CN101761807A - LED illuminator and LED modules - Google Patents

LED illuminator and LED modules Download PDF

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Publication number
CN101761807A
CN101761807A CN201010105226A CN201010105226A CN101761807A CN 101761807 A CN101761807 A CN 101761807A CN 201010105226 A CN201010105226 A CN 201010105226A CN 201010105226 A CN201010105226 A CN 201010105226A CN 101761807 A CN101761807 A CN 101761807A
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led
circuit board
lighting device
heat dissipation
led lighting
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陈凯
章子奇
傅少钦
赵雅杰
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ZHEJIANG XIZI OPTOELECTRONICS TECHNOLOGY Co Ltd
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ZHEJIANG XIZI OPTOELECTRONICS TECHNOLOGY Co Ltd
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Priority to CN201010105226A priority Critical patent/CN101761807A/en
Priority to PCT/CN2010/072712 priority patent/WO2010130212A1/en
Publication of CN101761807A publication Critical patent/CN101761807A/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/10—Outdoor lighting
    • F21W2131/103—Outdoor lighting of streets or roads
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources

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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

本发明提出一种LED照明装置及LED模块,其LED照明装置包括灯壳和至少二个LED模块。LED模块设置在灯壳中,且每个LED模块又包括电路板及透光单元。电路板上设置有若干LED颗粒,透光单元覆盖在电路板的LED颗粒上,且电路板和透光单元上均设置有位置对应的多个散热通孔,并形成多个散热通道。本发明具有很好的散热效果,以及很长的使用寿命。

The present invention provides an LED lighting device and an LED module. The LED lighting device includes a lamp housing and at least two LED modules. The LED modules are arranged in the lamp housing, and each LED module further includes a circuit board and a light-transmitting unit. Several LED particles are arranged on the circuit board, the light-transmitting unit covers the LED particles on the circuit board, and the circuit board and the light-transmitting unit are provided with a plurality of heat dissipation through holes corresponding to positions, and form a plurality of heat dissipation channels. The invention has good heat dissipation effect and long service life.

Description

LED照明装置及LED模块 LED lighting device and LED module

技术领域technical field

本发明涉及照明技术领域,尤其涉及具有高散热效果的LED照明装置及LED模块。The invention relates to the field of lighting technology, in particular to an LED lighting device and an LED module with high heat dissipation effect.

背景技术Background technique

目前随着节能减排的发展趋势,LED(Light Emitting Diode,发光二极管)以其节能环保、发光效率高、寿命长等特点,得到越来越广泛的应用,由于其工作时产生的热量较少,发光效率较高,被视为冷光源,大有取代传统白炽灯、荧光灯的趋势。然而,LED在实际使用时,也会产生一定的热量,LED正常工作时的PN节温度应小于80℃,如果温度较高,LED的寿命会显著缩短,对于应用在路灯上的大功率LED而言,此种情况更为严重。因此LED在使用中的散热问题已经成为相关技术人员主要研究的方向之一。At present, with the development trend of energy saving and emission reduction, LED (Light Emitting Diode, light emitting diode) is more and more widely used due to its energy saving, environmental protection, high luminous efficiency, long life and other characteristics, because it generates less heat when working , with high luminous efficiency, it is regarded as a cold light source, and it has a tendency to replace traditional incandescent and fluorescent lamps. However, when the LED is actually used, it will also generate a certain amount of heat. The temperature of the PN junction of the LED should be less than 80°C when the LED is in normal operation. If the temperature is high, the life of the LED will be significantly shortened. For high-power LEDs used in street lights In other words, this situation is more serious. Therefore, the heat dissipation problem of LEDs in use has become one of the main research directions of relevant technical personnel.

为了提高LED照明装置的散热效果,业者经常在LED照明装置上加装散热片,如中国专利申请号200910101200.5,名称为“LED路灯”的发明专利,请参见图1,其揭示的一种LED路灯包括透明灯罩1、外壳2、LED二极管3、线路板4、散热片5,且散热片5背部设置有排风扇罩6,排风扇罩6上设置有排风扇7。工作过程中,LED二极管3发光产生的热量经由线路板4传导至散热片5上,再由散热片5散发到空气中,且排风扇7更提高了散热片5的散热效果。In order to improve the heat dissipation effect of LED lighting devices, the industry often installs heat sinks on LED lighting devices, such as Chinese patent application number 200910101200.5, the invention patent named "LED street lamp", please refer to Figure 1, which discloses an LED street lamp It includes a transparent lampshade 1, a casing 2, LED diodes 3, a circuit board 4, and a heat sink 5, and an exhaust fan cover 6 is arranged on the back of the heat sink 5, and an exhaust fan 7 is arranged on the exhaust fan cover 6. During the working process, the heat generated by the LED diode 3 is transmitted to the heat sink 5 via the circuit board 4 , and then dissipated into the air by the heat sink 5 , and the exhaust fan 7 further improves the heat dissipation effect of the heat sink 5 .

虽然现有的LED照明装置采用散热片的方式可以达到一定的散热效果,但就目前的LED照明装置而言,其LED颗粒通常都装在同一个灯壳里面。由于大量的LED工作时发热很大,而这种大量LED颗粒集中在单一模块中的方案,会造成热量难以散发,特别是灯壳的中央区域的热量更高,非常不利于散热;同时光源发出的热量往往会影响同一壳体内的驱动电路的工作温度,缩短其使用寿命,同时也不利于电源的维护;最后,因大功率LED整灯的体积大,若某一部分器件坏掉,需将整灯拆下返送厂家维修,影响正常使用,也增加了维修成本。Although the existing LED lighting device can achieve a certain heat dissipation effect by using heat sinks, as far as the current LED lighting device is concerned, its LED particles are usually installed in the same lamp housing. Because a large number of LEDs generate a lot of heat when they work, and this solution of concentrating a large number of LED particles in a single module will cause heat to be difficult to dissipate, especially the heat in the central area of the lamp housing is higher, which is not conducive to heat dissipation; at the same time, the light source emits The heat of the LED will often affect the working temperature of the driving circuit in the same shell, shorten its service life, and is not conducive to the maintenance of the power supply; finally, because the high-power LED lamp is large in size, if a part of the device is broken, the whole lamp needs to be replaced. The lamp is disassembled and returned to the manufacturer for maintenance, which affects normal use and increases maintenance costs.

发明内容Contents of the invention

本发明的目的是提供两种LED照明装置,以解决现有LED照明装置散热难和维修不便的问题。The object of the present invention is to provide two kinds of LED lighting devices to solve the problems of difficult heat dissipation and inconvenient maintenance of the existing LED lighting devices.

本发明的另一目的是提供一种LED模块,以解决现有LED照明装置散热难和维修不便的问题。Another object of the present invention is to provide an LED module to solve the problems of difficult heat dissipation and inconvenient maintenance of existing LED lighting devices.

本发明提出一种LED照明装置,包括灯壳和至少二个LED模块。LED模块设置在灯壳中,且每个LED模块又包括电路板及透光单元。电路板上设置有若干LED颗粒,透光单元覆盖在电路板的LED颗粒上,且电路板和透光单元上均设置有位置对应的多个散热通孔,并形成多个散热通道。The invention provides an LED lighting device, which includes a lamp housing and at least two LED modules. The LED modules are arranged in the lamp housing, and each LED module further includes a circuit board and a light-transmitting unit. Several LED particles are arranged on the circuit board, the light-transmitting unit covers the LED particles on the circuit board, and the circuit board and the light-transmitting unit are provided with a plurality of heat dissipation through holes corresponding to positions, and form a plurality of heat dissipation channels.

依照本发明较佳实施例所述的LED照明装置,散热通孔呈线性排布在电路板及透光单元上,并将内部的LED划分成若干部分。According to the LED lighting device described in the preferred embodiment of the present invention, the heat dissipation through-holes are linearly arranged on the circuit board and the light-transmitting unit, and divide the internal LEDs into several parts.

依照本发明较佳实施例所述的LED照明装置,其还包括一个散热器,散热器上设置有平整的或有弧度的鳍片,散热器基座设置有相应的散热通孔,LED模块均与散热器相连。According to the LED lighting device described in the preferred embodiment of the present invention, it also includes a heat sink, the heat sink is provided with flat or curved fins, and the base of the heat sink is provided with corresponding heat dissipation through holes. Connected to the radiator.

依照本发明较佳实施例所述的LED照明装置,其还包括至少二个散热器,散热器的数量与LED模块的数量相对应,每个散热器上设置有平整的或有弧度的鳍片,且每个散热器基座均设置有相应的散热通孔,每个LED模块与一个散热器的相连。According to the LED lighting device described in the preferred embodiment of the present invention, it further includes at least two heat sinks, the number of heat sinks corresponds to the number of LED modules, and each heat sink is provided with flat or curved fins , and each heat sink base is provided with a corresponding heat dissipation through hole, and each LED module is connected with a heat sink.

依照本发明较佳实施例所述的LED照明装置,每个LED模块(22)的散热通道中均穿伸有通管。According to the LED lighting device described in the preferred embodiment of the present invention, a through pipe extends through the heat dissipation channel of each LED module (22).

依照本发明较佳实施例所述的LED照明装置,每个LED模块还包括密封圈,密封圈设置在电路板四周一圈及散热通孔的位置,且密封圈上也设置有相应的通孔。According to the LED lighting device described in the preferred embodiment of the present invention, each LED module also includes a sealing ring, and the sealing ring is arranged around the circuit board and at the position of the heat dissipation through hole, and the sealing ring is also provided with a corresponding through hole .

本发明另提出一种LED模块,且至少二个LED模块共同设置在一个LED照明装置中。此LED模块包括电路板及透光单元,电路板上设置有若干LED颗粒,透光单元覆盖在电路板的LED颗粒上,且电路板和透光单元上均设置有位置对应的多个散热通孔,并形成多个散热通道。The present invention further provides an LED module, and at least two LED modules are jointly arranged in one LED lighting device. This LED module includes a circuit board and a light-transmitting unit. The circuit board is provided with a number of LED particles. The light-transmitting unit covers the LED particles on the circuit board. holes and form multiple cooling channels.

依照本发明较佳实施例所述的LED模块,散热通孔以线性排布在电路板及透光单元上,并将内部的LED划分成若干部分。According to the LED module described in the preferred embodiment of the present invention, the heat dissipation vias are linearly arranged on the circuit board and the light-transmitting unit, and divide the internal LEDs into several parts.

本发明还提出一种LED照明装置,包括灯壳和一个LED整灯光源。LED整灯光源内部设置有电路板和透光板,电路板上设置有多颗LED颗粒,透光板覆盖在电路板的LED颗粒上。其中,电路板和透光板上设置有多个散热通孔,并形成多个散热通道。The present invention also provides an LED lighting device, which includes a lamp housing and an LED light source for the entire lamp. A circuit board and a light-transmitting plate are arranged inside the LED light source, and a plurality of LED particles are arranged on the circuit board, and the light-transmitting plate covers the LED particles on the circuit board. Wherein, the circuit board and the light-transmitting plate are provided with a plurality of heat dissipation through holes, and form a plurality of heat dissipation channels.

依照本发明较佳实施例所述的LED照明装置,散热通孔呈线性阵列排布在电路板和透光板上,并将内部的LED划分若干部分。According to the LED lighting device described in the preferred embodiment of the present invention, the heat dissipation vias are arranged in a linear array on the circuit board and the light-transmitting board, and divide the internal LEDs into several parts.

相对于现有技术,本发明的有益效果是:本发明在LED模块或LED整灯光源的电路板及透光部件上开设散热通孔,使内部相邻LED之间形成空气对流,并减少相邻部分LED之间的热传导,有效地降低了LED照明装置的工作温度,因而大大增加了其使用寿命;本发明还提出一种LED模块化灯具理念,在灯的某个模块坏掉时,在不影响其他LED模块的照明使用的情况下,仅需要更换该模块即可,明显降低了维修成本,增加了便捷性。Compared with the prior art, the beneficial effect of the present invention is that: the present invention provides heat dissipation through holes on the circuit board and light-transmitting parts of the LED module or the LED light source, so that air convection is formed between the adjacent LEDs inside, and the relative heat dissipation is reduced. The heat conduction between adjacent parts of LEDs effectively reduces the working temperature of the LED lighting device, thereby greatly increasing its service life; the invention also proposes a concept of LED modular lamps. When a module of the lamp is broken, the Without affecting the lighting use of other LED modules, only this module needs to be replaced, which significantly reduces maintenance costs and increases convenience.

附图说明Description of drawings

图1为中国专利申请号200910101200.5的一种LED路灯的实施例结构图;Fig. 1 is a structural diagram of an embodiment of an LED street lamp with Chinese patent application number 200910101200.5;

图2为本发明LED照明装置的一种实施例结构图;Fig. 2 is a structural diagram of an embodiment of the LED lighting device of the present invention;

图3为本发明LED模块的一种实施例分解图;Fig. 3 is an exploded view of an embodiment of the LED module of the present invention;

图4为本发明LED模块的一种实施例截面图;Fig. 4 is a cross-sectional view of an embodiment of the LED module of the present invention;

图5为本发明LED模块的一种实施例分解图;Fig. 5 is an exploded view of an embodiment of the LED module of the present invention;

图6为本发明LED模块的一种实施例分解图;Fig. 6 is an exploded view of an embodiment of the LED module of the present invention;

图7为本发明LED模块的一种实施例分解图;Fig. 7 is an exploded view of an embodiment of the LED module of the present invention;

图8为本发明另一LED照明装置的一种实施例分解图;Fig. 8 is an exploded view of an embodiment of another LED lighting device of the present invention;

图9为本发明另一LED照明装置的一种实施例整体图。Fig. 9 is an overall view of an embodiment of another LED lighting device of the present invention.

具体实施方式Detailed ways

以下结合附图,具体说明本发明。The present invention will be described in detail below in conjunction with the accompanying drawings.

请参见图2,其为本发明提出的一种LED照明装置结构示意图。本实施例的LED照明装置主要是由灯壳21和六个LED模块22组成,LED模块22设置在灯壳21上,而灯壳21则通过中轴的梁连接到灯杆23上,灯壳21和梁之间可通过卡接、滑槽、螺纹等多种方式相连。其中,本发明的特点在于每个LED模块22上均设置有多个散热通道24,散热通道24的存在可以使LED模块22内部形成空气对流,大大提高了整个LED照明装置的散热性能。另外,设置有散热通道24的LED模块22,配合LED模块22后端连接的散热器37,使本LED照明装置具备了很突出的散热效果。Please refer to FIG. 2 , which is a schematic structural diagram of an LED lighting device proposed by the present invention. The LED lighting device of this embodiment is mainly composed of a lamp housing 21 and six LED modules 22. The LED modules 22 are arranged on the lamp housing 21, and the lamp housing 21 is connected to the lamp post 23 through a central beam. 21 and the beam can be connected in multiple ways such as clamping, chute, screw thread and the like. Among them, the feature of the present invention is that each LED module 22 is provided with a plurality of heat dissipation channels 24, the existence of the heat dissipation channels 24 can form air convection inside the LED module 22, greatly improving the heat dissipation performance of the entire LED lighting device. In addition, the LED module 22 provided with the heat dissipation channel 24 cooperates with the heat sink 37 connected to the rear end of the LED module 22, so that the LED lighting device has a very prominent heat dissipation effect.

下面对单个LED模块22的结构进行介绍,如图3所示,其分别为本发明LED模块的一种实施例分解图和整体图,此LED模块22包括电路板31、密封圈32、透镜组33和透光罩34,透镜组33和透光罩34共同构成了LED模块22的透光单元,其中电路板31上焊接有二十四颗LED颗粒35,透镜组33和透光罩34均覆盖在电路板31的LED颗粒35上。其中,电路板31、透镜组33和透光罩34上均设置有位置相对应的多个散热通孔36,且位置相对应的散热通孔36可以形成贯通LED模块22的散热通道24。散热通孔36以“十字”的形状排布,从而散热通孔36便将LED颗粒35划分成四个部分,且每个部分中包含六颗LED颗粒35。The structure of a single LED module 22 is introduced below, as shown in Figure 3, which are respectively an exploded view and an overall view of an embodiment of the LED module of the present invention, the LED module 22 includes a circuit board 31, a sealing ring 32, a lens The group 33 and the light-transmitting cover 34, the lens group 33 and the light-transmitting cover 34 together constitute the light-transmitting unit of the LED module 22, wherein twenty-four LED particles 35 are welded on the circuit board 31, the lens group 33 and the light-transmitting cover 34 All are covered on the LED particles 35 of the circuit board 31 . Wherein, the circuit board 31 , the lens group 33 and the translucent cover 34 are provided with a plurality of corresponding heat dissipation through holes 36 , and the corresponding position of the heat dissipation through holes 36 can form the heat dissipation channel 24 through the LED module 22 . The heat dissipation through holes 36 are arranged in a “cross” shape, so that the heat dissipation through holes 36 divide the LED particles 35 into four parts, and each part contains six LED particles 35 .

在实际工作过程中,每部分的LED颗粒35都会散发一定热量,电路板内部热量尤为集中,散热通孔36的存在,使相邻两部分的LED颗粒35之间互相烘烤的通道被打断,从而减少相邻部分LED颗粒35之间的热传导,因此有效地降低了工作温度。并且,电路板31连接到散热器37基座,而散热器37上相同位置也设置有散热通孔36,LED模块22的散热通道24中产生空气对流,热空气上升,冷空气从下方补进来,带走大量的热量,使得散热通道24中的热流能有效地散发到空气中,并使LED模块22散热效果大大提高了一个层次。In the actual working process, each part of the LED particles 35 will emit a certain amount of heat, and the heat inside the circuit board is particularly concentrated. The existence of the heat dissipation through hole 36 interrupts the mutual baking channel between the two adjacent parts of the LED particles 35 , thereby reducing the heat conduction between adjacent LED particles 35, thus effectively reducing the working temperature. Moreover, the circuit board 31 is connected to the base of the heat sink 37, and the same position on the heat sink 37 is also provided with a heat dissipation through hole 36, air convection is generated in the heat dissipation channel 24 of the LED module 22, hot air rises, and cold air comes in from below , taking away a large amount of heat, so that the heat flow in the heat dissipation channel 24 can be effectively dissipated into the air, and the heat dissipation effect of the LED module 22 is greatly improved to a higher level.

由于在LED模块22中的各部分都开设了散热通孔36,因此为了保证LED模块22的密封性,本实施例还在电路板31的散热通孔36位置设置了密封圈32,并利用透光罩34压合在电路板31上,且密封圈32上也同样设置有相应的散热通孔36,以保证热空气的流通。Since each part of the LED module 22 has a heat dissipation through hole 36, in order to ensure the sealing of the LED module 22, this embodiment also sets a sealing ring 32 at the position of the heat dissipation through hole 36 of the circuit board 31, and uses a transparent The photomask 34 is pressed onto the circuit board 31 , and the sealing ring 32 is also provided with corresponding heat dissipation through holes 36 to ensure the circulation of hot air.

另外,为了进一步提高LED模块22的结构强度和密封性,可以在散热通孔36中穿伸通管101,如图4所示,通管101可以从固定边框74和密封圈32上长起,朝着LED模块22内部,穿过电路板31,并与散热器37的基座接触。而设置通管101后,单个LED模块22可以通过通管101来定位安装,令安装更加便捷。In addition, in order to further improve the structural strength and sealing performance of the LED module 22, the through-pipe 101 can be extended through the heat-dissipating through-hole 36, as shown in FIG. Towards the inside of the LED module 22 , passes through the circuit board 31 , and contacts the base of the heat sink 37 . After the through pipe 101 is provided, a single LED module 22 can be positioned and installed through the through pipe 101 , making the installation more convenient.

图3的LED模块22揭示了本发明一种较佳的实施方式,但并不以此限制本发明,LED模块22的具体结构可以根据需要进行调整。例如,散热通孔36的形状除了“十字”形,也可以是其它线性行列的排布形式,如“X”形、“‖形、“=”形等;电路板31上焊接的LED颗粒35的数量也可以根据实际需要来调整;散热通孔36的数量则可以根据LED颗粒35的数量来开设,只要在LED颗粒35数量>=2时就可考虑打孔;一个LED模块22可以配置一个散热器37,同样也可以是多个LED模块22共同配置连接到同一个散热器37;散热器37上散热鳍片的形状可以根据实际需要来设置,如散热鳍片可以是根据空气流动及产品造型而设置成一定弧度的形状。The LED module 22 in FIG. 3 discloses a preferred embodiment of the present invention, but does not limit the present invention, and the specific structure of the LED module 22 can be adjusted as required. For example, in addition to the "cross" shape, the shape of the heat dissipation through hole 36 can also be arranged in other linear rows and columns, such as "X" shape, "∥ shape, "=" shape, etc.; the LED particles 35 welded on the circuit board 31 The quantity can also be adjusted according to actual needs; the quantity of heat dissipation through holes 36 can be opened according to the quantity of LED particles 35, as long as the quantity of LED particles 35>=2, just can consider drilling; one LED module 22 can be configured with one The heat sink 37 can also be configured and connected to the same heat sink 37 by a plurality of LED modules 22; The shape is set into a certain arc shape.

在此,申请人还揭示了LED模块的其它几种典型结构。图5中,电路板31上焊接有十六颗LED颗粒35,而散热通孔36形成一个“十字”和一个“口字”相结合的形状,并将电路板31的每颗LED颗粒35均分隔开来,从而达到强效散热的效果。图6中,将透镜组集合到透光罩上,通过一体成型的方式做成带有透镜的透光罩64,提高透光率的同时节约了生产成本。图7中,采用透镜组33和固定边框74的组合来代替透镜组33和透光罩34的组合,其可以达到两个技术效果:其一,固定边框74可采用多种材料多种外观,可赋予LED照明装置更多的外观设计元素;其二,降低了透光部件的开模成本与难度。Here, the applicant also discloses several other typical structures of the LED module. In Fig. 5, sixteen LED particles 35 are welded on the circuit board 31, and the heat dissipation through hole 36 forms a shape combining a "cross" and a "word", and each LED particle 35 of the circuit board 31 is Separated to achieve a strong heat dissipation effect. In FIG. 6 , the lens group is assembled on the light-transmitting cover, and the light-transmitting cover 64 with lenses is formed by integral molding, which improves light transmittance and saves production cost. In Fig. 7, the combination of the lens group 33 and the fixed frame 74 is used to replace the combination of the lens group 33 and the translucent cover 34, which can achieve two technical effects: firstly, the fixed frame 74 can adopt various materials and various appearances, It can endow the LED lighting device with more appearance design elements; secondly, it reduces the mold-making cost and difficulty of the light-transmitting parts.

采用LED模块的LED照明装置有利于拆装维护,当然,本发明的通孔结构同样也可以应用在单一LED整灯光源22的LED照明装置上。为此,本发明还提出了一种LED照明装置,如图8和图9所示,其分别是本发明LED照明装置的一种实施例分解图和整体图。此LED照明装置的灯壳由前盖81和后盖82拼接而成,灯壳的下端设置有灯杆孔83,用来安装灯杆。灯壳内部设置有一个LED整灯光源和一个散热器84,LED整灯光源连接到散热器84的背部。其中,LED整灯光源又是由一块电路板85、一个透光板86和一个密封圈87构成,电路板85上焊接有多颗LED颗粒88,而电路板85、透光板86、密封圈87上均设置有位置相对应的散热通孔89,并形成多个散热通道。The LED lighting device using the LED module is beneficial for disassembly and maintenance. Of course, the through-hole structure of the present invention can also be applied to the LED lighting device with a single LED light source 22 . To this end, the present invention also proposes an LED lighting device, as shown in FIG. 8 and FIG. 9 , which are respectively an exploded view and an overall view of an embodiment of the LED lighting device of the present invention. The lamp housing of this LED lighting device is formed by splicing a front cover 81 and a rear cover 82 , and a lamp pole hole 83 is provided at the lower end of the lamp housing for installing a lamp pole. An LED light source and a radiator 84 are arranged inside the lamp housing, and the LED light source is connected to the back of the radiator 84 . Among them, the whole LED light source is composed of a circuit board 85, a light-transmitting plate 86 and a sealing ring 87. There are many LED particles 88 welded on the circuit board 85, and the circuit board 85, the light-transmitting plate 86, the sealing ring 87 are provided with corresponding heat dissipation through holes 89, and form a plurality of heat dissipation channels.

本实施例中,散热通道是排列成“十字”形状(也可以是其它的线性排布方式),并将电路板85上的LED颗粒88分隔成四个部分,因此,在LED照明装置工作过程中,相邻部分LED所产生的热量会在散热通道中形成空气对流,并通过散热器84散发到空气中,从而大大提高了LED照明装置的散热效果,并可以有效延长其使用寿命。In this embodiment, the heat dissipation channels are arranged in a "cross" shape (other linear arrangements are also possible), and the LED particles 88 on the circuit board 85 are divided into four parts. Therefore, during the working process of the LED lighting device Among them, the heat generated by the adjacent parts of the LED will form air convection in the heat dissipation channel, and be dissipated into the air through the heat sink 84, thereby greatly improving the heat dissipation effect of the LED lighting device and effectively prolonging its service life.

本发明在LED模块或LED整灯光源中的电路板及透光部件上开设散热通孔,使内部相邻LED之间形成空气对流,并减少相邻部分LED之间的热传导,有效地降低了LED照明装置的工作温度,因而大大增加了其使用寿命。The present invention provides heat dissipation through holes on the circuit board and light-transmitting parts of the LED module or the LED light source, so that air convection is formed between the adjacent LEDs inside, and the heat conduction between the adjacent LEDs is reduced, effectively reducing the heat dissipation. The operating temperature of the LED lighting device, thus greatly increasing its service life.

以上公开的仅为本发明的几个具体实施例,但本发明并非局限于此,任何本领域的技术人员能思之的变化,都应落在本发明的保护范围内。The above disclosures are only a few specific embodiments of the present invention, but the present invention is not limited thereto, and any changes conceivable by those skilled in the art should fall within the protection scope of the present invention.

Claims (10)

1. LED lighting device, comprise a lamp housing (21), it is characterized in that, it also comprises at least two led modules (22), those led modules (22) are arranged in this lamp housing (21), and each led module (22) comprises a circuit board (31) and a printing opacity unit again, this circuit board (31) is provided with some LED particles (35), this printing opacity unit covers on the LED particle (35) of this circuit board (31), and be provided with a plurality of heat radiation through holes (36) of position correspondence on this circuit board (31) and this printing opacity unit, and form a plurality of heat dissipation channels.
2. LED lighting device as claimed in claim 1 is characterized in that, those heat radiation through holes (36) are linearity and are arranged on this circuit board (31) and this printing opacity unit, and the LED of inside is divided into several portions.
3. LED lighting device as claimed in claim 1, it is characterized in that, it also comprises a radiator (37), this radiator (37) is provided with fin smooth or that radian is arranged, this radiator (37) pedestal is provided with corresponding heat radiation through hole (36), and those led modules (22) all link to each other with this radiator (37).
4. LED lighting device as claimed in claim 1, it is characterized in that, it also comprises at least two radiators (37), the quantity of this radiator (37) is corresponding with the quantity of this led module (22), each radiator (37) is provided with fin smooth or that radian is arranged, and each radiator (37) pedestal is provided with corresponding heat radiation through hole (36), and each led module (22) links to each other with one radiator (37).
5. LED lighting device as claimed in claim 1 is characterized in that, siphunculus has all stretched through in the heat dissipation channel of each led module (22).
6. LED lighting device as claimed in claim 1, it is characterized in that, each led module (22) also comprises a sealing ring (32), and sealing circle (32) is arranged on circuit board (31) position of a circle and heat radiation through hole (36) all around, and also is provided with corresponding through hole on the sealing circle (32).
7. led module, and at least two led modules (22) are co-located in the LED lighting device, it is characterized in that, this led module (22) comprises a circuit board (31) and a printing opacity unit, this circuit board (31) is provided with some LED particles (35), this printing opacity unit covers on the LED particle (35) of this circuit board (31), and is provided with a plurality of heat radiation through holes (36) of position correspondence on this circuit board (31) and this printing opacity unit, and forms a plurality of heat dissipation channels.
8. led module as claimed in claim 7 is characterized in that, those heat radiation through holes (36) are arranged on this circuit board (31) and this printing opacity unit with linearity, and the LED of inside is divided into several portions.
9. LED lighting device, comprise that a lamp housing and a LED put in order lamp source, the whole lamp source inside of this LED is provided with a circuit board (85) and a light-passing board (86), this circuit board (85) is provided with plurality of LEDs particle (88), this light-passing board (86) covers on the LED particle (88) of this circuit board (85), it is characterized in that this circuit board (85) and this light-passing board (86) are provided with a plurality of heat radiation through holes (89), and form a plurality of heat dissipation channels.
10. LED lighting device as claimed in claim 9 is characterized in that, those heat radiation through holes (89) are linear array and are arranged on this circuit board (85) and this light-passing board (86), and the LED of inside is divided several portions.
CN201010105226A 2009-05-14 2010-02-03 LED illuminator and LED modules Pending CN101761807A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201010105226A CN101761807A (en) 2009-05-14 2010-02-03 LED illuminator and LED modules
PCT/CN2010/072712 WO2010130212A1 (en) 2009-05-14 2010-05-13 Led illuminator and led module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200910098765.2 2009-05-14
CN201010105226A CN101761807A (en) 2009-05-14 2010-02-03 LED illuminator and LED modules

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102661552A (en) * 2012-05-19 2012-09-12 天台县海威机电有限公司 Integral light-emitting diode (LED) street lamp module
CN102809076A (en) * 2012-08-10 2012-12-05 浙江海威照明科技有限公司 One-piece LED module
CN103175000A (en) * 2012-11-02 2013-06-26 杭州华普永明光电股份有限公司 Light-emitting diode (LED) illuminating device and grading method thereof
CN103557446A (en) * 2013-10-11 2014-02-05 浙江星碧照明科技有限公司 LED (light emitting diode) module

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102661552A (en) * 2012-05-19 2012-09-12 天台县海威机电有限公司 Integral light-emitting diode (LED) street lamp module
CN102661552B (en) * 2012-05-19 2015-06-17 浙江海威照明科技有限公司 Integral light-emitting diode (LED) street lamp module
CN102809076A (en) * 2012-08-10 2012-12-05 浙江海威照明科技有限公司 One-piece LED module
CN103175000A (en) * 2012-11-02 2013-06-26 杭州华普永明光电股份有限公司 Light-emitting diode (LED) illuminating device and grading method thereof
CN103557446A (en) * 2013-10-11 2014-02-05 浙江星碧照明科技有限公司 LED (light emitting diode) module
CN103557446B (en) * 2013-10-11 2015-07-29 王丽娜 A kind of LED module

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