utilize closure plate, can comprise for example water or keep it to flow of liquid between base station WT commutation period.Usually provide this closure plate (CD) in being arranged in another dimple 70 of base station WT.If use this closure plate, dimple 70 has and the thickness of closure plate (CD) the identical degree of depth substantially, thereby when in use being arranged in closure plate (CD) in dimple 70, the flush of the surface of base station WT and closure plate (CD).In one embodiment, in case discharge vacuum in Fig. 6, randomly, activate actuating device 60, make that base station WT relatively is connected with cleaning system 10 optical projection system PL move to a position, make the closure plate CD of optical projection system PL disposed adjacent in dimple 70, as shown in Figure 7.In one embodiment,, in order to move to closure plate, needn't discharge vacuum, also needn't use actuating device to promote purification cover.Especially, in one embodiment, closure plate and primary backing are set to and the base station flush, and they only move by side to opposite side from one., in order to pick up closure plate, usually cut off gas-pressurized.Usually still keep vacuum, because closure plate is clamped in place.
In case, in the position of adjacent closure plate, just start at least part of vacuum 14, thereby cause closure plate (CD) to be drawn onto on hole 45, as shown in Figure 8.This vacuum is used for from coiling CD at the memory location of base station WT lifting dish, and it is remained fixed on purification cover 11.In case sealing, just remove base station WT, as shown in Figure 8.Subsequently, provide another base station WT.Closure plate (CD) enclosed purification cover 11, therefore guaranteed high dilution gfactor when base station WT is not provided.This is useful to keep optical projection system cleaning and/or drying between base station WT or substrate W commutation period.
Although the invention is not restricted to use purified gas, in all embodiments of describing in the above, purified gas for example can comprise very pure nitrogen N 2, or the gas of selecting He, Ne, Ar, Kr and Xe from group, or any two or more potpourri in these gases.When (for example clean-room condition of standard) under the temperature and pressure condition identical measured and used the radiation of identical wavelength, gas componant used can be transparent substantially to the UV radiation of projecting beam wavelength, and in one embodiment, has identical with air substantially refractive index.In one embodiment, the air refraction under the wavelength of this refractive index and the radiation laser beam that uses in interferometer displacement measuring device IF (as shown in Figure 1) is identical.Purified gas pressure in mask and/or base station can be atmospheric pressure, and perhaps it can make any leakage only can cause gas to flow out higher than atmospheric pressure, and can be due to the air pollution system that enters.Gaseous mixture includes but not limited to the CDA of forced air, nitrogen and purification of air, the filtration of air, filtration.
The gas componant of using in gas bearing can be identical with purified gas or has the character similar with purified gas.Gas bearing needn't be used identical gas componant.Yet,, if use identical gas, can simplify for the gas of purified gas and gas bearing and supply with, because do not need the independent gas that is used for purified gas and gas bearing to supply with.Especially, can use the gas of any kind for gas bearing, for example the gas-pressurized of nitrogen, gas-pressurized or filtration.The pressure of supply gas depend on desired size, the cleaning system in gap 22 quality, depend on especially the area of purification cover and gas vent.Usually the gaseous tension scope is 6 bar or less.If other factors remains unchanged substantially, export by gas bearing the gaseous tension of supplying with so higher, the size in gap 22 will be larger.Provide a regulator to control gas flow by gas bearing, in order to keep gap 22 to have enough size accurately.In this way, gas bearing can provide a flexible joint.In one embodiment, increase the gas volume of gas vent front, in order to guarantee pressure being uniformly distributed of each gas vent, thereby obtain more stable supporting.The size in gap 22 is usually less than about 100 microns.In non-immersion lithographic, gap along the typical sizes of Z direction in the 30-200 micrometer range.In immersion lithographic intermediate gap 22 along the typical sizes of Z direction in 30 micrometer ranges.Especially, approximately between the 10-50 micron.Yet, use regulator, the size in gap can change according to the operating conditions of expectation, this operating conditions for example can by in a substrate or the flatness with the substrate surface between the substrate of different-thickness determine.In the air bearing of routine, the typical sizes in gap is the order of magnitude of 8-15 micron.
In one embodiment, the gas-pressurized in gas bearing 12,14, provide at least part of vacuum,, for the gaseous tension that is approximately 6 bar, provide scope greatly about the vacuum of-0.4--0.8bar.Should be appreciated that, the vacuum that needs depends on special purification cover 11 and in purification cover and base station WT, substrate W or the above-mentioned required gas bearing in gap 22 that keeps between the two.
In embodiment as shown in drawings, illustrate and described the cleaning system of using near base station.Yet especially, embodiment of the present invention can be applicable to reticle MT, that is to say, can be applicable to the supporting construction MT of patterning device MA.Therefore, in another embodiment, provide a cleaning system 10 to be used for providing gas to purifying volume, this purification volume comprises at least a portion irradiation system IL.A junction spare can be provided, be used for connecting cleaning system 10 and supporting construction MT and/or patterning device MA.In this way, the benefit that gives the base station description also can be shared by masked MT.
In one embodiment, supporting construction MT and/or patterning device MA are arranged in a zone that is limited by the first and second different directions.Cleaning system 10 is connected with supporting construction MT and/or patterning device MA along third direction, and extend at angle in this third direction and this zone.In one embodiment, cleaning system is along third direction, around the sense of rotation of first direction, around sense of rotation or its any combination and supporting construction MT and/or the patterning device MA flexible joint of second direction.In one embodiment, cleaning system 10 is along first direction, second direction, be rigidly connected around the sense of rotation of third direction or its any combination and irradiation system IL.
In one embodiment, supporting construction MT has a dimple that is arranged to hold patterning device, and wherein for example, this dimple has a degree of depth, and it equals the thickness of patterning device substantially.In one embodiment, this dimple has the edge that extends around dimple on every side, this device also comprises gas access and/or a gas vent array that arranges around the dimple edge, thereby when purification cover moves on patterning device, prevents the gas from leaking in volume or from volume and leak out.In one embodiment, be arranged to receive projecting beam patterning device MA surface substantially with the flush of supporting construction MT.In one embodiment, the gas bearing in use provides a stable gap between the patterning device surface that is arranged to receive projecting beam and cleaning system.In one embodiment, gas bearing comprises a control element, and normally a regulator, be used for controlling flowing and/or pressure of gas, thereby control, is arranged to receive the patterning device surface of projecting beam and the gap size between cleaning system.Especially, gas bearing comprises that one is used for providing gas to supply with, be used for removing from this connection at least part of vacuum and a control element of gas to the gas that connects, this control element is arranged to control gas and supplies with and at least part of vacuum, the third direction that makes cleaning system edge and a zone extend at angle floats and has on patterning device surface, supporting construction or the two surface of enough hardness, and this zone that wherein is furnished with supporting construction is limited by first direction and second direction.
In one embodiment, cleaning system comprises a purification cover, and this purification cover is connected with supporting construction and/or patterning device.In one embodiment, cleaning system comprises a purification cover, and gas bearing comprises that one is configured to promote along third direction the actuating device of purification cover, and wherein this third direction, along with zone direction at angle, extending, is furnished with supporting construction in this zone.Device can also comprise an actuating device in conjunction with the link layout, thereby along third direction, promotes purification cover, and wherein third direction edge and zone direction are at angle extended, and have arranged supporting construction in this zone.Actuating device promotes purification cover 11 with one or more magnets.One control element can also be provided, be used for controlling the connection between cleaning system and supporting construction and/or patterning device.Especially, link can comprise a gas bearing and a control element, and they are arranged to provide a minimal air gap between supporting construction and/or patterning device and cleaning system, thereby make, purifies volume and surrounding environment isolation.
Although specific embodiment of the invention scheme described above, be appreciated that and can be different from enforcement the present invention described above.Instructions is not to limit the present invention.

Claims (9)

1. lithographic equipment comprises:
Be configured to regulate the irradiation system of radiation laser beam;
Be configured to support the supporting construction of patterning device, this patterning device is given to radiation laser beam at the xsect of radiation laser beam with pattern;
Be configured to keep the base station of substrate;
Be configured to patterned light beam projecting to the optical projection system in the target section of substrate;
Be configured to fluid is offered the fluid feed system of a volume, this volume comprises at least a portion in optical projection system, at least a portion in irradiation system, or above-mentioned both;
Be used for covering the closure plate in the hole between described fluid feed system and described optical projection system;
Be configured to connect the link of described closure plate to described fluid feed system;
Described fluid feed system comprises gas purge system, described volume is for purifying volume, described gas purge system is configured to gas is offered described purification volume, described purification volume comprise at least a portion optical projection system, at least a portion irradiation system or above-mentioned both;
Described gas purge system is connected with described optical projection system by gas bearing, be rigidly connected parts or flexible attachment components; And
Described link is gas bearing.
2. lithographic equipment according to claim 1, wherein, described gas bearing comprises at least part of vacuum.
3. lithographic equipment according to claim 2, wherein, described gas bearing is provided with a plurality of gas vents and a plurality of at least part of vacuum gas entrance.
4. lithographic equipment according to claim 3, wherein, described gas vent and described gas access are arranged on annular gas supply area and annular at least partly in vacuum area.
5. lithographic equipment according to claim 4, wherein, each comprises porosint described annular gas supply area and at least part of vacuum area of described annular.
6. lithographic equipment according to claim 4, wherein, the factor of porosity of the porosint of described annular gas supply area is greater than the factor of porosity of the porosint of at least part of vacuum area of described annular.
7. lithographic equipment according to claim 3, wherein, be cut off from the gas of described gas vent in order to pick up described closure plate.
8. lithographic equipment according to claim 1, wherein said closure plate is arranged in described base station, and the flush of the surface of described closure plate and described base station.
9. device making method comprises:
Use optical projection system patterned radiation laser beam to be projected to the target section of substrate;
Use fluid feed system to provide fluid to a volume, this volume comprise at least a portion in optical projection system, at least a portion in irradiation system or above-mentioned both; And
Fluid feed system is connected with closure plate, and described closure plate is used for covering the hole between described fluid feed system and described optical projection system;
Described fluid feed system comprises gas purge system, described volume is for purifying volume, described gas purge system is configured to gas is offered described purification volume, described purification volume comprise at least a portion optical projection system, at least a portion irradiation system or above-mentioned both;
Described gas purge system is connected with described optical projection system by gas bearing, be rigidly connected parts or flexible attachment components; And
By gas bearing, fluid feed system is connected with described closure plate or substrate.
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