CN101859746B

CN101859746B - Conductive substrate structure for forming conductive channel by two-sided cutting and manufacturing method thereof

Info

Publication number: CN101859746B
Application number: CN200910133085XA
Authority: CN
Inventors: 汪秉龙; 萧松益; 陈政吉
Original assignee: Harvatek Corp
Current assignee: Harvatek Corp
Priority date: 2009-04-07
Filing date: 2009-04-07
Publication date: 2012-06-27
Anticipated expiration: 2029-04-07
Also published as: CN101859746A

Abstract

The invention relates to a conductive substrate structure for forming a conductive channel by two-sided cutting. The conductive substrate structure comprises a base material unit, a conductive pad unit and a conductive layer unit, wherein the base material unit is provided with an upper surface, a lower surface, two opposite side surfaces and a front surface; the conductive pad unit is provided with two first conductive pads arranged on the upper surface of the base material unit and two second conductive pads arranged on the lower surface of the base material unit; the conductive layer unit is provided with two first conductive layers and two second conductive layers; the two first conductive layers are formed on the front surface of the base material unit and electrically connected to the front ends of the two first conductive pads respectively; the two second conductive layers are formed on the two opposite side surfaces of the base material unit and electrically connected to the two opposite side ends of the two second conductive pads; and the two first conductive layers are electrically connected to the two second conductive layers respectively. In the structure, a mode of forming holes on a substrate by cutting is adopted to replace a known mode of punching holes by using laser or digging holes by mechanical rotating.

Description

With two-sided cutting with conductive substrate structure of forming conductive channel and preparation method thereof

Technical field

The present invention relates to a kind of conductive substrate structure and preparation method thereof, relate in particular to the two-sided cutting of a kind of usefulness with conductive substrate structure of forming conductive channel and preparation method thereof.

Background technology

Use the purpose of via to be: to make front circuit and back side circuit on the substrate to produce each other and electrically conduct through via.The practice of known via is: through " laser hole burning " perhaps modes such as " mechanical rotation boreholes " one substrate is punched; In the hole, form conducting medium to change modes such as plating, plating, vapor deposition, sputter or the filling of metal mixed glue material more thereupon, electrically conduct so that front circuit on the substrate and back side circuit can produce each other through via.

Summary of the invention

Technical problem to be solved by this invention is to provide the two-sided cutting of a kind of usefulness conductive substrate structure to form conductive channel and preparation method thereof, and its mode through cutting forms a plurality of conductive channels (via) that pass a substrate.

In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, provide the two-sided cutting of a kind of usefulness to form the conductive substrate structure of conductive channel, it comprises: a base material unit, a conductive welding pad unit and a conductive layer unit.Wherein, this base material unit have a upper surface, a lower surface in contrast to this upper surface, in two opposite side surfaces between this upper surface and this lower surface, and one between this upper surface and this lower surface and be positioned at the front surface of the front end of above-mentioned two opposite side surfaces.This conductive welding pad unit has at least two upper surfaces that are arranged at this base material unit and first conductive welding pad separated from one another and at least two and is arranged at the lower surface of this base material unit and second conductive welding pad separated from one another.This conductive layer unit has at least two front surfaces that are formed at this base material unit and is electrically connected on first conductive layer and at least two two opposite side surfaces that are formed at this base material unit respectively of front end of above-mentioned two first conductive welding pad respectively and is electrically connected at second conductive layer of two opposite sides of above-mentioned two second conductive welding pad respectively, and above-mentioned at least two first conductive layers are electrically connected at above-mentioned at least two second conductive layers respectively.

In order to solve the problems of the technologies described above; According to wherein a kind of scheme of the present invention; The manufacture method of the conductive substrate structure of the two-sided cutting of a kind of usefulness to form conductive channel is provided, and it comprises the following steps: at first, and a base board unit is provided; Wherein the upper surface of this base board unit has a plurality of first conductive welding pad separated from one another, and the lower surface of this base board unit has a plurality of second conductive welding pad separated from one another; Then, the upper surface at this base board unit cuts out many first grooves; Then, cut out many second grooves at the lower surface of this base board unit, and the junction of said many second grooves and said many first grooves forms a plurality of openings; Next, form an electric conducting material in said many first grooves, in said many second grooves and in said a plurality of openings; Then, remove the interior partially conductive material of said many first grooves; At last, cut this base board unit along said many first grooves and said many second grooves, to form a plurality of conductive substrate structures.

Therefore, beneficial effect of the present invention is: the present invention replaces the mode of " known use laser beam perforation or mechanical rotation borehole " with the means of " on substrate, forming perforation through cutting mode ".

Reach technology, means and the effect that predetermined purpose is taked in order further to understand the present invention; See also following about detailed description of the present invention and accompanying drawing; Believe the object of the invention, characteristic and characteristics; Go deep into and concrete understanding when getting one thus, yet accompanying drawing only provides reference and explanation usefulness, is not to be used for the present invention is limited.

Description of drawings

Fig. 1 for the present invention with the flow chart of two-sided cutting with the manufacture method of the conductive substrate structure that forms conductive channel;

Fig. 2 to Fig. 8 B is respectively the present invention with the making schematic flow sheet (adopt U type cutter (U-cutting tool)) of two-sided cutting with the conductive substrate structure of formation conductive channel; And

Fig. 9 A to Fig. 9 D is respectively the two-sided cutting of the other a kind of usefulness of the present invention and makes schematic flow sheet (adopting V-knife tool (V-cutting tool)) with the part of the conductive substrate structure of formation conductive channel.

Description of reference numerals in the above-mentioned accompanying drawing is following:

1 ' base board unit, 11 ' upper surface

12 ' lower surface

A first groove

B second groove

The C opening

The D electric conducting material

1a ' base board unit 11a ' upper surface

12a ' lower surface

Aa first groove

Ba second groove

1 base material unit, 11 upper surfaces

12 lower surfaces

13 side surfaces

13A top

Plane on 130

The 13B lower part

131 lower planes

132 cambered surfaces

1320 camber lines

14 side surfaces

15 front surfaces

15A top

Plane on 151

152 cambered surfaces

1520 camber lines

The 15B lower part

150 lower planes

Surface, 16 back

16A top

Plane on 161

162 cambered surfaces

1620 camber lines

The 16B lower part

160 lower planes

2 conductive welding pad unit 20A first conductive welding pad

20A ' first conductive welding pad the group

20B second conductive welding pad

3 conductive layer unit 30A first conductive layers

30A ' first conductive layer

30B ' second conductive layer

1a base material unit 13a side surface

The 130a ramp

The 131a lower inclined plane

The 15a front surface

The 150a lower inclined plane

The 151a ramp

Surface behind the 16a

The 160a lower inclined plane

The 161a ramp

Embodiment

See also shown in Figure 1; The present invention provides the manufacture method of the conductive substrate structure of the two-sided cutting of a kind of usefulness to form conductive channel; It comprises the following steps: at first; One base board unit is provided, and wherein the upper surface of this base board unit has a plurality of first conductive welding pad separated from one another, and the lower surface of this base board unit has a plurality of second conductive welding pad separated from one another; Then, the upper surface at this base board unit cuts out many first grooves; Then, cut out many second grooves at the lower surface of this base board unit, and the junction of said many second grooves and said many first grooves forms a plurality of openings; Next, form an electric conducting material in said many first grooves, in said many second grooves and in said a plurality of openings; Then, remove the interior partially conductive material of said many first grooves; At last, cut this base board unit along said many first grooves and said many second grooves, to form a plurality of conductive substrate structures.

Please cooperate shown in Fig. 2 to Fig. 8 B, the present invention is with the detailed step of two-sided cutting with the manufacture method of the conductive substrate structure of formation conductive channel, shown in following:

Step S100 is: please cooperate Fig. 1 and shown in Figure 2; At first; Provide a base board unit 1 '; Wherein this base board unit 1 ' upper surface 11 ' have a plurality of first conductive welding pad 20A separated from one another, and this base board unit 1 ' lower surface 12 ' have a plurality of second conductive welding pad 20B separated from one another (figure is not shown in Fig. 2), wherein said a plurality of second conduction weldering 20B reach quantitatively corresponding with said a plurality of first conductive welding pad 20A each other in the position.In addition, this base board unit 1 ' can be wafer, circuit board or by the made substrate of any insulating material.

Step S102 is: please cooperate shown in Fig. 1, Fig. 3 A and Fig. 3 B; Adopt U type cutter (U-cutting tool) this base board unit 1 ' many first groove A of upper surface 11 ' cut out; The degree of depth of wherein said many first groove A (groove) with U-shaped shape greater than this base board unit 1 ' 1/2 thickness, and said many first groove A are formed at the both sides that each ranked first conductive welding pad 20A respectively.

Step S104 is: please cooperate (Fig. 4 B is the upward view of Fig. 4 A) shown in Fig. 1, Fig. 4 A and Fig. 4 B; Adopt U type cutter (U-cutting tool) this base board unit 1 ' lower surface 12 ' cut out many second groove B (groove) with U-shaped shape; And the junction of said many second groove B and said many first groove A forms a plurality of open C (shown in Fig. 4 B); The degree of depth of wherein said many second groove B greater than this base board unit 1 ' 1/2 thickness, and said many second groove B be formed at respectively per two ranked second conductive welding pad 20B both sides.

Step S106 is: please cooperate shown in Fig. 1, Fig. 5 A and Fig. 5 B that (Fig. 5 A is the example that is enlarged into the X part of Fig. 4 A; Fig. 5 B is the vertical view of Fig. 5 A); Through changing modes such as plating, plating, vapor deposition or sputter, to form an electric conducting material D in said many first groove A, in said many second groove B and in said a plurality of open C.

Step S108 is: please cooperate Fig. 1 and shown in Figure 6, remove the partially conductive material D in said many first groove A.In other words, in step S106, earlier with this base board unit 1 ' upper surface 11 ' said a plurality of first conductive welding pad 20A be divided into many group first conductive welding pad group 20A ', and each is organized the first conductive welding pad group 20A ' and has two first conductive welding pad 20A at least; Then; Through exposure, development, etched cooperation; Removing the electric conducting material D between each two first conductive welding pad 20A that organize the first conductive welding pad group 20A ', insulated from each other so that each organizes two the first conductive welding pad 20A of the first conductive welding pad group 20A '.

Step S110 is: please cooperate shown in Fig. 1, Fig. 7 A, Fig. 7 B, Fig. 8 A and Fig. 8 B, along said many first groove A and said many second groove B cut this base board unit 1 ', to form a plurality of conductive substrate structures (shown in Fig. 8 A and Fig. 8 B).Wherein above-mentioned along said many first groove A and said many second groove B cut this base board unit 1 ' step accomplish less than the cutting tool of the width of the width of said many first groove A and said many second groove B through one.

Therefore, can be known by Fig. 8 A and Fig. 8 B that the present invention provides the two-sided cutting of a kind of usefulness to form the conductive substrate structure of conductive channel, it comprises: a base material unit 1, a conductive welding pad unit 2 and a conductive layer unit 3.

Wherein, This base material unit 1, it has a upper surface 11, a lower surface 12 in contrast to this upper surface 11, in two opposite side surfaces between this upper surface 11 and this lower surface 12 (13,14), and one between this upper surface 11 and this lower surface 12 and be positioned at the front surface 15 of the front end of above-mentioned two opposite side surfaces (13,14).In addition, this base material unit 1 is an insulator.

In addition, this conductive welding pad unit 2 has at least two upper surfaces 11 that are arranged at this base material unit 1 and the first conductive welding pad 20A separated from one another and at least two and is arranged at the lower surface 12 of this base material unit 1 and the second conductive welding pad 20B separated from one another.In addition, above-mentioned at least two first conductive welding pad 20A are insulated from each other, and above-mentioned at least two second conductive welding pad 20B are insulated from each other.

Moreover; This conductive layer unit 3 has at least two front surfaces 15 that are formed at this base material unit 1 and is electrically connected at the first conductive layer 30A and the second conductive layer 30B that at least two two opposite side surfaces (13,14) that are formed at this base material unit 1 respectively went up and be electrically connected at respectively the two opposite sides of above-mentioned two second conductive welding pad 20B of the front end of above-mentioned two first conductive welding pad 20A respectively, and above-mentioned at least two first conductive layer 30A are electrically connected at above-mentioned at least two second conductive layer 30B respectively.In addition; Above-mentioned wherein one first conductive welding pad 20A through one first conductive layer 30A wherein and wherein electrically conducting of one second conductive layer 30B be electrically connected at wherein one second conductive welding pad 20B (shown in the arrow of Fig. 8 A), above-mentioned other one first conductive welding pad 20A is electrically connected at other one second conductive welding pad 20B through electrically conducting of other one first conductive layer 30A and other one second conductive layer 30B.

In addition; The front surface 15 of this base material unit 1 is divided into top 15A and lower part 15B; The area of the top 15A of this front surface 15 is greater than the area of the lower part 15B of this front surface 15, and the height of the top 15A of this front surface 15 is lower than the height of the lower part 15B of this front surface 15.In addition; The lower part 15B of this front surface 15 is a lower plane 150; The top 15A of this front surface 15 has plane 151 and on and is connected in the cambered surface 152 between the plane 151 and lower plane 150 on this, and has a camber line 1520 respectively on the two opposite sides of this cambered surface 150.Above-mentioned at least two first conductive layer 30A form on the last plane 151 of top 15A of this front surface 15 and on the cambered surface 152.

In addition; With side surface 13 is example (shown in Fig. 8 A); Each side surface 13 of this base material unit 1 is divided into top 13A and lower part 13B; The area of the top 13A of each side surface 13 is less than the area of the lower part 13B of each side surface 13, and the height of the top 13A of each side surface 13 is higher than the height of the lower part 13B of each side surface 13.In addition; The top 13A of each side surface 13 is plane 130 on; The lower part 13B of each side surface 13 has a lower plane 131 and and is connected in this lower plane 131 and goes up the cambered surface 132 between the plane 130, and has a camber line 1320 respectively on the two opposite sides of this cambered surface 132.Above-mentioned each second conductive layer 30B forms on the lower plane 131 of lower part 13B of each side surface 13 and on the cambered surface 132.

In addition; With side surface 14 is example (identical with side surface 13); Each side surface 14 of this base material unit 1 is divided into top (figure does not show) and lower part (figure does not show); The area on the top of each side surface 14 is less than the area of the lower part of each side surface 14, and the height on the top of each side surface 14 is higher than the height of the lower part of each side surface 14.In addition, the top of each side surface 14 is divided into plane on, and the lower part of each side surface 14 has a lower plane and and is connected in this lower plane and goes up the cambered surface between the plane, and has a camber line respectively on the two opposite sides of this cambered surface.Above-mentioned each second conductive layer 30B forms on the lower plane of lower part of each side surface 14 and on the cambered surface.

Moreover; This base material unit 1 have one between this upper surface 11 and this lower surface 12 and be positioned at above-mentioned two opposite side surfaces (13,14) the rear end back surperficial 16; This surface 16, back is in contrast to this front surface 15; This conductive layer unit 3 have be formed at this base material unit 1 back surperficial 16 on and be electrically connected at least two other first conductive layer 30A ' of the rear end of above-mentioned two first conductive welding pad 20A respectively, and above-mentioned at least two other first conductive layer 30A ' are electrically connected at above-mentioned at least two second conductive layer 30B respectively.

In addition; Shown in Fig. 8 B; Back surperficial 16 of this base material unit 1 is divided into top 16A and lower part 16B; The area of the top 16A on this surface, back 16 is greater than the area of the lower part 16B on this surface, back 16, and the height of the top 16A on this surface, back 16 is lower than the height of the lower part 16B on this surface, back 16.In addition; The lower part 16B on this surface, back 16 is a lower plane 160; The top 16A on surface, this back 16 has plane 161 and on and is connected in the cambered surface 162 between the plane 161 and lower plane 160 on this, and has a camber line 1620 respectively on the two opposite sides of this cambered surface 162.Above-mentioned at least two other first conductive layer 30A ' form on the last plane 161 of top 16A on surface, this back 16 and reach on the cambered surface 162.

Please refer to shown in Fig. 9 A; Adopt V-knife tool (V-cutting tool) to cut out many first groove Aa (groove) with V-arrangement shape at the upper surface 11a ' of this base board unit 1a '; The degree of depth of wherein said many first groove Aa is greater than 1/2 thickness of this base board unit 1a ', and said many first groove Aa are formed at the both sides that each ranked first conductive welding pad 20A respectively.

Please refer to shown in Fig. 9 B; Adopt V-knife tool (V-cutting tool) to cut out many second groove Ba (groove) with V-arrangement shape at the lower surface 12a ' of this base board unit 1a '; And the junction of said many second groove Ba and said many first groove Aa forms a plurality of openings (figure does not show); The degree of depth of wherein said many second groove Ba is greater than 1/2 thickness of this base board unit 1a ', and said many second groove Ba are formed at per two respectively and ranked second the conductive welding pad both sides of (figure does not show).

Please refer to shown in Fig. 9 C; The front surface 15a of this base material unit 1a is divided into top 15A and lower part 15B; The area of the top 15A of this front surface 15a is greater than the area of the lower part 15B of this front surface 15a, and the height of the top 15A of this front surface 15a is lower than the height of the lower part 15B of this front surface 15a.In addition, the lower part 15B of this front surface 15a is a lower inclined plane 150a, and the top 15A of this front surface 15a has a ramp 151a.

Please refer to shown in Fig. 9 C; With side surface 13a is example; Each side surface 13a of this base material unit 1a is divided into top 13A and lower part 13B; The area of the top 13A of each side surface 13a is less than the area of the lower part 13B of each side surface 13a, and the height of the top 13A of each side surface 13a is higher than the height of the lower part 13B of each side surface 13a.In addition, the top 13A of each side surface 13a is a ramp 130a, and the lower part 13B of each side surface 13a has a lower inclined plane 131a.Above-mentioned each second conductive layer 30B forms on the lower inclined plane 131a of lower part 13B of each side surface 13a.

Please refer to shown in Fig. 9 D; The back surperficial 16a of this base material unit 1a is divided into top 16A and lower part 16B; The area of the top 16A of the surperficial 16a in this back is greater than the area of the lower part 16B of the surperficial 16a in this back, and the height of the top 16A of the surperficial 16a in this back is lower than the height of the lower part 16B of the surperficial 16a in this back.In addition, the lower part 16B of the surperficial 16a in this back is a lower inclined plane 160a, and the top 16A of the surperficial 16a in this back has a ramp 161a.

In sum, beneficial effect of the present invention is: the present invention replaces the mode of " known use laser beam perforation or mechanical rotation borehole " with the means of " on substrate, forming perforation through cutting mode (adopting V-knife tool or U type cutter) ".

All scopes of the present invention should be as the criterion with appended claim; All closing in the embodiment of the spirit variation similar of claim of the present invention with it; All should be contained in the scope of the present invention; Any those of ordinary skill in the art in the field of the invention, can think easily and variation or modify and all can be encompassed in appended claim of the present invention.

Claims

One kind with two-sided cutting to form the conductive substrate structure of conductive channel, it is characterized in that, comprising:

One base material unit, it has a upper surface, a lower surface in contrast to this upper surface, in two opposite side surfaces between this upper surface and this lower surface, and one between this upper surface and this lower surface and be positioned at the front surface of the front end of above-mentioned two opposite side surfaces;

One conductive welding pad unit, it has at least two upper surfaces that are arranged at this base material unit and first conductive welding pad separated from one another and at least two and is arranged at the lower surface of this base material unit and second conductive welding pad separated from one another; And

One conductive layer unit; It has at least two front surfaces that are formed at this base material unit and is electrically connected at first conductive layer of the front end of above-mentioned two first conductive welding pad respectively; And at least two two opposite side surfaces that are formed at this base material unit respectively and be electrically connected at second conductive layer of two opposite sides of above-mentioned two second conductive welding pad respectively, and above-mentioned at least two first conductive layers are electrically connected at above-mentioned at least two second conductive layers respectively.
2. the two-sided cutting of usefulness as claimed in claim 1 is to form the conductive substrate structure of conductive channel; It is characterized in that: this base material unit is an insulator; Above-mentioned at least two first conductive welding pad are insulated from each other; Above-mentioned at least two second conductive welding pad are insulated from each other; And above-mentioned wherein one first conductive welding pad through one first conductive layer wherein and wherein electrically conducting of one second conductive layer be electrically connected at wherein one second conductive welding pad, above-mentioned other one first conductive welding pad is electrically connected at other one second conductive welding pad through electrically conducting of other one first conductive layer and other one second conductive layer.
3. the two-sided cutting of usefulness as claimed in claim 1 is to form the conductive substrate structure of conductive channel; It is characterized in that: the front surface of this base material unit is divided into top and lower part; The area on the top of this front surface is greater than the area of the lower part of this front surface, and the height on the top of this front surface is lower than the height of the lower part of this front surface.
4. the two-sided cutting of usefulness as claimed in claim 3 is to form the conductive substrate structure of conductive channel, and it is characterized in that: above-mentioned at least two first conductive layers form on the top of this front surface.
5. the two-sided cutting of usefulness as claimed in claim 3 is to form the conductive substrate structure of conductive channel; It is characterized in that: the bottom of this front surface is divided into plane; The top of this front surface has plane and on and is connected in the cambered surface between the plane and lower plane on this, and has a camber line respectively on the two opposite sides of this cambered surface.
6. the two-sided cutting of usefulness as claimed in claim 5 is characterized in that to form the conductive substrate structure of conductive channel: above-mentioned at least two first conductive layers form on the last plane on top of this front surface and reach on the cambered surface.
7. the two-sided cutting of usefulness as claimed in claim 1 is to form the conductive substrate structure of conductive channel; It is characterized in that: each side surface of this base material unit is divided into top and lower part; The area on the top of each side surface is less than the area of the lower part of each side surface, and the height on the top of each side surface is higher than the height of the lower part of each side surface.
8. the two-sided cutting of usefulness as claimed in claim 7 is to form the conductive substrate structure of conductive channel, and it is characterized in that: each second conductive layer forms on the lower part of each side surface.
9. the two-sided cutting of usefulness as claimed in claim 7 is to form the conductive substrate structure of conductive channel; It is characterized in that: the top of each side surface is divided into plane on; The lower part of each side surface has a lower plane and and is connected in this lower plane and goes up the cambered surface between the plane, and has a camber line respectively on the two opposite sides of this cambered surface.
10. the two-sided cutting of usefulness as claimed in claim 9 is characterized in that to form the conductive substrate structure of conductive channel: each second conductive layer forms on the lower plane of lower part of each side surface and on the cambered surface.
11. the two-sided cutting of usefulness as claimed in claim 1 is to form the conductive substrate structure of conductive channel; It is characterized in that: this base material unit has one between this upper surface and this lower surface and be positioned at the back surface of the rear end of above-mentioned two opposite side surfaces; This back surface opposite is in this front surface; This conductive layer unit has on the back surface that is formed at this base material unit and is electrically connected at least two other first conductive layers of the rear end of above-mentioned two first conductive welding pad respectively, and above-mentioned at least two other first conductive layers are electrically connected at above-mentioned at least two second conductive layers respectively.
12. the two-sided cutting of usefulness as claimed in claim 11 is to form the conductive substrate structure of conductive channel; It is characterized in that: the back surface segmentation of this base material unit becomes top and lower part; The area on the top on this surface, back is greater than the area of the lower part on this surface, back, and the height on the top on this surface, back is lower than the height of the lower part on this surface, back.
13. the two-sided cutting of usefulness as claimed in claim 12 is characterized in that to form the conductive substrate structure of conductive channel: above-mentioned at least two other first conductive layers form on the top on this surface, back.
14. the two-sided cutting of usefulness as claimed in claim 12 is to form the conductive substrate structure of conductive channel; It is characterized in that: the bottom on this surface, back is divided into plane; The top on surface, this back has plane and on and is connected in the cambered surface between the plane and lower plane on this, and has a camber line respectively on the two opposite sides of this cambered surface.
15. the two-sided cutting of usefulness as claimed in claim 14 is characterized in that to form the conductive substrate structure of conductive channel: above-mentioned at least two other first conductive layers form on the last plane on top on this surface, back and reach on the cambered surface.
16. one kind with the manufacture method of two-sided cutting with the conductive substrate structure that forms conductive channel, it is characterized in that, comprises the following steps:

One base board unit is provided, and wherein the upper surface of this base board unit has a plurality of first conductive welding pad separated from one another, and the lower surface of this base board unit has a plurality of second conductive welding pad separated from one another;

Upper surface at this base board unit cuts out many first grooves;

Lower surface at this base board unit cuts out many second grooves, and the junction of said many second grooves and said many first grooves forms a plurality of openings;

Form an electric conducting material in said many first grooves, in said many second grooves and in said a plurality of openings;

Remove the partially conductive material in said many first grooves; And

Cut this base board unit along said many first grooves and said many second grooves, to form a plurality of conductive substrate structures.
17. the two-sided cutting of usefulness as claimed in claim 16 is with the manufacture method of the conductive substrate structure of formation conductive channel; It is characterized in that: the degree of depth of said many first grooves is greater than 1/2 thickness of this base board unit, and the degree of depth of said many second grooves is greater than 1/2 thickness of this base board unit.
18. the two-sided cutting of usefulness as claimed in claim 16 is characterized in that with the manufacture method of the conductive substrate structure of formation conductive channel, in the step of the partially conductive material in said many first grooves of above-mentioned removal, further comprises:

Said a plurality of first conductive welding pad of this base board unit upper surface are divided into many group first conductive welding pad,

And each is organized first conductive welding pad and has two first conductive welding pad at least; And

Remove the electric conducting material between each two first conductive welding pad organizing first conductive welding pad, insulated from each other so that each organizes two first conductive welding pad of first conductive welding pad.
19. the two-sided cutting of usefulness as claimed in claim 16 is characterized in that with the manufacture method of the conductive substrate structure that forms conductive channel: above-mentioned step of cutting this base board unit along said many first grooves and said many second grooves is accomplished less than the cutting tool of the width of the width of said many first grooves and said many second grooves through one.
20. the two-sided cutting of usefulness as claimed in claim 16 is characterized in that with the manufacture method of the conductive substrate structure of formation conductive channel each conductive substrate structure comprises:

One base material unit, it has a upper surface, a lower surface in contrast to this upper surface, in two opposite side surfaces between this upper surface and this lower surface, and one between this upper surface and this lower surface and be positioned at the front surface of the front end of above-mentioned two opposite side surfaces;

One conductive welding pad unit, it has at least two upper surfaces that are arranged at this base material unit and first conductive welding pad separated from one another and at least two and is arranged at the lower surface of this base material unit and second conductive welding pad separated from one another; And

One conductive layer unit; It has at least two front surfaces that are formed at this base material unit and is electrically connected on first conductive layer and at least two two opposite side surfaces that are formed at this base material unit respectively of front end of above-mentioned two first conductive welding pad respectively and is electrically connected at second conductive layer of two opposite sides of above-mentioned two second conductive welding pad respectively, and above-mentioned at least two first conductive layers are electrically connected at above-mentioned at least two second conductive layers respectively.