CN101621044B - Chip lug structure and manufacturing method thereof - Google Patents
Chip lug structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN101621044B CN101621044B CN200810040231XA CN200810040231A CN101621044B CN 101621044 B CN101621044 B CN 101621044B CN 200810040231X A CN200810040231X A CN 200810040231XA CN 200810040231 A CN200810040231 A CN 200810040231A CN 101621044 B CN101621044 B CN 101621044B
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- connector
- solder projection
- size
- photoresistance
- solder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
The invention provides a chip lug structure and a manufacturing method thereof. A connector for the chip lug is designed into a table shape, and the inclination angle of the side of the connector is set according to the dosage of a solder for soldering the lug so as to meet the customization requirements of clients; and compared with the prior columnar connector, under the same section diameter, the connector of the invention can support the solder of more dosage and avoid the problem that the solder flows down from the edge of a copper column in a refluxing process. The chip lug structure is positioned on a solder pad on the surface of a wafer, and comprises the connector positioned on the solder pad and a solder lug positioned on the connector, wherein the connector has the table shape.
Description
Technical field
The present invention relates to a kind of semiconductor package and manufacture method thereof, particularly relate to a kind of structure and manufacture method thereof of chip lug.
Background technology
Develop rapidly along with semiconductor process techniques, the function of semiconductor chip is become stronger day by day, its pin number also increases thereupon, in order to satisfy the demand in market, dual in-line package (DIP) technology of chip encapsulation technology one route low order etc. develops into wafer-level package high-order encapsulation technologies such as (CSP) gradually.
Wherein wafer-level package is directly to link to each other with circuit board with projection (Bumping) or tin ball (Ball Mount), owing to do not need intermediary layer (Interposer), filler (Underfill) and lead frame, and omission sticks processing procedures such as crystalline substance, routing, significantly reduce material and cost of labor, thereby obtained development fast.And in the evolution of projection cube structure, copper post projection (Cu pillar bumping) is with respect to traditional Solder Bumps, higher interconnecting lead density, reliability can be provided, improve advantages such as electrical and heat dissipation characteristics, so become the projection Developing Trend in Technology gradually.
Please refer to Fig. 1, it is the generalized section of existing copper post projection cube structure.As shown in the figure; be formed with protective layer 20 on the surface of wafer 10, it exposes weld pad 12, and copper post projection just is formed on this weld pad 12; this copper post projection is made of copper post 16 and solder projection 18 formed thereon, and has ball substrate layer 14 between copper post 16 and the weld pad 12.Usually, different product has different requirements to the scolder dosage of solder projection 18; Yet in the operation of reality, the scolder dosage of solder projection 18 but is difficult to control.Because so that its fusion when being sphere-like, too much scolder can be under copper post 16 marginal flows, thereby cause the solder flux amount not meet the demands in the backflow of scolder, and the reliability of influence encapsulation.
For this reason, how improving the structure of chip lug, to improve the problem that existing projection cube structure is had, is an important topic in fact.
Summary of the invention
Technical problem to be solved by this invention is to improve the structure of existing chip lug, to reduce the situation of scolder under copper post marginal flow in the reflux course, to satisfy the requirement of higher scolder dosage.
For solving above technical problem, the invention provides a kind of chip lug structure, be positioned on the weld pad of crystal column surface, this chip lug structure comprises the connector that is positioned on the weld pad and is positioned at solder projection on this connector, wherein said connector be shaped as stage body.
Preferable, form the first angle α between the side of connector and the crystal column surface, solder projection be shaped as the part spheroid, it forms the second angle β less than 90 degree on cross surface outward flange arbitrarily mutually with connector between tangent plane of any and the crystal column surface, and the first angle α is less than the second angle β.
Preferable, the above-mentioned first angle α is more than or equal to 80 degree and less than 90 degree.
Preferable, the material of above-mentioned connector is a copper.
Preferable, described chip lug structure also comprises: ball substrate layer, and between above-mentioned weld pad and connector.
The present invention provides a kind of manufacture method of chip lug structure in addition, wherein this chip lug comprises connector that is positioned on the crystal column surface weld pad and the solder projection that is positioned on this connector, this method comprises: set connector and the solder projection size of cross surface mutually, wherein this connector be shaped as stage body and solder projection be shaped as the part spheroid, then above-mentioned phase cross surface is circular cross surface; Determine the size of solder projection; Determine solder projection and the connector tangent plane of any and the acute angle angle β between the crystal column surface arbitrarily on the cross surface outward flange mutually; Determine the size of connector, make angle α between this connector side and the crystal column surface less than above-mentioned acute angle angle β; Make the connector and the solder projection of described shape and size.
Preferable, the connector of described shape of above-mentioned making and size and the step of solder projection comprise: the deposit photoresistance; The described photoresistance of exposure imaging forms the photoresistance opening, and wherein this photoresistance opening has the identical part of shape and size with the connector of setting; In the photoresistance opening, form connector; On connector, form scolder; Reflux and form the solder projection of setting shape and size.
Preferable, above-mentioned connector is electro-coppering and forming in above-mentioned photoresistance opening.
Preferable, the manufacture method of described chip lug structure also comprises: form ball substrate layer on the surface of wafer, then deposit photoresistance thereon.
In sum, the present invention is designed to the stage body shape with the connector of chip lug, and sets the side angle of inclination of connector according to the scolder dosage of solder projection, thereby satisfies the customization requirement; And with respect to existing column connector, under the same cross-sectional diameter, connector of the present invention can support the more scolder of multiple dose, has avoided the problem that scolder is caused down from copper post marginal flow in the reflux course.
Description of drawings
Fig. 1 is the generalized section of existing copper post projection cube structure;
Fig. 2 is the generalized section of the chip lug structure that one embodiment of the invention provided;
Fig. 3 is the manufacture method schematic flow sheet of the chip lug structure that one embodiment of the invention provided;
Fig. 4 to Fig. 8 is the processing procedure schematic diagram of the chip lug structure that one embodiment of the invention provided.
Embodiment
Below in conjunction with accompanying drawing and execution mode, the present invention is further illustrated.
Please refer to Fig. 2, it is the generalized section of the chip lug structure that one embodiment of the invention provided.As shown in the figure, this chip lug structure is formed on the weld pad 22 on wafer 20 surfaces, and it comprises the connector that is positioned on the weld pad 26 and be positioned at solder projection 28 on this connector 26, and wherein connector 26 is shaped as stage body.Usually, form the first angle α between the side of connector 26 and wafer 20 surfaces; Solder projection 28 be shaped as the part spheroid, it forms the second angle β that spend less than 90 between tangent plane of any and wafer 20 surfaces arbitrarily on cross surface outward flange mutually with connector 26, wherein the first angle α is less than the second angle β.
In practical operation, the material of connector 26 often is a copper; And often be formed with ball substrate layer 24 between itself and the weld pad 22.In addition, according to the demand of client for the scolder dosage of solder projection 28, the angle α between the side of connector 26 and wafer 20 surfaces often is designed to more than or equal to 80 degree.
Correspondingly, one embodiment of the invention also provides a kind of manufacture method (as shown in Figure 3) of chip lug structure, to make chip lug on the weld pad of crystal column surface.Wherein this chip lug is formed by being positioned at connector on the weld pad and the solder projection that is positioned on the connector, wherein connector be shaped as stage body and solder projection be shaped as the part spheroid, then connector is circular cross surface with the cross surface mutually of solder projection.Usually when product specification was determined, the stool and urine of this circular cross surface can be determined; According to product specification or customization requirement, the scolder dosage of solder projection also can obtain to determine in addition.
After the scolder dosage of the size of above circular cross surface and solder projection was determined, the manufacture method of chip lug structure usually comprised the steps:
S1: set connector and the solder projection size of cross surface mutually, as mentioned above, it is often determined according to product specification;
S2: determine the size of solder projection, promptly according to the scolder dosage of solder projection with and with the connector size of cross surface mutually, determine the height and the diameter thereof of this solder projection;
S3: determine solder projection and the connector tangent plane of any and the acute angle angle β between the crystal column surface arbitrarily on the cross surface outward flange mutually, this solder projection be shaped as the part spheroid, the above step size of this part spheroid of getting back, thus can determine angle β;
S4: the size of determining connector, make angle α between this connector side and the crystal column surface less than above-mentioned acute angle angle β, this connector is a stage body, its upper surface, be connector and solder projection cross surface mutually, size set again, so only need an angle α who sets between its side and the crystal column surface just can determine its size, and angle β has determined in above step, can realize that angle is as angle α so get less than one of angle β;
S5: connector and the solder projection of making above shape and size.
Please refer to Fig. 4 to Fig. 8, it is for making described shape and the connector of size and the schematic flow sheet of solder projection.
Have protective layer 32 on the surface of wafer 20, it exposes weld pad 22.As Fig. 4, holomorphism balling-up substrate layer 24 on wafer 20 at first, then deposit photoresistance 30 thereon.Then, as Fig. 5, exposure imaging photoresistance 30 forms photoresistance opening 40; This photoresistance opening 40 have with above step in the identical part of shape and size of the connector set, the shape and size that are the connector set in shape and size and the above step of photoresistance opening of the certain altitude of ball substrate layer more than 24 are identical, and it can be realized by adjusting the exposure focal length.Then, as Fig. 6, form connector 26 in the photoresistance opening, it is often realized by electro-coppering in photoresistance opening 40; And,, just can obtain setting the connector 26 of shape and size so a need is controlled the thickness of electro-coppering because the shape and size of the connector of setting in the shape and size of the photoresistance opening 40 of the certain altitude of ball substrate layer 24 or more and the above step are identical.Then, as Fig. 7, on connector 26, form scolder 28 '.As Fig. 8, remove photoresist layer 30 at last and etch away the not ball substrate layer 24 of connected body 26 coverings, then carry out reflow treatment, make scolder 28 ' form the solder projection 28 of setting shape and size.
As seen, the chip lug structure that under this processing procedure, obtains, because connector 26 is the stage body shape, and its side angle of inclination is to set according to the scolder dosage of solder projection, satisfies the customization requirement; And with respect to existing column connector, under the same cross-sectional diameter, connector 26 can support the more scolder of multiple dose, has avoided that scolder has improved the reliability of encapsulation from the problem that copper post marginal flow is caused down in the reflux course.
Claims (3)
1. the manufacture method of a chip lug structure, wherein this chip lug comprises the connector that is positioned on the crystal column surface weld pad and is positioned at solder projection on this connector, it is characterized in that this method comprises:
Set connector and the solder projection size of cross surface mutually, wherein this connector be shaped as stage body wide at the top and narrow at the bottom and solder projection be shaped as the part spheroid, then above-mentioned phase cross surface is circular cross surface;
Determine the size of solder projection;
Determine solder projection and the connector tangent plane of any and the acute angle angle β between the crystal column surface arbitrarily on the cross surface outward flange mutually;
Determine the size of connector, make angle α between this connector side and the crystal column surface less than above-mentioned acute angle angle β;
Make the connector and the solder projection of described shape and size, it comprises:
The deposit photoresistance;
The described photoresistance of exposure imaging forms the photoresistance opening, and wherein this photoresistance opening has the identical part of shape and size with the connector of setting;
In the photoresistance opening, form connector;
On connector, form scolder;
Reflux and form the solder projection of setting shape and size.
2. the manufacture method of chip lug structure according to claim 1 is characterized in that, wherein above-mentioned connector is electro-coppering and forming in above-mentioned photoresistance opening.
3. the manufacture method of chip lug structure according to claim 1 is characterized in that, also comprises: form ball substrate layer on the surface of wafer, then deposit photoresistance thereon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810040231XA CN101621044B (en) | 2008-07-04 | 2008-07-04 | Chip lug structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810040231XA CN101621044B (en) | 2008-07-04 | 2008-07-04 | Chip lug structure and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101621044A CN101621044A (en) | 2010-01-06 |
| CN101621044B true CN101621044B (en) | 2011-06-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810040231XA Expired - Fee Related CN101621044B (en) | 2008-07-04 | 2008-07-04 | Chip lug structure and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101621044B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5656863A (en) * | 1993-02-18 | 1997-08-12 | Mitsubishi Denki Kabushiki Kaisha | Resin seal semiconductor package |
| CN101026106A (en) * | 2006-02-24 | 2007-08-29 | 中芯国际集成电路制造(上海)有限公司 | Solder bump lead-free flux preparing process |
-
2008
- 2008-07-04 CN CN200810040231XA patent/CN101621044B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5656863A (en) * | 1993-02-18 | 1997-08-12 | Mitsubishi Denki Kabushiki Kaisha | Resin seal semiconductor package |
| CN101026106A (en) * | 2006-02-24 | 2007-08-29 | 中芯国际集成电路制造(上海)有限公司 | Solder bump lead-free flux preparing process |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2007-214571A 2007.08.23 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101621044A (en) | 2010-01-06 |
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