CN101686606A - 线路板 - Google Patents
线路板 Download PDFInfo
- Publication number
- CN101686606A CN101686606A CN200810168067A CN200810168067A CN101686606A CN 101686606 A CN101686606 A CN 101686606A CN 200810168067 A CN200810168067 A CN 200810168067A CN 200810168067 A CN200810168067 A CN 200810168067A CN 101686606 A CN101686606 A CN 101686606A
- Authority
- CN
- China
- Prior art keywords
- perforation
- wiring board
- bus plane
- layers
- aperture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008101680670A CN101686606B (zh) | 2008-09-23 | 2008-09-23 | 线路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008101680670A CN101686606B (zh) | 2008-09-23 | 2008-09-23 | 线路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101686606A true CN101686606A (zh) | 2010-03-31 |
CN101686606B CN101686606B (zh) | 2011-06-22 |
Family
ID=42049480
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008101680670A Expired - Fee Related CN101686606B (zh) | 2008-09-23 | 2008-09-23 | 线路板 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101686606B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112738998A (zh) * | 2020-10-23 | 2021-04-30 | 广东科翔电子科技股份有限公司 | 一种线路板微导通孔加工工艺 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1220412C (zh) * | 2002-07-31 | 2005-09-21 | 威盛电子股份有限公司 | 多层电路板的层间配置结构 |
EP1589798A4 (en) * | 2003-01-31 | 2007-11-28 | Fujitsu Ltd | MULTILAYER CONDUCTOR PLATE, ELECTRONIC DEVICE AND ASSEMBLY PROCESS |
-
2008
- 2008-09-23 CN CN2008101680670A patent/CN101686606B/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112738998A (zh) * | 2020-10-23 | 2021-04-30 | 广东科翔电子科技股份有限公司 | 一种线路板微导通孔加工工艺 |
CN112738998B (zh) * | 2020-10-23 | 2022-04-29 | 广东科翔电子科技股份有限公司 | 一种线路板微导通孔加工工艺 |
Also Published As
Publication number | Publication date |
---|---|
CN101686606B (zh) | 2011-06-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CB03 | Change of inventor or designer information |
Inventor after: Tang Jinsong Inventor before: Liu Yan Inventor before: Yang Shumin |
|
CB03 | Change of inventor or designer information | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170421 Address after: Hunan Province, Yueyang City, Yueyang city Shengxin Road West, room 1710 Patentee after: Hunan Gezhi Control Technology Co. Address before: Taipei City, Taiwan Chinese Shilin District Hougang Street No. 66 Patentee before: Yingda Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110622 Termination date: 20210923 |
|
CF01 | Termination of patent right due to non-payment of annual fee |