CN101604618A - A kind of ball-planting device of semiconductor packaging device - Google Patents

A kind of ball-planting device of semiconductor packaging device Download PDF

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Publication number
CN101604618A
CN101604618A CNA2009100527786A CN200910052778A CN101604618A CN 101604618 A CN101604618 A CN 101604618A CN A2009100527786 A CNA2009100527786 A CN A2009100527786A CN 200910052778 A CN200910052778 A CN 200910052778A CN 101604618 A CN101604618 A CN 101604618A
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CN
China
Prior art keywords
ball
machine structure
tin ball
container
attachment machine
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Granted
Application number
CNA2009100527786A
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Chinese (zh)
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CN101604618B (en
Inventor
徐光宇
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Xiamen atom Electronic Technology Co., Ltd.
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SHANGHAI MICSON SEMICONDUCTOR EQUIPMENT CO Ltd
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Priority to CN2009100527786A priority Critical patent/CN101604618B/en
Publication of CN101604618A publication Critical patent/CN101604618A/en
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Publication of CN101604618B publication Critical patent/CN101604618B/en
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Abstract

The present invention relates to a kind of ball-planting device of semiconductor packaging device, comprise frame, web plate, article two, guide rail, ball attachment machine structure and driving mechanism, described web plate is fixed on the frame, described ball attachment machine structure is positioned at the top of web plate and is slidingly matched fixing with two guide rails, this ball attachment machine structure comprises tin ball container, a pair of locating part, scraper plate, connecting plate, a plurality of springs, a plurality of amesdials and transducer, the bottom of described tin ball container is provided with the ditch seam, described a pair of locating part is fixed on the tin ball container, the longitudinal section of described scraper plate generally is taper wide at the top and narrow at the bottom, the upper end of scraper plate is fixed in the lower end of described a plurality of springs, the upper end is connected with a plurality of amesdials by connecting plate, described transducer is located in the tin ball container, and described driving mechanism and ball attachment machine structure are in transmission connection.The present invention has that cost is low, control is easy with debugging, it is wide to be suitable for, and to the tin ball injure less, success rate is high, the utilance advantages of higher.

Description

A kind of ball-planting device of semiconductor packaging device
Technical field
The present invention relates to the semiconductor packages servicing unit, particularly relate to a kind of ball-planting device of semiconductor packaging device.
Background technology
The existing ball equipment of planting is accurately implanted substrate in order to realize with the tin ball, and basic the employing sweeps that ball is planted ball, tool is inhaled the method that ball is planted ball and sieve ball.Sweep ball and be and make a swivel head with the silk hairbrush and on web plate, back and forth sweep ball and ball is swept in the web plate hole be implanted on the substrate, this kind method actuating mechanism complexity, silk hairbrush consumption is big, and the manufacturing process complex steps, need the professional often to change, cost is higher; Sweeping in the ball process tin ball relatively wastes.It is to make a tool identical with substrate that tool is inhaled ball, utilizes vacuum in the tool groove of vibrations the tin ball to be drawn onto on the tool, by the accurate localization system tin ball is implanted web plate again.This kind method actuating mechanism complexity needs image identification system, Precise Position System, and the high-performance detection system, quality of hardware such as web plate are had relatively high expectations, and price is extremely expensive.Sieve ball method mechanism is simple, but it is not high to plant the ball precision, and it is not high to plant ball efficient, and oxidation easily.
Summary of the invention
Technical problem to be solved by this invention is exactly the ball-planting device that a kind of semiconductor packaging device is provided for the defective that overcomes above-mentioned prior art existence.
Purpose of the present invention can be achieved through the following technical solutions: a kind of ball-planting device of semiconductor packaging device, it is characterized in that, comprise frame, web plate, article two, guide rail, ball attachment machine structure and driving mechanism, described web plate is fixed on the frame, described two guide rails are located at the both sides of web plate respectively, described ball attachment machine structure is positioned at the top of web plate and is slidingly matched fixing with two guide rails, this ball attachment machine structure comprises tin ball container, a pair of locating part, scraper plate, connecting plate, a plurality of springs, a plurality of amesdials and transducer, described tin ball container is located on the web plate, the bottom of this tin ball container is provided with the ditch seam, described a pair of locating part is fixed on the tin ball container, the longitudinal section of described scraper plate generally is taper wide at the top and narrow at the bottom, its upper end is located between two locating parts, its lower end is located in the ditch seam of tin ball container, and the lower surface flushes with the lower surface of tin ball container bottom, the upper end of scraper plate is fixed in the lower end of described a plurality of springs, the upper end is connected with a plurality of amesdials by connecting plate, described transducer is located in the tin ball container, and described driving mechanism and ball attachment machine structure are in transmission connection.
The present invention also comprises two travelling carriages adaptive with guide rail, and described ball attachment machine structure is slidingly matched fixing by two travelling carriages and two guide rails.
The present invention also comprises ball mechanism, and this ball mechanism comprises vibrating disc and for bulb, described vibrating disc is fixed on the travelling carriage, and described inlet for bulb is connected with vibrating disc, and its outlet is visited in tin ball container.
Described locating part comprises fixed head and adjustable bolt, and described fixed head is fixed on the tin ball container, and described adjustable bolt is threaded with fixed head.
Described driving mechanism comprises stepping motor, synchronous cog belt and synchronizing jugged the wheel, and described synchronous cog belt is connected with stepping motor on also winding and synchronizing jugged the wheel, and this synchronous cog belt and travelling carriage are in transmission connection.
Compared with prior art, the present invention has the following advantages:
1, cost reduces: this device has only been used materials such as common stepping motor, transducer, synchronous cog belt, guide rail and amesdial;
2, control is easy with debugging: this device is planted ball with common stepping motor by reciprocal walking of cog belt drive ball attachment machine structure, implements simplyr with respect to other plant the ball control method, alleviates operating personnel's workload;
3, web plate dimensions scope is big, and it is bigger to plant tin bulb diameter scope;
4, scraper plate is less to the injury of tin ball, success rate height, utilance height.
As scheme explanation
Fig. 1 is a perspective view of the present invention;
Fig. 2 is a plan structure schematic diagram of the present invention;
Fig. 3 is the schematic diagram of the present invention under a kind of direction of travel;
The schematic diagram that Fig. 4 puts down in the another kind walking for the present invention.
Embodiment
The invention will be further described below in conjunction with accompanying drawing.
As Fig. 1, shown in 2, a kind of ball-planting device of semiconductor packaging device, comprise frame 1, web plate 2, article two, guide rail 3, ball attachment machine structure and driving mechanism, described web plate 2 is fixed on the frame 1, described two guide rails 3 are located at the both sides of web plate 2 respectively, described ball attachment machine structure is positioned at the top of web plate and is slidingly matched fixing with two guide rails 3, this ball attachment machine structure comprises tin ball container 4, a pair of locating part 5, scraper plate 6, connecting plate 7, a plurality of springs 8, a plurality of amesdials 9 and transducer, described tin ball container 4 is located on the web plate 2, the bottom of this tin ball container 4 is provided with ditch seam 40, described a pair of locating part 5 is fixed on the tin ball container 4, the longitudinal section of described scraper plate 6 generally is taper wide at the top and narrow at the bottom, its upper end is located between two locating parts 5, its lower end is located in the ditch seam 40 of tin ball container, and the lower surface flushes with the lower surface of tin ball container bottom, the upper end of scraper plate 6 is fixed in the lower end of described a plurality of spring 8, the upper end is connected with a plurality of amesdials 9 by connecting plate 7, described transducer is located in the tin ball container 4, and described driving mechanism and ball attachment machine structure are in transmission connection.
The present invention also comprises two travelling carriages 10 adaptive with guide rail, and described ball attachment machine structure is slidingly matched fixing by two travelling carriages 10 and two guide rails 3; The present invention also comprises ball mechanism, and this ball mechanism comprises vibrating disc 11 and for bulb 12, described vibrating disc 11 is fixed on the travelling carriage 10, and described inlet for bulb 12 is connected with vibrating disc 11, and its outlet is visited in tin ball container 4; Described locating part 5 comprises fixed head 50 and adjustable bolt 51, and described fixed head 50 is fixed on the tin ball container 4, and described adjustable bolt 51 is threaded with fixed head 50; Described driving mechanism comprises stepping motor 13, synchronous cog belt 14 and synchronizing juggedly takes turns 15, and described synchronous cog belt 14 is connected with stepping motor 13 and winding and synchronizing jugged the wheel on 15, and this synchronous cog belt 14 and travelling carriage 10 are in transmission connection.
The present invention utilizes scraper plate in ball attachment machine structure walking process certain deviation angle to be arranged, and the stress point that changes tin ball 16 increases the downward power of tin ball, and the tin ball is easier down in the web plate hole.Transducer is a surplus of measuring tin ball in the ball attachment machine structure, when being lower than the height of sensor measurement, can fill the tin ball automatically.The sensor measurement height can be regulated in debug process.Position-limit mechanism can be regulated the deviation angle of control scraper plate.Can regulate the downward pressure of scraper plate by micrometer and spring, reach and better plant the ball effect.
Shown in Fig. 3,4, the ball attachment machine structure is driven by travelling carriage, and its power is provided by stepping motor, carries out power transmission by synchronous cog belt and synchronizing jugged belt wheel, and the drive travelling carriage moves back and forth on guide rail and realizes planting the ball action.Web plate is positioned at the travel mechanism below, and the tin ball in the ball attachment machine structure is implanted web plate with the tin ball in the process that travel mechanism moves back and forth.In the ball attachment machine structure transducer is housed, when the amount of tin ball during less than the value set, ball mechanism adds the tin ball in the ball attachment machine structure to automatically.

Claims (5)

1. the ball-planting device of a semiconductor packaging device, it is characterized in that, comprise frame, web plate, article two, guide rail, ball attachment machine structure and driving mechanism, described web plate is fixed on the frame, described two guide rails are located at the both sides of web plate respectively, described ball attachment machine structure is positioned at the top of web plate and is slidingly matched fixing with two guide rails, this ball attachment machine structure comprises tin ball container, a pair of locating part, scraper plate, connecting plate, a plurality of springs, a plurality of amesdials and transducer, described tin ball container is located on the web plate, the bottom of this tin ball container is provided with the ditch seam, described a pair of locating part is fixed on the tin ball container, the longitudinal section of described scraper plate generally is taper wide at the top and narrow at the bottom, its upper end is located between two locating parts, its lower end is located in the ditch seam of tin ball container, and the lower surface flushes with the lower surface of tin ball container bottom, the upper end of scraper plate is fixed in the lower end of described a plurality of springs, the upper end is connected with a plurality of amesdials by connecting plate, described transducer is located in the tin ball container, and described driving mechanism and ball attachment machine structure are in transmission connection.
2. the ball-planting device of a kind of semiconductor packaging device according to claim 1 is characterized in that, also comprises two travelling carriages adaptive with guide rail, and described ball attachment machine structure is slidingly matched fixing by two travelling carriages and two guide rails.
3. the ball-planting device of a kind of semiconductor packaging device according to claim 2, it is characterized in that, also comprise ball mechanism, this ball mechanism comprises vibrating disc and supplies bulb, described vibrating disc is fixed on the travelling carriage, described inlet for bulb is connected with vibrating disc, and its outlet is visited in tin ball container.
4. the ball-planting device of a kind of semiconductor packaging device of stating according to claim 1 or 3 is characterized in that described locating part comprises fixed head and adjustable bolt, and described fixed head is fixed on the tin ball container, and described adjustable bolt is threaded with fixed head.
5. the ball-planting device of a kind of semiconductor packaging device according to claim 4, it is characterized in that, described driving mechanism comprises stepping motor, synchronous cog belt and synchronizing jugged the wheel, described synchronous cog belt is connected with stepping motor on also winding and synchronizing jugged the wheel, and this synchronous cog belt and travelling carriage are in transmission connection.
CN2009100527786A 2009-06-09 2009-06-09 Ball-planting device of semiconductor packaging equipment Active CN101604618B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009100527786A CN101604618B (en) 2009-06-09 2009-06-09 Ball-planting device of semiconductor packaging equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009100527786A CN101604618B (en) 2009-06-09 2009-06-09 Ball-planting device of semiconductor packaging equipment

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CN101604618A true CN101604618A (en) 2009-12-16
CN101604618B CN101604618B (en) 2011-02-09

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103871915A (en) * 2014-03-24 2014-06-18 上海微松工业自动化有限公司 Manual BGA ball mounting machine
CN105789095A (en) * 2016-04-12 2016-07-20 上海微松工业自动化有限公司 Automatic ball mounter and ball mounting method
CN106112182A (en) * 2016-07-12 2016-11-16 上海微松工业自动化有限公司 A kind of full-automatic ball attachment device and application thereof
CN105873378B (en) * 2016-06-01 2018-12-21 全讯射频科技(无锡)有限公司 The height adjustment device of a plant ball steel mesh
WO2020011233A1 (en) * 2018-07-12 2020-01-16 新冠科技有限公司 Ball mounter
CN112259478A (en) * 2020-10-23 2021-01-22 技感半导体设备(南通)有限公司 Ball scraping and spreading device and method
CN114597146A (en) * 2022-05-07 2022-06-07 深圳市立可自动化设备有限公司 BGA ball mounting machine

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103311137B (en) * 2012-03-06 2015-10-28 上海微松工业自动化有限公司 A kind of superchip packaging solder ball location auto supply equipment

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6253992B1 (en) * 1998-03-18 2001-07-03 Tessera, Inc. Solder ball placement fixtures and methods
CN1233029C (en) * 2003-04-11 2005-12-21 华中科技大学 Soldered ball embedding device
CN1312735C (en) * 2003-08-14 2007-04-25 宏达国际电子股份有限公司 Ball-planting device for making several tin balls stick to chip
CN1312749C (en) * 2004-12-29 2007-04-25 上海交通大学 Multi-diameter solder ball automatic releasing device
CN100539058C (en) * 2007-06-21 2009-09-09 华为技术有限公司 Plant the ball-planting device and the method for ball frock, BGA Package chip
CN101140889B (en) * 2007-10-16 2010-05-12 天津大学 Automatic welding ball packaging metal ball embedding method and apparatus

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103871915A (en) * 2014-03-24 2014-06-18 上海微松工业自动化有限公司 Manual BGA ball mounting machine
CN103871915B (en) * 2014-03-24 2016-08-17 上海微松工业自动化有限公司 Manually BGA ball attachment machine
CN105789095A (en) * 2016-04-12 2016-07-20 上海微松工业自动化有限公司 Automatic ball mounter and ball mounting method
CN105789095B (en) * 2016-04-12 2018-06-29 上海微松工业自动化有限公司 A kind of full-automatic ball attachment machine and its ball-establishing method
CN105873378B (en) * 2016-06-01 2018-12-21 全讯射频科技(无锡)有限公司 The height adjustment device of a plant ball steel mesh
CN106112182A (en) * 2016-07-12 2016-11-16 上海微松工业自动化有限公司 A kind of full-automatic ball attachment device and application thereof
WO2020011233A1 (en) * 2018-07-12 2020-01-16 新冠科技有限公司 Ball mounter
CN112259478A (en) * 2020-10-23 2021-01-22 技感半导体设备(南通)有限公司 Ball scraping and spreading device and method
CN114597146A (en) * 2022-05-07 2022-06-07 深圳市立可自动化设备有限公司 BGA ball mounting machine
CN114597146B (en) * 2022-05-07 2022-07-22 深圳市立可自动化设备有限公司 BGA ball mounting machine

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Denomination of invention: Ball-planting device of semiconductor packaging equipment

Effective date of registration: 20120629

Granted publication date: 20110209

Pledgee: Pudong Development Bank of Minhang Shanghai branch

Pledgor: Shanghai Weisong Industry Automation Co., Ltd.

Registration number: 2012990000338

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Date of cancellation: 20140219

Granted publication date: 20110209

Pledgee: Pudong Development Bank of Minhang Shanghai branch

Pledgor: Shanghai Weisong Industry Automation Co., Ltd.

Registration number: 2012990000338

PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of invention: Ball-planting device of semiconductor packaging equipment

Effective date of registration: 20140219

Granted publication date: 20110209

Pledgee: Pudong Development Bank of Minhang Shanghai branch

Pledgor: Shanghai Weisong Industry Automation Co., Ltd.

Registration number: 2014990000108

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PC01 Cancellation of the registration of the contract for pledge of patent right

Date of cancellation: 20150407

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Pledgee: Pudong Development Bank of Minhang Shanghai branch

Pledgor: Shanghai Weisong Industry Automation Co., Ltd.

Registration number: 2014990000108

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CB03 Change of inventor or designer information

Inventor after: Tang Xiaoshu

Inventor after: Cai Tianshou

Inventor after: Cai Huakun

Inventor before: Xu Guangyu

COR Change of bibliographic data
C41 Transfer of patent application or patent right or utility model
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Effective date of registration: 20160622

Address after: 361100 Fujian province Xiamen city Xiangan district town house in Road No. 594 fourth floor

Patentee after: Xiamen atom Electronic Technology Co., Ltd.

Address before: 201114 Shanghai city Minhang District new Chun Road 188, 15-102

Patentee before: Shanghai Weisong Industry Automation Co., Ltd.