CN101660882A - 散热片的制造方法及其结构 - Google Patents

散热片的制造方法及其结构 Download PDF

Info

Publication number
CN101660882A
CN101660882A CN 200810135534 CN200810135534A CN101660882A CN 101660882 A CN101660882 A CN 101660882A CN 200810135534 CN200810135534 CN 200810135534 CN 200810135534 A CN200810135534 A CN 200810135534A CN 101660882 A CN101660882 A CN 101660882A
Authority
CN
Grant status
Application
Patent type
Prior art keywords
heat
substrate
powder
manufacturing
method
Prior art date
Application number
CN 200810135534
Other languages
English (en)
Chinese (zh)
Inventor
阙山腾
Original Assignee
阙山腾
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

CN 200810135534 2008-08-29 2008-08-29 散热片的制造方法及其结构 CN101660882A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200810135534 CN101660882A (zh) 2008-08-29 2008-08-29 散热片的制造方法及其结构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200810135534 CN101660882A (zh) 2008-08-29 2008-08-29 散热片的制造方法及其结构

Publications (1)

Publication Number Publication Date
CN101660882A true true CN101660882A (zh) 2010-03-03

Family

ID=41789036

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200810135534 CN101660882A (zh) 2008-08-29 2008-08-29 散热片的制造方法及其结构

Country Status (1)

Country Link
CN (1) CN101660882A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102192489A (zh) * 2010-03-11 2011-09-21 骆俊光 高效率的散热装置
CN105344021A (zh) * 2015-11-07 2016-02-24 德化均能手造陶瓷有限公司 一种光波活血通络晶片

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102192489A (zh) * 2010-03-11 2011-09-21 骆俊光 高效率的散热装置
CN105344021A (zh) * 2015-11-07 2016-02-24 德化均能手造陶瓷有限公司 一种光波活血通络晶片

Similar Documents

Publication Publication Date Title
Kordas et al. Chip cooling with integrated carbon nanotube microfin architectures
JP2005200676A (ja) 複合材およびその製造方法
CN101478868A (zh) 散热装置及其制作方法
Appendino et al. Direct joining of CFC to copper
CN101315913A (zh) 一种轻质高导热效率的功率器的封装件
Dai et al. Influence of thermodynamics within molten pool on migration and distribution state of reinforcement during selective laser melting of AlN/AlSi10Mg composites
Moon et al. High performance multi-scaled nanostructured spectrally selective coating for concentrating solar power
JP2008300455A (ja) パワーモジュール
CN101661977A (zh) 一种用于大功率led封装的绝缘金属基板的制备方法
WO2001056736A2 (fr) Absorption modifiee par des matieres composites et combinaisons de matieres
CN1542166A (zh) 激光熔覆纳米陶瓷涂层抗裂的处理方法
JP2009026953A (ja) パワーモジュールの製造方法、パワーモジュール、車両用インバータ、及び車両
CN102145420A (zh) 一种异种合金激光深熔钎焊方法
CN101966587A (zh) 一种制备高性能热导管铜粉的方法
CN1546269A (zh) 铝基复合材料液相冲击扩散焊接新工艺
JP2005175006A (ja) 放熱体及びパワーモジュール
CN103935103A (zh) 一种石墨烯/金属复合板材的制备方法
CN102019543A (zh) 均温板及其制作方法
JP2011023475A (ja) 絶縁基板、絶縁回路基板、半導体装置、絶縁基板の製造方法及び絶縁回路基板の製造方法
CN101509650A (zh) 大功率led灯具导热散热装置、导热基座及制作工艺
US20100319895A1 (en) Heat spreader structure and method of manufacturing the same
CN201497248U (zh) 制冷装置及电子酒柜
JP2007194442A (ja) 半導体装置
CN102071332A (zh) 一种制备高体积分数金刚石增强铜基复合材料的方法
JP2004063898A (ja) 放熱材及びその製造方法

Legal Events

Date Code Title Description
C06 Publication
C10 Request of examination as to substance
C02 Deemed withdrawal of patent application after publication (patent law 2001)