CN101872817B - Light-emitting diode packaging structure and manufacturing method thereof - Google Patents
Light-emitting diode packaging structure and manufacturing method thereof Download PDFInfo
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- CN101872817B CN101872817B CN2009101373569A CN200910137356A CN101872817B CN 101872817 B CN101872817 B CN 101872817B CN 2009101373569 A CN2009101373569 A CN 2009101373569A CN 200910137356 A CN200910137356 A CN 200910137356A CN 101872817 B CN101872817 B CN 101872817B
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- transparent body
- emitting diode
- shaped support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
The invention discloses a light-emitting diode packaging structure and a manufacturing method thereof. The coating thickness of a florescent powder conversion layer can be changed by defining a transparent body with a cup-shaped structure, so that the thicknesses of florescent powder are different, and thus, florescent powder conversion layers that the large-angle emitting light passes by are reduced, and the problem of non-uniform light emission of the packaging body is solved. The light-emitting diode packaging structure comprises a cup-shaped support, at least one light-emitting diode chip, at least one transparent body and at least one florescent powder conversion layer, wherein the light-emitting diode chip is installed in the cup-shaped support; the transparent body is installed on the inner wall of the cup-shaped support and surrounds the light-emitting diode chip; the florescent powder conversion layer fills in the cup-shaped support so as to cover the light-emitting diode chip and the transparent body; and the height of the transparent body is greater than the height of the light-emitting diode chip and smaller than the depth of the cup-shaped structure, and the transparent body does not cover the light-emitting diode chip.
Description
Technical field
The present invention relates to a kind of package structure for LED and its manufacture method; Especially a kind of package structure for LED and its manufacture method of use one transparent material; It can change fluorescent material conversion coating coating thickness whereby through the transparent body of definition cup-like structure, makes variantization of fluorescent material thickness; Let the wide-angle bright dipping reduce the fluorescent material conversion coating of process, improve the uneven problem of packaging body bright dipping.
Background technology
In the field of diode package, conventional package body (slurry package) 1 mixes the formed mixture 11 in back with fluorescent material and colloid according to special ratios and directly coat on the light-emitting diode chip for backlight unit 12 and fill up bowl cup 13, and be as shown in Figure 1.This fluorescent-powder coating method is simple, therefore has many packaging bodies to adopt this kind encapsulating structure.Yet, in Fig. 1,, after fluorescent material transforms, have colour temperature height phenomenon pockety owing to behind the chip light emitting, go out light path 14 differences, it is peripheral in the bowl cup to form gold-tinted, causes so-called yellow dizzy phenomenon.Because yellow dizzy phenomenon can make light-emitting diode bright dipping irregular colour even; Especially on the uniform application product of needs light source, like the light-emitting diode operating lamp, its uniformity needs to consider; Otherwise cause the error in judgement of tissue, can cause the problem that to assess when operating on.Use the medical operation lamp of conventional light source the Light and radiation heat of ultraviolet light wave band to be arranged at present, can patient's affected part be exerted an adverse impact, so the light-emitting diode that manufacturer's desire of medical industries is used cold light is as lamp light source because of using Halogen lamp LED.But commercially available light-emitting diode has serious Huang circle problem at present, is applied to have on the operating lamp the even situation of irregular colour.
Therefore, the someone develops conformal coating (conformal coating) encapsulation technology, and it lets blue light pass through the fluorescent material of same distance at the chip 21 peripheral fluorescent material conversion coatings 22 of making equal thickness, so can obtain the light of same colour temperature, and is as shown in Figure 2.But the conformal coating technique has the problem of crystal grain imaging under the projection of secondary optics element, this problem can not meet the rules of depth when the medical illumination purposes, and its reason is promptly broken in the light type of non-imaging plane.
HP among 316 " the Multiple encapsulation of phosphor-LEDdevices ", proposes around chip 32, to produce the fluorescent material conversion coating 31 of one deck equal thickness in U.S. Pat 5,959, and is as shown in Figure 3.The light that lets chip 32 sent in theory passes through the fluorescent material conversion coating 31 of equal thickness, and the conventional package body that its light-emitting uniformity can be more shown in Figure 1 is good, but its manufacture craft is not easy, and certain degree of difficulty is arranged on the implementation.
In addition, though there are many modes to improve the uniformity, when considering light type and uniformity subject under discussion, often manufacture craft difficulty or light type do not reach requirement, in U.S. Pat 6,650, use screen painting or electrophoretic deposition in 040, but the light type are not right like Lumileds; AVAGO Technologies is in U.S. Pat 7,129, utilizes fluorescent material sedimentation relation in 638, forms the fluorescent material conversion coating of a uniform thickness, however the suitable difficulty of its manufacture craft.
In addition, Hsing Chen makes a transparent body with the mold mode, and in this transparent body, fills fluorescent material in the open application case US20080121922 of United States Patent (USP) around chip, increase rising angle.GELcore is in the open application case US6 of United States Patent (USP), in 917,057, around chip, makes the transparent body that is not higher than chip height at rack surface.The above-mentioned encapsulating structure that both propose all can not improve the colour temperature uniformity.
Based on the problems referred to above, the present invention proposes a kind of package structure for LED, improving the uneven phenomenon of color temperature distribution in the conventional package structure, and solves the crystal grain imaging problem of conformal coating technique.
Summary of the invention
A purpose of the present invention is to provide a kind of package structure for LED and its manufacture method, to improve the uneven phenomenon of color temperature distribution in the conventional package structure.
Another object of the present invention is to provide a kind of package structure for LED and its manufacture method, to solve the crystal grain imaging problem of conformal coating technique.
In order to realize above-mentioned purpose, the present invention provides a kind of package structure for LED, and it comprises: a cup-shaped support; At least one light-emitting diode chip for backlight unit, it is installed in this cup-shaped support; At least one transparent body, it is installed on the inwall of this cup-shaped support and around this light-emitting diode chip for backlight unit; And at least one fluorescent material conversion coating, it is filled in this cup-shaped support, to cover this light-emitting diode chip for backlight unit and this transparent body; Wherein the height of this transparent body is greater than the height of this light-emitting diode chip for backlight unit, and is not more than the degree of depth of this cup-like structure, and this transparent body does not cover this light-emitting diode chip for backlight unit.
In another embodiment, the present invention more provides a kind of manufacture method of package structure for LED, may further comprise the steps: a cup-shaped support is provided; Install at least one light-emitting diode chip for backlight unit in this cup-shaped support; Form at least one transparent body, it is installed on the inwall of this cup-shaped support and around this light-emitting diode chip for backlight unit; And fill at least one fluorescent material conversion coating in this cup-shaped support, to cover this light-emitting diode chip for backlight unit and this transparent body; Wherein the height of this transparent body is greater than the height of this light-emitting diode chip for backlight unit, and is not more than the degree of depth of this cup-like structure, and this transparent body does not cover this light-emitting diode chip for backlight unit.
Description of drawings
Fig. 1 is a known LED encapsulation body cross sectional representation;
Fig. 2 is another known LED encapsulation body cross sectional representation;
Fig. 3 is another known LED encapsulation body cross sectional representation;
Fig. 4 is the package structure for LED cross sectional representation of the present invention's first specific embodiment;
Fig. 5 A to Fig. 5 D is the sketch map of the manufacture method of the package structure for LED of the present invention's first specific embodiment;
Fig. 6 is the package structure for LED cross sectional representation of the present invention's second specific embodiment;
Fig. 7 is the package structure for LED cross sectional representation of the present invention's the 3rd specific embodiment;
Fig. 8 is the package structure for LED cross sectional representation of the present invention's the 4th specific embodiment;
Fig. 9 is the package structure for LED cross sectional representation of the present invention's the 5th specific embodiment; And
Figure 10 is the package structure for LED cross sectional representation of the present invention's the 6th specific embodiment.
Wherein, Reference numeral
The 1-packaging body
11-fluorescent material
The 12-light-emitting diode chip for backlight unit
13-bowl cup
14-goes out light path
The 21-chip
22-fluorescent material conversion coating
31-fluorescent material conversion coating
The 32-chip
The 4-package structure for LED
The 41-cup-shaped support
The 42-light-emitting diode chip for backlight unit
The 43-transparent body
44-fluorescent material conversion coating
The 6-package structure for LED
The 62-light-emitting diode chip for backlight unit
The 63-transparent body
The 7-package structure for LED
The 71-cup-shaped support
The 73-transparent body
The 8-package structure for LED
The 81-cup-shaped support
The 83-transparent body
The 85-micro-structural
The 9-package structure for LED
The 91-cup-shaped support
The 93-transparent body
The 10-package structure for LED
The 101-cup-shaped support
The 103-transparent body
Embodiment
For making those skilled in the art further cognition and understanding arranged to characteristic of the present invention, purpose and function; The hereinafter spy describes the relevant thin bilge construction of device of the present invention and the theory reason of design; So that those skilled in the art can understand characteristics of the present invention, specify statement as follows:
See also Fig. 4, it is for the package structure for LED cross sectional representation of the present invention's first specific embodiment.In Fig. 4, the present invention provides a kind of package structure for LED 4, and it comprises: a cup-shaped support 41; At least one light-emitting diode chip for backlight unit 42, it is installed in this cup-shaped support 41; At least one transparent body 43, it is installed on the inwall of this cup-shaped support 41 and around this light-emitting diode chip for backlight unit 42; And at least one fluorescent material conversion coating 44, it is filled in this cup-shaped support 41, to cover this light-emitting diode chip for backlight unit 42 and this transparent body 43.Wherein the height of this transparent body 43 is greater than the height of this light-emitting diode chip for backlight unit 42, and the degree of depth and this transparent body 43 that are not more than this cup-like structure 41 do not cover this light-emitting diode chip for backlight unit 42.
In one embodiment, this transparent body 43 and this light-emitting diode chip for backlight unit interval one distance, as shown in Figure 4.In one embodiment, the transparent body 43 in visible-range the penetrance of (400 to 700nm) greater than 80%.For instance, the transparent body 43 comprises organic material, inorganic material, metallic compound or above-mentioned combination, and made by die casting or ejection formation.
In one embodiment, cup-shaped support 41 comprises metal, pottery, plastics or above-mentioned combination, and has reflection or scattering nature.In one embodiment, light-emitting diode chip for backlight unit 42 is wall emission, flip chip type or vertical-type, and emission wavelength can be ultraviolet region or visible region.In one embodiment, fluorescent material conversion coating 44 comprises fluorescent powder grain or is mixed by fluorescent material and transmission substance.
In order to further specify characteristic of the present invention and spirit, the present invention more provides a kind of manufacture method of package structure for LED, may further comprise the steps, shown in Fig. 5 A to Fig. 5 D.At first, shown in Fig. 5 A, a cup-shaped support 41 is provided.In one embodiment, cup-shaped support 41 comprises metal, pottery, plastics or above-mentioned combination, and has reflection or scattering nature.
Secondly, shown in Fig. 5 B, install at least one light-emitting diode chip for backlight unit 42 in this cup-shaped support 41.In one embodiment, light-emitting diode chip for backlight unit 42 is wall emission, flip chip type or vertical-type, and emission wavelength can be ultraviolet region or visible region.
Then, shown in Fig. 5 C, form at least one transparent body 43, it is installed on the inwall of this cup-shaped support 41 and around this light-emitting diode chip for backlight unit 42.In one embodiment, the transparent body 43 in visible-range the penetrance of (400 to 700nm) greater than 80%.For instance, the transparent body 43 comprises organic material, inorganic material, metallic compound or above-mentioned combination, and made by die casting or ejection formation.
Step that it should be noted that Fig. 5 B and Fig. 5 C does not have restriction successively.That is, can carry out the step of Fig. 5 C earlier, carry out the step of Fig. 5 B again.
At last, shown in Fig. 5 D, fill at least one fluorescent material conversion coating 44 in this cup-shaped support 41, to cover this light-emitting diode chip for backlight unit 42 and this transparent body 43.In one embodiment, fluorescent material conversion coating 44 comprises fluorescent powder grain or is mixed by fluorescent material and transmission substance.
Wherein the height of this transparent body 43 is greater than the height of this light-emitting diode chip for backlight unit 42, and the degree of depth and this transparent body 43 that are not more than this cup-like structure 41 do not cover this light-emitting diode chip for backlight unit 42.
In one embodiment, this transparent body 43 and this light-emitting diode chip for backlight unit 42 intervals one distance, as shown in Figure 4.In this specific embodiment; Because general light-emitting diode chip for backlight unit 42 center luminous intensities are strong; And lateral direction light emission a little less than, the present invention can change fluorescent material conversion coating 44 coating methods at the inwall of the cup-like structure 41 of the packaging body definition transparent body 43; Make fluorescent material 44 thickness in cup-like structure 41 variant, and then improve the problem of the inhomogeneous and light type of general packaging body bright dipping.
Yet scope of the present invention is not limited thereto.Those skilled in the art are when can after understanding main points of the present invention, carrying out any retouching or modification.Below will enumerate some embodiment, with as explanation.
Fig. 6 is the package structure for LED cross sectional representation of the present invention's second specific embodiment.The package structure for LED 6 of Fig. 6 is roughly the same with structure and the manufacture method of Fig. 4, and only difference is that the transparent body 63 of Fig. 6 contacts with light-emitting diode chip for backlight unit 62.Because the package structure for LED 6 of Fig. 6 is similar with manufacture method and Fig. 4, does not repeat them here.
Fig. 7 is the package structure for LED cross sectional representation of the present invention's the 3rd specific embodiment.The package structure for LED 7 of Fig. 7 is roughly the same with structure and the manufacture method of Fig. 4, and only difference is that the cup-like structure 71 of Fig. 7 has at least one groove, and makes this transparent body 73 embed in this groove.Because the structure of Fig. 7 and manufacture method and Fig. 4 are similar, do not repeat them here.
Fig. 8 is the package structure for LED cross sectional representation of the present invention's the 4th specific embodiment.The package structure for LED 8 of Fig. 8 is roughly the same with structure and the manufacture method of Fig. 4, and only difference is at least one micro-structural 85 of cup-like structure 81 interior formation of Fig. 8, with the zone of the definition transparent body 83.Because the structure of Fig. 8 and manufacture method and Fig. 4 are similar, do not repeat them here.
Fig. 9 is the package structure for LED cross sectional representation of the present invention's the 5th specific embodiment.The package structure for LED 9 of Fig. 9 is roughly the same with structure and the manufacture method of Fig. 4, and only difference is that the inwall of the cup-like structure 91 of Fig. 9 is a slope, with the structure of the definition transparent body 93.Because the structure of Fig. 9 and manufacture method and Fig. 4 are similar, do not repeat them here.
Figure 10 is the package structure for LED cross sectional representation of the present invention's the 6th specific embodiment.The package structure for LED 10 of Figure 10 is roughly the same with structure and the manufacture method of Fig. 5 A to Fig. 5 D, and only difference is that the inwall of the cup-like structure 101 of Figure 10 is a slope, with the structure of the definition transparent body 103.Because the structure of Figure 10 and manufacture method and Fig. 5 A to Fig. 5 D are similar, do not repeat them here.
In sum, package structure for LED of the present invention and its manufacture method have the following advantages:
1. can be through the mode of the reflector inwall definition transparent body, and carry out the coating of fluorescence conversion coating, compare in the past that reflector directly carries out the coating of fluorescence conversion coating, the different encapsulation of tool kenels;
2. utilize the packaging body of transparent body definition fluorescent material conversion coating,, can improve its outgoing light homogeneity, reduce yellow dizzy problem compared to general fluorescence conversion coating coating encapsulation;
3. utilize the packaging body of transparent body definition fluorescent material conversion coating, can solve generally and utilize the fluorescence conversion coating evenly to coat the square smooth type of chip in the past, this invention can get preferable circular light shape, more is applicable to illumination application; And
4. can make the transparent body in packaging body in advance, accomplish the optical element assembling again, its manufacture craft has confirmed to have productivity.
In sum; When the knowledge capital invention provides a kind of package structure for LED and its manufacture method; The transparent body through the definition cup-like structure can change fluorescent material conversion coating coating thickness whereby, makes variantization of fluorescent material thickness; Let the wide-angle bright dipping reduce the fluorescent material conversion coating of process, improve the uneven problem of packaging body bright dipping.
Certainly; The present invention also can have other various embodiments; Under the situation that does not deviate from spirit of the present invention and essence thereof; Those of ordinary skill in the art can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (24)
1. package structure for LED is characterized in that it comprises:
One cup-shaped support;
At least one light-emitting diode chip for backlight unit, it is installed in this cup-shaped support;
At least one transparent body, it is installed on the inwall of this cup-shaped support and around this light-emitting diode chip for backlight unit; And
At least one fluorescent material conversion coating, it is filled in this cup-shaped support, to cover this light-emitting diode chip for backlight unit and this transparent body;
Wherein the height of this transparent body is greater than the height of this light-emitting diode chip for backlight unit, and is not more than the degree of depth of this cup-shaped support, and this transparent body does not cover this light-emitting diode chip for backlight unit.
2. package structure for LED according to claim 1 is characterized in that, this transparent body and this light-emitting diode chip for backlight unit contacts with each other or a distance at interval.
3. package structure for LED according to claim 1 is characterized in that, the penetrance of this transparent body in visible-range is greater than 80%.
4. package structure for LED according to claim 1 is characterized in that this transparent body comprises the combination of organic material, inorganic material, metallic compound or above-mentioned material.
5. package structure for LED according to claim 1 is characterized in that, this transparent body is die casting or ejection formation.
6. package structure for LED according to claim 1 is characterized in that this cup-shaped support comprises the combination of metal, pottery, plastics or above-mentioned material.
7. package structure for LED according to claim 1 is characterized in that, this cup-shaped support has reflection or scattering nature.
8. package structure for LED according to claim 1 is characterized in that, this light-emitting diode chip for backlight unit is wall emission, flip chip type or vertical-type, and emission wavelength can be ultraviolet region or visible region.
9. package structure for LED according to claim 1 is characterized in that, this fluorescent material conversion coating comprises fluorescent powder grain.
10. package structure for LED according to claim 1 is characterized in that, this fluorescent material conversion coating comprises fluorescent material and transmission substance mixes.
11. package structure for LED according to claim 1 is characterized in that, this cup-shaped support has at least one groove, and makes this transparent body embed in this groove.
12. package structure for LED according to claim 1 is characterized in that, forms at least one micro-structural in this cup-shaped support, to define the zone of this transparent body.
13. the manufacture method of a package structure for LED is characterized in that, this method may further comprise the steps:
One cup-shaped support is provided;
Install at least one light-emitting diode chip for backlight unit in this cup-shaped support;
Form at least one transparent body, it is installed on the inwall of this cup-shaped support and around this light-emitting diode chip for backlight unit; And
Fill at least one fluorescent material conversion coating in this cup-shaped support, to cover this light-emitting diode chip for backlight unit and this transparent body;
Wherein the height of this transparent body is greater than the height of this light-emitting diode chip for backlight unit, and is not more than the degree of depth of this cup-shaped support, and this transparent body does not cover this light-emitting diode chip for backlight unit.
14. manufacture method according to claim 13 is characterized in that, this transparent body does not cover this light-emitting diode chip for backlight unit, and contacts with each other or interval one distance with this light-emitting diode chip for backlight unit.
15. manufacture method according to claim 13 is characterized in that, the penetrance of this transparent body in visible-range is greater than 80%.
16. manufacture method according to claim 13 is characterized in that, this transparent body comprises the combination of organic material, inorganic material, metallic compound or above-mentioned material.
17. manufacture method according to claim 13 is characterized in that, this transparent body is die casting or ejection formation.
18. manufacture method according to claim 13 is characterized in that, this cup-shaped support comprises the combination of metal, pottery, plastics or above-mentioned material.
19. manufacture method according to claim 13 is characterized in that, this cup-shaped support has reflection or scattering nature.
20. manufacture method according to claim 13 is characterized in that, this light-emitting diode chip for backlight unit is wall emission, flip chip type or vertical-type, and emission wavelength can be ultraviolet region or visible region.
21. manufacture method according to claim 13 is characterized in that, this fluorescent material conversion coating comprises fluorescent powder grain.
22. manufacture method according to claim 13 is characterized in that, this fluorescent material conversion coating comprises fluorescent material and transmission substance mixes.
23. manufacture method according to claim 13 is characterized in that, this cup-shaped support has at least one groove, and makes this transparent body embed in this groove.
24. manufacture method according to claim 13 is characterized in that, forms at least one micro-structural in this cup-shaped support, to define the zone of this transparent body.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2009101373569A CN101872817B (en) | 2009-04-24 | 2009-04-24 | Light-emitting diode packaging structure and manufacturing method thereof |
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| CN2009101373569A CN101872817B (en) | 2009-04-24 | 2009-04-24 | Light-emitting diode packaging structure and manufacturing method thereof |
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| CN101872817A CN101872817A (en) | 2010-10-27 |
| CN101872817B true CN101872817B (en) | 2012-07-04 |
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| TWI550913B (en) * | 2013-07-03 | 2016-09-21 | 光寶電子（廣州）有限公司 | Illumination device |
| CN105702833B (en) * | 2016-03-30 | 2019-03-05 | 开发晶照明（厦门）有限公司 | LED encapsulation structure and LED light emission device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1455462A (en) * | 2002-04-30 | 2003-11-12 | 丰田合成株式会社 | Luminous diode |
| CN1913188B (en) * | 2005-08-12 | 2010-06-02 | 安华高科技Ecbuip(新加坡)私人有限公司 | Phosphor-converted LED devices having improved light distribution uniformity and its manufacture method |
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- 2009-04-24 CN CN2009101373569A patent/CN101872817B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1455462A (en) * | 2002-04-30 | 2003-11-12 | 丰田合成株式会社 | Luminous diode |
| CN1913188B (en) * | 2005-08-12 | 2010-06-02 | 安华高科技Ecbuip(新加坡)私人有限公司 | Phosphor-converted LED devices having improved light distribution uniformity and its manufacture method |
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| CN101872817A (en) | 2010-10-27 |
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