CN101872225A - Paste-type deflector and motherboard using the deflector - Google Patents

Paste-type deflector and motherboard using the deflector Download PDF

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Publication number
CN101872225A
CN101872225A CN200910301880A CN200910301880A CN101872225A CN 101872225 A CN101872225 A CN 101872225A CN 200910301880 A CN200910301880 A CN 200910301880A CN 200910301880 A CN200910301880 A CN 200910301880A CN 101872225 A CN101872225 A CN 101872225A
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China
Prior art keywords
paste
guide
air guide
adhesive
main board
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Pending
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CN200910301880A
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Chinese (zh)
Inventor
孙正衡
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN200910301880A priority Critical patent/CN101872225A/en
Priority to US12/558,578 priority patent/US8081453B2/en
Publication of CN101872225A publication Critical patent/CN101872225A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种粘贴式导流件，由绝缘耐高温材料制成，其包括一粘贴面及至少一倾斜于所述粘贴面的导流面。一种主板，其上的冷空气的风流方向为从前向后，所述主板设有一电子元件，所述电子元件具有一正对所述冷空气的风流方向的侧壁，所述主板包括一粘贴式导流件，所述粘贴式导流件包括一粘贴于所述电子元件的所述侧壁的粘贴面及至少一倾斜于所述粘贴面的导流面，所述导流面引导冷空气风流沿所述导流面向后流过，从而减小风阻。

Figure 200910301880

A paste-type flow guide is made of insulating and high-temperature-resistant materials, which includes a paste surface and at least one flow guide surface inclined to the paste surface. A kind of main board, the wind flow direction of the cold air on it is from front to back, the described main board is provided with an electronic component, and the electronic component has a side wall facing the wind flow direction of the cold air, and the main board includes a paste A type air guide, the paste type air guide includes an adhesive surface pasted on the side wall of the electronic component and at least one air guide surface inclined to the adhesive surface, and the air guide surface guides the cold air Wind flows backward along the guide surface, thereby reducing wind resistance.

Figure 200910301880

Description

Adhesive type conducting element and use the mainboard of this conducting element
Technical field
The present invention relates to a kind of adhesive type conducting element and use the mainboard of this conducting element.
Background technology
In the computer system, in the rack type version server, all be front end installing fan or fan blower usually, make it directly blow to mainboard, thereby the heat that electronic component gave out on the mainboard is taken away by the cold air that the outside sucks at casing.Yet owing to have the volume of portions of electronics element bigger than normal on the mainboard, it, is easy to generate bigger windage, thereby influences radiating effect perpendicular to distinguished and admirable direct of travel over against the sidewall of fan.
Summary of the invention
In view of more than, be necessary to provide a kind of mainboard that can reduce the adhesive type conducting element of windage and use this conducting element.
A kind of adhesive type conducting element is made by the insulation exotic material, and it comprises a stickup face and at least one guide face that favours described stickup face.
A kind of mainboard, the wind direction of the cold air on it is in the past backward, described mainboard is provided with an electronic component, described electronic component has a sidewall over against the wind direction of described cold air, described mainboard comprises an adhesive type conducting element, described adhesive type conducting element comprises that one is pasted on stickup face and at least one guide face that favours described stickup face of the described sidewall of described electronic component, and described guide face direct cold air is distinguished and admirable to be flow through backward along described guide face.
Compare prior art, above-mentioned adhesive type conducting element and use the mainboard of this conducting element can flow through backward along described guide face by the guide face direct cold air of adhesive type conducting element is distinguished and admirable, thereby reduce windage, improves radiating effect.
Description of drawings
Fig. 1 is the three-dimensional assembly diagram of adhesive type conducting element better embodiment of the present invention and a mainboard and a system fan.
Fig. 2 is the part adhesive type conducting element among Fig. 1 and the three-dimensional exploded view of this mainboard and system fan.
Embodiment
Please refer to Fig. 1 and Fig. 2, the better embodiment of adhesive type conducting element of the present invention is applied on the mainboard 10.
The front side of this mainboard 10 is equiped with a system fan 20.This system fan 20 is used for and will blows to this mainboard 10 by the outside cold air that sucks of casing.The arrow A direction is the wind direction of this cold air among Fig. 1.Be equiped with some electronic components 15 on this mainboard 10, as inductance, cpu connector, pci card connector, peripheral device connector and I/O connector etc.These electronic components are equipped with the wind direction of a sidewall 17 over against this cold air.
In the present embodiment, this mainboard 10 corresponding on it different electronic components 15 be equiped with a plurality of adhesive type conducting elements, these adhesive type conducting elements are divided into the first adhesive type conducting element 30 and the second adhesive type conducting element 40 by shape.These the first adhesive type conducting elements 30 and the second adhesive type conducting element 40 are made by the insulation exotic material of soft compressible.Each first adhesive type conducting element 30 comprises that bottom surface 32 and that a stickup face 31, is vertically connected at this stickup face 31 bottoms connects the guide face 33 of inclination of the front portion of the top of this stickup face 31 and this bottom surface 32.Wherein, size of this stickup face 31 and shape are identical with the size and the shape of the sidewall 17 of corresponding electronic component 15.Each second adhesive type conducting element 40 comprises that a stickup face 41, is vertically connected at the bottom surface 42 of this stickup face 41 bottoms and perpendicular to this bottom surface 42 and connect two guide faces 43 that tilt of 41 liang of opposite ends of this stickup face.Wherein, size of this stickup face 41 and shape are identical with the size and the shape of the sidewall 17 of corresponding electronic component 15, and the junction of described two guide faces 43 is outstanding to the direction away from this stickup face 41.
When using these adhesive type conducting elements, stickup face 31,41 with these the first adhesive type conducting elements 30 and the second adhesive type conducting element 40 is pasted on the sidewall 17 of the corresponding electronic component 15 on this mainboard 10 respectively, the bottom surface 32,42 of these first, second adhesive type conducting elements 30,40 is supported on this mainboard 10, and the wind direction of the cold air that the guide face 33,43 of these first, second adhesive type conducting elements 30,40 blows out towards this system fan 20.During work, cold air is distinguished and admirable when flowing through these electronic components 15 can blow over backward along the guide face 33,43 of the inclination of these first, second adhesive type conducting elements 30,40, these guide faces 33,43 can play in the past that guides wind backward flows to and the effect that reduces windage, thereby can improve the radiating efficiency of this mainboard 10.
In the present embodiment, these are first years old, the second adhesive type conducting element 30,40 bottom surface 32,42 are supported on this mainboard 10, because these are first years old, the second adhesive type conducting element 30,40 make by the insulation exotic material of soft compressible, even this mainboard 10 with these first, the second adhesive type conducting element 30,40 bottom surface 32, also be provided with some other less element between 42, as surface mount elements or resistance, electric capacity etc., these are first years old, the second adhesive type conducting element 30,40 can elastic deformation and cover in these less elements, thus can not influence these first, the second adhesive type conducting element 30,40 installation.
In other embodiments, the height of the stickup face 31,41 of these first, second adhesive type conducting elements 30,40 can be designed to be slightly less than the height of the sidewall 17 of corresponding electronic component 15, thereby these first, second adhesive type conducting elements are installed at 30,40 o'clock, can be towards this mainboard 10 and is spaced apart with this mainboard 10 in the bottom surface 32,42 of these first, second adhesive type conducting elements 30,40, thereby can avoid the element of these 32,42 belows, bottom surface.

Claims (10)

1.一种粘贴式导流件，由绝缘耐高温材料制成，其包括一粘贴面及至少一倾斜于所述粘贴面的导流面。1. A paste-type flow guide, made of insulating and high-temperature-resistant materials, which includes a paste surface and at least one flow guide surface inclined to the paste surface. 2.如权利要求1所述的粘贴式导流件，其特征在于：所述粘贴式导流件由柔软可压缩的绝缘耐高温材料制成。2. The adhesive type air guide according to claim 1, characterized in that: the adhesive air guide is made of soft, compressible insulating and high temperature resistant material. 3.如权利要求1所述的粘贴式导流件，其特征在于：所述粘贴式导流件还包括一垂直连接于所述粘贴面底部的底面。3 . The stick-on air guide as claimed in claim 1 , wherein the stick-on air guide further comprises a bottom surface vertically connected to the bottom of the stick-on surface. 4 . 4.如权利要求3所述的粘贴式导流件，其特征在于：所述导流面有两个，所述两导流面垂直于所述底面且连接所述粘贴面的两相对端，所述两导流面的连接处向远离所述粘贴面的方向突出。4. The paste-type deflector according to claim 3, wherein there are two deflector surfaces, the two deflector surfaces are perpendicular to the bottom surface and connect two opposite ends of the paste surface, The junction of the two guide surfaces protrudes away from the sticking surface. 5.如权利要求3所述的粘贴式导流件，其特征在于：所述导流面连接于所述粘贴面的顶部与所述底面的前部。5. The stick-type deflector according to claim 3, wherein the deflector surface is connected to the top of the sticky surface and the front of the bottom surface. 6.一种主板，其上的冷空气的风流方向为从前向后，所述主板设有一电子元件，所述电子元件具有一正对所述冷空气的风流方向的侧壁，其特征在于：所述主板包括一粘贴式导流件，所述粘贴式导流件包括一粘贴于所述电子元件的所述侧壁的粘贴面及至少一倾斜于所述粘贴面的导流面，所述导流面引导冷空气风流沿所述导流面向后流过。6. A main board, the wind flow direction of the cold air on it is from front to back, the main board is provided with an electronic component, and the electronic component has a side wall facing the wind flow direction of the cold air, characterized in that: The main board includes an adhesive air guide, the adhesive air guide includes an adhesive surface attached to the side wall of the electronic component and at least one air guide surface inclined to the adhesive surface, the The air guide surface guides the cool air to flow backward along the air guide surface. 7.如权利要求6所述的主板，其特征在于：所述粘贴式导流件由柔软可压缩的绝缘耐高温材料制成。7. The mainboard according to claim 6, wherein the paste-type air guide is made of soft, compressible insulating and high-temperature-resistant material. 8.如权利要求6所述的主板，其特征在于：所述粘贴式导流件还包括一垂直连接于所述粘贴面底部的底面。8 . The main board according to claim 6 , wherein the sticky air guide further comprises a bottom surface vertically connected to the bottom of the sticky surface. 9 . 9.如权利要求8所述的主板，其特征在于：所述导流面有两个，所述两导流面垂直于所述底面且连接所述粘贴面的两相对端，所述两导流面的连接处向远离所述粘贴面的方向突出。9. The motherboard according to claim 8, wherein there are two guide surfaces, the two guide surfaces are perpendicular to the bottom surface and connected to two opposite ends of the pasting surface, the two guide surfaces The junction of the flow surface protrudes away from the sticking surface. 10.如权利要求8所述的主板，其特征在于：所述导流面连接于所述粘贴面的顶部与所述底面的前部。10 . The main board according to claim 8 , wherein the guide surface is connected to the top of the adhesive surface and the front of the bottom surface. 11 .
CN200910301880A 2009-04-27 2009-04-27 Paste-type deflector and motherboard using the deflector Pending CN101872225A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200910301880A CN101872225A (en) 2009-04-27 2009-04-27 Paste-type deflector and motherboard using the deflector
US12/558,578 US8081453B2 (en) 2009-04-27 2009-09-14 Adhesive air guiding device and motherboard having the same

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Application Number Priority Date Filing Date Title
CN200910301880A CN101872225A (en) 2009-04-27 2009-04-27 Paste-type deflector and motherboard using the deflector

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US11982500B2 (en) 2013-09-06 2024-05-14 Delta Electronics, Inc. Heat sink

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US20100271778A1 (en) 2010-10-28
US8081453B2 (en) 2011-12-20

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Application publication date: 20101027