CN101911250A - 利用粒子束的薄膜材料处理方法 - Google Patents

利用粒子束的薄膜材料处理方法 Download PDF

Info

Publication number
CN101911250A
CN101911250A CN2008801244595A CN200880124459A CN101911250A CN 101911250 A CN101911250 A CN 101911250A CN 2008801244595 A CN2008801244595 A CN 2008801244595A CN 200880124459 A CN200880124459 A CN 200880124459A CN 101911250 A CN101911250 A CN 101911250A
Authority
CN
China
Prior art keywords
substrate
amorphous phase
zone
ion
treatment substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2008801244595A
Other languages
English (en)
Chinese (zh)
Inventor
乔纳森·吉罗德·英格兰
拉杰许·都蕾
卢多维克·葛特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Semiconductor Equipment Associates Inc
Original Assignee
Varian Semiconductor Equipment Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Semiconductor Equipment Associates Inc filed Critical Varian Semiconductor Equipment Associates Inc
Publication of CN101911250A publication Critical patent/CN101911250A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/38Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
    • H10P14/3802Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H10P14/3818Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using particle beams
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B1/00Single-crystal growth directly from the solid state
    • C30B1/02Single-crystal growth directly from the solid state by thermal treatment, e.g. strain annealing
    • C30B1/023Single-crystal growth directly from the solid state by thermal treatment, e.g. strain annealing from solids with amorphous structure
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02Elements
    • C30B29/06Silicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F10/00Individual photovoltaic cells, e.g. solar cells
    • H10F10/10Individual photovoltaic cells, e.g. solar cells having potential barriers
    • H10F10/16Photovoltaic cells having only PN heterojunction potential barriers
    • H10F10/164Photovoltaic cells having only PN heterojunction potential barriers comprising heterojunctions with Group IV materials, e.g. ITO/Si or GaAs/SiGe photovoltaic cells
    • H10F10/165Photovoltaic cells having only PN heterojunction potential barriers comprising heterojunctions with Group IV materials, e.g. ITO/Si or GaAs/SiGe photovoltaic cells the heterojunctions being Group IV-IV heterojunctions, e.g. Si/Ge, SiGe/Si or Si/SiC photovoltaic cells
    • H10F10/166Photovoltaic cells having only PN heterojunction potential barriers comprising heterojunctions with Group IV materials, e.g. ITO/Si or GaAs/SiGe photovoltaic cells the heterojunctions being Group IV-IV heterojunctions, e.g. Si/Ge, SiGe/Si or Si/SiC photovoltaic cells the Group IV-IV heterojunctions being heterojunctions of crystalline and amorphous materials, e.g. silicon heterojunction [SHJ] photovoltaic cells
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/10Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material
    • H10F71/103Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material including only Group IV materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/121The active layers comprising only Group IV materials
    • H10F71/1221The active layers comprising only Group IV materials comprising polycrystalline silicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H10P34/42Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901Materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901Materials
    • H10P14/2922Materials being non-crystalline insulating materials, e.g. glass or polymers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3402Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3404Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
    • H10P14/3411Silicon, silicon germanium or germanium
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/546Polycrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Recrystallisation Techniques (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Photovoltaic Devices (AREA)
CN2008801244595A 2007-11-13 2008-11-13 利用粒子束的薄膜材料处理方法 Pending CN101911250A (zh)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US98762907P 2007-11-13 2007-11-13
US98765007P 2007-11-13 2007-11-13
US98766707P 2007-11-13 2007-11-13
US60/987,650 2007-11-13
US60/987,629 2007-11-13
US60/987,667 2007-11-13
US12/269,276 US20090124064A1 (en) 2007-11-13 2008-11-12 Particle beam assisted modification of thin film materials
US12/269,276 2008-11-12
PCT/US2008/083391 WO2009064875A1 (en) 2007-11-13 2008-11-13 Particle beam assisted modification of thin film materials

Publications (1)

Publication Number Publication Date
CN101911250A true CN101911250A (zh) 2010-12-08

Family

ID=40624096

Family Applications (3)

Application Number Title Priority Date Filing Date
CN2008801244595A Pending CN101911250A (zh) 2007-11-13 2008-11-13 利用粒子束的薄膜材料处理方法
CN2008801245314A Pending CN101911255A (zh) 2007-11-13 2008-11-13 利用粒子束的薄膜材料处理方法
CN2008801202022A Pending CN101897006A (zh) 2007-11-13 2008-11-13 利用粒子束的薄膜材料处理方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN2008801245314A Pending CN101911255A (zh) 2007-11-13 2008-11-13 利用粒子束的薄膜材料处理方法
CN2008801202022A Pending CN101897006A (zh) 2007-11-13 2008-11-13 利用粒子束的薄膜材料处理方法

Country Status (6)

Country Link
US (3) US20090124065A1 (https=)
JP (3) JP2011503882A (https=)
KR (3) KR20100086042A (https=)
CN (3) CN101911250A (https=)
TW (3) TW200941550A (https=)
WO (3) WO2009064867A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI805022B (zh) * 2020-10-30 2023-06-11 美商希瑪有限責任公司 用於深紫外線光源之光學組件

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102099870A (zh) * 2008-06-11 2011-06-15 因特瓦克公司 用于在太阳能电池制作中使用的专用注入系统和方法
US20100053817A1 (en) * 2008-09-04 2010-03-04 Robert Glenn Biskeborn Coated magnetic head and methods for fabrication thereof
US8962376B2 (en) * 2009-04-21 2015-02-24 The Silanna Group Pty Ltd Optoelectronic device with lateral pin or pin junction
FR2946335B1 (fr) * 2009-06-05 2011-09-02 Saint Gobain Procede de depot de couche mince et produit obtenu.
US8749053B2 (en) 2009-06-23 2014-06-10 Intevac, Inc. Plasma grid implant system for use in solar cell fabrications
US20110039034A1 (en) * 2009-08-11 2011-02-17 Helen Maynard Pulsed deposition and recrystallization and tandem solar cell design utilizing crystallized/amorphous material
TWI459444B (zh) * 2009-11-30 2014-11-01 應用材料股份有限公司 在半導體應用上的結晶處理
DE112012002072B4 (de) * 2011-05-13 2023-11-16 Sumco Corp. Verfahren zur Herstellung eines epitaktischen Siliciumwafers, epitaktischer Siliciumwafer und Verfahren zur Herstellung einer Festkörperbildaufnahmevorrichtung
KR20120131753A (ko) * 2011-05-26 2012-12-05 삼성디스플레이 주식회사 박막 트랜지스터, 박막 트랜지스터의 제조 방법 및 유기 발광 표시 장치
US8652974B2 (en) * 2011-06-22 2014-02-18 Ipg Photonics Corporation Method and system for pre-heating of semiconductor material for laser annealing and gas immersion laser doping
TWI506719B (zh) 2011-11-08 2015-11-01 因特瓦克公司 基板處理系統及方法
US9318332B2 (en) 2012-12-19 2016-04-19 Intevac, Inc. Grid for plasma ion implant
CN106898540B (zh) * 2015-12-17 2020-01-31 宸鸿光电科技股份有限公司 半导体制造方法
DE102017119571B4 (de) 2017-08-25 2024-03-14 Infineon Technologies Ag Ionenimplantationsverfahren und ionenimplantationsvorrichtung
JP6812962B2 (ja) * 2017-12-26 2021-01-13 株式会社Sumco エピタキシャルシリコンウェーハの製造方法
CN111668353B (zh) * 2020-06-19 2021-12-17 錼创显示科技股份有限公司 发光半导体结构及半导体基板
TWI728846B (zh) 2020-06-19 2021-05-21 錼創顯示科技股份有限公司 發光半導體結構及發光半導體基板
CN117374146B (zh) * 2023-12-06 2024-11-12 山东大学 半导体探测器及其能量自刻度、状态监测方法

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5758315A (en) 1980-09-25 1982-04-08 Toshiba Corp Manufacture of semiconductor single crystal film
JPS57148341A (en) * 1981-03-09 1982-09-13 Nippon Telegr & Teleph Corp <Ntt> Crystal growth of amorphous layer or polycrystalline layer on single crystal layer
US4622093A (en) * 1983-07-27 1986-11-11 At&T Bell Laboratories Method of selective area epitaxial growth using ion beams
JPS6037719A (ja) * 1983-08-10 1985-02-27 Seiko Epson Corp 半導体装置の製造方法
JP2595525B2 (ja) * 1987-04-10 1997-04-02 ソニー株式会社 半導体薄膜の形成方法
JPH0319321A (ja) * 1989-06-16 1991-01-28 Fujitsu Ltd 半導体結晶形成方法
JP2726118B2 (ja) * 1989-09-26 1998-03-11 キヤノン株式会社 堆積膜形成法
JP2662058B2 (ja) * 1989-11-14 1997-10-08 日本板硝子株式会社 半導体膜の製造方法
JPH04294523A (ja) * 1991-03-22 1992-10-19 Toshiba Corp 半導体装置の製造方法
JP2662321B2 (ja) * 1991-05-31 1997-10-08 科学技術振興事業団 超低速クラスターイオンビームによる表面処理方法
JPH0529215A (ja) * 1991-07-22 1993-02-05 Nippon Telegr & Teleph Corp <Ntt> ビームアニール方法
JP3194608B2 (ja) * 1991-11-15 2001-07-30 株式会社ニューラルシステムズ 中性粒子のビーム照射による再結晶化方法
US5350926A (en) * 1993-03-11 1994-09-27 Diamond Semiconductor Group, Inc. Compact high current broad beam ion implanter
JP3450376B2 (ja) * 1993-06-12 2003-09-22 株式会社半導体エネルギー研究所 半導体装置の作製方法
DE69430230T2 (de) * 1993-10-14 2002-10-31 Mega Chips Corp., Osaka Verfahren und Vorrichtung zur Herstellung eines Einkristallinen dünnen Films
US6884698B1 (en) * 1994-02-23 2005-04-26 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device with crystallization of amorphous silicon
JPH09153458A (ja) * 1995-09-26 1997-06-10 Fujitsu Ltd 薄膜半導体装置およびその製造方法
JP3841910B2 (ja) 1996-02-15 2006-11-08 株式会社半導体エネルギー研究所 半導体装置の作製方法
JPH10256153A (ja) 1997-03-17 1998-09-25 Nippon Telegr & Teleph Corp <Ntt> 非晶質Si層の低温単結晶化法
US6200631B1 (en) * 1997-10-27 2001-03-13 Praxair Technology, Inc. Method for producing corrosion resistant refractories
KR19990050318A (ko) 1997-12-17 1999-07-05 윤덕용 저온공정에 의한 비정질 실리콘 박막의 결정화 방법
US6130436A (en) * 1998-06-02 2000-10-10 Varian Semiconductor Equipment Associates, Inc. Acceleration and analysis architecture for ion implanter
US6635880B1 (en) * 1999-10-05 2003-10-21 Varian Semiconductor Equipment Associates, Inc. High transmission, low energy beamline architecture for ion implanter
JP4869504B2 (ja) * 2000-06-27 2012-02-08 株式会社半導体エネルギー研究所 半導体装置の作製方法
EP1288996B1 (en) 2001-09-04 2006-03-22 Advantest Corporation Particle beam apparatus
US6933507B2 (en) * 2002-07-17 2005-08-23 Kenneth H. Purser Controlling the characteristics of implanter ion-beams
TW569350B (en) 2002-10-31 2004-01-01 Au Optronics Corp Method for fabricating a polysilicon layer
WO2005021430A1 (ja) * 2003-08-27 2005-03-10 Nu Eco Engineering Co., Ltd. カーボンナノウォールの製造方法、カーボンナノウォールおよび製造装置
US20060113489A1 (en) * 2004-11-30 2006-06-01 Axcelis Technologies, Inc. Optimization of beam utilization
JP2006245326A (ja) 2005-03-03 2006-09-14 A.S.K.株式会社 単結晶シリコン薄膜トランジスタ
US7482598B2 (en) * 2005-12-07 2009-01-27 Varian Semiconductor Equipment Associates, Inc. Techniques for preventing parasitic beamlets from affecting ion implantation

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI805022B (zh) * 2020-10-30 2023-06-11 美商希瑪有限責任公司 用於深紫外線光源之光學組件
TWI853580B (zh) * 2020-10-30 2024-08-21 美商希瑪有限責任公司 用於深紫外線光源之光學組件

Also Published As

Publication number Publication date
WO2009064867A3 (en) 2009-07-02
TW200941550A (en) 2009-10-01
US8003498B2 (en) 2011-08-23
TW200941549A (en) 2009-10-01
WO2009064872A3 (en) 2009-07-02
CN101911255A (zh) 2010-12-08
WO2009064872A2 (en) 2009-05-22
US20090124065A1 (en) 2009-05-14
JP2011503882A (ja) 2011-01-27
WO2009064875A1 (en) 2009-05-22
KR20100106374A (ko) 2010-10-01
WO2009064867A2 (en) 2009-05-22
CN101897006A (zh) 2010-11-24
US20090124066A1 (en) 2009-05-14
JP2011503883A (ja) 2011-01-27
US20090124064A1 (en) 2009-05-14
KR20100086042A (ko) 2010-07-29
TW200943432A (en) 2009-10-16
JP2011505685A (ja) 2011-02-24
KR20100105595A (ko) 2010-09-29

Similar Documents

Publication Publication Date Title
CN101911250A (zh) 利用粒子束的薄膜材料处理方法
US10840100B2 (en) Method of thermal processing structures formed on a substrate
US11107968B1 (en) All-semiconductor Josephson junction device for qubit applications
JP2013502076A (ja) パルス堆積及び再結晶、並びに、結晶化/アモルファス材料を利用したタンデム太陽電池構造
CN103370769B (zh) 用于太阳能电池制造中的固相外延再生长的直流离子注入
US20090181492A1 (en) Nano-cleave a thin-film of silicon for solar cell fabrication
US20190318947A1 (en) Low Thermal Budget Annealing
US8697549B2 (en) Deposition of porous films for thermoelectric applications

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20101208