CN101765627B - 用于照明系统的塑料构件 - Google Patents

用于照明系统的塑料构件 Download PDF

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Publication number
CN101765627B
CN101765627B CN200880100318XA CN200880100318A CN101765627B CN 101765627 B CN101765627 B CN 101765627B CN 200880100318X A CN200880100318X A CN 200880100318XA CN 200880100318 A CN200880100318 A CN 200880100318A CN 101765627 B CN101765627 B CN 101765627B
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CN
China
Prior art keywords
mole
polymer compsn
aliphatic diamine
compsn
aromatic polyamide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN200880100318XA
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English (en)
Chinese (zh)
Other versions
CN101765627A (zh
Inventor
鲁迪·鲁肯斯
汉斯·克拉斯·范迪克
桑杰伊·库马尔·拉梅什·库马尔·珍
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DSM IP Assets BV
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DSM IP Assets BV
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Publication of CN101765627A publication Critical patent/CN101765627A/zh
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Publication of CN101765627B publication Critical patent/CN101765627B/zh
Expired - Fee Related legal-status Critical Current
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyamides (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
CN200880100318XA 2007-07-23 2008-07-17 用于照明系统的塑料构件 Expired - Fee Related CN101765627B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP07014393.8 2007-07-23
EP07014393 2007-07-23
PCT/EP2008/005866 WO2009012933A1 (en) 2007-07-23 2008-07-17 Plastic component for a lighting systems

Publications (2)

Publication Number Publication Date
CN101765627A CN101765627A (zh) 2010-06-30
CN101765627B true CN101765627B (zh) 2012-12-05

Family

ID=38896967

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880100318XA Expired - Fee Related CN101765627B (zh) 2007-07-23 2008-07-17 用于照明系统的塑料构件

Country Status (7)

Country Link
US (1) US9090750B2 (ko)
EP (1) EP2170982A1 (ko)
JP (1) JP5574110B2 (ko)
KR (1) KR20100051669A (ko)
CN (1) CN101765627B (ko)
TW (1) TWI504635B (ko)
WO (1) WO2009012933A1 (ko)

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US7923739B2 (en) 2009-06-05 2011-04-12 Cree, Inc. Solid state lighting device
US8598602B2 (en) 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
CN102292378A (zh) * 2009-01-21 2011-12-21 帝斯曼知识产权资产管理有限公司 塑料容器和管道
JP2010182884A (ja) * 2009-02-05 2010-08-19 Sanesu:Kk 半導体発光装置、および、発光チップ搭載用配線基板
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
US9111778B2 (en) * 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US8860043B2 (en) * 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
US8557905B2 (en) 2010-04-07 2013-10-15 Denki Kagaku Kogyo Kabushiki Kaisha Heat-dissipating resin composition used for LED light housing and heat-dissipating housing for LED lighting
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
USD643819S1 (en) 2010-07-16 2011-08-23 Cree, Inc. Package for light emitting diode (LED) lighting
US8853723B2 (en) 2010-08-18 2014-10-07 E. I. Du Pont De Nemours And Company Light emitting diode assembly and thermal control blanket and methods relating thereto
KR20130101511A (ko) 2010-08-18 2013-09-13 이 아이 듀폰 디 네모아 앤드 캄파니 발광 다이오드 조립체 및 열 제어 블랭킷 및 이에 관련된 방법
USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
KR200483474Y1 (ko) * 2011-01-19 2017-05-18 그라프텍 인터내셔널 홀딩스 인코포레이티드 Led 전구를 위한 열 솔루션
TW201251140A (en) 2011-01-31 2012-12-16 Cree Inc High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
CN103348496A (zh) 2011-02-07 2013-10-09 克利公司 用于发光二极管（led）发光的部件和方法
WO2012113685A2 (en) * 2011-02-22 2012-08-30 Dsm Ip Assets B.V. Uv-led-light source
US9209373B2 (en) 2011-02-23 2015-12-08 Intellectual Discovery Co., Ltd. High power plastic leaded chip carrier with integrated metal reflector cup and direct heat sink
US8552101B2 (en) 2011-02-25 2013-10-08 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof
US8741998B2 (en) 2011-02-25 2014-06-03 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof
FR2973387B1 (fr) * 2011-04-04 2013-03-29 Rhodia Operations Composition polyamide de forte conductivite thermique
JP6177241B2 (ja) 2011-08-19 2017-08-09 ソルベイ スペシャルティ ポリマーズ ユーエスエー， エルエルシー Ｌｅｄ用途のための改良されたポリアミド組成物
CN102516754B (zh) * 2011-11-23 2013-06-26 安徽宜万丰电器有限公司 一种连接器及其制造方法
WO2013160454A2 (en) * 2012-04-27 2013-10-31 Dsm Ip Assets B.V. Electrically conductive polyamide substrate
JP5646120B1 (ja) * 2013-02-19 2014-12-24 ユニチカ株式会社 半芳香族ポリアミド樹脂組成物
US9227347B2 (en) 2013-02-25 2016-01-05 Sabic Global Technologies B.V. Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly
WO2015067563A1 (en) 2013-11-06 2015-05-14 Solvay Specialty Polymers Usa, Llc Flame retardant led for indoor lighting
CN104676399A (zh) * 2013-11-30 2015-06-03 鸿富锦精密工业（深圳）有限公司 Led路灯
US20160122082A1 (en) * 2014-11-03 2016-05-05 Scott A. Butz UV Plastic Object Protection System
CN107207854B (zh) * 2015-02-13 2020-03-03 艾曼斯专利股份公司 聚酰胺模塑组合物和由该模塑组合物制成的模制件
US9547108B2 (en) * 2015-02-24 2017-01-17 Arkema France Optical diffusion blend materials for LED lighting
US10345493B2 (en) * 2015-02-24 2019-07-09 Arkema France Optical diffusion blend materials for LED lighting
CN106147221B (zh) * 2015-04-28 2018-12-18 株洲时代新材料科技股份有限公司 玻纤增强阻燃导热半芳香共聚尼龙复合材料及其制备方法
TW201811976A (zh) 2016-08-08 2018-04-01 美商堤康那責任有限公司 用於散熱器之導熱聚合物組合物
CN110050032B (zh) * 2016-12-08 2022-06-28 帝斯曼知识产权资产管理有限公司 热塑性组合物、由其制成的模塑部件及其在汽车和电子电气应用中的用途
CN107417166A (zh) * 2017-05-26 2017-12-01 成都东浩散热器有限公司 用于降低led结温的材料及其制备方法
US20190322805A1 (en) * 2018-04-18 2019-10-24 Invista North America S.A R.L. Flame-retardant polyamide composition

Citations (2)

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CN1166843A (zh) * 1995-10-27 1997-12-03 三井石油化学工业株式会社 半芳族聚酰胺及其制备方法和其组合物的制备方法
EP1354915B1 (en) * 2002-04-15 2005-07-13 Kuraray Co., Ltd. Polyamide resin composition

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JP2000053762A (ja) * 1998-08-11 2000-02-22 Toray Ind Inc 共重合ポリアミド、その製造方法、及びその用途
JP2000129122A (ja) * 1998-10-23 2000-05-09 Yazaki Corp 成形用ポリアミド組成物
NL1013215C2 (nl) * 1999-10-05 2001-04-06 Dsm Nv Copolyamide op basis van tetramethyleentereftaalamide en hexamethyleentereftaalamide.
JP4158399B2 (ja) * 2002-04-05 2008-10-01 東レ株式会社 ポリアミド樹脂
CA2432522C (en) * 2002-06-21 2010-09-21 Hideaki Oka Polyamide composition
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TW200635993A (en) * 2004-12-17 2006-10-16 Solvay Advanced Polymers Llc Semi-crystalline polymer composition and article manufactured therefrom
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US20060293427A1 (en) * 2005-06-10 2006-12-28 Martens Marvin M Thermally conductive polyamide-based components used in light emitting diode reflector applications
RU2415156C2 (ru) * 2006-01-26 2011-03-27 ДСМ АйПи АССЕТС Б.В. Полукристаллический полуароматический полиамид

Patent Citations (2)

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CN1166843A (zh) * 1995-10-27 1997-12-03 三井石油化学工业株式会社 半芳族聚酰胺及其制备方法和其组合物的制备方法
EP1354915B1 (en) * 2002-04-15 2005-07-13 Kuraray Co., Ltd. Polyamide resin composition

Also Published As

Publication number Publication date
WO2009012933A1 (en) 2009-01-29
KR20100051669A (ko) 2010-05-17
JP5574110B2 (ja) 2014-08-20
TWI504635B (zh) 2015-10-21
TW200911881A (en) 2009-03-16
JP2010534257A (ja) 2010-11-04
EP2170982A1 (en) 2010-04-07
CN101765627A (zh) 2010-06-30
US9090750B2 (en) 2015-07-28
US20100270577A1 (en) 2010-10-28

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20121205

Termination date: 20160717