CN101786212A - Mechanical compaction welding set for processing laminated ceramic chips - Google Patents
Mechanical compaction welding set for processing laminated ceramic chips Download PDFInfo
- Publication number
- CN101786212A CN101786212A CN 201010131014 CN201010131014A CN101786212A CN 101786212 A CN101786212 A CN 101786212A CN 201010131014 CN201010131014 CN 201010131014 CN 201010131014 A CN201010131014 A CN 201010131014A CN 101786212 A CN101786212 A CN 101786212A
- Authority
- CN
- China
- Prior art keywords
- sleeve pipe
- ceramic chips
- laminated ceramic
- stage clip
- pressure spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 23
- 238000003466 welding Methods 0.000 title claims abstract description 19
- 238000005056 compaction Methods 0.000 title claims abstract description 8
- 239000004677 Nylon Substances 0.000 claims abstract description 4
- 229920001778 nylon Polymers 0.000 claims abstract description 4
- 238000003475 lamination Methods 0.000 claims description 13
- 241000237858 Gastropoda Species 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 5
- 238000010030 laminating Methods 0.000 abstract description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 5
- 229910052742 iron Inorganic materials 0.000 abstract 2
- 238000005476 soldering Methods 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000033001 locomotion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Images
Landscapes
- Ceramic Products (AREA)
Abstract
The invention discloses a mechanical compaction welding set for processing laminated ceramic chips, which solves the common technical problems of dislocation after laminating, surface deformation and warpage of the ceramic chips caused by unfavorable pressure control on soldering iron in a four-point welding technique for the laminated ceramic chips. The welding set comprises an air cylinder (1), a floating joint (2), a guide post (4) and a casing (7), wherein the output shaft of the air cylinder (1) is screwed with the soldering iron (12) orderly through the floating joint (2), the guide post (4), the casing (7) and a joint (11); the guide post (4) is movably arranged in a guide sleeve (3); the lower end surface of an inclined fixed sleeve (5) is fixedly connected with a pressure spring gasket (8); the inside of the inclined fixed sleeve (5) is sheathed with a nylon sleeve (6); the outer side of the lower end of the casing (7) is movably provided with a pressure spring fixing ring (10); and a pressure spring (9) is arranged between the pressure spring gasket (8) outside the casing (7) and the pressure spring fixing ring (10). The invention enhances the quality of four-point welded laminated ceramic chips.
Description
Technical field
The present invention relates to the welder in the lamination machine in a kind of LTCC system equipment, particularly a kind of mechanical compaction welding set of laminated ceramic chips.
Background technology
Lamination machine major function is to carry out automatic demoulding, vision location through the ceramic chips of filling and printed figure, again the laminated ceramic chips folded to be carried out fixing between layer and the layer, enters next procedure then and carry out lamination by the mode of four means of spot welds.And every layer of ceramic chips thickness minimum 100um only, the highest folded 30 laminations tightly weld.The lamination precision is up to ± 10um.The welding quality of flatiron also is even more important.Not only to guarantee positioning accuracy during welding, and will guarantee welding quality, and reach multilayer welding surfacing, indeformable, warpage not.In actual production process, ceramic chips, is moved on on the lamination platform that is connected with negative-pressure adsorption, and compresses down at the vacuum ceramic adsorption plate behind positioning table process hi-Fix by high-precision transporting mechanism, and flatiron presses down and welds.Each welding has only four flatirons at four jiaos of places to work simultaneously, and other four flatiron work then are replaced by in welding next time.This is in order to prevent that the same point continuous welding from causing the ceramic chips areal deformation, this mechanism adopts stage clip to adapt to the height change that causes owing to the variation of the ceramic chips number of plies in the lamination process automatically, and by the fixed position of regulating stage clip the pressure of eight flatirons is transferred to unanimity.Thereby guarantee that four means of spot welds can not cause ceramic chips areal deformation and warpage.
Summary of the invention
It is bad to the invention solves the flatiron pressure control that runs into usually in the laminated ceramic chips four means of spot welds technology, and then has influence on and laminate back dislocation and ceramic chips areal deformation and warpage, thereby causes the high technical problem of percent defective.
The present invention overcomes the above problems by following scheme:
A kind of mechanical compaction welding set of processing laminated ceramic chips, comprise cylinder, floating junction, guide pillar and sleeve pipe, the output shaft of cylinder links together by the upper end of floating junction and guide pillar, the lower end of guide pillar and the upper end snail of sleeve pipe are connected together, the lower end of sleeve pipe is screwed onto with flatiron by joint, guide pillar is movably arranged in the guide pin bushing, the upper surface of guide pin bushing is fixed together by the lower surface of screw and cylinder, the lower surface of guide pin bushing is screwed onto with the upper surface of oblique fixed cover, tiltedly the lower surface of fixed cover
The stage clip pad is arranged, and edge is furnished with nylon jacket in oblique fixed cover, is movably set with the stage clip retainer ring in the outside, bottom of sleeve pipe, is provided with stage clip between stage clip pad outside sleeve pipe and the stage clip retainer ring, and the tube wall of the sleeve pipe of hollow structure is provided with louvre.
The upper supporting plate of described oblique fixed cover and lamination machine is fixed together, and is provided with thermocouple and heating tube in sleeve pipe.
The invention has the beneficial effects as follows to have realized laminating and to guarantee that the lamination precision up to ± 10um, satisfies the designing requirement of lamination machine after the welding through the laminated ceramic chips behind the hi-Fix.
Description of drawings:
Fig. 1 is a structural representation of the present invention
The specific embodiment
A kind of mechanical compaction welding set of processing laminated ceramic chips, comprise cylinder 1, floating junction 2, guide pillar 4 and sleeve pipe 7, the output shaft of cylinder 1 links together by the upper end of floating junction 2 with guide pillar 4, the upper end snail of the lower end of guide pillar 4 and sleeve pipe 7 is connected together, the lower end of sleeve pipe 7 is screwed onto with flatiron 12 by joint 11, guide pillar 4 is movably arranged in the guide pin bushing 3, the upper surface of guide pin bushing 3 is fixed together by the lower surface of screw and cylinder 1, the lower surface of guide pin bushing 3 is screwed onto with the upper surface of oblique fixed cover 5, tiltedly the lower surface of fixed cover 5 is fixed with stage clip pad 8, tiltedly be socketed with nylon jacket 6 in the fixed cover 5, the outside, bottom at sleeve pipe 7 is movably set with stage clip retainer ring 10, be provided with stage clip 9 between stage clip pad 8 outside sleeve pipe 7 and the stage clip retainer ring 10, the tube wall of the sleeve pipe 7 of hollow structure is provided with louvre.
Described oblique fixed cover 5 is fixed together with the upper supporting plate of lamination machine, is provided with thermocouple and heating tube in sleeve pipe 7.
Eight cylinder 1 motions are controlled two groups of flatirons (four flatirons that are positioned at four jiaos of places are formed a group) respectively by two magnetic valves and are moved up and down eight unified controls of flatiron temperature.Utilize stage clip 9 to regulate simultaneously and adapt to the height change that causes owing to the variation of the ceramic chips number of plies in the lamination process automatically, and the pressure of eight flatirons is transferred to unanimity by the upper-lower position of regulating stage clip retainer ring 10.
Claims (2)
1. the mechanical compaction welding set of a processing laminated ceramic chips, comprise cylinder (1), floating junction (2), guide pillar (4) and sleeve pipe (7), it is characterized in that, the output shaft of cylinder (1) links together by the upper end of floating junction (2) with guide pillar (4), the upper end snail of the lower end of guide pillar (4) and sleeve pipe (7) is connected together, the lower end of sleeve pipe (7) is screwed onto with flatiron (12) by joint (11), guide pillar (4) is movably arranged in the guide pin bushing (3), the upper surface of guide pin bushing (3) is fixed together by the lower surface of screw and cylinder (1), the lower surface of guide pin bushing (3) is screwed onto with the upper surface of oblique fixed cover (5), tiltedly the lower surface of fixed cover (5) is fixed with stage clip pad (8), tiltedly be socketed with nylon jacket (6) in the fixed cover (5), the outside, bottom at sleeve pipe (7) is movably set with stage clip retainer ring (10), be provided with stage clip (9) between stage clip pad (8) outside sleeve pipe (7) and the stage clip retainer ring (10), the tube wall of the sleeve pipe of hollow structure (7) is provided with louvre.
2. the mechanical compaction welding set of processing laminated ceramic chips according to claim 1 is characterized in that, described oblique fixed cover (5) is fixed together with the upper supporting plate of lamination machine, is provided with thermocouple in sleeve pipe (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010131014 CN101786212B (en) | 2010-03-24 | 2010-03-24 | Mechanical compaction welding set for processing laminated ceramic chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010131014 CN101786212B (en) | 2010-03-24 | 2010-03-24 | Mechanical compaction welding set for processing laminated ceramic chips |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101786212A true CN101786212A (en) | 2010-07-28 |
| CN101786212B CN101786212B (en) | 2012-03-07 |
Family
ID=42529664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010131014 Expired - Fee Related CN101786212B (en) | 2010-03-24 | 2010-03-24 | Mechanical compaction welding set for processing laminated ceramic chips |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101786212B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB663404A (en) * | 1948-04-03 | 1951-12-19 | Air Liquide | Improvements in welding through pressure |
| CN2246557Y (en) * | 1995-09-15 | 1997-02-05 | 淄博多星电器总厂 | Soldering machine for composite bottom of electric-heating pot |
| JP2005059031A (en) * | 2003-08-08 | 2005-03-10 | Honda Motor Co Ltd | Welding equipment |
| CN2829961Y (en) * | 2005-07-04 | 2006-10-25 | 刘瑜 | Plasma copying angle semi-circular arc welder for cutting metal tube ends |
| CN2834764Y (en) * | 2005-06-30 | 2006-11-08 | 鹏煜威科技(深圳)有限公司 | Full automatic spot welder dedicated for copper wire welding |
| CN1927530A (en) * | 2006-09-29 | 2007-03-14 | 哈尔滨工业大学 | Apparatus for controlling welding stress deformation depending on welding friction extrusion |
| CN201067831Y (en) * | 2007-04-29 | 2008-06-04 | 上海英提尔交运汽车零部件有限公司 | Laser multi-point multi-plate welding working equipment |
| CN201625823U (en) * | 2010-03-24 | 2010-11-10 | 中国电子科技集团公司第二研究所 | Mechanical compaction welding device for processing multi-layer green ceramic sheets |
-
2010
- 2010-03-24 CN CN 201010131014 patent/CN101786212B/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB663404A (en) * | 1948-04-03 | 1951-12-19 | Air Liquide | Improvements in welding through pressure |
| CN2246557Y (en) * | 1995-09-15 | 1997-02-05 | 淄博多星电器总厂 | Soldering machine for composite bottom of electric-heating pot |
| JP2005059031A (en) * | 2003-08-08 | 2005-03-10 | Honda Motor Co Ltd | Welding equipment |
| CN2834764Y (en) * | 2005-06-30 | 2006-11-08 | 鹏煜威科技(深圳)有限公司 | Full automatic spot welder dedicated for copper wire welding |
| CN2829961Y (en) * | 2005-07-04 | 2006-10-25 | 刘瑜 | Plasma copying angle semi-circular arc welder for cutting metal tube ends |
| CN1927530A (en) * | 2006-09-29 | 2007-03-14 | 哈尔滨工业大学 | Apparatus for controlling welding stress deformation depending on welding friction extrusion |
| CN201067831Y (en) * | 2007-04-29 | 2008-06-04 | 上海英提尔交运汽车零部件有限公司 | Laser multi-point multi-plate welding working equipment |
| CN201625823U (en) * | 2010-03-24 | 2010-11-10 | 中国电子科技集团公司第二研究所 | Mechanical compaction welding device for processing multi-layer green ceramic sheets |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101786212B (en) | 2012-03-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103978340B (en) | A kind of encircling welding equipment of aircraft pipe component and circular-seam welding method | |
| CN100513053C (en) | Device for clamping components | |
| CN103071902B (en) | Method and device for controlling welding process based on stability of perforated molten bath | |
| CN107738098A (en) | Sensor group assembling production lines with detection function | |
| CN201625823U (en) | Mechanical compaction welding device for processing multi-layer green ceramic sheets | |
| WO2019178955A1 (en) | Multilayer deviation-correction device for sandpaper processing | |
| CN201455645U (en) | Cast pipe and flange centering machine | |
| CN206422986U (en) | A kind of automatic laminater of printed circuit board (PCB) | |
| CN103752974B (en) | Upper and lower hot blast Synchronous Heating integration sealing-off system | |
| CN116056369A (en) | Multilayer PCB board lamination equipment | |
| KR101281600B1 (en) | A taping attachment of pcb | |
| CN206811267U (en) | Point solder past welding machine | |
| CN211135845U (en) | Over-reflow soldering fixture | |
| CN116727797A (en) | Semiconductor element welding equipment and welding method thereof | |
| CN101786212B (en) | Mechanical compaction welding set for processing laminated ceramic chips | |
| CN106426955B (en) | A kind of plastic window welding equipment, the method for work of the equipment and four angle welders that are combined into using the equipment | |
| CN207788128U (en) | A kind of pcb board welding fixture | |
| CN105458323B (en) | A kind of improved high-efficiency automation hole-drilling system | |
| CN200967128Y (en) | Assembling jig for welding special-shaped thin casing | |
| CN103128966B (en) | Welding method of polyethylene (PE) gas valve | |
| CN201058890Y (en) | Bore work-piece inductive melt coating device | |
| CN108747071A (en) | Core plate assemble method | |
| CN208991919U (en) | A kind of automated production equipment of thermofussion welding | |
| CN215034426U (en) | Induction welding equipment with shielding ring | |
| KR20210000610A (en) | System and method for manufacturing a composite substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120307 |