CN101621057B - Active assembly array base plate - Google Patents
Active assembly array base plate Download PDFInfo
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- CN101621057B CN101621057B CN 200910111649 CN200910111649A CN101621057B CN 101621057 B CN101621057 B CN 101621057B CN 200910111649 CN200910111649 CN 200910111649 CN 200910111649 A CN200910111649 A CN 200910111649A CN 101621057 B CN101621057 B CN 101621057B
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- connection pads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05553—Shape in top view being rectangular
Abstract
The invention relates to an active assembly array base plate which comprises an active assembly array, a plurality of first connecting pads, a plurality of second connecting pads, a plurality of detection connecting pads, a plurality of switch assemblies, a detection signal pad, a switch assembly control pad, as well as at least one drive chip, wherein the first connecting pads are electrically connected with the active assembly array; the second connecting pads are electrically insulated from the first connecting pads; the detection connecting pads are configured between the second connecting pads and the first connecting pads; the switch assemblies are configured between the detection connecting pads and the first connecting pads; and the drive chips are electrically connected to the first connecting pads, the second connecting pads and the detection connecting pads. The detection connecting pads are separated from the second connecting pads, wherein each detection connecting pad corresponds to one of the second connecting pads; the switch assemblies are electrically connected with the detection connecting pads; and both the detection signal pad used for inputting or outputting a detection signal and the switch assembly control pad for opening or closing the switch assemblies are electrically connected with the switch assemblies.
Description
Technical field
The invention relates to a kind of active assembly array base plate, and particularly relevant for a kind of active assembly array base plate with testing circuit.
Background technology
Along with the evolution of photoelectricity and semiconductor technology, so driven the flourish of display.In all multi-displays, (Liquid Crystal Display LCD) is widely used LCD recently, and (Cathode Ray Tube CRT) becomes one of the main flow of display of future generation to replace cathode-ray tube display.
Single with regard to the active assembly array base plate in the LCD, in order to improve the yield of active assembly array base plate, usually after finishing the processing procedure of active assembly array base plate, can carry out electrical detection to assembly in the active assembly array base plate or circuit, could normal operation to judge these assemblies or circuit.For chip for driving on the active assembly array base plate and connection pad connecting state are between the two detected, generally can use microscope to observe connecting state between chip for driving and the connection pad.Yet such method not only expends man-hour, the problem that the human error of also deriving is easily brought.Therefore, a kind of circuit design with electrical detection function that is provided with in the perimeter circuit district of active assembly array base plate is suggested.
Fig. 1 looks schematic diagram on the part for known active assembly array base plate.Please refer to Fig. 1, active assembly array base plate 100 comprise a plurality of first connection pad 120a of being arranged at the driving component array 110 among the I ' of viewing area and being disposed at perimeter circuit district II ', 120b, 120c ..., a plurality of second connection pad 130a, 130b, 130c ..., one detect a signal pad 160 and a chip for driving (not illustrating).The first connection pad 120a, 120b, 120c ... electrically connect with driving component array 110, and the first connection pad 120a, 120b, 120c ... and the second connection pad 130a, 130b, 130c ... electrically connect with chip for driving.
Hold above-mentioned, the first connection pad 120a in the left side of Fig. 1 is electrically connected to and detects signal pad 160, therefore, when the first connection pad 120a, 120b, 120c ... and the second connection pad 130a, 130b, 130c ... with after chip for driving engages, just can see through detect test signal on the signal pad 160 and learn electric characteristics between the first connection pad 120a and the chip for driving, with the connecting state of further judgement first connection pad 120a and chip for driving.Yet, detect the connecting state that signal pad 160 only can detect between the first connection pad 120a and the chip for driving, but all the other the first connection pad 120b, 120c ... and the connecting state between the chip for driving is just unknown.
Summary of the invention
The purpose of this invention is to provide a kind of active assembly array base plate, dispose testing circuit on it, wherein this testing circuit can to a plurality of connection pads and and the chip for driving that electrically connects of these connection pads between connecting state detect.
For specifically describing content of the present invention, at this a kind of active assembly array base plate is proposed, it has an adjacent viewing area and a perimeter circuit district, and comprises that a driving component array, a plurality of first connection pad, a plurality of second connection pad, a plurality of detection connection pad, a plurality of switch module, detect signal pad, switch module control pad and at least one chip for driving.The driving component array is disposed at the viewing area, and first connection pad and second connection pad are disposed at the perimeter circuit district, and wherein first connection pad electrically connects the driving component array, second connection pad, first connection pad that is electrically insulated.The detection connection pad is disposed at the perimeter circuit district between second connection pad and first connection pad, and separates with second connection pad, and wherein each detects corresponding second connection pad of connection pad one of them.Switch module is disposed at the perimeter circuit district of detecting between the connection pad and first connection pad, and electrically connects the detection connection pad.Detect the signal pad and be disposed at the perimeter circuit district, and electrically connect switch module, wherein detect the signal pad in order to inputing or outputing the detection signal, and switch module control is filled up in order to the unlatching of control switch assembly or closed with switch module control pad.Chip for driving electrically connects first connection pad, second connection pad and detects connection pad.
According to one embodiment of the invention, chip for driving comprises a plurality of first pins and a plurality of second pin.First pin electrically connects first connection pad, and second pin electrically connects second connection pad and detect connection pad.In one embodiment, each second pin comprises a drive division and a test section.Drive division electrically connects the second corresponding connection pad, and test section electrically connects corresponding detection connection pad.In one embodiment, in each second pin, drive division and test section electrically connect.In another embodiment, in each second pin, drive division and test section are separated from one another.
According to one embodiment of the invention, active assembly array base plate more comprises an anisotropy conductive media, and wherein the anisotropy conductive media is disposed at first connection pad, second connection pad and detects between connection pad and at least one chip for driving.
According to one embodiment of the invention, active assembly array base plate more comprises a bendable printed circuit board (PCB), a plurality of bendable printed circuit connection pad and a plurality of leads.Bendable printed circuit connection pad is disposed at the perimeter circuit district, and electrically connects with bendable printed circuit board (PCB), and lead-in wire is electrically connected at respectively between second connection pad of corresponding bendable printed circuit connection pad and correspondence.
According to one embodiment of the invention, each switch module is a thin-film transistor.In one embodiment, an end of each thin-film transistor electrically connects and detects connection pad, and its other end electrically connects and detects the signal pad, and its another end electrically connects switch module control pad.
Based on above-mentioned, testing circuit on the active assembly array base plate of the present invention can have a plurality of detection connection pads, connection pad that wherein is engaged with each other and chip for driving can see through corresponding detection connection pad and detect, and then judge the connection pad that is engaged with each other and electrical relation and the connecting state between the chip for driving.
For above and other objects of the present invention, feature and advantage can be become apparent, embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Description of drawings
Fig. 1 looks schematic diagram on the part for known active assembly array base plate.
Fig. 2 looks schematic diagram on the part for a kind of active assembly array base plate of one embodiment of the invention.
Fig. 3 is the generalized section according to hatching A-B among Fig. 2 and hatching C-D gained.
Fig. 4 is the partial cutaway schematic of the another kind of active assembly array base plate of one embodiment of the invention.
Primary clustering symbol description in the accompanying drawing:
100,200: active assembly array base plate
110,310: the driving component array
120a, 120b, 120c, 320a, 320b, 320c: first connection pad
130a, 130b, 130c, 330a, 330b, 330c: second connection pad
160,360: detect the signal pad
340a, 340b, 340c: detect connection pad
350a, 350b, 350c: switch module
370: switch module control pad
380: chip for driving
420a: first pin
430a: second pin
500: the anisotropy conductive media
610: bendable printed circuit board (PCB)
620a, 620b, 620c: bendable printed circuit connection pad
630a, 630b, 630c: lead-in wire
I ', I: viewing area
II ', II: perimeter circuit district
DA: drive division
TA: test section
Embodiment
Fig. 2 looks schematic diagram on the part for a kind of active assembly array base plate of one embodiment of the invention, and the partial cutaway schematic of a kind of active assembly array base plate of Fig. 3 one embodiment of the invention.Wherein, the pairing structure of regional AB among Fig. 3 is the section according to the hatching A-B gained among Fig. 2, and the pairing structure of the zone C D among Fig. 3 is the section according to the hatching C-D gained among Fig. 2.
Please be simultaneously with reference to Fig. 2 and Fig. 3, the active assembly array base plate 200 of present embodiment has an adjacent viewing area I and a perimeter circuit district II, and comprise a driving component array 310 that is disposed among the I of viewing area and a plurality of first connection pad 320a that are disposed at perimeter circuit district II, 320b, 320c ..., a plurality of second connection pad 330a, 330b, 330c ..., a plurality of detection connection pad 340a, 340b, 340c ..., a plurality of switch module 350a, 350b, 350c ..., one detect signal pad 360, switch module control pad 370 and at least one chip for driving 380.
Need to prove that at this for convenience of description, following embodiment only describes with a chip for driving 380.Yet in the application of actual product, the number of chip for driving 380 should be decided on the demand of product, and in other words, the present invention is not subject to the number of chip for driving number.
In the present embodiment, active assembly array base plate 200 for example is the glass substrate that band carries chip, wherein driving component array 310 is made of a plurality of picture element unit (not illustrating) with driving component (not illustrating), and chip for driving 380 for example is gate drive chip or the source driving chip that is used for driving each picture element unit in the driving component array 310.
In addition, the chip for driving 380 of present embodiment can utilize cover crystal glass (Chip On Glass, COG) processing procedure and with the first connection pad 320a, 320b, 320c ..., the second connection pad 330a, 330b, 330c ... and detect connection pad 340a, 340b, 340c are bonded with each other.Below at first with regard to the driving component array 310 of present embodiment, the first connection pad 320a, 320b, 320c ..., the second connection pad 330a, 330b, 330c ... and chip for driving 380 etc. partly describes.
In the present embodiment, chip for driving 380 electrically connect the first connection pad 320a, 320b, 320c ... and the second connection pad 330a, 330b, 330c ... wherein the first connection pad 320a, 320b, 320c ... electrically connect with driving component array 310, but with the second connection pad 330a, 330b, 330c ... be electrically insulated.On the practice, chip for driving 380 is utilized its a plurality of pin (pins usually, be detailed later) electrically connect respectively the first connection pad 320a, 320b, 320c ... with the second connection pad 330a, 330b, 330c ..., and see through the first connection pad 320a, 320b, 320c ... further provide the driving signal to driving component array 310 with the second connection pad 330a, 330b, 330c.
For instance, chip for driving 380 comprises a plurality of first pins and a plurality of second pin, and wherein Fig. 3 only illustrates one first pin 420a and one second pin 430a is an example.In the present embodiment, first pin (for example 420a) electrically connects first connection pad (for example 320a), and second pin (for example 430a) electrically connects second connection pad (for example 330a), and then driving component array 310 just can see through chip for driving 380 and obtain its required driving signal.
In the present embodiment, for example be utilize an anisotropy conductive media 500 reach between first pin (for example 420a) and first connection pad (for example 320a) electrically conduct and second pin (for example 430a) and second connection pad (for example 330a) between electrically conduct.Wherein, anisotropy conductive media 500 normally the anisotropy conductive film (Anisotropic Conductive Film, ACF), (Anisotropic ConductivePaste ACP) waits the material that the anisotropy conductive characteristic can be provided to anisotropic conductive.
Further, anisotropy conductive media 500 is disposed between first connection pad (for example 320a) and first pin (for example 420a), and is disposed between second connection pad (for example 330a) and second pin (for example 430a).General anisotropy conductive media 500 is made of conducting particles, form short circuit phenomenon between connection pad (for example first, second connection pad 320a, 330a), conducting particles and pin (for example first, second pin 420a, the 430a) three and can make, and then connection pad (for example first, second connection pad 320a, 330a) and pin (for example first, second pin 420a, 430a) are electrically connected by pressing first connection pad (for example 320a) and first pin (for example 420a) and pressing second connection pad (for example 330a) and second pin (for example 430a).
Know the configuration relation between the three between anisotropy conductive media 500 and other connection pad and the corresponding pin thereof by inference by above-mentioned, do not described at this.In brief, anisotropy conductive media 500 be disposed at the first connection pad 320a, 320b, 320c ... and between the chip for driving 380, and be disposed at the second connection pad 330a, 330b, 330c ... and between the chip for driving 380, thus make the first connection pad 320a, 320b, 320c ... and the second connection pad 330a, 330b, 330c ... seen through anisotropy conductive media 500 and electrically connected with chip for driving 380.
On the other hand, please be simultaneously with reference to Fig. 2 and Fig. 3, the active assembly array base plate 200 of present embodiment also can further be provided with a bendable printed circuit (Flexible Printed Circuit, FPC) plate 610, a plurality of bendable printed circuit connection pad 620a, 620b, 620c ... and a plurality of leads 630a, 630b, 630c ..., wherein bendable printed circuit board (PCB) 610 and the bendable printed circuit connection pad 620a that is disposed at perimeter circuit district II, 620b, 620c ... electrically connect.Lead-in wire 630a, 630b, 630c ... be electrically connected at respectively corresponding bendable printed circuit connection pad 620a, 620b, 620c ... and the second corresponding connection pad 330a, 330b, 330c ... between.
In detail, lead-in wire 630a is electrically connected between the bendable printed circuit connection pad 620a and the second connection pad 330a, lead-in wire 630b is electrically connected between the bendable printed circuit connection pad 620b and the second connection pad 330b, and lead-in wire 630c is electrically connected between the bendable printed circuit connection pad 620c and the second connection pad 330c, by that analogy the configuration relation between other bendable printed circuit connection pad, lead-in wire and the second connection pad three.
Thus, the signal that the bendable printed circuit board (PCB) 610 of present embodiment is exported just can see through bendable printed circuit connection pad 620a and lead-in wire 630a and be sent to the second connection pad 330a, sees through the second pin 430a that anisotropy conductive media 500 is sent to chip for driving 380 again.Chip for driving 380 just can be carried out computing after receiving these signals, to produce the required driving signal of driving component array 310.Then, this driving signal sees through the first pin 420a, anisotropy conductive media 500 and the first connection pad 320a and is transferred into driving component array 310.
See through above-mentioned general description, learn between driving component array 310 among the viewing area I of present embodiment and the chip for driving 380 be the first connection pad 320a that how to see through perimeter circuit district II, 320b, 320c ... and the second connection pad 330a, 330b, 330c ... obtain binding, and make driving component array 310 obtain the driving signal that chip for driving 380 is provided.Yet, when chip for driving 380 and the second connection pad 330a, 330b, 330c ... between when having bad electrical the relation, then driving component array 310 required driving signals just might be affected, and then influence the display quality of display unit.
For fully understand the chip for driving 380 and the second connection pad 330a, 330b, 330c ... between electrical relation, present embodiment in perimeter circuit district II be provided with detect connection pad 340a, 340b, 340c ..., switch module 350a, 350b, 350c ..., detect signal pad 360 and switch module control pad 370.In the following embodiments, will at detect connection pad 340a, 340b, 340c ..., switch module 350a, 350b, 350c ..., the relation that detects between signal pad 360 and the switch module control pad 370 describes.
In the present embodiment, respectively with the second connection pad 330a, 330b, 330c ... corresponding detection connection pad 340a, 340b, 340c ... be disposed at the second connection pad 330a, 330b, 330c ... with the first connection pad 320a, 320b, 320c ... between perimeter circuit district II, and with the first connection pad 320a, 320b, 320c ... and the second connection pad 330a, 330b, 330c ... separate.In addition, switch module 350a, 350b, 350c ... be disposed at detect connection pad 340a, 340b, 340c ... with the first connection pad 320a, 320b, 320c ... between.
In the present embodiment, switch module 350a, 350b, 350c ... for example be thin-film transistor, wherein three ends of each thin-film transistor electrically connect respectively detect connection pad 340a, 340b, 340c ..., detect signal pad 360 and switch module control pad 370.More particularly, a wherein end of the source of thin-film transistor/drain end electrically connect to detect connection pad 340a, 340b, 340c ..., the other end of its source/drain end electrically connects and detects signal pad 360, and its gate terminal electrically connects switch module control pad 370.
So, present embodiment just can see through detect signal pad 360 and will detect signal be sent to detection connection pad 340a, 340b, 340c ... in.Further say, switch module control pad 370 and detect signal pad 360 can provide respectively open signal and detect signal to control switch assembly 350a, 350b, 350c ..., and with switch module 350a, 350b, 350c ... the detection connection pad 340a that electrically connects, 340b, 340c ... just can receive the detection signal.That is to say, switch module 350a, the 350b of present embodiment, 350c ... as detect signal pad 360 with detect connection pad 340a, 340b, 340c ... between bridge to reach the effect that transmit to detect signal, wherein switch module 350a, 350b, 350c ... open/close state can be controlled by controlling signal on the switch module control pad 370.
For instance, please be simultaneously with reference to Fig. 2 and Fig. 3, switch module 350a, 350b, 350c ... can see through switch module control pad 370 receives a unlatching signal (a for example high levle signal) and is in opening, at this moment, detect connection pad 340a, 340b, 340c ... can see through switch module 350a, 350b, 350c ... receive and input to the detection signal that detects signal pad 360.
As shown in Figure 2, the detection connection pad 340a of present embodiment, 340b, 340c ... and further dispose anisotropy conductive media 500 between the chip for driving 380.Thus, each detects connection pad (for example 340a) and just can electrically connect with corresponding second pin (for example 430a), and wherein each second pin (for example 430a) can be divided into a drive division DA and a test section TA.Drive division DA electrically connects corresponding second connection pad (for example 330a), and test section TA electrically connects corresponding detection connection pad (for example 340a).
Hold above-mentioned, detect connection pad 340a after receiving above-mentioned detection signal, this detects signal and can see through anisotropy conductive media 500 and chip for driving 380 earlier and be transferred into the second connection pad 330a, is transferred into bendable printed circuit connection pad 620a through lead-in wire 630a more afterwards.Other detection connection pad 340b, 340c ..., switch module 350b, 350c ..., the second connection pad 330b, 330c ... and bendable printed circuit connection pad 620b, 620c ... between the signal transmission can not be described in detail at this by that analogy.In brief, present embodiment can see through with detect connection pad 340a, 340b, 340c ... the corresponding second connection pad 330a that connects, 330b, 330c ... and bendable printed circuit connection pad 620a, 620b, 620c ... obtain to detect signal, so judge the second connection pad 330a, 330b, 330c ... and the electrical relation between the chip for driving 380.
It should be noted that the second pin 430a among the above-mentioned Fig. 3 of being illustrated in is made of integrally formed drive division DA and test section TA.That is to say that the drive division DA and the test section TA of present embodiment are electrically connected to each other.Yet, in other embodiments, the drive division DA that electrically connects with second connection pad (for example 330a) and with detect the test section TA that connection pad (for example 340a) electrically connects also can be separated from one another, as second pin (for example 430a) that Fig. 4 illustrated.
In addition, in other embodiments, when switch module 350a, 350b, 350c ... during unlatching, also can with detect signal input to bendable printed circuit connection pad 620a, 620b, 620c ... in, and this detect signal in regular turn through lead-in wire 630a, 630b, 630c ..., the second connection pad 330a, 330b, 330c ..., chip for driving 380, detect connection pad 340a, 340b, 340c ... and switch module 350a, 350b, 350c ... after just can be sent to and detect signal pad 360.Thus, measure by detecting the detection signal that signal pad 360 is exported, equally also can obtain the second connection pad 330a, 330b, 330c ... with electrical relation between the chip for driving 380 and engage situation.
From the above, see through to open switch module 350a, 350b, 350c ... and detect signal, can learn the second connection pad 330a, 330b, 330c ... and the electrical relation between the chip for driving 380, so understand the second connection pad 330a, 330b, 330c ... with the situation that engages between the chip for driving 380.With the viewpoint of product, this measure helps to improve the yield of active assembly array base plate 200, and then makes the display quality of the display unit of using active assembly array base plate 200 obtain to promote.With the processing procedure viewpoint, when the second connection pad 330a, 330b, 330c ... when engaging bad situation between the chip for driving 380, can in time detect bad engaging zones also can further improve, are left in the successive process steps bad active assembly array base plate 200 is continuous avoiding, thereby reduce unnecessary consuming time and expense.
Review, conventional detection circuitry needs the extra microscope that uses to observe the situation that engages between connection pad and the chip for driving, and tradition to separate the information that the survey method obtained when the electrical detection of carrying out between connection pad and the chip for driving also extremely limited.Yet, a plurality of connection pads that present embodiment and chip for driving electrically connect can with a plurality of corresponding connections of detection connection pad, see through measurement detection signal, can fully judge the connecting state between each connection pad and the chip for driving.This measure not only can be saved and be used microscope spent man-hour, also can avoid artificial observation and produce unnecessary human error, thereby reliability improves thereupon.
Special one carry be, when switch module 350a, 350b, 350c ... be not unlocked and when being in closed condition, detect connection pad 340a, 340b, 340c ... and detect signal pad 360 understand naturally with chip for driving 380 and the second connection pad 330a, 330b, 330c ... be electrically insulated.In other words, present embodiment utilize to detect connection pad 340a, 340b, 340c ..., switch module 350a, 350b, 350c ..., detect after signal pad 360 and switch module control pad 370 detect, need not to take extra fabrication steps to cut off or destroy to detect connection pad 340a, 340b, 340c ..., switch module 350a, 350b, 350c ..., detect the configuration of signal pad 360 or switch module control pad 370, this measure can be avoided unnecessary manufacturing step, and then shortens and make man-hour and save cost of manufacture.
In sum, active assembly array base plate of the present invention can carry out electrical detection to the chip for driving of configuration on it and with connection pad that chip for driving is engaged with each other.See through the setting of a plurality of detection connection pads of active assembly array base plate, can judge the chip for driving that is engaged with each other and the electrical relation between the connection pad fully, and then judge its connecting state.Generally speaking, the present invention has high yield, high reliability, simplifies fabrication steps and reduces advantages such as Production Time and cost.
Though the present invention discloses as above with embodiment; right its is not in order to limit the present invention; any person with usual knowledge in their respective areas; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking the accompanying Claim person of defining.
Claims (9)
1. an active assembly array base plate has an adjacent viewing area and a perimeter circuit district, it is characterized in that, comprising:
One driving component array is disposed at this viewing area;
A plurality of first connection pads are disposed at this perimeter circuit district, electrically connect this driving component array;
A plurality of second connection pads are disposed at this perimeter circuit district, and those first connection pads are electrically insulated;
A plurality of detection connection pads are disposed at this perimeter circuit district between those second connection pads and those first connection pads, and separate with those second connection pads, and wherein each detects corresponding those second connection pads of connection pad one of them;
A plurality of switch modules are disposed at this perimeter circuit district between those detection connection pads and those first connection pads, electrically connect those and detect connection pad;
One detects the signal pad, is disposed at this perimeter circuit district, electrically connects those switch modules, in order to input or output the detection signal;
One switch module control pad is disposed at this perimeter circuit district, electrically connects those switch modules, in order to the unlatching of controlling those switch modules or close; And
At least one chip for driving electrically connects those first connection pads, those second connection pads and those detection connection pads.
2. active assembly array base plate according to claim 1 is characterized in that, wherein this at least one chip for driving comprises:
A plurality of first pins electrically connect those first connection pads; And
A plurality of second pins electrically connect those second connection pads and those detect connection pad.
3. active assembly array base plate according to claim 2 is characterized in that, wherein each second pin comprises:
One drive division electrically connects the second corresponding connection pad; And
One test section electrically connects corresponding detection connection pad.
4. active assembly array base plate according to claim 3 is characterized in that, wherein in each second pin, this drive division and this test section electrically connect.
5. active assembly array base plate according to claim 3 is characterized in that, wherein in each second pin, this drive division and this test section are separated from one another.
6. active assembly array base plate according to claim 1 is characterized in that, more comprises:
One anisotropy conductive media is disposed between those first connection pads, those second connection pads and those detection connection pads and this at least one chip for driving.
7. active assembly array base plate according to claim 1 is characterized in that, more comprises:
One bendable printed circuit board (PCB);
A plurality of bendable printed circuit connection pads are disposed at this perimeter circuit district, and electrically connect with this bendable printed circuit board (PCB); And
A plurality of leads is electrically connected at respectively between second connection pad of corresponding bendable printed circuit connection pad and correspondence.
8. active assembly array base plate according to claim 1 is characterized in that, wherein each switch module is a thin-film transistor.
9. active assembly array base plate according to claim 8, it is characterized in that, wherein an end of the source of each thin-film transistor/drain end electrically connects those and detects connection pad, and the other end of its source/drain end electrically connects this detection signal pad, and its gate terminal electrically connects this switch module control pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910111649 CN101621057B (en) | 2009-05-05 | 2009-05-05 | Active assembly array base plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910111649 CN101621057B (en) | 2009-05-05 | 2009-05-05 | Active assembly array base plate |
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| Publication Number | Publication Date |
|---|---|
| CN101621057A CN101621057A (en) | 2010-01-06 |
| CN101621057B true CN101621057B (en) | 2011-03-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200910111649 Expired - Fee Related CN101621057B (en) | 2009-05-05 | 2009-05-05 | Active assembly array base plate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112526791A (en) * | 2020-11-09 | 2021-03-19 | 信利（惠州）智能显示有限公司 | Display panel and display device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5349226A (en) * | 1990-12-28 | 1994-09-20 | Sharp Kabushiki Kaisha | Active matrix substrate having a contact pad for detecting bus line signals |
| CN101241281A (en) * | 2007-02-07 | 2008-08-13 | 中华映管股份有限公司 | Active element array substrate |
| CN101295720A (en) * | 2007-04-29 | 2008-10-29 | 中华映管股份有限公司 | Active element array substrate |
-
2009
- 2009-05-05 CN CN 200910111649 patent/CN101621057B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5349226A (en) * | 1990-12-28 | 1994-09-20 | Sharp Kabushiki Kaisha | Active matrix substrate having a contact pad for detecting bus line signals |
| CN101241281A (en) * | 2007-02-07 | 2008-08-13 | 中华映管股份有限公司 | Active element array substrate |
| CN101295720A (en) * | 2007-04-29 | 2008-10-29 | 中华映管股份有限公司 | Active element array substrate |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2007-114124A 2007.05.10 |
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| CN101621057A (en) | 2010-01-06 |
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