CN101787783A - Multilayer compound floor with aluminum structure and preparation method thereof - Google Patents

Multilayer compound floor with aluminum structure and preparation method thereof Download PDF

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Publication number
CN101787783A
CN101787783A CN 201010133845 CN201010133845A CN101787783A CN 101787783 A CN101787783 A CN 101787783A CN 201010133845 CN201010133845 CN 201010133845 CN 201010133845 A CN201010133845 A CN 201010133845A CN 101787783 A CN101787783 A CN 101787783A
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Prior art keywords
dash board
plate
thickness
last
veneer
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CN 201010133845
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CN101787783B (en
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吴殿满
李春平
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Individual
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Abstract

The invention discloses a multilayer compound floor with an aluminum structure and a preparation method thereof, which relate to the technical field of floor processing. The multilayer compound floor is prepared by sequentially overlapping, arraying and gluing an upper surface plate, an upper single plate, an upper aluminum plate, a substrate plate, a lower aluminum plate, a lower surface plate and a back plate. The floor has the advantages of strong stability, smoother, insusceptible deformation, quicker heat transfer, more uniform and particular suitability for terrestrial heat pavement.

Description

A kind of multilayer compound floor with aluminum structure and preparation method thereof
Technical field:
The present invention relates to the floor processing technique field, the present invention relates to a kind of composite floor board specifically, the invention still further relates to the preparation method of this composite floor board.
Background technology:
The essential structure of common composite floor board is: dash board, paddle, base plate are glued together.Manufacturing process is: behind selected base material gluing, use common hot-press equipment to press together, through after the sanding, be processed into normal specifications semiproduct plate with common mortise equipment, carry out deep processing according to different requirements again.
1. common composite floor board base material is chosen:
1.. dash board: length 400-2300MM; Width: 80-270MM; Thickness 3.0-4.0MM
2.. paddle and base plate:, mostly be the rotary cut venner of monolithic or multi-disc overlap joint according to selected specification of dash board and the selection of equipment processing limit.
2. common composite floor board equipment is chosen:
1.. hot-press equipment: general processing length 1000-2500MM;
2.. mortise equipment: general processing length: 400-2500MM.
3. common composite floor board specification is set:
1.. length: 400-2200MM
2.. width: 90-260MM
3.. thickness: 10-15MM
4.. the compound number of plies: 3-7 layer.
No matter be to produce base material, the equipment that needs, still the floor of being processed into all exists very big traditional, generality and randomness, the floor of adopting the big specification of said method production, and warpage issues is serious.Simultaneously, because common composite floor board is full wooden structures, heat conductivility is relatively poor, and for the user that northern area adopts ground hot channel heating winter, heat utilization efficiency is lower.
Summary of the invention:
The technical problem to be solved in the present invention is to disclose a kind of multilayer compound floor with aluminum structure.
The present invention also discloses the preparation method of this multilayer compound floor with aluminum structure.
Composite floor board of the present invention is by last dash board, last veneer, last aluminium sheet, backing material plate, lower aluminum sheet, following dash board and backboard constitute, last dash board, last veneer, backing material plate, following dash board and backboard are wooden boards, each laminate discharges successively, adopt glue bond, wherein going up dash board thickness is 3.3 6.3mm, vertically put, last veneer thickness is 0.8-1.2mm, laterally puts, last aluminium plate thickness is 0.25-0.35mm, backing material plate thickness is 3.3-6.3mm, laterally puts, and lower aluminum sheet thickness is 0.25-0.35mm, the following table plate thickness is 0.8-1.2mm, laterally put, back plate thickness is 3.3-6.3mm, vertically puts.
The preparation method of above-mentioned composite floor board is for may further comprise the steps:
(1) go up dash board and choose processing: choose plate side, sawing becomes dash board, and balance is gone into drying kiln, and temperature is controlled at 90-70 ℃, and after dry processing in 12 days, moisture content reaches 7.0 9.0%, and saw is cut into the dash board woolen cloth again;
(2) paddle is chosen processing: choosing moisture content is 7-8.5%, and thickness is that veneer or the finger plate of 3.3-6.3mm done backing material plate, gluing after sanding is fixed thick;
Choose two of the thick aluminium sheets of 0.3-0.4mm and carry out gluing after the manual sanding in length and breadth in two sides, do stereotype and following stereotype, sand grains size in abrasive band is the 60-80 order;
Choose two of the veneers of 0.8-1.2mm, do veneer and following dash board;
According to order from bottom to top, put down dash board, lower aluminum sheet, backing material plate successively, go up aluminium sheet and last veneer, after the combination, to cold pressing 60 minutes, the temperature of colding pressing is 30 ℃, unit pressure is the 16-18Kg/ square centimeter, makes paddle;
(3) backboard is chosen processing: veneer or the finger plate of choosing 3.3-6.3mm are made backboard, moisture content 1-5%;
(4) will go up the overlapping placement behind the gluing one by one of dash board, paddle and backboard, and adopt the method for colding pressing to carry out pressing, and make flooring blank, pressure is the 16-18Kg/ square centimeter, and the time is 60 minutes;
(5) balance health-preserving: the health 48 hours under airtight condition of the flooring blank after will colding pressing;
(6) sanding, mortise: identical with general composite floor board processing technology, guarantee plate gross thickness tolerance+0.2MM during sanding, described mortise guarantees that squareness is controlled in the 0.1MM in the difference of height 0.3MM between the plate;
Described glue is Tai Er does not have aldehyde glue.
Wherein going up the dash board dry run in the step (1) adopts following conditional effect even more ideal:
The temperature humidity time
Initial stage is handled 90 ℃ of 28-30.5% 8-12H
Dry 70 ℃ of 2223.5% 22-24H
72℃ 1921.5% 22-24H
74℃ 16-18.5% 22-24H
78℃ 13-15.5% 24-26H
Handle 90 ℃ of 9% 12-14H mid-term
Dry 78 ℃ of 11-13.5% 22-24H
82℃ 8-10.5% 22-24H
86℃ 6.5-8.5% 22-24H
End and handle 90 ℃ of 15-18.5% 24-26H
Cooling detects moisture content, airtight health 3 days;
For enhanced stability principle dash board consistent with base plate thickness.Veneer thickness consistent and with last dash board and backboard amalgamation in length and breadth.
Floor of the present invention stability is strong, more smooth, not yielding; The conduction heat is faster, more even, is particularly suitable for underground heat and mats formation.
Description of drawings:
Accompanying drawing is the sectional view on floor of the present invention.
The specific embodiment:
Composite floor board of the present invention is by last dash board 1, last veneer 2, last aluminium sheet 3, backing material plate 4, lower aluminum sheet 5, following dash board 6 and backboard 7 constitute, last dash board 1, last veneer 2, backing material plate 4, following dash board 6 and backboard 7 are wooden boards, each laminate discharges successively, adopt glue bond, wherein going up dash board 1 thickness is 3.3-6.3mm, vertically put, last veneer 2 thickness are 0.8-1.2mm, laterally put, last aluminium sheet 3 thickness are 0.25-0.35mm, backing material plate 4 thickness are 3.3-6.3mm, laterally put, and lower aluminum sheet 5 thickness are 0.25-0.35mm, following dash board 6 thickness are 0.8-1.2mm, laterally put, backboard 7 thickness are 3.3-6.3mm, vertically put.
The preparation method of above-mentioned composite floor board is for may further comprise the steps:
(1) go up dash board 1 and choose processing: choose plate side, sawing becomes dash board, and balance is gone into drying kiln, and temperature is controlled at 90-70 ℃, and after dry processing in 12 days, moisture content reaches 7.0-9.0%, and saw is cut into the dash board woolen cloth again;
(2) paddle is chosen processing: choosing moisture content is 7-8.5%, and thickness is that veneer or the finger plate of 3.3-6.3mm done backing material plate 4, gluing after sanding is fixed thick;
Choose two of the thick aluminium sheets of 0.3-0.4mm and carry out gluing after the manual sanding in length and breadth in two sides, do stereotype 3 and following stereotype 5, sand grains size in abrasive band is the 60-80 order;
Choose two of the veneers of 0.8-1.2mm, do veneer 2 and following dash board 6;
According to order from bottom to top, put down dash board 6, lower aluminum sheet 5, backing material plate 4 successively, go up aluminium sheet 3 and last veneer 2, after the combination, to cold pressing 60 minutes, the temperature of colding pressing is 30 ℃, unit pressure is the 16-18Kg/ square centimeter, makes paddle;
(3) backboard 7 is chosen processing: veneer or the finger plate of choosing 3.3-6.3mm are made backboard 7, moisture content 1-5%;
(4) will go up the overlapping placement behind the gluing one by one of dash board 1, paddle and backboard 7, and adopt the method for colding pressing to carry out pressing, and make flooring blank, pressure is the 16-18Kg/ square centimeter, and the time is 60 minutes;
(5) balance health-preserving: the health 48 hours under airtight condition of the flooring blank after will colding pressing;
(6) sanding, mortise: identical with general composite floor board processing technology, guarantee plate gross thickness tolerance+0.2MM during sanding, described mortise guarantees that squareness is controlled in the 0.1MM in the difference of height 0.3MM between the plate;
Described glue is Tai Er does not have aldehyde glue.

Claims (4)

1. multilayer compound floor with aluminum structure, it is characterized in that: it is by last dash board, last veneer, last aluminium sheet, backing material plate, lower aluminum sheet, following dash board and backboard constitute, last dash board, last veneer, backing material plate, following dash board and backboard are wooden boards, each laminate discharges successively, adopt glue bond, wherein going up dash board thickness is 3.3-6.3mm, vertically puts, last veneer thickness is 0.8-1.2mm, laterally put, last aluminium plate thickness is 0.25 0.35mm, and backing material plate thickness is 3.3-6.3mm, laterally put, lower aluminum sheet thickness is 0.25-0.35mm, and the following table plate thickness is 0.8-1.2mm, laterally puts, back plate thickness is 3.3-6.3mm, vertically puts.
2. multilayer compound floor with aluminum structure preparation method according to claim 1 is characterized in that adopting following steps to finish:
(1) go up dash board and choose processing: choose plate side, sawing becomes dash board, and balance is gone into drying kiln, and temperature is controlled at 90-70 ℃, and after dry processing in 12 days, moisture content reaches 7.0-9.0%, and saw is cut into the dash board woolen cloth again;
(2) paddle is chosen processing: choosing moisture content is 7-8.5%, and thickness is that veneer or the finger plate of 3.3-6.3mm done backing material plate, gluing after sanding is fixed thick;
Choose two of the thick aluminium sheets of 0.3-0.4mm and carry out gluing after the manual sanding in length and breadth in two sides, do stereotype and following stereotype, sand grains size in abrasive band is the 60-80 order;
Choose two of the veneers of 0.8-1.2mm, do veneer and following dash board;
According to order from bottom to top, put down dash board, lower aluminum sheet, backing material plate successively, go up aluminium sheet and last veneer, after the combination, to cold pressing 60 minutes, the temperature of colding pressing is 30 ℃, unit pressure is the 16-18Kg/ square centimeter, makes paddle;
(3) backboard is chosen processing: veneer or the finger plate of choosing 3.3-6.3mm are made backboard, moisture content 1-5%;
(4) will go up the overlapping placement behind the gluing one by one of dash board, paddle and backboard, and adopt the method for colding pressing to carry out pressing, and make flooring blank, pressure is the 16-18Kg/ square centimeter, and the time is 60 minutes;
(5) balance health-preserving: the health 48 hours under airtight condition of the flooring blank after will colding pressing;
(6) sanding, mortise: identical with general composite floor board processing technology, guarantee plate gross thickness tolerance+0.2MM during sanding, described mortise guarantees that squareness is controlled in the 0.1MM in the difference of height 0.3MM between the plate;
Described glue is Tai Er does not have aldehyde glue.
3. floor preparation method according to claim 2 is characterized in that: going up dash board dry run condition in the step 1 is:
The temperature humidity time
Initial stage is handled 90 ℃ of 28-30.5% 8-12H
Dry 70 ℃ of 22-23.5% 22-24H
72℃ 19-21.5% 22-24H
74℃ 16-18.5% 22-24H
78℃ 13-15.5% 24-26H
Handle 90 ℃ of 9% 12-14H mid-term
Dry 78 ℃ of 11-13.5% 22-24H
82℃ 8-10.5% 22-24H
86℃ 6.5-85% 22-24H
End and handle 90 ℃ of 15-18.5% 24-26H
Cooling detects moisture content, airtight health 3 days.
4. floor preparation method according to claim 2 is characterized in that: go up veneer thickness consistent and with last dash board and backboard amalgamation in length and breadth.
CN201010133845XA 2010-03-20 2010-03-20 Multilayer compound floor with aluminum structure and preparation method thereof Expired - Fee Related CN101787783B (en)

Priority Applications (1)

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CN201010133845XA CN101787783B (en) 2010-03-20 2010-03-20 Multilayer compound floor with aluminum structure and preparation method thereof

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Application Number Priority Date Filing Date Title
CN201010133845XA CN101787783B (en) 2010-03-20 2010-03-20 Multilayer compound floor with aluminum structure and preparation method thereof

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CN101787783B CN101787783B (en) 2012-05-30

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103437522A (en) * 2013-08-28 2013-12-11 南京和木新材料科技发展有限公司 Method for preparing novel fireproof decorative material
CN113374385A (en) * 2021-07-02 2021-09-10 广东玛格家居有限公司 Mortise and tenon joint wooden door core structure and processing method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998018656A1 (en) * 1996-10-29 1998-05-07 Rieter Automotive (International) Ag Ultralight, multifunctional, sound-insulating material assembly
CN2647969Y (en) * 2003-09-03 2004-10-13 邱新根 Anti-transshape wood floor plate
CN2863971Y (en) * 2005-12-02 2007-01-31 徐久亮 Soft wood solid wood type floor
CN201062420Y (en) * 2007-08-10 2008-05-21 哈尔滨市人和木业有限公司 Artificial solid wood squelch geothermal floor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998018656A1 (en) * 1996-10-29 1998-05-07 Rieter Automotive (International) Ag Ultralight, multifunctional, sound-insulating material assembly
CN2647969Y (en) * 2003-09-03 2004-10-13 邱新根 Anti-transshape wood floor plate
CN2863971Y (en) * 2005-12-02 2007-01-31 徐久亮 Soft wood solid wood type floor
CN201062420Y (en) * 2007-08-10 2008-05-21 哈尔滨市人和木业有限公司 Artificial solid wood squelch geothermal floor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103437522A (en) * 2013-08-28 2013-12-11 南京和木新材料科技发展有限公司 Method for preparing novel fireproof decorative material
CN113374385A (en) * 2021-07-02 2021-09-10 广东玛格家居有限公司 Mortise and tenon joint wooden door core structure and processing method

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Denomination of invention: Multilayer compound floor with aluminum structure and preparation method thereof

Effective date of registration: 20140815

Granted publication date: 20120530

Pledgee: China Co truction Bank Corp Baishan branch

Pledgor: Wu Dianman

Registration number: 2014990000662

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120530

Termination date: 20190320

CF01 Termination of patent right due to non-payment of annual fee