CN101639170A - Lamp and lighting equipment - Google Patents

Lamp and lighting equipment Download PDF

Info

Publication number
CN101639170A
CN101639170A CN200910160870A CN200910160870A CN101639170A CN 101639170 A CN101639170 A CN 101639170A CN 200910160870 A CN200910160870 A CN 200910160870A CN 200910160870 A CN200910160870 A CN 200910160870A CN 101639170 A CN101639170 A CN 101639170A
Authority
CN
China
Prior art keywords
lamp
radiator
substrate
ignition
socket
Prior art date
Application number
CN200910160870A
Other languages
Chinese (zh)
Other versions
CN101639170B (en
Inventor
田中敏也
久安武志
大泽滋
Original Assignee
东芝照明技术株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2008196678 priority Critical
Priority to JP2008-196678 priority
Priority to JP2008196678A priority patent/JP5218751B2/en
Priority to JP2008303794A priority patent/JP5163896B2/en
Priority to JP2008-303794 priority
Priority to JP2008303794 priority
Application filed by 东芝照明技术株式会社 filed Critical 东芝照明技术株式会社
Publication of CN101639170A publication Critical patent/CN101639170A/en
Application granted granted Critical
Publication of CN101639170B publication Critical patent/CN101639170B/en

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238Arrangement or mounting of circuit elements integrated in the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/02Globes; Bowls; Cover glasses characterised by the shape
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

The present invention relates to a lamp and a lighting equipment. A plurality of LEDs are provided to an outer edge side of a center position of one main surface of an LED substrate main body in a deviated manner respectively. The wiring part including the connector receiving part and the wiring hole are provided at a position that overlaps the center position of the one main surface side of the LED substrate main body. Since the power feeding part is inserted into the wiring hole, the connection part and the connector receiving part can be easily connected and therefore it becomes possible toensure ease in assembly. Since the connector receiving part is kept away from each of the LEDs with substantially equal distance so that emitted light is hardly blocked, decrease in uniformity of light distribution can be suppressed.

Description

Lamp device and ligthing paraphernalia

Technical field

The present invention relates to a kind of lamp device and ligthing paraphernalia that possesses the device substrate that is disposing a plurality of light-emitting components.

Background technology

Before, about using light emitting diode (Light Emitting Diode, LED) the lamp device that is used as light-emitting component is LED lamp (lamp), for example opening the 2006-313718 communique as the Japan Patent spy discloses, the device substrate that circumference outside is installed with LED equably is that the LED substrate is installed in the distolateral of radiating part, and lampshade (globe) covers described LED substrate and is installed in the distolateral of radiating part.And, distolateral at another of this radiating part, inserted and contained the light a lamp accepting box (case) of ignition device of control of LED substrate, at the opposition side of the radiating part of this accepting box socket is installed.

When ignition device is connected with the LED substrate, consider assembleability, preferably will be connected in the LED substrate-side from the supply lines that the ignition device side derives, and, consider the connectivity of supply lines, preferably the front at supply lines is provided with connector portion, and this connector portion is connected with the connector shelf of LED substrate-side.

Yet this kind bulb type lamp has following problem points: connector shelf can block the light that sends from LED, and the uniformity of luminous intensity distribution might descend.

Summary of the invention

The objective of the invention is to, provide a kind of and can guarantee the easiness of assembling, lamp device and the ligthing paraphernalia that one side suppresses the inhomogeneity decline of luminous intensity distribution on the one hand.Comprise among the present invention: device substrate, possess the device substrate body, be configured in from the center of an interarea of this device substrate body to a plurality of light-emitting components and the wiring part of the position that the outer rim lateral deviation is moved respectively, this wiring part has with described light-emitting component is electrically connected and is connected support and is connected with this that support forms and the wiring hole of pass-through member substrate body adjacently, and at least a portion of described wiring part is to dispose with the center overlaid of an interarea side of device substrate body; Radiator, at one end side is installed with another interarea side of the device substrate body of device substrate closely; Socket, another that is installed in radiator is distolateral; And ignition device, possess power supply, and to the light-emitting component control of lighting a lamp, described power supply is housed between radiator and the socket, have supply lines and be connected in this supply lines front end and be connected the connecting portion that support is connected, and can insert and lead in the wiring hole.

Among the present invention, the lamp device can constitute the lamp device (A shape) of the akin bulb-shaped of shape of steeping with ordinary incandescent lamp, lamp device (R shape), the lamp device (G shape) of ball (ball) shape bulb-shaped and the lamp device (T shape) of cylindrical bulb shape etc. of reflection (reflx) shape bulb-shaped.And then, also can be the lamp device that constitutes the bulb-shaped of no lampshade.And the present invention is not limited to the akin lamp device of shape with the ordinary incandescent lamp bubble, also can be applicable to form the lamp device of other various face shapings, purposes.

The device substrate body for example is that the metal by good aluminium of thermal diffusivity etc. is formed.

Light-emitting component for example can be light emitting diode (LED), organic electroluminescent (Electroluminescence, EL) or semiconductor laser (laser) etc. with the light-emitting component as light emitting source such as semiconductor.Can select the essential number of light-emitting component according to the purposes of illumination.Light-emitting component preferably comes luminous with white, but also can carry out luminously according to the purposes of ligthing paraphernalia with redness, blueness, green etc., and then also shades of colour can be made up and constitute.

The center overlaid of an at least a portion of so-called wiring part and an interarea side of device substrate body and disposing, be meant the equitant position, center of an interarea side of the part that for example connects the either party in support and the wiring hole and device substrate body, perhaps connect the equitant position, center etc. of an interarea side of the part in the zone between support and the wiring hole and device substrate body.

Connecting support and for example be the mechanicalness with connector support etc. and keep the part of mechanism, in addition, also can be to insert supply lines and the part that is electrically connected as terminal board.

About power supply, for example keep under the situation of mechanism connecting the mechanicalness that support has connector support etc., can have the connecting portion that is connected with the connector support at the front end of supply lines, and connecting under the situation that support is a terminal board etc., can will be inserted into the front of the supply lines in this terminal board etc. as connecting portion.

Radiator for example preferably forms by containing at least a metal in the good aluminium of thermal conductivity (Al), copper (Cu), iron (Fe), the nickel (Ni).In addition, this radiator also can (silicone carbide, SiC) industrial materials of Denging and constituting also can be by the synthetic resin of high thermal conductive resin etc. and constitute by aluminium nitride (AlN), carborundum.Face shaping is preferably formed the akin shape of profile (silhouette) that diminish successively to the other end from an end for diameter and the neck portion ordinary incandescent lamp bubble, this has improved the utility ratio that is applied in the existing ligthing paraphernalia, but herein, close with the ordinary incandescent lamp bubble is not condition, is not limited to limited specific face shaping.

Ignition device comprises the lamp circuit of dc source of for example having constant current etc.

And, a plurality of light-emitting components are configured in respectively from the center of an interarea of device substrate body to the position that the outer rim lateral deviation is moved, and at least a portion that makes wiring part is positioned at the equitant position, center with an interarea side of device substrate body, described wiring part comprises: connect support, can connect the connecting portion that is connected with front end from the supply lines of ignition device; And wiring hole, with the described adjacent ground connection pass-through member of the support substrate body that is connected, and can insert logical for the power supply of ignition device, power supply is inserted led in the wiring hole, connect on the support, therefore thereby can easily connecting portion be connected to, can guarantee the easiness of assembling on the one hand, make on the one hand to connect support, be difficult for blocking the light that described each light-emitting component sends, thereby can suppress the inhomogeneity decline of luminous intensity distribution roughly equably away from each light-emitting component.

And among the present invention, radiator comprises and can insert logical inserting hole portion for the power supply of ignition device, under the state of a distolateral device substrate body that device substrate is installed of radiator, and the corresponding position of wiring hole that this inserting hole portion is positioned at this device substrate.

Inserting hole portion forms the toroidal that for example has with the roughly the same diameter dimension of wiring hole.

And, under the state of a distolateral device substrate body that device substrate is installed of radiator, with the corresponding position of the wiring hole of this device substrate inserting hole portion is being set, thus can be to insert from the supply lines of ignition device and lead in the radiator, and can make the distolateral contact area increase of device substrate body and radiator one via this inserting hole portion.

And, comprising accepting box among the present invention, this accepting box makes radiator and socket insulation, is configured between described radiator and the socket, and is accommodating ignition device.

Accepting box is preferably by having electric insulating quality and stable on heating synthetic resin, for example polybutylene terephthalate (PBT) (polybutylene terephthalate, PBT) constitute, but also can be by acrylic resin or acrylonitrile-styrene-butadiene copolymer (acrylonitrile butadienestyrene, ABS) other synthetic resin of Denging and constituting.The shape of this accepting box for example is preferably the cylinder that forms the end, but in order to reduce fee of material or to improve radiating effect etc., in the scope of not destroying electric insulation, for example also can be made of the cylinder that is provided with other openings such as clathrate, prism etc.

And, with ignition device accommodate be configured between radiator and the socket and make radiator and the accepting box of socket insulation in, thus, ignition device and radiator are insulated, and the configuration of ignition device becomes easy.

And, among the present invention, radiator at one end portion comprises the support that is disposing device substrate, comprise the housing recess that is disposing ignition device in the other end, in the part of accepting box, comprise the peristome that is communicated in housing recess, this accepting box disposes in the mode between the housing recess of ignition device and radiator, comprises heat conduction member among the present invention, and this heat conduction member forms thermally coupled via the peristome of accepting box with the surface of the housing recess of ignition device and radiator.

In order to improve thermal diffusivity, ignition device preferably constitutes substrate portion by the thermal conductivity good metal of for example aluminium etc. but also can constitute substrate portion by the member of glass epoxide (glass epoxy) material, paper phenol (paper phenol) material, glass composite nonmetal characters such as (glass composite), more can be waited by pottery (ceramics) to constitute substrate portion.And in order to realize miniaturization, ignition device is preferably roughly along the central axis direction of radiator and be provided in the housing recess, but herein, can be and the direction of orthogonality of center shaft also can set obliquely.And then the state that is setting the inside of ignition device in the housing recess of radiator can be airtight state, also can form in order to the heat radiation or the airport of discharge pressure etc. and the state of external communications.

Ignition device can be that configuration example converts the DC voltage of 24V to as the alternating voltage with 100V and is supplied to the device of the lamp circuit of light-emitting component.And ignition device also can be to have in order to semiconductor light-emitting elements is carried out the device of the light adjusting circuit of light modulation.

The heat conduction member preference is as good by thermal conductivity and have a stable on heating organic siliconresin (silicone resin) of electric insulating quality, the plastic adhesive of epoxy resin (epoxy resin) or polyurethane resin (urethane resin) etc. and constituting, and be filled into via the peristome of accepting box between the housing recess of ignition device and radiator to carry out thermally coupled, but the material of described heat conduction member is not limited to these synthetic resin, the thermal conductivity good metal of aluminium or copper etc. is connected between the housing recess of ignition device and radiator, also described metal can be made up with plastic adhesive and be connected.

And, when utilizing heat conduction member to come that the surface of ignition device and housing recess carried out thermally coupled, form the peristome that runs through accepting box, be communicated with not make the mode of heat insulation member between the surface of ignition device and housing recess.But, as long as can guarantee heat dispersion, then also can be peristome be connected but residual film down connects this film between the surface of described ignition device and housing recess, in a word, make the thermal conductivity of peristome better than the thermal conductivity of the other parts of accepting box.

And then, when utilizing heat conduction member to come that the surface of ignition device and housing recess carried out thermally coupled, for example also can on the surface of housing recess, form protuberance, or in ignition device, form protuberance, and then on the surface of ignition device and housing recess these both, form protuberance, make distance between the surface of ignition device and housing recess near connecting by these methods, thereby further improve thermal conductivity.

And, the present invention can provide a kind of lamp device, in the part of the accepting box between the housing recess of ignition device and radiator, forming the peristome that is communicated in housing recess, via this peristome and by heat conduction member thermally coupled is carried out on the surface of the housing recess of ignition device and radiator, make thus from the heat of ignition device generation and dispel the heat effectively, thereby can improve reliability.

And among the present invention, ignition device roughly is configured in the accepting box along the central axis direction of radiator, and housing recess has integratedly to the outstanding protuberance of ignition device, and heat conduction member is connected ignition device via peristome with protuberance.

Among the present invention, ignition device is roughly along the central axis direction of radiator and be configured in the accepting box, but also can be strictly with central axes set this ignition device, for example also can under with respect to the state of inclined, dispose this ignition device, in a word, with the wider plate face of the substrate portion of ignition device and the protuberance mode in opposite directions of housing recess, roughly set this ignition device and get final product along central axis direction.

And, also can make to the surface of the outstanding protuberance of ignition device and form concavity, or form jog, with the contact area of further increase and heat conduction member.

And, the present invention can provide a kind of lamp device, owing to ignition device roughly is configured in the accepting box along the central axis direction of radiator, therefore can constitute small-sized lamp device, and ignition device is positioned on the longitudinal direction, make wider area relative with the housing recess of radiator to, thereby can increase the area that is connected with heat conduction member, thus, can make from the heat of ignition device generation and more effectively dispel the heat, thereby improve reliability.

And, because housing recess forms to the outstanding protuberance of ignition device, therefore, can make the distance of ignition device and housing recess approaching, and can reduce the use amount of adhesive, thus also favourable aspect cost.

And, comprise among the present invention: the LED lamp that possesses the apparatus body of socket (socket) and socket is installed on the socket of this apparatus body.

Among the present invention, ligthing paraphernalia can be the Down lamp (down light) of the direct mount type of ceiling, ceiling hanging type or wall mount type, and then can be Down lamp of ceiling embedded type etc.Lampshade, shade (shade), reflector etc. can be installed on apparatus body be used as limitting the light body, the lamp device is exposed.And ligthing paraphernalia is not limited to 1 lamp device is installed on apparatus body, and a plurality of lamp devices also can be installed.And then, can also constitute the large-scale ligthing paraphernalia of office's facilities such as (office), professional usefulness etc.

And, can utilize the lamp device that is encased in the apparatus body, constitute and can guarantee the easiness of assembling on the one hand, suppress the inhomogeneity decline of luminous intensity distribution on the one hand and can improve the ligthing paraphernalia of reliability.

Description of drawings

Fig. 1 is the profilograph of the lamp device of expression first embodiment of the present invention.

Fig. 2 is the plane of the device substrate of described lamp device.

Fig. 3 is the side view of described lamp device.

Fig. 4 is the key diagram that the ligthing paraphernalia of schematically representing to be installed with described lamp device is arranged at the state of ceiling face.

Fig. 5 is the profilograph of the lamp device of expression second embodiment of the present invention.

Fig. 6 represents the lamp device of the 3rd embodiment of the present invention, and Fig. 6 A is a profilograph, and Fig. 6 B is the stereogram of accepting box.

Fig. 7 is the stereogram that the lamp device of Fig. 6 (having removed the state of circuit substrate) slit shearing is represented.

Fig. 8 is the chart of temperature of the ignition device of the temperature of ignition device of the described lamp device of expression and first precedent.

Fig. 9 represents the variation of described lamp device, Fig. 9 A is with first a variation incised notch part and the profilograph of expression, Fig. 9 B is with second a variation incised notch part and the profilograph of expression, Fig. 9 C is the stereogram of the protuberance in expression the 3rd variation, and Fig. 9 D is the stereogram of the protuberance in expression the 4th variation.

11: bulb type LED lamp 12:LED substrate

13,61: radiator 14: lampshade

14a, 16a, 31a, 65a: an end 14b, 16d, 31b, 65b: the other end

15: lamp circuit substrate 16,62: accepting box

16b: choke plate 16c: intercommunicating pore

16e: flange part 17: socket

18: apparatus body 18a, 62a, 62b: peristome

19: Down lamp 21:LED substrate body

21a, 21b: interarea 22:LED

23: connector support 24: wiring hole

25: wiring part 27: screw

28: screw incised notch portion 31: radiator body

32: wide diameter portion 32a: the substrate installed surface

32b: screw fixed hole 32c: concave part

33,66: fin 34: inserting hole portion

37,72: chimeric recess 41: lamp circuit substrate body

45: supply lines 46: connecting portion

47: power supply 51: housing

52: insulation division 53: eyelet

55: reflector 56: socket

62c: fastener 62d: socket installation portion

62e: the hole 65f that deaeration is used: guiding groove

62g: intercommunicating pore 62h: screw hole

63: heat conduction member 65: the radiator body

71,72a: peristome 74,81b: recess

75: support 75a: section portion

77: inserting hole 81: protuberance

81a: convex shaped part 91,92: part

94: adhesive A: light source portion

A: size C: center

E: earth connection MD: maximum diameter position

X, y, z: axis

The specific embodiment

Below, come one embodiment of the present invention is described with reference to accompanying drawing.

Express first embodiment among Fig. 1 to Fig. 4, Fig. 1 is the profilograph of lamp device, Fig. 2 is the plane of the device substrate of lamp device, and Fig. 3 is the side view of lamp device, and Fig. 4 is the key diagram that the ligthing paraphernalia of schematically representing to be installed with described lamp device is arranged at the state of ceiling face.

In Fig. 1 and Fig. 3,11 expressions are bulb type LED lamp as the bulb type lamp of lamp device, being constructed as follows of this bulb type LED lamp 11: be installed in the distolateral of radiator 13 as the LED substrate 12 of device substrate, lampshade 14 covers LED substrates 12 and is installed in the distolateral of this radiator 13, distolateral at another of this radiator 13, it is accepting box 16 that the insulation booth that contains as the lamp circuit substrate 15 of ignition device is installed, and on this accepting box 16 socket 17 is installed.In addition, this bulb type LED lamp 11 has and so-called mini krypton gas (mini krypton) total length that bulb is identical.And as shown in Figure 4, this bulb type LED lamp 11 for example is to be installed in the apparatus body 18 in mode removably, thereby constitutes the Down lamp 19 as ligthing paraphernalia, and wherein this apparatus body 18 is imbedded in the ceiling face X that is arranged on shop etc.

As Fig. 1 and shown in Figure 3, LED substrate 12 comprises: the device substrate body LED substrate body 21 of rounded shape when overlooking; Be installed in this LED substrate body 21 an interarea 21a side a plurality of, for example 8 semiconductor light-emitting elements as light-emitting component are LED22; And wiring part 25, the conduct that described wiring part 25 has another interarea 21b side that is installed in LED substrate body 21 connects the connector support 23 of support and the wiring hole 24 that connects the circular hole of LED substrate body 21.

As shown in Figures 1 and 2, LED substrate body 21 for example is by formed metal (metal) substrates such as metal material of good aluminium of thermal diffusivity etc. or insulating materials, incised notch has formed screw incised notch portion 28 respectively on both sides, this screw incised notch portion 28 is the modes with face contact, is that screw 27 is close to and is fixed on the radiator 13 by the thermal mechanism as fixed mechanism.And, on an interarea 21a of this LED substrate body 21, for example via the not shown electric insulation layer of organic siliconresin etc. and forming the Wiring pattern of forming by the conductive member of Copper Foil etc.And then, on another interarea 21b of this LED substrate body 21, forming not shown electric insulation layer.Also can attach the insulation sheet material as required, thereby form this electric insulation layer.Moreover adhesive that this LED substrate body 21 also can be by for example organosilicon of thermal diffusivity excellence (silicone) class etc. is adhered on the radiator 13.

Each LED22 is the high brightness that has roughly the same performance each other, the light emitting diode of high output, comprise the not shown bare chip (bare chip) that for example sends blue light and cover this bare chip by formed not shown resin portion such as organic siliconresins, in this resin portion, sneaking into not shown fluorophor, the part of the blue light that this fluorophor is sent by bare chip excites and mainly radiates the promptly yellow light of blue complementary color, each LED22 can obtain the illumination light of white color system, and has for example consumption electric power about 0.5W.And, these LED22 are installed in the Wiring pattern of an interarea 21a of LED substrate body 21 and are electrically connected with being one another in series, on the outer edge of an interarea 21a of LED substrate body 21, under the state that roughly equally spaced separates each other, the center C that these LED22 are configured in LED substrate body 21 is on the same circumference at center.And, these LED22 to the direction radiation bright dipping of an interarea 21a approximate vertical of LED substrate body 21.

Connector support 23 is to become with each LED22 to be electrically connected, and the connector pole plate (connector shelf) of the electrified terminal that is connected with lamp circuit substrate 15 sides, this connector support 23 is formed by synthetic resin etc., and the center aim at LED substrate body 21 an interarea 21a center C and disposing.And this connector support 23 is the vertical configuration that forms opening towards the top.

Wiring hole 24 is and the 23 adjacent ground connection configurations of connector support, for example has the diameter dimension bigger than the maximum profile of described connector support 23.Therefore, wiring hole 24 be configured in LED substrate body 21 center C near, and the position of the size a that is disposed on diametric(al) (the excircle direction of LED substrate body 21) therewith that center C departs from (skew (offset)).

In addition, as Fig. 1 and shown in Figure 3, radiator 13 comprises: roughly columned radiator body 31; An end 31a side of this radiator body 31 with the hole enlargement shape continuous wide diameter portion 32; And spread all over described radiator body 31 with the outer peripheral face of wide diameter portion 32 continuous a plurality of fin (radiating fin) 33, described radiator body 31, wide diameter portion 32 and each fin 33 for example are to utilize the metal material of good aluminium of thermal conductivity etc. or resin material etc., after processing, be configured as the member that there is the interior wall thickness in cavity inside by casting, forging or machining etc. integratedly.And, the cross section shape of this radiator 13 is roughly rounded, outer peripheral face forms roughly cone shape taper (taper) face that diameter from one end to the other side diminishes successively, thereby constitutes the akin shape of profile of the neck that steeps with ordinary incandescent lamp in appearance.And, connect radiator body 31 and wide diameter portion 32 and forming inserting hole portion 34.

In the other end 31b of radiator body 31 side, be provided with the chimeric recess 37 as housing recess of an end 16a side of inserting accepting box 16 along central shaft.The central shaft y-y that the cross section of this chimeric recess 37 forms with radiator 13 is the circular at center, and is communicated with inserting hole portion 34.

Wide diameter portion 32 is to form flat sphere-like in the mode of hole enlargement from radiator body 31 sides, and the upper end side of this wide diameter portion 32 becomes the substrate installed surface 32a of flat condition of support that the LED substrate body 21 of LED substrate 12 as mounting.And the upper end of inserting hole portion 34 is towards described substrate installed surface 32a, and in described substrate installed surface 32a, wearing screw fixed hole 32b in order to fixing described screw 27 accordingly with the screw incised notch portion 28 of LED substrate 12.That is, inserting hole portion 34 is formed at the position that is slightly offset (skew) on diametric(al) with the center of substrate installed surface 32a.And then near the outer edge of the substrate installed surface 32a of wide diameter portion 32, the concave part 32c that the chimeric card in end of an end 14a side of lampshade 14 is ended forms toroidal continuously along circumferencial direction.

Gradually become big mode from radiator body 31 to wide diameter portion 32 sides with the overhang on the diametric(al), be formed obliquely fin 33.And these fin 33 are each other roughly at a distance of equally spaced being formed on the circumferencial direction of radiator 13.

Inserting hole portion 34 forms the circular hole that has with wiring hole 24 diameter dimension about equally.

Lampshade 14 is to be formed flat dome shape by the glass with light diffusing of transparent or milky etc. or synthetic resin etc., and become upper end side continuous shape with the wide diameter portion 32 of radiator 13, that is, become the akin smooth curved surface shape of profile of the head that steeps with ordinary incandescent lamp.And this lampshade 14 is to form in the mode that expands out gradually from an end 14a side, and forms to the diminishing mode of other end 14b side from maximum diameter position MD with diameter, and maximum diameter position MD is the position of more leaning on the top than each LED22 of LED substrate 12.And then this lampshade 14 covers the light-emitting area of LED substrates 12, and an end 14a side is utilized the adhesive of for example organic siliconresin or epoxy resin etc. and is fixed on the periphery of wide diameter portion 32 of radiator 13.The result; cover and protect LED substrate 12 by lampshade 14; and the outer peripheral face shape of radiator 13 becomes and the roughly continuous integratedly face shaping of the outer peripheral face shape of lampshade 14, and the global shape of bulb type LED lamp 11 constitutes and the whole more approximate shape of profile of ordinary incandescent lamp bubble.

Lamp circuit substrate 15 comprises: for example by glass epoxide material etc. and to form flat ignition device body be lamp circuit substrate body 41; The not shown a plurality of electronic components that are installed in the formation lamp circuit in this lamp circuit substrate body 41 are component; And power supply 47, this power supply 47 possesses the connecting portion 46 that base end side is electrically connected on the supply lines 45 of lamp circuit and is electrically connected on the front of this supply lines 45, and described lamp circuit substrate 15 is housed in the accepting box 16 along direction of principal axis.And, on the input terminal of this lamp circuit substrate 15, connecting input line (not shown).

Lamp circuit for example is a circuit etc. of LED22 being supplied with constant current, and this lamp circuit converts the alternating voltage of 100V the DC voltage of 24V to and is supplied to each LED22.

Supply lines 45 is in order to will being supplied to the supply lines of LED substrate 12 sides from the electric power of lamp circuit side, and the length of this supply lines 45 has surplus with respect to the distance till LED substrate 12.Moreover the remaining length part of this supply lines 45 can be housed in the described inserting hole portion 34.

Connecting portion 46 is the connector shells (connector housing) that become the power supply terminal of the front that is connecting supply lines 45, this connecting portion 46 is inserted and secured on the connector support 23 of LED substrate 12 sides downwards from the top, promptly, be inserted and secured on LED substrate body 21 and intersect on the direction of (vertical), whereby supply lines 45 (lamp circuit) is electrically connected on the LED22 side via connector support 23.And the maximum profile of this connecting portion 46 is set forr a short time than the diameter dimension of wiring hole 24 and inserting hole portion 34.Therefore, supply lines 45 and connecting portion 46 (power supply 47) can be inserted and lead in wiring hole 24 and the inserting hole portion 34.In addition, in the present embodiment, this connecting portion 46 is to be made as the other member different with supply lines 45, but is for example connecting under the situation that support is a terminal board etc., and this connecting portion 46 also can be made as the front of supply lines 45 itself.

Accepting box 16 is with so that the member of electric insulation between lamp circuit substrate 15 and the radiator 13, utilizes the material with insulating properties of PBT resin for example etc., shapes in the chimeric recess 37 and form roughly cylindric.And, utilize an end 16a side of blocking this accepting box 16 as the choke plate 16b of box obstruction portion, on this choke plate 16b, opening forming have with inserting hole portion 34 about equally diameter dimension and be communicated in the intercommunicating pore 16c of this inserting hole portion 34.And then, on the outer peripheral face of the pars intermedia of end 16a side of this accepting box 16 and other end 16d side, with so that between the other end 31b of the radiator body 31 of radiator 13 and the socket 17 insulation division of insulation to be flange (flange) 16e of portion outstanding towards diametric(al), and be formed on continuously on the whole circumference direction.Moreover, also can bury the mode of this lamp circuit substrate 15, the packing material that will have thermal diffusivity and insulating properties is the inside that resin of silicon-type etc. is filled into accepting box 16.

Socket 17 for example is the socket of the E17 type of Edison's type (Edison type), this socket 17 is electrically connected with lamp circuit substrate 15 sides by not shown distribution, and comprise: the housing of column (shell) 51 possesses the screw thread in the lamp socket that is screwed into not shown ligthing paraphernalia; And eyelet (eyelet) 53, being arranged on a distolateral top of described housing 51 via insulation division 52, this socket 17 is for example by bonding or hold back method such as close and anchor on the accepting box 16.

Housing 51 is electrically connected with not shown mains side, in the inside of this housing 51, and accepting box 16 between, sandwiching in order to the not shown power line of the lamp circuit power supply of lamp circuit substrate 15 and with housing 51 conductings.

Eyelet 53 is electrically connected with not shown ground connection (ground) current potential, and the earth connection E that is electrically connected with the earthing potential of the lamp circuit of lamp circuit substrate 15 is electrically connected on this eyelet 53 by methods such as welding.

And, apparatus body 18 is members that the ordinary incandescent lamp bubble that for example has the socket of E17 type is used as the existing ligthing paraphernalia of the Down lamp formula of light source, and form at lower surface and have the metal box-like of peristome 18a, chimeric metal reflector 55 in peristome 18a, and the socket 56 that can screw in for socket 17 is installed.

Reflector 55 for example is that the metallic plate by stainless steel (stainless) etc. is constituted, and the central portion of plate is being provided with socket 56 in the above.

In addition, Down lamp 19 is existing members of ordinary incandescent lamp bubble usefulness, for energy-conservation and long lifetime etc., uses described bulb type LED lamp 11 to replace incandescent lamp bulb.That is,, therefore, can directly be inserted in the described socket 56 because the socket 17 of bulb type LED lamp 11 is the E17 type.At this moment, radiator 13 forms roughly cone shape taper surface, constitute the akin shape of profile in appearance with the neck of incandescent lamp bulb, therefore, neck can not contact and successfully be inserted in the described socket 56 with reflector 55 grades of socket 56 peripheries, thereby the utility ratio of using bulb type LED lamp 11 in existing apparatus body 18 improves, and has constituted the energy-saving Down lamp 19 that described bulb type LED lamp 11 is being set.

Next, the effect to described first embodiment describes.

When bulb type LED lamp 11 is assembled, at first, to another interarea 21b side of LED substrate body 21 of the LED substrate 12 of LED22 and connector support 23 etc. be installed, mounting is to the substrate installed surface 32a of radiator 13, make the position of wiring hole 24 and the position alignment of inserting hole portion 34, and make the position alignment of each screw fixed hole 32b of the position of each screw incised notch portion 28 of LED substrate body 21 sides and radiator 13 sides, simultaneously, by screw 27 LED substrate 12 is fixed on the radiator 13, makes LED substrate 12 and radiator 13 thermal.

And, the base end side of the supply lines 45 of connecting portion 46 will be set in front, be electrically connected on the lead-out terminal of the lamp circuit of lamp circuit substrate 15.

Then, the accepting box 16 of accommodating lamp circuit substrate 15 is inserted in the chimeric recess 37 of radiator 13, makes intercommunicating pore 16c be communicated with, utilize not shown sag and swell to wait accepting box 16 cards only are fixed on the radiator 13 with inserting hole portion 34.At this moment, allow power supply 47 pass inserting hole portion 34, make the front and the connecting portion 46 of supply lines 45 outstanding from an interarea 21a of the LED substrate body 21 of LED substrate 12, and connecting portion 46 is inserted into the described connector support 23 from the top, thereby being formed with connecting portion 46, connector support 23 is electrically connected and mechanical connection.

After this, export at the power line that will be electrically connected under the state in the outside of housing 51 with lamp circuit substrate 15 sides, the socket 17 that lamp circuit substrate 15 is connected with eyelet 53 will be inserted from the other end 16d side of accepting box 16, with power clip between accepting box 16 and housing 51.At this moment, utilizing not shown sag and swell to wait ends accepting box 16 and socket 17 cards fixing.

Then, an end 14a side of lampshade 14 is embedded in the concave part 32c of radiator 13, so that lampshade 14 is fixed on the radiator 13, and utilizes adhesive etc. to fix reinforcement, thereby finish bulb type LED lamp 11.

After being installed to this bulb type LED lamp 11 on the socket 56, if Down lamp 19 is connected power supply, then power supply can be supplied to bulb type LED lamp 11 via socket 17 from socket 56, thereby the lamp circuit of lamp circuit substrate 15 is moved, the DC voltage of output 24V.This DC voltage supplies power to LED substrate 12 sides via the supply lines 45 that is connected with the lead-out terminal of lamp circuit.Thus, all LED22 can be simultaneously luminous, radiates the light of white.

At this moment, with each LED22 to form the roughly mode of concentric circles, roughly equally spaced install and be configured on the interarea 21a of LED substrate body 21, therefore, wide cause equably of radiating from each LED22 can not be connected device support 23 grades to the whole inner face radiation of lampshade 14 and block, light spreads on milky lampshade 14, thereby has the illumination of steeping akin light distribution characteristic with ordinary incandescent lamp.

Particularly owing to become the luminous intensity distribution that the luminous intensity distribution of the bulb type LED lamp 11 of light source approaches the ordinary incandescent lamp bubble, thereby, near the exposure of the light of reflector 55 irradiations the socket 56 in being configured in Down lamp 19 increases, thereby can roughly obtain to constitute the utensil characteristic that meets optical design that ordinary incandescent lamp steeps the reflector 55 of usefulness.

And the heat that is produced by each LED22 on LED substrate 12 by lighting a lamp of bulb type LED lamp 11 can be delivered on the radiator 13 via substrate installed surface 32a, and dispel the heat via each fin 33, radiator body 31 and the wide diameter portion 32 of this radiator 13.And then the heat of injection in accepting box 16 can be delivered to socket 17 and dispel the heat.

As mentioned above, a plurality of LED22 are configured in respectively from the center C of an interarea 21a of LED substrate body 21 to position that the outer rim lateral deviation is moved, and make wiring part 25 be positioned at the equitant position of center C with an interarea 21a side of LED substrate body 21, described wiring part 25 comprises: connector support 23 can connect the connecting portion 46 that is connected with front end from the supply lines 45 of lamp circuit substrate 15; And wiring hole 24, connect LED substrate body 21 with described connector support 23 adjacent ground connection, and can insert logical for the power supply 47 of lamp circuit substrate 15, power supply 47 is inserted to lead in the wiring hole 24, thereby can easily connecting portion 46 be connected on the connector support 23, therefore, can guarantee the easiness of assembling on the one hand, make connector support 23 roughly equably away from each LED22 on the one hand, be difficult for blocking the light that described each LED22 sends, thereby can suppress the inhomogeneity decline of luminous intensity distribution.

In addition, connector support 23 is erected to be configured on the interarea 21a of LED substrate body 21 of LED substrate 12, whereby, can easily be connected on the connector support 23 inserting the connecting portion 46 that leads to the power supply 47 in inserting hole portion 34 and wiring hole 24, and under the state that connecting portion 46 is connected on the connector support 23, load is difficult for being applied near the link position of supply lines 45 and connecting portion 46, therefore, for example when being connected to connecting portion 46 on the connector support 23, not fragile supply lines 45.

And then, under the state that the LED substrate body 21 of LED substrate 12 is installed on the distolateral substrate installed surface 32a of radiator 13 1, in wiring hole 24 corresponding positions inserting hole portion 34 is set with described LED substrate 12, whereby, can be via this inserting hole portion 34 will insert and lead in the radiator 13, and the contact area of the distolateral substrate installed surface 32a of LED substrate body 21 and radiator 13 1 is increased from the supply lines 45 of lamp circuit substrate 15.

And, be disposed between radiator 13 and the socket 17 and make radiator 13 and the accepting box 16 of socket 17 insulation in accommodating lamp circuit substrate 15, whereby, can easily make lamp circuit substrate 15 and radiator 13 insulation, and the configuration of lamp circuit substrate 15 becomes easy.

And, the maximum diameter position MD that LED substrate 12 (LED22) is configured in than lampshade 14 more leans on the downside place, whereby, the part of the light that sends from each LED22 can be because the curved shape till from an end 14a side of lampshade 14 to maximum diameter position MD and shining to downside, therefore, can make illumination be mapped to wider scope.

Next, expression second embodiment in Fig. 5, this Fig. 5 is the profilograph of lamp device.In addition, about formation and the effect identical with described first embodiment, mark same-sign and omit its explanation.

According to described first embodiment, in this second embodiment, make connector support 23 be horizontal configuration.

Promptly, on an interarea 21a of the LED of LED substrate 12 substrate body 21, connector support 23 in wiring hole 24 sides towards forming opening along the direction (horizontal direction) of this interarea 21a, thereby connecting portion 46 can be inserted and is fixed in the described connector support 23 along LED substrate body 21.

Like this, by making connector support 23 be horizontal configuration, just can reduce connector support 23 from the outstanding overhang of LED substrate body 21, block so more be difficult for being connected device support 23, thereby can further suppress the inhomogeneity decline of luminous intensity distribution from the light of LED22.

Moreover, in described each embodiment,, and whole wiring part 25 being configured to the center overlaid of the LED substrate body 21 of at least a portion and LED substrate 12 as long as connector support 23 is adjacent to each other with wiring hole 24, then can at random set.Promptly, even if connector support 23 and wiring hole 24 form either party's a part and the state that dispose overlapping with the center C of LED substrate body 21, perhaps form an one of zone between connector support 23 and the wiring hole 24 become with the center C of LED substrate body 21 equitant near the state etc. of part, also can bring into play same action effect.

Then, expression the 3rd embodiment in Fig. 6 A, figure (b) and Fig. 7, Fig. 6 indication lamp device, Fig. 6 A is a profilograph, Fig. 6 B is the stereogram of accepting box, Fig. 7 will show the lamp device slit shearing of Fig. 6 and the stereogram represented, and Fig. 8 is the chart of temperature of the ignition device of the temperature of ignition device of indication lamp device and first precedent.Moreover, about formation and the effect identical, mark identical symbol and omit its explanation with described each embodiment.

According to described first embodiment, in the 3rd embodiment, use as the radiator 61 of body and as the accepting box 62 of insulation booth to replace radiator 13 and accepting box 16, by heat conduction member 63 with lamp circuit substrate 15 and radiator 61 thermally coupleds.

Radiator 61 is made of thermal conductivity good metal, for example aluminium, cross section shape is roughly rounded, outer peripheral face forms roughly cone shape taper (taper) face that diameter from one end to the other side diminishes successively, thereby forms the akin shape of profile of the neck that steeps with ordinary incandescent lamp in appearance.And this radiator 61 comprises: roughly columned radiator body 65 and be integrally formed in a plurality of fin 66 on the outer peripheral face of this radiator body 65.And, this radiator 61 for example by casting, forging or machining etc. after processing, constitute the inner member that does not have the wall thickness in cavity.

In an end 65a of radiator body 65, forming the bigger peristome of diameter 71, and in other end 65b, forming chimeric recess 72 as housing recess with the less peristome 72a of diameter.

In peristome 71, the mode that the recess 74 of LED substrate 12 is installed with formation forms support 75, and the surface of this support 75 forms level and smooth face.Promptly, via to have thermal conductivity and to have the formed insulation sheet material such as organic siliconresin of electric insulating quality or adhesive etc., another interarea 21b side of LED substrate body 21 is close under the state of support 75, and LED substrate 12 is bearing on the radiator body 65 by the fixed mechanism of screw etc.Thus, the optical axis x-x of LED substrate 12 and the central shaft y-y of radiator 61 roughly coincide, thereby have constituted the light source portion A with the roughly rounded light-emitting area of when overlooking integral body.

And then, in radiator body 65, forming and making supply lines 45 slotting logical inserting holes 77.This inserting hole 77 be middle body from support 75 towards peristome 72a, and roughly connect ground and form along central shaft y-y direction.And in order to be communicated with the wiring hole 24 of LED substrate body 21, the central shaft z-z of this inserting hole 77 is formed on from the position of the outside circumferencial direction offset dimensions of the central shaft y-y a of radiator 61.

Chimeric recess 72 is in order to lamp circuit substrate 15 being configured in the recess of self inside, and the central shaft y-y that the cross section is with radiator 61 is the circular at center, and is connecting described inserting hole 77 on the bottom surface.And then, on the surface of this chimeric recess 72, in the part on circumference from the bottom surface to the medial surface roughly between the mid portion, cross section shape does not form circle, but has formed protuberance 81 in the mode of wall thickness.

And fin 66 is to give prominence to radially and be formed on the outer peripheral face of radiator body 65 to other end 65b from an end 65a.

And accepting box 62 forms being that interior shape with the chimeric recess 72 of radiator 61 roughly coincide the columned shape in the end, forming peristome 62a in an end of this accepting box 62, and the other end gets clogged.

And, on the medial surface of accepting box 62, partly formed the peristome 62b that becomes rectangular-shaped from the bottom surface across the roughly mid portion of medial surface in the part on circumference.This peristome 62b forms in the mode that is communicated with the chimeric recess 72 of described radiator 61, and form can be chimeric with the protuberance 81 of chimeric recess 72 shape and size, in the time of in the bottom surface with accepting box 62 is inserted into chimeric recess 72 up, protuberance 81 can automatically be fitted among the peristome 62b, and protuberance 81 is exposed to the inner face of accepting box 62 highlightedly.

And, roughly mid portion at the outer peripheral face of accepting box 62, forming outstanding fastener 62c in the mode of the flange that forms ring-type, in the part of giving prominence to from this fastener 62c forward end, forming the socket installation portion 62d of periphery for the section shape, and at the lower surface of the flange shape part of the formation of fastener 62c, forming the hole 62e that deaeration is used, the pressure of this hole 62e in accepting box 62 makes in this accepting box 62 when rising and is communicated with extraneous air.

In addition, on the inner face of accepting box 62, along the direction of principal axis of cylinder and forming guiding groove 65f, the lamp circuit substrate body 41 of flat lamp circuit substrate 15 is along longitudinal direction, that is, roughly along the central shaft y-y of radiator 61 and chimeric and be supported among this guiding groove 65f.Guiding groove 65f is from the axis of the accepting box 62 that forms cylinder, in other words is amesiality and form from the central shaft y-y of radiator 61, in the present embodiment, this guiding groove 65f be the deflection forming peristome 62b and protuberance 81 a side (skew) and formation, lamp circuit substrate body 41 longitudinally is embedded in the guiding groove 65f that this skew forms, whereby, the wider plate face of lamp circuit substrate body 41 disposes to protuberance 81 from peristome 62b, is supported in the position that closely connects with protuberance 81 simultaneously.

And in the present embodiment, in LED substrate 12, four LED22 are installed on the interarea 21a of LED substrate body 21.

And, being constructed as follows of lamp circuit substrate 15: for example bigger part 91 concentrated areas of electrolytic capacitor (electrolyticcondenser) etc. are configured on one of them face of lamp circuit substrate body 41, and the comparison of smaller chip (chip) part or transistor (transistor) etc. is installed on another face with the part 92 of heating.When among the guiding groove 65f that lamp circuit substrate body 41 longitudinally is inserted into accepting box 62, make the comparison of chip element or transistor etc. be positioned at narrow space with the part 92 that generates heat, promptly, be positioned at the space of the side that peristome 62b and protuberance 81 are arranged, make bigger part 91 be positioned at the opposing party's wider space, thereby insert and chimeric this lamp circuit substrate 15.Moreover, when component being installed in the lamp circuit substrate body 41, the comparison that preferably makes transistor etc. in advance with the part 92 of heating be positioned at peristome 62b and protuberance 81 in opposite directions the position and install.In the case, if lamp circuit substrate 15 is accommodated in the accepting box 62, then make electric insulation between radiator 61 and the lamp circuit substrate 15 by accepting box 62, and the comparison of transistor etc. with the part 92 of heating can be automatically with peristome 62b and protuberance 81 in opposite directions.Under the part 92 and peristome 62b and protuberance 81 state in opposite directions of this heating, the plate face of the part that contains heating 92 of lamp circuit substrate body 41, and the protuberance 81 on chimeric recess 72 surfaces of exposing from peristome 62b between, filling the thermal conductivity member, is to fill for example by the formed stable on heating adhesive 94 with electric insulating quality of organic siliconresin in the present embodiment.

Whereby, utilization is made by formed radiator 61 of aluminium and lamp circuit substrate 15 electric insulations by the formed adhesive 94 of organic siliconresin, simultaneously, make lamp circuit substrate 15, particularly the generate heat protuberance 81 of part 92 and radiator 61 form thermally coupleds, and lamp circuit substrate 15 is also anchored on accepting box 62 and the radiator 61 securely by adhesive 94.

Moreover, the intercommunicating pore that the 62g among Fig. 6 B is formed on the bottom surface and forms accordingly with the inserting hole 77 of radiator 61, supply lines 45 is drawn out in the accepting box 62, and 62h is in order to the screw hole on the bottom surface that accepting box 62 is affixed to chimeric recess 72.

And then, the outer peripheral face of the socket installation portion 62d that the peristome 72a from the other end of radiator 61 of accepting box 62 is given prominence to, embedded socket 17, and closed or use the stable on heating adhesive that has of organic siliconresin or epoxy resin etc. to carry out set by holding back.Whereby, the face shaping that carries out the transition to the outer peripheral face of socket 17 from radiator 61 constitutes the akin shape of profile with the neck of ordinary incandescent lamp bubble.

And socket 17 for example is to use the socket of the E26 type of Edison's type.Therefore, the size of the each several part of ligthing paraphernalia 18 and shape are corresponding with the E26 type.

Next, the assembling sequence to described the 3rd embodiment describes.

At first, accepting box 62 is embedded in the chimeric recess 72 of radiator 61, by screw and use screw hole 62h this accepting box 62 to be affixed to the bottom surface of chimeric recess 72.At this moment, make the protuberance 81 of chimeric recess 72 be embedded in the peristome 62b of accepting box 62, and make intercommunicating pore 62g aim at and be bonded to the inserting hole 77 of radiator 61.

Then, supply lines 45 on the lead-out terminal of lamp circuit substrate 15 passes radiator 61 from the intercommunicating pore 62g of accepting box 62 inserting hole 77 will be connected in advance, simultaneously, lamp circuit substrate 15 is erected to be inserted in the accepting box 62, makes lamp circuit substrate body 41 chimeric and be supported on guiding groove 65f.At this moment, make heating part 92 towards peristome 62b and protuberance 81, thereby lamp circuit substrate 15 is inserted in the described accepting box 62.At this moment, the front end that comprises connecting portion 46 of supply lines 45 is to draw from the wiring hole 24 of LED substrate body 21 that LED22 is installed.

Then, under the state that lamp circuit substrate 15 is bearing in the accepting box 62, adhesive 94 injected and be filled between the lamp circuit substrate 15 and protuberance 81 in the accepting box 62.Thus, will comprise heating part 92 on the lamp circuit substrate body 41 that is installed in lamp circuit substrate 15 by adhesive 94 and the plate face of lamp circuit substrate body 41 is connected with the protuberance 81 of radiator 61.

Then, make LED substrate 12 mountings and be close on the support 75 of radiator 61, and described LED substrate 12 is fixed about four positions around the interarea 21a side direction of LED substrate body 21 by the fixed mechanism of screw etc.At this moment, with the position alignment of the inserting hole 77 of the position of the wiring hole 24 of LED substrate body 21 and radiator 61 and fixed.Thus, the level and smooth face of another interarea 21b of LED substrate body 21 and support 75 is fixed closely.

Next, with an end by the supply lines 45 of from the wiring hole 24 of LED substrate body 21, drawing to LED substrate body 21 lateral bucklings, connecting portion 46 is electrically connected and mechanical connection with connector support 23.

Then, to be connected in the housing 51 and the eyelet 53 of socket 17 from the input line (not shown) that the input terminal of lamp circuit substrate 15 is derived, under this connection status, the peristome of housing 51 is embedded among the socket installation portion 62d of accepting box 62, and utilizes adhesive to come set.

Next, prepare lampshade 14,, an end 14a side of lampshade 14 is embedded on the support 75 of radiator 61 among the formed section 75a of portion, and utilizes adhesive to fix in the mode of the light source portion A that covers radiator 61.

Constitute bulb type LED lamp 11 whereby, end at this bulb type LED lamp 11 has lampshade 14, socket 17 is being set in the other end, the profile phase of whole face shaping and ordinary incandescent lamp bubble is approximate, and the rated electrical of this bulb type LED lamp 11 is about about 4W, and brightness is equivalent to the brightness of 40W incandescent lamp bulb.

Then, after being installed to this bulb type LED lamp 11 on the socket 56, if Down lamp 19 is connected power supply, then power supply can be supplied to bulb type LED lamp 11 via socket 17 from socket 56, thereby lamp circuit is moved, the DC voltage of output 24V.This DC voltage is applied on each LED22 that is connected in series via the supply lines 45 that is connected with the lead-out terminal of lamp circuit.Thus, all LED22 together with the time light a lamp, and radiate white light.

Because lighting a lamp of this bulb type LED lamp 11 makes the part 92 of the component of lamp circuit, particularly transistor etc. generate heat.The heat that is produced is via the protuberance 81 that is delivered to chimeric recess 72 by the formed adhesive 94 of organic siliconresin as heat conduction member, and dispels the heat to extraneous air via fin 66 from the radiator 61 by the formed wall thickness of aluminium.Simultaneously, the heat owing to part causes that the heat of the lamp circuit substrate 15 that temperature rises also can be delivered to protuberance 81 via adhesive 94.And then the heat that are full of in the accepting box 62 can be delivered to socket 17 and dispel the heat, and also can be by convection action go up the hole 62e that formed deaeration uses and discharge to the outside from the fastener 62c of accepting box 62.

At this moment,, and utilize adhesive 94 that lamp circuit substrate 15 directly is being connected with the protuberance 81 of chimeric recess 72, effectively dispel the heat so can reduce conduction loss because accepting box 62 is provided with peristome 62b.As previous, to from the lamp circuit substrate to accepting box, after the temperature of the lamp circuit substrate in when heat radiation is measured to extraneous air via outer cover component from accepting box again, shown in the chart of Fig. 8, before, thermoelectric resistive is big and the temperature of lamp circuit substrate is about (a point in the chart) about 185 ℃, with respect to this, in the present embodiment, thermal resistance diminishes and the temperature of lamp circuit substrate 15 is about (the b point in the chart) about 110 ℃, and temperature has reduced about about 75 ℃.

And the temperature of each LED22 also rises simultaneously and produces heat.This heat can be from being delivered to the support 75 of set that this LED substrate body 21 is close to by the formed discoideus LED substrate body 21 of aluminium, and to extraneous air, dispelling the heat via fin 66 by the formed radiator 61 of aluminium.At this moment, because constitute LED substrate body 21 and radiator 61, so can the heat that each LED22 produces effectively be dispelled the heat in the less mode of conduction loss by the good aluminium of thermal conductivity.

Thus, can prevent that the temperature of each LED22 from rising and the temperature inequality, suppress the decline of luminous efficiency, prevent to manage to prolong simultaneously the life-span of LED22 by the descend decline of caused illumination of light beam.And, can realize lightweight by aluminium, do not have bulb and become heavy situation.

According to described the 3rd embodiment, in the accepting box 62 of taking in lamp circuit substrate 15, partly formed the peristome 62b that is communicated with chimeric recess 72, and via this peristome 62b, by as heat conduction member by the formed adhesive 94 of organic siliconresin with lamp circuit substrate 15 chimeric recess 72 thermally coupleds with radiator 61, therefore, can be to effectively dispelling the heat by the heat that component produced of lamp circuit substrate 15, thus the temperature that suppresses component rises.Thus, can provide a kind of owing to got rid of wanting thereby making reliability uprise and can suppress bulb type LED lamp 11 and the Down lamp 19 that the life-span descends of fault.

Particularly because lamp circuit substrate 15 roughly is provided in the chimeric recess 72 along the central shaft y-y direction of radiator 61, so for the bulb type LED lamp 11 of central shaft as length direction, the part suitable with the neck of ordinary incandescent lamp bubble can be constituted tiny shape, thereby can constitute and the akin small-sized bulb type LED lamp 11 of the profile of bulb.Simultaneously, in lamp circuit substrate 15, lamp circuit substrate body 41 can be configured on the longitudinal direction, make wider plate face relative with the surface of the chimeric recess 72 of radiator 61 to, whereby, can increase the area that carries out hot linked part with heat conduction member 63, and can make conduction loss still less, thereby the heat of lamp circuit substrate 15 more effectively is delivered to radiator 61 sides.

And, because on the surface of chimeric recess 72, forming the protuberance of giving prominence to lamp circuit substrate 15 81, so can make lamp circuit substrate 15 approaching with the distance of chimeric recess 72, the heat of lamp circuit substrate 15 more effectively can be delivered to radiator 61 sides thus, and it is can reduce the use amount of the adhesive 94 of expensive organic siliconresin etc., thereby also favourable aspect cost.And then, can when constituting radiator 61, form the protuberance 81 of chimeric recess 72 simultaneously, therefore, can provide a kind of and need not to prepare special parts peculiar and can simplify assembling operation, thereby be suitable for the bulb type LED lamp 11 of mass production.

And, because lamp circuit substrate 15 is on longitudinal direction and is partial to forming a side of peristome 62b and protuberance 81 and disposes, so supported in the position of more approaching protuberance 81, thereby can the heat of lamp circuit substrate 15 be delivered to radiator 61 sides in conduction loss mode still less, and also can further reduce the use amount of adhesive 94.

And, under lamp circuit substrate 15 and peristome 62b and protuberance 81 state in opposite directions, to be filled between the plate face and and the protuberance 81 that exposes outstanding of lamp circuit substrate 15 by the formed adhesive 94 of organic siliconresin from peristome 62b, therefore, make by formed radiator 61 of aluminium and lamp circuit substrate 15 electric insulations by adhesive 94, make the lamp circuit substrate 15 and the protuberance 81 of radiator 61 form thermally coupled simultaneously, and then lamp circuit substrate 15 also anchored on accepting box 62 and the radiator 61 securely by adhesive 94, and a kind of electrical safety can be provided thus, and reliability is also high, and then also seem firm bulb type LED lamp 11 with respect to vibration etc.

Moreover, in described the 3rd embodiment, will be as only being filled between lamp circuit substrate 15 and the protuberance 81 of thermal conductivity member by formed adhesives 94 such as organic siliconresins, but also can be to comprising this part and rear side filling adhesive 94 in all interior parts of bigger part 91 being installed.

And then, though lamp circuit substrate 15 longitudinally is accommodated in the chimeric recess 72, but for example first variation that also can be shown in Fig. 9 A is such, and lamp circuit substrate 15 is tilted, and takes in the mode of the bond area of adhesive 94 to increase lamp circuit substrate 15.And second variation shown in Fig. 9 B is such, also can constitute more small-sized lamp circuit substrate 15, so that this lamp circuit substrate 15 is accommodated on the transverse direction (horizontal direction).In the case, on the bottom surface of accepting box 62, form peristome 62b, on the bottom surface of chimeric recess 72, form protuberance 81, adhesive 94 is filled between the protuberance 81 of the upper surface of the lamp circuit substrate 15 that accumbency and chimeric recess 72 bottom surfaces.

And, though constitute the surface of the protuberance 81 that is integrally formed in chimeric recess 72 by smooth face, but the 3rd variation that also can be shown in Fig. 9 C is such, on longitudinal direction, promptly, on the extraction direction of mould, form out the convex shaped part 81a that embarks on journey, to increase the contact area with organic siliconresin etc. as the adhesive 94 of thermal conductivity member.And then the 4th variation shown in Fig. 9 D is such, also can form the recess 81b that is curved surface, to increase contact area.

And, socket 17 is made of the E26 type socket that can be installed in Edison's type on the socket that ordinary incandescent lamp bubble installed, but also can be E17 type etc., in addition, aspect material, constituted whole socket by metal, but also can be resinous socket, the part of the electrical connection of this resinous socket is that the metal by copper coin etc. is constituted, and part in addition is made of synthetic resin.And then, can be socket with the employed pin of fluorescent lamp (pin) shape terminal, also can be socket with the employed L shaped terminal of ceiling suspention lamp.

Moreover, in Fig. 9 of the above-mentioned variation of expression, the part identical with described each embodiment marked identical symbol, and omitted its detailed description.

The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.

Claims (6)

1, a kind of lamp device is characterized in that comprising:
Device substrate, possess the device substrate body, be configured in from the center of an interarea of described device substrate body to a plurality of light-emitting components and the wiring part of the position that the outer rim lateral deviation is moved respectively, described wiring part has with described light-emitting component is electrically connected and is connected support and is connected with described that support forms and the wiring hole of pass-through member substrate body adjacently, and at least a portion of described wiring part is to dispose with the center overlaid of an interarea side of device substrate body;
Radiator, at one end side is installed with another interarea side of the device substrate body of device substrate closely;
Socket, another that is installed in radiator is distolateral; And
Ignition device, possess power supply, and to the light-emitting component control of lighting a lamp, described power supply is housed between radiator and the socket, have supply lines and be connected in described supply lines front end and be connected the connecting portion that support is connected, and can insert and lead in the wiring hole.
2, lamp device according to claim 1 is characterized in that:
Described radiator comprises and can insert logical inserting hole portion for the supply lines of ignition device, and under the state of a distolateral device substrate body that device substrate is installed of described radiator, described inserting hole portion is positioned at and the corresponding position of the wiring hole of described device substrate.
3, lamp device according to claim 1 and 2 is characterized in that:
Comprise accepting box, described accepting box makes radiator and socket insulation, is configured between described radiator and the socket, and is accommodating ignition device.
4, lamp device according to claim 3 is characterized in that:
Described radiator at one end portion comprises the support that is disposing device substrate, comprises the housing recess that is disposing ignition device in the other end;
Comprise the peristome that is communicated in housing recess in the part of described accepting box, described accepting box is disposing in the mode between the housing recess of ignition device and radiator;
Described lamp device comprises heat conduction member, and described heat conduction member forms thermally coupled via the peristome of accepting box with the surface of the housing recess of ignition device and radiator.
5, lamp device according to claim 4 is characterized in that:
Described ignition device is roughly along the central axis direction of radiator and be configured in the accepting box;
Described housing recess has integratedly to the outstanding protuberance of ignition device;
Described heat conduction member is connected ignition device via peristome with protuberance.
6, a kind of ligthing paraphernalia is characterized in that comprising:
The apparatus body that possesses socket; And
The described lamp device of claim 1 of socket is installed on the socket of described apparatus body.
CN2009101608704A 2008-07-30 2009-07-28 Lamp and lighting equipment CN101639170B (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2008196678 2008-07-30
JP2008-196678 2008-07-30
JP2008196678A JP5218751B2 (en) 2008-07-30 2008-07-30 Light bulb lamp
JP2008303794 2008-11-28
JP2008303794A JP5163896B2 (en) 2008-11-28 2008-11-28 Lighting device and lighting fixture
JP2008-303794 2008-11-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN2011100968381A Division CN102175000B (en) 2008-07-30 2009-07-28 Lamp and lighting equipment

Publications (2)

Publication Number Publication Date
CN101639170A true CN101639170A (en) 2010-02-03
CN101639170B CN101639170B (en) 2011-08-31

Family

ID=41614283

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009101608704A CN101639170B (en) 2008-07-30 2009-07-28 Lamp and lighting equipment

Country Status (2)

Country Link
JP (1) JP5218751B2 (en)
CN (1) CN101639170B (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102168817A (en) * 2010-02-26 2011-08-31 东芝照明技术株式会社 Bulb lamp and lighting equipment
CN102384382A (en) * 2011-05-09 2012-03-21 厦门立明光电有限公司 LED (Light-Emitting Diode) illumination lamp
CN102650387A (en) * 2011-02-28 2012-08-29 株式会社东芝 Lighting apparatus
CN102713415A (en) * 2011-01-14 2012-10-03 松下电器产业株式会社 Light source device
CN102893080A (en) * 2010-05-31 2013-01-23 夏普株式会社 Lighting device
CN103189681A (en) * 2010-11-04 2013-07-03 松下电器产业株式会社 Lamp
CN103322532A (en) * 2013-07-04 2013-09-25 浙江和鸿进出口有限公司 LED lamp
CN103339800A (en) * 2011-01-12 2013-10-02 意力速电子工业株式会社 Connector
CN103499034A (en) * 2013-10-10 2014-01-08 深圳市子元技术有限公司 LED device with reflection face capable of active deformation
CN104254177A (en) * 2013-06-28 2014-12-31 戴乐格半导体公司 Intensity control of leds interfacing three-way sockets
CN104364874A (en) * 2012-06-05 2015-02-18 皇家飞利浦有限公司 A base for an electrical lamp and a method of assembling a base for an electrical lamp
CN105179969A (en) * 2010-06-08 2015-12-23 克利公司 Led Light Bulbs And Light Containing The Led Light Bulbs
CN105841006A (en) * 2011-01-26 2016-08-10 罗姆股份有限公司 LED light bulb
CN106439629A (en) * 2016-11-30 2017-02-22 南京路特软件有限公司 LED track lamp
CN107535075A (en) * 2015-06-11 2018-01-02 东丽株式会社 Supply unit and the photochemical reaction device and method and lactams manufacture method using the supply unit

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10340424B2 (en) 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component
US8593040B2 (en) 2009-10-02 2013-11-26 Ge Lighting Solutions Llc LED lamp with surface area enhancing fins
EP2541121A4 (en) 2010-02-23 2013-10-23 Panasonic Corp Light source device
JP5052634B2 (en) * 2010-02-25 2012-10-17 シャープ株式会社 Lighting device
US10240772B2 (en) * 2010-04-02 2019-03-26 GE Lighting Solutions, LLC Lightweight heat sinks and LED lamps employing same
JP2011222858A (en) * 2010-04-13 2011-11-04 Cirocomm Technology Corp Manufacturing method and structure of light core material of light-emitting diode (led) bulb
JP2011228117A (en) * 2010-04-20 2011-11-10 Cirocomm Technology Corp Light emitting diode (led) lamp structure which can exchange light emitting units
WO2011155432A1 (en) * 2010-06-07 2011-12-15 アイリスオーヤマ株式会社 Led lamp
JP5656461B2 (en) 2010-06-14 2015-01-21 日東光学株式会社 Light emitting device
JP4908616B2 (en) 2010-07-28 2012-04-04 日本航空電子工業株式会社 Connector and lighting device
JP5718030B2 (en) * 2010-11-24 2015-05-13 ローム株式会社 LED bulb
JP4838902B1 (en) * 2011-01-12 2011-12-14 イリソ電子工業株式会社 Electrical connection terminal and connector using the same
JP5591726B2 (en) * 2011-01-27 2014-09-17 三菱電機照明株式会社 Lighting device
JP5826503B2 (en) 2011-03-04 2015-12-02 株式会社小糸製作所 LED bulb
KR101827717B1 (en) * 2011-07-08 2018-02-09 엘지이노텍 주식회사 Lighting device
JP5704005B2 (en) * 2011-07-26 2015-04-22 東芝ライテック株式会社 Light bulb shaped LED lamp
CN203757396U (en) * 2011-08-02 2014-08-06 松下电器产业株式会社 Lamp
JP5575715B2 (en) * 2011-08-29 2014-08-20 日立アプライアンス株式会社 Light bulb type lighting device
CN104081121A (en) * 2012-02-02 2014-10-01 普司科Led股份有限公司 Heatsink and led lighting device including same
US9500355B2 (en) 2012-05-04 2016-11-22 GE Lighting Solutions, LLC Lamp with light emitting elements surrounding active cooling device
KR101412959B1 (en) 2013-07-05 2014-06-27 주식회사 포스코엘이디 Led illuminating apparatus
JP5775630B2 (en) * 2014-07-30 2015-09-09 三菱電機照明株式会社 Lighting device and method of assembling lighting device
CN104214749B (en) * 2014-09-23 2017-04-05 海南省蓝波新能源科技有限公司 A kind of LED fish-luring lights and its cooling system
JP5935854B2 (en) * 2014-10-15 2016-06-15 岩崎電気株式会社 LED lamp
JP6028784B2 (en) * 2014-10-21 2016-11-16 岩崎電気株式会社 lamp
JP2015201461A (en) * 2015-07-08 2015-11-12 ローム株式会社 Led lighting device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003059330A (en) * 2001-08-16 2003-02-28 Matsushita Electric Works Ltd Led luminaire
JP4482706B2 (en) * 2005-04-08 2010-06-16 東芝ライテック株式会社 Light bulb lamp
JP4552897B2 (en) * 2006-05-26 2010-09-29 パナソニック電工株式会社 LED lighting unit and lighting apparatus using the same

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102168817A (en) * 2010-02-26 2011-08-31 东芝照明技术株式会社 Bulb lamp and lighting equipment
CN102168817B (en) * 2010-02-26 2014-06-18 东芝照明技术株式会社 Bulb lamp and lighting equipment
CN102893080A (en) * 2010-05-31 2013-01-23 夏普株式会社 Lighting device
US10107487B2 (en) 2010-06-08 2018-10-23 Cree, Inc. LED light bulbs
US9933148B2 (en) 2010-06-08 2018-04-03 Cree, Inc. LED light bulbs
CN105179969A (en) * 2010-06-08 2015-12-23 克利公司 Led Light Bulbs And Light Containing The Led Light Bulbs
CN103189681A (en) * 2010-11-04 2013-07-03 松下电器产业株式会社 Lamp
CN103189681B (en) * 2010-11-04 2015-04-29 松下电器产业株式会社 Lamp
CN103339800A (en) * 2011-01-12 2013-10-02 意力速电子工业株式会社 Connector
CN102713415A (en) * 2011-01-14 2012-10-03 松下电器产业株式会社 Light source device
CN102713415B (en) * 2011-01-14 2015-06-17 松下电器产业株式会社 Light source device
CN105841006A (en) * 2011-01-26 2016-08-10 罗姆股份有限公司 LED light bulb
CN105841006B (en) * 2011-01-26 2019-05-07 罗姆股份有限公司 LED bulb
CN102650387A (en) * 2011-02-28 2012-08-29 株式会社东芝 Lighting apparatus
CN102650387B (en) * 2011-02-28 2015-04-01 株式会社东芝 Lighting apparatus
CN102384382A (en) * 2011-05-09 2012-03-21 厦门立明光电有限公司 LED (Light-Emitting Diode) illumination lamp
CN104364874A (en) * 2012-06-05 2015-02-18 皇家飞利浦有限公司 A base for an electrical lamp and a method of assembling a base for an electrical lamp
CN104364874B (en) * 2012-06-05 2016-12-14 皇家飞利浦有限公司 Pedestal and the method assembling the pedestal for electric light for electric light
CN104254177A (en) * 2013-06-28 2014-12-31 戴乐格半导体公司 Intensity control of leds interfacing three-way sockets
CN104254177B (en) * 2013-06-28 2017-04-26 戴乐格半导体公司 Intensity control of leds interfacing three-way sockets
CN103322532A (en) * 2013-07-04 2013-09-25 浙江和鸿进出口有限公司 LED lamp
CN103499034B (en) * 2013-10-10 2015-06-17 深圳市子元技术有限公司 LED device with reflection face capable of active deformation
CN103499034A (en) * 2013-10-10 2014-01-08 深圳市子元技术有限公司 LED device with reflection face capable of active deformation
CN107535075A (en) * 2015-06-11 2018-01-02 东丽株式会社 Supply unit and the photochemical reaction device and method and lactams manufacture method using the supply unit
CN106439629A (en) * 2016-11-30 2017-02-22 南京路特软件有限公司 LED track lamp

Also Published As

Publication number Publication date
JP5218751B2 (en) 2013-06-26
JP2010033959A (en) 2010-02-12
CN101639170B (en) 2011-08-31

Similar Documents

Publication Publication Date Title
US9603226B2 (en) LED lamps with enhanced wireless communication
US10208919B2 (en) Retrofit LED lighting system for replacement of fluorescent lamp
JP5756502B2 (en) Lighting device
JP5795632B2 (en) LED bulb
US9016924B2 (en) Lamp device
CN203615157U (en) Light and lighting device
TWI476347B (en) Lighting device
US20140218930A1 (en) Plastic led bulb
US8760042B2 (en) Lighting device having a through-hole and a groove portion formed in the thermally conductive main body
CN101910710B (en) LED bulb and lighting apparatus
CN103097801B (en) Bulb-shaped lamp and ligthing paraphernalia
EP3106740B1 (en) Led filament lamp
CN103486464B (en) Bulb-shaped lamp and ligthing paraphernalia
EP1914470B1 (en) Semiconductor lamp
US7303301B2 (en) Submersible LED light fixture
US8294356B2 (en) Light-emitting element lamp and lighting equipment
CN101749576B (en) Light-emitting module and illumination apparatus
KR101227525B1 (en) Lighting apparatus
JP5348410B2 (en) Lamp with lamp and lighting equipment
RU2510874C2 (en) Radially directed heat dissipating device and pear-shaped light-emitting device using same
TWI424131B (en) Lighting device
US8596820B2 (en) LED unit and LED lighting lamp using the LED unit
US8395304B2 (en) Lamp and lighting equipment with thermally conductive substrate and body
TWI435026B (en) Illiminant device and lamp thereof and manufacturing method of the of the lamp
US10240724B2 (en) LED filament

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant