CN101544784B - 光固化性树脂组合物、其干膜和固化物以及使用这些的印刷电路板 - Google Patents

光固化性树脂组合物、其干膜和固化物以及使用这些的印刷电路板 Download PDF

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Publication number
CN101544784B
CN101544784B CN2009101323080A CN200910132308A CN101544784B CN 101544784 B CN101544784 B CN 101544784B CN 2009101323080 A CN2009101323080 A CN 2009101323080A CN 200910132308 A CN200910132308 A CN 200910132308A CN 101544784 B CN101544784 B CN 101544784B
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China
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resin composition
photocurable resin
film
compound
dry
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CN101544784A (zh
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冈本大地
伊藤信人
有马圣夫
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Taiyo Holdings Co Ltd
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Taiyo Holdings Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L1/00—Compositions of cellulose, modified cellulose or cellulose derivatives
    • C08L1/08—Cellulose derivatives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
CN2009101323080A 2008-03-26 2009-03-25 光固化性树脂组合物、其干膜和固化物以及使用这些的印刷电路板 Active CN101544784B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008-080449 2008-03-26
JP2008080449 2008-03-26
JP2008080449A JP5449688B2 (ja) 2008-03-26 2008-03-26 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

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Publication Number Publication Date
CN101544784A CN101544784A (zh) 2009-09-30
CN101544784B true CN101544784B (zh) 2012-12-26

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CN2009101323080A Active CN101544784B (zh) 2008-03-26 2009-03-25 光固化性树脂组合物、其干膜和固化物以及使用这些的印刷电路板

Country Status (4)

Country Link
JP (1) JP5449688B2 (ko)
KR (1) KR101010103B1 (ko)
CN (1) CN101544784B (ko)
TW (1) TWI391782B (ko)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5449729B2 (ja) * 2008-09-29 2014-03-19 三洋化成工業株式会社 感光性樹脂組成物
KR20100099048A (ko) * 2009-03-02 2010-09-10 주식회사 동진쎄미켐 감광성 수지 조성물
JP5661293B2 (ja) * 2010-02-08 2015-01-28 太陽ホールディングス株式会社 光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板
JP5422427B2 (ja) * 2010-02-08 2014-02-19 太陽ホールディングス株式会社 積層構造体及びそれに用いる感光性ドライフィルム
JP5308398B2 (ja) * 2010-05-11 2013-10-09 日東電工株式会社 光導波路形成用樹脂組成物およびそれを用いた光導波路
CN102375339B (zh) * 2010-08-20 2013-06-12 太阳油墨（苏州）有限公司 碱显影型感光性树脂组合物
KR20160003294A (ko) * 2010-12-28 2016-01-08 다이요 잉키 세이조 가부시키가이샤 광 경화성 수지 조성물, 그의 드라이 필름 및 경화물, 및 이들을 이용한 인쇄 배선판
JP5854600B2 (ja) * 2010-12-28 2016-02-09 太陽インキ製造株式会社 光硬化性樹脂組成物
JP6078535B2 (ja) * 2012-05-17 2017-02-08 太陽インキ製造株式会社 アルカリ現像型の熱硬化性樹脂組成物、プリント配線板
CN104334604A (zh) * 2012-05-17 2015-02-04 太阳油墨制造株式会社 碱显影型的热固化性树脂组合物、印刷电路板
KR101388820B1 (ko) * 2012-09-19 2014-04-23 삼성전기주식회사 절연용 에폭시 수지 조성물, 절연 필름, 프리프레그 및 인쇄회로기판
JP2014141626A (ja) * 2012-12-28 2014-08-07 Konica Minolta Inc 塗布液、反射膜、反射シート、太陽電池モジュール、ｌｅｄ照明装置および実装用基板
CN104049457B (zh) * 2013-03-11 2016-01-27 太阳油墨制造株式会社 光固化性树脂组合物、其干膜和固化物、以及具有使用它们形成的固化皮膜的印刷电路板
KR20140123780A (ko) * 2013-04-15 2014-10-23 동우 화인켐 주식회사 광경화 코팅 필름, 편광판 및 표시장치
WO2014175260A1 (ja) * 2013-04-24 2014-10-30 太陽インキ製造株式会社 積層樹脂構造体、ドライフィルム、及びフレキシブルプリント配線板
CN104141173B (zh) * 2014-06-25 2016-08-24 广西科技大学 可光固化纤维素酯纳米纤维膜的制备方法
CN105467753B (zh) * 2014-07-31 2020-01-14 太阳油墨（苏州）有限公司 光固化性热固化性树脂组合物、干膜、固化物、及印刷电路板
WO2016052026A1 (ja) * 2014-09-30 2016-04-07 富士フイルム株式会社 凹凸構造を有する物品の製造方法及び凹凸構造を有する物品
JP6424150B2 (ja) * 2014-09-30 2018-11-14 富士フイルム株式会社 凹凸構造を有する物品の製造方法および凹凸構造を有する物品
JP2016080803A (ja) * 2014-10-14 2016-05-16 太陽インキ製造株式会社 ドライフィルムおよびフレキシブルプリント配線板
EP3230360A4 (en) * 2014-12-09 2018-07-11 Arkema, Inc. Compositions and methods for crosslinking polymers in the presence of atmospheric oxygen
CN109532257B (zh) * 2018-09-25 2020-12-18 宁波慎承印业有限公司 一种环保印刷工艺
KR20230163369A (ko) * 2021-03-31 2023-11-30 다이요 잉키 세이조 가부시키가이샤 경화성 수지 조성물, 적층 구조체, 경화물 및 전자 부품

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5030548A (en) * 1988-08-11 1991-07-09 Fuji Photo Film Co., Ltd. Photo-polymerizable composition
CN1311458A (zh) * 2000-03-03 2001-09-05 奇美实业股有限公司 感光性树脂组成物
CN101126893A (zh) * 2006-08-18 2008-02-20 山荣化学株式会社 保护图形的形成方法
CN101142526A (zh) * 2005-03-18 2008-03-12 东京应化工业株式会社 黑色矩阵形成用光固化性树脂组合物、使用该组合物的感光性膜、黑色矩阵的形成方法、黑色矩阵及具有该黑色矩阵的等离子体显示面板

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JP3220708B2 (ja) * 1992-02-28 2001-10-22 大日本印刷株式会社 感光性記録媒体
JP3449572B2 (ja) * 1994-08-12 2003-09-22 東京応化工業株式会社 感光性樹脂組成物およびこれを用いた感光性ドライフィルム
JP2005024893A (ja) * 2003-07-02 2005-01-27 Hitachi Chem Co Ltd 感光性樹脂組成物及びその用途
JP2005241801A (ja) * 2004-02-25 2005-09-08 Kri Inc 感光性グリーンシート及びそれを用いた複合グリーンシート
JP2006145606A (ja) * 2004-11-16 2006-06-08 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いたサンドブラスト用感光性フィルム
JP2006199834A (ja) * 2005-01-21 2006-08-03 Mitsui Chemicals Inc 光硬化性熱分解性組成物およびその用途
JP2006253664A (ja) * 2005-02-08 2006-09-21 Showa Denko Kk ソルダーレジスト用難燃組成物およびその用途
JP4566862B2 (ja) * 2005-08-25 2010-10-20 富士通株式会社 レジストパターン厚肉化材料、レジストパターンの形成方法、半導体装置及びその製造方法
JP4849860B2 (ja) * 2005-10-04 2012-01-11 太陽ホールディングス株式会社 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5030548A (en) * 1988-08-11 1991-07-09 Fuji Photo Film Co., Ltd. Photo-polymerizable composition
CN1311458A (zh) * 2000-03-03 2001-09-05 奇美实业股有限公司 感光性树脂组成物
CN101142526A (zh) * 2005-03-18 2008-03-12 东京应化工业株式会社 黑色矩阵形成用光固化性树脂组合物、使用该组合物的感光性膜、黑色矩阵的形成方法、黑色矩阵及具有该黑色矩阵的等离子体显示面板
CN101126893A (zh) * 2006-08-18 2008-02-20 山荣化学株式会社 保护图形的形成方法

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Publication number Publication date
JP2009237057A (ja) 2009-10-15
JP5449688B2 (ja) 2014-03-19
CN101544784A (zh) 2009-09-30
TW201007356A (en) 2010-02-16
KR20090102693A (ko) 2009-09-30
KR101010103B1 (ko) 2011-01-24
TWI391782B (zh) 2013-04-01

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Application publication date: 20090930

Assignee: Taiyo Ink Mfg.Co., Ltd.

Assignor: Taiyo Holding Co., Ltd.

Contract record no.: 2011990000116

Denomination of invention: Photocurable resin composition, dry film and cured object thereof, and printed circuit board with the same

Granted publication date: 20121226

License type: Common License

Record date: 20110302

LICC Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model