CN101836286A - Apparatus for adjusting pitch of buffer tray and apparatus for transferring semiconductor devices using the buffer tray - Google Patents

Apparatus for adjusting pitch of buffer tray and apparatus for transferring semiconductor devices using the buffer tray Download PDF

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Publication number
CN101836286A
CN101836286A CN200780101286A CN200780101286A CN101836286A CN 101836286 A CN101836286 A CN 101836286A CN 200780101286 A CN200780101286 A CN 200780101286A CN 200780101286 A CN200780101286 A CN 200780101286A CN 101836286 A CN101836286 A CN 101836286A
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CN
China
Prior art keywords
spacing
buffer disc
pick
semiconductor
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200780101286A
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Chinese (zh)
Inventor
孔根泽
李镇煥
朴唱亿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SAIKELOON Ltd
Secron Co Ltd
Original Assignee
SAIKELOON Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to KR1020070084334A priority Critical patent/KR100957562B1/en
Priority to KR10-2007-0084334 priority
Application filed by SAIKELOON Ltd filed Critical SAIKELOON Ltd
Priority to PCT/KR2007/004030 priority patent/WO2009025403A1/en
Publication of CN101836286A publication Critical patent/CN101836286A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766Mechanical parts of transfer devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769Storage means
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of waers
    • H01L21/67781Batch transfer of wafers
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces

Abstract

A pitch between a plurality of unit buffer trays for receiving semiconductor devices may be adjusted by a pitch-adjusting apparatus comprising a guide member, a pitch-adjusting plate and a plurality of connecting members. The guide member guides the unit buffer trays in a pitch direction, and the pitch-adjusting plate is adjacent to the buffer tray and is movable in a direction perpendicular to the pitch direction. The pitch-adjusting plate has a plurality of tracks extending in different directions to adjust the pitch between the unit buffer trays. The connecting members are movably disposed along the tracks and are connected to the unit buffer trays so that the pitch between the unit buffer trays is adjusted by moving the pitch-adjusting plate.

Description

Pitch of buffer tray adjusting device and transmit the device of semiconductor device with this buffer disc
Technical field
The present invention relates to a kind of device of semiconductor test.The invention particularly relates to a kind of buffer disc that in the Test handler that semiconductor device is tested, uses and transmit the device of semiconductor device.
Background technology
Usually, after the operating characteristic of semiconductor test (such as volatibility or nonvolatile memory, systematic large-scale integrated (LSI) device etc.), can load and transport this semiconductor device.
Test handler is sent in the test cabinet semiconductor device to test this semiconductor device.Particularly, semiconductor device is sent to test panel (test tray) by buffer disc (buffer tray) from user disk (customer tray).In addition, the semiconductor device of having tested in this test cabinet is sent to user disk by buffer disc from test panel.
This Test handler comprises the pick-up system that is used for transmitting semiconductor device between this test panel and this user disk.The example that waits United States Patent (USP) to disclose this pick-up system the 6th, 761, No. 526, the 7th, 000, No. 648, the 7th, 023, No. 197.
Recently, transmit the required time of semiconductor device in order to shorten, this pick-up system adopts a plurality of pick-ups.In addition, this pick-up system adopts distance regulating mechanism so that the spacing between this pick-up equates with the spacing of this test panel or the spacing of this user disk.Yet owing to the increase along with pick-up quantity of the weight of this distance regulating mechanism increases, the transfer rate of accelerating semiconductor device is restricted.
Summary of the invention
Technical problem
An object of the present invention is to provide a kind of device of regulating pitch of buffer tray, with the transfer rate of semiconductor device in the Test handler of accelerating semiconductor device is tested.
Another object of the present invention provides a kind of device that uses buffer disc to transmit semiconductor device, and described buffer disc can be regulated the spacing in the Test handler that semiconductor device is tested.
Technical scheme
According to one aspect of the invention, a kind of device of regulating pitch of buffer tray, described buffer disc comprise a plurality of unit buffer discs that are used for the holding semiconductor device, and described device comprises guide, and its spacing direction along described buffer disc leads to described buffer disc; Near the spacing adjustable plate of described buffer disc, described spacing adjustable plate can move along the direction perpendicular to the spacing direction of described buffer disc, and has a plurality of tracks that extend along different directions, to regulate the spacing between the described unit buffer disc; And a plurality of connectors, it is provided with and is connected to described unit buffer disc movably along described track, to regulate the described spacing between the described unit buffer disc by mobile described spacing adjustable plate.
According to the embodiment of the invention, described spacing adjusting device also comprises substrate, and described guide comprises the guide rail that is located on the described substrate and extends along described spacing direction, and a plurality ofly is connected to described guide rail movably to support the spherical slide block of described unit buffer disc.
According to the embodiment of the invention, described spacing adjustable plate is located between described substrate and the described unit buffer disc.
According to the embodiment of the invention, described substrate has the hole.Described unit buffer disc and described spacing adjustable plate are located at the upper surface and the lower surface of described substrate respectively.Described connector connects described unit buffer disc and described spacing adjustable plate by described hole.
According to the embodiment of the invention, described spacing adjustable plate has a plurality of grooves as track, and the end of wherein said connector is located in the described groove.
According to the embodiment of the invention, described connector comprises from the extended connecting axle of described unit buffer disc, and the roller of end to contact with the inner surface formation of described groove that is connected to described connecting axle.
According to the embodiment of the invention, a plurality of guide rails that are used as described track are located on the described spacing adjustable plate, and a plurality of spherical slide blocks are connected to described guide rail.Described unit buffer disc is connected to described spherical slide block by described connector.
According to the embodiment of the invention, described spacing adjusting device also comprises the drive division that makes that described spacing adjustable plate moves along the direction perpendicular to described spacing direction.
According to the embodiment of the invention, each described unit buffer disc has a plurality of slots that are arranged in row holding described semiconductor device, and described spacing direction is perpendicular to the column direction of described slot.
According to the embodiment of the invention, each described unit buffer disc has a plurality of slots that are arranged in multiple row with the holding semiconductor device, and described spacing direction is perpendicular to the column direction of described slot.
According to a further aspect in the invention, a kind of semiconductor device that transmits between dish comprises to be used to test the device of described semiconductor device: buffer disc, and it comprises that a plurality of unit buffer disc is to hold described semiconductor device; The spacing adjusting portion, it is regulated between the described unit buffer disc along the x spacing of the line direction of described buffer disc; And the pick-up system, it is sent to described buffer disc with described semiconductor device from first dish.Wherein said spacing adjusting portion comprises: guide, and its line direction along described buffer disc leads to described unit buffer disc; Near the spacing adjustable plate of described buffer disc, described spacing adjustable plate can move along the column direction of described buffer disc, and has a plurality of tracks that extend along different directions, to regulate the x spacing between the described unit buffer disc; And a plurality of connectors, it is provided with and is connected to described unit buffer disc movably along described track, to regulate described x spacing by moving described spacing adjustable plate.
According to the embodiment of the invention, described pick-up system comprises a plurality of pick-ups that are arranged in rows and columns, to pick up described semiconductor device; Reach the pick-up transport unit that between described first dish and described buffer disc, moves described pick-up.
According to the embodiment of the invention, the x spacing that follows direction of described pick-up system and equal the x spacing that follows direction of described first dish and along the y spacing of column direction along the y spacing of column direction.
According to the embodiment of the invention, described conveyer also comprises the second pick-up system that described semiconductor device is sent to second dish from described buffer disc.
According to the embodiment of the invention, the described second pick-up system comprises a plurality of pick-ups that are arranged in rows and columns, to pick up described semiconductor device.The x spacing of the described second pick-up system and y spacing equal the x spacing and the y spacing of described second dish, and the y spacing of described buffer disc equals the y spacing of described second dish.
According to the embodiment of the invention, described conveyer also is included in the buffering transport unit that transmits described buffer disc between described first dish and second dish.
Beneficial effect
According to embodiments of the invention, can make the x spacing of buffer disc equal the x spacing of test panel or user disk by the spacing adjusting device, described spacing adjusting device comprises guide, spacing adjustable plate and connector.
Thus, when transmitting semiconductor device, need not to regulate the x spacing of pick-up system, transmit the required time of semiconductor device thereby shorten.In addition, need not the x spacing that extra device is regulated this pick-up system, thereby reduce the weight of this pick-up system and the structural stability of promoting Test handler.
Description of drawings
Fig. 1 is the schematic diagram that illustrates according to the semiconductor device conveyer of the embodiment of the invention;
Fig. 2 and 3 schematic plan views for spacing adjusting portion that the x spacing that is used to regulate buffer disc shown in Figure 1 is shown;
Fig. 4 and 5 diagrammatic bottom view for spacing adjusting portion that the x spacing that is used to regulate buffer disc shown in Figure 1 is shown;
Fig. 6 is the schematic isometric that the described first pick-up system of Fig. 1 is shown;
Fig. 7 illustrates the schematic diagram that semiconductor device is fitted into the method for buffer disc;
Fig. 8 is the schematic plan view that another embodiment of spacing adjusting portion is shown;
Fig. 9 is the schematic front view that spacing adjusting portion shown in Figure 8 is shown;
Figure 10 is the schematic plan view that another embodiment of spacing adjustable plate shown in Figure 2 is shown;
Figure 11 is the schematic plan view that another embodiment of buffer disc is shown;
Figure 12 and 13 is for illustrating the schematic diagram that uses buffer disc shown in Figure 11 to transmit the method for semiconductor device.
In conjunction with the accompanying drawing that the embodiment of the invention is shown in detail, the present invention is described in detail.Yet the present invention can realize with many different forms, and should not be construed as the restriction of the embodiment that is subjected in this proposition.More properly, it is abundant and complete open to reach to propose these embodiment, and makes those skilled in the art understand scope of the present invention fully.In the accompanying drawing, for the purpose of knowing, amplified the size and the relative size in layer and zone.
Embodiment
Fig. 1 is the schematic diagram that illustrates according to the semiconductor device conveyer of the embodiment of the invention.
Referring to Fig. 1, can be used in the Test handler of semiconductor test according to the semiconductor device conveyer 10 of the embodiment of the invention.Particularly, device 10 is used between first dish and second dish and transmits semiconductor device, for example, and between the user disk 12 and test panel 14 in the Test handler.
Although not shown in the figures, device 10 can comprise the buffer disc 20 that is located at movably between user disk 12 and the test panel 14, and first picking up system 30 that is used for transmitting semiconductor device between test panel 14 and buffer disc 20.In addition, device 10 comprises second picking up system 40 that is used for transmitting semiconductor device between buffer disc 20 and user disk 12.
Particularly, buffer disc 20 is provided with movably along the y direction of principal axis, and first picking up system 30 and second picking up system 40 are provided with movably along x axle and y direction of principal axis.For example, buffer disc 20 can make it mobile by buffering transport unit 22, and first picking up system 30 and second picking up system 40 make it mobile by the first pick-up transport unit 32 and the second pick-up transport unit 42 respectively.
Can regulate x spacing on the line direction of buffer disc 20 by spacing adjusting portion 100.
Fig. 2 and 3 schematic plan views for spacing adjusting portion that the x spacing that is used to regulate buffer disc shown in Figure 1 is shown, Fig. 4 and 5 diagrammatic bottom view for spacing adjusting portion that the x spacing that is used to regulate buffer disc shown in Figure 1 is shown.
With reference to figure 2~5, can make the spacing of buffer disc 20 equate with the spacing of test panel 14 or the spacing of user disk 12.
Buffer disc 20 comprises a plurality of unit buffer disc 22.Each unit buffer disc 22 has a plurality of a plurality of slots that are arranged in row with the holding semiconductor device.Herein, unit buffer disc 22 can be arranged along the line direction (x direction of principal axis) of slot.
Unit buffer disc 22 can be located on the substrate 102.Particularly, unit buffer disc 22 follows direction and is located at movably on the substrate 102, to follow the x spacing p1 between the direction regulon buffer disc 22.For example, can be provided with guide on the substrate 102 and unit buffer disc 22 be led to follow direction, that is, and along the x spacing direction.Unit buffer disc 22 can be connected to guide.
As shown in the figure, a plurality of first guide rails 110 can follow on the upper surface that direction is located at substrate 102.Unit buffer disc 22 can be mounted to a plurality of spherical slide blocks (ball block) 112 that are connected to first guide rail 110.
Spacing adjustable plate 120 can be located on the lower surface of substrate 102, to regulate the x spacing p1 of buffer disc 20.Spacing adjustable plate 120 promptly along the column direction (y direction of principal axis) of buffer disc 20, is located on the lower surface of substrate 102 movably along the direction perpendicular to the x spacing direction, and has a plurality of tracks that extend along different directions.
Unit buffer disc 22 is connected with spacing adjustable plate 120 by a plurality of connectors 130.Particularly, this connector forms and can move along described track, to come the x spacing p1 between the regulon buffer disc 22 by moving interval adjustable plate 120.
For example, spacing adjustable plate 120 has and forms fan-shaped a plurality of grooves 122.Can be by come the x spacing of regulon buffer disc 22 between the groove 122 along the interval variation of column direction.
Connector 130 comprises a plurality of connecting axles 132 that extend from unit buffer disc 22 downwards.The end of connecting axle 132 can be located in the groove 122.Particularly, pass substrate 102 and form porosely 104, and connecting axle 132 extends through hole 104.In addition, roller 134 can be connected to the end of connecting axle 132, contacts to form with the inner surface of groove 122.
Second guide rail 124 that extends along the y direction of principal axis is located at the both sides in hole 104, and the second spherical slide block 126 is connected to second guide rail 124.Spacing adjustable plate 120 is installed on the second spherical slide block 126.
Drive division 140 is located on the lower surface of substrate 102, with along column direction moving interval adjustable plate 120.For example, the lower surface of substrate 102 is provided with pneumatic linear actuator or the hydraulic cylinder that is connected to spacing adjustable plate 120.Perhaps, drive division 140 can comprise motor, ball-screw, spherical slide block, lm guides etc.
By drive division 140 spacing adjustable plate 120 is moved along column direction, be thus connected part 13 and move along groove 122.Thereby, come x spacing p1 between the regulon buffer disc 22 by moving interval adjustable plate 120.Particularly, make spacing between x spacing p1 and the user disk 12 between the unit buffer disc 22 or the spacing between the test panel 14 equate.
As shown in the figure, although the lower surface of substrate 102 is provided with two spacing adjustable plates 120 and two drive divisions 140, can use a drive division 140 and spacing adjustable plate 120 to come x spacing p1 between the regulon buffer disc 22.In addition, although eight buffer discs 22 shown in the figure, scope of the present invention is not subjected to the restriction of buffer disc 22 quantity.
Particularly, maximum x spacing between the unit buffer disc 22 and minimum x spacing are by the spacing of user disk 12 and the x spacing decision of test panel 14.In addition, unit buffer disc 22 has x spacing between the odd column slot and the 2nd x spacing between even column slot and the odd column slot.Herein, an x spacing is different from the 2nd x spacing.
Simultaneously, the spherical nut on the lower surface that although not shown in the figures, buffering transport unit 22 can be included in the 3rd guide rail, the 3rd spherical slide block that is connected to the 3rd guide rail that substrate 102 lower edge y direction of principal axis extend, be installed in substrate 102, pass this spherical nut ball-screw, and be connected so that the motor of revolving force to be provided with this ball-screw.In addition, the lower surface of substrate 102 can be equipped with link, and substrate 102 can be connected to the 3rd spherical slide block by link.
Fig. 6 is the schematic isometric that the described first pick-up system of Fig. 1 is shown.
Comprise a plurality of pick-ups that are arranged in rows and columns 202 with reference to figure 6, the first pick-up systems 30.Pick-up 202 is provided with movably by pick-up transport unit 32.Although not shown in the figures, pick-up 202 can be used for using the vacuum power picks up semiconductor devices.Each pick-up 202 can form and move in the vertical direction, that is, and and along the z direction of principal axis.
Particularly, the first pick-up system 30 comprises a plurality of pickup unit 200.Each pickup unit 200 comprises a plurality of pick-ups of arranging along the line direction of the first pick-up system 30 202.For example, each pickup unit 200 comprises the carriage 204 that follows direction (x direction of principal axis) extension, and pick-up 202 vertically is mounted to carriage 204.
In addition, the first pick-up system 30 comprises the first pick-up pedestal 206, and pickup unit 200 is mounted to the first pick-up pedestal 206 along the column direction (y direction of principal axis) of the first pick-up system 30.The first pick-up pedestal 206 is connected to the first pick-up transport unit 32, to transmit pick-up 202.Although not shown in the figures, the first pick-up transport unit 32 forms along x direction of principal axis and y direction of principal axis and moves pick-up 202.For example, the first pick-up transport unit 32 can form and use linear motor, ball-screw, spherical slide block, lm guides etc.
The x spacing that follows direction of the first pick-up system 30 and equal the x spacing that follows direction of test panel 14 and along the y spacing of column direction along the y spacing of column direction.Thus, a plurality of semiconductor device can pick up from test panel 14 by once-through operation in the first pick-up system 30.For example, 64 or 32 semiconductor device can pick up from test panel 14 by once-through operation in the first pick-up system 30.
After picks up semiconductor devices, make pick-up 202 above buffer disc 20, move by the first pick-up transport unit 32.Make the x spacing of buffer disc 20 equal the x spacing of test panel 14 by spacing adjusting portion 100 herein.
Fig. 7 illustrates the schematic diagram that semiconductor device is fitted into the method for buffer disc.
With reference to figure 7, because the y spacing of buffer disc 20 is different from the y spacing of test panel 14, when entering buffer disc 20 from the first pick-up system 30, semiconductor device 1 holds delegation successively at every turn.Particularly, buffer disc 20 moves along column direction with step-by-step system, that is, and and along the y direction of principal axis.When buffer disc 20 moved with step-by-step system, the semiconductor device 1 that delegation is kept by the pick-up 202 of the first pick-up system 30 fitted into the slot of buffer disc 20.Perhaps, the first pick-up system 30 moves along the y direction of principal axis in the mode of stepping, and semiconductor device 1 fits into buffer disc 20 simultaneously.
After semiconductor device fits into buffer disc 20, make the x spacing of buffer disc 20 equal the x spacing on the line direction of user disk 12.
In addition, by buffering transport unit 22 buffer disc 20 is moved to the position of close user disk 12.During the moving of buffer disc 20, the x spacing of regulating buffer disc 20.Perhaps, before or after mobile buffer disc 20, regulate the x spacing of buffer disc 20.
Regulate after the x spacing and mobile buffer disc 20 of buffer disc 20, semiconductor device 1 is sent to user disk 12 by the second pick-up system 40 from buffer disc 20.Herein, the y spacing of buffer disc 20 equals the y spacing of user disk 12.Thus, from buffer disc 20 picks up semiconductor devices 1, and semiconductor device 1 is fitted into user disk 12 by once-through operation by once-through operation.
Simultaneously, the second pick-up system 40 comprises a plurality of pick-ups that are arranged in rows and columns.The x spacing of the second pick-up system 40 and y spacing equal the x spacing and the y spacing of user disk 12.Because the second pick-up system class is similar to the first pick-up system of describing with reference to figure 6 30, therefore is not described in detail.
As previously mentioned, although be used for semiconductor device 1 is sent to user disk 12 from test panel 14, described method and install 10 and also can be used for semiconductor device 1 being sent to test panel 14 from user disk 12 in similar mode inequality.
According to previous embodiment of the present invention, make the x spacing between the unit buffer disc 22 equate with the x spacing of user disk 12 or the x spacing of test panel 14 by spacing adjusting portion 100.Thus, need not to regulate and be used to transmit first, second pick-up system 30 of semiconductor device and 40 x spacing, transmit the required time of semiconductor device to shorten between buffer disc 20 and test panel 14 or user disk 12.In addition, can alleviate the weight of the first pick-up system 30 and the second pick-up system 40, thereby promote the structural stability of this Test handler and increase the pick-up quantity of first, second pick-up system 30 and 40.
Fig. 8 is the schematic plan view that another embodiment of spacing adjusting portion is shown, and Fig. 9 is the schematic front view that spacing adjusting portion shown in Figure 8 is shown.
With reference to figure 8 and 9, buffer disc 2 is located at the top of substrate 302.Particularly, following first guide rail 310 that direction (x direction of principal axis) extends is located on the substrate 302.First guide rail 310 is supported by a plurality of strutting pieces 314 that are located on the substrate 302.The first spherical slide block 312 is connected to first guide rail 310 movably, and unit buffer disc 22 is mounted to the first spherical slide block 312.
Spacing adjustable plate 320 is located between unit buffer disc 22 and the substrate 302, with the x spacing on the line direction between the regulon buffer disc 22.
Spacing adjustable plate 320 has a plurality of grooves 322 as track, and spacing adjustable plate 320 is located on the substrate 302 movably along column direction (y direction of principal axis).Particularly, second guide rail 324 that extends along column direction is located on the substrate 302, and spacing adjustable plate 320 is connected to second guide rail 324 by the second spherical slide block 326.In addition, drive division 340 is located on the substrate 302, with along column direction moving interval adjustable plate 320.
Unit buffer disc 22 is connected to spacing adjustable plate 320 by a plurality of connectors 330.Although not detailed showing among the figure, connector 330 comprises the connecting axle 332 that extends from unit buffer disc 222 downwards.The end of connecting axle 332 is located in the groove 322.Connector 330 also comprises the roller 334 of the end that is connected to connecting axle 332.
Figure 10 is the schematic plan view that another embodiment of spacing adjustable plate shown in Figure 2 is shown.
With reference to Figure 10, spacing adjustable plate 420 comprises a plurality of the 4th guide rails 422 as track.The 4th guide rail 422 can be set to fan-shaped, and can be used for the x spacing of regulon buffer disc 22.
Particularly, the 4th spherical slide block 424 is connected to the 4th guide rail 422, and unit buffer disc 22 is connected to the 4th spherical slide block 424 by connecting axle.
Figure 11 is the schematic plan view that another embodiment of buffer disc is shown.
With reference to Figure 11, buffer disc 50 comprises a plurality of unit buffer disc 52.Each unit buffer disc 52 comprises a plurality of slot 54a and the 54b that is arranged in multiple row.For example, each unit buffer disc 52 comprises a plurality of slot 54a and the 54b that is arranged in two row.Herein, the x spacing between the slot of each unit buffer disc 52 equals the x spacing of user disk or test panel.
Figure 12 and 13 is for illustrating the schematic diagram that uses buffer disc shown in Figure 11 to transmit the method for semiconductor device.
With reference to Figure 11~13, the pick-up 202 of semiconductor device 1 by the first pick-up system 30 that is contained in the test panel 14 picks up out from test panel 14.Herein, x spacing between the pick-up 202 and y spacing equal the x spacing and the y spacing of test panel 14.
After picks up semiconductor devices 1, the first pick-up system 30 moves above buffer disc 50.Make the 2nd x spacing between the unit buffer disc 52 of buffer disc 50 equal the interval between the slot of the odd column of test panel 14 or even column herein.The pick-up of the odd column 202a of the first pick-up system 30 moves above the first slot 54a of unit buffer disc 52, and the semiconductor device 1 that makes slot by odd column 202a keep then is contained among the first slot 54a.
The first pick-up system 30 follows direction (x direction of principal axis) and moves, so that the pick-up of the even column 202b of the first pick-up system 30 is located at the second slot 54b top of unit buffer disc 52, the feasible then semiconductor device 1 that is kept by the slot of even column 202b is contained among the second slot 54b.
After semiconductor device 1 was contained in buffer disc 50, buffer disc 50 moved to the position of close user disk 12 by the buffering transport unit.Make the 2nd x spacing of buffer disc 50 equal the interval between the slot of the odd column of user disk 12 or even column.Herein, an x spacing of buffer disc 50 equals the x spacing of user disk 12.In addition, the y spacing of buffer disc 50 equals the y spacing of user disk 12.
Thus, can be by the second pick-up system 40 with once-through operation from buffer disc 50 picks up semiconductor devices 1, and semiconductor device is contained in the user disk 12 with once-through operation.
Industrial applicability
According to previous embodiment of the present invention, can make the x spacing of buffer disc equal the x spacing of test panel or user disk by the spacing adjusting portion.
Thus, when transmitting semiconductor device, need not to regulate the x spacing of pick-up system, transmit the required time of semiconductor device thereby shorten.In addition, need not the x spacing that extra device is regulated this pick-up system, thereby reduce the weight of this pick-up system and the structural stability of promoting Test handler.
Although described embodiments of the invention already, not should be understood that to limit the invention to these embodiment, those skilled in the art can as hereinafter within the spirit of claims the present invention for required protection and the scope it is made various changes and modification.

Claims (16)

1. device of regulating pitch of buffer tray, described buffer disc comprises a plurality of unit buffer discs that are used for the holding semiconductor device, described device comprises:
Guide, its spacing direction along described buffer disc leads to described buffer disc;
Near the spacing adjustable plate of described buffer disc, described spacing adjustable plate can move along the direction perpendicular to the spacing direction of described buffer disc, and has a plurality of tracks that extend along different directions, to regulate the spacing between the described unit buffer disc; And
A plurality of connectors, it is provided with and is connected to described unit buffer disc movably along described track, to regulate the described spacing between the described unit buffer disc by mobile described spacing adjustable plate.
2. device as claimed in claim 1 also comprises substrate,
Wherein said guide comprises:
The guide rail that is located on the described substrate and extends along described spacing direction; And
A plurality ofly be connected to described guide rail movably to support the spherical slide block of described unit buffer disc.
3. device as claimed in claim 2, wherein said spacing adjustable plate are located between described substrate and the described unit buffer disc.
4. device as claimed in claim 2, wherein said substrate has the hole, described unit buffer disc and described spacing adjustable plate are located at the upper surface and the lower surface of described substrate respectively, and described connector connects described unit buffer disc and described spacing adjustable plate by described hole.
5. device as claimed in claim 1, wherein said spacing adjustable plate have a plurality of grooves as track, and the end of wherein said connector is located in the described groove.
6. device as claimed in claim 5, wherein said connector comprise from the extended connecting axle of described unit buffer disc, and the roller of end to contact with the inner surface formation of described groove that is connected to described connecting axle.
7. device as claimed in claim 1, wherein a plurality of guide rails as described track are located on the described spacing adjustable plate, and a plurality of spherical slide blocks are connected to described guide rail, and described unit buffer disc is connected to described spherical slide block by described connector.
8. device as claimed in claim 1 also comprises the drive division that makes that described spacing adjustable plate moves along the direction perpendicular to described spacing direction.
9. device as claimed in claim 1, wherein each described unit buffer disc has a plurality of row that are arranged in holding the slot of described semiconductor device, and described spacing direction is perpendicular to the column direction of described slot.
10. device as claimed in claim 1, wherein each described unit buffer disc has a plurality of slots that are arranged in multiple row with the holding semiconductor device, and described spacing direction is perpendicular to the column direction of described slot.
11. one kind is transmitted semiconductor device to be used to test the device of described semiconductor device, comprising between dish:
Buffer disc, it comprises that a plurality of unit buffer disc is to hold described semiconductor device;
The spacing adjusting portion, it is regulated between the described unit buffer disc along the x spacing of the line direction of described buffer disc; And
The pick-up system, it is sent to described buffer disc with described semiconductor device from first dish,
Wherein said spacing adjusting portion comprises:
Guide, its line direction along described buffer disc leads to described unit buffer disc;
Near the spacing adjustable plate of described buffer disc, described spacing adjustable plate can move along the column direction of described buffer disc, and has along the different directions extension, to regulate a plurality of tracks of described x spacing; And
A plurality of connectors, it is provided with and is connected to described unit buffer disc movably along described track, to regulate described x spacing by moving described spacing adjustable plate.
12. device as claimed in claim 11, wherein said pick-up system comprises:
A plurality of pick-ups that are arranged in rows and columns are to pick up described semiconductor device; And
Between described first dish and described buffer disc, move the pick-up transport unit of described pick-up.
13. device as claimed in claim 12, the x spacing that follows direction of wherein said pick-up system and equal the x spacing that follows direction of described first dish and along the y spacing of column direction along the y spacing of column direction.
14. device as claimed in claim 11 also comprises the second pick-up system that described semiconductor device is sent to second dish from described buffer disc.
15. device as claimed in claim 14, the wherein said second pick-up system comprises a plurality of pick-ups that are arranged in rows and columns, picking up described semiconductor device,
And the x spacing of the wherein said second pick-up system and y spacing equal the x spacing and the y spacing of described second dish, and
The y spacing of described buffer disc equals the y spacing of described second dish.
16. device as claimed in claim 14 also is included in the buffering transport unit that transmits described buffer disc between described first dish and second dish.
CN200780101286A 2007-08-22 2007-08-23 Apparatus for adjusting pitch of buffer tray and apparatus for transferring semiconductor devices using the buffer tray Pending CN101836286A (en)

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PCT/KR2007/004030 WO2009025403A1 (en) 2007-08-22 2007-08-23 Apparatus for adjusting pitch of buffer tray and apparatus for transferring semiconductor devices using the buffer tray

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WO2009025403A1 (en) 2009-02-26
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KR100957562B1 (en) 2010-05-11

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