CN101793361B - LED light source with Fresnel lens - Google Patents

LED light source with Fresnel lens Download PDF

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Publication number
CN101793361B
CN101793361B CN 201010128959 CN201010128959A CN101793361B CN 101793361 B CN101793361 B CN 101793361B CN 201010128959 CN201010128959 CN 201010128959 CN 201010128959 A CN201010128959 A CN 201010128959A CN 101793361 B CN101793361 B CN 101793361B
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mounting frame
substrate
frame
fresnel lens
led
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CN 201010128959
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Chinese (zh)
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CN101793361A (en
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罗本杰
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罗本杰(北京)光电研究所有限公司
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Abstract

The invention relates to an LED light source, comprising a substrate, a mounting frame, a reflecting cup, an LED chip array, a supporting bracket and a Fresnel lens, and is characterized in that the substrate comprises one or two substrate conductive inserting pin passages passing through in the thickness direction of the substrate; a mounting frame location device is installed at the bottom of the mounting frame; the substrate is located by embedding the location device on the substrate conductive inserting pin passages; the reflecting cup is embedded on the mounting frame location device through the reflecting cup aiming device at the bottom of the reflecting cup so as to locate the mounting frame through the reflecting cup; the supporting bracket is on the mounting frame; the Fresnel lens is on the supporting bracket; and the efficiency of the switching power supply of the light source is more than 80%.

Description

一种具有菲涅尔透镜的led光源 Led light having a Fresnel lens

技术领域 FIELD

[0001] 本发明涉及一种具有菲涅尔透镜的led的光源。 [0001] The present invention relates to a light source having led a Fresnel lens. 尤其涉及一种具有高功率led的光源。 In particular, it relates to a light source having a high power is led.

[0002] 该光源采用led芯片阵列作为发光源,具有使led光源射出的光线柔和、均勻、亮度高、光衰小等特点。 [0002] The light source as a light source led chip array, has a light source for emitting light led soft, uniform, high brightness light decay characteristics. 而且该led光源的安装过程简单,能够大幅度提高生产效率,并且具有提高led光源的应用范围,延长使用寿命等特点,同时还具有防水、防尘、防爆的三防功能。 The led light and the install process is simple and can greatly improve the production efficiency, and has improved application led light, extended service life, and also has a waterproof, dust-proof, explosion-proof three functions.

背景技术 Background technique

[0003] 近年来,能源问题已经成为制约世界各国经济发展的头等重要问题,随着能源短缺的逐步加剧,这一问题所衍化的矛盾也愈演愈烈。 [0003] In recent years, energy has become an issue of primary importance restricting economic development of countries of the world, with the gradual increasing energy shortage, the problem derived contradictions intensified. 这一问题只有通过增源和节流两条途径进行解决,增源即寻找新的能源,比如光能、核能、水能等等,节流就是减少目前能源的消耗,例如小排量汽车、节能建筑等等,而led光源无疑就是这其中的一只奇葩。 This question can only be increased by two ways to solve the source and the throttle, increase the source that is looking for new sources of energy, such as solar energy, nuclear, hydro, etc., the throttle is to reduce the current energy consumption, such as small cars, energy-efficient buildings and so on, but this one is undoubtedly led light of a wonderful work. 现在所用的高能耗、低发光效率的白炽灯、日光灯等陈旧的照明灯具已无法适应当今社会对照明灯具的新需求。 Now with high energy consumption, low luminous efficiency of incandescent, fluorescent and other lighting old has been unable to adapt to the new needs of today's society for lighting. 因此具有能耗低、寿命长等特点的led光源逐步受到市场的青睐,成为了当今最热门的照明用具,在当前国家相关政策的扶持之下,led光源必将成为市场上的主流选择, 以及在高端市场的唯一选择。 It has low energy consumption, long life led light gradually favored by the market, has become the most popular lighting appliances, under the support of current national policies, led light will become the mainstream choice in the market, and the only choice in high-end market.

[0004] 但是led光源传统的结构,由于存在着反光率低下、散热效果一般、成本造价高、 光衰较高、光线不均勻、亮度不高、外形不美观、不利于安装等缺点,严重制约了led光源的发展,特别是适用于城市照明、广场照明、战场照明的高功率led光源的高速发发展。 [0004] However, the conventional structure led light, due to the existence of the low reflective, general cooling effect, high construction costs, high light fades, uneven lighting, brightness is not high, unsightly appearance, is not conducive to installation and other shortcomings, seriously hampered the led light source development, especially for urban lighting, square lighting, high-speed development of high-power led light hair battlefield illumination. 特别是针对发光功率在10W、40W以上的室内照明,甚至在100WU000W以上的舞台、室外高功率led光源的封装结构,这一问题尤为突出。 Especially for a light emitting power 10W, 40W or more indoor lighting, even in the above 100WU000W stage, the package configuration of the outdoor high power led light, this problem is particularly acute.

[0005] led光源传统的结构,多采用将led芯片安装于反光杯中,然后再将反光杯安装于定位装置上,再通过将该定位装置安装于对准装置上,然后再把该对准装置安装于散热装置上,还要进行内部的电路连接,然后采用树脂封装成型。 [0005] light led conventional construction, use more led chip mounted on the reflective cup, and then the reflector cup mounted on the positioning means, the positioning means through the alignment means is mounted on, and then the alignment means mounted on the heat sink, but also for connecting the internal circuit, and a resin encapsulation molding. 由于需要专门的定位装置和对准装置,和进行诸多繁琐的电路连接,增多了生产工序,增加了生产成本。 Because of the need for specialized alignment means and the positioning means, and for many tedious circuit, an increase in the production processes, the production cost increases.

[0006] 而且,传统的led光源结构多采用树脂封装,树脂形成为透明板、凸透镜、凹透镜等,以便对led芯片所产生的光线直接射出,或者进行汇聚或者发散,经过汇聚的光线得以在局部产生高亮度照明,而经过发散的光线通常以平行光的形式向外发送,以求达到更远的照明距离。 [0006] Moreover, conventional led light source structure to use more resin package, the resin is formed of a transparent plate, convex, concave, etc., in order to direct emitted light rays led generated by the chip, or by converging or diverging, through the light converging to the local generating high intensity lighting, usually sent out in the form of parallel light passes through the light distribution, in order to achieve greater illumination range. 但是却存在着光线在通过封装树脂时光衰过大的问题,以及由该树脂汇聚后而产生的的光斑过大、亮度过低,而且由该树脂所发散形成的光斑形状无法控制、光斑过小、亮度不均勻等缺点。 But there are bad light through the encapsulating resin problem of excessive time, and the converged light spot from the resin produced is too large, too dark, and the spot shape formed from the resin emanating uncontrollable, the spot is too small , luminance unevenness and other shortcomings.

[0007] 针对以上诸多方面的问题,本人经过多方面查找资料、并经过数年的科学实验,耗费大量财力、物力,终于研究成功本具有使led光源射出的光线柔和、均勻、亮度高、光衰小等特点的led封装结构。 [0007] For the above question many aspects, I read many find information, and after several years of scientific experiments, spend a lot of financial and material resources, the success of this research has finally led light emitted from the light soft, uniform, high brightness, decay characteristics of the led package. 而且使用该封装结构还可以达到简化led光源的安装过程,大幅度提高生产效率,并且具有提高led光源的应用范围,延长使用寿命等特点,同时还具有防 And the use of the packaging structure may also achieve a simplified installation process led light, significantly increase productivity, and has improved light led range of applications, to extend the service life, and also has anti

4水、防尘、防爆的三防功能。 4 water, dust, three anti-function explosion. 发明内容 SUMMARY

[0008] 本发明涉及一种具有菲涅尔透镜的led光源,包括基底、安装框、反射杯、led芯片阵列、支撑架和菲涅尔透镜,其特征在于:基底,其中具有一个或两个基底导电插针通道在基底厚度方向上贯穿,基底导电插针通道在基底顶面上露出约0. 5-10mm,并且在基底导电插针通道内部具有导电插针,安装框,其中间部分具有开口并直接暴露基底的顶表面,在该开口中用于放置反射杯,并且在安装框的底部具有安装框定位装置,通过将该定位装置嵌套在基底导电插针通道上实现对基底的定位,并将安装框安装在基底上,并且该定位装置可以容纳基底导电插针通道露出基底顶表面的部分,反射杯,其通过反射杯底部上的反射杯对准装置嵌套在安装框定位装置上,来实现反射杯对安装框的定位,并将反射杯安装在安装框上,led芯片阵列位于反射杯的底部,安装框 [0008] The present invention relates to a led light having a Fresnel lens, comprising a substrate, a mounting frame, reflective cup, led chip array, a support frame and a Fresnel lens, wherein: a substrate, having one or two channel base conductive pins on the substrate through the thickness direction, the conductive substrate is exposed to about 0. 5-10mm pin channel in the top surface of the substrate, and the substrate having the conductive pins within the channel conductive pins, mounting frame, wherein the middle portion has opening and directly expose the top surface of the substrate, the reflective cup opening for placing and positioning means has a mounting frame installed at the bottom of the box, to achieve positioning of the substrate on the substrate through the conductive pins channel nested positioning means and mounting frame mounted on the substrate, and the substrate positioning means can accommodate the exposed portion of the conductive pin channel, the top surface of the substrate reflective cup, which is mounted in a nested block positioning means through the reflective cup alignment means on the bottom of the reflective cup on the reflective cup to achieve the positioning of the mounting frame, and the reflective cup is mounted on the mounting block, led chip arrays located in the bottom of the reflective cup, the mounting block 内部具有导电通路,支撑架,其位于安装框上,菲涅尔透镜位于所述支撑架上,并且菲涅尔透镜与支撑架的顶表面在同一个水平面, 菲涅尔透镜的底面距离led芯片阵列的距离为约5-10mm,安装框定位装置内的所述导电通路的一端用于和导电插针电连接,另一端用于和反射杯对准装置内的连接通路的一端电连接,连接通路的另一端用于和led芯片阵列连接,导电插针的另一端用于和led光源的开关电源相连接,该开关电源的效率在约80 %以上。 Having internal conductive paths, support frame, which is located on the mounting frame, said support frame Fresnel lens, the Fresnel lens and the top surface of the support frame in a same horizontal plane, from the bottom surface of the Fresnel lens led chip distance of the array is approximately 5-10mm, one end of the conductive paths in the mounting frame, and positioning means for electrically connecting the conductive pins, and the other end for one end of the electrical connection path within the reflective cup alignment means, connected the other end of the passage and led to chip array, and the other end of the conductive pins and led to the switching power supply is connected to the light source, the efficiency of the switching power supply above about 80%.

[0009] 所述基底和安装框之间通过粘接剂粘接的方式进行连接,或者通过位于基底和安装框之间的用于连接的卡榫卡扣结构进行连接。 Between the [0009] substrate and the mounting frame are connected by way of adhesive bonding, or connected by tenon positioned locking structure for connection between the base and the mounting frame. 所述粘接剂位于基底导电插针通道与安装框定位装置之间,或者所述卡榫卡扣结构位于基底导电插针通道与安装框定位装置之间。 The adhesive is positioned between the conductive substrate and the mounting pins channel frame positioning means, or the tenon locking structure is located between the conductive substrate and the mounting pins channel frame positioning means. 所述反射杯和安装框之间通过粘接剂粘接的方式进行连接,或者通过位于反射杯和安装框之间的用于连接的卡榫卡扣结构进行连接。 Between the reflective cup and the mounting frame are connected by way of adhesive bonding, or connected by tenon locking structure is located between the reflective cup and the mounting frame for connection. 所述粘接剂位于反射杯对准装置与安装框定位装置之间,或者所述卡榫卡扣结构位于反射杯对准装置与安装框定位装置之间。 The adhesive is positioned between the reflective cup and the mounting frame alignment device positioning means, or said locking tenons reflective cup structure positioned between the alignment means and the mounting frame positioning means.

[0010] 所述安装框上具有用于容纳支撑架底面的凹槽,该凹槽中还具有用于容纳多余的用于将支撑架和安装框进行粘接的粘接剂的凹陷,或者该凹槽还具有用于与支撑架进行连接的卡榫卡扣结构,或者不具有凹陷和卡榫卡扣结构,直接使凹槽和支撑架进行通过粘接剂的粘接。 [0010] The support frame having a recess for receiving the bottom surface of the recess, the recess further having an adhesive for the support frame for receiving excess bonding and mounting frame of the mounting frame, or the also has a recess with a snap bracket structure connecting tenons, or without recesses and tenon locking structure, so that the recess and the support frame is directly bonded by an adhesive agent. 所述安装框上具有用于与支撑架底面接触的凸起,该凸起上还具有用于容纳多余的用于将支撑架和安装框进行粘接的粘接剂的凹陷,或者该凸起还具有用于与支撑架进行连接的卡榫卡扣结构,或者不具有凹陷和卡榫卡扣结构,直接使凸起和支撑架进行通过粘接剂的粘接。 The mounting frame has an upper convex bottom surface for contact with the support frame further includes a recess for receiving excess adhesive for mounting the support frame and the frame are bonded on the projection, the projection or also it has a support frame with a snap-tenon connecting structure, having no recesses or locking structure and tenon, so that the projection and the support frame is directly bonded by an adhesive agent.

[0011] 所述支撑架和菲涅尔透镜由相同的材料一体化形成,且支撑架和菲涅尔透镜的材料分别选自由PC材料、环氧树脂材料和玻璃构成的组中之一。 [0011] The support frame and a Fresnel lens formed of the same material integration, and the support frame, and the material of the Fresnel lens are selected from the group consisting of PC material, one of the group consisting of an epoxy material and glass. 该菲涅尔透镜具有正方形、 长方形、圆形、菱形、正五边形、正六边形的形状,使经过菲涅尔透镜的光线具有任意需要的形状。 The Fresnel lens has a square, rectangular, circular, rhombus, a regular pentagon, regular hexagon shape, so that light passing through the Fresnel lens having any desired shape. 通过该菲涅尔透镜的光线的光通量的光衰为约5% _7%。 Light attenuation by the light flux Fresnel lens is about 5% _7%.

附图说明 BRIEF DESCRIPTION

[0012] 附图1 :本发明的菲涅尔透镜的顶视图。 [0012] Figure 1: Top view of the Fresnel lens according to the present invention.

[0013] 附图2 :本发明的菲涅尔透镜的侧视图。 [0013] Figure 2: a side view of a Fresnel lens of the present invention.

[0014] 附图3 :本发明的基底结构的侧视图。 [0014] BRIEF 3: a side view of the base structure of the present invention.

5[0015] 附图4 :本发明的安装框结构的侧视图。 5 [0015] Figure 4: a side view of the mounting frame structure of the present invention.

[0016] 附图5 :本发明的反射杯结构的顶视图。 [0016] Figure 5: a top view of the structure of a reflective cup of the present invention.

[0017] 附图6 :本发明的led光源的侧视图。 [0017] Figure 6: side view of light led to the present invention.

[0018] 1:菲涅尔透镜2:支撑架3:基底4:基底导电插针通道5:安装框6 :安装框定位装置7 :反射杯8 :反射杯对准装置9 =Led芯片阵列 [0018] 1: 2 Fresnel lens: the support frame 3: substrate 4: pin base conductive path 5: mounting frame 6: block positioning means 7: the reflective cup 8: reflective cup alignment means 9 = Led chip array

具体实施方式 Detailed ways

[0019] 本发明的led光源包括基底、安装框、反射杯、led芯片阵列、支撑架和菲涅尔透 [0019] led to the present invention includes a light source substrate, a mounting frame, reflective cup, led chip array, a Fresnel lens, and the support frame

^Mi ο ^ Mi ο

[0020] 附图3是本发明的基底结构的侧视图。 [0020] Figure 3 is a side view of the base structure of the present invention. 基底3包括一个或两个基底导电插针通道4,该基底导电插针通道4贯穿该基底3的厚度方向,并从基底3的上表面暴露出一定的高度,该高度为0. 5-10mm,优选为l_5mm,更优选为2_4mm。 3 comprises a substrate or two electroconductive pins channel substrate 4, the substrate 4 through the conductive pins channel substrate 3 in the thickness direction, and exposing a certain height from the upper surface of the substrate 3, the height of 0. 5-10mm preferably l_5mm, more preferably 2_4mm. 其可以使两根导电插针(未示出) 从基底导电插针通道4中穿过,既可以从同一个基底导电插针通道4内穿出,也可以分别从两个不同的基底导电插针通道4内穿出,从基底3的顶面穿出基底导电插针通道4的两个导电插针的一端分别用于和安装框5上的两个安装框定位装置6内的导电通路(未示出) 进行电连接。 Which allows two electrically conductive pins (not shown) through a channel from the base conductive pins 4, 4 may be from the same piercing a channel base conductive pins can be inserted from two different substrates electrically conductive are 4 piercing needle channel, the base conductive pins piercing channel from a top surface of the base 3 of the two end of the conductive pins 4, respectively, for the conductive path in the two positioning means on the mounting frame and the mounting frame 56 ( not shown) are electrically connected. 导电插针的数目为两个,从基底3底面的基底导电插针通道4中露出的两根导电插针的两端分别和电源的正、负极进行电连接, The number of conductive pins is two, two ends of the conductive pins in the substrate 3 is exposed from the bottom surface of the channel substrate 4 are electrically conductive pins and the power supply positive and negative electrical connections,

[0021] 基底导电插针通道4可以做成正方体、圆柱体、三棱体等多种几何体形状。 [0021] The electroconductive substrate 4 may be made more pins channel geometry cube shapes, cylindrical, triangular prism and the like. 该基底3可以由铜、铝、等金属构成,也可以由或者是镀有防锈保护层的铁来构成,或者可以采用其它任何具有优良导热性能的材料来制作,可以起到散热器的作用,例如可以由特种陶瓷等进行制作。 The substrate 3 may be, is made of a metal such as copper, aluminum, a protective layer may also have rust or iron plating is constituted by a, or any other material having excellent thermal conductivity can be used to produce, it can serve as a heat sink , for example, may be made of special ceramics and the like. 基底3的底面也可以选择性的安装各种的散热装置,可以在其底面安装风扇、散热片或者水冷散热装置,或者其它的现有技术中存在的散热装置,或者是上述散热装置的组合。 3 the bottom surface of the substrate may be selectively install various cooling devices may be mounted on the bottom surface of the fan, cooling fins or water-cooling device, or other heat dissipating device of the prior art, or a combination of the heat dissipation device.

[0022] 基底3可以是如附图3中所示的平板的形状,也可以做成其它的形状,可以将其做成散热片的形状,以增加基底3底部和空气接触的面积,已增加散热的效果;基底3也可以做成任何其它的几何形状,如三角形板、正五边形板、六棱形板等等任意的多边形板以及圆形板,也可以做成具有立方体、球状体等立体的形状,也可以做成具有各种卡通形象的形状,也可以做成其它任何的工艺所允许的形状。 [0022] The shape of substrate 3 may be flat as shown in figures 3 and other shapes can also be made, which can be made into the shape of fins, to increase the area of ​​the substrate 3 and the air in contact with the bottom, has increased cooling effect; substrate 3 may be made of any other geometric shapes, such as triangular plates, regular pentagonal panels, an arbitrary six prism plate like a circular plate and the polygonal plate may be formed to have a cubic, spheroid other three-dimensional shapes can also be made with various shapes of cartoon characters, it can also be made by any other process allowing shape.

[0023] 基底3可以增加一个容纳电池的舱室,使LED光源可以摆脱导线的束缚,成为手持照明设备,同时也可以在基底3底面增加光电转换装置(如光电池、或者太阳能电池)或者充电接口(市电充电、风力充电、外界光电池、蓄电池充电的接口)。 [0023] The substrate 3 can be increased compartment a receiving cell, the LED light source may break free of the wire, be handheld lighting devices, but also can increase the photoelectric conversion device (e.g., photovoltaic cell, or solar cell) or a charging port on the base 3 the bottom surface ( electricity charge, the charging wind, ambient light battery, battery charging interface).

[0024] 附图4是本发明的安装框结构的侧视图。 [0024] Figure 4 is a side view of the mounting frame structure of the present invention. 安装框5的中间部分具有开口,直接暴露基底3,在该开口中用于放置反射杯7。 Mounting frame having an opening of the intermediate section 5 directly exposing the substrate 3, the openings 7 for placement of the reflective cup. 在安装框5的底部具有安装框定位装置6,该安装框定位装置6的数目与基底导电插针通道4的数目相同,安装框定位装置6直接嵌套在基底导电插针通道4上,可以容纳基底导电插针通道4从基底3的顶面所暴露的高度,在安装框定位装置6内部具有导电通路(未示出),用以和基底导电插针通道4内部的导电插针进行电连接,即安装框5上的安装框定位装置6可以在完成定位安装的同时完成电连接。 At the bottom of the mounting frame 5 having a mounting frame positioning means 6, the number of the mounting frame positioning means and the substrate electrically conductive pin 6 of the same number of channels 4, the mounting frame positioning means 6 is directly fitted on the conductive pin channel substrate 4, base conductive pin receiving passage 4 from a top surface of the substrate 3 is exposed height, mounting block inside positioning means 6 having a conductive path (not shown), conductive pins to the interior of the channel and the substrate 4 are electrically conductive pins connection, i.e. the positioning means on the mounting frame mounting block 56 may be electrically connected to complete the installation in the completion of the positioning. 该导电通路的另一端用于和反射杯7中的反射杯对准装置8内部的连接通路(未示出)进行电连接。 The other end of the conductive paths for the reflective cup 7 and the reflective cup alignment device 8 is connected to the internal passage (not shown) are electrically connected.

6[0025] 其中,安装框5和基底3之间的定位通过安装框定位装置6和基底导电插针通道4 之间的识别定位来实现,通过将安装框定位装置6嵌套于基底导电插针通道4上,来实现两者之间的识别定位;然后可以在这两者之间施加粘接剂进行粘接,来实现安装框5和基底3 之间的安装,或者可以在安装框定位装置6和基底导电插针通道4之间施加进行连接的卡榫卡扣结构来实现安装框5和基底3之间的安装。 6 [0025] wherein, positioned between the frame 5 and the substrate 3 is mounted by the mounting frame and the positioning means 6 is positioned between the identified base conductive pins channel 4 is achieved by positioning the frame means mounted to a substrate conductive plug nested 6 the needle channel 4, to achieve positioning between the two identified; may then be applied to the adhesive bonding between the two, is achieved between the mounting frame 5 and the base 3 is mounted, or may be positioned at the mounting block applying a locking structure for connection tenon to achieve mounted between the mounting frame 5 and the base 3 between the device 6 and 4 base conductive pins channel. 或者也可以在安装框5和基底3之间其它的位置施加粘接剂或者进行连接的卡榫卡扣结构,来实现安装框5和基底3之间的安装。 Or may be applied in other locations between the mounting frame 5 and the base 3 an adhesive or by snap-tenon connecting structure, to achieve the installation frame 5 and the substrate 3 is mounted between.

[0026] 安装框由可以耐高温的陶瓷或树脂来制成,其至少可以在100°C、甚至至少是200°C、优选至少是300°C的环境温度下,保持不变形、且具有良好的绝缘性能,可以用环氧树脂、聚氯乙烯、聚丙烯、聚苯丙乙烯等耐高温的材料来制作该安装框。 [0026] The mounting frame may be made of a refractory ceramic or a resin, which may be at least 100 ° C, or even at least 200 ° C, preferably at least ambient temperature to 300 ° C, keep their shape, and has good insulating properties, it can be an epoxy resin, polyvinyl chloride, polypropylene, ethylene-phenylpropyl and other high temperature materials to make the mounting frame. 也可以由带有绝缘部件的金属等来制作该安装框。 Also the mounting frame can be produced with an insulating member made of a metal or the like.

[0027] 附图5 :本发明的反射杯结构的顶视图。 [0027] Figure 5: a top view of the structure of a reflective cup of the present invention. 该反射杯7的形状为倒置的截园锥体或者是倒置的截顶多棱锥体的形状,其底面小、顶面大。 The shape of the reflective cup 7 is a cone truncated shape of an inverted or inverted truncated pyramid, at most, a small bottom surface thereof, a large top surface. 反射杯7的底面与通过安装框5的开口所暴露的基底3的顶面直接接触,并且该反射杯容纳于该安装框中。 Reflective cup bottom surface 7 is in direct contact with the exposed frame 5 is mounted through the opening of the base top surface 3 and the reflective cup housed in the mounting frame. 该反射杯7的底部具有反射杯对准装置8,通过将该反射杯对准装置8嵌套在安装框定位装置6上,来实现反射杯的定位安装,反射杯对准装置8内具有连接通路,一端与安装框定位装置6中的导电通路进行电连接,另一端与led芯片阵列9进行电连接。 7 the bottom of the reflective cup having a reflective cup alignment means 8, by aligning the reflective cup means 8 fitted on the mounting frame positioning means 6 is positioned to achieve the reflective cup mounted within a reflective cup 8 having a connector alignment means passage, one end of the mounting frame 6 positioned conductive path means electrically connected to the other end led chip array 9 are electrically connected.

[0028] 该反射杯7的锥体具有30-60度的角度,优选是具有45度的角度。 [0028] The reflective cup having a cone angle of 30-60 degrees to 7, preferably having an angle of 45 degrees. 该反射杯7的材料是具有高反光性的材料,其光反射率在80%以上,甚至是90%以上,或者是95%以上、 优选是98%以上或者是100%。 The reflective cup material 7 is a material having high light reflectivity, the light reflectivity of 80% or more, or even 90% or more, or 95% or more, preferably 98% or 100%. 该反射杯7的厚度为0. Imm-IOmm之间,优选是0. 2mm-5mm, 更优选是0. lmm-lmm。 The reflective cup 7 thickness is between 0. Imm-IOmm, preferably 0. 2mm-5mm, more preferably 0. lmm-lmm. 反射杯7在具有高反光效率的同时,还应当具有优良的导热性,可以将led芯片阵列9在发光过程中产生的热能传导到下面的基底3。 7 while the reflective cup having a reflective, high efficiency, should also have excellent thermal conductivity, heat generated led chip array 9 during lighting can be transferred to the underlying substrate 3. 因此反射杯7的材料可以为高反光率的铝板、银板,或者是表面镀有高反光膜层的板,比如镀有银层、铝层、金层的金属板、塑料板、树脂板等各种板。 Thus the material 7 may be reflective cup high reflectance aluminum, silver plates, or plated with a highly reflective film plate, such as silver plated layer, aluminum layer, gold layer of the metal plate, a plastic plate, a resin plate various boards.

[0029] 该被直接暴露基底3的顶面,用于和反射杯7的底面直接接触,可以通过粘接剂进行粘接,该粘接剂可以为耐高温的绝缘、导热粘胶(未示出),将反射杯7中的led芯片阵列9所产生的热量,通过反射杯底面传递给基底3,再将热量传递到外界。 [0029] The top surface is directly exposed to the substrate 3, the bottom surface of the reflective cup, and 7 for direct contact, can be adhered by an adhesive, the adhesive may be a high temperature insulating, thermally conductive adhesive (not shown out), heat is led chip array of the reflective cup 79 generated, transmitted through the reflective cup to the bottom surface of the substrate 3, and then heat is transferred to the outside. 该耐高温的绝缘、导热粘胶可以为环氧树脂、银浆、导热硅胶、或者是ab胶,或者也可以是其它的任何具有上述功能的胶。 The high temperature insulating, thermally conductive adhesive may be an epoxy, silver paste, thermal silica, or ab glue, or may be any other glue having the above function.

[0030] 其中,安装框5和反射杯7之间的定位通过安装框定位装置6和反射杯对准装置8 之间的识别定位来实现,通过将反射杯对准装置8嵌套于基安装框定位装置6上,来实现两者之间的识别定位;然后可以在这两者之间施加粘接剂进行粘接,来实现安装框5和反射杯7之间的安装,或者可以在安装框定位装置6和反射杯对准装置8之间施加进行连接的卡榫卡扣结构来实现安装框5和反射杯7之间的安装。 [0030] wherein, positioned between the mounting frame 5 and 7 by mounting reflector cup frame positioning means 6 and the reflective cup positioned between the alignment means 8 recognize achieved by aligning the reflective cup in nested groups mounting means 8 positioning means on the frame 6, the positioning is achieved between the two identified; may then be applied to the adhesive bonding therebetween, mounting is achieved between the mounting frame 5 and the reflective cup 7, or may be mounted frame positioning means 6 for applying a reflective cup and tenon locking structure connected to the implement 7 mounted between the mounting frame 5 between the alignment means and the reflective cup 8. 或者也可以在安装框5和反射杯7 之间其它的位置施加粘接剂或者进行连接的卡榫卡扣结构,来实现安装框5和反射杯7之间的安装。 Or may be applied in other locations between the mounting frame 5 and 7 reflective cup for adhesive or a snap-tenon connecting structure, to achieve the installation between the mounting frame 5 and the reflective cup 7.

[0031] led芯片阵列9安装在反射杯7底面上,该led芯片阵列9中所包含的led芯片的数量可以为2个、3个、50个、100个或几百个、几千个,其数目可以为任意的自然数。 [0031] 9 led chip array 7 mounted on the bottom surface of the reflective cup, which led the number of chip led chip array 9 may comprise 2, 3, 50, 100, or hundreds, thousands, the number thereof may be any natural number. 该led 芯片阵列9的功率可以在IOw以上、20w以上、40w以上、80w以上、IOOw以上、200w以上、500w 以上或IOOOw的高功率。 The power led chip array may be in IOw 9 above, 20w above, 40w above, 80w above, IOOw above, 200w above, 500w IOOOw of the above or high power. 该led芯片可以通过具有导热、绝缘、在高温下不变形的粘胶直接将led芯片阵列9直接粘接在反射杯底面31上,例如环氧树脂、银浆、导热硅胶、导热硅胶、 或者是ab胶,或者也可以是其它的任何具有上述功能的胶。 The chip may be led by a thermally conductive, insulating, at high temperature deformation glue chip array 9 led directly bonded directly reflective cup bottom surface 31, such as epoxy, silver paste, thermal silica, thermal silica, or ab glue, or it may be any other glue having the above function. 也可以通过在led芯片和反射杯底面31上安装卡榫和卡扣进行安装。 It can also be mounted and snap-in tenons led chip mounted on the bottom surface 31 and the reflective cup. Led导线33焊接在导电插针上,采用不直接接触被焊接的物体,而直接将热能提供在Led导线33和导电插针上的方法来完成焊接,可以通过超声波焊、回流焊等无接触焊接的方法,避免了传统的焊接中对内部精细器件的损伤,也避免了电荷的积聚而使led芯片击穿损毁。 Led wires soldered on the conductive pins 33, are welded using direct contact of the object, it provides a method of thermal energy directly on wire 33 and the conductive pins Led to complete the welding, by ultrasonic welding, contactless welding as reflow, the method avoids the conventional welding damage to the internal components of the fine, but also to avoid the accumulation of charge breakdown led chip damage.

[0032] 附图1、2是本发明的菲涅尔透镜的结构图。 [0032] FIG 1 is a configuration diagram of a Fresnel lens of the present invention. 菲涅尔透镜1及其支撑架2放置在安装框5上,该菲涅尔透镜由一个或多个菲涅尔透镜组成,在菲尼尔透镜1的下面具有一个支撑架2,支撑架2所形成的框架的大小,正好可以放入该菲涅尔透镜1,菲涅尔透镜1的上表面和支撑架2的上表面位于同一水平面,菲涅尔透镜1的下表面和支撑架2的下表面具有一定的距离,调节该距离使得从菲涅尔透镜1的下表面到led芯片阵列9的距离等于菲涅尔透镜1的焦距。 Fresnel lens 1 and the supporting frame 2 is placed on the mounting frame 5, the Fresnel lens by one or more Fresnel lenses, having a supporting frame 2 below the Fresnel lens 1, the support frame 2 the size of the frame to be formed, can be placed just on the surface of the support frame and the upper surface of the Fresnel lens 1, a Fresnel lens 2 at the same level, the lower surface of the Fresnel lens 1 and the supporting frame 2 a lower surface having a certain distance, the distance is adjusted such that equal to the focal length of the Fresnel lens 1 from the lower surface of the Fresnel lens from 1 to 9 led chip array.

[0033] 安装框5上可以形成有与支撑架2相对应的凹槽,用于容纳支撑架2的底面。 [0033] The frame 5 is mounted on the support frame 2 may be formed corresponding to the groove for receiving the bottom surface of the support frame 2. 还可以在该凹槽的外侧的某一处还可以具有一个凹陷,当支撑架2通过粘接剂粘接的方式与安装框5的凹槽进行连接时,多余的粘接剂可以流入到该凹陷中去,避免多余的粘接剂造成对led光源以及外界的污染;还可以在凹槽中具有与支撑架2连接用的卡榫卡扣结构; 还可以在凹槽中直接通过粘接剂和支撑架2进行粘接。 It may also have a recess may at some point outside of the recess, when the support frame 2 are connected by way of a groove adhesive bonding the mounting frame 5, the excess adhesive may flow into the recess to avoid contamination of the light sources and led outside of the excess adhesive; may also have a locking structure tenon connection in the groove of the support frame 2; may also be directly in the recess by an adhesive and a support frame 2 are bonded.

[0034] 安装框5上可以形成有与支撑架2相对应的凸起,用于和支撑架2进行连接。 [0034] mounted on the frame 5 may be formed with protrusions corresponding to the supporting frame 2, and a support frame 2 for connecting. 还可以在该凸起的外侧的某一处还可以具有一个凹陷,当支撑架2通过粘接剂粘接的方式与安装框5的凸起进行连接时,多余的粘接剂可以流入到该凹陷中去,避免多余的粘接剂造成对led光源以及外界的污染;还可以在凸起上具有与支撑架2连接用的卡榫卡扣结构; 还可以在凸起上直接通过粘接剂和支撑架2进行粘接。 It may also have a recess may at some point outside of the projection, when the support frame 2 is connected by way of adhesive bonding the mounting frame 5 is raised, the excess adhesive may flow into the recess to avoid excess adhesive causes pollution to the outside and led light; may also have a locking structure tenon connection support frame 2 on the projection; can also directly by an adhesive on the protrusions and a support frame 2 are bonded.

[0035] 当然也可以在卡榫卡扣结构中应用少量的粘接剂,以增强结合的紧密性。 [0035] Of course, it can also be used in a small amount of adhesive tenon locking structure to enhance binding tightness. 当然安装框5也可以不具有任何的用于和支撑架2进行连接的卡榫卡扣结构和凹槽、凹陷、凸起, 通过粘接剂直接将支撑架2和安装框5连接在一起。 Of course, the installation frame 5 may not have any support frame 2 and a tenon and groove connection of the locking structure, recesses, projections, are joined together by an adhesive to directly support frame 2 and the mounting frame 5. 或者只在安装框5上设置凹陷用于安装框5和支撑架2用粘接剂进行连接,并通过凹陷容纳多余的粘接剂。 Or only on the mounting frame 5 is provided a recess for mounting the support frame 2 and frame 5 are connected with an adhesive, and through the recess accommodating excess cement. 该凹槽和凸起也可以位于该反射杯7上或者该反射杯7的内部,也可以位于安装框5出去安装框定位装置6 以外的其它地方。 The groove and the projection may also be located on the interior of the reflective cup 7 or the reflective cup 7, the mounting frame 5 may also be mounted elsewhere block out outside the positioning means 6.

[0036] 此处所用的粘接剂可以为任何的粘接剂,热固性的粘接剂,光固性的粘接剂等都可以用于该粘接。 [0036] As used herein, the adhesive may be any adhesive, a thermosetting adhesive, photocurable adhesive properties of the adhesive can be used. 该粘接剂可以为环氧树脂或PC材料。 The adhesive may be an epoxy resin or a PC material.

[0037] 调节该距离使得从菲涅尔透镜1的下表面到led芯片阵列9的距离等于菲涅尔透镜1的焦距,此时可以达到最好的汇聚或者发散效果。 [0037] adjusted so that the distance from the lower surface of the Fresnel lens 1 is led to the chip array distance equal to the focal length of the Fresnel lens 9 1, at this time can achieve the best effect of converging or diverging. 该有效高度为菲涅尔透镜的下表面距离led芯片的距离。 The effective height is the distance from the lower surface of the chip led Fresnel lens. 当采用直接粘接剂粘接的方式时,该有效高度可能和支撑架2的实际高度一样;当采用凹槽、凹陷的方式时该有效高度可能小于支撑架2的实际高度;当采用凸起的时候该有效高度可能大于支撑架2的实际高度。 When adhesive bonding of the direct mode, the effective height and the actual height of the support frame 2 may be the same; when using a groove recessed manner the effective height may be less than the actual height of the support frame 2; and when using projection when the effective height may be greater than the actual height of the support frame 2. 为了满足某些特定的需要,该有效高度也可以不等于菲涅尔透镜的焦距,可以比该焦距略大或者略小。 In order to meet certain needs, which may not be equal to the height of the effective focal length of the Fresnel lens may be slightly smaller or slightly larger than the focal length.

[0038] 支撑架2的材料可以为任意的树脂材料,例如PC材料、环氧树脂材料,也可以为玻璃、金属等任意可以起到支撑作用的材料。 Materials [0038] The support frame 2 may be any resin material such as PC material, epoxy material, the support material may play a role can be any glass, metal or the like. 该支撑架2的材料可以和菲涅尔透镜的材料一致,并且一体化形成,这样可以省去菲涅尔透镜固定在支撑架2上这一工序,提改了生产效率、提高了密闭性能。 The support frame material 2 may be consistent with the Fresnel lens and the material, and integrally formed, may be omitted so that the Fresnel lens is fixed to the supporting frame 2 in this step, mention changed productivity, improve the sealing ability.

[0039] 支撑架2的形状可以和菲涅尔透镜的形状一致,也可以不一致,只需要该支撑架2 可以将菲涅尔透镜支撑在led芯片之上,并保持需要的高度既可以。 [0039] The shape of the supporting frame 2 and the shape of the Fresnel lens may coincide or may not coincide, only the support frame 2 may be supported above the Fresnel lens led chip, and either to maintain the required height. 该支撑架2可以为正方形、圆形、长方形、三角形、五角形、菱形、正多边形,或者非正多边形的任意形状。 The support frame 2 may be square, circular, rectangular, triangular, pentagonal, diamond, regular polygon, or any non-regular polygonal shape.

[0040] 菲涅尔透镜1由一个或多个菲涅尔透镜组成。 [0040] Fresnel lens 1 by one or more Fresnel lenses. 菲涅尔透镜的形状可以形成正方形、圆形、长方形、三角形、五角形、菱形、正多边形,或者非正多边形的任意形状;由多个菲涅尔透镜所组成的菲涅尔透镜的形状可以是正方形、圆形、长方形、三角形、五角形、菱形、 正多边形,或者非正多边形的任意形状,也可以使任意规则的或者不规则的平面形状或者是立体形状。 Fresnel lens may be formed in the shape of a square, circular, rectangular, triangular, pentagonal, diamond, regular polygon, or any non-regular polygonal shape; the shape of a Fresnel lens consisting of a plurality of Fresnel lens may be square, circular, rectangular, triangular, pentagonal, diamond, regular polygon, or any non-regular polygonal shape, may be made of any regular or irregular three-dimensional shape or a planar shape. 可以通过对菲涅尔透镜1形状的选择,来限定led光源最终光线的照明范围, 使其保持在任意规则的或者不规则的形状,其可以是正方形、圆形、长方形、三角形、五角形、菱形、正多边形,或者非正多边形的任意形状,可以使经过菲涅尔透镜1的的光线具有任意需要的形状。 By selecting the shape of a Fresnel lens, the illumination range is defined ultimately led light source, keeping it in any regular or irregular shape, which may be square, circular, rectangular, triangular, pentagonal, diamond , a regular polygon, or any non-regular polygonal shape, allows the light passing through the Fresnel lens 1 having any desired shape.

[0041] 菲涅尔透镜的材料为pc材料,或者是其它任意的具有良好透光性的材料,也可以为玻璃、环氧树脂,如果不考虑成本,也可以采用蓝宝石、红宝石等。 [0041] The material of the Fresnel lens is pc material, or any other material having a good light-transmitting property may be a glass, an epoxy resin, without considering the cost, also made of sapphire, ruby. 菲涅尔透镜通常只有l-20mm的厚度,优选是3_10mm的厚度,更优选是5mm左右的厚度。 Fresnel lenses are typically only a thickness of l-20mm, preferably a thickness 3_10mm, more preferably a thickness of about 5mm.

[0042] 菲涅尔透镜1中所具有的多个菲涅尔透镜之间具有位于同一平面或者同一球面的位置关系。 [0042] The positional relationship in the same plane or the same between the plurality of spherical Fresnel lens of the Fresnel lens 1 has. 菲涅尔透镜的光学面朝向外侧,即光线射出的一侧,菲涅尔透镜的另一侧朝向led芯片阵列9,以允许光线进入,并在菲涅尔透镜内部完成汇聚或者发散。 The optical surface of the Fresnel lens toward the outside, i.e. the side of light emitted toward the other side of the Fresnel lens led array chip 9, to allow light to enter and complete the diverging or converging Fresnel lens inside. 且菲涅尔透镜的底面与其对应的led芯片阵列9之间的垂直距离等于该菲涅尔透镜的焦距,当然为了某些特定的需要,也可以略小于或者略大于该相应的菲涅尔透镜的焦距。 9 and the vertical distance between the bottom surface of the corresponding chip arrays led equal focal length of the Fresnel lens of the Fresnel lens, of course, for some specific needs, may be slightly less than or slightly greater than the corresponding Fresnel lens the focal length.

[0043] 具有该菲涅尔封装结构的照明用具用于路灯、城市照明或者广场照明时,其光源从距离地面10-200m的距离、20-100m的距离、或者是35_40m的距离向下进行照明时,可以将照明的范围控制在需要照明的区域内,例如广场的范围,两个路灯之间的路面范围,甚至是形成特定的文字、图案,可以同时兼顾宣传和照明的目的。 When the illuminating device package structure for a Fresnel street, square or urban lighting illumination source from which the distance from the ground of 10-200m, 20-100m distance, or the distance downward lighting 35_40m [0043] having , the range of the illumination can be controlled in the area to be illuminated, for example, a range between the road range of the square, two lights, or even a specific form of text, graphics, and illumination purposes can promote both simultaneously.

[0044] 采用了该菲涅尔封装结构的照明用具,其照明亮度可以在同等功率的情况下,较传统的封装能够提高15% -25%,光通量的光衰由传统的20% -30%,降低到5% -7%。 [0044] The Fresnel the illuminating device package structure, in which case the illumination brightness can be the same power, compared with conventional package can be increased by 15% -25%, the luminous flux of the light fades from the traditional 20% -30% , down to about 5% -7%. 单位照度可以提高2-9倍,平均亮度可以提高15%-25%。 Unit illuminance can be increased 2-9 times, the average brightness can be increased by 15% -25%. 在这种情况下,路灯的地面照明亮度可以由25-30勒克斯,提高到40勒克斯以上。 In this case, lights from the ground 25-30 lux illumination brightness can be improved to more than 40 lux.

[0045] 安装框5和反射杯7之间的连接、安装框定位装置6和反射杯对准装置8之间的连接、基底3和安装框5之间的连接、基底导电插针通道4和安装框定位装置6之间的连接、支撑架2和安装框5之间的连接、或者是菲涅尔透镜1和支撑架2之间的连接,都可以通过卡榫卡扣结构进行连接,也可以通过凹、凸结构进行连接,还可以通过任何具有相对称的、互补的形状进行连接,还可以通过增加具有良好散热性能的散热油、导热硅脂之类的物质来增加散热性,还可以通过增加具有粘性的粘胶来增加两者连接的稳定性。 [0045] The reflective cup mounted frame 5 and 7 are connected between the mounting frame and the reflective cup positioning means 6 is connected between the alignment means 8, the connection between the mounting frame 5 and the base 3, the base 4 and the conductive pins channel 6 is connected between the mounting frame positioning means, connected between the support frame 2 and the mounting frame 5, or a Fresnel lens 1 and the connection between the support frame 2, are connected by tenon locking structure, may be performed by concave and convex structure is connected, may be connected by any, having a complementary shape symmetrical, heat radiation property can also be increased by increasing the heat oil with good heat dissipation properties, thermal grease or the like material, may also be by increasing the adhesive having a viscosity to increase the stability of both the connections.

[0046] 导电插针所连接的电源为电源效率在80%以上的开关电源,优选为95%以上的开关电源。 Power Supply [0046] The electrically conductive pins connected to the power efficiency of the switching power supply at 80% or more, preferably 95% or more of the switching power supply. 电源的种类优选为恒流源,但是不仅仅局限于横流源,任何可以提供电能的电源都可以用于和导电插针相连接,例如恒压源、市电、高压电经过变压的电源、电池、太阳能发电装置、风力发电装置等等现在所有的各种能够提供电力的装置以及线路,和将来各种可以所有可以提供电力的装置以及线路。 Type power supply is preferably a constant current source, but not limited to cross-flow source, any power source may provide electrical energy can be used and the conductive pins are connected, a constant voltage source, for example, electricity, high-voltage power supply through the transformer , batteries, solar power, wind power generation apparatus, etc. now all of the various devices and capable of providing electric power lines, and in the future may be all the various means, and may provide power lines. [0047] 上面说明了本发明的实施例。 [0047] The above described embodiments of the present invention. 但本发明并不限于上述实施例,本领域技术人员在本发明技术方案的范围内所进行的各种更改,都在本发明的保护范围之内。 However, the present invention is not limited to the above embodiments, various embodiments within the scope of those skilled in the art of the present invention is carried out changes, are within the scope of the present invention.

Claims (10)

1. 一种具有菲涅尔透镜的led光源,包括基底、安装框、反射杯、led芯片阵列、支撑架和菲涅尔透镜,其特征在于:基底,其中具有一个或两个基底导电插针通道在基底厚度方向上贯穿,基底导电插针通道在基底顶面上露出0. 5-10mm,并且在基底导电插针通道内部具有导电插针,安装框,其中间部分具有开口并直接暴露基底的顶表面,在该开口中用于放置反射杯, 并且在安装框的底部具有安装框定位装置,通过将该定位装置嵌套在基底导电插针通道上实现对基底的定位,并将安装框安装在基底上,并且该定位装置可以容纳基底导电插针通道露出基底顶表面的部分,反射杯,其通过反射杯底部上的反射杯对准装置嵌套在安装框定位装置上,来实现反射杯对安装框的定位,并将反射杯安装在安装框上,led芯片阵列位于反射杯的底部,安装框内部具有导电通 A Fresnel lens having a led light, comprising a substrate, a mounting frame, reflective cup, led chip array, a support frame and a Fresnel lens, wherein: the substrate, wherein the substrate has one or two electroconductive pins channel on the substrate through the thickness direction, the conductive pin channel in the base substrate top surface is exposed 0. 5-10mm, and the electrically conductive pins having a conductive plunger passage inside the base, the mounting frame, and an intermediate portion having an opening exposed directly to the substrate a top surface for the reflective cup opening is placed, and a mounting frame is positioned at the bottom of the mounting frame of the apparatus, to achieve positioning of the substrate on the substrate through the conductive pins channel nested positioning means, and the mounting frame mounted on the substrate, and the substrate positioning means can accommodate the exposed portion of the conductive pin channel, the top surface of the reflective cup base, which fitted on the mounting frame by means of the reflective cup aligned positioning means on the bottom of the reflective cup, to achieve reflection cup positioning of the mounting frame, and the reflective cup is mounted on the mounting block, led array chip at the bottom of the reflective cup, the internal mounting frame having conductive vias 路,支撑架,其位于安装框上,菲涅尔透镜位于所述支撑架上,并且菲涅尔透镜与支撑架的顶表面在同一个水平面,菲涅尔透镜的底面距离led芯片阵列的距离为5-10mm,安装框定位装置内的所述导电通路的一端用于和导电插针电连接,另一端用于和反射杯对准装置内的连接通路的一端电连接,连接通路的另一端用于和led芯片阵列连接,导电插针的另一端用于和led光源的开关电源相连接,该开关电源的效率在80%以上。 Road, support frame, which is located on the mounting frame, said support frame Fresnel lens, the Fresnel lens and the distance from the top surface of the support frame in the same horizontal plane, led from the bottom surface of the Fresnel lens array chips It is 5-10mm, and an end for electrically conductive pins of the conductive paths in the mounting frame positioning means, and the other end is electrically connected to one end of the connecting passage reflector cup alignment means, connected to the other end of the passageway and led for the chip array, and the other end of the conductive pins and led to the switching power supply is connected to the light source, the efficiency of the switching power supply is more than 80%.
2.根据权利要求1所述的led光源,其特征在于:所述基底和安装框之间通过粘接剂粘接的方式进行连接,或者通过位于基底和安装框之间的用于连接的卡榫卡扣结构进行连接。 2. led light source according to claim 1, wherein: the connection between the substrate and the mounting frame by way of adhesive bonding, or by a card for connection located between the base and the mounting frame snap connecting tongue structure.
3.根据权利要求2所述的led光源,其特征在于:所述粘接剂位于基底导电插针通道与安装框定位装置之间,或者所述卡榫卡扣结构位于基底导电插针通道与安装框定位装置之间。 Claimed in claim 2 led light, wherein: said adhesive is positioned between the conductive substrate and the mounting frame positioning pins passage means or said locking tenons is located in the base structure of the conductive pins passage positioning means between the mounting frame.
4.根据权利要求1所述的led光源,其特征在于:所述反射杯和安装框之间通过粘接剂粘接的方式进行连接,或者通过位于反射杯和安装框之间的用于连接的卡榫卡扣结构进行连接。 Led light claimed in claim 1, wherein: between said reflective cup and the mounting frame are connected by way of adhesive bonding, or by a connector positioned between the reflective cup and the mounting frame the snap-tenon connecting structure.
5.根据权利要求4所述的led光源,其特征在于:所述粘接剂位于反射杯对准装置与安装框定位装置之间,或者所述卡榫卡扣结构构位于反射杯对准装置与安装框定位装置之间。 Led light according to claim 4, wherein: said adhesive is positioned between the reflective cup aligned with the mounting means frame positioning means, or the structural configuration of the tenon locking the reflector cup alignment means and positioning means between the mounting frame.
6.根据权利要求1所述的led光源,其特征在于:所述安装框上具有用于容纳支撑架底面的凹槽,该凹槽中还具有用于容纳多余的用于将支撑架和安装框进行粘接的粘接剂的凹陷,或者该凹槽还具有用于与支撑架进行连接的卡榫卡扣结构,或者不具有凹陷和卡榫卡扣结构,直接使凹槽和支撑架进行通过粘接剂的粘接。 6. led light source according to claim 1, wherein: the support frame has a groove for receiving the bottom surface of the mounting frame, which also has a recess for receiving extra mounting bracket and frame recess adhesive bonding, or the groove further having a support frame with a snap-tenon connecting structure, having no recesses or locking structure and tenon, grooves and so that the support frame for direct by adhesive bonding.
7.根据权利要求1所述的led光源,其特征在于:所述安装框上具有用于与支撑架底面接触的凸起,该凸起上还具有用于容纳多余的用于将支撑架和安装框进行粘接的粘接剂的凹陷,或者该凸起还具有用于与支撑架进行连接的卡榫卡扣结构,或者不具有凹陷和卡榫卡扣结构,直接使凸起和支撑架进行通过粘接剂的粘接。 7. led light source according to claim 1, wherein: a protrusion having a bottom surface for contact with the mounting bracket on the frame, the protrusion further having a support frame for receiving and excess recess adhesive bonding the mounting frame or the protrusion further having a support frame with a snap-tenon connecting structure, having no recesses or locking structure and tenon, so that the projection and the supporting frame directly bonded by an adhesive agent.
8.根据权利要求1所述的led光源,其特征在于:所述支撑架和菲涅尔透镜由相同的材料一体化形成,且支撑架和菲涅尔透镜的材料分别选自由PC材料、环氧树脂材料和玻璃构成的组中之一。 8. The light led in claim 1, wherein: the support frame and a Fresnel lens formed of the same material integration, and the support frame, and the material of the Fresnel lens are selected from the group consisting of PC material, the ring one group of the epoxy resin material and glass.
9.根据权利要求1所述的led光源,其特征在于:该菲涅尔透镜具有正方形、长方形、 圆形、菱形、正五边形、正六边形的形状,使经过菲涅尔透镜的光线具有任意需要的形状。 9. The led light in claim 1, characterized in that: said Fresnel lens has a square, rectangular, circular, rhombus, a regular pentagon, regular hexagon shape, so that the light through the Fresnel lens having any desired shape.
10.根据权利要求1所述的led光源,其特征在于:通过该菲涅尔透镜的光线的光通量的光衰为5^-7¾^ 10. The LED light source of claim 1, wherein: the light flux decay light by the Fresnel lens is 5 ^ -7¾ ^
CN 201010128959 2010-03-22 2010-03-22 LED light source with Fresnel lens CN101793361B (en)

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