CN101551077B - Light-emitting device and backlight device using the same and assembling method - Google Patents

Light-emitting device and backlight device using the same and assembling method Download PDF

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Publication number
CN101551077B
CN101551077B CN2009101282324A CN200910128232A CN101551077B CN 101551077 B CN101551077 B CN 101551077B CN 2009101282324 A CN2009101282324 A CN 2009101282324A CN 200910128232 A CN200910128232 A CN 200910128232A CN 101551077 B CN101551077 B CN 101551077B
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light
colloid layer
emitting device
transparent encapsulating
encapsulating body
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CN101551077A (en
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林明德
林明耀
戴光佑
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Industrial Technology Research Institute ITRI
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Industrial Technology Research Institute ITRI
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Abstract

A light-emitting device includes a bearing support, a light-emitting unit, a transparent packaging body and a fluorescent colloid layer. The light-emitting unit is arranged on the bearing support. Thetransparent packaging body covers the light-emitting unit, the outer side of the transparent packaging body has a dent, and the transparent packaging body has at least a reflecting face in the dent. The fluorescent colloid layer is covered outside the transparent packaging body, and forms an air chamber with the dent of the transparent packaging body. The reflecting face of the transparent packaging body guides the luminous ray generated by the light-emitting unit to one side wall of the fluorescent colloid layer.

Description

Light-emitting device and back lighting device and the assemble method thereof of using it
Technical field
The invention relates to a kind of light-emitting device, and particularly relevant for the uniform light-emitting device of a kind of briliancy.
Background technology
Be used for light-emitting devices such as light-emitting device such as at home illumination, commercial lighting, office lighting or domestic electronic, auto electronic, industrial electronics, nothing more than being combinations such as incandescent lamp, fluorescent lamp, Halogen lamp LED.
In recent years and since light-emitting diode possess have that driving voltage is low, the toggle speed of lighting a lamp is fast, no mercury pollution, non-emitting ultraviolet light, solid-state encapsulation are difficult for advantages such as fragmentation, light-emitting diode is regarded as the optimal selection of light-emitting device of new generation.Moreover the volume of light-emitting diode is little, more can cooperate the demand of many light, thin and miniaturized application products.
Yet the light-emitting device of most of kind comprises light-emitting diode, belongs to point-source of light more.When being applied to specific products and using, how to make its light source uniformly dispersing become the emphasis of required consideration as light source.
In addition, no matter the light-emitting device of which kind of type all can produce high temperature and have influence on its peripheral electronic building brick when running, and the radiating efficiency that how to increase light-emitting device effectively also is the problem of required solution.
At present, because each tame manufacturer wishes that all the manufacturing product can meet economic benefit, how to reduce the cost of manufacture of light-emitting device, and can keep the reliability of light-emitting device, more a noticeable problem.
Summary of the invention
The object of the present invention is to provide a kind of light-emitting device and back lighting device and the assemble method thereof of using it.The present invention is to provide a kind of light-emitting device that can be applicable to many electronic installations and occasion, the advantage that not only has the assembling of being beneficial to, also can solve the problem that heat be difficult for to be got rid of, in addition, more can produce comparatively evenly and light source that briliancy is lower to overcome the high briliancy problem of traditional light-emitting device.
For achieving the above object, the uniform light-emitting device of briliancy provided by the invention, it comprises a carrying support, a luminescence unit, a transparent encapsulating body and a fluorescent colloid layer.Luminescence unit is arranged on the carrying support.Transparent encapsulating body covers luminescence unit, and the outside of transparent encapsulating body has a recess.Transparent encapsulating body is in its recess and have at least one reflecting surface.It is external that fluorescent colloid layer covers in transparent enclosure, and the recess of fluorescent colloid layer and transparent encapsulating body forms an air chamber.Wherein, the reflecting surface of transparent encapsulating body ray guidance that luminescence unit is produced is to a sidewall of fluorescent colloid layer.
Light-emitting device provided by the invention, it comprises a carrying support, a luminescence unit, a light tight side assemblies, a transparent encapsulating body and a fluorescent colloid layer.Luminescence unit is arranged on the carrying support.Light tight side assemblies is around the luminescence unit setting.Transparent encapsulating body covers luminescence unit, and the position is in light tight side assemblies, and wherein, the upper surface of transparent encapsulating body has a recess, and transparent encapsulating body has a reflecting surface in recess.Fluorescent colloid layer is arranged on the sidewall of transparent encapsulating body, and the position is between light tight side assemblies and transparent encapsulating body.Wherein, the reflecting surface of transparent encapsulating body is that ray guidance that luminescence unit is produced is to fluorescent colloid layer, with the fluorescence excitation colloid layer, light tight side assemblies makes it the upper surface bright dipping from transparent encapsulating body then in order to the light of reflected fluorescent light colloid layer and luminescence unit.
Light-emitting device provided by the invention, it comprises a carrying support, an opaque carrier, a luminescence unit, a transparent encapsulating body and a plurality of fluorescent colloid layer.Opaque carrier is arranged on carrying support bottom side.Luminescence unit is arranged on the carrying support.Transparent encapsulating body covers luminescence unit, and the position is on opaque carrier, and wherein, the upper surface of transparent encapsulating body comprises a plurality of reflectings surface.These fluorescent colloid layer are arranged on a plurality of sidewalls of transparent encapsulating body, and contiguous those reflectings surface.Wherein, those reflectings surface of transparent encapsulating body ray guidance that luminescence unit is produced is to those fluorescent colloid layer, with the fluorescence excitation colloid layer.
Light-emitting device provided by the invention, it comprises a carrying support, a luminescence unit, a transparent encapsulating body, a fluorescent colloid layer, a light tight reflector and an opaque carrier.Luminescence unit is arranged on the carrying support.Transparent encapsulating body covers luminescence unit, and wherein, transparent encapsulating body top has a reflecting surface.Fluorescent colloid layer is arranged on the reflecting surface of transparent encapsulating body.Light tight reflector covers fluorescent colloid layer.Opaque carrier is arranged on carrying support bottom side.Wherein, light tight reflector in order to ray guidance that luminescence unit is produced to fluorescent colloid layer, with the fluorescence excitation colloid layer, and opaque carrier and light tight reflector are also left from a bright dipping zone of the sidewall of transparent encapsulating body in order to the light of control fluorescent colloid layer and luminescence unit.
Description of drawings
Figure 1A, Figure 1B distinctly illustrate the schematic diagram of light-emitting device under different visual angles according to the tool assembling positioning function of the embodiment of the invention one.
Fig. 1 C illustrates the schematic diagram that has projective structure on the registration arm of Figure 1A.
Fig. 1 D illustrates the schematic diagram that the carrying support has a pair of trip.
Fig. 1 E illustrates the schematic diagram that the carrying support has removable thin slice.
Fig. 1 F illustrates the schematic diagram that registration arm has recessed folding end.
Fig. 1 G illustrates the schematic diagram that light-emitting device has two carrying supports.
Fig. 1 H is the schematic diagram that illustrates Fig. 1 G light-emitting device and a corresponding circuit board.
Fig. 1 I illustrates light-emitting device can be attached to schematic diagram on the lamp socket.
Fig. 2 A~2D is the continuous schematic diagram that illustrates the assembling back lighting device.
Fig. 2 E, Fig. 2 F are the fin cross section views of recessed folding in the same direction that illustrates radiating seat.
Fig. 2 G is the schematic diagram that illustrates radiating seat and circuit board electric connection.
Fig. 2 H illustrates the schematic diagram that reflector is set on the circuit board.
Fig. 3 is the method flow diagram that illustrates assembling light-emitting device and circuit board.
Fig. 4 A is the schematic diagram that illustrates according to the uniform light-emitting device of briliancy of the embodiment of the invention two.
Fig. 4 B illustrates the enlarged diagram of Fig. 4 A light-emitting device when running.
Fig. 5 A, Fig. 5 B illustrate the schematic diagram that light-emitting device has the transparent colloid layer.
Fig. 5 C illustrates the schematic diagram that the fluorescent colloid layer top has opening.
Fig. 5 D is the schematic diagram that the fluorescent colloid layer that illustrates Fig. 5 C does not envelope transparent encapsulating body fully.
Fig. 5 E is the schematic diagram that the fluorescent colloid layer that illustrates Fig. 5 D only covers transparent encapsulating body.
Fig. 5 F be illustrate Fig. 5 D fluorescent colloid layer also clad live the schematic diagram of its recess of transparent encapsulating body.
Fig. 5 G to Fig. 5 I illustrates the schematic diagram that catoptric arrangement is set in light-emitting device.
Fig. 5 J to Fig. 5 P illustrates the schematic diagram that catoptric arrangement has other variation.
Fig. 5 Q and Fig. 5 R are that to illustrate catoptric arrangement respectively be concentric circles and the schematic diagram that is arranged in parallel.
Fig. 5 S illustrates the schematic diagram of filling up a clearance layer material between transparent encapsulating body and the fluorescent colloid layer.
Fig. 5 T illustrates the schematic diagram of designing the alligatoring structure on the reflecting surface of transparent encapsulating body.
Fig. 5 U illustrates the schematic diagram that the junction of transparent encapsulating body and fluorescent colloid layer has the alligatoring structure.
Fig. 6 is the method flow diagram that illustrates shop drawings 4A light-emitting device.
Fig. 7 A~7D is the continuous schematic diagram that illustrates construction drawing 4A light-emitting device.
Fig. 8 A illustrates the schematic diagram that Fig. 4 A light-emitting device is equiped with bowl-shape reflector.
Fig. 8 B illustrates the schematic diagram that fills up material in the reflector of Fig. 8 A.
Fig. 8 C~8G is the schematic diagram that illustrates fluorescent colloid layer tool sandwich construction.
Fig. 8 H~8M illustrates the schematic diagram that transparent encapsulating body has different face shapings.
Fig. 8 N illustrates the schematic diagram of the height of fluorescent colloid layer greater than transparent encapsulating body.
Fig. 8 O illustrates fluorescent colloid layer to be produced on schematic diagram in the transparent encapsulating body.
Fig. 8 P illustrates the schematic diagram of the height of transparent encapsulating body alteration of form and fluorescent colloid layer greater than transparent encapsulating body.
Fig. 8 Q illustrates the schematic diagram that a dyestuff colloid layer envelopes luminescence unit.
Fig. 8 R illustrates a dye coating to be arranged on the outermost schematic diagram of structure.
Fig. 8 S illustrates the schematic diagram that a dye fluorescence layer is arranged on the transparent enclosure external body.
Fig. 8 T illustrates the schematic diagram that directly dye coating is arranged on the fluorescent colloid layer outside.
Fig. 8 U illustrates the schematic diagram that a diffusion layer is arranged on the transparent encapsulating body outside.
Fig. 8 V, Fig. 8 W illustrate the schematic diagram that light-emitting device has diffusion layer and multilayer fluorescence coating.
Fig. 9 A is the schematic diagram that illustrates according to the stack light-emitting device of the embodiment of the invention three.
Fig. 9 B is the exploded view that illustrates Fig. 9 A stack light-emitting device.
Fig. 9 C, Fig. 9 D illustrate with the fixing schematic diagram of cover frame.
Fig. 9 E, Fig. 9 F illustrate with the fixing schematic diagram of Extendible flake.
Fig. 9 G, Fig. 9 H are the schematic diagrames that illustrates other distortion of stack light-emitting device.
Figure 10 illustrates the staggered schematic diagram of luminescence unit.
Figure 11 A illustrates the schematic diagram that the stack light-emitting device is a column structure.
Figure 11 B is the end view that illustrates Figure 11 A stack light-emitting device.
Figure 12 A is the schematic diagram that illustrates the main body rack of Figure 11 A.
Figure 12 B is the schematic diagram that illustrates the cooling stand of Figure 11 A.
Figure 13 A is the schematic diagram that illustrates according to the embodiment of the invention two another light-emitting devices.
Figure 13 B, Figure 13 C are the schematic diagrames that the light-emitting device that respectively illustrates Figure 13 A adds preposition receipts optical lens.
Figure 13 D, Figure 13 E respectively illustrate a plurality of fluorescent colloid layer uprightly to be arranged on schematic diagram in the light-emitting device.
Figure 13 F illustrates the schematic diagram that may command goes out the light-emitting device of optical range.
Figure 13 G is the schematic diagram that the light-emitting device that illustrates Figure 13 F adds the secondary optics reflector.
Figure 13 H to Figure 13 K respectively illustrates the fluorescent colloid layer of Figure 13 F and the schematic diagram of other set-up mode of light tight reflector.
Figure 13 L is the schematic diagram that is provided with a plurality of luminescence units in the light-emitting device.
Primary clustering symbol description in the accompanying drawing
100,100 ', 100 ": the light-emitting device of tool assembling positioning function
102,102 ', 102 ", 202,302,402: luminescence unit
104,104 ', 104 ", 204: the carrying support
106: plate body
108,110,108 ', 110 ': registration arm
108A, 110A: detent
108B, 110B: projective structure
108A ', 110A ': recessed folding end
112,112 ', 114: electrode pin
116: guide pillar
118: trip
120: removable thin slice
140,150: circuit board
140A, 150A: run through opening
142: lamp socket
152,154: electrode contact
156: the insert type pin
160: radiating seat
160A: slot
162,164: fin
166: power supply slot
170: reflector
200: the uniform light-emitting device of briliancy
206,410: transparent encapsulating body
206A: reflecting surface
207: the clearance layer material
208,208 ', 208 ", 280,280 ', 280 ", 412: fluorescent colloid layer
208A: sidewall
208A ': opening
208B: top
209,209 ': the alligatoring structure
210: air chamber
220: the transparent colloid layer
231,233,235,237,239,241,243,245,247: catoptric arrangement
250: the first die cavitys
260: the second die cavitys
270: bowl-shape reflector
281,281 ', 281 ": first fluorescence coating
282,282 ', 282 ": second fluorescence coating
283,283 ": the 3rd fluorescence coating
290: transparent spacers
291: the dyestuff colloid layer
292,292 ': dye coating
293: the dye fluorescence layer
294,294 ', 294 ": diffusion layer
300,400: the stack light-emitting device
304,404: main body rack
304A: air discharge duct
306,308,306 ', 308 ', 306 ", 308 ", 406,408: cooling stand
310,312: the electrode pin
316: fixation kit
318: the cover frame
320: Extendible flake
500,600,600 ', 600 ": light-emitting device
502,602: luminescence unit
504,604: the carrying support
504A, 504B: lead frame
506,606: transparent encapsulating body
506A, 606A: fully reflecting surface
508,608: fluorescent colloid layer
510: light tight side assemblies
512,512 ': preposition receipts optical lens
512A ': receive optical interface
604A: reflector
610: light tight reflector
612: light tight carrier
614: bowl-shape reflector
616: transparent spacers
Embodiment
For foregoing of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs. elaborates.
Embodiment one
Please refer to Figure 1A, 1B, it distinctly illustrates the schematic diagram of light-emitting device under different visual angles according to the tool assembling positioning function of the embodiment of the invention one.Light-emitting device 100 comprises a luminescence unit 102 and a carrying support 104.Carrying support 104 comprises a plate body 106 and at least one registration arm, in present embodiment, is that to have two registration arm 108,110 with carrying support 104 be that example is done explanation.One end of plate body 106 connects 108,110 other ends that connect plate body 106 of 102, two registration arm of luminescence unit, and registration arm the 108, the 110th, extends towards the direction of luminescence unit 102.Preferably, two registration arm the 108, the 110th are symmetrical in plate body 106 and are provided with.
Because registration arm the 108, the 110th, extend upward by plate body 106 belows, the two itself has the characteristic that is similar to elastic clamping hook registration arm 108,110, makes carrying support 104 be easy to be assembled on other assembly.In addition, the junction of registration arm 108,110 and plate body 106 has radian design, makes the elastic characteristic of 106 of registration arm 108,110 and plate bodys more obvious, and damages the structure of registration arm 108,110 can be because of assembling carrying support 104 time.
For making carrying support 104 firmly and securely be positioned on registration arm 108,110, respectively to be provided with detent 108A, 110A on other assembly.Detent 108A, 110A distinctly are positioned at the end that registration arm 108,110 is adjacent to luminescence unit 102, in order to engage with other assembly.
Except preventing to carry support 104 by detent 108A, 110A direction moves up, down, also can on registration arm 108,110, design different assemblies and on other direction, move with restriction carrying support 104.For example can be with reference to Fig. 1 C, it illustrates the schematic diagram that has projective structure on the registration arm of Figure 1A.In registration arm 108,110 each other detent 108A, 110A two sides, can produce a plurality of projective structure 108B, 110B, these projective structures 108B, 110B use so that the thickness of part registration arm 108,110 increases.With detent 108A projective structure 108B adjacent thereto is example, the opening (for example be Fig. 2 A run through opening 150A) and its detent 108A that run through an assembly when registration arm 108 are sticked on the assembly, two projective structure 108B can make registration arm 108 closely contact with sidewall in the opening, thereby can prevent that registration arm 108 from rocking because of opening clearance front and back.
The luminescence unit 102 of present embodiment for example comprises a light-emitting diode chip for backlight unit (not indicating), and shown in Figure 1A, 1B, the bottom surface of luminescence unit 102 is provided with two electrode pins 112,114 in order to luminescence unit 102 is electrically connected to other assembly.In addition, carrying support 104 has more a guide pillar 116, is arranged on the plate face of plate body 106, and is adjacent to luminescence unit 102.Guide pillar 116 can be one-body molded with plate body 106, in order to fixing of auxiliary carrying support 104.This guide pillar 116 also can be the structure of other form, please refer to Fig. 1 D, 1E, and Fig. 1 D illustrates the schematic diagram that the carrying support has a pair of trip, and Fig. 1 E illustrates the schematic diagram that the carrying support has removable thin slice.Shown in Fig. 1 D, aforementioned guide pillar 116 can be replaced by a pair of trip 118, and trip 118 is adjacent to luminescence unit 102, and is positioned at two offsides of plate body 106, also can be used for the fixing of auxiliary carrying support 104.Shown in Fig. 1 E, aforesaid two guide pillars 116 also can be replaced by two comparatively fragile removable thin slices 120 of structure.Removable thin slice 120 is positioned at plate body 106 2 sides of luminescence unit 102 lower ends, and in the process of assembling carrying support 104, removable thin slice 120 is destroyed or remain on the carrying support 104 with as the auxiliary fixing assembly that carries support 104 according to situation.
Though the above-mentioned registration arm 108,110 of present embodiment is to be engaged with other assembly by detent 108A, 110A, so not as qualification, registration arm 108,110 also can have other structural design.Please refer to Fig. 1 F, it illustrates the schematic diagram that registration arm has recessed folding end.Registration arm 108 ', 110 ' to form recessed folding end 108A ', 110A ', makes registration arm 108 ', 110 ' have the backstop function that folk prescription makes progress in the outside respectively recessed folding in contiguous luminescence unit 102 places after being assembled on other assembly.
Please refer to Fig. 1 G, 1H, Fig. 1 G illustrates the schematic diagram that light-emitting device has two carrying supports, and Fig. 1 H illustrates the schematic diagram of the corresponding circuit board of Fig. 1 G light-emitting device.Two carrying supports 104 ' of light-emitting device 100 ' are divided into two sides of its luminescence unit 102 ' symmetry.The structure of carrying support 104 ' and aforementioned carrying support 104 can be identical or inequality.In this example, carrying support 104 ' is the rectangular configuration that is made by single plate.Shown in Fig. 1 H, when light-emitting device 100 ' was desired to be attached on the circuit board 140, the 104 ' beginning of two carrying supports of light-emitting device 100 ' was to recessed folding, ran through among the opening 140A to insert two of circuit board 140.In addition, the electrode pin 112 ' of light-emitting device 100 ' also is attached to circuit board 140 backs and circuit board 140 electric connections at light-emitting device 100 '.
Other please refer to Fig. 1 I, and it illustrates light-emitting device can be attached to schematic diagram on the lamp socket.Similarly, light-emitting device 100 " have two carrying supports 104 ", be divided into luminescence unit 102 " two sides of below.Two carrying supports 104 " shape that constituted is identical with the shape of lamp socket 142, as helical form, makes carrying support 104 " can lock in the lamp socket 142, with light-emitting device 100 " be fixed in the lamp socket 142.
Above-mentioned each light-emitting device serves many purposes, and except can be applicable in the general lighting equipment, for example is household light fixtures, street lamp etc., also can be applicable in advertisement billboard, the StoreFront signboard, and in addition, light-emitting device also can be applicable to use as light source in the back lighting device.And, have more elasticity, the following drawings explanation when making the more simple and easy and dismounting of the assembling of back lighting device because light-emitting device has the function of assembling location.
Please refer to Fig. 2 A~Fig. 2 D, it illustrates the continuous schematic diagram of assembling back lighting device.And please refer to Fig. 3, it illustrates the method flow diagram of assembling light-emitting device and circuit board.As shown in Figure 3, the assemble method of light-emitting device comprises step S31~S33: at first, make the luminescence unit of light-emitting device and the opening that runs through of carrying support alignment circuit plate; Then, the carrying support being inserted runs through in the opening; Then, continue to move the carrying support, pass the outside of running through opening and being positioned at circuit board, and the registration arm system of carrying support is sticked in the sidewall that runs through in the opening up to the plate body of carrying support, so so that luminescence unit be fixed on the circuit board.
Shown in Fig. 2 A, the circuit board 150 of back lighting device has one and runs through opening 150A, arrange in pairs or groups the in fact cross sectional shape of carrying support 104 of light-emitting device 100 of this shape that runs through opening 150A.In addition, having two electrode contacts 152,154 on circuit board 150, is to electrically connect in order to the electrode pin 112,114 with light-emitting device 110.
In step S31, in the time will being assembled into light-emitting device 100 on the circuit board 150, must earlier 104 alignment of carrying support be run through opening 150A, and the also necessary alignment electrode contact 152,154 in the position of electrode pin 112,114 can electrically connect after combining with circuit board 150 to guarantee light-emitting device 100.
Then, shown in step S32 and S33, will carry support 104 insertions and run through opening 150A, and the registration arm 108,110 that continues to move up to carrying support 104 is sticked on the circuit board 150.Because registration arm 108,110 has elasticity, when assembling, because registration arm 108,110 is subjected to running through the strangulation of opening 150A, rubber-like registration arm 108,110 can successfully be inserted carrying support 104 and run through among the opening 150A towards the recessed folding of direction of plate body 106.When carrying support 104 moves detent 108A, 110A (seeing Figure 1A) that a segment distance makes registration arm 108,110 when running through opening 150A, because the strangulation that registration arm 108,110 and circuit board are 150 disappears immediately, because the elastic reaction of registration arm 108,110 itself, registration arm 108,110 can outwards eject moment, detent 108A, 110A is sticked in runs through the interior sidewall of opening 150A.Thus, luminescence unit 102 can be positioned on the circuit board 150 just carry support 104, shown in Fig. 2 B.
At this moment, electrode pin the 112, the 114th is aligned in electrode contact 152,154.Electrically connect for making really to produce between light-emitting device 100 and the circuit board 150, during the assembling back lighting device, also can comprise the step of welding.
Preferably, can scolder be set prior to electrode contact 152,154 places, for example be brazing metals such as tin, lead, copper.After light-emitting device 100 is assembled to circuit board 150, shown in Fig. 2 B, light-emitting device 100 and circuit board 150 can be arranged at a heater, for example be to heat in the tin stove.Because the volume of electrode contact 152,154 is very little, the scolder on the electrode contact 152,154 will melt after being heated fast, and afterwards, electrode contact 152,154 just can combine with electrode pin 112,114 really.
What deserves to be mentioned is that because after light-emitting device 100 is assembled in circuit board 150, it is few that it exposes to the outer structure (only being luminescence unit 102) of circuit board 150, make that to make secondary optics assembly assembling design more easy.In addition, because the registration arm 108,110 of carrying support 104 has elasticity, when single light-emitting device 100 lost efficacy, only need light-emitting device 100 to be disassembled light-emitting device more to renew from circuit board 150, no matter more convenient really when assembling or dismounting with simple push action.
Preferably, back lighting device also has a radiating seat 160 (seeing Fig. 2 C) and passes in order to the temperature with light-emitting device 100, produces overheated situation to prevent light-emitting device 100.Radiating seat 160 has a slot 16 0A, and wherein, slot 16 0A can be made of 162,164 of two fin.Two fin the 162, the 164th, recessed in the opposite direction folding, for example: fin 162 is towards the fovea superior folding, and fin 164 is to constitute slot 16 0A towards recessed folding.
The carrying support 104 of light-emitting device 100 is to run through circuit board 150 also partly to be positioned at outside the circuit board 150, and carrying support 104 then can insert among the slot 16 0A of radiating seat 160.Preferably, be that carrying support 104 is combined in the mode of close-fitting with slot 16 0A, make carrying support 104 produce substantial the contact, shown in Fig. 2 D with two fin 162,164.So, the heat energy that luminescence unit 102 is produced when running enough directly is passed to radiating seat 160 with outside loss by carrying support 104, rather than be passed on the circuit board 150, can avoid high temperature that the circuit of circuit board 150 is caused damage, for example make other electronic building brick Yin Gaowen on the circuit board 150 and wear out.
Though above-mentioned radiating seat 160 be with two in the opposite direction the fin 162,164 of recessed folding explain, so not as qualification, please refer to through Fig. 2 E, 2F, its fin that illustrates radiating seat is the cross section view of recessed folding in the same direction.Shown in Fig. 2 E, fin 162,164 simultaneously to recessed folding to constitute slot 16 0A.Or shown in Fig. 2 F, fin 162,164 is rolled over to constitute slot 16 0A to fovea superior simultaneously.Fin 162,164 can be made by same plate in fact one-body moldedly.
And please refer to Fig. 2 G, it illustrates the schematic diagram of radiating seat and circuit board electric connection.It is to electrically connect circuit board 150 that radiating seat 160 has a feeder ear, gives light-emitting device 100 with power supply.Shown in Fig. 2 G, feeder ear can be a power supply slot 166, and circuit board 150 can be an insert type pin 156.In assembling light-emitting device 100 during, in the power supply slot 166 of can simultaneously insert type pin 156 being planted, to finish the electric connection of radiating seat 160 and circuit board 150 to radiating seat 160.
In addition, please refer to Fig. 2 H, it illustrates the schematic diagram that reflector is set on the circuit board.Preferably, reflector 170 can be set on circuit board 150, and make reflector 170 be positioned at light-emitting device 100 around, with control light-emitting device 100 light direction.
The light-emitting device 100 of present embodiment is owing to have flat carrying support 104, can pass circuit board 150 easily also directly is plugged in the radiating seat 160 of circuit board 150 belows, cooling system (comprising carrying support 104 and radiating seat 160) is come with Circuits System (comprising luminescence unit 102 and circuit board 150) is isolated effectively, so is to improve manipulating the life-span of whole device.In addition, the registration arm 108,110 of carrying support 104 has elastic characteristic and detent 108A, 110A, can carrying support 104 insert circuit boards 150 backs directly and circuit board 150 accurately locate, the light-emitting device 100 of present embodiment has encapsulating structure more simple and that be easy to manufacture.Moreover, after the location, also can so when being applied to the electronic product of middle and high power, also can guarantee that product has enough reliabilitys by seam light-emitting device 100 and the reliability of circuit board 150 with the increase circuit.
Embodiment two
Please refer to Fig. 4 A, it illustrates the schematic diagram according to the uniform light-emitting device of briliancy of the embodiment of the invention two.Light-emitting device 200 comprises a luminescence unit 202, carrying support 204, a transparent encapsulating body 206 and a fluorescent colloid layer 208.Luminescence unit 202 is arranged on the carrying support 204.Transparent encapsulating body 206 covers luminescence unit 202, and the outside of transparent encapsulating body 206 has a recess.Transparent encapsulating body 206 has at least one reflecting surface 206A in its recess.Fluorescent colloid layer 208 is arranged at outside the transparent encapsulating body 206, and the recess of fluorescent colloid layer 208 and transparent encapsulating body 206 forms an air chamber 210.Wherein, the reflecting surface 206A of transparent encapsulating body 206 is in order to ray guidance that luminescence unit 202 the is produced sidewall 208A to fluorescent colloid layer 208.Fluorescent colloid layer 208 can be made into a cylinder with transparent encapsulating body 206, allows sidewall 208A present an annular light-emitting area.
Preferably, the position of transparent encapsulating body 206 its recesses is to be positioned at luminescence unit 202 tops, and recess presents a back taper, and the summit of taper is corresponding to luminescence unit 202.In addition, reflecting surface 206A is preferably an arc surface.
And please refer to Fig. 4 B, it illustrates the enlarged diagram of Fig. 4 A light-emitting device when running.Shown in Fig. 4 B,, thereby can produce the effect of total reflection because transparent encapsulating body 206 is different with the gas refracting index in the air chamber 210.For instance, the refractive index of transparent encapsulating body 206 for example is 1.5, and the air refraction in the air chamber 210 is about 1, when the light that is produced when luminescence unit 202 is passed to reflecting surface 206A, owing to only be delivered in the less air of refractive index, thereby can produce the phenomenon of total reflection by the bigger transparent encapsulating body 206 of refractive index.The light that luminescence unit 202 produces is crossed transparent encapsulating body 206 except the part break-through and the top 208B of arrival fluorescent colloid layer 208, and major part is the sidewall 208A that is led to fluorescent colloid layer 208, with the fluorescent material effect in the fluorescent colloid layer 208, produces fluorescence.In addition, also material, film or the metal coating with high reflectance can be set on reflecting surface 206A directly.
Fluorescent colloid layer 208 can be the uniform rete of a thickness.Yet, shown in Fig. 4 B,, therefore, preferably, can make the thickness of the thickness of fluorescent colloid layer 208 its sidewall 208A greater than fluorescent colloid layer 208 its top 208B because the light that luminescence unit 202 produces can be led to the sidewall 208A of fluorescent colloid layer 208; Or, make the fluorescent material concentration of the fluorescent material concentration of fluorescent colloid layer 208 its sidewall 208A greater than fluorescent colloid layer 208 its top 208B.Thus, not only can strengthen the efficient of fluorescence conversion, more can accurately control the light of luminescence unit 202 generations and the mixed light ratio between fluorescent colloid layer 208 convert light.
The luminescence unit 202 of present embodiment for example is a light-emitting diode chip for backlight unit, and the phosphor material powder kind of fluorescent colloid layer 208 then can be according to the coloured light color decision that will allocate.For instance, if light-emitting device 200 will be produced the effect of white light, then can select a blue LED chip as luminescence unit 202, and the fluorescent colloid layer 208 of collocation yellow fluorescent powder making, thus, when the blue light of blue LED chip generation was directed at fluorescent colloid layer 208, blue light can excite yellow fluorescent powder to produce gold-tinted earlier, when gold-tinted again with after blue light combines, just can produce the mixed light effect of white light.In addition, also can utilize the luminescence unit of ultraviolet light to mix the light-emitting device that the fluorescent material with red, green, blue three-wavelength is produced white light.
Light-emitting device 200 also can have other structural design.Please refer to Fig. 5 A, 5B, it illustrates the schematic diagram that light-emitting device has the transparent colloid layer.Shown in Fig. 5 A, this transparent colloid layer 220 is arranged at outside the fluorescent colloid layer 208, can be in order to protection fluorescent colloid layer 208.In addition, shown in Fig. 5 B, also can earlier transparent colloid layer 220 be arranged at transparent encapsulating body 206, again fluorescent colloid layer 208 be arranged at outside the transparent colloid layer 220 outward to form air chamber 210.
The fluorescent colloid layer of present embodiment also can have other structural design, below with illustration.Please earlier with reference to Fig. 5 C, it illustrates the schematic diagram that the fluorescent colloid layer top has opening.Because wide sidewalls that are led to fluorescent colloid layer 208 ' that luminescence unit 202 produces can be produced opening 208A ' at the top of fluorescent colloid layer 208 ' more, to save phosphor material powder.Opening 208A ' is corresponding to the recess location of transparent encapsulating body 206, and preferably, makes the size of opening 208A ' approximate the size of recess.Please refer to Fig. 5 D in addition, its fluorescent colloid layer 208 ' that illustrates Fig. 5 C does not envelope the schematic diagram of transparent encapsulating body 206 fully.Because fluorescent colloid layer 208 ' only covers the partial sidewall of transparent encapsulating body 206, luminescence unit 202 part light can directly penetrate from transparent encapsulating body 206, the light of part meeting fluorescence excitation colloid layer 208 ' in addition, to produce how different mixed light effects.Then please refer to Fig. 5 E, its fluorescent colloid layer that illustrates Fig. 5 D only covers the schematic diagram of transparent encapsulating body.The fluorescent colloid layer 208 ' of Fig. 5 E is only along the configuration of the partial sidewall of transparent encapsulating body 206, makes the opening range size of fluorescent colloid layer 208 ' equal the recess range size of transparent encapsulating body 206.And please refer to Fig. 5 F, its fluorescent colloid layer that illustrates Fig. 5 D also clad is lived the schematic diagram of its recess of transparent encapsulating body.Fluorescent colloid layer 208 ' can directly be located at the upper end of transparent encapsulating body 206 equally, forms an air chamber with the recess with transparent encapsulating body 206.
For increasing the light extraction efficiency of device, can on transparent encapsulating body 206, catoptric arrangement be set, the following drawings explanation.Please refer to Fig. 5 G to 5I, it illustrates the schematic diagram that catoptric arrangement is set in light-emitting device.Shown in Fig. 5 G, be provided with a cone shape catoptric arrangement 231 in the reflecting surface of transparent encapsulating body 206.The light that produces by luminescence unit 202 can be directly by catoptric arrangement 231 reflections and guiding and from the sidewall bright dipping of transparent encapsulating body 206.In addition, shown in Fig. 5 H, 5I, catoptric arrangement 233 can be set, scatter and disappear from the below and cause the waste of light source with the light of avoiding luminescence unit 202 in the lower end of luminescence unit 202 and transparent encapsulating body 206.
And please refer to Fig. 5 J to Fig. 5 P, it illustrates the schematic diagram that catoptric arrangement has other variation.Shown in Fig. 5 J, transparent encapsulating body 206 respectively be provided with catoptric arrangement 231,235 up and down, catoptric arrangement 235 forms a circular-arc catoptric arrangement along transparent encapsulating body 206 lower ends.Shown in Fig. 5 K, transparent encapsulating body 206 respectively be provided with circular-arc catoptric arrangement 237,235 up and down, right catoptric arrangement the 237, the 235th, salient point is to the configuration mode of salient point.Shown in Fig. 5 L, the top of transparent encapsulating body 206 is provided with flat catoptric arrangement 239, and the bottom then is provided with circular-arc catoptric arrangement 235.Shown in Fig. 5 M, the top of transparent encapsulating body 206 is provided with circular-arc catoptric arrangement 241, and the bottom then is provided with circular-arc catoptric arrangement 235, and catoptric arrangement the 241, the 235th, concave point is to the configuration mode of salient point.Shown in Fig. 5 N, the top of transparent encapsulating body 206 is provided with cone shape catoptric arrangement 243, and the bottom then is provided with circular-arc catoptric arrangement 235.Shown in Fig. 5 O, it is jagged catoptric arrangement 245 that the top of transparent encapsulating body 206 is provided with section.Shown in Fig. 5 P, it is a plurality of circular-arc catoptric arrangements 247 that the top of transparent encapsulating body 206 is provided with section.The configuration mode of above-mentioned zigzag or a plurality of circular-arc catoptric arrangement 245,247 please refer to Fig. 5 Q and Fig. 5 R.Catoptric arrangement 245,247 can be concentrically ringed arrangement mode (shown in Fig. 5 Q), also can be parallel arrangement mode (shown in Fig. 5 R).Above-mentioned each catoptric arrangement system can be the metal coating that metal material is made, and in addition, also can be the film that the high reflectance material is made.
To form the structure of fluorescent colloid layer 208 earlier, again fluorescent colloid layer 208 covers are set to transparent encapsulating body 206 and are example, owing to be easy to generate the gap between transparent encapsulating body 206 and the fluorescent colloid layer 208 bright dipping is impacted, therefore, shown in Fig. 5 S, can between transparent encapsulating body 206 and fluorescent colloid layer 208, fill up a clearance layer material 207, and preferably, the refraction coefficient of filling up of clearance layer material 207 is near transparent encapsulating body 206 and fluorescent colloid layer 208, causes total reflection to avoid the space between the two.
For increasing the efficient of transparent encapsulating body 206 its reflecting surface 206A directing lights, alligatoring structure 209 can be designed, shown in Fig. 5 T on reflecting surface 206A to fluorescent colloid layer 208 its side bright dippings.In addition, shown in Fig. 5 U, the junction of transparent encapsulating body 206 and fluorescent colloid layer 208 also can make alligatoring structure 209 '.Alligatoring structure 209 ' can be formed directly in the structural outer surface in transparent encapsulating body 206, or is formed at the inwall of fluorescent colloid layer 208 earlier, is set on the transparent encapsulating body 206 by fluorescent colloid layer 208 covers again.Alligatoring structure 209,209 ' design also can be applicable among earlier figures 5D~5G, Fig. 5 J~5P.
The manufacture method of light-emitting device 200 below is described.Please refer to Fig. 6, it illustrates the method flow diagram of shop drawings 4A light-emitting device.The method of making light-emitting device 200 comprises step S61~S63: a luminescence unit is fixed on the carrying support; Then, on luminescence unit, form a transparent encapsulating body, and the outside of transparent encapsulating body has a recess; Then, in external making one fluorescent colloid layer of transparent enclosure, and the recess of this fluorescent colloid layer and transparent encapsulating body forms an air chamber.
And please refer to Fig. 7 A~7D, it illustrates the continuous schematic diagram of construction drawing 4A light-emitting device.Ask for an interview Fig. 7 A, in step S61, luminescence unit 202 is to be made on the carrying support 204 in the mode of consolidating brilliant routing.
Then, when the making transparent encapsulating body 206 of step S62, can be by the auxiliary use of die cavity, the material of transparent encapsulating body 206 is finalized the design on luminescence unit 202 and carrying support 204.During making, can be prior to pouring into the material of transparent encapsulating body 206 in first die cavity 250 (seeing Fig. 7 B), wherein, the interior cave shape of first die cavity 250 is the external shape of transparent encapsulating body 206.Then, make carrying support 204 together with luminescence unit 202 counter-rotating and insert in first die cavity 250.Then, toast to combine with the material typing of transparent encapsulating body 206 and with luminescence unit 202 and carrying support 204.Then, first die cavity 250 is sloughed back (shown in Fig. 7 C) just completing steps S62.
The mode of the making fluorescent colloid layer 208 of step S63 can be followed step S62 equally and finish.The material that can insert fluorescent colloid layer 208 earlier in second die cavity 260 (seeing Fig. 7 D) then, reverses the carrying support 204 among Fig. 7 C, luminescence unit 202 in the lump together with transparent encapsulating body 206 and to insert in second die cavity 260.At this moment, the material of the recess of transparent encapsulating body 206 and fluorescent colloid layer 208 can form air chamber 210 by nature.Again after the process of the overbaking and the demoulding, just the material of fluorescent colloid layer 208 take shape in outside the transparent encapsulating body 206, shown in Fig. 4 A.
In addition, after also can earlier fluorescent colloid layer 208 being completed separately, again fluorescent colloid layer 208 is set on the transparent encapsulating body 206.
Because fluorescent colloid layer 208 can be by Mold Making controlling its thickness, effectively even mixed light during therefore with transparent encapsulating body 206 collocation is to improve photochromic damp uniformity.Moreover the thickness of increase fluorescent colloid layer 208 that can be appropriate also can reach the effect that reduces the light source briliancy.
If a transparent colloid layer 220 (seeing Fig. 5 A to 5B) will be set, then can after finishing, the making fluorescent colloid layer 208 of step S63 further produce transparent colloid layer 220 in light-emitting device 200 more.Or can be after the making transparent encapsulating body 206 of step S62 is finished, the making of carrying out transparent colloid layer 220 earlier enters step S63 again to form airtight air chamber 210.
As for the making that has the fluorescent colloid layer 208 ' of opening 208A ' among Fig. 5 C, 5D, the 5E, it can be reached by suitable structural change in second die cavity 260 (seeing Fig. 7 D), for example produce a raised structures in second die cavity, 260 bottom surfaces, make the material of fluorescent colloid layer 208 ' not fill up the bottom surface of second die cavity 260, can provide the fluorescent colloid layer 208 ' of opening 208A ' in follow-up making.
Please refer to Fig. 8 A, it illustrates the schematic diagram that Fig. 4 A light-emitting device is equiped with bowl-shape reflector.When light during by the sidewall 208A bright dipping of fluorescent colloid layer 208, can for example be that a bowl-shape reflector 270 is set in luminescence unit 202 belows by suitable secondary optics combination of components, go out required light shape with modulation.In addition, please refer to Fig. 8 B, it illustrates the schematic diagram that fills up material in the reflector of Fig. 8 A.Transparent colloid or fluorescent powder colloid can fill up in the place in illustrated oblique line.
Other structural design of the following drawings explanation fluorescent colloid layer and transparent encapsulating body.Please refer to Fig. 8 C~8G, it illustrates the schematic diagram of fluorescent colloid layer tool sandwich construction.Shown in Fig. 8 C, fluorescent colloid layer 280 can be by a plurality of fluorescence coatings, for example be that first fluorescence coating 281, second fluorescence coating 282 and the 3rd fluorescence coating 283 are formed, wherein second fluorescence coating 282 covers outside first fluorescence coating 281, and the 3rd fluorescence coating 283 covers outside second fluorescence coating 282.The material of these fluorescence coatings for example is the fluorescent material of red fluorescence powder, green emitting phosphor, blue colour fluorescent powder or other color.Shown in Fig. 8 D, between first fluorescence coating 281, second fluorescence coating 282 and the 3rd fluorescence coating 283 a plurality of transparent spacers 290 can be set.Shown in 8E figure, a transparent spacers 290 also can be set to protect the 3rd fluorescence coating 283 outside the 3rd fluorescence coating 283.
In addition, shown in Fig. 8 F, fluorescent colloid layer 280 ' also can only be arranged on the side of transparent encapsulating body 206.Mode except above-mentioned stacking setting from inside to outside, shown in Fig. 8 G, the different fluorescence coatings of fluorescent colloid layer 280 ' also from top to bottom (or opposite direction) be arranged on the side of transparent encapsulating body 206 in regular turn, the thickness system of different fluorescence coatings can be identical or inequality.
Please refer to Fig. 8 H~8M, it illustrates the schematic diagram that transparent encapsulating body has different face shapings.Shown in Fig. 8 H~8M, even transparent encapsulating body 206 its cross sectional shapes can be circle, ellipse, triangle, square, rectangle polygon etc.
Fluorescent colloid layer and transparent encapsulating body have other design in addition, please refer to Fig. 8 N to 8P.Shown in Fig. 8 N, fluorescent colloid layer 208 " height can be greater than the schematic diagram of transparent encapsulating body 206.Shown in Fig. 8 O, fluorescent colloid layer 208 " can be produced in the transparent encapsulating body 206.Shown in Fig. 8 P, the shaped upper part profile of transparent encapsulating body 206 can be changed, and fluorescent colloid layer 208 " height more can be greater than transparent encapsulating body 206.
In addition, (light emitting diode LED) is example, because human eye is higher to the perception degree of white light bright dipping color, color is slightly different promptly can be differentiated out, therefore is commonly used to be used as the preliminary standard of LED shipment screening with light-emitting diode at once.Can utilize the filter effect of dyestuff, change the colour temperature perception of human eye, make the LED bright dipping color and luster unanimity that the direct view led white light source of human eye is experienced, and don't influence the original colour temperature of light source white light source.The following drawings explanation.
Please refer to Fig. 8 Q to 8T.Fig. 8 Q illustrates the schematic diagram that a dyestuff colloid layer 291 envelopes luminescence unit 202, and dyestuff colloid layer 291 can be made by transparent adhesive tape and dyestuff, and the light (as white light) that luminescence unit 202 is sent passes through the filter effect of dyestuff colloid layer 291 to change color.In addition, shown in Fig. 8 R, also a dye coating 292 can be arranged on the structure outermost layer.Fig. 8 S illustrates the schematic diagram that a dye fluorescence layer 293 is arranged on transparent encapsulating body 206 outsides, and this dyestuff colloid layer 293 can be made of fluorescent material and dyestuff.In addition, shown in Fig. 8 T, also can directly dye coating 292 ' be arranged on the outside of fluorescent colloid layer 208 '.In addition, shown in Fig. 8 U, also can directly a diffusion layer 294 be arranged on transparent encapsulating body 206 outsides.Diffusion layer 294 contains diffusant, and the directive property that it can be used to change the LED bright dipping makes bright dipping comparatively even.
Shown in Fig. 8 V, in fact also diffusion layer 294 ', first fluorescence coating 281 ' and second fluorescence coating 282 ' can be set simultaneously in outermost layer.Suppose that luminescence unit is the luminescence chip of blue light, then diffusion layer 294 ' can send original blue light, and then first fluorescence coating 281 ' can select for use yellow fluorescent powder to make, and second fluorescence coating 282 " can select for use green or red fluorescence powder to make.
Be different from the design of Fig. 8 V, shown in Fig. 8 W, can make first fluorescence coating 281 in fact in outermost layer " the area maximum of (yellow fluorescent powder); be sequentially provided with diffusion layer 294 in the lower part ", second fluorescence coating 282 " with the 3rd fluorescence coating 283 ", wherein, second fluorescence coating 282 " for example be to make with green emitting phosphor, and the 3rd fluorescence coating 283 " for example be to make with red fluorescence powder.
The distribution of color system of multilayer fluorescence coating can be rule or irregular, and its production method can be encapsulating, bread, subsides seal or spraying method.
Because light-emitting diode can be considered a point-source of light, if the brightness concentrations of light source is in the regional extent of a point, the briliancy of light source can be too high, human eye can't be looked at straight, so that can't effectively be applied in the illuminating product.
Yet, the light-emitting device 200 of present embodiment two is to the sidewall 208A of fluorescent colloid layer 208 and form lateral light with the ray guidance of luminescence unit 202, this lateral light part converts fluorescence to through fluorescent colloid layer 208, mix mutually with former lateral light again, thereby have bigger light-emitting area, reduce the briliancy of luminescence unit 202 point-source of lights own effectively, thereby can solve the aforementioned problem that is produced because of high briliancy characteristic, in addition, also can avoid dazzle that human eye is caused or problem such as dazzling.Also owing to transparent encapsulating body 206 is kept apart fluorescent colloid layer 208 and luminescence unit 202, fluorescent colloid layer 208 is not directly contacted with luminescence unit 202, so, can avoid fluorescent colloid layer 208 because of being subjected to the problem of aging that temperatures involved produced of luminescence unit 202, promote the useful life of light-emitting device 200 effectively.
In addition, designs of its carrying supports 204 of present embodiment light-emitting device 200 are not limited to the structure shown in Fig. 4 A, and carrying support 204 also can be the structure shown in the carrying support 104 of Figure 1A, is beneficial to the assembling and the heat radiation of light-emitting device 200.And with preferred implementation, when replacing carrying support 204 with carrying support 104, the area that can appropriateness amplifies carrying support 104 scatters and disappears from the below with the light of avoiding luminescence unit 202 and causes the waste of light source, also can promote the luminous efficiency of light-emitting device 200.
Please refer to Figure 13 A, it illustrates the schematic diagram according to the embodiment of the invention two another light-emitting devices.Light-emitting device 500 comprises luminescence unit 502, carrying support 504, transparent encapsulating body 506, fluorescent colloid layer 508 and light tight side assemblies 510.Luminescence unit 502 is arranged on the carrying support 504, and electrically connects two lead frame 504A, 504B of carrying support 504.Light tight side assemblies 510 is provided with around luminescence unit 502.Transparent encapsulating body 506 covers luminescence unit 502, and the position is in light tight side assemblies 510.508 sidewalls that are arranged on transparent encapsulating body 506 of fluorescent colloid layer, and the position is between light tight side assemblies 510 and transparent encapsulating body 506.The material of light tight side assemblies 510 can be materials such as plastics, pottery.
Transparent encapsulating body 506 is preferably a high-refraction material, and for instance, the refractive index of air is 1, and the refractive index of transparent encapsulating body 506 is 1.5, makes the upper surface of its indent can be a fully reflecting surface 506A.The light that luminescence unit 502 produces can produce total reflection at fully reflecting surface 506A, and is led to the sidewall of transparent encapsulating body 506, with fluorescence excitation colloid layer 508, and produces mixed light.And because the outer periphery of fluorescent colloid layer 508 is equipped with light tight side assemblies 510, mixed light can be guided top bright dipping from transparent encapsulating body 506 by light tight side assemblies 510.In addition, the light of fluorescence excitation colloid layer 508 can not pass through fluorescent colloid layer 508 once more, and then increases the intensity of mixed light.
With the effect of producing white light is example.Can select a blue LED chip as luminescence unit 502 at this, and the fluorescent colloid layer 508 of collocation yellow fluorescent powder making.When the blue light that produces when blue LED chip was directed at fluorescent colloid layer 508, blue light can excite yellow fluorescent powder producing gold-tinted earlier, when gold-tinted again with after blue light combines, just can produce the mixed light effect of white light.This white light can reflect via light tight side assemblies 510, and from the top bright dipping.Also because light extraction efficiency without any the closed interval, therefore can be improved effectively in the top of transparent encapsulating body 506.
Then please refer to Figure 13 B, 13C, its light-emitting device that respectively illustrates Figure 13 A adds the schematic diagram of preposition receipts optical lens.Shown in Figure 13 B, preposition receipts optical lens 512 is installed in the top of transparent encapsulating body 506, in order to control out direction of light.This preposition receipts optical lens 512 can be made by an optical lens, and its cross sectional shape can be a plurality of continuous quadrants.In addition, shown in Figure 13 C, preposition receipts optical lens 512 ' also can be convex lens, can reach the effect of modulation light angle via the receipts optical interface 512A ' and preposition receipts optical lens 512 ' of preposition receipts optical lens 512 ' from the light of the top bright dipping of transparent encapsulating body 506.
Please refer to Figure 13 D, 13E respectively illustrates a plurality of fluorescent colloid layer and uprightly is arranged on schematic diagram in the light-emitting device.Shown in Figure 13 D, light-emitting device 600 comprises luminescence unit 602, carrying support 604, transparent encapsulating body 606, a plurality of fluorescent colloid layer 608 and an opaque carrier 612.Luminescence unit 602 is arranged on the carrying support 604, and is preferably disposed on a reflector 604A of carrying support 604, and reflector 604A is in order to upwards guiding of light, prevent light directly from the side of transparent encapsulating body 606 or below bright dipping.Transparent encapsulating body 606 has a plurality of discontinuous fully reflecting surface 606A, side at these fully reflecting surfaces 606A all is provided with a upright fluorescent colloid layer 608, thus, when the light source of luminescence unit 602 when the reflecting surface 606A of diverse location is led to the fluorescent colloid layer 608 of its adjacent side on transparent encapsulating body 606, can direct fluorescence excitation colloid layer 608.
Shown in Figure 13 E, the part fluorescent colloid layer 608 also can in be embedded in the transparent encapsulating body 606.Be provided with the fluorescent colloid layer 608 of multi-ring annular in the transparent encapsulating body 606, wherein, the fluorescent colloid layer 608 of inner ring is embedded in this transparent encapsulating body 606 in being.The light that luminescence unit 602 sends is after fully reflecting surface 606A reflection, and part can directly be mapped to the fluorescent colloid layer 608 of outer ring, and excites the fluorescent colloid layer 608 of outer ring.In addition, the light of part then can be incident upon the fluorescent colloid layer 608 of inner ring, afterwards, is delivered to the fluorescent colloid layer 608 of outer ring again.Also light tight reflector can be set on the fully reflecting surface 606A in Figure 13 D, 13E.These fluorescent colloid layer 608 also can be the fluorescence coating of identical or excitation wavelength inequality.
Please refer to Figure 13 F, it illustrates the schematic diagram that may command goes out the light-emitting device of optical range.Light-emitting device 600 ' comprises luminescence unit 602, carrying support 604, transparent encapsulating body 606, fluorescent colloid layer 608 and light tight reflector 610.Luminescence unit 602 is arranged on the carrying support 604, and is preferably disposed on a reflector 604A of carrying support 604, and reflector 604A is in order to upwards guiding of light, prevent light directly from the side of transparent encapsulating body 606 or below bright dipping.Light-emitting device 600 also can comprise an opaque carrier 612, and it is arranged on carrying support 604 bottom sides, and transparent encapsulating body 606 then covers luminescence unit 602.The upper surface of transparent encapsulating body 606 concaves, and fluorescent colloid layer 608 is arranged on the upper surface of transparent encapsulating body 606, and light tight reflector 610 covers fluorescent colloid layer 608.Light tight reflector 610 can be the metal or the light non-transmittable layers of plastic production.
The light that luminescence unit 602 produces can be received light via reflector 604A earlier, get to fluorescent colloid layer 608 upwards to concentrate, inspire the coloured light of other wavelength, and produce mixed lights with the original coloured light that produce of luminescence unit 602, as white light, and then by light tight reflector 610, from the sidewall bright dipping of transparent encapsulating body 606.In addition, because the opaque carrier 612 of bottom side makes the rising angle of mixed light be limited, mixed light only can leave from the bright dipping area I.
And please refer to Figure 13 G, its light-emitting device that illustrates Figure 13 F adds the schematic diagram in secondary optics reflector.The secondary optics reflector is provided by a bowl-shape reflector 614.Bowl-shape reflector 614 is arranged on the periphery of light-emitting device 600 ' bottom side.Traditionally, the preposition light district (position in for example corresponding light tight reflector 610) of spotlight (as automobile-used lamp) makes light very concentrated, and causes the problem of dazzling light easily because light tight reflector 610 is not set.The light-emitting device 600 ' of present embodiment is owing to have light tight reflector 610 in order to stop the forward bright dipping of luminescence unit 602, make luminescence unit 602 change horizontal bright dipping into, add be provided with bowl-shape reflector 614 after, just can make horizontal bright dipping change by the forward bright dipping (as in graphic upward to).Because light-emitting device 600 ' and unmatched light district so can solve the problem of dazzling light, therefore are highly suitable for spotlight.In addition,, exiting surface is originally increased by adding the secondary optics reflector, the also easier purpose of reaching luminous intensity distribution, and can effectively reduce too high briliancy.
Please refer to Figure 13 H to 13K, it respectively illustrates the fluorescent colloid layer of Figure 13 F and the schematic diagram of other set-up mode of light tight reflector.Shown in Figure 13 H, the upper surface of transparent encapsulating body 606 is multisection type surfaces, and it can divide into several sections, and wherein, fluorescent colloid layer 608 only is arranged on the several segments, and on the section as corresponding region I1, corresponding 2 of another area I are not provided with any fluorescent material.Therefore, when the part light of luminescence unit 602 when area I 2 penetrates, area I 2 is the color of luminescence unit 602 original coloured light.As for area I 1 place, the light of luminescence unit 602 meeting fluorescence excitation colloid layer 608, its coloured light that excites can reflect by light tight reflector 610, and makes area I 1 present the color of this coloured light.
Shown in Figure 13 I, fluorescent colloid layer 608 is arranged on the sidewall of transparent encapsulating body 606.Light tight reflector 610 covers on the transparent encapsulating body 606 except whole, more a little outwards is convexly equipped with, and stops with the light with transparent encapsulating body 606 upper limb outgoing, thereby can reduce the situation of forward bright dipping.After the light source that luminescence unit 602 produces can 610 reflections of light tight reflector and be directed into the sidewall of transparent encapsulating body 606 earlier, ability fluorescence excitation colloid layer 608.
Shown in Figure 13 J, on transparent encapsulating body 606, a plurality of fluorescent colloid layer 608 can be set simultaneously, and a transparent spacers 616 can be set between two fluorescent colloid layer 608.Can make the effect increase of light diffusion by the fluorescent colloid layer 608 and the sandwich construction of transparent spacers 616 crossover settings.In addition, these fluorescent colloid layer 608 can be the fluorescence coating of identical or excitation wavelength inequality.
Shown in Figure 13 K, the reflecting surface of transparent encapsulating body 606 can have radian.Transparent encapsulating body 606 for example is one 1/4th spheroid, and fluorescent colloid layer 608 is the outer surface settings along transparent encapsulating body 606 its spheroids, and light tight reflector 610 then covers fluorescent colloid layer 608.The light source of luminescence unit 602 and can be reflected by light tight reflector 610 with the mixed light of fluorescent colloid layer 608 its coloured light, and from transparent encapsulating body 606 one sides (as the vertical plane on accompanying drawing right side) outgoing.
Please refer to Figure 13 L, is the schematic diagram that is provided with a plurality of luminescence units in the light-emitting device.A plurality of luminescence units are set in the light-emitting device, the integrated wattage of light source will be increased.Shown in Figure 13 L, light-emitting device 600 " for example have two luminescence units 602, respectively be arranged among the reflector 604A of a carrying support 604.Transparent encapsulating body 606 has the upper surface of indent, and two luminescence units 602 are preferably two sides of position at transparent encapsulating body 606 its upper surface concave points.Transparent encapsulating body 606 its upper surfaces are sequentially provided with fluorescent colloid layer 608, transparent spacers 616 and light tight reflector 610.After fluorescent colloid layer 608 is crossed in the light break-through that luminescence unit 602 sends, can pass through light tight reflector 610 reflected back fluorescent colloid layer 608.That is the fluorescent material meeting in the fluorescent colloid layer 608 also acts on twice, and the mixed light of generation will be comparatively even.Also, can increase the zone of mixed light, also help inhomogeneity lifting owing to the setting of transparent spacers 616.
Embodiment three
The stack light-emitting device of present embodiment comprises a main body rack, at least one cooling stand and at least one luminescence unit, wherein, cooling stand is a side that is arranged at main body rack, and luminescence unit is to be arranged on the cooling stand, and is electrically connected to the pair of electrodes pin on the main body rack.Owing to main body rack is to make up in the mode of piling up with the cooling stand that carries luminescence unit, each assembly can be gone after processing separately again and be assembled, and so not only can promote the machining accuracy of physical dimension, and can reach the purpose that electric heating separates.Below illustrate.
Please refer to Fig. 9 A, Fig. 9 B, Fig. 9 A illustrates the schematic diagram according to the stack light-emitting device of the embodiment of the invention three, and Fig. 9 B illustrates the exploded view of Fig. 9 A stack light-emitting device.Stack light-emitting device 300 comprises a plurality of luminescence units 302 (clear for making icon, as only to indicate three luminescence units 302), a main body rack 304, two cooling stands 306,308.Be provided with pair of electrodes pin 310,312 in main body rack 304.Cooling stand 306,308 is arranged at two opposite flanks of main body rack 304 respectively.302 of luminescence units are divided into two groups being arranged at respectively on the cooling stand 306,308, and are electrically connected to electrode pin 310,312.In addition, the luminescence unit 302 on the cooling stand 306,308 is to set in a row, and each luminescence unit 302 on the cooling stand 306 all is provided with corresponding to another luminescence unit 302 on the cooling stand 308.
Can be an insulator electrically non-conductive material on the main body rack 304.Main body rack 304 is except in order to fixing the position of two cooling stands 306,308, and can make two electrode pin 310,312 and other component insulation.Shown in Fig. 9 B, cooling stand 306,308 is a laminated structure, is that full wafer is resisted against on two sides of main body rack 304, thereby helps the heat radiation of luminescence unit 302.Two electrode pin the 310, the 312nd are extended outward by the bottom surface of main body rack 304, make whole stack light-emitting device 300 present a upright plug-in state.In addition, design has an air discharge duct 304A on main body rack 304, is that the directions in 304 are extended from the close position of electrode pin 310,312 towards main body rack, and air discharge duct 304A is in order to get rid of unnecessary gas in the preparation process.
Cooling stand the 306, the 308th, two sides by main body rack 304 are attached on the main body rack 304 respectively, and can be combined by at least one fixation kit 316 between cooling stand 306,308 and the main body rack 304.This fixation kit 316 can be any type of fastener, for example is rivet or screw.In addition, main body rack 304 can adopt polymolecular material such as plastics, rubber, also can cooling stand 306,308 be combined with main body rack 304 by thermoforming way.
Also can combine between cooling stand 306,308 and the main body rack 304 by the mode of welding, or by other assembly.Please refer to Fig. 9 C, 9D, illustrate with the fixing schematic diagram of cover frame.After cooling stand 306,308 was assembled on the main body rack 304, cover frame 318 overlapped and is set on the device that above-mentioned assembling finishes.The material of cover frame for example is and cooling stand 306,308 similar metals.In addition, please refer to Fig. 9 E, 9F, it illustrates with the fixing schematic diagram of Extendible flake.Shown in Fig. 9 E, on cooling stand 306,308, design two Extendible flakes 320, with Extendible flake 320 behind the recessed folding of direction of main body rack 304, Extendible flake 320 just can clamp two offsides (shown in Fig. 9 F) of main body rack 304, and cooling stand 306,308 is fixed on the main body rack 304.
And please refer to Fig. 9 G, 9H, it illustrates the schematic diagram of other distortion of stack light-emitting device.Shown in Fig. 9 G, the part that cooling stand 306 ', 308 ' edge extend out can be arc and with the whole coating in the edge of main body rack 304.In addition, shown in Fig. 9 H, cooling stand 306 ", 308 " the edge also can have knuckle.
The luminescence unit 302 of present embodiment for example is a light-emitting diode chip for backlight unit, and it can finish electric connection by the mode and the electrode pin 310,312 of routing (wirebonding).Employed routing platform can form 4 or 8 pins (pin) with the mode of two-layer superposition, and in addition, routing point is configurable in two sides of luminescence unit 302 or an external side.If will produce the coloured light of different colours, can be in the surface coated fluorescent material of light-emitting diode chip for backlight unit, to produce required mixed light color.
Though above-mentioned luminescence unit 302 is to be arranged on the cooling stand 306,308 in mode one to one, so not as qualification, please refer to Figure 10, it illustrates the staggered schematic diagram of luminescence unit.Luminescence unit 302 on the cooling stand 306 is to be crisscross arranged with the luminescence unit 302 on the cooling stand 308, and forms a line, and so can reduce the thickness of whole stack light-emitting device 300.
Please refer to Figure 11 A, 11B, Figure 11 A illustrates the schematic diagram that the stack light-emitting device is a column structure, and Figure 11 B illustrates the end view of Figure 11 A stack light-emitting device.And please refer to Figure 12 A, 12B, and Figure 12 A illustrates the schematic diagram of the main body rack of Figure 11 A, and Figure 12 B illustrates the schematic diagram of the cooling stand of Figure 11 A.Two cooling stands 406,408 of stack light-emitting device 400 respectively are one to have the laminated structure (shown in Figure 12 B) of radian, from two offsides of main body rack 404 (seeing Figure 12 A) main body rack 404 is clamped, and luminescence unit 402 is the upper surfaces that are arranged on cooling stand 406,408 in the form of a ring.Luminescence unit 402 is provided with transparent encapsulating body 410, and a fluorescent colloid layer 412 can be set outside transparent encapsulating body 410.
The stack light-emitting device of present embodiment is that main body rack and cooling stand are made up in the mode of piling up, and cooling stand is positioned at two sides of main body rack, make that electrically conduction is to carry out in structure, thermally conductive pathways then is positioned at the outside, and the stack light-emitting device of present embodiment realizes that fully electricity walks interior, heat and walk outer purpose.In addition, the electrode pin is to be stretched out by the main body rack bottom surface, makes the stack light-emitting device present a upright plug-in state, stack light-emitting device thereby can carry out number of assembling steps with other assembly by the action of simple and easy plug.
Moreover, the light-emitting device of the higher-wattage preferable cooling stand of heat-loading capacity (being generally thicker structure) of must arranging in pairs or groups.After can distinctly processing earlier, assemble again by stack light-emitting device 300 its each assemblies of present embodiment, not only when adjusted size, have more elasticity, and can the reinforced structure dimensional accuracy be beneficial to the required accuracy requirement of mass production, and can reduce the interference of other package assembling in manufacture process, can be applicable to future throw light on or the high light-emitting device related application technology of the integrated wattage of need to deal with.
In sum, though the present invention describes as above with preferred embodiment, so it is not in order to limit the present invention.Those skilled in the art without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations.Therefore, protection scope of the present invention should be as the criterion with the claim scope content that be defined of application.

Claims (2)

1. light-emitting device comprises:
One carrying support;
One luminescence unit is arranged on this carrying support;
One transparent encapsulating body covers this luminescence unit, and the outside of this transparent encapsulating body has a recess, and this transparent encapsulating body has at least one reflecting surface in this recess; And
One fluorescent colloid layer, it is external to cover in this transparent enclosure, and this recess of this fluorescent colloid layer and this transparent encapsulating body forms an air chamber;
Wherein, this reflecting surface of this transparent encapsulating body ray guidance that this luminescence unit is produced is to a sidewall of this fluorescent colloid layer.
2. light-emitting device as claimed in claim 1, wherein, this fluorescent colloid layer is located on the outside of this transparent encapsulating body.
CN2009101282324A 2008-04-03 2009-03-18 Light-emitting device and backlight device using the same and assembling method Active CN101551077B (en)

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8791484B2 (en) * 2011-09-13 2014-07-29 Uniled Lighting Taiwan Inc. LED lamp
CN103152026A (en) * 2011-12-06 2013-06-12 中强光电股份有限公司 Touch button device and projector
CN103311399B (en) * 2012-03-15 2015-10-07 展晶科技(深圳)有限公司 LED light emission device
US8926158B2 (en) * 2012-04-30 2015-01-06 Qualcomm Mems Technologies, Inc. Array illumination system
CN103996780A (en) * 2013-02-16 2014-08-20 奇麟光电股份有限公司 LED lamp, manufacturing method of LED lamp and LED subtitle panel
TWI707484B (en) * 2013-11-14 2020-10-11 晶元光電股份有限公司 Light-emitting device
CN107403861B (en) * 2017-07-31 2019-03-26 深圳市华星光电技术有限公司 The preparation method of light emitting diode, backlight module and light emitting diode
CN109654454B (en) * 2019-02-25 2021-02-05 上海魅质智能科技有限公司 Light guide cover of electronic indicator lamp

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2718787Y (en) * 2004-07-22 2005-08-17 东贝光电科技股份有限公司 Light-emitting diode with improved structure
CN1665038A (en) * 2004-12-03 2005-09-07 陈建伟 360 degree high photosynthetic capacity photoluminescent diode
CN1870309A (en) * 2005-05-26 2006-11-29 陈隆建 Reflection white-light LED excited by fluorescent powder
CN1992455A (en) * 2002-10-03 2007-07-04 夏普株式会社 Light emitting device
CN100370629C (en) * 2003-04-30 2008-02-20 三星电机株式会社 Light emitting device having fluorescent multilayer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1992455A (en) * 2002-10-03 2007-07-04 夏普株式会社 Light emitting device
CN100370629C (en) * 2003-04-30 2008-02-20 三星电机株式会社 Light emitting device having fluorescent multilayer
CN2718787Y (en) * 2004-07-22 2005-08-17 东贝光电科技股份有限公司 Light-emitting diode with improved structure
CN1665038A (en) * 2004-12-03 2005-09-07 陈建伟 360 degree high photosynthetic capacity photoluminescent diode
CN1870309A (en) * 2005-05-26 2006-11-29 陈隆建 Reflection white-light LED excited by fluorescent powder

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