CN101587301A - The coating curing device of soup and coating curing method - Google Patents
The coating curing device of soup and coating curing method Download PDFInfo
- Publication number
- CN101587301A CN101587301A CNA2009101187480A CN200910118748A CN101587301A CN 101587301 A CN101587301 A CN 101587301A CN A2009101187480 A CNA2009101187480 A CN A2009101187480A CN 200910118748 A CN200910118748 A CN 200910118748A CN 101587301 A CN101587301 A CN 101587301A
- Authority
- CN
- China
- Prior art keywords
- soup
- coating
- handled object
- medical liquid
- liquid spraying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Materials For Photolithography (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention provides a kind of can cutting device equipment cost and the space is set, make the coating curing device of the soup that the service efficiency of throughput rate and soup improves.With liquid medicine coating in the surface of handled object (W) and make in the coating curing device (2) of its curing, comprising: have and utilize outside transport mechanism (70) that handled object is moved into the container handling (4) that moving into of taking out of taken out of mouthful (10); Be arranged in the container handling mounting table of mounting handled object (24); Open the opening and closing shutter portion (12) that takes out of mouth that moves into that closes; Be located at and move into the outside of taking out of mouth, with the applying mechanism (4) of liquid medicine coating to the surface of handled object; Be located in the container handling, make the soup that is coated in the handled object surface be solidified to form the solidified cell (26) of film.The curing function that can in integrated apparatus, carry out the coating function of soup thus and solidify coated soup, thereby equipment cost that can cutting device and the space is set.
Description
Technical field
The present invention relates to the coating curing device and the coating curing method of the soup that applies soup and make its curing, wherein, this soup is the aqueous material that is used for forming resist, dielectric film, nesa coating etc. on semiconductor wafer or glass substrate etc.
Background technology
In order to form liquid crystal indicators such as SIC (semiconductor integrated circuit) or LCD, to carry out various processing such as film forming processing, etch processes, oxide-diffused processing, modification processing to handled objects such as semiconductor wafer or glass substrates repeatedly usually.In carrying out aforesaid a series of various processing, use aqueous raw material sometimes, be soup, it is coated in the surface of handled object and forms film.
For example, by etching the surface of handled object is being carried out under the situation of retrofit, to carry out the coating of aqueous resist to processed surface, in addition, under the situation of the dielectric film that forms macromolecular compound such as pi (polyimide) resin as the interlayer dielectric of SIC (semiconductor integrated circuit) etc., to carry out the coating of aqueous pi resin to the surface of handled object, in addition, form on the surface of handled object under the situation of nesa coating, carry out the coating of electric conductive polymer etc. the surface of handled object.
As with above-mentioned various aqueous raw materials, the method that is liquid medicine coating to the handled objects such as semiconductor wafer, known have when making the handled object rotation, make the surface of above-mentioned medicine liquid droplet to handled object, the so-called spin-coating method (for example patent documentation 1 etc.) that utilizes centrifugal force to throw away, with the driving force spattered droplets of utilizing piezoelectric elements such as piezoelectric type (piezo) element, make its lip-deep so-called ink-jetting style (for example patent documentation 2) etc. attached to handled object.
Then, the aforesaid lip-deep soup that is coated in handled object is carried out conveyance to the after-treatment device different with applying device, and be under low temperature or the high temperature in this and cure, make the volatile ingredient evaporation, perhaps by irradiation ultraviolet radiation etc. cross-linking reaction taking place, thereby makes the soup of above-mentioned coating solidify filming.
Patent documentation 1: Japanese kokai publication hei 5-259060 communique
Patent documentation 2: No. the 3946398th, United States Patent (USP)
But, in the coating method of aforesaid existing soup, need two kinds of devices, promptly, the coating soup applying device and, cure above-mentioned coated soup as the aftertreatment of the handled object of coating behind the soup, the cross-linking reaction that produces by ultraviolet ray makes the after-treatment device of film hardening.Therefore, equipment cost height not only, but also increased the space that two devices are set, and, owing to the needed time of conveyance that conveyance handled object between two devices produces, also exist to cause turnout to reduce such problem.
And, in utilizing the applying device of above-mentioned spin-coating method, because go out of use by the soup of rotation handled object sputter, therefore, cause the service efficiency variation of soup, for example, there is the soup only use about 5%, and the such problem that goes out of use of the soup about 95%.
In addition, under the situation of above-mentioned ink-jetting style, more in short-term, because must move back and forth inkjet head on the surface of handled object, therefore, coated soup can take place overlap in the length of employed inkjet head, the result produces the coating non-uniform phenomenon.
Summary of the invention
The present invention puts and the innovation and creation that can effectively address these problems that propose in view of the above problems.The object of the present invention is to provide a kind of coating curing device and coating curing method of soup, it carries out in the device of the coating function of integrated soup and the curing function of solidifying coated soup, its result, equipment cost that can cutting device and the space is set, and not only can boost productivity, can also improve the service efficiency of soup.
In one aspect of the invention, a kind of coating curing device of soup is provided, it is characterized in that: on the surface of handled object and this soup is solidified, it comprises the coating curing device of this soup with liquid medicine coating: have and utilize outside transport mechanism that above-mentioned handled object is moved into the container handling that moving into of taking out of taken out of mouthful; Be arranged in the above-mentioned container handling mounting table of the above-mentioned handled object of mounting; Open the above-mentioned opening and closing shutter portion that takes out of mouth that moves into that closes; Be arranged on the above-mentioned outside of taking out of mouth of moving into, with the applying mechanism of above-mentioned liquid medicine coating on the surface of above-mentioned handled object; Be arranged in the above-mentioned container handling, make the above-mentioned soup on the surface that is coated in above-mentioned handled object be solidified to form the solidified cell of film.
Like this, because have make soup be solidified to form film solidified cell container handling move into the arranged outside applying mechanism of taking out of mouthful, can be to the surface of the handled object of in container handling, moving into liquid medicine coating, therefore, can in incorporate device, carry out the coating function of soup and the curing function of solidifying coated soup, its result, equipment cost that can cutting device and the space is set, and then, not only can boost productivity, but also can improve the service efficiency of soup, in addition, there is not the uneven phenomenon of liquid medicine coating, can carries out the coating of soup equably.
At this moment, in a second aspect of the present invention, above-mentioned solidified cell is made of the heating unit of the above-mentioned handled object of heating.
In addition, in a third aspect of the present invention, above-mentioned heating unit is made of well heater or heating lamp.
In addition, in a fourth aspect of the present invention, above-mentioned solidified cell is made of UV-lamp.
In a fifth aspect of the present invention, above-mentioned applying mechanism comprises: the medical liquid spraying head, this medical liquid spraying head has the medical liquid spraying face, and this medical liquid spraying face is spreading all over the diameter of above-mentioned handled object or width is identical or be formed with a plurality of medical liquid sprayings hole than this diameter or width on the long length; And jet controling part, when taking out of when mouthful moving into above-mentioned handled object in above-mentioned container handling from above-mentioned moving into, control is sprayed above-mentioned soup from above-mentioned medical liquid spraying head.
In addition, in a sixth aspect of the present invention, above-mentioned jet controling part is controlled above-mentioned a plurality of medical liquid sprayings hole respectively.
In addition, in a seventh aspect of the present invention, below above-mentioned medical liquid spraying head, be provided with the acceptance division that is used to receive from the above-mentioned soup of above-mentioned medical liquid spraying head injection.
In addition, in a eighth aspect of the present invention, move into the detecting sensor portion that the arranged outside of taking out of mouthful has the above-mentioned handled object that detection moved into above-mentioned, above-mentioned jet controling part is controlled the action of above-mentioned medical liquid spraying head according to the output of above-mentioned detecting sensor portion.
In addition, in a ninth aspect of the present invention, above-mentioned jet controling part and above-mentioned transport mechanism move into the action that above-mentioned medical liquid spraying head is controlled in action synchronously.
In addition, in a tenth aspect of the present invention, the spacing in above-mentioned medical liquid spraying hole is in the scope of 30～3000 μ m.
In addition, in a eleventh aspect of the present invention, the spacing in above-mentioned medical liquid spraying hole is in the scope of 10～200 μ m.
In addition, in a twelveth aspect of the present invention, a kind of method that applies soup is provided, it is characterized in that: the coating curing method of this soup with liquid medicine coating on the surface of handled object and this soup is solidified, it comprises: working procedure of coating, utilize outside transport mechanism with above-mentioned handled object to have move into move in the container handling of taking out of mouthful in, utilize to be arranged on the above-mentioned applying mechanism in the outside of taking out of mouthful of moving into the surface of above-mentioned liquid medicine coating to above-mentioned handled object; And curing process, the above-mentioned soup on the surface that is coated in above-mentioned handled object is solidified.
In a thirteenth aspect of the present invention, a kind of storage medium that stores the program that can read in computing machine is provided, this program use of the present invention first to the tenth on the one hand in the described liquid medicine coating solidification equipment of either side when on the surface of handled object it being solidified liquid medicine coating, control above-mentioned coating curing device to implement the coating curing method of the described soup of a twelveth aspect of the present invention.
According to the coating curing device and the coating curing method of the soup that the present invention relates to, can bring into play good effect and effect as described below.
Because applying mechanism is arranged having the arranged outside of taking out of mouthful of moving into of container handling that makes soup be solidified to form the solidified cell of film, can be to the surface of the handled object of in container handling, moving into liquid medicine coating, therefore, can in incorporate device, carry out the coating function of soup and the curing function of solidifying coated soup, its result, equipment cost that can cutting device and the space is set, and then, not only can boost productivity, but also can improve the service efficiency of soup, in addition, there is not the uneven phenomenon of liquid medicine coating, can applies soup equably.
Description of drawings
Fig. 1 is the structural drawing of an example of the coating curing device of expression soup of the present invention.
Fig. 2 is the stereographic map of the position relation of expression medical liquid spraying head and acceptance division.
Fig. 3 is the planimetric map of an example of the medical liquid spraying face of expression medical liquid spraying head.
Fig. 4 is the process flow diagram that is used to illustrate the action of coating curing device.
Symbol description:
2: the coating curing device of soup; 4: container handling; 6: the spray head; 10: move into and take out of mouth; 12: opening and closing shutter portion; 24: mounting table; 26: solidified cell; 28: heating unit; 30: well heater; 44: applying mechanism; 48: resist (soup); 50: the medical liquid spraying head; 52: jet controling part; 56: the medical liquid spraying face; 58: the medical liquid spraying hole; 60: acceptance division; 62: detecting sensor portion; 70: transport mechanism; W: semiconductor wafer (handled object)
Embodiment
Below, describe the coating curing device of soup involved in the present invention and the embodiment of coating curing method in detail according to appended accompanying drawing.
Fig. 1 is the structural drawing of an example of the coating curing device of expression soup involved in the present invention, Fig. 2 is the stereographic map of the position relation of expression medical liquid spraying head and acceptance division (receiving portion), and Fig. 3 is the planimetric map of an example of the medical liquid spraying face of expression medical liquid spraying head.To using aqueous resist, use heating unit (well heater) to describe herein, as the situation of solidification equipment as soup.
As shown in the figure, the coating curing device 2 of this soup for example has by what aluminium or aluminium alloy etc. constituted and forms cylinder-shaped container handling 4.Top in this container handling 4 is provided with as the gas that is used to import the needs spray head 6 of the gas feed unit of purge gas for example, and a plurality of gas jetting hole 8A set from the gas jet face 8 in its lower section are to processing space S gas jet.In addition, use for example N
2Gas is as above-mentioned purge gas.
In this spray head 6, be formed with the 6A of gas diffusion chamber, be directed into the gas here after in-plane diffusion, spray from above-mentioned gas spray-hole 8A.
In addition, the sidewall of container handling 4 is provided with and is used for respect to taking out of mouth 10 to move into elongated the moving into that form in the horizontal direction of taking out of as the semiconductor wafer W of handled object in this container handling 4, and this is moved into and takes out of mouthfuls 10 and be provided with and can open the opening and closing shutter portion 12 that closes.And, being formed with exhausr port 16 in the bottom 14 of this container handling 4, the gas outlet 20 that is provided with off-gas pump 18 is connected with this exhausr port 16, carries out exhaust on one side can carry out pressure control to the atmosphere in the container handling 4 on one side.
In addition, be provided with the mounting table 24 that erects by pillar 22 from the central portion of the bottom 14 of container, upload the semiconductor wafer W that is equipped with as handled object at this charging floor 24 at the central portion of container handling 4.And, thereby in this container handling 4, be provided with make be coated in above-mentioned semiconductor wafer W soup lip-deep as described below for example resist solidify film forming solidified cell 26.
Particularly, the heating unit 28 that is provided with the above-mentioned wafer W of heating, uses well heater 30 as heating unit 28 herein as solidified cell 26.Above-mentioned well heater 30 is embedded in and is arranged in the above-mentioned mounting table 24, spreads all over the roughly whole zone of its in-plane and with respect to mounting table 24 electric insulations.This mounting table 24 is made of the pottery of AlN etc. or aluminium alloy etc.
On above-mentioned mounting table 24, be formed with a plurality of (for example 3) pin inserting hole 32 (in Fig. 1, only illustrating 2) that connects its above-below direction, above-mentioned respectively sell dispose in the inserting hole 32 with trip embedding (free chimeric (loosening chimeric)) state can insert up or down logical respectively sell inserting hole go up distribution 34.Throw-out collar 36 on promoting on this that pottery that 34 lower end disposes for example aluminium oxide and so on of toroidal makes, above-mentioned each go up and promote 34 lower end lift-launch attached on the throw-out collar on this 36.
Should go up throw-out collar 36 and be connected with the moving rod (stretch out and return bar) 38 that connects container bottom 14 settings, this moving rod 38 can carry out lifting by driver 40.Thus, when carrying out the handing-over of wafer W, make and above-mentionedly promote 34 on each and stretch out upward from each pin inserting hole 32 and to return (advance and retreat).In addition, the breakthrough part of the container bottom of moving rod 38 is provided with the corrugated tube 42 that can stretch, and above-mentioned moving rod 38 can carry out lifting in the impermeability of keeping container handling 4 (gas tightness).
In addition, the outside of mouth 10 is taken out of in elongated moving on the sidewall that is formed at above-mentioned container handling 4, be provided with the applying mechanism 44 as the soup of feature of the present invention, herein, the wafer W coating of moving in this container handling 4 of subtend is as the aqueous resist 48 of soup.
Particularly, this applying mechanism 44 comprises: with the medical liquid spraying head 50 of droplet-like injection as the resist 48 of soup; Jet controling part 52 with the injection action of controlling this medical liquid spraying head 50.This medical liquid spraying head 50 is fixed on above-mentioned moving on the container side wall of taking out of mouthfuls 10 outer upper by sway brace 54, and, take out of mouthfuls 10 length direction and form strip along above-mentioned moving into.
And, be formed with a plurality of medical liquid sprayings hole 58 as shown in Figures 2 and 3 on the medical liquid spraying face 56 below this medical liquid spraying head 50.Fig. 3 expresses an example of the alignment arrangements in medical liquid spraying hole 58, and in the situation shown in Fig. 3 (A), medical liquid spraying hole 58 is arranged and is configured to row, in the situation shown in Fig. 3 (B), express position, the left and right sides stagger a little and be arranged in two row situations.
And, under the situation of Fig. 3 (B), be listed as hole per 1/2 spacing staggered positions and forming on column direction by the 1st row and the 2nd.And the spacing P1 in the medical liquid spraying hole 38 of the situation shown in Fig. 3 (A) is about 30～3000 μ m, and the spacing P2 of every row of the situation shown in Fig. 3 (B) also is about 30～3000 μ m.Herein, if be " 2P1=P2 ", then in the situation of Fig. 3 (A) and Fig. 3 (B), identical to the injection density of the resist of wafer surface with length setting.In addition, the diameter in medical liquid spraying hole 58 is about 10～200 μ m.Wherein, in order easily to understand the present invention, in Fig. 3, amplify the diameter and the spacing in record medical liquid spraying hole 58 respectively.
In addition, it is identical with the diameter (being its width when handled object is the situation of tetragonal glass substrate) of wafer W that the length L in the formation zone in above-mentioned medical liquid spraying hole 58 is configured to, perhaps long than its length, for can be with primary coating by the wafer W moved into, promptly with once by and apply all sidedly.In above-mentioned each medical liquid spraying hole 58, be provided with piezoelectric element such as piezoelectric type (piezo) element as driver (actuator), thus resist 48 that can the liquid droplets shape.At this moment, about above-mentioned each medical liquid spraying hole 58, can control above-mentioned driver respectively.And, in order to receive the soup that falls, below above-mentioned medical liquid spraying head 50, be provided with the acceptance division 60 (with reference to Fig. 2) relative with above-mentioned medical liquid spraying face 56.
In addition, be provided with the detecting sensor portion 62 that is used to detect the above-mentioned wafer W of being moved at the central portion of the length direction of above-mentioned medical liquid spraying head 50, the output of this detecting sensor portion 62 is transfused to above-mentioned jet controling part 52.Therefore, this jet controling part 52 detects moving into of wafer W by above-mentioned detecting sensor portion 62, thus to medical liquid spraying head 50 output orders to spray resist.As this detecting sensor portion 62, can use for example optical sensor of reflection-type, but also can use the optical sensor of transmission-type.
In addition, in the above-mentioned outside of taking out of mouth 10 of moving into, be provided with the transport mechanism 70 of the outside that can bend and stretch and rotate with its separated portions, wafer W can be remained on fork (fork) 70A of this transport mechanism 70, take out of mouthfuls 10 by above-mentioned moving into, with wafer W with respect to moving into and take out of in the container handling 4.In addition, the signal of the action of relevant this transport mechanism 70 is fed to above-mentioned jet controling part 52.
And, the molar behavior of the coating curing device 2 of Gou Chenging like this, for example indication that moving into of transport mechanism 70 taken out of, to indication, the N of the action permission of jet controling part 52
2The supply of gas begins or supplies with the indication that stops and to the indication of wafer W heating etc., undertaken by the apparatus control portion of for example being made up of computing machine 72.The program of carrying out the computing machine of this action is stored on the storage medium of being made up of flexible plastic disc, CD (Compact Disc CD), CD-ROM, hard disk, flash memory or DVD etc. 74.
Below, with reference to Fig. 4 the action of the coating curing device 2 that as above constituted is described.Fig. 4 is the process flow diagram that is used to illustrate the action of coating curing device.
At first, the fork 70A that untreated semiconductor wafer W is supported on transport mechanism 70 goes up (Fig. 4 (A)), shown in arrow 80, drive this transport mechanism 70, by making 70 elongations of this transport mechanism, this wafer W is in moving into of open mode by opening and closing shutter portion 12 takes out of mouthfuls 10 and in container handling 4, move into (Fig. 4 (B)).
At this moment, when wafer W is under the detecting sensor portion 62 of horizontal direction by applying mechanism 44, is detected this and moves into action, 52 pairs of medical liquid spraying heads 50 of jet controling part send the indication of spraying resist.So, from the resist 48 of each medical liquid spraying hole 58 liquid droplets shape of above-mentioned medical liquid spraying head 50, thus below by this medical liquid spraying face 56 coating resist 48A (with reference to Fig. 4 (B)) on the wafer W surface of part.Wherein, in Fig. 4, represent to be coated with the part of resist 48A with oblique line.
In this case, may be controlled to from whole medical liquid spraying holes 58 and spray resist simultaneously, but, also may be controlled to the pace of the fork 70A of transport mechanism 70 synchronous, at first the central portion from the arrangement in medical liquid spraying hole 58 sprays, along with advancing of fork 70A, slowly expand the injection beginning action of carrying out soup to two side ends.In this case, can reduce the amount of the discarded resist of downwards acceptance division 60 sides effectively.
Thus, when wafer W was housed in the container handling 4 fully, shown in Fig. 4 (C), the whole surface of wafer W was coated with resist 48A fully.So, make going up of the below that is arranged on mounting table 24 promote 34 and rise, receive this wafer W, then, promote 34 declines this on by making, with the wafer W transfer on mounting table 24.Then, by making transport mechanism 70 bendings, shown in arrow 82, fork 70A leaves (Fig. 4 (C)) in container handling 4, by closing above-mentioned opening and closing shutter portion 12, makes in the container handling 4 to be in air-tight state.Air tightness when in addition, this is airtight also can ratio such as the air tightness during film formation device such as CVD low.
Utilize well heater 30, above-mentioned mounting table 24 is preheated, wafer W is heated to predetermined temperature and maintains this temperature, and flow out for example N from spray head 6
2Gas further utilizes the atmosphere in 18 pairs of container handlings of off-gas pump 4 to carry out exhaust as purge gas.
Thus, cure wafer W, remove volatile ingredient and resist is solidified, form the film 84 (Fig. 4 (D)) of the resist that solidifies from resist 48A.If finish above-mentioned cure processing, i.e. curing processing, then transport mechanism 70 carries out action same as described above, and shown in Fig. 4 (E), the wafer W that will be formed with the processing end of film 84 on the surface is taken out in container handling 4, thus end process.In addition, when the wafer W transfer that processing is finished is to fork 70A, makes and promote 34 risings, lift wafer W upward from mounting table 24.
Like this, moving into the outside of taking out of mouth 10, take out of the medical liquid spraying head 50 that is provided with applying mechanism 44 above mouthfuls 10 the outside moving into particularly, resist 48 as soup is coated on the surface of wafer W, that therefore, can carry out the coating of resist 48 and the resist 48 by coating in a table apparatus cures the curing of carrying out.
Therefore, the equipment cost of cutting device and the space is set simultaneously.In addition, owing to can in a conveyance, carry out working procedure of coating and curing process to wafer W, therefore, compare with existing situation of in independent device respectively, carrying out above-mentioned two operations, a part of conveyance operation can be omitted, thus, the throughput rate of product treatment can be improved.And, owing to compare, can reduce waste as the resist of soup with existing spin-coating method, therefore, can improve the service efficiency of soup.In addition, there is not the uneven phenomenon of liquid medicine coating yet, can carries out the coating of soup equably.
In addition, detect the wafer W of being moved into though be provided with detecting sensor portion 62 here,, be not limited thereto, also detecting sensor portion 62 can be set, control the injection action of the resist 48 that comes from medical liquid spraying head 50 synchronously with the conveyance of transport mechanism 70 action.In addition, though here the situation of use well heater 30 as heating unit 28 is illustrated,, also can use heating lamp to replace.
In addition, under the situation of usability photosensitiveness resist, can not use heating unit 28, can use for example UV-lamp, wait by this ultraviolet ray generation cross-linking reaction (polymerization or polycondensation) to be cured as solidified cell 26 as soup.
In addition, though here to using resist to be illustrated as the situation of soup, be not limited thereto, also can use the soup that is used to form dielectric film, for example poly-imines (polyimide) resin is used to form the soup of nesa coating etc.In addition, though here the example of semiconductor wafer as handled object is illustrated, be not limited thereto, glass substrate, LCD substrate, ceramic substrate etc. also can be applicable to the present invention.
Claims (12)
1. the coating curing device of a soup is characterized in that:
On the surface of handled object and this soup is solidified, it comprises the coating curing device of this soup with liquid medicine coating:
Have and utilize outside transport mechanism described handled object to be moved into the container handling of taking out of mouth of moving into of taking out of;
Be arranged in the described container handling mounting table of the described handled object of mounting;
Open the described opening and closing shutter portion that takes out of mouth that moves into that closes;
Be arranged on the described outside of taking out of mouth of moving into, with the applying mechanism of described liquid medicine coating on the surface of described handled object; With
Be arranged in the described container handling, make the described soup on the surface that is coated in described handled object be solidified to form the solidified cell of film.
2. the coating curing device of soup according to claim 1 is characterized in that:
Described solidified cell is made of the heating unit of the described handled object of heating.
3. the coating curing device of soup according to claim 2 is characterized in that:
Described heating unit is made of well heater or heating lamp.
4. the coating curing device of soup according to claim 1 is characterized in that:
Described solidified cell is made of UV-lamp.
5. according to the coating curing device of each described soup in the claim 1～4, it is characterized in that:
Described applying mechanism comprises:
The medical liquid spraying head, this medical liquid spraying head has the medical liquid spraying face, and this medical liquid spraying face is spreading all over the diameter of described handled object or width is identical or be formed with a plurality of medical liquid sprayings hole than this diameter or width on the long length; With
Jet controling part, when taking out of when mouthful moving into described handled object in described container handling from described moving into, control is sprayed described soup from described medical liquid spraying head.
6. the coating curing device of soup as claimed in claim 5 is characterized in that:
Described jet controling part is controlled described a plurality of medical liquid sprayings hole respectively.
7. the coating curing device of soup as claimed in claim 5 is characterized in that:
Below described medical liquid spraying head, be provided with the acceptance division that is used to receive from the described soup of described medical liquid spraying head injection.
8. the coating curing device of soup as claimed in claim 5 is characterized in that:
In the described arranged outside of taking out of mouthful of moving into the detecting sensor portion that the described handled object of being moved into is detected is arranged, described jet controling part is controlled the action of described medical liquid spraying head according to the output of described detecting sensor portion.
9. the coating curing device of soup as claimed in claim 5 is characterized in that:
Described jet controling part and described transport mechanism move into the action that described medical liquid spraying head is controlled in action synchronously.
10. the coating curing device of soup as claimed in claim 5 is characterized in that:
The spacing in described medical liquid spraying hole is in the scope of 30～3000 μ m.
11. the coating curing device of soup as claimed in claim 5 is characterized in that:
The spacing in described medical liquid spraying hole is in the scope of 10～200 μ m.
12. the coating curing method of a soup is characterized in that:
On the surface of handled object and this soup is solidified, it comprises the coating curing method of this soup with liquid medicine coating:
Working procedure of coating, utilize outside transport mechanism with described handled object to have move into move in the container handling of taking out of mouthful in, utilize to be arranged on the described applying mechanism in the outside of taking out of mouthful of moving into the surface of described liquid medicine coating to described handled object; With
Curing process makes the described soup on the surface that is coated in described handled object solidify in described container handling.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008053603 | 2008-03-04 | ||
| JP2008053603A JP2009212295A (en) | 2008-03-04 | 2008-03-04 | Application solidification device and application solidification method of chemical solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101587301A true CN101587301A (en) | 2009-11-25 |
Family
ID=41185162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2009101187480A Pending CN101587301A (en) | 2008-03-04 | 2009-03-04 | The coating curing device of soup and coating curing method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2009212295A (en) |
| KR (1) | KR101176707B1 (en) |
| CN (1) | CN101587301A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103247554A (en) * | 2012-02-07 | 2013-08-14 | 东京毅力科创株式会社 | Substrate treatment apparatus and substrate treatment method |
| CN110201851A (en) * | 2019-06-21 | 2019-09-06 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Heating device and atomizing glue spreader |
| CN113333235A (en) * | 2021-04-28 | 2021-09-03 | 西安交通大学 | Digital photocuring spin coating instrument for preparing sterile wound dressing with controllable shape |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0509962A1 (en) | 1991-04-15 | 1992-10-21 | Ciba-Geigy Ag | A process and an apparatus for producing a thin photoimageable coating on a metallic-layered substrate |
| JP3284814B2 (en) * | 1995-03-08 | 2002-05-20 | 松下電器産業株式会社 | Thin film forming apparatus and thin film forming method |
| JP3340945B2 (en) | 1997-08-06 | 2002-11-05 | 東京エレクトロン株式会社 | Coating and development processing equipment |
| JP2002351085A (en) * | 2001-05-30 | 2002-12-04 | Sharp Corp | Ultraviolet irradiation method and ultraviolet irradiation device |
| JP4043009B2 (en) * | 2001-06-11 | 2008-02-06 | 大日本スクリーン製造株式会社 | Substrate processing apparatus, substrate processing method, and substrate processing system |
| JP3808741B2 (en) * | 2001-10-01 | 2006-08-16 | 東京エレクトロン株式会社 | Processing equipment |
| JP3784312B2 (en) * | 2001-12-04 | 2006-06-07 | 東京エレクトロン株式会社 | Coating film forming apparatus and method |
| JP2003234280A (en) * | 2002-02-08 | 2003-08-22 | Dainippon Screen Mfg Co Ltd | Substrate treatment unit and device thereof |
| JP3853256B2 (en) * | 2002-05-28 | 2006-12-06 | 東京エレクトロン株式会社 | Substrate baking apparatus, substrate baking method, and coating film forming apparatus |
| JP2005270932A (en) * | 2004-03-26 | 2005-10-06 | Tokyo Electron Ltd | Coating film forming apparatus |
| JP2006210682A (en) * | 2005-01-28 | 2006-08-10 | Seiko Epson Corp | Substrate drier, substrate treating system, manufacturing method for electro-optical device, the electro-optical device and electronic equipment |
| JP4554397B2 (en) * | 2005-02-23 | 2010-09-29 | 東京エレクトロン株式会社 | Stage device and coating treatment device |
| JP3966884B2 (en) * | 2005-06-17 | 2007-08-29 | 美岳 伊藤 | Substrate processing apparatus, substrate processing method, and substrate manufacturing method |
| JP2008034746A (en) * | 2006-07-31 | 2008-02-14 | Tokyo Electron Ltd | Coating and developing device, method therefor and storage medium |
-
2008
- 2008-03-04 JP JP2008053603A patent/JP2009212295A/en active Pending
-
2009
- 2009-02-16 KR KR1020090012421A patent/KR101176707B1/en not_active IP Right Cessation
- 2009-03-04 CN CNA2009101187480A patent/CN101587301A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103247554A (en) * | 2012-02-07 | 2013-08-14 | 东京毅力科创株式会社 | Substrate treatment apparatus and substrate treatment method |
| CN103247554B (en) * | 2012-02-07 | 2016-08-31 | 东京毅力科创株式会社 | Substrate board treatment and substrate processing method using same |
| CN110201851A (en) * | 2019-06-21 | 2019-09-06 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Heating device and atomizing glue spreader |
| CN113333235A (en) * | 2021-04-28 | 2021-09-03 | 西安交通大学 | Digital photocuring spin coating instrument for preparing sterile wound dressing with controllable shape |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101176707B1 (en) | 2012-08-23 |
| JP2009212295A (en) | 2009-09-17 |
| KR20090095467A (en) | 2009-09-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101331567B1 (en) | Ink, Inkjet Printer, and Method for Printing | |
| US8609006B2 (en) | Pattern transfer apparatus and pattern forming method | |
| US10974495B2 (en) | Thermal management methods and apparatus for producing uniform material deposition and curing for high speed three-dimensional printing | |
| US10710297B2 (en) | Three-dimensional printer and operating method for the same | |
| CN105751695B (en) | A kind of pathological embedding box laser printer and its Method of printing | |
| KR101357745B1 (en) | Imprint apparatus, imprint method, and article manufacturing method | |
| AU2005202167A1 (en) | Method of forming structures using drop-on-demand printing | |
| KR19990067544A (en) | Solid Prototyping Method and Apparatus | |
| CN101587301A (en) | The coating curing device of soup and coating curing method | |
| WO2018097107A1 (en) | Imprint device, imprint method and article production method | |
| US10174184B2 (en) | Cellulosic material, liquid composition, shaped article, and shaped article production method | |
| US20190139788A1 (en) | Apparatus and methods for packaging semiconductor dies | |
| US20170072712A1 (en) | Method and system for modifying a surface topography | |
| JP5611912B2 (en) | Imprint resist material, pattern forming method, and imprint apparatus | |
| TWI795648B (en) | Method and apparatus for substrate registration and anchoring in inkjet printing | |
| US8900657B2 (en) | Transferring medium manufacturing method and transferring medium | |
| US20180215152A1 (en) | Fluid manifold | |
| KR20160047558A (en) | Imprint apparatus and method of manufacturing article | |
| CN107000288A (en) | The mould that Controlled OverLap for the carrier with electronic component is molded, molding equipment and method and molding product | |
| JP2011050837A (en) | Liquid body heating device, and liquid body discharge device with the same | |
| JP5866931B2 (en) | Image forming method | |
| EP3156234B1 (en) | Ink jet head and ink jet recording device | |
| US10427401B2 (en) | Printhead recovery | |
| US11548287B2 (en) | Fluidic die assemblies with rigid bent substrates | |
| US20220379553A1 (en) | Particle material preheating device and use in 3d methods |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20091125 |
|
| AD01 | Patent right deemed abandoned |