CN101594735B - Flexible film and display device including the same - Google Patents

Flexible film and display device including the same Download PDF

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CN101594735B
CN101594735B CN 200910118618 CN200910118618A CN101594735B CN 101594735 B CN101594735 B CN 101594735B CN 200910118618 CN200910118618 CN 200910118618 CN 200910118618 A CN200910118618 A CN 200910118618A CN 101594735 B CN101594735 B CN 101594735B
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surface
metal layer
flexible film
thickness
hole
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CN 200910118618
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CN101594735A (en )
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廉晶燮
高东起
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Lg电子株式会社
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Abstract

A flexible film and a display device including the same are disclosed. The flexible film includes an insulating film and first and second metal layers on the insulating film. The insulating film including at least one hole, a first surface corresponding to an inner circumferential surface of the hole, a second surface corresponding to an upper surface of the insulating film, and a third surface corresponding to a lower surface of the insulating film. The first metal layer and the second metal layer are positioned on the first surface and at least one of the second and third surfaces. An anglebetween the first surface and the second surface is equal to or greater than an angle between the first surface and the third surface.

Description

柔性膜和包括该柔性膜的显示器件 The flexible film and the flexible film comprises a display device

技术领域 FIELD

[0001] 示例性实施方案涉及柔性膜,并且更具体地涉及用于各种电器件的柔性膜。 [0001] An exemplary embodiment relates to a flexible film, and more particularly, to a flexible film for various electrical devices. 背景技术 Background technique

[0002] 柔性膜可用于各种电器件。 [0002] The flexible film is used for various electrical devices. 作为柔性膜的例子,可列举柔性印刷电路板(FPCB)和柔性覆铜层合板(FCCL)。 Examples of the flexible film include a flexible printed circuit board (FPCB) and a flexible copper clad laminate (FCCL).

[0003] FPCB或FCCL的金属层利用溅射方法、铸造方法或层合方法制造。 [0003] FPCB or the FCCL metal layer by a sputtering method, a casting method, or lamination methods.

[0004] 在溅射方法中,对聚酰亚胺膜实施溅射工艺以形成金属层。 [0004] In the sputtering process, the sputtering process of the polyimide film to form a metal layer. 在铸造方法中,在金属薄膜上涂覆液体聚酰亚胺,然后实施铸造工艺以由此形成FCCL的金属层。 In the casting method, the coating liquid polyimide on a metal film, a casting process is then performed to thereby form a metal layer of FCCL. 在层合方法中, 在聚酰亚胺膜上涂覆粘合剂,并利用层合方法将金属薄膜粘附于聚酰亚胺膜。 In the lamination process, the adhesive coated polyimide film, and a lamination process using a metal thin film is adhered to the polyimide film.

[0005] 在溅射方法中,由于聚酰亚胺膜的表面受到损伤,所以平滑度降低。 [0005] In the sputtering method, since the surface of the polyimide film is damaged, so the smoothness is lowered. 在铸造方法中,可用的聚酰亚胺膜的种类有限。 In the casting method, the kind of the polyimide film available is limited. 在层合方法中,由于所使用的粘合剂的物理性能的限制,所以不易制造FPCB或FCCL。 In the lamination process, due to limitations of physical properties of the adhesive used, it is difficult to manufacture FPCB or FCCL.

[0006] 因此,近来已经需要具有改善的物理性能诸如剥离强度的FPCB或FCCL。 [0006] Therefore, recently it has been required to have improved physical properties such as peel strength FPCB or FCCL. 发明内容 SUMMARY

[0007] 示例性实施方案提供具有优异的稳定性和可靠性的柔性膜以及包括该柔性膜的显示器件。 [0007] Exemplary embodiments provide excellent in stability and reliability of the flexible film and a display device including the flexible film.

[0008] 在一个方面,提供一种柔性膜,所述柔性膜包括绝缘膜以及在绝缘膜上的第一金属层和第二金属层,所述绝缘膜包括至少一个孔、对应于所述孔的内周表面的第一表面、对应于绝缘膜上表面的第二表面和对应于绝缘膜下表面的第三表面,第一金属层和第二金属层位于第一表面上以及位于第二和第三表面中的至少一个上,其中第一表面和第二表面之间的角α基本等于或大于第一表面和第三表面之间的角β,其中角α为钝角。 [0008] In one aspect, there is provided a flexible film, the flexible film comprising an insulating film and a first metal layer and second metal layer insulating film, said insulating film comprises at least one aperture corresponding to the aperture a first surface of the inner circumferential surface, corresponding to the second surface of the insulating film corresponding to the third surface and a lower surface of the insulating film, a first metal layer and second metal layer disposed on the first surface, and a second and at least a third of the surface, wherein the angle α between the first and second surfaces substantially equal to or greater than the angle β between the first surface and the third surface, wherein the angle α is obtuse.

[0009] 角β可为角α的约0. 3〜0. 9倍。 [0009] The angle β angle α may be from about 0.5 3~0. 9 times.

[0010] 角β可为角α的约0. 8〜0. 9倍。 [0010] angle β angle α may be from about 0.5 8~0. 9 times.

[0011] 孔的直径可为约30μπΐ〜ΙΟΟΟμίΉ。 Diameter [0011] The holes may be about 30μπΐ~ΙΟΟΟμίΉ.

[0012] 第一金属层的厚度可为约0. 02 μ m〜0. 2 μ m。 [0012] The first metal layer may be from about 0. 02 μ m~0. 2 μ m.

[0013] 第一金属层可以是化学镀层。 [0013] The first metal layer may be a plating layer.

[0014] 第二金属层可以是电镀层。 [0014] The second metal layer may be a plated layer.

[0015] 第一金属层可由选自铬(Cr)、金(Au)、铜(Cu)和镍(Ni)中的至少一种形成。 [0015] The first metal layer may be selected from chromium (Cr), gold (Au), copper (Cu) and nickel (Ni) is formed of at least one.

[0016] 第一金属层可包括由Cu形成的上层和由Ni形成的下层。 [0016] The first metal layer may comprise an upper layer and a lower layer formed of Ni is formed of Cu.

[0017] 第二金属层可由金(Au)或铜(Cu)形成。 [0017] The second metal layer may be gold (Au) or copper (Cu) is formed.

[0018] 绝缘膜可由选自聚酯、聚酰亚胺、液晶聚合物和氟树脂中的一种形成。 [0018] The insulating film may be selected from polyester, polyimide, liquid crystal polymer and fluororesin is formed.

[0019] 第一金属层的厚度和第二金属层的厚度的总和可基本等于或大于孔直径的3/1000且小于孔直径的1/2。 [0019] The sum of the thicknesses of the second metal layer and the thickness of the first metal layer may be substantially equal to or larger than the hole diameter is smaller than the hole diameter of 3/1000 and 1/2.

[0020] 第一金属层厚度和第二金属层厚度的总和可为孔直径的约1/100〜1/10。 [0020] The sum of the thickness of the first metal layer and the second metal layer thickness may be about 1 / 100~1 / 10 pore diameter. [0021] 第一金属层的厚度对第二金属层的厚度的比例可为约1 : 10〜1 : 2500。 [0021] The thickness ratio of the first metal layer thickness of the second metal layer may be from about 1: 10~1: 2500.

[0022] 第一金属层的厚度对第二金属层的厚度的比例可为约1 : 400〜1 : 500。 [0022] The thickness ratio of the first metal layer thickness of the second metal layer may be from about 1: 400~1: 500.

[0023] 柔性膜包括电路图案。 [0023] The flexible film includes a circuit pattern.

[0024] 在另一方面,提供一种显示器件,包括:显示面板、对显示面板施加驱动信号的驱动器、以及在显示面板和驱动器之间的柔性膜,所述柔性膜包括绝缘膜以及在绝缘膜上的第一金属层和第二金属层,所述绝缘膜包括至少一个孔、对应于所述孔的内周表面的第一表面、对应于绝缘膜上表面的第二表面和对应于绝缘膜下表面的第三表面,第一金属层和第二金属层位于第一表面上以及位于第二和第三表面中的至少一个上,其中第一表面和第二表面之间的角α基本等于或大于第一表面和第三表面之间的角β,其中角α为钝角。 [0024] In another aspect, there is provided a display device comprising: a display panel, a driving signal is applied to drive the display panel, and a flexible film between the display panel and the driver, the flexible membrane and the insulating film comprises an insulating a first metal film layer and the second metal layer, said insulating film comprises at least one aperture corresponding to a first surface of the inner circumferential surface of the hole, a second surface corresponding to the surface of the insulating film corresponding to the insulating the third lower surface of the film, a first metal layer and second metal layer positioned on the first surface, and a second and third surfaces to at least one of which the angle α between the first and second surfaces substantially equal to or greater than the angle β between the first surface and the third surface, wherein the angle α is obtuse.

[0025] 角β可为角α的约0. 8〜0. 9倍。 [0025] The angle β angle α may be from about 0.5 8~0. 9 times.

[0026] 第一金属层的厚度和第二金属层的厚度的总和可基本等于或大于孔直径的3/1000且小于孔直径的1/2。 [0026] The sum of the thicknesses of the second metal layer and the thickness of the first metal layer may be substantially equal to or larger than the hole diameter is smaller than the hole diameter of 3/1000 and 1/2.

[0027] 第一金属层的厚度对第二金属层的厚度的比例可为约1 : 10〜1 : 2500。 [0027] The thickness ratio of the first metal layer thickness of the second metal layer may be from about 1: 10~1: 2500. 附图说明 BRIEF DESCRIPTION

[0028] 所包括的附图用于进一步理解本发明并引入作为本说明书的一部分,附图说明本发明的实施方案并与说明书一起用于解释本发明的原理。 [0028] The drawings are included for a further understanding of the present invention is incorporated as a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. 在附图中: In the drawings:

[0029] 图1示出根据一个示例性实施方案的柔性膜; [0029] Figure 1 shows a flexible film in accordance with an exemplary embodiment of the exemplary embodiment;

[0030] 图2〜5是沿着图1的线1-1'截取的截面图; [0030] FIG. 2 ~ 5 is a sectional view taken along line 1-1 ';

[0031] 图6和7是沿图1的线1-1'截取的根据一个示例性实施方案的柔性膜的截面图; 禾口 [0031] FIGS. 6 and 7 are a cross-sectional view of a flexible film 1-1 an exemplary embodiment of the exemplary embodiment of FIG. 1 along line 'taken; Wo port

[0032] 图8是根据一个示例性实施方案的显示器件的透视图。 [0032] FIG. 8 is a perspective view of a display device according to an exemplary embodiment. 具体实施方式 detailed description

[0033] 现在将参考本发明的详细的实施方案,其中本发明的实施例在附图中说明。 [0033] Reference will now be made in detail to embodiments of the present invention, wherein embodiments of the invention are illustrated in the accompanying drawings.

[0034] 图1示出根据一个示例性实施方案的柔性膜,并且图2〜5是沿图1的线1-1'截取的截面图。 [0034] Figure 1 shows a flexible film in accordance with one exemplary embodiment, and FIG. 2 ~ 5 is a sectional view taken along line 1-1 in FIG. 1 '.

[0035] 如图1〜5所示,柔性膜100可包括:具有至少一个孔120的绝缘膜110以及在绝缘膜110上的第一和第二金属层131和132。 As shown in [0035] FIG. 1 ~ 5, the flexible film 100 may include: at least one hole having the insulating film 120 and the first 110 and second metal layer on the insulating film 110 and 131 132. 绝缘膜110可包括:对应于孔120的内周表面的第一表面11 la、对应于绝缘膜110上表面的第二表面Illb以及对应于绝缘膜110下表面的第三表面111c。 Insulating film 110 may comprise: a first inner circumferential surface corresponding to the surface of the bore 120 11 la, surface Illb second insulating film 110 corresponding to the upper surface and a third surface 111c corresponding to the lower surface of the insulating film 110. 第一金属层131和第二金属层132可位于第一表面Illa上以及位于第二和第三表面Illb和Illc中的至少一个上。 The first metal layer 131 and the second metal layer 132 may be positioned on the first surface and at least one positioned Illa second and third surfaces in Illb and Illc. 在柔性膜100中,第一金属层131和第二金属层132可位于第一、第二和第三表面IllaUllb和Illc上。 In the flexible film 100, a first metal layer 131 and the second metal layer 132 may be located in the first, second and third surfaces and IllaUllb Illc.

[0036] 绝缘膜110可由选自聚酯、聚酰亚胺、液晶聚合物和氟树脂中的一种形成。 [0036] The insulating film 110 may be selected from polyester, polyimide, a liquid crystal polymer and fluororesin is formed. 绝缘膜110可优选由聚酰亚胺形成。 Insulating film 110 may be preferably formed of polyimide.

[0037] 绝缘膜110可具有约12 μ m〜50 μ m的厚度并可具有柔性。 [0037] The insulating film 110 may have a thickness of about 12 μ m~50 μ m and may have flexibility.

[0038] 第一表面11 Ia和第二表面Illb之间的角α基本等于或大于第一表面11 Ia和第三表面Illc之间的角β。 [0038] The angle α between the first surface and the second surface 11 Ia Illb substantially equal to or greater than the angle β between the first surface and the third surface 11 Ia Illc.

[0039] 如图2所示,当孔120通过从第二表面Illb以向下的方式照射激光来形成时,第一表面Illa和第二表面Illb之间的角α可大于第一表面Illa和第三表面Illc之间的角β,并且角α可为钝角。 [0039] As shown, when the hole 120 in a downward manner through the laser irradiation is formed from the second surface Illb, the angle α between the first surface and the second surface Illa Illb first surface may be greater than 2 Illa and the angle β between the third surface Illc, and may be an obtuse angle α. 因此,通过在绝缘膜110上形成第一金属层131和第二金属层132,柔性膜100可具有图3所示的结构。 Thus, by forming the first metal layer 131 and the second metal layer on the insulating film 110132, the flexible film 100 may have a structure shown in FIG.

[0040] 如图4所示,当孔120通过从第二和第三表面Illb和Illc以向上和向下的方式照射激光来形成时,第一表面Illa和第二表面Illb之间的角α可基本等于第一表面Illa 和第三表面Illc之间的角β。 [0040] As shown in FIG. 4, when the through hole 120 in the upward and downward to form the laser light irradiated from the second and third surfaces and Illb ILLC, the angle α between the first surface and a second surface Illa Illb It may be substantially equal to the angle β between the first surface and the third surface Illa Illc. 因此,通过在绝缘膜110上形成第一金属层131和第二金属层132,柔性膜100可具有图5所示的结构。 Thus, by forming the first metal layer 131 and the second metal layer on the insulating film 110132, the flexible film 100 may have a structure shown in Fig.

[0041] 下表1示出随着角α对角β的比例而变化的柔性膜100的稳定性和剥离强度。 Table 1 shows the flexible film as the comparative angle α the angle β varies stability and peel strength of 100 to [0041] of. 在下表1中,X、〇和◎分别表示的差、良好和优异的特性状态。 The difference in the following Table 1, X, square and ◎ represent the good and excellent states of the characteristics.

[0042] 【表1】 [0042] [Table 1]

[0043] [0043]

Figure CN101594735BD00061

[0044] 如表1所示,当角α基本等于或大于角β时,孔120的直径随着孔120向上延伸而逐渐变宽。 [0044] As shown in Table 1, when the angle α substantially equal to or greater than the angle beta], with the diameter of the hole 120 of bore 120 extending upwardly becomes wider. 因此,在后续工艺中可形成具有恒定厚度的第一金属层131和第二金属层132,并因此可改善柔性膜100的稳定性和剥离强度。 Thus, in a subsequent process layer 131 may be formed in a first metal and a second metal layer 132 having a constant thickness, and thus improve the stability and peel strength of the flexible film 100.

[0045] 角α对角β的比例可为约10 : 3〜10 : 9。 Ratio [0045] The diagonal angle α β may be about 10: 3~10: 9. 当角α对角β的比例等于或大于10 : 3时,在后续工艺中可形成具有恒定厚度的第一金属层131和第二金属层132,并因此柔性膜100的稳定性和剥离强度可以是良好的。 When the ratio of the angle β of the angle α is greater than or equal to 10: 3, in a subsequent process layer 131 may be formed in a first metal and a second metal layer 132 having a constant thickness, and therefore the stability and peel strength of the flexible film 100 can be It is good. 当角α对角β的比例等于或小于10 : 9时,易于在第一表面Illa上形成第一金属层131和第二金属层132。 When the ratio of the angle β of the angle α is less than or equal to 10: 9, the first metal layer 131 and the second metal layer 132 is easily formed on the first surface Illa.

[0046] 角α对角β的比例可为约10 : 8〜10 : 9。 Ratio [0046] diagonal angle α β may be about 10: 8~10: 9. 当角α对角β的比例为10 : 8〜 10 : 9时,柔性膜100的稳定性和剥离强度可以是优异的,如表1所示。 When the ratio of the angle β angle α is 10: 8~ 10: 9, the stability of the peel strength of the flexible film 100 and may be excellent, as shown in Table 1. [0047] 因此,角β可等于或约为角α的0. 3〜0. 9倍。 [0047] Accordingly, the angle β may be equal to or about 0. 3~0. 9 times the angle α. 角β可为角α的约0. 8〜0. 9倍。 Angle β may be about 0.5 8~0. 9 times the angle α.

[0048] 孔120用于将柔性膜100连接至各种电器件的电极或电路图案。 [0048] The hole 120 for connecting the circuit patterns to an electrode or various electrical flexible film member 100. 孔120的直径d 可为约30μπι〜ΙΟΟΟμπι。 Diameter d of the hole 120 may be about 30μπι~ΙΟΟΟμπι. 孔120的直径d可以是其中第一表面Illa与第二表面Illb相交的点之间的距离。 Diameter d of the hole 120 may be a distance between the point where the first surface and the second surface Illa Illb intersect.

[0049] 第一金属层131可利用化学镀方法由选自铬(Cr)、金(Au)、铜(Cu)和镍(Ni)中的至少一种形成。 [0049] The first metal layer 131 using an electroless plating method may be selected from chromium (Cr), gold (Au), copper (Cu) and nickel (Ni) is formed of at least one. 优选地,考虑到工艺效率,第一金属层131可由具有优异导电性的Ni或Cu形成。 Preferably, in view of process efficiency, a first metal layer 131 may be formed of Ni or Cu having excellent conductivity.

[0050] 第一金属层131可具有由Ni和Cu形成的多层结构。 [0050] The first metal layer 131 may have a multilayer structure formed by Ni and Cu. 例如,可利用化学镀方法在绝缘膜Iio上形成Ni层,然后可利用化学镀方法在Ni层上形成Cu层。 For example, using an electroless plating method may be a Ni layer on the insulating film Iio, may then be formed by chemical Cu plating layer on the Ni layer method. 因此,可形成具有两层结构的化学镀层。 Accordingly, electroless plating may be formed having a two-layer structure. 换言之,在具有两层结构的化学镀层中,M层可为下层,并且Cu层可为上层。 In other words, the plating layer having a two-layer structure, M is the lower layer may be, may be an upper layer and the Cu layer. 可形成具有由Ni、Cu和Cu形成的三层结构的化学镀层。 It may form a plating layer having a three-layer structure formed by Ni, Cu and Cu. 可使用其它的多层结构。 Other multilayer structures may be used.

[0051] 与第一金属层131不同,第二金属层132可利用电镀方法由金(Au)或铜(Cu)形成。 [0051] and different from the first metal layer 131, second metal layer 132 may be formed of gold (Au) or copper (Cu) using electroplating. 优选地,考虑到制造成本,第二金属层132可由Cu形成。 Preferably, in view of manufacturing cost, the second metal layer 132 may be formed of Cu.

[0052] 第一金属层131的厚度Tl可小于第二金属层132的厚度T2。 [0052] The first metal layer 131 may be less than the thickness Tl thickness of the second metal layer 132 is T2. 更具体地,第一金属层131可作为用于镀覆第二金属层132的金属籽晶层并且可利用化学镀方法形成。 More specifically, the first metal layer 131 may be used as a plating seed metal layer a second metal layer 132 and may be formed using an electroless plating method. 因此, 第一金属层131的厚度Tl可非常小并且可为约0. 02 μ m〜0. 2 μ m。 Thus, the first metal layer 131 may be very small and the thickness Tl may be about 0. 02 μ m~0. 2 μ m.

[0053] 第二金属层132可利用电镀方法在第一金属层131的整个表面上形成。 [0053] The second metal layer 132 may be formed on the entire surface of the first metal layer 131 by electroplating method. 比第一金属层131厚的第二金属层132的厚度T2可为约2 μ m〜50 μ m。 Thicker than the first metal layer 131 a second metal layer thickness T2 132 may be about 2 μ m~50 μ m.

[0054] 第一表面Illa上的第二金属层132可具有约2 μ m〜40 μ m的厚度,并且第二和第三表面Illb和Illc上的第二金属层132可具有约3μπι〜50μπι的厚度。 [0054] The second metal layer on the first surface Illa 132 may have a thickness of about 2 μ m~40 μ m, and the second metal layer on the second and third surfaces Illb and Illc 132 may have about 3μπι~50μπι thickness of.

[0055] 下表2示出随着第一金属层131的厚度Tl对第二金属层132的厚度Τ2的比例而变化的柔性膜100的稳定性和剥离强度。 2 shows the stability and peel strength of the flexible film with the thickness of the first metal layer 131 Tl of the thickness of the second metal layer 132 varies in proportion Τ2 100 [0055] in the following table. 在下表2中,X、〇和◎分别表示差、良好和优异的特性状态。 In the following Table 2, X, square and ◎ represent bad, good, and excellent states of the characteristics.

[0056] 【表2】 [0056] [Table 2]

[0057] [0057]

Figure CN101594735BD00071
Figure CN101594735BD00081

[0059] 如表2所示,厚度Tl对厚度Τ2的比例可为约1 : 10〜1 : 2500。 [0059] As shown in Table, the thickness ratio of the thickness Τ2 2 Tl may be about 1: 10~1: 2500. 当厚度Tl对厚度Τ2的比例等于或小于1/10时,可在合适时间期间内实施用于形成第一金属层131的化学镀工艺。 When the thickness ratio of the thickness Tl Τ2 1/10 or less, may be implemented within a suitable time during the electroless plating process is used for the first metal layer 131 is formed. 因此,包含在化学镀工艺中所用的镀液中的助剂不会降低第一金属层131表面的剥离强度。 Thus, the plating solution contained in the plating process used in the adjuvant without lowering the peel strength of the surface of the first metal layer 131. 当厚度Tl对厚度Τ2的比例等于或大于1/2500时,当在后续工艺中在金属层上形成电路图案和在电路图案上形成Sn层时,可防止第一金属层131的形成材料被锡(Sn)置换。 When the thickness ratio of the thickness Tl is equal to or larger than 1/2500 Τ2 time, when the circuit pattern is formed on the metal layer in a subsequent process and the formation of the Sn layer on the circuit pattern, forming a first metal layer 131 may prevent a material is tin (Sn) replacement.

[0060] 厚度Tl对厚度Τ2的比例可为约1 : 400〜1 : 500。 [0060] The ratio of the thickness Τ2 thickness Tl may be about 1: 400~1: 500. 当厚度Tl对厚度Τ2的比例为1 : 400〜1 : 500时,柔性膜100的稳定性和剥离强度可以是优异的,如表2所示。 When the thickness ratio of the thickness Tl of Τ2 1: 400~1: 500, stability and peel strength of the flexible film 100 may be excellent, as shown in Table 2.

[0061] 第一和第二金属层131和132的厚度Tl和Τ2的总和可基本等于或大于孔120的直径d的3/1000且小于其1/2。 [0061] The first and the sum of the thickness of the second metal layer 131 Tl and 132 and Τ2 may be substantially equal to or greater than the diameter d of the hole 120 is smaller than 3/1000 and 1/2.

[0062] 下表3示出随着第一和第二金属层131和132的厚度Tl和T2的总和(T1+T2)对孔120的直径d的比例而变化的柔性膜100的稳定性和剥离强度。 3 shows the stability and the flexible film as the sum of the first and second metal layer 131 of a thickness Tl 132 and T2 (T1 + T2) of the ratio of the diameter d of the hole 120 is changed 100 [0062] and the following table peel strength. 在下表3中,X、〇和© 分别表示差、良好和优异的特性状态。 In Table 3, X, square and © represent bad, good, and excellent states of the characteristics.

[0063] 【表3】 [0063] TABLE 3

[0064] [0064]

Figure CN101594735BD00082

[0065] 如表3所示,第一和第二金属层131和132的厚度Tl和T2的总和(T1+T2)可基本等于或大于孔120的直径d的3/1000且小于其1/2。 [0065] As shown in Table 3, the first and second metal layers 131 and the sum of the thickness Tl 132 and T2 is (T1 + T2) may be substantially equal to or greater than the diameter d of the hole 120 is smaller than 3/1000 and 1 / 2. 当厚度Tl和T2的总和(T1+T2)等于或大于孔120的直径d的3/1000时,在绝缘膜110上可形成各自具有恒定厚度的金属层。 When the thickness of the sum of Tl and T2 (T1 + T2) is equal to or larger than 3/1000 of the diameter d of the hole 120, the insulating film 110 may be formed on each metal layer having a constant thickness. 因此,柔性膜100的稳定性可以是良好的。 Accordingly, stability of the flexible film 100 may be good. 当厚度Tl和T2的总和(T1+T2)小于孔120的直径d的1/2时,可防止孔120被厚金属层填充。 When 1/2 of the thickness Tl, and T2 is the sum (T1 + T2) is smaller than the diameter d of the hole 120, hole 120 is prevented from filling the thick metal layer.

[0066] 第一和第二金属层131和132的厚度Tl和T2的总和(T1+T2)可为孔120的直径d的约1/100〜1/10。 [0066] The thickness Tl of the first and second metal layers 131 and 132 and the sum T2 is (T1 + T2) d is the diameter of the hole may be about 1 120 / 100~1 / 10. 当厚度Tl和T2的总和(T1+T2)为孔120的直径d的1/100〜1/10 时,柔性膜100的稳定性和剥离强度可以是优异的,如表3所示。 When the thickness of the sum of Tl and T2 (T1 + T2) diameter hole 120 d of the 1 / 100~1 / 10, stability and peel strength of the flexible film 100 may be excellent, as shown in Table 3.

[0067] 如上所述,通过调节绝缘膜110的角度和金属层的厚度可改善柔性膜100的稳定性。 [0067] As described above, by adjusting the angle of the thickness of the insulating film 110 and a metal layer can improve the stability of the flexible film 100.

[0068] 此外,通过调节金属层厚度可防止孔120被填充。 [0068] Further, 120 is filled can be prevented by adjusting the thickness of the metal layer apertures. 因此,可确保柔性膜100和电极之间的连接的优异可靠性。 Thus, ensuring excellent reliability of the connection between the flexible film 100 and the electrode. 因此,可提供具有优异的稳定性和可靠性的柔性膜100。 Thus, the flexible film 100 can be provided with excellent stability and reliability.

[0069] 图6和7是沿图1的线1-1'截取的根据一个示例性实施方案的柔性膜的截面图。 [0069] FIGS. 6 and 7 are a cross-sectional view of a flexible film 1-1 an exemplary embodiment of the exemplary embodiment of FIG. 1 along line 'taken.

[0070] 如图6和7所示,柔性膜200可包括具有至少一个孔220的绝缘膜210以及在绝缘膜210上的第一和第二金属层231和232。 As shown in [0070] Figures 6 and 7, the flexible film 200 may include at least one aperture 220 of the insulating film 210 and the first and second metal layer on the insulating film 210, 231 and 232. 绝缘膜210可包括:对应于孔220的内周表面的第一表面21 la、对应于绝缘膜210上表面的第二表面211b以及对应于绝缘膜210下表面的第三表面211c。 Insulating film 210 may include: a first hole 220 corresponding to the surface of the inner circumferential surface 21 la, the second surface 210 corresponding to the upper surface of the insulating film 211b and the third surface 211c corresponding to the lower surface of the insulating film 210. 第一金属层231和第二金属层232可位于第一表面211a上以及第二和第三表面211b和211c中的至少一个上。 The first metal layer 231 and the second metal layer 232 may be positioned on the first surface 211a and the second and third surfaces 211b and 211c at least one.

[0071] 在柔性膜200中,第一金属层231和第二金属层232位于第一表面211a和第二表面211b上。 [0071] In the flexible film 200, a first metal layer 231 and the second metal layer 232 on the first surface 211a and second surface 211b.

[0072] 第一表面21 Ia和第三表面211c之间的角β可为第一表面21 Ia和第二表面211b 之间的角α的约0.3〜0.9倍。 [0072] about 0.3~0.9 times the angle β between the first surface and the third surface 21 Ia 211c may be a first angle between the surface and a second surface 21 Ia of 211b α.

[0073] 如图6所示,第一表面211a和第二表面211b之间的角α可大于第一表面211a 和第三表面211c之间的角β。 As shown in [0073] FIG. 6, the angle α between the first surface 211a and second surface 211b may be greater than the first surface 211a and the angle β between the third surface 211c. 角α可以是钝角。 It may be obtuse angle α.

[0074] 如图7所示,第一表面211a和第二表面211b之间的角α可基本等于第一表面211a和第三表面211c之间的角β。 [0074] As shown in FIG 7, the angle α between the first surface 211a and second surface 211b may be substantially equal to the angle β between the first surface 211a and the third surface 211c.

[0075] 第一金属层231的厚度Tl可小于第二金属层232的厚度Τ2。 [0075] The first metal layer may be less than the thickness Tl 231 Τ2 thickness of the second metal layer 232. 更具体地,第一金属层231可作为用于镀覆第二金属层232的金属籽晶层并且可利用化学镀方法形成。 More specifically, the first metal layer 231 may be used as a plating seed metal layer a second metal layer 232 and may be formed using an electroless plating method. 因此, 第一金属层231的厚度Tl可非常小并且可为约0. 02 μ m〜0. 2 μ m。 Accordingly, the first metal layer thickness Tl 231 may be very small and may be about 2 μ m is 0. 02 μ m~0..

[0076] 第二金属层232可利用电镀方法在第一金属层231的整个表面上形成。 [0076] The second metal layer 232 may be formed on the entire surface of the first metal layer 231 by electroplating method. 比第一金属层231厚的第二金属层232的厚度T2可为约2 μ m〜50 μ m。 Thicker than the first metal layer 231 a second metal layer thickness T2 232 may be about 2 μ m~50 μ m.

[0077] 第一金属层231的厚度Tl对第二金属层232的厚度T2的比例可为约1 : 10〜 1 : 2500。 [0077] The first metal layer 231 Tl thickness T2 of the second metal layer 232 may be a ratio from about 1: 10~ 1: 2500. 第一金属层231的厚度Tl和第二金属层232的厚度Τ2的总和(Tl+D)可基本等于或大于孔220的直径d的3/1000而小于其1/2。 The sum of the diameter (Tl + D) a first metal layer 231 and the thickness of the second metal layer thickness Tl Τ2 232 may be substantially equal to or larger than the hole 220 d of which is less than 3/1000 and 1/2. 由于在上述实施方案中参考图1〜5 描述所述柔性膜,所以在本实施方案中省略对柔性膜200的描述。 Since the above-described embodiments 1 ~ 5 described with reference to FIG the flexible membrane, so the description thereof is omitted flexible film 200 in this embodiment.

[0078] 以下将描述根据示例性实施方案制造柔性膜的方法。 [0078] Here will be described a method for manufacturing a flexible film according to an exemplary embodiment.

[0079] 在由聚酰亚胺形成的绝缘膜上形成至少一个孔。 [0079] at least one hole formed in the insulating film is formed of polyimide. 所述孔形成在绝缘膜的预定部分上,并且孔的直径可以是约30 μ m〜1000 μ m。 The hole is formed in a predetermined portion of the insulating film, and the hole diameter may be from about 30 μ m~1000 μ m. 所述孔可利用化学蚀刻法、钻孔法和激光加工方法中的一种形成。 The hole may be a chemical etching method using a laser drilling method and a processing method for forming.

[0080] 所述绝缘膜可具有:对应于孔的内周表面的第一表面、对应于绝缘膜上表面的第二表面以及对应于绝缘膜下表面的第三表面。 [0080] The insulating film may have: a first surface corresponding to the inner circumferential surface of the hole, corresponding to the second surface of the insulating film corresponding to the third surface and a lower surface of the insulating film. 第一表面和第二表面之间的角α可基本等于或大于第一表面和第三表面之间的角β。 The angle α between the first and second surfaces may be substantially equal to or greater than the angle β between the first surface and the third surface.

[0081] 在相关技术中,由于在绝缘膜上形成金属层之后才形成所述孔,所以孔区域必须再次镀覆金属层。 [0081] In the related art, since the hole is formed before the formation of the insulating film after the metal layer, the hole plated metal layer areas must again. 然而,在示例性实施方案中,由于在绝缘膜上形成所述孔之后才形成金属层,所以工艺时间减少并且易于形成所述孔。 However, in the exemplary embodiment, since, after forming the hole in the insulating film before the formation of the metal layer, to reduce the process time and is easy to form the hole.

[0082] 当利用激光加工方法形成所述孔时,根据照射在绝缘膜上的激光的照射方向,第一表面和第二表面之间的角α可不同于第一表面和第三表面之间的角β。 When the holes are formed by laser processing method, between [0082] The laser beam irradiation in the irradiation direction of the insulating film, the angle α between the first and second surfaces may be different from the first and third surfaces angle β. 具体地,当激光从第二表面以向下的方式照射时,由于激光的能量分布,使得角α可以是钝角。 Specifically, when the laser is irradiated from a second surface in a downward manner, since the energy distribution of the laser, so that the angle α may be obtuse.

[0083] 随后,对其上形成有孔的聚酰亚胺膜实施脱脂工艺。 [0083] Subsequently, the polyimide film formed thereon apertured degreasing processes. 所述脱脂工艺是移除当制造或加工聚酰亚胺膜时在聚酰亚胺膜表面上产生的杂质的工艺。 The degreasing process is to remove impurities when manufacturing or processing a polyimide film produced on the surface of the polyimide film process. 如果不实施脱脂工艺,则柔性膜的剥离强度会降低。 Without the degreasing process, the peel strength of the flexible film may be reduced. 在脱脂工艺中可使用碱性洗涤剂或清洗剂作为脱酯溶液。 In the degreasing process may be used as an alkali detergent or cleaning agent degreasing solution. 可使用其它材料作为脱脂溶液。 Other materials may be used as a degreasing solution.

[0084] 脱脂工艺可在20°C〜30°C的温度下实施约5分钟。 [0084] The debinding process may be carried out at a temperature of 20 ° C~30 ° C for about 5 minutes. 当脱脂工艺的温度等于或高于20°C时,可防止脱脂溶液的活化作用降低,并因此可改善脱脂效果。 When the temperature of the degreasing process is at or above 20 ° C, prevents activation of the degreasing solution decreases, and thus can improve defatting effect. 当脱脂工艺的温度等于或低于30°C时,容易调节脱脂工艺所需的时间。 When the degreasing process temperature at or below 30 ° C, the time required for debinding process is easy to adjust.

[0085] 对经过脱脂工艺的聚酰亚胺膜表面实施表面重整(reforming)工艺。 [0085] The surface reforming (reforming) process on the surface of the polyimide film after the degreasing process. 表面重整工艺是利用蚀刻溶液蚀刻聚酰亚胺膜表面的工艺。 The surface reforming process is an etching process using an etching solution, a polyimide film surface. 蚀刻溶液可使用氢氧化钾、氢氧化钾和乙二醇的混合物、以及铬酸和硫酸的混合物。 The etching solution of potassium hydroxide may be used, a mixture of potassium hydroxide and ethylene glycol, and a mixture of chromic acid and sulfuric acid. 可使用其它材料作为蚀刻溶液。 Other materials may be used as the etching solution.

[0086] 表面重整工艺可在40°C〜50°C的温度下实施约5〜10分钟。 [0086] surface reforming process may be carried out at a temperature of 40 ° C~50 ° C for about 5 to 10 minutes. 当表面重整工艺的温度等于或高于40°C时,可改善蚀刻溶液的活化作用,并因此可改善蚀刻效果。 When the surface temperature of the reforming process is equal to or higher than 40 ° C, may improve the activation of the etching solution, and thus improve the etching effect. 此外,由于表面重整工艺因蚀刻溶液活化作用增加而没有长时间实施,所以可防止聚酰亚胺膜表面受到部分损伤。 Further, since the surface reforming process by the etching solution for a long time without increasing activation embodiment, the surface of the polyimide film can be prevented from being damaged portion. 当表面重整工艺的温度等于或低于50°C时,由于没有快速实施蚀刻操作,所以容易均勻控制聚酰亚胺膜的表面。 When the surface reforming process temperature at or below 50 ° C, since no rapid etching operation, it is easy to uniformly control the surface of the polyimide film.

[0087] 表面重整工艺可在后续镀覆工艺中增加经过表面重整工艺的聚酰亚胺膜和第一金属层之间的粘合。 [0087] The surface reforming process may increase the adhesion between the surface-reforming process of the polyimide film and the first metal layer in a subsequent plating process. 因此,可提高柔性膜的剥离强度。 This improves the peel strength of the flexible film. 聚酰亚胺膜的亚酰胺环通过蚀刻工艺而重排并被酰胺基(-C0NH)或羧基(-C00H)取代。 Imide ring of the polyimide film by etching process and rearrangement of an amide group (-C0NH) or carboxyl (-C00H) group. 因此,可提高反应性。 Thus, the reactivity can be improved.

[0088] 对经过表面重整工艺的聚酰亚胺膜实施中和工艺。 [0088] After the surface of the polyimide film reforming process of the embodiment and process. 当在表面重整工艺中使用的蚀刻溶液是碱性溶液时,在中和工艺中使用酸性中和溶液。 When the etching solution used in the surface reforming process is an alkaline solution, the acidic neutralization solution in the neutralization process. 当蚀刻溶液是酸性溶液时,在中和工艺中使用碱性中和溶液。 When the etching solution is an acidic solution, the alkaline solution and the neutralization process.

[0089] 中和工艺是利用酸性溶液的H+离子来置换可能由于对在表面重整工艺中获得的聚酰亚胺膜表面的酰胺基(-C0NH)或羧基(-C00H)进行反应而残留的K+或Cr3+离子,从而移除K+或Cr3+离子的工艺。 [0089] The neutralization process is an acidic solution of H + ions may be due to replacement of the amide group (-C0NH) or carboxyl (-C00H) of the surface of the polyimide film obtained in the surface reforming process reacting the remaining Cr3 + or K + ions, thereby removing process Cr3 + or K + ions.

[0090] 如果在聚酰亚胺膜表面上残留有K+或Cr3+离子,则K+或Cr3+离子会与在后续极化工艺中用来极化聚酰亚胺膜表面的偶合离子进行竞争。 [0090] If the remains Cr3 + or K + ions on the surface of the polyimide film, or the K + and Cr3 + ions to ionic polarization coupling polyimide film surface to compete in the subsequent polarization process. 因此,K+或Cr3+离子阻止偶合离子与酰胺基(-C0NH)或羧基(-C00H)反应。 Thus, K + or Cr3 + ions and ions to prevent coupling of the amide group (-C0NH) or carboxyl (-C00H) reaction.

[0091] 中和工艺可在10〜30°C的温度下实施。 [0091] and the process may be performed at a temperature of 10~30 ° C. 当中和工艺的温度等于或高于10°C时, 可防止反应溶液的活化作用降低,并因此可改善中和效果。 And when the activation process among temperatures at or above 10 ° C, the reaction solution is reduced can be prevented, and thus can be improved and the effects. 此外,可防止聚酰亚胺膜表面受到损伤。 Further, the surface of the polyimide film can be prevented from being damaged. 当中和工艺的温度等于或低于30°C时,由于不发生快速反应,所以易于控制聚酰亚胺膜的均勻性。 And the process temperature which is equal to or lower than 30 ° C, due to the rapid reaction occurs, it is easy to control the uniformity of the polyimide film. [0092] 所述中和工艺不是必需的,而是可在必要时选择性实施的。 [0092] The neutralization process is not required, but may, if necessary, of the alternative embodiment.

[0093] 利用偶合溶液对经过中和工艺的聚酰亚胺膜实施极化工艺。 [0093] After the polyimide film and process embodiments using polarization coupling process solution.

[0094] 极化工艺是通过在聚酰亚胺膜的一部分中结合偶合离子来极化聚酰亚胺膜表面的工艺,在该部分聚酰亚胺膜中,聚酰亚胺膜表面的亚酰胺环通过蚀刻工艺而重排。 [0094] poling process by binding ions in the coupling portion of the polyimide film to the surface of the polyimide film of the polarization process, the portion of the polyimide film, the polyimide film surface alkylene lactam ring by a rearrangement of the etching process. 极化工艺可使得后续镀覆工艺平稳实施并可改善剥离强度。 Polarizing process may be smooth so that a subsequent plating process embodiment can improve the peel strength.

[0095] 可提供硅烷基偶联剂或胺基偶联剂作为可用于极化工艺中的偶合溶液。 [0095] Silane-based coupling agent may be provided as a coupling agent or an amine solution used in the coupling of the polarization process. 可使用其它材料作为偶联剂。 Other materials may be used as the coupling agent.

[0096] 极化工艺可在20〜30°C的温度下实施5〜10分钟。 [0096] poling process may be carried out at a temperature of 20~30 ° C in 5 to 10 minutes.

[0097] 随后,将经过极化工艺的聚酰亚胺膜浸于常温下的酸性溶液中。 [0097] Subsequently, the polyimide film after the polarization process is immersed in an acidic solution at room temperature. 因此,移除在聚酰亚胺膜表面的重排区域中未结合的偶合离子。 Thus, removal of the coupling surface of the polyimide film in the ion rearrangement unbound region.

[0098] 脱脂工艺、表面重整工艺、中和工艺和极化工艺是实施镀覆工艺的预加工步骤,并且上述预加工步骤可提高镀覆工艺的效率。 [0098] degreasing process, the surface reforming process, the polarizing process and the process is implemented and the step of preprocessing the plating process, and the pre-processing steps can improve the efficiency of the plating process.

[0099] 利用化学镀方法在经过预加工步骤的聚酰亚胺膜上形成第一金属层。 [0099] by chemical plating method of the first metal layer is formed on the polyimide film through a pre-processing step. 在示例性实施方案中描述了实施化学镀工艺一次以形成第一金属层。 Embodiment described plating process to form a metal layer on a first exemplary embodiment. 然而,可实施化学镀工艺两次以形成具有多层结构的第一金属层。 However, embodiments plating process twice to form a first metal layer having a multilayer structure.

[0100] 更具体地,对经过预加工步骤的聚酰亚胺膜实施催化剂加入工艺。 [0100] More specifically, the polyimide film is subjected to a pre-processing step is added to the process embodiment of the catalyst. 在催化剂加入工艺中,将聚酰亚胺膜浸于催化剂溶液中。 In the catalyst added to the process, the polyimide film immersed in the catalyst solution. 因此,作为催化剂的钯(Pd)可吸附在聚酰亚胺膜的表面上。 Thus, a palladium catalyst (Pd) may be adsorbed on the surface of the polyimide film. 用于催化剂加入工艺的催化剂溶液可以是用盐酸稀释体积比1 : IWPdCI2 和SnCl2获得的溶液。 The catalyst solution was added to the process used in the catalyst may be diluted with a volume ratio of hydrochloric acid 1: IWPdCI2 and SnCl2 solution was obtained.

[0101] 如果在催化剂加入工艺中的反应时间非常短,那么在聚酰亚胺膜表面上Pd或Sn 的吸附量会减少。 [0101] If added to the process reaction time is very short in the catalyst, then the Pd adsorption amount is reduced or Sn on the polyimide film surface. 如果反应时间非常长,那么聚酰亚胺膜表面会被腐蚀。 If the reaction time is very long, then the polyimide film surface may be corroded. 因此,应适当调节反应时间。 Thus, the reaction time should be properly adjusted.

[0102] 然后,将经过催化剂加入工艺的聚酰亚胺膜浸于镀液中,并且在聚酰亚胺膜的整个表面上镀覆第一金属层。 [0102] Then, after the catalyst is added to the process of the polyimide film immersed in the bath, and plating a first metal layer on the entire surface of the polyimide film.

[0103] 镀液可包括EDTA水溶液,苛性钠水溶液,通过混合福尔马林水溶液与硫酸铜水溶液获得的硫酸铜镀液,或通过混合次磷酸钠、柠檬酸钠、氨和硫酸镍六水合物获得的硫酸镍镀液。 [0103] EDTA bath may comprise an aqueous solution, an aqueous solution of sodium hydroxide, copper sulfate plating solution obtained by mixing an aqueous solution of formalin and aqueous copper sulfate solution, or by mixing sodium hypophosphite, sodium citrate, ammonium sulfate hexahydrate, and nickel nickel sulfate plating solution is obtained.

[0104] 镀液可进一步包含少量抛光组分、少量稳定剂组分等以改善金属的物理性能。 [0104] plating solution may further contain small amounts of a polishing component, a small amount of stabilizer component or the like to improve the physical properties of the metal. 抛光组分和稳定剂组分可允许镀液重复利用和保存很长时间。 The polishing component and the stabilizer component may allow to save and reuse the bath for a long time.

[0105] 在使用硫酸铜镀液的情况下,将加入有催化剂的聚酰亚胺膜浸于35°C〜45°C温度下的硫酸铜镀液中20〜30分钟而不对所述聚酰亚胺膜施加电流,以由此形成第一金属层。 [0105] In the case of copper sulfate plating solution, a catalyst added to the polyimide film was immersed in a copper sulfate plating solution at a temperature of 35 ° C~45 ° C in 20 to 30 minutes without the polyimide imine current is applied film, to thereby form a first metal layer. 如上,其中实施镀覆工艺而不施加电流的方法称为化学镀方法。 Above, wherein the method implemented without applying the plating process is referred to as a current plating method.

[0106] 在使用硫酸镍镀液的情况下,将加入有催化剂的聚酰亚胺膜浸于35°C〜45°C温度下的硫酸镍镀液中2分钟,以由此形成第一金属层。 [0106] In the case of using nickel sulfate plating solution, a catalyst added to the polyimide film is immersed in a nickel sulfate plating solution at a temperature of 35 ° C~45 ° C for 2 minutes to thereby form a first metal Floor.

[0107] 用于形成第一金属层的工艺是用于镀覆第二金属层的预加工步骤。 Process of the first metal layer [0107] is used to form the preprocessing steps for plating the second metal layer. 可形成具有约0. 02 μ m〜1 μ m厚度的第一金属层。 The first metal layer may be formed of about 0. 02 μ m~1 μ m thickness. 可完全实施用于形成第一金属层的工艺直至从聚酰亚胺膜上移除未镀覆的部分。 Process until the first metal layer may be completely removed for forming the embodiment unplated portion from the polyimide film.

[0108] 将其上形成有第一金属层的聚酰亚胺膜浸于镀液中,然后对聚酰亚胺膜施加电流以形成第二金属层。 [0108] A polyimide film which is formed on a first metal layer is immersed in the plating solution, and current is applied to the polyimide film to form a second metal layer.

11[0109] 更具体地,将其上形成有第一金属层的聚酰亚胺膜浸于镀液中,然后在40〜50°C 的温度下对聚酰亚胺膜施加2A/dm2的电流30分钟以形成第二金属层。 11 [0109] More specifically, the polyimide film is formed on a first metal layer is immersed in the plating solution, and then applied 2A / dm2 in the polyimide film at a temperature of 40~50 ° C current 30 minutes to form a second metal layer. 因此,制造包括第二金属层的聚酰亚胺膜,例如柔性膜印刷电路板(FPCB)或柔性覆铜层合板(FCCL)。 Thus, manufacturing a polyimide film comprising a second metal layer, for example a flexible film printed circuit board (FPCB) or a flexible copper clad laminate (FCCL).

[0110] 通过平稳搅拌镀液来保持镀液的浓度恒定。 [0110] to maintain constant concentration in the bath of plating solution through a smooth stirring. 可根据所要获得的镀层的厚度来适当调节镀覆条件。 May be appropriately adjusted according to conditions of the plating thickness of the coating to be obtained. 如上,包括施加电流的镀覆工艺称为电镀方法。 As above, the plating process including applying a current referred to as a plating method.

[0111] 作为可用的镀液,可使用由Heesung Metal Ltd.制造的市售的Enthone 0ΜΙ,NMP 等。 [0111] As the plating solution available, may be commercially available, manufactured by Enthone 0ΜΙ of Heesung Metal Ltd., NMP and the like. 可使用通过用水稀释CuSO4-H2CK H2SO4和HCl的混合溶液获得的镀液。 It can be obtained using the plating solution by diluting a mixed solution of CuSO4-H2CK H2SO4 and HCl in water. 镀液可进一步包含少量抛光组分和少量稳定剂组分。 Bath may further contain minor amounts of a polishing component and a small amount of stabilizer component.

[0112] 凭肉眼评估通过上述工艺制造的FPCB或FCCL的镀覆状态之后,可完成根据示例性实施方案的柔性膜。 After [0112] visually evaluated with the plating state produced by the above process FPCB or the FCCL, the flexible film can be completed according to the exemplary embodiment.

[0113] 电路图案可印刷到根据示例性实施方案的柔性膜上。 [0113] to the flexible printed circuit film pattern according to an exemplary embodiment. 其上印刷有电路图案的柔性膜可连接至各种电器件的电极或电路图案,以对各种电器件传输电信号。 The flexible film on which printed circuit may be connected to an electrode pattern or a circuit pattern of the various electrical devices to transfer electric signals to various electrical devices.

[0114] 图8是根据一个示例性实施方案的显示器件的透视图。 [0114] FIG. 8 is a perspective view of a display device according to an exemplary embodiment.

[0115] 如图8所示,显示器件300可包括:显示面板310、对显示面板310施加驱动信号的驱动器320、显示面板310和驱动器320之间的柔性膜330。 [0115] As shown in FIG. 8, the display device 300 may include: a display panel 310, the display driver 310 applies a driving signal to the panel 320, the flexible film 330 between the display panel 310 and a driver 320.

[0116] 显示器件300可以是平板显示器,如液晶显示器(IXD)、等离子体显示面板(PDP) 和有机发光显示器。 [0116] The display device 300 may be a flat panel display, liquid crystal display (IXD), plasma display panel (PDP) and organic light emitting displays.

[0117] 显示面板310可包括第一基板311和第二基板312。 [0117] The display panel 310 may include a first substrate 311 and second substrate 312. 第一基板311可包括多个像素。 The first substrate 311 may include a plurality of pixels. 所述像素可以以矩阵形式布置以显示图像。 The pixels may be arranged in a matrix form to display an image. 在像素中可布置连接至驱动器320的多个电极以彼此交叉。 Are arranged in the pixel may be connected to the plurality of drive electrodes 320 to cross each other. 例如,第一电极可以在水平方向上布置,而第二电极可以在垂直于第一电极的方向上布置。 For example, the first electrode may be disposed in the horizontal direction, and the second electrode may be arranged in a direction perpendicular to the first electrode. 第二基板312可以是密封第一基板311的透明玻璃基板。 The second substrate 312 may be sealed transparent glass substrate 311 of the first substrate.

[0118] 驱动器320可对电极施加信号,以由此在显示面板310上显示图像。 [0118] The drive signal may be applied to the electrode 320, to thereby display an image on the display panel 310.

[0119] 在显示面板310和驱动器320之间可连接柔性膜330,以将由驱动器320产生的信号传输至显示面板310。 [0119] The flexible film 330 may be connected between the display panel 310 and a driver 320, a signal transmission generated by the driver 320 to the display panel 310. 柔性膜330可以是其上印刷有预定电路图案的具有柔性的膜。 The flexible film 330 may be printed on which a predetermined circuit pattern of the flexible film has. 柔性膜330可包括绝缘膜、所述绝缘膜上的金属层、所述金属层上的电路图案、连接至所述电路图案的集成电路(IC)芯片等。 The flexible film 330 may include an insulating film, the metal layer insulating film, the circuit pattern on the metal layer, connected to the circuit pattern of an integrated circuit (IC) chip or the like.

[0120] 柔性膜330可包括绝缘膜以及绝缘膜上的第一金属层和第二金属层,所述绝缘膜包括:至少一个孔、对应于所述孔的内周表面的第一表面、对应于所述绝缘膜上表面的第二表面以及对应于所述绝缘膜下表面的第三表面。 [0120] The flexible film 330 may include an insulating film and a first metal layer insulating film and a second metal layer, the insulating film comprises: at least one aperture corresponding to a first surface of the inner circumferential surface of the hole, corresponding to the insulating film surface and a second surface corresponding to the third surface of the lower surface of the insulating film. 第一金属层和第二金属层可位于第一表面上以及位于第二和第三表面中的至少一个上。 A first metal layer and second metal layers may be located on a first surface and at least a second and third surfaces. 第一表面和第二表面之间的角α可基本等于或大于第一表面和第三表面之间的角β,并且可以是钝角。 The angle α between the first and second surfaces may be substantially equal to or greater than the angle β between the first surface and the third surface, and may be obtuse.

[0121] 因此,根据示例性实施方案的显示器件通过包括根据示例性实施方案的柔性膜可提供优异的可靠性。 [0121] Thus, according to an exemplary embodiment of a display device comprising a flexible film by the exemplary embodiment can provide excellent reliability.

[0122] 在说明书中提及的“一个实施方案”、“实施方案”、“示例性实施方案”等是指与该实施方案相关联的特定特征、结构或特性包括在本发明的至少一个实施方案中。 [0122] mentioned in the specification to "one embodiment," "an embodiment," "example embodiment," etc., means that a particular feature associated with the embodiment, structure, or characteristic comprises at least one embodiment of the present invention programs. 在说明书中的不同处出现的这些措词不必均指相同的实施方案。 Such phrases appearing in the specification are not necessarily referring to the same the different embodiments. 此外,当针对任意实施方案来说明特定特征、结构或特性时,本领域技术人员针对其它实施方案实现这些特定特征、结构或特性。 Further, when any embodiment will be described with particular feature, structure, or characteristic, one skilled in the art to achieve these particular features, structures, or characteristics for the other embodiments.

[0123] 虽然已经参考大量示例性实施方案进行了说明,但是应该理解本领域技术人员可以设计将落入本发明原理的精神和范围内的许多其它修改和实施方案。 [0123] Although reference to a number of illustrative embodiments have been described, it is to be appreciated that those skilled in the art can design numerous other modifications and embodiments will fall within the principles of the embodiment of the present invention from the spirit and scope. 更具体而言,说明书、附图和所附权利要求范围内的部件和/或布置可以进行各种变化和修改。 More specifically, components and / or arrangements within the scope of the specification, drawings and appended claims various changes and modifications may be made. 除了部件和/或布置的变化和修改之外,替代性的使用对本发明的技术人员而言也是显而易见的。 In addition to the parts and / or arrangements of variations and modifications, alternative uses to those skilled in the present invention is obvious.

Claims (16)

  1. 1.一种柔性膜,包括:绝缘膜,包括:至少一个孔、对应于所述孔的内周表面的第一表面、对应于所述绝缘膜上表面的第二表面以及对应于所述绝缘膜下表面的第三表面;和在所述绝缘膜上的第一金属层和第二金属层,所述第一金属层和所述第二金属层位于所述第一表面上以及位于所述第二和第三表面中的至少一个上,其中所述第一表面和所述第二表面之间的角α等于或大于所述第一表面和所述第三表面之间的角β,其中所述角α是钝角,其中所述第一金属层的厚度和所述第二金属层的厚度的总和等于或大于所述孔直径的3/1000且小于所述孔直径的1/2,其中所述孔直径为其中所述第一表面与所述第二表面相交的点之间的距离,其中所述第一金属层为化学镀层,所述第二金属层为电镀层。 1. A flexible film comprising: an insulating film, comprising: at least one aperture corresponding to a first surface of the inner circumferential surface of the hole, corresponding to the surface of the second insulating film corresponding to the insulating surface, and the third lower surface of the film; and the insulating film on the first metal layer and second metal layers, the first metal layer and said second metal layer is on the first surface and positioned second and third surfaces to at least one of which the angle α between the first surface and the second surface is equal to or greater than the angle β between the first surface and the third surface, wherein the angle is an obtuse angle α, wherein the sum of the thicknesses of the first metal layer and a thickness of the second metal layer is greater than or equal to 3/1000 of the diameter of the hole is less than 1/2 of the diameter of the hole, wherein the pore diameter is the distance between the point where the first surface and the second surface intersects, wherein the first metal layer is a plating layer, the second metal layer is a plated layer.
  2. 2.根据权利要求1所述的柔性膜,其中所述角β为所述角α的0.3〜0.9倍。 2. A flexible film according to claim 1, wherein said angle β is the angle α of 0.3~0.9 times.
  3. 3.根据权利要求2所述的柔性膜,其中所述角β为所述角α的0.8〜0.9倍。 3. The flexible film of claim 2, wherein said angle β is the angle α of 0.8~0.9 times.
  4. 4.根据权利要求1所述的柔性膜,其中所述孔的直径为30μπι〜ΙΟΟΟμπι。 The flexible film according to claim 1, wherein the diameter of the hole is 30μπι~ΙΟΟΟμπι.
  5. 5.根据权利要求1所述的柔性膜,其中所述第一金属层的厚度为0. 02 μ m〜0. 2 μ m。 5. A flexible film according to claim 1, wherein a thickness of said first metal layer is a 0. 02 μ m~0. 2 μ m.
  6. 6.根据权利要求1所述的柔性膜,其中所述第一金属层由选自铬(Cr)、金(Au)、铜(Cu)和镍(Ni)中的至少一种形成。 6. A flexible film according to claim 1, wherein said first layer is formed of metal selected from chromium (Cr), gold (Au), copper (Cu) and nickel (Ni) is formed of at least one.
  7. 7.根据权利要求6所述的柔性膜,其中所述第一金属层包括由Cu形成的上层和由Ni 形成的下层。 7. A flexible film according to claim 6, wherein said first metal layer comprises upper and lower layers formed of Ni is formed of Cu.
  8. 8.根据权利要求1所述的柔性膜,其中所述第二金属层由金(Au)或铜(Cu)形成。 8. The flexible film of claim 1, wherein said second metal layer is formed from gold (Au) or copper (Cu).
  9. 9.根据权利要求1所述的柔性膜,其中所述绝缘膜由选自聚酯、聚酰亚胺、液晶聚合物和氟树脂中的一种形成。 9. The flexible film of claim 1, wherein said insulating film is selected from polyester, polyimide, a liquid crystal polymer and fluororesin is formed.
  10. 10.根据权利要求1所述的柔性膜,其中所述第一金属层的厚度和所述第二金属层的厚度的总和为所述孔直径的1/100〜1/10。 10. A flexible film according to claim 1, wherein the sum of the thicknesses of the first metal layer and a thickness of the second metal layer to the diameter of the hole 1 / 100~1 / 10.
  11. 11.根据权利要求1所述的柔性膜,其中所述第一金属层的厚度对所述第二金属层的厚度的比例为1 : 10〜1 : 2500。 11. The flexible film of claim 1, wherein the thickness ratio of the thickness of the first metal layer of the second metal layer is 1: 10~1: 2500.
  12. 12.根据权利要求11所述的柔性膜,其中所述第一金属层的厚度对所述第二金属层的厚度的比例为1 : 400〜1 : 500。 12. A flexible film according to claim 11, wherein the thickness ratio of the thickness of the first metal layer of the second metal layer is 1: 400~1: 500.
  13. 13.根据权利要求1所述的柔性膜,其中所述柔性膜包括电路图案。 13. A flexible film according to claim 1, wherein said flexible film includes a circuit pattern.
  14. 14.一种显示器件,包括: 显示面板;对所述显示面板施加驱动信号的驱动器;和在所述显示面板和所述驱动器之间的柔性膜,所述柔性膜包括: 绝缘膜,包括:至少一个孔、对应于所述孔的内周表面的第一表面、对应于所述绝缘膜上表面的第二表面以及对应于所述绝缘膜下表面的第三表面,和在所述绝缘膜上的第一金属层和第二金属层,所述第一金属层和所述第二金属层位于所述第一表面上以及位于所述第二和第三表面中的至少一个上,其中所述第一表面和所述第二表面之间的角α等于或大于所述第一表面和所述第三表面之间的角β,其中所述角α是钝角,其中所述第一金属层的厚度和所述第二金属层的厚度的总和等于或大于所述孔直径的3/1000且小于所述孔直径的1/2,其中所述孔直径为其中所述第一表面与所述第二表面相交的点之间的距离,其中 14. A display device comprising: a display panel; applied to the display panel driver driving signal; and a flexible film between the display panel and the driver, the flexible membrane comprising: an insulating film, comprising: at least one hole corresponding to the first surface of the inner circumferential surface of the hole, corresponding to the insulating film surface and a second surface corresponding to the lower surface of the insulating film in the third surface, and said insulating film a first metal layer and a second metal layer on the first metal layer and the second metal layer is positioned on the first surface and at least one of the second and the third surface, wherein the angle α between said first surface and said second surface is equal to or greater than the angle β between the first surface and the third surface, wherein the angle is an obtuse angle α, wherein said first metal layer the sum of the thicknesses and the thickness of the second metal layer is greater than or equal to 3/1000 of the diameter of the hole is less than 1/2 of the diameter of the hole, wherein the pore diameter of the first surface and wherein said distance between the point of intersection of the second surface, wherein 述第一金属层为化学镀层,所述第二金属层为电镀层。 Said first metal layer is a plating layer, the second metal layer is a plated layer.
  15. 15.根据权利要求14所述的显示器件,其中所述角β为所述角α的0.8〜0.9倍。 15. The display device according to claim 14, wherein the angle β is the angle α of 0.8~0.9 times.
  16. 16.根据权利要求14所述的显示器件,其中所述第一金属层的厚度对所述第二金属层的厚度的比例为1 : 10〜1 : 2500。 16. The display device according to claim 14, wherein the thickness ratio of the thickness of the first metal layer of the second metal layer is 1: 10~1: 2500.
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Citations (3)

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Publication number Priority date Publication date Assignee Title
US5092958A (en) 1989-01-20 1992-03-03 Casio Computer Co., Ltd. Method of manufacturing double-sided wiring substrate
US6211468B1 (en) 1998-08-12 2001-04-03 3M Innovative Properties Company Flexible circuit with conductive vias having off-set axes
CN1979804A (en) 2005-12-09 2007-06-13 东部电子股份有限公司 Method for fabricating semiconductor device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002043752A (en) * 2000-07-27 2002-02-08 Nec Kansai Ltd Wiring board, multilayer wiring board, and their manufacturing method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5092958A (en) 1989-01-20 1992-03-03 Casio Computer Co., Ltd. Method of manufacturing double-sided wiring substrate
US6211468B1 (en) 1998-08-12 2001-04-03 3M Innovative Properties Company Flexible circuit with conductive vias having off-set axes
CN1979804A (en) 2005-12-09 2007-06-13 东部电子股份有限公司 Method for fabricating semiconductor device

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