CN101537530A - 靶材结构的制作方法 - Google Patents
靶材结构的制作方法 Download PDFInfo
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- CN101537530A CN101537530A CN200910127156A CN200910127156A CN101537530A CN 101537530 A CN101537530 A CN 101537530A CN 200910127156 A CN200910127156 A CN 200910127156A CN 200910127156 A CN200910127156 A CN 200910127156A CN 101537530 A CN101537530 A CN 101537530A
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- 238000004519 manufacturing process Methods 0.000 title abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims abstract description 78
- 239000002184 metal Substances 0.000 claims abstract description 76
- 238000003466 welding Methods 0.000 claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052802 copper Inorganic materials 0.000 claims abstract description 23
- 239000010949 copper Substances 0.000 claims abstract description 23
- 238000005516 engineering process Methods 0.000 claims abstract description 22
- 238000009713 electroplating Methods 0.000 claims abstract description 19
- 238000009792 diffusion process Methods 0.000 claims abstract description 17
- 229910052715 tantalum Inorganic materials 0.000 claims abstract description 13
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical group [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 10
- 229910001362 Ta alloys Inorganic materials 0.000 claims abstract description 5
- 239000013077 target material Substances 0.000 claims description 39
- 229910000679 solder Inorganic materials 0.000 claims description 22
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 19
- 239000007788 liquid Substances 0.000 claims description 19
- 238000002360 preparation method Methods 0.000 claims description 17
- 238000004140 cleaning Methods 0.000 claims description 15
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 239000004411 aluminium Substances 0.000 claims description 9
- 229910021645 metal ion Inorganic materials 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 238000005554 pickling Methods 0.000 claims description 2
- 238000007747 plating Methods 0.000 abstract 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 6
- 229910001431 copper ion Inorganic materials 0.000 description 6
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 5
- 239000012046 mixed solvent Substances 0.000 description 5
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 5
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 5
- 229910017604 nitric acid Inorganic materials 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 150000001768 cations Chemical class 0.000 description 2
- 230000021615 conjugation Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 241000370738 Chlorion Species 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical group [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 229910001423 beryllium ion Inorganic materials 0.000 description 1
- 229910001430 chromium ion Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- -1 preferably Substances 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
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Abstract
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Claims (9)
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CN 200910127156 CN101537530B (zh) | 2009-03-16 | 2009-03-16 | 靶材结构的制作方法 |
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CN 200910127156 CN101537530B (zh) | 2009-03-16 | 2009-03-16 | 靶材结构的制作方法 |
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CN101537530A true CN101537530A (zh) | 2009-09-23 |
CN101537530B CN101537530B (zh) | 2011-08-03 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102059421A (zh) * | 2010-12-09 | 2011-05-18 | 宁波江丰电子材料有限公司 | 钛靶铝背板焊接方法 |
CN102441732A (zh) * | 2010-10-12 | 2012-05-09 | 北京智创联合科技有限公司 | 一种扩散焊接的方法及焊件 |
CN103203608A (zh) * | 2013-03-23 | 2013-07-17 | 广州有色金属研究院 | 一种提高管壳式换热器钎焊接头质量的方法 |
CN106555161A (zh) * | 2015-09-29 | 2017-04-05 | 宁波江丰电子材料股份有限公司 | 靶材组件及其制造方法 |
CN107620048A (zh) * | 2016-07-14 | 2018-01-23 | 宁波江丰电子材料股份有限公司 | 硅靶材结构及其制造方法以及硅靶材组件的制造方法 |
CN112676782A (zh) * | 2020-12-25 | 2021-04-20 | 宁波江丰电子材料股份有限公司 | 一种钛靶材与铜背板的装配方法 |
CN116200639A (zh) * | 2022-12-30 | 2023-06-02 | 北京安泰六九新材料科技有限公司 | 一种CrW合金靶材及其制备方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5836506A (en) * | 1995-04-21 | 1998-11-17 | Sony Corporation | Sputter target/backing plate assembly and method of making same |
US6579431B1 (en) * | 1998-01-14 | 2003-06-17 | Tosoh Smd, Inc. | Diffusion bonding of high purity metals and metal alloys to aluminum backing plates using nickel or nickel alloy interlayers |
JP3905301B2 (ja) * | 2000-10-31 | 2007-04-18 | 日鉱金属株式会社 | タンタル又はタングステンターゲット−銅合金製バッキングプレート組立体及びその製造方法 |
-
2009
- 2009-03-16 CN CN 200910127156 patent/CN101537530B/zh active Active
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102441732A (zh) * | 2010-10-12 | 2012-05-09 | 北京智创联合科技有限公司 | 一种扩散焊接的方法及焊件 |
CN102059421A (zh) * | 2010-12-09 | 2011-05-18 | 宁波江丰电子材料有限公司 | 钛靶铝背板焊接方法 |
CN103203608A (zh) * | 2013-03-23 | 2013-07-17 | 广州有色金属研究院 | 一种提高管壳式换热器钎焊接头质量的方法 |
CN106555161A (zh) * | 2015-09-29 | 2017-04-05 | 宁波江丰电子材料股份有限公司 | 靶材组件及其制造方法 |
CN106555161B (zh) * | 2015-09-29 | 2021-04-27 | 合肥江丰电子材料有限公司 | 靶材组件及其制造方法 |
CN107620048A (zh) * | 2016-07-14 | 2018-01-23 | 宁波江丰电子材料股份有限公司 | 硅靶材结构及其制造方法以及硅靶材组件的制造方法 |
CN112676782A (zh) * | 2020-12-25 | 2021-04-20 | 宁波江丰电子材料股份有限公司 | 一种钛靶材与铜背板的装配方法 |
CN116200639A (zh) * | 2022-12-30 | 2023-06-02 | 北京安泰六九新材料科技有限公司 | 一种CrW合金靶材及其制备方法 |
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Publication number | Publication date |
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CN101537530B (zh) | 2011-08-03 |
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Denomination of invention: Method for preparing target structure Effective date of registration: 20121113 Granted publication date: 20110803 Pledgee: Export Import Bank of China Pledgor: Ningbo Jiangfeng Electronic Materials Co., Ltd. Registration number: 2012990000688 |
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Address after: 315400 Zhejiang Province, Yuyao City Yangming science and Technology Industrial Park No. 1 Jiang Feng Lu Patentee after: NINGBO JIANGFENG ELECTRONIC MATERIAL CO., LTD. Address before: 315400 Zhejiang Province, Yuyao City Yangming science and Technology Industrial Park No. 1 Jiang Feng Lu Patentee before: Ningbo Jiangfeng Electronic Materials Co., Ltd. |
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Denomination of invention: Method for preparing target structure Effective date of registration: 20170510 Granted publication date: 20110803 Pledgee: Bank of China Limited by Share Ltd Yuyao branch Pledgor: NINGBO JIANGFENG ELECTRONIC MATERIAL CO., LTD. Registration number: 2017330000038 |
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Denomination of invention: Fabrication method of target structure Effective date of registration: 20200908 Granted publication date: 20110803 Pledgee: Bank of China Limited by Share Ltd. Yuyao branch Pledgor: KONFOONG MATERIALS INTERNATIONAL Co.,Ltd. Registration number: Y2020330000675 |