CN101840973A - Light emitting diode encapsulating structure and manufacturing method thereof - Google Patents

Light emitting diode encapsulating structure and manufacturing method thereof Download PDF

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Publication number
CN101840973A
CN101840973A CN 200910126851 CN200910126851A CN101840973A CN 101840973 A CN101840973 A CN 101840973A CN 200910126851 CN200910126851 CN 200910126851 CN 200910126851 A CN200910126851 A CN 200910126851A CN 101840973 A CN101840973 A CN 101840973A
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China
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phosphor
light emitting
emitting diode
solution
led
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CN 200910126851
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Chinese (zh)
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赵自皓
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亿光电子工业股份有限公司
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Priority to CN 200910126851 priority Critical patent/CN101840973A/en
Publication of CN101840973A publication Critical patent/CN101840973A/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909Post-treatment of the connector or wire bonding area
    • H01L2224/8592Applying permanent coating, e.g. protective coating
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12041LED

Abstract

The invention discloses a manufacturing method of a light emitting diode encapsulating structure, which provides a loader and at least one light emitting diode chip which is provided with a light outlet surface and a plurality of side surfaces. The invention provides a first shade which is provided with at least one first opening; and the first opening at least exposes out of the light emitting diode chip. A spray coating device is arranged above the first shade for carrying out a first spray coating technology. The spray coating device is used for carrying out reciprocating spray coating on first fluorescent solution along a route so that the light outlet surface and the side surfaces of the light emitting diode chip are coated conformally by the first fluorescent solution. A first curing technology is carried out for curing the first fluorescent solution into a first fluorescent layer. An encapsulating colloid is formed for coating the first fluorescent layer and a part of the loader.

Description

发光二极管封装结构及其制作方法 LED package structure and a fabrication method

技术领域 FIELD

[0001] 本发明是有关于一种半导体封装结构及其制作方法,且特别是有关于一种发光二极管封装结构及其制作方法。 [0001] The present invention relates to a semiconductor package structure and a fabrication method, and more particularly to LED package structure and a manufacturing method of a light-on.

背景技术 Background technique

[0002] 发光二极管具有诸如寿命长、体积小、高抗震性、低热产生及低功率消耗等优点, 因此已被广泛应用于家用及各种设备中的指示器或光源。 [0002] The LED has advantages such as long life, small volume, high shock resistance, low heat generation and low power consumption, and therefore have been widely used in household devices and various indicators or light sources. 近年来,发光二极管已朝多色彩及高亮度发展,因此其应用领域已扩展至大型户外广告牌、交通号志灯及相关领域。 In recent years, North Korea has more than light-emitting diodes and high brightness color development, so its field of application has been extended to outdoor billboards, traffic lights and related fields. 在未来,发光二极管甚至可能成为兼具省电及环保功能的主要照明光源。 In the future, the LED may even become the main illumination light source of both energy saving and environmental features.

[0003] 公知由于发光二极管封装结构是采用大量生产的方式来制作,因此会先将封装胶体以点胶的方式填入于芯片凹穴内,之后再同时进行一烘烤过程来使封装胶体固化,以完成发光二极管封装结构。 [0003] Since the known LED package structure embodiment is the use of mass production to make, thus dispensing first encapsulant manner to fill the recesses in the chip, and then, after a baking process at the same time to make the cured encapsulant, to complete the LED package structure. 然而,由于封装胶体内具有荧光材料,于等待烘烤的过程中,荧光材料会因封装胶体所填入于芯片凹穴内的时间太长而沉降或填胶时间先后的不同,而使得荧光材料产生分布不均的现象(即大部份荧光材料沉降于芯片凹穴的底面或芯片表面), 仅有一小部份荧光材料零星地分布于封装胶体内,进而影响所生产的发光二极管封装结构的出光均勻度。 However, since the fluorescent material within the encapsulant, the process waits in the baking, due to the fluorescent material filled in the encapsulant too long in the chip pocket settle or different chronological filler, such that the fluorescent material produced maldistribution phenomenon (i.e., most of the fluorescent material settling on the bottom surface or chip surface of the chip pocket), only a small part of the fluorescent material is distributed sporadically in the encapsulant, and thus the light emitting diode package structure effects produced Evenness.

[0004] 另外,由于公知发光二极管封装结构的承载器形状不一,因此若以进行荧光涂布工艺的方式来形成荧光层于发光二极管芯片上,则必须针对不同的承载器来调整机台设备,因而降低生产效率并增加生产成本。 [0004] Further, since the shape of the carrier varies known LED package structure, so the way the coating process In terms of fluorescent phosphor layer is formed on the light emitting diode chip, the machine must be adjusted for different carrier device , thereby reducing production costs and increasing productivity.

发明内容 SUMMARY

[0005] 本发明的目的在于提供一种发光二极管封装结构及其制作方法,可提高发光二极管封装结构的发光均勻度。 [0005] The object of the present invention is to provide an LED package and a manufacturing method can improve the light emission uniformity of the light emitting diode package structure.

[0006] 为实现上述目的,本发明提出一种发光二极管封装结构的制作方法。 [0006] To achieve the above object, the present invention provides a method for manufacturing an LED package structure. 首先,提供至少一发光二极管芯片。 First, at least one light emitting diode chip. 发光二极管芯片配置于一承载器上,且发光二极管芯片具有一出光面与多个连接出光面的侧表面。 LED chips are disposed on a carrier, and the light emitting diode chip having a light emitting surface and a side surface connecting the plurality of light emitting surface. 接着,提供一第一遮罩。 Next, there is provided a first mask. 第一遮罩具有至少一第一开口,且第一开口至少暴露出发光二极管芯片。 At least a first mask having a first opening and a first opening at least exposes the LED chip. 提供一喷涂装置配置于第一遮罩的上方,以进行一第一喷涂工艺。 Providing a spray device disposed above the first mask to perform a first spray coating process. 喷涂装置沿着一路径往返喷涂一第一荧光体溶液,使得发光二极管芯片的出光面与这些侧表面被第一荧光体溶液共形地包覆。 Spraying a spraying device and from the first phosphor solution along a path, such that the surface of the light emitting diode chip is conformally coat the side surfaces and the first phosphor solution. 之后,进行一固化工艺,使包覆于发光二极管芯片的表面上的第一荧光体溶液固化成一第一荧光层。 Thereafter, a curing process, the first phosphor is coated on a surface of the LED chip in solidification of the solution into a first fluorescent layer. 最后,形成一封装胶体,包覆第一荧光层与部分承载器。 Finally, an encapsulant is formed, covering the first fluorescent layer and the carrier portion.

[0007] 在本发明的一实施例中,上述第一荧光体溶液是由一胶体溶剂、一胶体与一荧光粉所组成。 [0007] In an embodiment of the present invention, the first fluorescent substance is a colloidal solution of a solvent, a colloid and a phosphor composed.

[0008] 在本发明的一实施例中,上述沿着路径往返向第一遮罩喷涂第一荧光体溶液的同时,还包括对发光二极管芯片及承载器进行一第一加热工艺,使得发光二极管芯片上的第一荧光体溶液中的胶体溶剂被蒸发。 [0008] In an embodiment of the present invention, the first mask and from the solution of the first phosphor coating along the path while the above, further comprising a light emitting diode chip carrier and performing a first heating process, so that the light emitting diode the solvent colloidal first phosphor solution on the chip is evaporated. [0009] 在本发明的一实施例中,上述在进行固化工艺之前,还包括移除第一遮罩。 [0009] In an embodiment of the present invention, the curing process is performed prior to the above, further comprising removing the first mask. 提供一第二遮罩于发光二极管芯片的上方。 Providing a second mask over the light emitting diode chip. 第二遮罩具有至少一小于第一开口的第二开口,第二开口对应暴露出发光二极管芯片的出光面上部分的第一荧光层。 At least a second mask having a second opening smaller than the first opening, a second opening corresponding to the first fluorescent layer to expose the light emitting diode chip surface portion. 进行一第二喷涂工艺。 Performing a second spraying process. 喷涂装置沿着路径往返喷涂一第二荧光体溶液于第二开口所暴露出部分的第一荧光层上。 Spraying a spraying apparatus along the path and from the second phosphor solution exposed by the second opening on the first fluorescent layer portion.

[0010] 在本发明的一实施例中,上述第二荧光体溶液是由一胶体溶剂、一胶体与一荧光粉所组成。 [0010] In an embodiment of the present invention, the second fluorescent substance is a colloidal solution of a solvent, a colloid and a phosphor composed.

[0011] 在本发明的一实施例中,上述胶体溶剂包括二甲苯、正庚烷或丙酮。 [0011] In an embodiment of the present invention, the colloidal solvents include xylene, n-heptane or acetone.

[0012] 在本发明的一实施例中,上述胶体包括硅胶或环氧树脂。 [0012] In an embodiment of the present invention, the colloidal silica comprises or epoxy.

[0013] 在本发明的一实施例中,上述在第一荧光体溶液中,胶体溶剂、胶体与荧光粉的比例约为50%,20%% 30%。 [0013] In an embodiment of the present invention, the above-described first phosphor solution, a solvent colloid, colloid and the ratio of the phosphor is about 50% 30% 20 %%.

[0014] 在本发明的一实施例中,上述进行第二次喷涂工艺的同时,还包括进行一第二加热工艺,以蒸发喷涂在发光二极管芯片上的第二荧光体溶液中的胶体溶剂。 [0014] In an embodiment of the present invention, while a second spraying process described above, further comprising performing a second heating process to evaporate the solvent, spraying a colloidal solution of the second phosphor on the LED chip in.

[0015] 在本发明的一实施例中,上述喷涂装置包括一喷嘴。 [0015] In an embodiment of the present invention, the above-described means comprises a spray nozzle. 喷嘴以雾化的方式将第一荧光体溶液与第二荧光体溶液分别喷涂于发光二极管芯片上。 The nozzle atomized manner the first phosphor solution and the second phosphor solution is sprayed onto each LED chip.

[0016] 在本发明的一实施例中,上述在进行固化工艺的同时,还包括将位在发光二极管芯片上的第二荧光体溶液固化成一第二荧光层。 [0016] In an embodiment of the present invention, the curing process is performed while further comprising a bit on the light emitting diode chip, the second phosphor solution solidified into a second phosphor layer.

[0017] 在本发明的一实施例中,上述于提供第一遮罩于发光二极管芯片的上方之前,还包括形成至少一导线。 [0017] In an embodiment of the present invention, the above-described prior to providing a first mask over the light emitting diode chip, further comprising forming at least one wire. 发光二极管芯片通过导线与承载器电性连接。 The light emitting diode chip is electrically connected to the carrier through the wire.

[0018] 在本发明的一实施例中,上述承载器包括一电路基板或一导线架。 [0018] In an embodiment of the present invention, the above-mentioned carrier includes a circuit board or a lead frame.

[0019] 本发明提出一种发光二极管封装结构,其包括一发光二极管芯片、一第一荧光层、 一第二荧光层以及一封装胶体。 [0019] The present invention provides an LED package structure, which comprises a light emitting diode chip, a first phosphor layer, a phosphor layer, and a second encapsulant. 发光二极管芯片配置于一承载器上,且发光二极管芯片具有一出光面与多个连接出光面的侧表面。 LED chips are disposed on a carrier, and the light emitting diode chip having a light emitting surface and a side surface connecting the plurality of light emitting surface. 第一荧光层共形地包覆发光二极管芯片的出光面与这些侧表面。 The first fluorescent layer conformally covering the surface of the LED chip and the side surfaces. 第二荧光层配置于发光二极管芯片的出光面上的部分第一荧光层上。 Portion of the second phosphor layer is disposed on the light emitting diode chip surface of the first phosphor layer. 封装胶体包覆第一荧光层、第二荧光层与部分承载器。 Encapsulant covers the first fluorescent layer, the fluorescent layer and a portion of the second carrier.

[0020] 在本发明的一实施例中,上述第一荧光层包括一胶体与一荧光粉。 [0020] In an embodiment of the present invention, the first fluorescent layer comprises a phosphor with a colloid. [0021 ] 在本发明的一实施例中,上述胶体包括硅胶或环氧树脂。 [0021] In an embodiment of the present invention, the colloidal silica comprises or epoxy.

[0022] 在本发明的一实施例中,上述第二荧光层包括一胶体与一荧光粉。 [0022] In an embodiment of the present invention, the second phosphor layer comprising a phosphor and a colloid.

[0023] 在本发明的一实施例中,上述第二荧光层于第一荧光层上具有实质上相同的厚度。 [0023] In an embodiment of the present invention, the second fluorescent layer has substantially the same thickness on the first fluorescent layer.

[0024] 在本发明的一实施例中,上述第二荧光层的厚度小于或大于第一荧光层的厚度。 [0024] In an embodiment of the present invention, the thickness of the second fluorescent layer is smaller or greater than the thickness of the first fluorescent layer.

[0025] 在本发明的一实施例中,上述第一荧光层的厚度介于10微米至30微米之间,第二荧光层的厚度介于10微米至20微米之间。 [0025] In an embodiment of the present invention, the thickness of the first phosphor layer is between 10 and 30 microns, the thickness of the second phosphor layer is between 10 microns to 20 microns.

[0026] 在本发明的一实施例中,上述发光二极管封装结构更包括至少一导线。 [0026] In an embodiment of the present invention, the light emitting diode package structure further comprises at least one wire. 发光二极管芯片通过导线与承载器电性连接。 The light emitting diode chip is electrically connected to the carrier through the wire.

[0027] 在本发明的一实施例中,上述承载器包括一电路基板或一导线架。 [0027] In an embodiment of the present invention, the above-mentioned carrier includes a circuit board or a lead frame.

[0028] 基于上述,本发明因采用沿着相同路径往返喷涂荧光体溶液于发光二极管芯片的出光面与侧表面上,且荧光层于出光面与侧表面上具有实质上相同的厚度,意即荧光层是以均勻厚度配置于出光面与侧表面上,而荧光层于出光面上的厚度实质上与荧光层于每一侧表面的厚度相同。 [0028] having substantially the same thickness as the above, because the present invention uses the same path to and from the phosphor coating solution to the surface of the LED chip and the side surface, and a phosphor layer on the upper surface side surface, which means a uniform thickness phosphor layer is disposed on the upper surface side surface, while the phosphor layer on the light-emitting surface of the fluorescent layer of a thickness substantially the thickness of each of the side surface of the same. 因此,当发光二极管芯片所发出的光经过封装胶体而传递至外界时,发光二极管封装结构能具有较佳的发光均勻度。 Thus, when the light emitted from the LED chip is transmitted through the encapsulant to the outside, the light emitting diode package structure can have a better light emitting uniformity. 附图说明 BRIEF DESCRIPTION

[0029] 图1为本发明的一实施例的一种发光二极管封装结构的剖面示意图。 Cross-sectional schematic view of an embodiment of a light emitting diode package structure [0029] FIG. 1 of the present invention.

[0030] 图2为本发明的一实施例的一种发光二极管封装结构的制作方法的流程图。 A flowchart of method for manufacturing an LED package structure according to an embodiment of [0030] FIG. 2 of the present invention.

[0031] 图3A至图3C为本发明的一实施例的一种发光二极管封装结构的制作方法的流程剖面示意图。 Process of manufacturing method of an LED package structure according to an embodiment [0031] FIGS. 3A to 3C is a cross-sectional schematic view of the present disclosure.

[0032] 附图中主要组件符号说明 [0032] BRIEF DESCRIPTION OF main component symbol

[0033] 100 :发光二极管封装结构 [0033] 100: LED package structure

[0034] 110:承载器 [0034] 110: carrier

[0035] 120、120a〜120c :发光二极管芯片 [0035] 120,120a~120c: LED chip

[0036] 122、122a 〜122c :出光面 [0036] 122,122a ~122c: the surface

[0037] 124、124a 〜124c :侧表面 [0037] 124,124a ~124c: side surface

[0038] 130 :第一荧光层 [0038] 130: a first fluorescent layer

[0039] 130,:第一荧光体溶液 [0039] The first phosphor solution 130 ,:

[0040] 140 :第二荧光层 [0040] 140: second phosphor layer

[0041] 140' :第二荧光体溶液 [0041] 140 ': the second phosphor solution

[0042] 150 :封装胶体 [0042] 150: encapsulant

[0043] 160 :导线 [0043] 160: wire

[0044] 200 :喷涂装置 [0044] 200: spraying device

[0045] 201 :发光二极管芯片数组 [0045] 201: LED chip array

[0046] 202 :二流体喷嘴 [0046] 202: two-fluid nozzle

[0047] Ml :第一遮罩 [0047] Ml: first mask

[0048] M2 :第二遮罩 [0048] M2: second mask

[0049] 01:第一开口 [0049] 01: a first opening

[0050] 02:第二开口 [0050] 02: second opening

[0051] S301〜S305 :发光二极管封装结构的制造方法的各步骤具体实施方式 [0051] S301~S305: the steps of the method for manufacturing a light emitting diode package structure DETAILED DESCRIPTION

[0052] 为让本发明的上述特征和优点能更明显易懂,以下特举实施例,并配合附图作详细说明。 [0052] In order to make the above features and advantages of the present invention can be more fully understood, the following Patent several embodiments accompanied with figures are described in detail.

[0053] 图1为本发明的一实施例的一种发光二极管封装结构的剖面示意图。 Cross-sectional schematic view of an embodiment of a light emitting diode package structure [0053] FIG. 1 of the present invention. 请参考图1, 在本实施例中,发光二极管封装结构100包括一承载器110、一发光二极管芯片120、一第一荧光层130、一第二荧光层140以及一封装胶体150。 Referring to FIG. 1, in the present embodiment, the LED package structure 100 includes a carrier 110, a LED chip 120, a first fluorescent layer 130, a phosphor layer 140, and a second encapsulant 150.

[0054] 详细而言,发光二极管芯片120配置于承载器110上,且发光二极管芯片120具有一出光面122与多个连接出光面122的侧表面124,其中发光二极管芯片120通过至少一导线160(图1中仅示意地绘示一条)与承载器110电性连接。 [0054] Specifically, the light emitting diode chips 120 is disposed on the carrier 110, and the light emitting diode chip 120 having a surface 122 with a plurality of connecting the side surface 122 of the surface 124, wherein at least the light emitting diode chip 120 through a conductor 160 (FIG. 1 only schematically illustrates one) 110 is electrically connected to the carrier. 在本实施例中,承载器110例如是一电路基板或一导线架,且发光二极管芯片120包括蓝光发光二极管芯片、红光发光二极管芯片、绿光发光二极管芯片或紫外光发光二极管芯片。 In the present embodiment, the carrier 110 is, for example, a circuit substrate or a lead frame, and the light emitting diode chip 120 comprises a blue LED chip, red LED chip, green LED chip or ultraviolet LED chip. [0055] 第一荧光层130配置于发光二极管芯片120上,且包覆发光二极管芯片120的出光面122与这些侧表面124,其中第一荧光层130于出光面122与这些侧表面124上具有实质上相同的厚度,意即第一荧光层130是以均勻厚度配置于发光二极管芯片120的出光面122与这些侧表面124上,且第一荧光层130于出光面122上的厚度实质上与第一荧光层130于每一侧表面124的厚度相同。 [0055] The first phosphor layer 130 is disposed on the light emitting diode chip 120, and encapsulates the LED chip 122 and the surface 120 of the side surfaces 124, wherein the first fluorescent layer 130 on an upper surface 122 and side surfaces having 124 substantially the same thickness, which means that the first fluorescent layer 130 is disposed at a uniform thickness out of the light emitting diode chip 120 on the surface 122 and side surfaces 124, and the first fluorescent layer 130 on the light receiving surface 122 having a thickness substantially the same thickness as the first fluorescent layer 130 on each side surface 124. 在本实施例中,第一荧光层130的材质包括一胶体与一荧光粉。 In the present embodiment, the material of the first fluorescent layer 130 comprises a phosphor with a colloid.

[0056] 第二荧光层140配置于位于发光二极管芯片120的出光面122上的部分第一荧光层130上,且第二荧光层140于第一荧光层130上具有实质上相同的厚度,意即第二荧光层140是以均勻厚度配置于发光二极管芯片120的出光面122上的部分第一荧光层130上。 [0056] The second phosphor layer 140 is disposed on a portion of the first fluorescent layer 130 on the surface 122 of the light emitting diode chip 120, and the second fluorescent layer 140 has substantially the same thickness on the first fluorescent layer 130, intended to i.e., the second phosphor layer 140 is the upper portion of the first fluorescent layer 130 on the surface 122 of uniform thickness 120 is disposed on the light emitting diode chip. 此外,在本实施例中,第二荧光层140的厚度可以大于、小于或等于第一荧光层130的厚度。 Further, in the present embodiment, the thickness of the second phosphor layer 140 may be greater than, less than or equal to the thickness of the first phosphor layer 130. 较佳地,第一荧光层130的厚度介于10微米至30微米之间,第二荧光层140的厚度介于10 微米至20微米。 Preferably, the thickness of the first fluorescent layer 130 is between 10 and 30 microns, the thickness of the second fluorescent layer 140 is between 10 to 20 microns. 在本实施例中,第二荧光层140的材质包括一胶体与一荧光粉。 In the present embodiment, the material of the second fluorescent layer 140 comprises a phosphor with a colloid. 值得一提的是,第一荧光层130与第二荧光层140所含的荧光粉实质上相同,当然,亦可以因所需要的颜色,而使得第一荧光层130所含的荧光粉不同于第二荧光层140所含的荧光粉。 It is worth mentioning that the first phosphor layer 130 and the second phosphor contained in the phosphor layer 140 are substantially the same, of course, also be required depending on the color, so that the phosphor contained in the first phosphor layer 130 is different from phosphor 140 contained in the second phosphor layer.

[0057] 封装胶体150包覆部分承载器110、第一荧光层130、第二荧光层140以及导线160,其中封装胶体150的功用为保护发光二极管芯片120与导线160,以避免受到外界温度、湿气与噪声的影响。 [0057] The encapsulant 150 cover the carrier portion 110, a first fluorescent layer 130, a second fluorescent layer 140 and a wire 160, wherein the function of encapsulant 150 to protect the light emitting diode chip 120 and the wire 160, in order to avoid the outside temperature, effects of moisture and noise. 在本实施例中,封装胶体150的材质例如是环氧树脂。 In the present embodiment, the encapsulant material 150, for example, an epoxy resin.

[0058] 当发光二极管芯片120所发出的色光从出光面122或这些侧表面124经由封装胶体150而传递至外界时,在此过程中,发光二极管芯片120所发出的色光会有一部份从出光面122照射到第一荧光层130与第二荧光层140,而另一部份的色光会从发光二极管芯片120的这些侧表面124照射到第一荧光层130,自发光二极管芯片120所发出的光会分别激发第一荧光层130与第二荧光层140中的荧光粉且发出色光,并与发光二极管芯片120所发出的色光相混合,以产生人眼所见的白光。 [0058] When the color light-emitting diode chip emitted 120 is transmitted to the outside through the encapsulant 150 from the surface 122 or the side surface 124, in this process, the colored light emitting diode chip is emitted 120 will be a part of the light a first surface 122 irradiated to the phosphor layer 130 and the second phosphor layer 140, and the other part of the color light irradiated from the side 124 will surface of the LED chip 120 to the first fluorescent layer 130, emitted from the LED chip 120 light excites the phosphor layer 130 and the first respectively the second phosphor layer 140 and emitting fluorescent light, and mixed with the color light emitted from the LED chip 120, to produce white light seen by human eyes.

[0059] 由于本实施例的第一荧光层130是以均勻厚度配置于发光二极管芯片120的出光面122与这些侧表面124上,而第二荧光层140是以均勻厚度配置在发光二极管芯片120 的出光面122上的部分第一荧光层130上,因此,第一荧光层130与第二荧光层140所发出的色光与发光二极管芯片120所发出的色光相混合后的色光均勻度较佳,也就是说,混合后的色光通过封装胶体150而传递外界时,发光二极管封装结构100于各角度所呈现的出光均勻度较佳。 [0059] Since the first fluorescent layer 130 of the present embodiment is arranged in a uniform thickness of the light emitting diode chip 122 and the upper surface 120 of the side surfaces 124, and the second fluorescent layer 140 is disposed at a uniform thickness LED chip 120 of the upper portion of the first fluorescent layer 130 on the light receiving surface 122, therefore, the phosphor layer 130 and the first color light and the color light emitted from the light emitting diode chips 120 140 emitted from the second phosphor layer with the mixed color light uniformity preferred, that is, when the mixed color light is transmitted outside through the encapsulant 150, the light emitting diode package structure 100 to the respective angle of the light uniformity presented preferred. 换言之,本实施例的发光二极管封装结构100具有较佳的出光均勻度。 In other words, the light emitting diode package structure 100 of the present embodiment has better light uniformity.

[0060] 以上仅介绍本发明的发光二极管封装结构100,并未介绍本发明的发光二极管封装结构的制作方法。 [0060] The above description is only the light emitting diode package 100 according to the present invention, does not describe the production method of the LED package structure of the present invention. 对此,以下将以图1中的发光二极管封装结构100作为举例说明,并配合图2、图3A至图3C对本发明的发光二极管封装结构的制作方法进行详细的说明。 In this regard, the light emitting diode package structure 1100 as will be illustrated hereinafter view and with FIG. 2, 3A to 3C of the method of manufacturing a light emitting diode package of the present invention will be described in detail.

[0061] 图2为本发明的一实施例的一种发光二极管封装结构的制作方法的流程图,图3A 至图3C为本发明的一实施例的一种发光二极管封装结构的制作方法的流程剖面示意图。 Process of manufacturing method of an LED package structure according to an embodiment of the [0061] present invention. FIG. 2 is a flowchart of a method for manufacturing a light emitting diode package according to an embodiment, FIGS. 3A to 3C of the present invention. sectional view. 请先参考图2与图3A,依照本实施例的发光二极管封装结构的制造方法,首先,步骤S301是提供一承载器110及一发光二极管芯片数组201,发光二极管芯片数组201包括一第一发光二极管芯片120a、一第二发光二极管芯片120b及一第三发光二极管芯片120c,图3A仅示意地绘示三个,但不以此为限。 Please refer to FIG. 2 and 3A, the method of manufacturing a package structure in accordance with the light emitting diode of the present embodiment, first, step S301 is to provide a carrier 110 and a LED chip array 201, the light emitting diode chip 201 comprises a first light emitting array LED chip 120a, a second LED chip 120b and a third LED chip 120c, FIG. 3A only schematically illustrates three, but not limited thereto.

[0062] 详细而言,这些发光二极管芯片1 20a、120b、120c配置于承载器110上,且这些发光二极管芯片120a、120b、120c分别具有一出光面122a、122b、122c与多个连接出光面122的侧表面124a、124b、124c,其中每一发光二极管芯片120a、120b、120c通过至少一导线160 (图3A中仅示意地绘示一个)与承载器110电性连接。 [0062] Specifically, the LED chips 1 20a, 120b, 120c disposed on the carrier 110, and the LED chips 120a, 120b, 120c each having a light emitting surface 122a, 122b, 122c connected to the plurality of surface side surface 122 124a, 124b, 124c, wherein each of the LED chips 120a, 120b, 120c (FIG. 3A only schematically illustrated a) through at least one wire 160 is electrically connected to the carrier 110. 在本实施例中,承载器110例如是一电路基板或一导线架(未绘示)。 In the present embodiment, the carrier 110 is, for example, a circuit substrate or a lead frame (not shown). 发光二极管芯片数组201包括蓝光发光二极管芯片、红光发光二极管芯片、绿光发光二极管芯片或紫外光发光二极管芯片。 LED chip array 201 includes a blue LED chip, red LED chip, green LED chip or ultraviolet LED chip.

[0063] 接着,步骤S302是提供一第一遮罩Ml于发光二极管芯片数组201的上方。 [0063] Next, a step S302 is provided above the first mask Ml to the LED chip array 201. 详细而言,第一遮罩Ml具有至少一第一开口01 (图3A中仅示意地绘示三个),这些第一开口01 分别对应暴露出发光二极管芯片120a、120b、120c的出光面122a、122b、122c与部分承载器110。 Specifically, the first mask Ml having at least a first opening 01 (FIG. 3A only schematically illustrates three), respectively corresponding to the first openings 01 to expose the light emitting diode chips 120a, 120b, 120c exit surface 122a , 122b, 122c and the portions of the carrier 110.

[0064] 接着,步骤S303是提供一喷涂装置200于第一遮罩Ml的上方,以进行一第一喷涂工艺。 [0064] Next, step S303 is to provide a spray device 200 in a first mask Ml above, to perform a first spray coating process. 喷涂装置200沿着一路径(图3A中的箭头方向)往返喷涂一第一荧光体溶液130', 以包覆暴露于这些第一开口01与承载器110的外的发光二极管芯片120a、120b、120c的出光面122a、122b、122c与侧表面124a、124b、124c。 Spraying device 200 along a path (arrow direction in FIG. 3A) and from spray a first phosphor solution 130 ', so as to cover the outer exposed to the first openings 01 and the carrier 110 of the LED chip 120a, 120b, 120c exit surface 122a, 122b, 122c and the side surfaces 124a, 124b, 124c. 由于本发明是采用相同路径往返喷涂第一荧光体溶液130,于发光二极管芯片120a、120b、120c的出光面122a、122b、122c与侧表面124a、124b、124c上,因此,第一发光二极管芯片120a与第三发光二极管芯片120c的出光面122a、122c与侧表面124a、124c上的荧光粉分布大致上相同,如此一来,可提高每一发光二极管芯片120a、120b、120c整体的出光均勻度。 Since the present invention is the use of the same path to and from coating the first phosphor solution 130, the light emitting diode chip to a surface 122a 120a, 120b, 120c of, 122b, 122c and the side surfaces 124a, 124b, upper 124c, therefore, the first LED chip 120a and 120c of the LED chip of the third light exit surface 122a, 122c and the side surfaces 124a, 124c on the distribution of the phosphor is substantially the same as, this way, can be improved 120a, 120b, 120c overall uniformity of each light-emitting diode chips .

[0065] 详细而言,喷涂装置200包括一二流体喷嘴202,其中二流体喷嘴202是利用压缩空气高速流动的原理,使液体变微粒化的喷嘴。 [0065] Specifically, the fluid spray device 200 comprises twelve nozzle 202, wherein the two-fluid nozzle 202 is compressed using the principle of high-speed flow of the liquid becomes atomized nozzle. 第一荧光体溶液130'通过二流体喷嘴202 以雾化液体的方式喷涂于这些发光二极管芯片120a、120b、120c的这些出光面122a、122b、 122c与这些侧表面124a、124b、124c上。 The first phosphor solution 130 'by the two-fluid nozzle 202 so as to atomize the liquid sprayed in the LED chips 120a, 120b, 120c of the light emitting surface 122a, 122b, 122c and the side surfaces 124a, 124b, the 124c. 在本实施例中,第一荧光体溶液130'是由一胶体溶剂、一胶体与一荧光粉所组成,其中胶体溶剂例如是二甲苯、正庚烷或丙酮,且胶体溶剂、 胶体与荧光粉分别约占第一荧光体溶液130'的50%、20%与30%。 In the present embodiment, the first phosphor solution 130 'is a colloid solvent, a colloid and a phosphor composed of, for example, a solvent wherein the colloidal xylene, n-heptane or acetone, and the solvent colloid, colloid and phosphor representing approximately the first phosphor solution 130 '50%, 20% and 30%.

[0066] 值得一提的是,在本实施例中,沿着路径(图3A中的箭头方向)往返喷涂第一荧光体溶液130,于这些发光二极管芯片120a、120b、120c的这些出光面122a、122b、122c与这些侧表面124a、124b、124c的同时,还包括进行一第一加热工艺,以蒸发第一荧光体溶液130'中的胶体溶剂。 [0066] It is worth mentioning that, in the present embodiment, along the path (arrow direction in FIG. 3A) and from the first phosphor solution 130 sprayed, in the LED chips 120a, 120b, 120c of the light emitting surface 122a , 122b, 122c and the side surfaces 124a, while 124b, 124c, further comprising performing a first heating process, the first phosphor solution to evaporate the solvent colloidal 130 'is. 由于本实施例的第一荧光体溶液130'中具有胶体溶剂,可使第一荧光体溶液130'的黏度降低,因此当采用二流体喷嘴202喷涂第一荧光体溶液130'时,可使第一荧光体溶液130'均勻的分布于这些发光二极管芯片120a、120b、120c的这些出光面122a、122b、122c与这些侧表面124a、124b、124c,且同时进行加热过程时,第一荧光体溶液130'能先行成型,可降低第一荧光体溶液130'中荧光粉分布不均的问题。 Since the first embodiment according to the present embodiment the phosphor solution 130 'in a solvent having a colloid, can first phosphor solution 130' decreases viscosity, thus when using the two-fluid spray nozzle 202 of the first phosphor solution 130 ', the first enable when a phosphor solution 130 'is uniformly distributed in the LED chips are those that surface 120a, 120b, 120c to 122a, 122b, 122c and the side surfaces 124a, 124b, 124c, and simultaneously the heating process, the first phosphor solution 130 'can be formed in advance can reduce the first phosphor solution 130' in the problem of uneven distribution of the phosphor. 换言之,第一加热工艺后,仅遗留第一荧光体溶液130'中的荧光粉与少许的胶体于这些发光二极管芯片120a、120b、120c 的这些出光面122a、122b、122c 与这些侧表面124a、124b、124c 上。 In other words, after the first heating process, only the left first phosphor and the phosphor solution 130 little colloidal 'on the LED chips 120a, 120b, 120c of the light emitting surface 122a, 122b, 122c and the side surfaces 124a, 124b, 124c on.

[0067] 接着,移除第一遮罩Ml。 [0067] Next, removal of the first mask Ml.

[0068] 接着,请参考图3B,提供一第二遮罩M2于发光二极管芯片120a、120b、120c的上方,其中第二遮罩M2位于发光二极管芯片120a、120b、120c与喷涂装置200之间,且第二遮罩M2具有至少一第二开口02 (图3B中仅示意地绘示三个),这些第二开口02以对应暴露出这些发光二极管芯片120a、120b、120c的这些出光面122a、122b、122c上的部分第一荧光体溶液130'。 [0068] Next, referring to Figure 3B, to provide the top 120a, 120b, 120c of a second mask M2 to the light emitting diode chip, wherein the second mask M2 is located light emitting diode chips 120a, 120b, 120c and the spray apparatus 200 and the second mask M2 has (in FIG. 3B only schematically illustrate three) at least a second opening 02, second openings 02 to correspond to expose the LED chips 120a, 120b, 120c of the light emitting surface 122a , 122b, 122c on the part of the first phosphor solution 130 '. [0069] 接着,请再参考图3B,进行一第二喷涂工艺。 [0069] Next, Referring again to Figure 3B, performing a second spray coating process. 喷涂装置200沿着路径(图3B中的箭头方向)往返喷涂一第二荧光体溶液140'于第二开口02所暴露出的这些发光二极管芯片120a、120b、120c的这些出光面122a、122b、122c上的部分第一荧光体溶液130,上。 Spraying apparatus 200 traverse along a path (arrow direction in FIG. 3B) spray a second phosphor solution 140 'opening to the second LED chips 02 exposed 120a, 120b, 120c of the light emitting surface 122a, 122b, portion of the first phosphor solution 130 on 122c, the. 在本实施例中,第二荧光体溶液140'是通过二流体喷嘴202以雾化液体的方式喷涂于这些发光二极管芯片120a、120b、120c的这些出光面122a、122b、122c上的部份第一荧光体溶液130'上。 In the present embodiment, the second phosphor solution 140 'is a two-fluid nozzle 202 by way of the atomized liquid sprayed out of the surface of these LED chips 120a, 120b, 120c to 122a, 122b, 122c on the second portion a phosphor solution 130 'on. 第二荧光体溶液140'是由一胶体溶剂、一胶体与一荧光粉所组成,其中胶体溶剂例如是二甲苯、正庚烷或丙酮,且胶体溶剂、胶体与荧光粉分别约占第二荧光体溶液140'的50%、20%与30%。 The second phosphor solution 140 'is composed of a colloidal solvent, a colloid and a phosphor composed of, for example, a solvent wherein the colloidal xylene, n-heptane or acetone, and the solvent colloid, colloid and the second phosphor are fluorescent about precursor solution 140 '50%, 20% and 30%.

[0070] 值得一提的是,在本实施例中,沿着路径(图3B中的箭头方向)往返喷涂第二荧光体溶液140'于这些发光二极管芯片120a、120b、120c的这些出光面122a、122b、122c上的第一荧光体溶液130'上的同时,还包括进行一第二加热工艺,以蒸发第二荧光体溶液140' 中的胶体溶剂。 [0070] It is worth mentioning that, in the present embodiment, along the path (arrow direction in FIG. 3B) and from the second phosphor solution spray 140 'on the LED chips 120a, 120b, 120c of the light emitting surface 122a , 122b, the first phosphor solution on the 122c 130 'simultaneously, further comprising performing a second heating process to evaporate the second phosphor solution 140' colloid solvent. 由于本实施例的第二荧光体溶液140'中具有胶体溶剂,可使第二荧光体溶液140'的黏度降低,因此当采用二流体喷嘴202喷涂第二荧光体溶液140'时,可使第二荧光体溶液140'均勻的分布于这些发光二极管芯片120a、120b、120c的出光面122a、122b、 122c上的第一荧光层130上,且同时进行加热过程时,第二荧光体溶液140'能先行成型,可降低第二荧光体溶液140'中荧光粉分布不均的问题。 Since the second embodiment according to the present embodiment the phosphor solution 140 'of colloid solvent enables the second phosphor solution 140' decreases viscosity, thus when using the two-fluid nozzle 202 spray the second phosphor solution 140 ', the first enable two phosphor solution 140 'is uniformly distributed in the light emitting diode chips 120a, 120b, 120c exit surface 122a, 122b, on the first fluorescent layer 130 on 122c, while the heating process, the second phosphor solution 140' forming first energy, reduce the second phosphor solution 140 'in the problem of uneven distribution of the phosphor. 换言之,第二加热工艺后,仅遗留第二荧光体溶液140'中的荧光粉与少许的胶体于这些发光二极管芯片120a、120b、120c的这些出光面122a、122b、122c上的第一荧光体溶液130'上。 In other words, after the second heating process, only the left second phosphor solution 140 'with little colloidal phosphor to the LED chips 120a, 120b, 120c of the light emitting surface 122a, 122b, 122c on the first phosphor solution 130 'on.

[0071] 此外,本实施例的第一荧光体溶液130'可与第二荧光体溶液140'实质上相同,当然,亦可以因荧光体溶液所选择的荧光粉不同,而使得第一荧光体溶液130'不同于第二荧光体溶液140',此仍属于本发明可采用的技术方案,不脱离本发明所欲保护的范围。 [0071] In addition, the first phosphor solution according to the present embodiment 130 'may be the second phosphor solution 140' is substantially the same, of course, also be due to the different phosphors phosphor selected solution, so that the first phosphor solution 130 'differs from the second phosphor solution 140', still belongs to this aspect of the present invention may be employed without departing from the scope of protection of the present invention is desired.

[0072] 接着,步骤S304是进行一固化工艺,以使第一荧光体溶液130'固化成一第一荧光层130,第二荧光体溶液140'固化成一第二荧光层140。 [0072] Next, step S304 is a curing process, so that the first phosphor solution 130 'is cured into a first fluorescent layer 130, the second phosphor solution 140' is cured into a second phosphor layer 140. 详细而言,第一荧光层130于这些发光二极管芯片120a、120b、120c的这些出光面122a、122b、122c与这些侧表面124a、124b、 124c上具有实质上相同的厚度,意即第一荧光层130是以均勻厚度分布于这些发光二极管芯片120a、120b、120c的这些出光面122a、122b、122c与这些侧表面124a、124b、124c上。 Specifically, the first fluorescent layer 130 on which the LED chips 120a, 120b, 120c of the light receiving surface 122a, 122b, 122c and the side surfaces 124a, 124b, 124c have substantially the same thickness, which means the first fluorescent 130 is a uniform layer thickness distribution in the light emitting diode chips 120a, 120b, 120c of the light emitting surface 122a, 122b, 122c and the side surfaces 124a, 124b, the 124c. 第一荧光层130于每一出光面122a、122b、122c上的厚度实质上与第一荧光层130于每一侧表面124a、124b、124c的厚度相同。 The first fluorescent layer 130 on each of the light emitting surface 122a, 122b, 122c of a thickness of the substantially 124a, 124b, 130 on each side of the same surface 124c of the first phosphor layer thickness. 第二荧光层140于这些发光二极管芯片120a、120b、 120c的这些出光面122a、122b、122c上的部分第一荧光层130上具有实质上相同的厚度,或是第二荧光层140的厚度小于或大于第一荧光层130的厚度。 The second fluorescent layer 140 on the LED chips 120a, 120b, 120c of the light emitting surface 122a, 122b, having substantially the same thickness of the upper portion of the first fluorescent layer 130 on 122c, or the thickness of the second phosphor layer 140 is smaller than or greater than the thickness of the first phosphor layer 130.

[0073] 接着,移除第二遮罩M2。 [0073] Subsequently, removing the second mask M2.

[0074] 之后,步骤S305是形成一封装胶体150以包覆部分承载器110、第一荧光层130、 第二荧光层140以及导线160,其中封装胶体150的功用为保护发光二极管芯片120与导线160,以避免受到外界温度、湿气与噪声的影响。 After [0074] Step S305 is the cover portion 150 to the carrier 110, a first fluorescent layer 130 is formed encapsulant, the second phosphor layer 140, and the wire 160, wherein the function of encapsulant 150 to protect the light emitting diode chip 120 and the wires 160, in order to avoid the impact of external temperature, moisture and noise. 在本实施例中,封装胶体150的材质例如是环氧树脂。 In the present embodiment, the encapsulant material 150, for example, an epoxy resin. 最后,进行一单体化工艺,以形成多个独立的发光二极管封装结构100,请参考图3C。 Finally, a single process to form a plurality of independent LED package 100, refer to FIG. 3C.

[0075] 简言之,由于本实施例的发光二极管封装结构的制作方法,是采用相同路径往返喷涂第一荧光体溶液130'于这些发光二极管芯片120的这些出光面122与这些侧表面124 上,且第一荧光层130是以均勻厚度配置于这些出光面122与这些侧表面124上,第一荧光层130于每一出光面122上的厚度实质上与第一荧光层130于每一侧表面124的厚度相同,因此本实施例的发光二极管封装结构的制作方法可提高这些发光二极管封装结构100 整体的出光均勻度。 [0075] In brief, since the manufacturing method of the LED package according to the present embodiment is the same path to and from the first phosphor coating solution 130 'on the light emitting surface 122 and the side surface 124 of the LED chips 120 on and the first fluorescent layer 130 is disposed at a uniform thickness such that upper surface 122 and side surfaces 124, 130 to each of the first fluorescent layer with a thickness of 122 on the light receiving surface substantially in the first fluorescent layer 130 on each side surface 124 of the same thickness, thus making the method of the LED package according to the present embodiment can improve the overall uniformity of light 100 of the LED package structure.

[0076] 此外,由于发光二极管芯片120所产生的色光指向性强(即出光面的光较强),因此在本发明中,于第一喷涂工艺后,利用不同于第一遮罩Ml尺寸的第二遮罩M2来进行第二喷涂工艺,以于这些发光二极管芯片120的这些出光面122上的第一荧光层130上形成第二荧光层140。 [0076] Further, since the shade strong directivity (i.e., the surface of the strong light) generated by the LED chip 120, so in the present invention, after the first spraying process, using a mask different from the first size Ml the second mask M2 to perform a second spraying process, the second phosphor layer 140 is formed on the first fluorescent layer 130 on the surface 122 of the light emitting diode chip 120. 换言之,利用不同尺寸的遮罩,可于发光二极管芯片120上制作出局部多层的荧光层,以提高发光二极管封装结构100整体的出光均勻度。 In other words, the use of masks of different sizes, can be produced in a partial multilayer phosphor layer on the light emitting diode chip 120, in order to improve the overall LED package structure 100 of the light uniformity.

[0077] 另外,喷涂装置200沿着相同路径往返喷涂第二荧光体溶液140'于这些发光二极管芯片120a、120b、120c的出光面122a、122b、122c上的第一荧光体溶液130,,且第二荧光层140是以均勻厚度配置于这些出光面122a、122b、122c上的第一荧光层130上,因此每一发光二极管芯片120a、120b、120c所发出的色光与第一荧光层130与第二荧光层140所发出的色光相混合后并通过封装胶体150而传递外界时,每一发光二极管封装结构100于各角度所呈现的出光均勻度较佳。 [0077] Further, the spraying device 200 traverse along the same path spray the second phosphor solution 140 'on the LED chips 120a, 120b, 120c exit surface 122a, 122b, on the first phosphor solution and 122c 130 ,, the second fluorescent layer 140 is disposed at a uniform thickness of these light exit surface 122a, 122b, on the first fluorescent layer 130 on 122c, so that each light emitting diode chips 120a, 120b, 120c of the color light emitted from the phosphor layer 130 and the first the colored light emitted from the second phosphor layer 140 and is transmitted after mixing with the outside through the encapsulant 150, each LED package structure 100 to the respective angle of the light uniformity presented preferred. 换言之,本实施例的发光二极管封装结构的制造方法所形成的每一发光二极管封装结构100皆具有较佳的出光均勻度。 In other words, each LED package manufacturing method of the LED package structure of the present embodiment are formed 100 has better light uniformity.

[0078] 综上所述,本发明因采用沿着相同路径往返喷涂第一荧光体溶液与第二荧光体溶液于发光二极管芯片的出光面与侧表面上及出光面上的第一荧光层上,且第一荧光层是以均勻厚度配置于出光面与侧表面上,第二荧光层是以均勻厚度配置于出光面上的第一荧光层上。 [0078] As described above, the upper surface and the side surface of the present invention by using the same path to and from the spray solution first phosphor and the second phosphor solution on the LED chip of the light receiving surface of the first fluorescent layer and the first fluorescent layer is disposed in a uniform thickness and a surface side surface, the second phosphor layer is a phosphor layer on the first light receiving surface disposed at a uniform thickness. 因此,当发光二极管芯片所发出的色光与第一荧光层与(或)第二荧光层所发出的色光相混合后并通过封装胶体而传递外界时,发光二极管封装结构于各角度所呈现的出光均勻度较佳。 Accordingly, when the color light color light emitted from the LED chip and the phosphor layer and the first (or the) emitted from the second phosphor layer and after mixing with the outside is transmitted through the encapsulant, the light emitting diode package in each angle light presented uniformity preferred. 换言之,本发明的发光二极管封装结构具有较佳的出光均勻度。 In other words, the light emitting diode package structure of the present invention has better light uniformity.

[0079] 虽然本发明已以实施例描述如上,然其并非用以限定本发明,本领域技术人员在不脱离本发明的精神和范围内,当可作些许的更动与润饰,故本发明的保护范围应当以申请的权利要求范围所界定的内容为准。 [0079] While the embodiments of the present invention has been described above, they are not intended to limit the invention, those skilled in the art without departing from the spirit and scope of the present disclosure, may make various modifications and variations, the present invention is therefore the scope of application should be claimed scope as defined in claims and their equivalents.

Claims (16)

  1. 一种发光二极管封装结构的制作方法,包括:提供至少一发光二极管芯片,该发光二极管芯片配置于一承载器上,且该发光二极管芯片具有一出光面与多个连接该出光面的侧表面;提供一第一遮罩,具有至少一第一开口,该第一开口至少暴露出该发光二极管芯片;提供一喷涂装置,配置于该第一遮罩的上方,以进行一第一喷涂工艺,该喷涂装置沿着一路径往返喷涂一第一荧光体溶液,使得该发光二极管芯片的该出光面与该些侧表面被该第一荧光体溶液共形地包覆;进行一固化工艺,使包覆于该发光二极管芯片的表面上的第一荧光体溶液固化成一第一荧光层;以及形成一封装胶体,包覆该第一荧光层与部分该承载器。 A method of making a light emitting diode package structure, comprising: providing at least one light emitting diode chip, the LED chip disposed on a carrier, and the LED chip having a surface with a surface connected to the plurality of side surfaces; providing a first mask, having at least a first opening, the first opening at least exposes the LED chip; providing a spray means disposed above the first mask to perform a first spray coating process, the spraying device along a path to and from the first phosphor coating a solution, so that the LED chip is the light emitting surface of the first phosphor solution conformally coated with the plurality of side surfaces; performing a curing process, so that the coating in the first phosphor on the surface of the LED chip was cured into a first phosphor layer; and forming an encapsulant, covering the first fluorescent layer and a portion of the carrier.
  2. 2.如权利要求1所述的发光二极管封装结构的制作方法,其中,沿着该路径往返向该第一遮罩喷涂该第一荧光体溶液的同时,包括对该发光二极管芯片及该承载器进行一第一加热工艺,使该发光二极管芯片上的该第一荧光体溶液中的该胶体溶剂被蒸发。 2. The manufacturing method of the LED package 1 of claim, wherein the first mask serving to spray the solution while the first phosphor along the path, including the LED chip and the carrier performing a first heating process, so that the solvent for the colloid first phosphor solution on the LED chip is evaporated.
  3. 3.如权利要求1所述的发光二极管封装结构的制作方法,其中,在进行该固化工艺之前,包括:移除该第一遮罩;提供一第二遮罩于该发光二极管芯片的上方,该第二遮罩具有至少一小于该第一开口的第二开口,该第二开口对应暴露出该发光二极管芯片的出光面上部分的该第一荧光层; 以及进行一第二喷涂工艺,其中该喷涂装置沿着该路径往返喷涂一第二荧光体溶液于该第二开口所暴露出部分的该第一荧光层上。 3. The manufacturing method of light emitting diode package structure as claimed in claim, wherein, prior to the curing process, comprising: removing the first mask; providing a second mask over to the light emitting diode chip, the at least one second mask having a second opening smaller than the first opening, a second opening corresponding to the phosphor layer exposes the first portion of the light-emitting surface of the LED chip; and performing a second spray coating process, wherein the spray coating apparatus along the path and from a second phosphor solution exposed by the second opening in the first portion of the phosphor layer.
  4. 4.如权利要求3所述的发光二极管封装结构的制作方法,其中,该第一荧光体溶液及该第二荧光体溶液分别是由一胶体溶剂、一胶体与一荧光粉所组成。 4. The manufacturing method of claim 3 LED package of claim wherein the first phosphor and the second phosphor solution are composed of a colloidal solution solvent, a colloid and a phosphor composed.
  5. 5.如权利要求4所述的发光二极管封装结构的制作方法,其中,该胶体溶剂包括二甲苯、正庚烷或丙酮,该胶体包括硅胶或环氧树脂。 5. The manufacturing method of claim 4 LED package structure according to claim wherein the colloid solvents include xylene, n-heptane or acetone, which comprises colloidal silica or epoxy.
  6. 6.如权利要求5所述的发光二极管封装结构的制作方法,其中,在该第一荧光体溶液中,该胶体溶剂、该胶体与该荧光粉的比例约为50%、20%与30%。 6. The manufacturing method according to the light emitting diode package structure as claimed in claim, wherein, in the first phosphor solution, the ratio of colloid solvent of the colloid and the phosphor is about 50%, 20% and 30% .
  7. 7.如权利要求4所述的发光二极管封装结构的制作方法,其中,进行该第二喷涂工艺的同时,包括进行一第二加热工艺,以蒸发喷涂在该发光二极管芯片上的该第二荧光体溶液中的该胶体溶剂。 7. The method of manufacturing the same time 4 LED package structure according to claim, wherein the second spraying process is performed, including a second heating process to evaporate the second phosphor coating on the light emitting diode chip the solvent of the colloidal solution in the body.
  8. 8.如权利要求3所述的发光二极管封装结构的制作方法,其中,该喷涂装置包括一喷嘴,该喷嘴以雾化的方式将该第一荧光体溶液与该第二荧光体溶液分别喷涂于该发光二极管芯片上。 8. The manufacturing method of claim 3 LED package of claim, wherein the apparatus comprises a spray nozzle in atomized manner the first phosphor solution and the second solution are sprayed on phosphor the light emitting diode chip.
  9. 9.如权利要求3所述的发光二极管封装结构的制作方法,其中,在进行该固化工艺的同时,包括将位在该发光二极管芯片上的该第二荧光体溶液固化成一第二荧光层。 9. The manufacturing method of claim 3 LED package of claim, wherein the curing process is performed at the same time, the bits comprising the LED chip on the second phosphor solution solidified into a second phosphor layer.
  10. 10.如权利要求1所述的发光二极管封装结构的制作方法,其中,于提供该第一遮罩于该发光二极管芯片的上方之前,包括形成至少一导线,该发光二极管芯片通过该导线与该承载器电性连接。 10. The method of fabricating a light emitting diode package structure as claimed in claim, wherein, in a first mask before providing the above the light emitting diode chip, comprising forming at least one wire, the LED chip through the lead to the the carrier is electrically connected.
  11. 11. 一种发光二极管封装结构,包括:一发光二极管芯片,配置于一承载器上,该发光二极管芯片具有一出光面与多个连接该出光面的侧表面;一第一荧光层,共形地包覆该发光二极管芯片的该出光面与该些侧表面; 一第二荧光层,配置在该发光二极管芯片的该出光面上的部分该第一荧光层上,以及一封装胶体,包覆该第一荧光层、该第二荧光层与部分该承载器。 11. A light emitting diode package structure, comprising: a light emitting diode chip, disposed on a carrier, the LED chip having a surface and a side surface connecting the plurality of light-emitting surface; a first fluorescent layer, the conformal to encapsulate the LED chip and the plurality of the light emitting surface side surface; a second fluorescent layer disposed on a first portion of the phosphor layer of the light emitting diode chip of the light-emitting surface, and an encapsulant covering the first phosphor layer, the phosphor layer and the second portion of the carrier.
  12. 12.如权利要求11所述的发光二极管封装结构,其中,该第一荧光层及该第二荧光层分别包括一胶体与一荧光粉。 The light emitting diode package according to claim 11, wherein the first layer and the second phosphor layer comprising a phosphor and a phosphor colloid respectively.
  13. 13.如权利要求12所述的发光二极管封装结构,其中,该胶体包括硅胶或环氧树脂。 The light emitting diode package according to claim 12, wherein the colloid comprises an epoxy resin or silica gel.
  14. 14.如权利要求11所述的发光二极管封装结构,其中,该第二荧光层于该第一荧光层上具有实质上相同的厚度。 14. The LED package structure according to claim 11, wherein the second phosphor layer having substantially the same thickness on the first fluorescent layer.
  15. 15.如权利要求11所述的发光二极管封装结构,其中,该第二荧光层的厚度小于或大于该第一荧光层的厚度。 The light emitting diode package according to claim 11, wherein the thickness of the first thickness is less than or greater than the second phosphor layer is a phosphor layer.
  16. 16.如权利要求11所述的发光二极管封装结构,其中,包括至少一导线,该发光二极管芯片通过该导线与该承载器电性连接。 16. The LED package structure according to claim 11, wherein the at least one wire, the LED chip is connected electrically with the carrier through the wire.
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