CN101787246B - Combined-type self-expansion package body and manufacturing method thereof - Google Patents

Combined-type self-expansion package body and manufacturing method thereof Download PDF

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Publication number
CN101787246B
CN101787246B CN200910202131.7A CN200910202131A CN101787246B CN 101787246 B CN101787246 B CN 101787246B CN 200910202131 A CN200910202131 A CN 200910202131A CN 101787246 B CN101787246 B CN 101787246B
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China
Prior art keywords
foaming substance
coating layer
combined
package body
type self
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Expired - Fee Related
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CN200910202131.7A
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Chinese (zh)
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CN101787246A (en
Inventor
穆陟晅
马宇尘
王向安
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SHANGHAI JIEYUAN ENVIRONMENTAL TECHNOLOGY Co Ltd
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SHANGHAI JIEYUAN ENVIRONMENTAL TECHNOLOGY Co Ltd
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Priority to CN200910202131.7A priority Critical patent/CN101787246B/en
Publication of CN101787246A publication Critical patent/CN101787246A/en
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Publication of CN101787246B publication Critical patent/CN101787246B/en
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Abstract

The invention provides a combined-type self-expansion package body and a manufacturing method thereof, belonging to the bonding technology application field. The combined-type self-expansion package comprises a foaming substance A, a coating layer of the foaming substance A, a foaming substance B and a coating layer of the foaming substance B. The manufacturing method comprises the following steps: packaging the foaming substance A; packaging the foaming substance B outside the coating layer of the foaming substance A; and packaging the coating layer of the foaming substance B outside the foaming substance B. The radio frequency identification (RFID) can be bonded or removed conveniently by adopting the package body, thereby facilitating RFID circulation utilization.

Description

A kind of combined-type self-expansion package body and manufacture method thereof
Technical field
The invention belongs to adhesive technology Application Areas, particularly the adhesive technology of electron device aspect.
Background technology
RF identification (RFID) is a kind of contactless automatic identification technology, and it is automatically identified target object and obtained related data by radiofrequency signal, and identification work need not manual intervention, can work in various severe environment.RFID technology is general known and can be for multiple application, for example automobile recognition and the eas on managed inventory, electronic access control, security system, turn pike.
Existing RFID chip is generally adopted and is pasted in the method for paste on target item or commodity by glue-line, for example, Chinese patent (Granted publication CN200986778Y) provide a kind of adhesive label with RFID chip, and it is pasted with RFID chip and antenna on non-drying glue layer.Fixing RFID electronic tag, adopts hot melt adhesive or organic glue-line to realize conventionally in this way.If RFID electronic tag is realized to recycle, just must remove RFID electronic tag from target object, and existing bonding mode only stresses the stability connecting, and ignored the convenience removing.Therefore, propose a kind ofly take into account bonding and remove the linker of laying equal stress on and be very important.
In view of the above-mentioned state of the art, the invention provides a kind of combined-type self-expansion package body and manufacture method thereof, it can be used as intermediate and is arranged between RFID electronic tag and target object, by glue-line, RFID electronic tag is fixed on target object, when removing RFID electronic tag, only need firmly push this package, can realize self explosion, thereby make RFID electronic tag separated with target object.
Summary of the invention
The object of this invention is to provide a kind of combined-type self-expansion package body, meanwhile, also provide a kind of manufacture method of combined-type self-expansion package body.
A kind of combined-type self-expansion package body, it comprises foaming substance A, and the peripheral foaming substance A coating layer that is arranged on aforesaid foaming substance A, and the peripheral foaming substance B that is arranged on aforesaid foaming substance A coating layer, and the peripheral foaming substance B coating layer that is arranged on aforesaid foaming substance B.
Further, described a kind of combined-type self-expansion package body, also comprises following technical characterictic:
Described foaming substance A coating layer, adopts organic plastics film to realize.
Described foaming substance A, in employing HCl solution, acetum, dilution heat of sulfuric acid, dilute nitric acid solution, at least one is realized.
Described foaming substance B coating layer, adopts organic plastics film to realize.
Described foaming substance B is to adopt NaHCO 3, Na 2cO 3, KHCO 3, K 2cO 3, CaHCO 3, CaCO 3realize.
A manufacture method for combined-type self-expansion package body, as previously described, the method includes following making step to described a kind of combined-type self-expansion package body:
Step 1, encapsulation foaming substance A;
Step 2, at foaming substance A coating layer outer package foaming substance B;
Step 3, at foaming substance B outer package foaming substance B coating layer.
Further, described a kind of combined-type self-expansion package body, also comprises following technical characterictic:
Described step 1, the technology of employing microcapsule moulding, first atomization foaming substance A, then sprays the foaming substance A coating layer being atomized.
Described step 2, adopt first wetting foaming substance A coating layer, and then the sticky method of wrapping up in foaming substance B is carried out.
Described step 3, adopts the mode of atomization to process foaming substance B coating layer, then puts on the particulate that has been provided with foaming substance B.
Wherein, described foaming substance A is preferably HCl solution or acetum, and described foaming substance B is preferably NaHCO 3.
The anti-intensity of foaming substance A coating layer is less than foaming substance B coating layer.
Advantage of the present invention:
Combined-type self-expansion package body provided by the invention, comprise foaming substance A, and the peripheral foaming substance A coating layer that is arranged on foaming substance A, and the peripheral foaming substance B that is arranged on foaming substance A coating layer, and the peripheral foaming substance B coating layer that is arranged on foaming substance B.It can be arranged between RFID electronic tag and target object as intermediate, by glue-line, RFID electronic tag is fixed on target object, when removing RFID electronic tag, only need firmly push this package, can realize self explosion, thereby make RFID electronic tag separated with target object.This package, when application, is taken into account the bonding of RFID electronic tag and removes, and has improved the convenience that RFID electronic tag removes, and has facilitated the recycle to RFID electronic tag.
Accompanying drawing explanation
Fig. 1 is the structure iron for a kind of combined-type self-expansion package body of the present invention.
Fig. 2 is the schema for a kind of combined-type self-expansion package body manufacture method of the present invention.
Fig. 3 is a kind of enforcement illustration for the structure of a kind of combined-type self-expansion package body of the present invention.
Fig. 4 implements illustration for the another kind of the structure of a kind of combined-type self-expansion package body of the present invention.
Label declaration in figure:
Combined-type self-expansion package body-100, foaming substance A-110, foaming substance A coating layer-120, foaming substance B-130, foaming substance B coating layer-140.
Embodiment
Below with reference to accompanying drawing, to a kind of combined-type self-expansion package body of the present invention and manufacture method thereof, be described in detail.
The explanation of Fig. 1:
Shown in ginseng Fig. 1, this figure has shown a kind of structure iron of combined-type self-expansion package body 100, this combined-type self-expansion package body 100 comprises foaming substance A 110, and the peripheral foaming substance A coating layer 120 that is arranged on aforesaid foaming substance A110, and the peripheral foaming substance B 130 that is arranged on aforesaid foaming substance A coating layer 120, and the peripheral foaming substance B coating layer 140 that is arranged on aforesaid foaming substance B 130.
Wherein, foaming substance A 110, is for carrying out chemical reaction with foaming substance B130, discharges gas, realizes the material of package self-expanding function, and it adopts, and in HCl solution, acetum, dilution heat of sulfuric acid, dilute nitric acid solution, at least one is realized.
Wherein, foaming substance A coating layer 120, is the periphery that is coated on foaming substance A110, is used for isolating the sealing coat of foaming substance A110 and foaming substance B 130, and its anti-intensity is less than foaming substance B coating layer 140.It adopts organic plastics film to realize, and can be at least one in vinyon, polystyrene plastic, igelite.
Wherein, foaming substance B 130, is for carrying out chemical reaction with foaming substance A110, discharges gas, realizes the material of package self-expanding function, and it is to adopt NaHCO 3, Na 2cO 3, KHCO 3, K 2cO 3, CaHCO 3, CaCO 3in at least one is realized.
Wherein, foaming substance B coating layer 140, is the peripheral coating layer that is coated on foaming substance B130, and its anti-intensity is greater than foaming substance A coating layer 120, it adopts organic plastics film to realize, and can be at least one in vinyon, polystyrene plastic, igelite.
The explanation of Fig. 2:
Shown in ginseng Fig. 2, this figure has shown a kind of schema of manufacture method of combined-type self-expansion package body, and the method includes following making step:
Step 1, encapsulation foaming substance A110.Adopt the technology of microcapsule moulding, first atomization foaming substance A110, then sprays the foaming substance A coating layer 120 being atomized.
Step 2, at foaming substance A coating layer 120 outer package foaming substance B130.First wetting foaming substance A coating layer 120, and then the sticky foaming substance B130 of wrapping up in.
Step 3, at foaming substance B130 outer package foaming substance B coating layer 140.Adopt the mode of atomization to process foaming substance B coating layer 140, then put on the particulate that has been provided with foaming substance B130.
When manufacturing compound self-expanding package, foaming substance A110 is preferably HCl solution or acetum, and foaming substance B130 is preferably NaHCO 3.Foaming substance A coating layer 120 and foaming substance B coating layer 140 adopt organic plastics film to realize, and the anti-intensity of foaming substance A coating layer 120 is less than foaming substance B coating layer 140.
Specific embodiment one:
Shown in ginseng Fig. 3, this figure has shown a kind of specific embodiment figure of structure of combined-type self-expansion package body 100, this combined-type self-expansion package body 100 comprises foaming substance A 110, and the peripheral foaming substance A coating layer 120 that is arranged on foaming substance A110, and the peripheral foaming substance B 130 that is arranged on foaming substance A coating layer 120, and the peripheral foaming substance B coating layer 140 that is arranged on foaming substance B 130.In the present embodiment, foaming substance A 100 selects HCl solution, and foaming substance A coating layer 120 selects sealed polyethylene plastic to realize; Corresponding foaming substance A 100 selects HCl solution, and foaming substance B 130 selects NaHCO 3powder, foaming substance B coating layer 140 selects sealed polyethylene plastic to realize.
In the present embodiment, the manufacture method of this combined-type self-expansion package body 100 is:
Adopt the technology of microcapsule moulding, first atomization HCl solution, then sprays the vinyon being atomized; First wetting vinyon, and then the sticky NaHCO of wrapping up in 3powder; Adopt the mode of atomization to process vinyon, then put on and be provided with NaHCO 3on the particulate of powder.
Specific embodiment two:
Shown in ginseng Fig. 4, this figure has shown a kind of specific embodiment figure of structure of combined-type self-expansion package body 100, this combined-type self-expansion package body 100 comprises foaming substance A 110, and the peripheral foaming substance A coating layer 120 that is arranged on foaming substance A110, and the peripheral foaming substance B 130 that is arranged on foaming substance A coating layer 120, and the peripheral foaming substance B coating layer 140 that is arranged on foaming substance B 130.In the present embodiment, foaming substance A 100 selects dilution heat of sulfuric acid, and foaming substance A coating layer 120 selects polyvinyl chloride plastic film to realize; Corresponding foaming substance A 100 selects dilution heat of sulfuric acid, and foaming substance B130 selects CaCO 3powder, foaming substance B coating layer 140 selects sealed polyethylene plastic to realize.
In the present embodiment, the manufacture method of this combined-type self-expansion package body 100 is:
Adopt the technology of microcapsule moulding, first atomization dilution heat of sulfuric acid, then sprays the igelite being atomized; First wetting igelite, and then the sticky CaCO of wrapping up in 3powder; Adopt the mode of atomization to process vinyon, then put on and be provided with CaCO 3on the particulate of powder.
Be more than the description of this invention and non-limiting, other embodiment based on inventive concept, all among protection scope of the present invention.

Claims (10)

1. a combined-type self-expansion package body, is characterized in that, this combined-type self-expansion package body comprises foaming substance A, and
Be arranged on the peripheral foaming substance A coating layer of aforesaid foaming substance A, and
Be arranged on the peripheral foaming substance B of aforesaid foaming substance A coating layer, and
Be arranged on the peripheral foaming substance B coating layer of aforesaid foaming substance B,
Chemical reaction wherein can occur between foaming substance A and foaming substance B and discharge gas, realize the self-expanding effect of package, the anti-intensity of foaming substance A coating layer is less than foaming substance B coating layer.
2. a kind of combined-type self-expansion package body according to claim 1, is characterized in that: described foaming substance A coating layer, adopts organic plastics film to realize.
3. a kind of combined-type self-expansion package body according to claim 1, is characterized in that: described foaming substance A, in employing HCl solution, acetum, dilution heat of sulfuric acid, dilute nitric acid solution, at least one is realized.
4. a kind of combined-type self-expansion package body according to claim 1, is characterized in that: described foaming substance B coating layer, adopts organic plastics film to realize.
5. a kind of combined-type self-expansion package body according to claim 1, is characterized in that: described foaming substance B is to adopt NaHCO 3, Na 2cO 3, KHCO 3, K 2cO 3, CaHCO 3, CaCO 3realize.
6. a manufacture method for combined-type self-expansion package body as claimed in claim 1, is characterized in that, the method includes following making step:
Step 1, encapsulation foaming substance A;
Step 2, at foaming substance A coating layer outer package foaming substance B;
Step 3, at foaming substance B outer package foaming substance B coating layer,
Chemical reaction wherein can occur between foaming substance A and foaming substance B and discharge gas, realize the self-expanding effect of package, the anti-intensity of foaming substance A coating layer is less than foaming substance B coating layer.
7. the manufacture method of a kind of combined-type self-expansion package body according to claim 6, is characterized in that: described step 1, the technology of employing microcapsule moulding, first atomization foaming substance A, the foaming substance A coating layer that then injection is atomized.
8. the manufacture method of a kind of combined-type self-expansion package body according to claim 6, is characterized in that: described step 2, employing is wetting foaming substance A coating layer first, and then the sticky method of wrapping up in foaming substance B is carried out.
9. the manufacture method of a kind of combined-type self-expansion package body according to claim 6, is characterized in that: described step 3, the mode of employing atomization is processed foaming substance B coating layer, then puts on the particulate that has been provided with foaming substance B.
10. the manufacture method of a kind of combined-type self-expansion package body according to claim 6, is characterized in that: wherein, described foaming substance A is preferably HCl solution or acetum, and described foaming substance B is preferably NaHCO 3.
CN200910202131.7A 2009-12-31 2009-12-31 Combined-type self-expansion package body and manufacturing method thereof Expired - Fee Related CN101787246B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104299022B (en) * 2014-10-10 2018-09-21 竹林伟业科技发展(天津)股份有限公司 A kind of RFID tag and its manufacturing method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1977281A (en) * 2004-10-22 2007-06-06 株式会社佐藤 A method for applying a RFID tag carrying label on an object
CN101346420A (en) * 2005-10-21 2009-01-14 卡伯特公司 Aerogel based composites
CN101398912A (en) * 2007-09-28 2009-04-01 富士通株式会社 RFID tag and manufacturing method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1977281A (en) * 2004-10-22 2007-06-06 株式会社佐藤 A method for applying a RFID tag carrying label on an object
CN101346420A (en) * 2005-10-21 2009-01-14 卡伯特公司 Aerogel based composites
CN101398912A (en) * 2007-09-28 2009-04-01 富士通株式会社 RFID tag and manufacturing method thereof

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