CN101636907A - 通过低压注入活性树脂而密封复杂形状的电子传感器的方法 - Google Patents
通过低压注入活性树脂而密封复杂形状的电子传感器的方法 Download PDFInfo
- Publication number
- CN101636907A CN101636907A CN200880008641A CN200880008641A CN101636907A CN 101636907 A CN101636907 A CN 101636907A CN 200880008641 A CN200880008641 A CN 200880008641A CN 200880008641 A CN200880008641 A CN 200880008641A CN 101636907 A CN101636907 A CN 101636907A
- Authority
- CN
- China
- Prior art keywords
- reactive resin
- injection
- overflow container
- filler opening
- low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
-
- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05B—LOCKS; ACCESSORIES THEREFOR; HANDCUFFS
- E05B81/00—Power-actuated vehicle locks
- E05B81/54—Electrical circuits
- E05B81/64—Monitoring or sensing, e.g. by using switches or sensors
- E05B81/76—Detection of handle operation; Detection of a user approaching a handle; Electrical switching actions performed by door handles
- E05B81/77—Detection of handle operation; Detection of a user approaching a handle; Electrical switching actions performed by door handles comprising sensors detecting the presence of the hand of a user
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/945—Proximity switches
- H03K17/95—Proximity switches using a magnetic detector
- H03K17/9505—Constructional details
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Casings For Electric Apparatus (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0701913A FR2913808B1 (fr) | 2007-03-16 | 2007-03-16 | Procede d'entancheisation d'un capteur electronique de forme complexe par injection basse pression de resine reactive |
FR0701913 | 2007-03-16 | ||
PCT/EP2008/001885 WO2008128602A1 (fr) | 2007-03-16 | 2008-03-10 | Procédé d'étanchéisation d'un capteur électronique de forme complexe par injection basse pression de résine réactive |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101636907A true CN101636907A (zh) | 2010-01-27 |
CN101636907B CN101636907B (zh) | 2012-09-26 |
Family
ID=38596113
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008800086414A Active CN101636907B (zh) | 2007-03-16 | 2008-03-10 | 通过低压注入活性树脂而密封复杂形状的电子传感器的方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20100109192A1 (zh) |
CN (1) | CN101636907B (zh) |
FR (1) | FR2913808B1 (zh) |
WO (1) | WO2008128602A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103764362A (zh) * | 2011-09-01 | 2014-04-30 | 施耐德电器工业公司 | 用于控制填充具有未填充区域的检测器的树脂水平的装置 |
CN104713583A (zh) * | 2013-12-13 | 2015-06-17 | 欧姆龙株式会社 | 电子设备 |
CN106415212A (zh) * | 2013-12-12 | 2017-02-15 | Sc2N公司 | 测量传感器 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010048309A1 (de) * | 2010-10-14 | 2012-04-19 | Continental Automotive Gmbh | Verfahren zur Herstellung eines Hochtemperatur-Sensors und Hochtemperatur-Sensor |
DE102011121045B3 (de) | 2011-12-14 | 2012-11-22 | K.A. Schmersal Holding Gmbh & Co. Kg | Elektrisches Schaltgerät |
FR3015025B1 (fr) * | 2013-12-12 | 2016-01-22 | Sc2N Sa | Capteur de mesure |
DE102019106813A1 (de) * | 2019-03-18 | 2020-09-24 | Huf Hülsbeck & Fürst Gmbh & Co. Kg | Türgriff-Elektronik-Modul eines Kraftfahrzeugs |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63178037U (zh) * | 1987-05-07 | 1988-11-17 | ||
JP2602343B2 (ja) * | 1990-05-07 | 1997-04-23 | 三菱電機株式会社 | Icカード |
DE4244994B8 (de) * | 1992-03-19 | 2006-08-10 | I F M Electronic Gmbh | Gehäuse mit vergossenen Bauteilen |
JP2774906B2 (ja) * | 1992-09-17 | 1998-07-09 | 三菱電機株式会社 | 薄形半導体装置及びその製造方法 |
TW222346B (en) * | 1993-05-17 | 1994-04-11 | American Telephone & Telegraph | Method for packaging an electronic device substrate in a plastic encapsulant |
DE19504608C2 (de) * | 1995-02-11 | 2002-03-21 | Balluff Gebhard Feinmech | Positionssensor und Verfahren zur Herstellung desselben |
US5588202A (en) * | 1995-03-17 | 1996-12-31 | Honeywell Inc. | Method for manufacturing an overmolded sensor |
DE19622445C1 (de) * | 1996-06-05 | 1997-07-24 | Siemens Ag | Näherungsschalter mit mechanischer Entkopplung von Anschlußstiften und Steckereinsatz |
US5955021A (en) * | 1997-05-19 | 1999-09-21 | Cardxx, Llc | Method of making smart cards |
JP3438565B2 (ja) * | 1997-08-22 | 2003-08-18 | ユニ電子工業株式会社 | 盗難防止用タグ |
US6495083B2 (en) * | 1997-10-29 | 2002-12-17 | Hestia Technologies, Inc. | Method of underfilling an integrated circuit chip |
US6117382A (en) * | 1998-02-05 | 2000-09-12 | Micron Technology, Inc. | Method for encasing array packages |
US6256873B1 (en) * | 1998-03-17 | 2001-07-10 | Cardxx, Inc. | Method for making smart cards using isotropic thermoset adhesive materials |
DE10041166C2 (de) * | 2000-08-21 | 2002-11-14 | Ifm Electronic Gmbh | Elektronisches Schaltgerät |
DE10304775B3 (de) * | 2003-02-05 | 2004-10-07 | Infineon Technologies Ag | Messgerät für einen Biosensor in Chipkartenform und Messverfahren |
TW577624U (en) * | 2003-03-14 | 2004-02-21 | View Technology Co Ltd 3 | Package structure of small-sized card |
US7118646B2 (en) * | 2004-03-15 | 2006-10-10 | Delphi Technologies, Inc. | Method of manufacturing a sealed electronic module |
GB0414456D0 (en) * | 2004-06-29 | 2004-07-28 | Advanced Composites Group Ltd | Sealing devices and sealing methods |
TWM312771U (en) * | 2006-09-29 | 2007-05-21 | Taiwan Oasis Technology Co Ltd | Chip packaging device capable of preventing excessive glue, light emitting diode and light source |
-
2007
- 2007-03-16 FR FR0701913A patent/FR2913808B1/fr active Active
-
2008
- 2008-03-10 US US12/531,648 patent/US20100109192A1/en not_active Abandoned
- 2008-03-10 CN CN2008800086414A patent/CN101636907B/zh active Active
- 2008-03-10 WO PCT/EP2008/001885 patent/WO2008128602A1/fr active Application Filing
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103764362A (zh) * | 2011-09-01 | 2014-04-30 | 施耐德电器工业公司 | 用于控制填充具有未填充区域的检测器的树脂水平的装置 |
CN103764362B (zh) * | 2011-09-01 | 2016-04-13 | 施耐德电器工业公司 | 用于控制填充具有未填充区域的检测器的树脂水平的装置 |
CN106415212A (zh) * | 2013-12-12 | 2017-02-15 | Sc2N公司 | 测量传感器 |
CN106415212B (zh) * | 2013-12-12 | 2019-05-31 | Sc2N公司 | 测量传感器 |
CN104713583A (zh) * | 2013-12-13 | 2015-06-17 | 欧姆龙株式会社 | 电子设备 |
CN104713583B (zh) * | 2013-12-13 | 2017-04-12 | 欧姆龙株式会社 | 电子设备 |
Also Published As
Publication number | Publication date |
---|---|
FR2913808A1 (fr) | 2008-09-19 |
FR2913808B1 (fr) | 2009-04-24 |
US20100109192A1 (en) | 2010-05-06 |
CN101636907B (zh) | 2012-09-26 |
WO2008128602A1 (fr) | 2008-10-30 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: Fa Guotuluzi Patentee after: WeiPai technology France Ltd. Address before: Fa Guotuluzi Patentee before: Cibet France Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210401 Address after: Fa Guotuluzi Patentee after: Cibet France Ltd. Address before: Fa Guotuluzi Patentee before: CONTINENTAL AUTOMOTIVE FRANCE Effective date of registration: 20210401 Address after: 387 Huimin Road, Yangpu District, Shanghai Patentee after: WeiPai technology investment (China) Co.,Ltd. Address before: Fa Guotuluzi Patentee before: WeiPai technology France Ltd. |
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TR01 | Transfer of patent right |