CN101637945A

CN101637945A - Dicing frame

Info

Publication number: CN101637945A
Application number: CN200810131185A
Authority: CN
Inventors: 细野则义; 田中清文; 谷口敦
Original assignee: Shin Etsu Polymer Co Ltd
Current assignee: Shin Etsu Polymer Co Ltd
Priority date: 2008-07-30
Filing date: 2008-07-30
Publication date: 2010-02-03

Abstract

The invention relates to a dicing frame. The dicing frame 1, which is a hollow frame 1 that is made from a molding material containing resin by means of through injection molding, is used for accommodating a semiconductor chip and is removably sucked under vacuum by a plurality of suctioning pads 20. The dicing frame is provided with a spot facing part 30 which is depressed from a surface 4 of theframe 1. The surface 4 of the frame 1 and the bottom surface 31 of the spot facing part 30 are jointed by an oblique plane at an inclination angle of about 30 degrees or less.

Description

Dicing frame

Technical field

The present invention relates to a kind of dicing frame of using in semiconductor wafer scribing (dicing) work or similar work of being used for.

Background technology

Conventional dicing frame comprises the framework 1 and the scribing film 10 of hollow, and described hollow frame 1 is used for the holding semiconductor wafer W, and described scribing film adheres to framework 1 and adhesively semiconductor wafer W is fixed thereon, and (sees patent documentation 1) as shown in Figure 6.

Framework 1 is to be formed by SUS etc., and it is configured as form smooth, sub-circular, thereby it is lived to be transferred and to transmit with vacuum attraction removedly by a plurality of vacuum mats (suctioning pad), and described vacuum mat has a kind of not graphic, approximate funnel shaped (funnel shape).Scribing film 10 is film formed by the soft koroseal with flat circular shape, for example, can apply the described soft koroseal film with laminating propylene acid adhesive thereon.

Use this dicing frame 1, the semiconductor wafer W that adhesively is fixed on the scribing film 10 is divided into a plurality of tube cores (die) D by diamond blade 40, as shown in Figure 6, be set to subsequently on the not shown expander (expander), thereby make that scribing film 10 is radially outward expanded, make tube core D not be in contact with one another.Then, these tube cores D is picked up one by one and is transmitted from scribing film 10.

Although the framework of dicing frame 1 once used SUS or other similar material to form, recently, framework has become by molded resin material and has formed, so that satisfy nearest demand to light weight, and on front face surface, form the flat part of ream (spot facing portion) 30A, as shown in Figure 7 with flat rectangular shape.The flat part 30A of this ream will have with adhesive etc. and adhere to wherein bar code (code bar) or RF identification (RFID) system's radio frequency (RF) label 34 (seeing patent documentation 2).

According to the size and the thickness of bar code or RF tag 34, the flat part 30A of ream sink and has the cross section of rectilinear or angled, approximate U-shaped, with bigger darker than bar code or RF tag 34.

Patent documentation: 1

Japanese Patent Application Publication 2006-299266.

Patent documentation 2:

Japanese Patent Application Publication 2007-62333.

Because conventional dicing frame is so constructed, that is: have the flat part 30A of angled ream that on framework 1 surface, caves in, have the bar code or the RF tag 34 that are suitable for and adhere to the flat part 30A of this ream, the geometry (flat part 30A of ream and surrounding edge part thereof) that depends on the vacuum attraction zone in some cases might have problems promptly: form the slit between flat part 30A of ream and vacuum mat, cause being hindered during with vacuum attraction vacuum attraction and air to leak by vacuum mat at dicing frame and pass described slit.

As the countermeasure of head it off, there is a kind of method, it forms the sealing that vacuum pad produces the slit that reclines by using flexible material.Yet the simple change of material is not enough to keep reliability, and has a kind of worry promptly: along with because the aging material degradation that causes makes the vacuum mat hardening, it is impossible that vacuum attraction will become.

Summary of the invention

Therefore the present invention an object of the present invention is to provide a kind of dicing frame in view of top described the design, is inhaled when it and has guaranteed attraction when pad attracts.

In order to achieve the above object, dicing frame of the present invention comprises: semiconductor wafer is fixed in wherein hollow frame by resiniferous moulding material being used for of forming, described framework is inhaled pad and can be pulled down (detachably) and attract, and it is characterized in that: at least one forms and has the part (depressed portion) of sinking in the front surface of described framework and the rear surface, and the inclined-plane that the basal surface of the surface of described framework and described sagging part is had about 30 degree or a following inclination angle engages (join).

In the above, the RF tag of bar code or radio-frequency recognition system can be attached in described sagging part.

Here, the framework of being stipulated by each claim is not to be limited to its shape especially, and may take Any shape, such as ring-type (ring-like) form, rectangular in form or similar type.Have for example different types of semiconductor wafer of different-diameters such as 200mm, 300mm, 450mm although exist, the present invention is not limited especially by semiconductor wafer types.Inhale pad quantity and be not specially limited, can use one or more pads.Preferably, the basal surface of the surface of framework, the part of sinking and inclined-plane all form and have the smooth surface that does not have corner angle.Sagging part is not limited to its shape, and can take Any shape, such as: smooth circle, ellipse, rectangle, polygon or analogous shape.The number of the part of sinking is not specially limited.That is, can on the front and back of framework, form one or more sagging parts.Similarly, can on the either side of framework, form the sagging part of necessary number.

According to the present invention, because sink the inclination angle on part inclined-plane be defined as about 30 degree or below, do not have precipitous protuberance (rise) around the part of sinking, therefore when framework is inhaled pad and attracted, in the sagging part of framework and inhale between the pad the almost risk of air leakage.

According to the present invention, a kind of dicing frame might be provided, when being inhaled pad attraction, it can be attracted reliably.

When the RF tag of bar code or radio-frequency recognition system is attached to the depression timesharing, might be easily obtain information about framework and semiconductor wafer from bar code or RF tag.

Description of drawings

Fig. 1 is that diagram shows the explanation view that comprises according to the volume rendering of the whole system of an embodiment of a kind of dicing frame of the present invention;

Fig. 2 is the illustrative top view that diagram shows an embodiment of a kind of dicing frame of the present invention;

Fig. 3 is the illustrative bottom view that diagram shows an embodiment of a kind of dicing frame of the present invention;

Fig. 4 is the explanatory that diagram shows an embodiment of a kind of dicing frame of the present invention;

Fig. 5 is the explanatory that diagram shows the flat part of a ream among another embodiment of a kind of dicing frame of the present invention;

Fig. 6 shows the illustrative perspective view of conventional dicing frame;

Fig. 7 shows the illustrative top view by the dicing frame of molded of resin material.

The specific embodiment

With a preferred embodiment that illustrates with reference to the accompanying drawings according to a kind of dicing frame of the present invention.Shown in Fig. 1 to 4, the dicing frame of present embodiment is a hollow frame 1, and it is formed by moulding material, be used for by flexible scribing film 10 holding semiconductor wafer W in wherein, and its removedly by a plurality of vacuum mat 20 with vacuum attraction.This dicing frame forms has the flat part 30 of ream of sinking at the rear portion on the front face surface, and its 4 places at framework 1 are indicated.

Framework 1 is made 2 to 3mm thick, diameter by resiniferous moulding material by injection mould and is formed less times greater than the smooth approximate annular plate of semiconductor wafer W diameter.Framework separates with metal die by means of a plurality of stripper pins (ejectorpin).The moulding material of this framework 1 prepares by fusion fiberfill in predetermined resin, erose filler.For example, by with mobile and dimensional stability and fabulous nylon resin or polyphenylene sulfide (the polyphenylene sulfide of precision moldability (moldability), PPS) resin, mix with fabulous aluminium borate whisker (aluminum borate whisker) of the carbon fiber that is used to guarantee rigidity and/or calcium carbonate and chemical resistance and strengthening effect etc. and integrate, can prepare moulding material.

Arrive shown in Figure 3 as Fig. 1, framework 1 is so constructed, that is: make its inner peripheral surface 2 form to have the inclined-plane or form to have and be similar to the V-arrangement cross section that stretches out, and the left side and the right side of outer peripheral edges are all cut on front-rear direction point-blank simultaneously, and a pair of positioning recess 3 cuts out on the forward part left side and the right side of outer peripheral edges.

As shown in Figure 1, semiconductor wafer W is the type that for example has the 300mm diameter, and bonded ground and being fixed to removedly from the rear side of hollow frame 1 covers on the scribing film 10 of described framework 1.Semiconductor wafer is a plurality of tube core D by diamond blade 40 cutting-ups subsequently, and after this tube core D is picked up one by one and transmits from scribing film 10.

Scribing film 10 is with thin flat circular form, by such as ethene-vinyl acetate (ethylene-vinylacetate; EVA) or such polyolefin (polyolefin) film of analog and coating and the ultraviolet solidifiable adhesive that is laminated on the film surface make.This scribing film adheres to the rear side of framework 1, thereby makes film to peel off from the rear side of framework 1 after use, can reuse framework 1 thus.Preferably, lamination when being exposed to ultraviolet radiation, will lose its fusible ultraviolet solidifiable adhesive, yet, if necessary, can for be coating and a kind of acryloid cement of lamination.

Shown in Fig. 1,2 and 4, the flat part 30 of ream is similar to rectangle in plane, and size and thickness according to the RF tag (RF tag) 34 of bar code or radio-frequency recognition system 33 have the cross section that is similar to dish (dish like), with bigger darker than bar code or RF tag 34.In the present embodiment, RF tag 34 is by installations and bonding such as a kind of adhesives.

Because the thickness of RF tag 34 is generally 0.2 to 0.4mm, the flat part 30 of ream forms to be had 0.3 to 0.5mm the degree of depth or is preferably 0.3 to 0.4mm the degree of depth.Consider and prevent that during vacuum attraction air from leaking, the flat part 30 of ream is so constructed promptly: the near flat surface 4 of framework 1 is bored inclined-plane (tapered slope) 32 with the periphery of bottom 31 and is connected, and the inclination angle on inclined-plane 32 is defined as about 30 degree or following (see figure 4)s.

As shown in Figure 1, radio-frequency recognition system 33 comprises: RF tag 34, and it moves with framework 1 and has the addressable internal memory of radio wave; Antenna element 35 is used for and RF tag 34 exchange radio wave and electrical power; Read write line 36 is used to control the radio communication with RF tag 34; With computer 37, be used to control read write line 36.Antenna element 35 and read write line 36 can provide on demand dividually or integrally.Also might use various types of controller substituting for computer 37, as long as do not hinder the control of read write line 36.

According to above-mentioned configuration, replaced to form and had the flat part 30 of ream straight line or angled approximate U-shaped cross section, the flat part 30 of ream forms and has the hollow that possesses approximate dish-shaped cross section, and the inclination angle on inclined-plane 32 be defined as about 30 degree or below.Promptly, the periphery of the flat part 30 of ream does not form has precipitous protuberance, thereby might eliminate in the problem of carrying out with vacuum mat 20 taking place during the vacuum attraction: promptly form very big step or gap (clearance) between flat part 30 of ream and vacuum mat 20, because of the transfer of the position that hinders vacuum attraction and vacuum mat 20 by slot leakage.Therefore, might anticipate reliable vacuum attraction, its improved significantly the attraction position of vacuum mat 20 flexibility in position, and carry and transmit dicing frame reposefully.

In addition, necessaryly form vacuum mat 20, might eliminate because the aging material degradation that causes makes vacuum mat 20 hardening and thereby can not carry out the risk of vacuum attraction with soft material because no longer include.In addition, consider to prevent that air from leaking, no longer include relatively poor minor diameter vacuum mat 20 of necessary use attraction or special-purpose vacuum mat 20, therefore might increase the versatility of framework 1, vacuum mat 20, installed part (mounter) etc. significantly.And because framework 1 is to replace metal to make by resin, it will not apply the communication characteristic of any adverse effect in RF tag 34.

Next, Fig. 5 shows another embodiment of the present invention.In the case, border between the bottom 31 of surface 4, inclined-plane 32 and the flat part 30 of ream of framework 1 is not connected with the non-curved surface that tends to form step, but link to each other with level and smooth continuous curved surface, so that between them, be not formed with angle corner angle (angular corner).Other structure is same as the previously described embodiments, thereby has omitted explanation.

Equally in this embodiment, be contemplated to operation same as described above and function, because the flat part 30 of the surface 4 of framework 1, inclined-plane 32 and ream is to be formed by the continuous bend surface without any corner angle, clearly between flat part 30 of ream and vacuum mat 20, will there be big slit to form.

Dicing frame of the present invention should be limited to the foregoing description fully.For example, although in the above-described embodiments, the RF tag 34 of radio-frequency recognition system 33 adheres to (attach) flat part 30 of ream to framework 1, and bar code also can be attached to the flat part 30 of ream.The flat part 30 of ream not necessarily is used to adhere to RF tag 34 or bar code, but can be used near vertical burr (burr) that may occur the stripper pin of mould avoiding during the molding process being created in.

Claims

1, a kind of dicing frame, it comprises: semiconductor wafer is fixed in wherein hollow frame by resiniferous moulding material being used for of forming, described framework is inhaled pad and can be attracted with pulling down,

It is characterized in that: the front surface of described framework and at least one in the rear surface form has sagging part, and the inclined-plane that the basal surface of the surface of described framework and described sagging part is had about 30 degree or a following inclination angle engages.

2, dicing frame as claimed in claim 1 is characterized in that, the RF tag of bar code or radio-frequency recognition system is attached in described sagging part.