CN101745989A - Double-station multiwire wafer cutting machine controlled by microcomputer - Google Patents
Double-station multiwire wafer cutting machine controlled by microcomputer Download PDFInfo
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- CN101745989A CN101745989A CN 201010118972 CN201010118972A CN101745989A CN 101745989 A CN101745989 A CN 101745989A CN 201010118972 CN201010118972 CN 201010118972 CN 201010118972 A CN201010118972 A CN 201010118972A CN 101745989 A CN101745989 A CN 101745989A
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Abstract
The invention discloses a double-station multiwire wafer cutting machine controlled by a microcomputer, which comprises a stand, worktables, a metal wire, rotating rollers, a pay-off mechanism, a winding displacement mechanism, a wind-up mechanism, a main substrate programmable control CPU module, a touch display screen, a servo amplifier and a servo motor. The stand is internally provided with a lower worktable and an upper worktable which are opposite to each other; a pair of parallel rotating rollers is arranged between the lower worktable and the upper worktable and arranged on a roller shaft; and the two rotating rollers are driven by the roller servo motor to rotate. Since the two worktables are arranged in one machine, compared with the traditional single-station multiwire wafer cutting machine, the working efficiency of the invention is improved by two times.
Description
Technical field
The present invention relates to a kind of wire cutting machine, refer in particular to a kind of microcomputer control multiline wafer cutting machine.
Background technology
Quartz-crystal resonator is the Primary Component of electronics and IT products, is widely used in a plurality of fields such as electronics, communication, Aeronautics and Astronautics, industrial equipment, instrument and meter, household electrical appliance.At present, what quartz crystal was cut into that quartz wafer generally uses is multi-cutting machine, as Chinese patent disclosed a kind of " quartz crystal multi-cutting machine bed " (China, notification number CN2298115Y, day for announcing 1998.11.25), it comprises bedstead, and worktable lifting is located constant device, the machine driving cutter sweep, sanding device, lubricating arrangement and control device are formed, and characteristics are, the positioning guide column that described worktable lifting is located constant device is three, take post as the leading factor for one, in addition two is secondary guide pillar, they respectively with linear bearing for movingly, the major-minor guide pillar is respectively through lower cover, and lifting support is connected as a single entity.This multi-cutting machine, because cutting accuracy is low, the differential seat angle of wafer (angle second) does not reach requirement, and the raw material loss is big, and efficient is low, and cutting 48 crystal bars (whenever pulling) needs 48 hours.
The applicant had once designed a kind of " microcomputer control crystal wire electrode cutting machine " (China, notification number CN2597171Y, day for announcing 2004.01.07), it comprises frame, the wrapping wire cylinder group, workbench, reduction box and differential round side steering, wire, anchor clamps, stirring wheel, send sand pump, its control section adopts computer, it is characterized in that the wrapping wire cylinder group comprises a drive roll and two passive cylinders, in the frame front wrapping wire cylinder group and workbench are set, the back side is provided with beat arm and tension compensating wheel, left surface is provided with actinobacillus wheel and take-up pulley, and some cabling directive wheels are sent wire and returned take-up pulley via the wrapping wire cylinder group and form a wire path by actinobacillus wheel.Its operation is directly perceived, easy, reliable and stable, coordination, and wire is installed, workpiece is easy for installation, is applicable to cutting silicon single crystal body, quartz crystal, pottery, jewel and various hard material, can be widely used in radio and electronic component industry.Though its cutting accuracy is greatly improved, owing to adopt the main transmission of mechanical reduction case, operating efficiency is not high yet.
The applicant had once designed a kind of " microcomputer control multiline cutting machine " (China, publication number CN101301734A, open day 2008.11.12), it comprises frame, workbench, metal wire, the lapping liquid feed mechanism, its control section adopts its parameter of main substrate programming Control CPU module by the touch display screen setting, and by optical fiber control servo amplifier, servo amplifier control servomotor, six servo amplifiers and six servomotors are housed in the frame at least, control worktable lifting respectively, three rotation rollers, actinobacillus wheel, the laying tension sensor, take-up pulley, the takeup tension sensor, the lapping liquid feed mechanism is drawn the centre of its outlet of diamond dust liquid jet pipe at three rotation isosceles triangles that roller is, metal wire comes out through the laying tension sensor from actinobacillus wheel, parallel around hundreds of circle formation cut surface on three rotation rollers, utilize the rotating speed/direction of main substrate programming Control CPU module controls servomotor, thereby make rotation roller and take-up pulley, unwrapping wire crop rotation reciprocating rotating.Its cutting accuracy and high efficiency.But owing to have only single station, the operating efficiency of complete machine is also not very good.
Summary of the invention
The object of the present invention is to provide a kind of double-station multiwire wafer cutting machine controlled by microcomputer, its operating efficiency has had large increase.
For achieving the above object, the solution that the present invention takes is: a kind of double-station multiwire wafer cutting machine controlled by microcomputer, it comprises frame, workbench, metal wire, the rotation roller, payingoff mechanism, wire-arranging mechanism, take-up mechanism, main substrate programming Control CPU module, touch display screen, servo amplifier, servomotor, relative lower table and upper table are housed in the frame, it between lower table and the upper table a pair of rotation roller arranged side by side, the rotation roller is installed on the roller shaft, and a roller servomotor drives the rotation of two rotation rollers by belt pulley.
This double-station multiwire wafer cutting machine controlled by microcomputer adopts main substrate programming Control CPU module, main substrate programming Control CPU module parameter is by the touch display screen setting, main substrate programming Control CPU module is controlled servo amplifier by optical fiber, directly reading locator data operates, rotating speed/the direction and the hi-Fix of control servomotor, thereby control rotation roller, payingoff mechanism, wire-arranging mechanism, take-up mechanism, make the hundreds of wires make at a high speed (350-450 rice/minute) and move back and forth, wafer (workpiece) is cut.Owing in a machine two workbench (lower table and upper table) are set, to compare with the wafer cutting machine of existing single station, the rotation roller has reduced one than prior art, and the work operating efficiency has improved twice.
Description of drawings
Fig. 1 is the fundamental diagram of present embodiment.
Fig. 2 is the main TV structure schematic diagram of present embodiment.
Fig. 3 is the side-looking structural representation of present embodiment.
Among the figure: 1, touch display screen, 2, main substrate programming Control CPU module, 3, the actinobacillus wheel servo amplifier, 4, the actinobacillus wheel servomotor, 5, actinobacillus wheel, 6, laying tension motion controller servo amplifier, 7, laying tension motion controller servomotor, 8, the laying tension motion controller, 9, unwrapping wire load sensor servo amplifier, 10, the unwrapping wire load sensor, 11, lower table, 12, the lower table servo amplifier, 13, the lower table servomotor, 14, the rotation roller, 15, rotation roller servo amplifier, 16, rotation roller servomotor, 17, the take-up load sensor, 18, take-up load sensor servo amplifier, 19, take-up load sensor servomotor, 20, take-up pulley, 21, the take-up pulley servo amplifier, 22, the take-up pulley servomotor, 23, takeup tension motion controller servo amplifier, 24, takeup tension motion controller servomotor, 25, the takeup tension motion controller, 26, metal wire, 27, upper table, 28, the upper table servo amplifier, 29, the upper table servomotor, 30, frame, 31, roller shaft, 32, unwrapping wire load sensor servomotor, 33, glass pulley, 34, the glass pulley servomotor, 35, the glass pulley servo amplifier.
The specific embodiment
Below in conjunction with embodiment and accompanying drawing thereof the present invention is remake description.
Referring to Fig. 1-Fig. 3, a kind of double-station multiwire wafer cutting machine controlled by microcomputer, it comprises frame 30, workbench, metal wire 26, rotation roller 14, payingoff mechanism, wire-arranging mechanism, take-up mechanism, main substrate programming Control CPU module 2, touch display screen 1, servo amplifier, servomotor, relative lower table 11 and upper table 27 are housed in the frame 30, it between lower table 11 and the upper table 27 a pair of rotation roller 14 arranged side by side, rotation roller 14 is installed on the roller shaft 31, and a roller servomotor 16 drives two rotation roller 14 rotations by belt pulley.
Referring to Fig. 1-Fig. 3, described lower table 11 is by 13 controls of lower table servomotor, lower table servomotor 13 is by 12 controls of lower table servo amplifier, described upper table 27 is by 29 controls of upper table servomotor, and upper table servomotor 29 is by 28 controls of upper table servo amplifier.
Referring to Fig. 1-Fig. 3, described roller servomotor 16 is by 15 controls of rotation roller servo amplifier.
Referring to Fig. 1-Fig. 3, described payingoff mechanism is by actinobacillus wheel 5, laying tension motion controller 8, unwrapping wire load sensor 10 constitutes, actinobacillus wheel 5 is by 4 controls of actinobacillus wheel servomotor, actinobacillus wheel servomotor 4 is by 3 controls of actinobacillus wheel servo amplifier, laying tension motion controller 8 is by 7 controls of laying tension motion controller servomotor, laying tension motion controller servomotor 7 is by 9 controls of laying tension motion controller servo amplifier, unwrapping wire load sensor 10 is by 32 controls of unwrapping wire load sensor servomotor, and unwrapping wire load sensor servomotor 32 is by 9 controls of unwrapping wire load sensor servo amplifier; Described take-up mechanism is by take-up pulley 20, takeup tension motion controller 25, take-up load sensor 17 constitutes, take-up pulley 20 is by 22 controls of take-up pulley servomotor, take-up pulley servomotor 22 is by 21 controls of take-up pulley servo amplifier, takeup tension motion controller 25 is by 24 controls of takeup tension motion controller servomotor, takeup tension motion controller servomotor 24 is by 23 controls of takeup tension motion controller servo amplifier, take-up load sensor 17 is by 19 controls of take-up load sensor servomotor, and take-up load sensor servomotor 19 is by 18 controls of take-up load sensor servo amplifier.It has compared with prior art increased laying tension motion controller 8 and takeup tension motion controller 25, more effectively keeps the constant of metal wire 26 tension force, has improved cut quality.
Referring to Fig. 1-Fig. 3, described wire-arranging mechanism is prepended to take-up mechanism, it comprises glass pulley 33, glass pulley servomotor 34, glass pulley servo amplifier 35, and the wire-arranging mechanism among " microcomputer control multiline cutting machine " (publication number CN101301734A) of the structure of wire-arranging mechanism and effect and the applicant's design is the same.
Claims (4)
1. double-station multiwire wafer cutting machine controlled by microcomputer, it comprises frame (30), workbench, metal wire (26), rotation roller (14), payingoff mechanism, wire-arranging mechanism, take-up mechanism, main substrate programming Control CPU module (2), touch display screen (1), servo amplifier, servomotor, it is characterized in that: relative lower table (11) and upper table (27) are housed in the frame (30), it between lower table (11) and the upper table (27) a pair of rotation roller (14) arranged side by side, rotation roller (14) is installed on the roller shaft (31), and a roller servomotor (16) drives two rotation rollers (14) rotation by belt pulley.
2. double-station multiwire wafer cutting machine controlled by microcomputer according to claim 1, it is characterized in that: described lower table (11) is controlled by lower table servomotor (13), lower table servomotor (13) is controlled by lower table servo amplifier (12), described upper table (27) is by upper table servomotor (29) control, and upper table servomotor (29) is controlled by upper table servo amplifier (28).
3. double-station multiwire wafer cutting machine controlled by microcomputer according to claim 1 is characterized in that: described roller servomotor (16) is by rotation roller servo amplifier (15) control.
4. double-station multiwire wafer cutting machine controlled by microcomputer according to claim 1, it is characterized in that: described payingoff mechanism is by actinobacillus wheel (5), laying tension motion controller (8), unwrapping wire load sensor (10) constitutes, actinobacillus wheel (5) is controlled by actinobacillus wheel servomotor (4), actinobacillus wheel servomotor (4) is controlled by actinobacillus wheel servo amplifier (3), laying tension motion controller (8) is controlled by laying tension motion controller servomotor (7), laying tension motion controller servomotor (7) is controlled by laying tension motion controller servo amplifier (9), unwrapping wire load sensor (10) is by unwrapping wire load sensor servomotor (32) control, and unwrapping wire load sensor servomotor (32) is controlled by unwrapping wire load sensor servo amplifier (9); Described take-up mechanism is by take-up pulley (20), takeup tension motion controller (25), take-up load sensor (17) constitutes, take-up pulley (20) is controlled by take-up pulley servomotor (22), take-up pulley servomotor (22) is controlled by take-up pulley servo amplifier (21), takeup tension motion controller (25) is controlled by takeup tension motion controller servomotor (24), takeup tension motion controller servomotor (24) is controlled by takeup tension motion controller servo amplifier (23), take-up load sensor (17) is by take-up load sensor servomotor (19) control, and take-up load sensor servomotor (19) is controlled by take-up load sensor servo amplifier (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101189722A CN101745989B (en) | 2010-03-04 | 2010-03-04 | Double-station multiwire wafer cutting machine controlled by microcomputer |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010101189722A CN101745989B (en) | 2010-03-04 | 2010-03-04 | Double-station multiwire wafer cutting machine controlled by microcomputer |
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| CN101745989A true CN101745989A (en) | 2010-06-23 |
| CN101745989B CN101745989B (en) | 2011-11-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010101189722A Expired - Fee Related CN101745989B (en) | 2010-03-04 | 2010-03-04 | Double-station multiwire wafer cutting machine controlled by microcomputer |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102626956A (en) * | 2012-02-14 | 2012-08-08 | 上海五同机械制造有限公司 | Silicon wafer cutting equipment with function of automatic tension adjustment |
| CN102794784A (en) * | 2012-08-09 | 2012-11-28 | 山东水星博惠汽车部件股份有限公司 | Dual-station cutting machine tool |
| CN113941942A (en) * | 2021-11-04 | 2022-01-18 | 烟台力凯数控科技有限公司 | Ultrasonic vibration consolidation diamond wire cutting composite processing equipment and processing method for magnetic neodymium iron boron |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH09193143A (en) * | 1996-01-24 | 1997-07-29 | Sharp Corp | Shaving and cutting method for semiconductor block |
| CN2597171Y (en) * | 2003-02-16 | 2004-01-07 | 周文敏 | Microcomputer controlled crystal linear cutting machine |
| CN101209572A (en) * | 2007-12-24 | 2008-07-02 | 湖南宇晶机器实业有限公司 | Multi-line cutting machine |
| CN201095134Y (en) * | 2007-08-30 | 2008-08-06 | 宁波科宁达工业有限公司 | Multi-line cutting machine working bench device |
| CN201609933U (en) * | 2010-03-04 | 2010-10-20 | 周文敏 | Microcomputer control double-station multi-wire wafer saw |
-
2010
- 2010-03-04 CN CN2010101189722A patent/CN101745989B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09193143A (en) * | 1996-01-24 | 1997-07-29 | Sharp Corp | Shaving and cutting method for semiconductor block |
| CN2597171Y (en) * | 2003-02-16 | 2004-01-07 | 周文敏 | Microcomputer controlled crystal linear cutting machine |
| CN201095134Y (en) * | 2007-08-30 | 2008-08-06 | 宁波科宁达工业有限公司 | Multi-line cutting machine working bench device |
| CN101209572A (en) * | 2007-12-24 | 2008-07-02 | 湖南宇晶机器实业有限公司 | Multi-line cutting machine |
| CN201609933U (en) * | 2010-03-04 | 2010-10-20 | 周文敏 | Microcomputer control double-station multi-wire wafer saw |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102626956A (en) * | 2012-02-14 | 2012-08-08 | 上海五同机械制造有限公司 | Silicon wafer cutting equipment with function of automatic tension adjustment |
| CN102794784A (en) * | 2012-08-09 | 2012-11-28 | 山东水星博惠汽车部件股份有限公司 | Dual-station cutting machine tool |
| CN113941942A (en) * | 2021-11-04 | 2022-01-18 | 烟台力凯数控科技有限公司 | Ultrasonic vibration consolidation diamond wire cutting composite processing equipment and processing method for magnetic neodymium iron boron |
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| Publication number | Publication date |
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| CN101745989B (en) | 2011-11-09 |
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Granted publication date: 20111109 Termination date: 20160304 |