CN101871614A - Illuminating lamp and manufacturing method thereof - Google Patents

Illuminating lamp and manufacturing method thereof Download PDF

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Publication number
CN101871614A
CN101871614A CN201010186419A CN201010186419A CN101871614A CN 101871614 A CN101871614 A CN 101871614A CN 201010186419 A CN201010186419 A CN 201010186419A CN 201010186419 A CN201010186419 A CN 201010186419A CN 101871614 A CN101871614 A CN 101871614A
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China
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circuit board
printed circuit
lamp
injection molding
led
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CN201010186419A
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Chinese (zh)
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剧金星
杨伟
杨兵
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东风汽车有限公司
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Priority to CN201010186419A priority Critical patent/CN101871614A/en
Publication of CN101871614A publication Critical patent/CN101871614A/en

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Abstract

The invention relates to an illuminating lamp, which comprises a printed circuit board, an LED lamp and a thermoplastic resin body which are connected by leads, wherein the LED lamp is provided with a lead part electrically connected with the printed circuit board and a head part for illumination; the printed circuit board and the lead part of the LED lamp are encapsulated in the thermoplastic resin body; a chip fixed resistor and a diode are arranged on the printed circuit board; and at least one through hole is formed on the printed circuit board. A manufacturing method of the illuminating lamp comprises the following steps of: (1) forming at least one through hole on the printed circuit board; (2) printing a chip circuit on the printed circuit board to connect lamp bulbs and a power cord; and (3) forming the printed circuit board through encapsulation and injection molding, wherein the injection molding temperature is between 140 and 170 DEG C, and the injection molding pressure is between 36 and 90 Kg/cm<2>. In the manufacturing method of the illuminating lamp and the illuminating lamp, the problem of nonuniform pressure of components during the injection molding is solved by arranging the through holes, and the injection molding can be performed within the ranges of high pressure and low temperature. The illuminating lamp and the manufacturing method have the advantages of low requirements on materials, low manufacturing cost and low energy consumption.

Description

一种照明灯及其制造方法【技术领域】 An illumination lamp and a manufacturing method FIELD

[0001 ] 本发明涉及一种照明设备,尤其是指应用在车辆照明的照明灯。 [0001] The present invention relates to a lighting device, particularly to applications in vehicle illumination lights. 【背景技术】 【Background technique】

[0002] 安装在车辆照明设备如车窗控制开关的内部照明设备、烟灰缸的内部照明设备、 电子设备面板上的照明设备等,包括发光二极管或小灯泡的照明灯,这些发光二极管或小灯泡的暴露部分是由玻璃或合成树脂制成,在暴露状态下非常容易损坏,如果采用传统的壳体封装方法,在壳体和照明灯之间的固定点容易产生间隙,会导致灰尘进入或发生松动。 [0002] The illumination apparatus mounted in a vehicle such as a window control switch interior lighting, interior lighting ashtray equipment, lighting equipment and other electronic devices on the panel, comprising a light emitting diode or a light bulb lights, light emitting diodes or small light bulbs the exposed portion is made of glass or synthetic resin, it is easily damaged in an exposed state, if the conventional method of packaging a housing, the housing and the fixing point between the illuminating lamp easy to produce a gap, or the occurrence of dust can cause loose. 为解决这些问题,中国专利02105702. 8采用热熔树脂来模制照明灯,该模制方法的特点是在较低的压力(3〜35Kg/cm2)及较高的温度下(180〜230°C )才能完成相应制造工程。 To solve these problems, Chinese patent 02105702.8 hot melt resin molding lights, features of the molding process is at a lower pressure (3~35Kg / cm2) and high temperature (180~230 ° C) to complete the respective manufacturing engineering. 该模制方法对树脂材料的要求非常高,其制造成本也相对较高,并且在高温情况下可能使照明灯构成部件损坏;同时,低压注塑需要特殊的设备,这也会导致制造成本上升。 The method of claim molding resin material is very high, the manufacturing cost is relatively high, and may cause damage to the lamp components at high temperatures; the same time, low pressure injection molding requires special equipment, which also results in an increase in manufacturing costs.

[0003] 因此,为解决现有技术存在的问题,需要提供一种对材料要求低、制造成本较低的、可在低温范围内模制的制造方法。 [0003] Thus, to solve the problems of the prior art, it is necessary to provide a low material requirement, low manufacturing cost, can be molded in a low temperature range of the manufacturing method.

【发明内容】 [SUMMARY]

[0004] 本发明的目的在于提供一种制造成本低、制造质量好、制造能耗低的照明灯及其制造方法。 [0004] The object of the present invention is to provide a low manufacturing cost, good manufacturing quality, low energy consumption for producing the illuminating lamp and its manufacturing method.

[0005] 为实现本发明目的,提供以下技术方案: [0005] To achieve the object of the present invention, there is provided the following technical solutions:

[0006] 本发明照明灯包括印刷电路板,LED灯和热塑性树脂本体,所述印刷电路板上设有贴片电阻和二极管,所述LED灯具有与所述印刷电路板电连接的导线部分以及用于照明的头部,所述热塑性树脂本体封装所述印刷电路板及所述LED灯的导线部分,所述印刷电路板上开设有至少一个穿孔,该穿孔可改善注塑时对印刷电路板及各元件造成的压力不均的影响。 [0006] The illumination lamp of the present invention includes a printed circuit board, LED lamp body and a thermoplastic resin, the printed circuit board with chip resistors and a diode, the LED lamp has a lead portion connected to the printed circuit board and when the illumination for the head, the wire portion of the thermoplastic resin body encapsulating the printed circuit board and the LED lamp, the printed circuit board defines at least one perforation, the perforations may improve the injection of the printed circuit board and the influence of the pressure variation caused by the elements.

[0007] 较佳的,该至少一个穿孔中的一个设置在所述贴片电阻的下方。 Below [0007] Preferably, a set of the at least one aperture in said chip resistors. 特别地,由于贴片电阻与印刷电路板之间存在间隙,模制时注塑材料会注入间隙中并受高温膨胀,造成贴片电阻上下所受压力不均,使贴片电阻毁坏,因此在贴片电阻下方的印刷电路板设置穿孔,使贴片电阻与印刷电路板之间的间隙与印刷电路板另一面的注塑材料相通,使得贴片电阻上下所受压力均衡。 In particular, since there is a gap between the chip resistor and the printed circuit board, when manufactured by molding the molding material will be injected into the gap in the high temperature and expands, resulting in uneven pressure on the upper and lower chip resistors, chip resistors so destroyed, so the paste the sheet resistance of the lower printed circuit board perforations, so that the other surface of the molding material and the gap between the printed circuit board and the printed circuit board chip resistors communication, so that the vertical pressure applied to the chip resistor equalization.

[0008] 进一步地,采用该种结构进行注塑,可承受的压力范围更高,因此可采用较低的注塑温度范围,对工艺、材料的要求大大降低,应用普通的热塑性树脂材料如PVC/IPR即可实现,成本相应降低,一般采用改性PVC材料。 [0008] Further, injection molding With this configuration, the pressure range may be higher, so the injection can be a lower temperature range, the requirements for the process, the material is greatly reduced, applying ordinary thermoplastic resin material such as PVC / IPR can be realized, cost reduced accordingly, modified PVC material is generally used. 同时,由于温度对设备能耗的影响显著大于压力对设备能耗的影响,因此采用该种结构可进行的较低温的高压注塑,可大大降低生产过程中的能耗,节能减排。 Meanwhile, since the influence of temperature on the energy consumption of the device is significantly greater than the effect of pressure on the energy consumption of the device, so a relatively low temperature high-pressure injection can be performed by this kind of configuration, it can significantly reduce energy consumption during production, energy saving.

[0009] 较佳的,在所述贴片电阻和电容或二极管下方分别各设有一个穿孔,以使贴片电阻、电容或二极管在注塑时所受压力均衡。 [0009] Preferably, the capacitors or chip resistors and diodes are each provided below a perforation, so that chip resistors, capacitors or diodes equalizing the pressure applied during the injection molding. [0010] 本发明还提供一种照明灯的制造方法,其包括如下步骤: [0010] The present invention also provides a method for producing a lamp, comprising the steps of:

[0011] (1)在印刷电路板上开设至少一个穿孔; [0011] (1) defines at least one perforation in the printed circuit board;

[0012] (2)在所述印刷电路板上设置贴片电阻和二极管,连接LED灯和所述印刷电路板; [0012] (2) and a diode chip resistors disposed on the printed circuit board, and connecting the LED lights the printed circuit board;

[0013] (3)用热塑性树脂材料对所述LED灯导线部分和印刷电路板封装注塑成型,同时, 防止热塑性树脂覆盖LED用于照明的头部以使得LED用于照明的头部保持可见得暴露在注模热熔树脂之外,其中,注塑温度范围在140〜170°C,注塑压力范围在36〜90Kg/cm2。 [0013] (3) of the LED light wire portion and the printed circuit board encapsulated by injection molding a thermoplastic resin material, while preventing the thermoplastic resin covering the LED illumination for the head for the head so that the LED lighting remains visible to give exposed outside of the hot-melt resin injection molding, wherein the injection temperature in the range of 140~170 ° C, the injection pressure in the range 36~90Kg / cm2.

[0014] 较佳的,该至少一个穿孔的其中一个设置在贴片电阻的下方。 [0014] Preferably, the at least one perforation which is provided below a chip resistor.

[0015] 对比现有技术,本发明具有以下优点: [0015] Compare the prior art, the present invention has the following advantages:

[0016] 本发明照明灯的制造方法及该照明灯,通过设置穿孔来改善注塑时对印刷电路板及各元件造成的压力不均的影响,在元件下方的印刷电路板设置穿孔,使元件与印刷电路板之间的间隙与印刷电路板另一面的注塑材料相通,使得元件上下所受压力均衡,避免毁坏元件。 [0016] The method of manufacturing a illumination lamp of the present invention and the lamp, unevenness of pressure effects on the printed circuit board and the components caused by the injection molding improves by providing perforations, perforations in the printed circuit board disposed below the element so that element the other side of the gap with the molding material of the printed circuit board between the printed circuit board in communication, so that the pressure on the upper and lower equalizing element, to avoid destruction of components.

[0017] 此外,采用本发明提供的照明灯制造方法进行注塑,可承受的压力范围更高,因此可采用较低的注塑温度范围,对工艺、材料的要求大大降低,应用普通的热塑性树脂材料如PVC/TPR即可实现,成本相应降低。 [0017] Further, using the method of manufacturing a lamp according to the present invention is provided by injection molding, the pressure range may be higher, so the injection can be a lower temperature range, the requirements for the process, the material is greatly reduced, applying ordinary thermoplastic resin material The PVC / TPR can be realized, cost reduced accordingly. 同时,由于温度对设备能耗的影响显著大于压力对设备能耗的影响,因此采用该种结构可进行的较低温的高压注塑,可大大降低生产过程中的能耗,节能减排。 Meanwhile, since the influence of temperature on the energy consumption of the device is significantly greater than the effect of pressure on the energy consumption of the device, so a relatively low temperature high-pressure injection can be performed by this kind of configuration, it can significantly reduce energy consumption during production, energy saving.

【附图说明】 BRIEF DESCRIPTION

[0018] 图1为本发明照明灯的结构示意图; [0018] The structure of the present invention, FIG. 1 is a schematic view of an illumination lamp;

[0019] 图2为本发明照明灯的透视图; [0019] FIG. 2 is a perspective view of the light of the present disclosure;

[0020] 图3为图2的aa向剖视图; [0020] FIG. 3 is a cross-sectional view of FIG. 2 to aa;

[0021] 图4为本发明照明灯制造方法的温压范围示意图; [0021] FIG. 4 is a schematic temperature and pressure range of lamp manufacturing method of the present invention;

[0022] 图5为现有技术制造方法的温压范围示意图。 [0022] FIG. 5 is a schematic view of the range of temperature and pressure prior art manufacturing method.

【具体实施方式】 【Detailed ways】

[0023] 请参阅图1〜图3,本发明照明灯包括印刷电路板13、LED灯和热塑性树脂本体11,该印刷电路板13上设有贴片电阻R和二极管D,所述LED灯12具有与所述印刷电路板13电连接的导线部分15以及用于照明的头部12,所述热塑性树脂本体封装所述印刷电路板13及所述LED灯的导线部分15,该印刷电路板13上相应所述贴片电阻R的下方位置开设有穿孔14,该穿孔可改善注塑时对印刷电路板及元件造成的压力不均的影响,特别地,由于贴片电阻R与印刷电路板13之间存在间隙,模制时注塑材料会注入间隙中并受高温膨胀,造成贴片电阻上下所受压力不均,使贴片电阻毁坏,因此在贴片电阻下方的印刷电路板设置穿孔,使贴片电阻与印刷电路板之间的间隙与印刷电路板另一面的注塑材料相通,使得贴片电阻上下所受压力均衡。 [0023] Please refer to FIG. 1 ~ 3, the present invention includes a lighting printed circuit board 13, an LED lamp and a thermoplastic resin body 11 is provided with chip resistors R and the diode D on the printed circuit board 13, the LED lamp 12 having lead electrically connected to the printed circuit board 13 and 12 of portion 15, the thermoplastic resin body encapsulating said printed circuit board for the head portion of the wire 13 and the lighting of the LED lamp 15, the printed circuit board 13 the respective position of the patch on the bottom of the resistor R defines perforations 14, the pressure variation of the printed circuit board and components caused by the influence of the injection perforations can improve, in particular, since the chip resistor R 13 of the printed circuit board there is a gap between the molding material will be injected into the gap during injection and expansion of the high temperature, resulting in uneven pressure on the upper and lower chip resistors, chip resistors so destroyed, so perforations in the printed circuit board disposed below the chip resistors, so that stickers the other side of the gap with the molding material of the printed circuit board between the sheet resistance of the printed circuit board in communication, so that the vertical pressure applied to the chip resistor equalization.

[0024] 同样,还可以在二极管D的相应位置以及印刷电路板其他位置设置穿孔,进一步减轻注塑压力对印刷电路板及各元件所造成的影响。 [0024] Also, perforations may be provided in another position corresponding to position the printed circuit board and a diode D, to further reduce the impact on the injection pressure of the printed circuit board and the components caused.

[0025] 请参阅图2和图3,注塑过程中,压力从印刷电路板13的穿孔14流出,不会积聚在印刷电路板13与贴片电阻R,或印刷电路板13与二极管D之间,造成贴片电阻或者二极管断裂、失效。 [0025] Please refer to FIGS. 2 and 3, the injection molding process, the pressure flowing out of perforations 14 of the printed circuit board 13 does not accumulate between the printed circuit board 13 and the chip resistor R, or a printed circuit board 13 and the diode D resulting chip resistor or a diode fracture, failure. 穿孔14的形状可以为圆形,也可以是方形、三角形、椭圆形或其他几何形状,同样可以达到缓解注塑压力不均的问题。 The perforations 14 may have a circular shape, but may be square, triangular, oval, or other geometric shapes can also achieve ease the problem of uneven injection pressure.

[0026] 进一步地,采用该种结构进行注塑,可承受的压力范围更高,因此可采用较低的注塑温度范围,对工艺、材料的要求大大降低,应用普通的树脂材料如PVC/TPR即可实现,成本相应降低。 [0026] Further, injection molding With this configuration, the pressure range may be higher, so the injection can be a lower temperature range, the requirements for the process, the material is greatly reduced, applying ordinary resin material such as PVC / TPR i.e. can be achieved, cost reduced accordingly.

[0027] 该照明灯的制造方法,其包括如下步骤: [0027] The method for producing the illumination lamp, comprising the steps of:

[0028] (1)在印刷电路板上开设至少一个穿孔; [0028] (1) defines at least one perforation in the printed circuit board;

[0029] (2)在所述印刷电路板上设置贴片电阻和二极管,连接LED灯和所述印刷电路板; [0029] (2) and a diode chip resistors disposed on the printed circuit board, and connecting the LED lights the printed circuit board;

[0030] (3)用热塑性树脂材料对所述LED灯导线部分和印刷电路板封装注塑成型,同时, 防止热塑性树脂覆盖LED用于照明的头部以使得LED用于照明的头部保持可见得暴露在注模热熔树脂之外,其中,注塑温度范围在140〜170°C,注塑压力范围在36〜90Kg/cm2。 [0030] (3) of the LED light wire portion and the printed circuit board encapsulated by injection molding a thermoplastic resin material, while preventing the thermoplastic resin covering the LED illumination for the head for the head so that the LED lighting remains visible to give exposed outside of the hot-melt resin injection molding, wherein the injection temperature in the range of 140~170 ° C, the injection pressure in the range 36~90Kg / cm2.

[0031] 如图3所示,本发明所采用的注塑温度范围为140°C〜170°C,注塑压力范围在36〜90Kg/cm2。 [0031] As shown in FIG 3, used in the present invention, the injection temperature range of 140 ° C~170 ° C, injection pressure ranging 36~90Kg / cm2. 采用普通树脂材料注塑模制封装照明灯的导线部分和印刷电路板,成型时LED用于照明的头部保持可见地暴露在注塑热熔树脂之外。 Ordinary injection molding encapsulation resin material illuminator wire portion and the printed circuit board, LED illumination for the head remains visible outside the exposed hot-melt resin injection molding.

[0032] 由于温度对设备能耗的影响显著大于压力对设备能耗的影响,因此采用该种照明灯结构及制造方法,可大大降低生产过程中的能耗,节能减排。 [0032] Since the effect of temperature on the energy consumption of the device is significantly greater than the pressure effect on the energy consumption of the device, so the use of this type of lighting configuration and manufacturing method, can greatly reduce energy consumption during production, energy saving.

[0033] 以上所述仅为本发明的较佳实施例,本发明的保护范围并不局限于此,任何基于本发明技术方案上的等效变换均属于本发明保护范围之内。 [0033] The foregoing is only preferred embodiments of the present invention, the scope of the present invention is not limited thereto, and any equivalent transformation based on the technical solution of the present invention fall within the scope of the present invention.

Claims (5)

  1. 一种照明灯,包括印刷电路板,LED灯和热塑性树脂本体,所述印刷电路板上设有贴片电阻和二极管,所述LED灯具有与所述印刷电路板电连接的导线部分以及用于照明的头部,所述热塑性树脂本体封装所述印刷电路板及所述LED灯的导线部分,其特征在于,所述印刷电路板上开设有至少一个穿孔。 An illumination lamp comprising a printed circuit board, LED lamp body and a thermoplastic resin, the printed circuit board with chip resistors and a diode, the LED lamp has a lead portion connected to the printed circuit board and for lighting head, the thermoplastic resin body encapsulating said printed circuit board and the lead portion of the LED lamp, wherein the printed circuit board defines at least one perforation.
  2. 2.如权利要求1所述的照明灯,其特征在于,该至少一个穿孔中的一个设置在所述贴片电阻的下方。 2. The lamp according to claim 1, wherein the at least one disposed below a perforation in said chip resistors.
  3. 3.如权利要求1所述的照明灯,其特征在于,在所述贴片电阻和电容下方分别各设有一个穿孔。 The lamp as claimed in claim 1, characterized in that the perforations are each provided with a resistance and capacitance below the patch.
  4. 4. 一种如权利要求1〜3任意一项所述的照明灯的制造方法,其特征在于,其包括如下步骤:(1)在印刷电路板上开设至少一个穿孔;(2)在所述印刷电路板上设置贴片电阻和二极管,连接LED灯和所述印刷电路板;(3)用热塑性树脂材料对所述LED灯导线部分和印刷电路板封装注塑成型,同时,防止热塑性树脂覆盖LED用于照明的头部以使得LED用于照明的头部保持可见得暴露在注模热熔树脂之外,其中,注塑温度范围在140〜170°C,注塑压力范围在36〜90Kg/cm2。 1~3 as claimed in claim 4. A method for producing a lamp according to any, characterized in that it comprises the following steps: (1) defines at least one perforation in the printed circuit board; (2) the the printed circuit board is provided and a diode chip resistors, connecting an LED lamp and the printed circuit board; (3) a thermoplastic resin material molded by the LED light wire portion and the printed circuit board package injection, while preventing the thermoplastic resin covering the LED for the head so that the illumination LED illumination for the head remains visible too exposed externally melt resin injection molding, wherein the injection temperature in the range of 140~170 ° C, the injection pressure in the range 36~90Kg / cm2.
  5. 5.如权利要求7所述的照明灯,其特征在于,该至少一个穿孔的其中一个设置在贴片电阻的下方。 5. The lamp according to claim 7, characterized in that the at least one perforation which is provided below a chip resistor.
CN201010186419A 2010-05-21 2010-05-21 Illuminating lamp and manufacturing method thereof CN101871614A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102352978A (en) * 2011-07-20 2012-02-15 青岛海诺特电器有限公司 Indicating lamp and injection-molding process thereof

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