CN101443892B - High-throughput formation of semiconductor layer by use of chalcogen and inter-metallic material - Google Patents

High-throughput formation of semiconductor layer by use of chalcogen and inter-metallic material Download PDF

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CN101443892B
CN101443892B CN2007800146270A CN200780014627A CN101443892B CN 101443892 B CN101443892 B CN 101443892B CN 2007800146270 A CN2007800146270 A CN 2007800146270A CN 200780014627 A CN200780014627 A CN 200780014627A CN 101443892 B CN101443892 B CN 101443892B
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CN101443892A (en
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耶罗恩·K·J·范杜伦
克雷格·R·莱德赫尔姆
马修·R·鲁滨逊
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耶罗恩·K·J·范杜伦
克雷格·R·莱德赫尔姆
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Priority to US11/395,438 priority patent/US20070163643A1/en
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Abstract

本发明公开了用于形成IB族-IIIA族-硫属元素化物化合物膜的前体材料的高生产量印刷的方法和装置。 The present invention discloses a group for forming a Group IB -IIIA - high production of precursor materials chalcogenide compound film printing method and apparatus. 在一个实施方案中,该方法包括在衬底上形成前体层,其中,前体层包括一个或多个不连续层。 In one embodiment, the method includes forming a precursor layer on the substrate, wherein the precursor layer comprises one or more discontinuous layers. 这些层可以包括含一种或多种IB族元素和两种或更多种不同IDA族元素的至少第一层和含单质硫属元素颗粒的至少第二层。 These layers may comprise contain one or more Group IB elements and two or more different Group IDA elements at least a first layer containing elemental chalcogen particles is at least a second layer. 可以将前体层加热至足以熔化硫族元素颗粒并使硫属元素颗粒与前体层中的一种或多种IB族元素和IDA族元素反应的温度以形成IB-IIIA族硫属元素化物化合物。 Precursor layer may be heated to a temperature sufficient to melt the particles and the temperature chalcogen chalcogen precursor particles and one element in a plurality of layers IB elements and Group IDA element or a reaction to form a group IB-IIIA chalcogenide compound compound. 前体层中的至少一组颗粒是含有至少一种IB-IIIA族金属间合金相的金属间颗粒。 At least one set of particles in the precursor layer is an alloy containing an intermetallic phase between the at least one group IB-IIIA metal particles. 该方法还可以包括制造IB-IIIA族硫属元素化物化合物的膜,其包括将纳米颗粒和/或纳米小球和/或纳米液滴混合以形成油墨,将该油墨沉积在衬底上,加热以便融化额外的硫属元素并使硫属元素与IB族和IIIA族元素和/或硫属元素化物反应以形成致密膜。 The method may further comprise producing group IB-IIIA chalcogenide film of sulfur compounds, comprising the nano-particles and / or nano-beads and / or nano-mixed to form an ink droplet, the ink deposited on the substrate, heating in order to melt the extra chalcogen and chalcogen elements of group IB and group IIIA and / or chalcogenide reaction to form a dense film.

Description

硫属元素层的高生产量印刷和金属间材料的使用 Use chalcogen layer between the high production printing and metal materials

发明领域 Field of the Invention

[0001] 本发明涉及太阳能电池且更具体地涉及使用基于IB-1IIA-VIA化合物的活性层的太阳能电池的制造。 [0001] The present invention relates more particularly to a solar cell using a solar cell manufactured based on the active layer IB-1IIA-VIA compound.

[0002] 发明背景 [0002] Background of the Invention

[0003] 太阳能电池和太阳能组件将日光转换为电。 [0003] Solar cells and solar modules convert sunlight into electricity. 这些电子器件传统地使用硅(Si)作为光吸收半导体材料以相当昂贵的生产工艺制造。 These electronic devices are conventionally used silicon (Si) as the manufacturing process is comparatively expensive semiconductor light-absorbing material. 为使太阳能电池更加经济可行,已开发出如下的太阳能电池装置结构:该结构可以廉价地利用薄膜、光吸收半导体材料,例如但不限于铜铟镓硫代二硒化物,Cu (In,Ga) (S,Se) 2,也被称为Cl (G) S⑶。 Of the solar cell more economically viable, it has been developed solar cell device structure: This structure can inexpensively using a thin film, the light-absorbing semiconductor material, such as, but not limited to, copper indium gallium thio diselenide, Cu (In, Ga) (S, Se) 2, also referred to as Cl (G) S⑶. 这类太阳能电池通常具有夹在背面电极层和η型结配对层之间的P型吸收层。 Such solar cell having a P-type absorber layer is generally sandwiched between the back electrode layer and the η-type junction partner layer. 背面电极层常常是钥,而结配对常常是CdS。 Often the key back electrode layer, and the junction partner is often CdS. 在结配对层上形成透明导电氧化物(TCO),例如但不限于锌氧化物(ZnOx),通常将其用作透明电极。 Forming a transparent conductive oxide (TCO) on the junction partner layer, for example, but not limited to, zinc oxide (ZnOx), typically used as a transparent electrode. CIS基太阳能电池已经证明有超过19%的功率转换效率。 CIS-based solar cells have been shown to have more than 19% of the power conversion efficiency.

[0004] 成本有效地构建大面积CIGS基太阳能电池或组件中的中心挑战是,CIGS层的元素应该在所有三个维度上在纳米、介观和宏观长度尺度上处在窄的化学计量比之内,以使所产生的电池或组件具有高效率。 [0004] Cost effective to build the center of the solar cell assembly or CIGS-based challenge is large, the elements should be in a narrow CIGS layer on the nano-stoichiometric, mesoscopic and macroscopic length scales in all three dimensions than the inside, so that the battery or component is produced with high efficiency. 然而使用传统的真空基沉积工艺难以在相对大的衬底面积上实现精确的化学计量组分。 However, using conventional vacuum based deposition process is difficult to achieve accurate stoichiometric composition in a relatively large substrate area. 举例来说,通过溅射或蒸发难以沉积含有多于一种元素的化合物和/或合金。 For example, by sputtering or evaporation deposition difficult compounds and / or alloys containing more than one element. 这两种技术依赖受限于瞄准线和有限面积源的沉积方法,趋向于产生不良的表面覆盖率。 Both techniques rely limited to line of sight deposition method and a finite area of ​​the source, it tends to produce a poor surface coverage. 瞄准线轨迹和有限面积源能够在所有三个维度上产生元素非均匀的三维分布和/或在大面积上产生不良的膜厚度均匀性。 Limited area and a line of sight trajectory source capable of generating a non-uniform three-dimensional distribution of elements and / or adverse over a large area film thickness uniformity in all three dimensions. 这些非均匀性可以发生在纳米、介观和/或宏观尺度上。 These non-uniformities can occur in nanometers, mesoscopic and / or macro scale. 此类非均匀性也改变吸收层的局部化学计量比,降低全部电池或组件的潜在(potential)功率转换效率。 Such non-uniformity also alter the local stoichiometric absorber layer, reducing the potential (potential) or battery power conversion efficiency of the whole assembly.

[0005] 已开发出真空基沉积技术的替代方法。 [0005] Alternative methods have been developed based vacuum deposition techniques. 特别是,使用真空半导体印刷技术在柔性衬底上制备太阳能电池提供了传统真空沉积太阳能电池的高度成本有效的代替。 Instead of particularly effective using a vacuum printing technique in a semiconductor substrate provided on a flexible solar cells prepared in conventional vacuum deposition height of the solar cell cost. 举例来说,T.Arita 及其同事[20th IEEEPV Specialists Conference, 1988,第1650 页]描述了非真空丝网印刷技术,该技术包括:以1:1:2的组成比将纯铜、铟和硒粉混合并研磨并且形成可丝网印刷的糊料,将该糊料丝网印刷在衬底上,以及烧结该膜以形成化合物层。 For example, T.Arita and colleagues [20th IEEEPV Specialists Conference, 1988, pages 1650] describes a non-vacuum screen printing technique comprising: 1: 1: 2 composition ratio of the copper, indium and selenium powder are mixed and ground and form a screen printable paste, screen printing the paste on a substrate, and sintering the film to form the compound layer. 他们报道说,虽然他们以单质铜、铟和硒粉开始,然而在研磨步骤之后,糊料含有CuInSe2相。 They reported that, although they begin to elemental copper, indium and selenium powder, but after the grinding step, a paste containing CuInSe2 phase. 然而,从烧结层制造的太阳能电池具有非常低的效率,因为这些吸收体的结构和电子品质差。 However, the sintered layer from the solar cell fabricated with very low efficiency due to poor quality of these structures and the electron absorber.

[0006] A.Vervaet等亦报道了沉积在薄膜上的丝网印刷的CuInSe2 [9thEuropeanCommunities PV Solar Energy Conference, 1989,第480 页],其中将微米尺寸的CuInSe2粉末与微米尺寸的硒粉末一起使用,以制备可丝网印刷的糊料。 [0006] A.Vervaet reported, are also deposited on the film screen-printed CuInSe2 [9thEuropeanCommunities PV Solar Energy Conference, 1989, page 480], which will be used together with the micron-sized powder CuInSe2 micron-sized powder of selenium, to prepare a screen printable paste. 在高温下烧结非真空丝网印刷所形成的层。 Non-vacuum layer formed by screen printing at a high temperature sintering. 这种方法的困难是寻找用于致密CuInSe2膜形成的合适助熔剂。 The difficulty with this method is to find a suitable fluxing agent for CuInSe2 film formation dense. 尽管以此方式制造的太阳能电池也具有不良的转换效率,然而使用印刷和其它非真空技术制造太阳能电池仍有发展前景。 Although a solar cell manufactured in this manner also have poor conversion efficiency, however, a printing and other non-vacuum techniques for producing solar cells still prospects.

[0007] 其它人曾尝试使用硫属元素化物粉末作为前体材料,例如通过丝网印刷沉积的微米尺寸的CIS粉末,非晶态四元硒化物纳米粉末或通过在热衬底上喷涂沉积的非晶态二元硒化物纳米粉末的混合物,以及其它的例子[(l)Vervaet, A.等,ECPhotovoltaicSol.EnergyConf., Proc.1nt.Conf.,IOth(1991), 900-3.;(2)Journal ofElectronicMaterials, Vol.27,N0.5,1998,第433 页;Ginley 等;(3)W099,378, 32 ;Ginley 等;(4)US6, 126,740]。 [0007] Others have tried using chalcogenide powder as a precursor material, for example deposited by screen printing CIS micron size powder, amorphous four yuan selenide nanopowder by spraying or deposited on a thermal substrate mixture of amorphous binary selenide nanopowder thereof, and other examples [(l) Vervaet, A. et, ECPhotovoltaicSol.EnergyConf, Proc.1nt.Conf, IOth (1991), 900-3;... (2 ) Journal ofElectronicMaterials, Vol.27, N0.5,1998, p. 433; Ginley et; (3) W099,378, 32; Ginley the like; (4) US6, 126,740]. 到目前为止,当使用硫属元素化物粉末来快速处理形成适合于太阳能电池的CIGS薄膜时并没有获得有希望的结果。 We did not get promising results so far, when using a chalcogenide material to a powder form suitable for rapid processing of CIGS thin film solar cell.

[0008] 由于烧结所需的高温和/或长的处理时间,因此当从其中每一单独颗粒都含大量IB、IIIA和VIA族元素的IB-1IIA-硫属元素化物粉末开始时,形成适合于薄膜太阳能电池的IB-1IIA-硫属元素化物化合物膜具有挑战性,所述IB、IIIA和VIA族元素的量通常接近最终IB-1IIA-硫属元素化物化合物膜的化学计量比。 [0008] Due to the required sintering temperature and / or long processing time, and therefore when the sulfur from the IB-1IIA- wherein each of the individual particles all contain a large number of IB, IIIA and VIA group elements of metal powder at the beginning, is formed for IB-1IIA- sulfur in thin film solar cell chalcogenide compound film is challenging, said the IB, IIIA and VIA elements amount is generally close to the final IB-1IIA- chalcogen stoichiometric chalcogenide compound film ratio. 不良的均匀性通过宽范围的异质层特征而明显,包括但不限于多孔层结构、空隙、间隙、裂纹和相对低密度的区域。 Poor uniformity of the layer characterized by significantly heterogeneous broad range, including but not limited to the porous layer structure, voids, gaps, cracks and a relatively low density region. 在从前体材料形成CIGS晶体期间发生的复杂的相变序列加剧了这种非均匀性。 Complex phase transition sequence occurs during CIGS crystals formed from a precursor material exacerbated this non-uniformity. 特别是,在初生吸收薄膜的不连续区域中形成的多个相也将导致增加的非均匀性以及最终不良的器件性能。 In particular, a plurality of phases formed in the discontinuous region of the nascent absorber film will also lead to an increased non-uniformity, and ultimately poor device performance.

[0009] 快速处理的要求导致高温的使用,这将损害在卷到卷(roll-to-roll)加工中所用的温度敏感箔片。 [0009] require rapid high temperature processing results, which would damage the temperature-sensitive foil in a roll to roll (roll-to-roll) processing used. 事实上,对温度敏感的衬底将可用于处理前体层成CIS或者CIGS的最大温度限制到一定水平,该水平通常远低于三元或四元硒化物的熔点(>900°C)。 In fact, the temperature-sensitive substrates can be used as a pretreatment layer CIS or CIGS maximum temperature is limited to a certain level, this level is generally much lower than the melting point of a ternary or quaternary (> 900 ° C) selenide. 因此较不优选快速且高温工艺。 Therefore less preferred fast and high-temperature process. 因此,时间和温度的限制未能在适当的衬底上使用三元或四元硒化物作为起始材料时导致有希望的结果。 Accordingly, time and temperature limitations of use of ternary or quaternary selenide on a suitable substrate results in promising results as a starting material.

[0010] 作为替代,起始材料可以基于二元硒化物的混合物,该混合物在高于500°C的温度下会导致液相形成,该液相将扩大初始固体粉末间的接触面积,从而与全固态工艺相比会加快烧结工艺。 [0010] Alternatively, the starting material may be based on the binary selenide mixture, the mixture at a temperature above 500 ° C will cause formation of a liquid phase, the liquid phase will enlarge the contact area between the initial solid powder, and thereby all-solid-state technology will accelerate the sintering process compared. 遗憾的是,低于500°C时没有液相产生。 Unfortunately, there is no generation liquid below 500 ° C.

[0011] 因此,在本领域中对于单步骤需要快速但低温的技术以制造用于太阳能组件的高品质均匀CIGS膜和用于制造这样的膜的适当前体材料。 [0011] Accordingly, in the present art for a rapid but low temperature single-step technique needed to produce high-quality solar modules for CIGS film and a uniform precursor materials suitable for producing such films.

发明内容 SUMMARY

[0012] 本发明的实施方案克服了与现有技术相关的缺点,本发明意在将硫属元素化物纳米粉末形式的IB和IIIA元素的引入并将这些硫属元素化物纳米粉末与诸如硒或硫、碲或者两种或更多这些元素的混合物的其它硫属元素源结合,以形成IB-1IIA族硫属元素化物化合物。 [0012] The embodiments of the present invention overcomes the disadvantages associated with the prior art, the invention is intended to be introduced into the chalcogenide material nanopowder form IB and IIIA elements and chalcogenide nanopowder such as a selenium these sulfur or other sulfur, sulfur, tellurium or a mixture of two or more of these metal element source elements combined to form a group IB-1IIA chalcogenide compound. 根据一个实施方案,可以由以下的混合物形成化合物膜:1) 二元或多元硒化物、硫化物或碲化物和2)单质硒、硫或碲。 According to one embodiment, a film can be formed by the following mixture of compounds: 1) di- or polycarboxylic selenide, sulfide or tellurides and 2) elemental selenium, sulfur or tellurium. 根据另一实施方案,可以使用核壳纳米颗粒来形成化合物膜,所述核壳纳米颗粒具有含有涂有非氧硫属元素材料的IB族和/或IIIA族元素的核心纳米颗粒。 According to another embodiment, may be used to form the core-shell nanoparticles compound film, the core-shell nanoparticles having a non-oxygen chalcogen material group IB and / or IIIA elements nanoparticle core containing coated. 在本发明的又一实施方案中,也可以用前体材料而非在单独的不连续层中沉积硫属元素。 In yet another embodiment of the present invention, may be used instead of chalcogen deposited precursor material in individual discontinuous layer.

[0013] 在一个实施方案中,该方法包括在衬底上形成前体层,其中,所述前体层包含一个或多个不连续层。 [0013] In one embodiment, the method includes forming a precursor layer on the substrate, wherein said precursor layer comprises one or more discrete layers. 该层可以包括含有一种或多种IB族元素和两种或更多种不同的IIIA族元素的至少第一层和含有单质硫属元素颗粒的至少第二层。 The layer may include those containing one or more Group IB elements and two or more different group IIIA elements at least at least a first layer and a second layer containing a metal element elemental sulfur particles. 将所述前体层加热到足以熔化硫属元素颗粒并使硫属元素颗粒与前体层中的一种或多种IB族元素和IIIA族元素反应的温度以形成IB-1IIA族硫属元素化物化合物膜。 The precursor layer is heated enough to melt the particles and the temperature of the chalcogen chalcogen precursor particles and one element or more layers IB elements and Group IIIA elements of the reaction to form the Group IB-1IIA chalcogen nitride compound film. 该方法还可以包括制成IB-1IIA硫属元素化物化合物膜,其包括将纳米颗粒和/或纳米小球和/或纳米液滴混合以形成油墨、在衬底上沉积油墨、加热以熔化额外的硫属元素并使硫属元素与IB族和IIIA族元素和/或硫属元素化物反应以形成致密膜。 The method may further comprise a sulfur formed IB-1IIA metal chalcogenide compound film, comprising the nano-particles and / or nano-beads and to melt the additional / or nano-mixed to form an ink droplet, ink is deposited on the substrate, heating and chalcogen chalcogen group IB and group IIIA elements of the reaction and / or chalcogenide to form a dense film. 在某些实施方案中,不使用前体层的致密化,因为可以在不首先将前体层烧结至发生致密化的温度的情况下形成吸收层。 In certain embodiments, the precursor is not used densified layer, the absorbent layer may be formed as in the case where the precursor layer without first densification temperature sintering to occur. 前体层中的至少一组颗粒是含有至少一种IB-1IIA族金属间合金相的金属间颗粒。 At least one set of particles in the precursor layer is an alloy containing an intermetallic phase between the at least one Group IB-1IIA metal particles. 或者,前体层中的至少一组颗粒由含有至少一种IB-1IIA族金属间合金相的金属间颗粒的进料形成。 Alternatively, the precursor layer is formed from at least one group of particles containing at least a Group IB-1IIA inter-metal intermetallic alloy phase feed particles.

[0014] 任选地,第一层可以在第二层之上形成。 [0014] Optionally, the first layer may be formed over the second layer. 在另一实施方案中,第二层可以在第一层之上形成。 In another embodiment, the second layer may be formed on the first layer. 第一层还可以含有单质硫属元素颗粒。 The first layer may further contain elemental chalcogen particles. 第一层可以具有IB族硫属元素化物形式的IB族元素。 The first layer may have a Group IB element group IB chalcogenide forms thereof. 第一层可以具有IIIA族硫属元素化物形式的IIIA族元素。 The first layer may have a group IIIA IIIA elements in the form of chalcogenide material. 可以存在含有单质硫属元素颗粒的第三层。 It may be present in elemental chalcogen-containing particles third layer. 两种或更多种不同的IIIA族元素可以包括铟和镓。 Two or more different group IIIA elements may include indium and gallium. IB族元素可以是铜。 Group IB element may be copper. 硫属元素颗粒可以是硒、硫和/或碲颗粒。 Chalcogen particles may be of selenium, sulfur and / or tellurium particles. 前体层可以基本上无氧。 Precursor layer may be substantially oxygen-free. 形成前体层可以包括形成分散体,其包括含有一种或多种IB族元素的纳米颗粒和含有两种或更多种IIIA族元素的纳米颗粒,并将分散体膜散布到衬底上。 Forming the precursor layer may include forming a dispersion comprising containing one or more Group IB element nanoparticles and nanoparticles containing two or more group IIIA elements, and the dispersion was spread onto a film substrate. 形成前体层可以包括烧结该膜以形成前体层。 Forming the precursor layer may comprise a sintered film to form the precursor layer. 烧结前体层可以在于前体层上布置含有单质硫属元素颗粒的层的步骤之前执行。 Wherein the sintered precursor layer may be disposed before the step of performing containing elemental chalcogen element particles of the layer precursor layer. 该衬底可以是柔性衬底,并且其中,形成前体层和/或在前体层上布置含有单质硫属元素颗粒的层、和/或加热前体层和硫属元素颗粒包括使用关于柔性衬底的卷到卷制造。 The substrate may be a flexible substrate, and wherein forming a layer containing an element disposed elemental chalcogen particles on the precursor layer and / or the precursor layer, and / or heating the precursor layer comprises particles and a chalcogen use on a flexible volume of the substrate-to-roll manufacturing. 该衬底可以是铝箔衬底。 The substrate may be an aluminum foil substrate. 任选地,对于单步骤或两步骤工艺,得到的IB-1IIA-VIA族化合物优选地是CuIn(1_x)GaxS2(1_y)Se2y形式的Cu、In、Ga和硒(Se)和/或硫S的化合物,其中OSxSl且OSySl。 Optionally, for a one-step or two-step process, IB-1IIA-VIA compound is preferably obtained CuIn (1_x) GaxS2 (1_y) Se2y form of Cu, In, Ga, and selenium (Se) and / or sulfur S compounds, and wherein OSxSl OSySl. 还应理解的是得到的IB-1IIA族硫属元素化物化合物可以是CuzIn(1_x)GaxS2(1_y)Se2y形式的Cu、In、Ga和硒(Se)和/或硫S的化合物,其中0.5彡z彡1.5,O 彡X彡1.0 且1.0。 It should also be appreciated that obtained IB-1IIA Group chalcogenide compound may be CuzIn (1_x) GaxS2 (1_y) Se2y form of Cu, In, Ga, and selenium (Se) and / or compounds of sulfur S, wherein 0.5 Pie z San 1.5, O X San San 1.0 and 1.0.

[0015] 在本发明的另一实施方案中,前体层和硫属元素颗粒的加热可以包括将衬底和前体层从环境温度加热至约200°C与约600°C之间的平稳温度范围,将衬底和前体层的温度保持在该平稳范围内持续约几分之一秒至约60分钟范围内的时间段,并随后降低衬底和前体层的温度。 Heating [0015] In another embodiment of the present invention, the precursor layer and a chalcogen particles may include a substrate and a precursor layer is heated from ambient temperature to between smooth and about 200 ° C to about 600 ° C temperature range, the temperature of the substrate and the precursor layer is maintained for about a time period within a fraction of a second to the stable range within about 60 minutes, and then lowering the temperature of the substrate and the precursor layer.

[0016] 在本发明的另一实施方案中,提供了一种方法,其用于形成IB-1IIA族硫属元素化物化合物膜。 [0016] In another embodiment of the present invention, there is provided a method for forming a Group IB-1IIA sulfur metal chalcogenide compound film. 该方法包括在衬底上形成前体层,其中,所述前体层含有一种或多种IB族元素和一种或多种IIIA族元素。 The method includes forming a precursor layer on the substrate, wherein said precursor layer contains one or more Group IB elements and one or more group IIIA elements. 该方法可以包括烧结前体层。 The method may comprise a sintered precursor layer. 烧结前体层之后,该方法可以包括在前体层上形成含有单质硫属元素颗粒的层。 After sintering the precursor layer, the method may include forming a layer containing elemental chalcogen particles on the precursor layer. 该方法还可以包括将前体层和硫属元素颗粒加热至足以熔化硫属元素颗粒并使硫属元素颗粒与前体层中的IB族元素和IIIA族元素反应的温度以形成IB-1IIA硫属元素化物化合物膜。 The method may further comprise the precursor layer and chalcogen particles are heated to a temperature sufficient to melt the particles and the temperature of the chalcogen group IB element and a chalcogen element of Group IIIA element particles and reaction precursor layer to form a sulfur IB-1IIA metal chalcogenide compound film. 所述一种或多种IIIA族元素可以包括铟与镓。 The one or more group IIIA elements may include indium and gallium. 硫属元素颗粒可以是硒、硫或碲的颗粒。 Chalcogen particles may be of selenium, sulfur or tellurium particles. 前体层可以是基本无氧的。 Precursor layer may be substantially free of oxygen. 该方法可以包括形成前体层,其包括形成分散体,所述分散体含有含一种或多种IB族元素的纳米颗粒和含两种或更多种IIIA族元素的纳米颗粒,将分散体膜散布到衬底上。 The method may include forming the precursor layer, which comprises forming a dispersion comprising nanoparticles containing one or more Group IB element and nanoparticles containing two or more elements of Group IIIA of the dispersion, the dispersion film is spread onto the substrate. 该方法可以包括形成前体层和/或烧结前体层和/或在前体层上布置含单质硫属元素颗粒的层和/或将前体层和硫属元素颗粒加热至足以熔化硫属元素颗粒的温度,包括使用关于柔性衬底的卷到卷制造。 The method may include forming the precursor layer is arranged containing elemental chalcogen layer element particles and / or the precursor layer and chalcogen particles are heated to a temperature sufficient to melt the sulfur and / or on the sintered precursor layer and / or the precursor layer of the genus element temperature particles, including the use of a flexible substrate on roll-to-roll manufacturing. 还应理解的是所得到的IB-1IIA硫属元素化物化合物可以是CuzIn(1_x)GaxS2(1_y)Se2y形式的Cu、In、Ga和硒(Se)和/或硫S的化合物,其中0.5彡z彡1.5,O彡x彡1.0且O彡y彡1.0。 It should also be appreciated that the resulting IB-1IIA chalcogenide compound may be CuzIn (1_x) GaxS2 (1_y) Se2y form of Cu, In, Ga, and selenium (Se) and / or compounds of sulfur S, wherein 0.5 Pie z San 1.5, O San San 1.0 and x O y San San 1.0.

[0017] 在本发明的又一实施方案中,烧结前体层可以包括将衬底和前体层从环境温度加热至约200 V与约600 V之间的平稳温度范围,将衬底和前体层的温度保持在该平稳范围内持续约几分之一秒至约60分钟的范围内的时间段,并随后降低衬底和前体层的温度。 [0017] In yet another embodiment of the present invention, the precursor layer may comprise a sintered substrate and precursor layer is heated from ambient temperature to a plateau temperature range of between about 200 V and about 600 V, and the front substrate layer temperature is maintained for about within the stable range of a fraction of a second to a time period within the range of about 60 minutes, and then lowering the temperature of the substrate and the precursor layer. 加热前体层和硫属元素颗粒可以包括将衬底、前体层和硫属元素颗粒从环境温度加热至约200V与约600V之间的平稳温度范围,将衬底和前体层的温度保持在该平稳范围内持续几分之一秒至约60分钟的范围内的时间段,并随后降低衬底和前体层的温度。 Heating the precursor layer and a chalcogen particles may comprise a substrate, the precursor layer and chalcogen particles are heated from ambient temperature to a plateau temperature range of between about 200V and about 600V, and the temperature of the substrate holder precursor layer within this range smoothly continued fraction of a second to a time period within the range of about 60 minutes, and then lowering the temperature of the substrate and the precursor layer. 还应理解的是衬底可以是铝箔衬底。 It should also be understood that the substrate may be an aluminum foil substrate.

[0018] 在本发明在另一实施方案中,提供了一种方法,其包括形成前体层,该前体层含有具有一种或多种IB族元素和两种或更多种不同的IIIA族元素的颗粒的前体层以及形成含有提供过量硫属元素的源的过量硫属元素颗粒的层,其中,前体层与过剩硫属元素层相互邻近。 [0018] In the present invention, In another embodiment, a method is provided which includes forming a precursor layer, the precursor having one or more layers containing Group IB elements and two or more different IIIA precursor particle layer elements is formed comprising excess sulfur and a sulfur source providing an excess chalcogen element particles of the metal layer, wherein the precursor layer with an excess chalcogen layer adjacent to each other. 将前体层和过剩硫属元素层加热至足以熔化提供过量硫属元素源的颗粒并使该颗粒与前体层中的一种或多种IB元素和IIIA族元素反应的温度以便在衬底上形成IB-1IIA族硫属元素化物化合物膜。 The precursor layer and excess chalcogen layer is heated to provide sufficient to melt the particles of excess chalcogen and one such source is the precursor particles and the temperature of one or more layers IB elements and Group IIIA elements in response to the substrate group IB-1IIA formed sulfur metal chalcogenide compound film. 过剩硫属元素层在前体层之上形成。 Excess chalcogen layer is formed on the precursor layer. 过剩硫属元素层可以在前体层之下形成。 Excess chalcogen layer may be formed beneath the first layer. 提供过量硫属元素源的颗粒可以包括单质硫属元素颗粒。 Providing an excess chalcogen source of sulfur particles may include elemental chalcogen particles. 提供过量硫属元素源的颗粒可以包括硫属元素化物颗粒。 Providing an excess chalcogen source of sulfur particles may include chalcogenide particles. 提供过量硫属元素源的颗粒可以包括富硫属元素的硫属元素化物颗粒。 Providing an excess chalcogen source of sulfur particles may include chalcogen-rich chalcogenide particles. 前体层还可以含单质硫属元素颗粒。 Precursor layer may also contain elemental chalcogen particles. 前体层可以具有IB族硫属元素化物形式的IB族元素。 Precursor layer may have a Group IB element group IB chalcogenide forms thereof. 前体层可以具有IIIA族硫属元素化物形式的IIIA族元素。 Precursor layer may have a group IIIA IIIA elements in the form of chalcogenide material. 可以提供含单质硫属元素颗粒的第三层。 It may be provided a third layer containing elemental chalcogen particles. 可以由颗粒的前体层和与前体层接触的含钠材料层形成该膜。 The film layers may be formed from a precursor material particles and the sodium-containing layer in contact with the precursor layer.

[0019] 任选地,该膜可以由颗粒的前体层和与前体层接触并含有以下材料中的至少一种的层形成:IB族元素、IIIA族元素、VIA族元素、IA族元素、任何前述元素的二元和/或多元合金、任何前述元素的固溶体、铜、铟、镓、硒、铜铟、铜镓、铟镓、钠、钠化合物、氟化钠、硫化钠铟、硒化铜、硫化铜、硒化铟、硫化铟、硒化镓、硫化镓、硒化铜铟、硫化铜铟、硒化铜镓、硫化铜镓、硒化铟镓、硫化铟镓、硒化铜铟镓和/或硫化铜铟镓。 [0019] Optionally, the film may be one layer and containing at least the following materials from the particles and the precursor layer in contact with the precursor layer: IB group elements, IIIA group elements, VIA group elements, IA elements binary element of any of the foregoing and / or polyhydric alloy, a solid solution of any of the foregoing elements, copper, indium, gallium, selenium, copper, indium, copper, gallium, indium, gallium, sodium, a sodium compound, sodium fluoride, sodium sulfide, indium, selenium copper, copper sulfide, indium selenide, indium sulfide, gallium selenide, gallium sulfide, copper indium diselenide, copper indium disulfide, copper selenide, gallium sulfide, copper, gallium, indium selenide, gallium sulfide, indium gallium selenide, copper indium gallium and / or copper indium gallium disulfide. 在一个实施方案中,所述颗粒含约I原子%或更少的钠。 In one embodiment, the particles are from about I atomic% or less of sodium-containing. 所述颗粒可以含以下材料中的至少一种:Cu-Na、In-Na、Ga_Na、Cu_In_Na、Cu_Ga_Na、In_Ga_Na、Na-Se、Cu_Se_Na、In_Se_Na、Ga_Se_Na、Cu_In_Se_Na、Cu_Ga_Se_Na、In_Ga_Se_Na、Cu_In_Ga_Se_Na、Na-SΛ Cu-S-NaΛ In-S-NaΛGa_S_Na、Cu_In_S_Na、Cu_Ga_S_Na、In-Ga-S-Na或Cu_In_Ga_S_Na。 The particles may contain at least one of the following materials: Cu-Na, In-Na, Ga_Na, Cu_In_Na, Cu_Ga_Na, In_Ga_Na, Na-Se, Cu_Se_Na, In_Se_Na, Ga_Se_Na, Cu_In_Se_Na, Cu_Ga_Se_Na, In_Ga_Se_Na, Cu_In_Ga_Se_Na, Na-SΛ Cu-S-NaΛ In-S-NaΛGa_S_Na, Cu_In_S_Na, Cu_Ga_S_Na, In-Ga-S-Na or Cu_In_Ga_S_Na. 所述月旲可以由颗粒的如体层和含具有有机抗衡离子的钠化合物或具有无机抗衡离子的钠化合物的油墨形成。 The month Dae ink particles may be formed as a sodium-containing compound layer and an organic counterion, or an inorganic compound having a sodium counter ion. 任选地,所述膜可以由以下形成:颗粒的前体层以及含有至少一种下列材料的与前体层和/或颗粒接触的含钠材料的层:Cu_Na、In_Na、Ga-NaΛ Cu_In_Na、Cu-Ga-NaΛ In-Ga-Na、Na-SeΛ Cu-Se-Na、In_Se_Na、Ga_Se_Na、Cu_In_Se_Na、Cu_Ga_Se_Na、In_Ga_Se_Na、Cu_In_Ga_Se_Na、Na_S、Cu-S-Naλ In-S-Naλ Ga-S-NaΛ Cu-1n-S-NaΛ Cu-Ga-S-NaΛ In-Ga-S-Na 或Cu-1n-Ga-S-Na ;和/或含有该颗粒以及具有有机抗衡离子的钠化合物或具有无机抗衡离子的钠化合物颗粒的油墨。 Optionally, the film may be formed by the following: a precursor layer comprising particles and at least one of the material layers and the precursor layer / material or a sodium-containing particles contact: Cu_Na, In_Na, Ga-NaΛ Cu_In_Na, Cu-Ga-NaΛ In-Ga-Na, Na-SeΛ Cu-Se-Na, In_Se_Na, Ga_Se_Na, Cu_In_Se_Na, Cu_Ga_Se_Na, In_Ga_Se_Na, Cu_In_Ga_Se_Na, Na_S, Cu-S-Naλ In-S-Naλ Ga-S-NaΛ Cu -1n-S-NaΛ Cu-Ga-S-NaΛ in-Ga-S-Na or Cu-1n-Ga-S-Na; and / or the particles containing a sodium compound and an organic counterion, or an inorganic counterion ink sodium compound particles. 该方法还可以包括在加热步骤之后向所述膜添加含钠材料。 The method may further comprise adding a sodium-containing material to the film after the heating step.

[0020] 在另一实施方案中,可以使用一种或多种液态金属制成液体油墨。 [0020] In another embodiment, using one or more liquid metal liquid ink. 例如,可以从镓和/或铟的液态和/或熔融混合物开始制成油墨。 For example, the ink can be made from the start / or a mixture of molten gallium and / or indium and liquid. 然后可以将铜纳米颗粒添加到该混合物,随后可以将该混合物用作油墨/糊料。 Then the copper nanoparticles may be added to the mixture, the mixture may then be used as an ink / paste. 铜纳米颗粒是市售的。 Copper nanoparticles are commercially available. 或者,可以调节(例如冷却)Cu-Ga-1n混合物的温度直到形成固体。 Alternatively, it may be adjusted (e.g., cooling) the temperature of Cu-Ga-1n until the mixture formed a solid. 可以在该温度下研磨所述固体直到出现小的纳米颗粒(例如小于5nm)。 The solid may be ground at this temperature until small nanoparticles (e.g., less than 5nm) appears. 可以将硒添加到油墨和/或通过在例如退火之前、期间或之后暴露于硒蒸气而由油墨形成的膜中。 Selenium may be added to the ink and / or annealing the film before, during or after exposure to selenium vapor is formed by, for example, from the ink. 暴露于硒蒸气可以在非真空环境中发生。 Exposure to selenium vapor can occur in a non-vacuum environment. 暴露于硒蒸气可以在大气压力下发生。 Exposure to selenium vapor at atmospheric pressure can occur. 这些条件可适用于此处所述的任何实施方案。 These conditions are applicable to any of the embodiments described herein. [0021] 在另一实施方案中,可以使用一种或多种液态金属制成液体油墨。 [0021] In another embodiment, using one or more liquid metal liquid ink. 例如,可以从镓和/或铟的液态和/或熔融混合物开始制成油墨。 For example, the ink can be made from the start / or a mixture of molten gallium and / or indium and liquid. 然后可以将铜纳米颗粒添加到混合物,随后可以将该混合物用作油墨/糊料。 Then the copper nanoparticles may be added to the mixture, the mixture may then be used as an ink / paste. 铜纳米颗粒是市售的。 Copper nanoparticles are commercially available. 或者,可以调节(例如冷却)Cu-Ga-1n混合物的温度直到形成固体。 Alternatively, it may be adjusted (e.g., cooling) the temperature of Cu-Ga-1n until the mixture formed a solid. 可以在该温度下研磨所述固体直到出现小的纳米颗粒(例如小于5nm)。 The solid may be ground at this temperature until small nanoparticles (e.g., less than 5nm) appears. 可以将硒添加到油墨和/或通过在例如退火之前、期间或之后暴露于硒蒸气而由油墨形成的膜中。 Selenium may be added to the ink and / or annealing the film before, during or after exposure to selenium vapor is formed by, for example, from the ink.

[0022] 在本发明的又一实施方案中,描述了一种工艺,其包括配制包含IB和/或IIIA族元素并任选地包含至少一种VIA族元素的固体和/或液体颗粒的分散体。 [0022] In yet another embodiment of the present invention, a process is described, which comprises formulating a dispersion comprising IB and / or IIIA elements and optionally at least one Group VIA element of solid and / or liquid particles body. 该工艺包括将所述分散体沉积到衬底上以便在衬底上形成层并使该层在适当气氛中反应以形成膜。 The process comprises depositing the dispersion onto a substrate and allowing the layer to layer in a suitable atmosphere is formed on a substrate to form a film. 在此工艺中,至少一组颗粒是含有至少一种IB-1IIA族金属间相的金属间颗粒。 In this process, at least one group of particles containing at least one intermetallic phase intermetallic particles of a Group IB-1IIA.

[0023] 在本发明的又一实施方案中,提供了一种组合物,其包括多个包含IB族和/或IIIA族元素并任选地包含至少一种VIA族元素的颗粒。 [0023] In yet another embodiment of the present invention, there is provided a composition comprising a comprising a plurality of group IB and / or Group IIIA element particles and optionally at least one Group VIA element. 至少一组颗粒含有至少一种IB-1IIA族金属间合金相。 Between at least one set of particles comprising at least one Group IB-1IIA metal alloy phase.

[0024] 在本发明的又一实施方案中,该方法可以包括配制包含IB和/或IIIA族元素并任选地包含至少一种VIA族元素的颗粒的分散体。 [0024] In yet another embodiment of the present invention, the method may comprise formulating comprising IB and / or dispersion of particles IIIA element and optionally at least one Group VIA element. 该方法可以包括将该分散体沉积到衬底上以便在衬底上形成层并使该层在适当气氛中反应以形成膜。 The method may comprise depositing the dispersion onto a substrate and allowing the layer to layer in a suitable atmosphere is formed on a substrate to form a film. 至少一组颗粒含有贫IB族的IB-1IIA族合金相的颗粒。 At least one group of particles containing particles of Group IB-lean Group IB-1IIA alloy phase. 在一些实施方案中,贫IB族颗粒贡献在所有颗粒中发现的IB族元素的小于约50摩尔百分比。 In some embodiments, the contribution of the lean group IB IB element particles found in all particles of less than about 50 mole percent. 贫IB族的IB-1IIA族合金相颗粒可以是IIIA族元素之一的唯一来源。 Group IB-1IIA Group IB-depleted alloy phase particles may be the sole source of one of the Group IIIA elements. 贫IB族的IB-1IIA族合金相颗粒可以含金属间相并且可以是IIIA族元素之一的唯一来源。 Group IB-1IIA group IB-depleted alloy phase particles containing intermetallic phases and may be the only source of one of the Group IIIA elements. 贫IB族的IB-1IIA族合金相可以含金属间相并且可以是IIIA族元素之一的唯一来源。 Lean group IB Group IB-1IIA alloy phase containing intermetallic phases and may be the only source of one of the Group IIIA elements. 贫IB族的IB-1IIA族合金相颗粒可以是Cu1In2微粒并且是材料中铟的唯一来源。 Group IB-1IIA Group IB-depleted alloy phase particles may be the only source of Cu1In2 particulate material and indium.

[0025] 应理解的是对于任何前述情形,所述膜和/或最终化合物可以包括IB-1IIA-VIA族化合物。 [0025] It should be understood that for any of the aforementioned circumstances, the film and / or final compounds may comprise a Group IB-1IIA-VIA compound. 反应步骤可以包括在适当气氛中加热该层。 The reaction step may include heating the layer in a suitable atmosphere. 沉积步骤可以包括用分散体涂覆衬底。 Depositing step may include coating the substrate with the dispersion. 分散体中的至少一组颗粒可以是纳米小球的形式。 Dispersion of at least one set of particles may be in the form of nano-pellets. 分散体中的至少一组颗粒可以是纳米小球的形式并含至少一种IIIA族元素。 Dispersion of at least one set of nano-particles may be in the form of pellets and containing at least one Group IIIA element. 分散体中的至少一组颗粒可以是包含单质形式的IIIA族元素的纳米小球。 Dispersion may be at least one set of particles comprise elemental form IIIA elements small nanospheres. 在本发明的一些实施方案中,金属间相不是端际固溶体相。 In some embodiments of the present invention, the intermetallic phase is not terminal solid solution phase. 在本发明的一些实施方案中,金属间相不是固溶体相。 In some embodiments of the present invention, the intermetallic phase is not a solid solution phase. 金属间颗粒可以贡献在所有颗粒中发现的IB族元素的小于约50摩尔百分比。 Less than about 50 mole percent of the intermetallic particles can contribute Group IB elements found in all particles. 金属间颗粒可以贡献在所有颗粒中发现的IIIA族元素的小于约50摩尔百分比。 Less than about 50 mole percent of the intermetallic particles can contribute IIIA elements found in all particles. 金属间颗粒可以在沉积在衬底上的分散体中贡献小于约50摩尔百分比的IB族元素和小于约50摩尔百分比的IIIA族元素。 Intermetallic particles can contribute less than about 50 mole percent of the Group IB elements and less than about 50 mole percent of the Group IIIA elements in the dispersion deposited on the substrate. 金属间颗粒可以在沉积在衬底上的分散体中贡献小于约50摩尔百分比的IB族元素和大于约50摩尔百分比的IIIA族元素。 Intermetallic particles can contribute less than about 50 mole percent of the Group IB elements and greater than about 50 mole percent of the Group IIIA element in the dispersion is deposited on a substrate. 金属间颗粒可以在沉积在衬底上的分散体中贡献大于约50摩尔百分比的IB族元素和小于约50摩尔百分比的IIIA族元素。 Intermetallic particles in the dispersion may be deposited on the substrate is greater than about 50 mole percent of the contribution of the Group IB elements and less than about 50 mole percent of the Group IIIA elements. 任何前述项的摩尔百分比可以基于分散体中存在的所有颗粒中元素的总摩尔量。 The mole percent of any preceding item may be based on the total molar amount of elements of all the particles present in the dispersion. 在一些实施方案中,至少一些颗粒具有片晶(platelet)形状。 In some embodiments, at least some of the particles having platelets (platelet) in shape. 在一些实施方案中,大多数颗粒具有片晶形状。 In some embodiments, the majority of the particles have a platelet shape. 在其它实施方案中,基本上所有的颗粒具有片晶形状。 In other embodiments, substantially all of the particles have a platelet shape.

[0026] 对于任何前述实施方案,供本发明使用的金属间材料是二元材料。 [0026] For any of the preceding embodiments, intermetallic materials for use according to the present invention is a binary material. 该金属间材料可以是三元材料。 The inter-metallic material may be a ternary material. 该金属间材料可以包括Cu1In215该金属间材料可以包括Cu1In2 δ相的组组成。 The inter-metallic material may comprise the inter-metallic material may comprise Cu1In215 group Cu1In2 δ phase composition. 该金属间材料可以包括Cu1In2 δ相与Cu16In9限定的相之间的组组成。 The intermetallic phase may comprise component between Cu1In2 δ defined Cu16In9 phase composition. 该金属间材料可以包括CUlGa2。 The metallic material may comprise between CUlGa2. 该金属间材料可以包括Cu1Ga2的中间固溶体。 The intermetallic intermediate material may comprise a solid solution of Cu1Ga2. 该金属间材料可以包括Cu68Ga38。 The metallic material may comprise between Cu68Ga38. 该金属间材料可以包括Cu7(lGa3(l。该金属间材料可以包括Cu75Ga25。该金属间材料可以包括端际固溶体与紧邻的中间固溶体之间的相的Cu-Ga组成。该金属间化合物可以包括YI相的Cu-Ga的组成(约31.8至约39.8wt% Ga)。该金属间化合物可以包括Y 2相的Cu-Ga组成(约36.0至约39.9wt% Ga)。该金属间化合物可以包括Y 3相的Cu-Ga组成(约39.7至约-44.9wt% Ga)。该金属间化合物可以包括Y 2与Y 3之间的相的Cu-Ga组成。该金属间化合物可以包括端际固溶体与YI之间的相的Cu-Ga组成。该金属间化合物可以包括Θ相的Cu-Ga组成(约66.7至约68.7wt% Ga)。该金属间化合物可以包括富Cu的Cu-Ga。镓可以作为纳米小球悬浮液形式的IIIA族元素而并入。可以通过在溶液中形成液态镓的乳液来形成镓的纳米小球。可以通过在室温下骤冷来形成镓纳米小球。 The intermetallic material may comprise Cu7 (lGa3 (l. Intermetallic material may comprise Cu75Ga25. Intermetallic material may include a phase of Cu-Ga between the terminal solid solution of the intermediate solid solution close to the composition. The intermetallic compound may include Cu-Ga composition (from about 31.8 to about 39.8wt% Ga) YI phase. the intermetallic compound may include Y 2 phase composed of Cu-Ga (from about 36.0 to about 39.9wt% Ga). the intermetallic compound may include Y 3-phase Cu-Ga composition (from about 39.7 to about -44.9wt% Ga). the intermetallic compound may include a phase between Y 2 and Y 3 composed of Cu-Ga. the intermetallic compound may include a terminal solid solution phase and Cu-Ga between the YI composition. the intermetallic compound may include Cu-Ga [Theta] phase composition (from about 66.7 to about 68.7wt% Ga). the intermetallic compound may include Cu-rich Cu-Ga. gallium may be used as nano-suspension of beads incorporated IIIA elements may be formed of gallium small nanospheres formed by emulsion liquid gallium in the solution may be formed of gallium nanoglobules quenched at room temperature by the cold.

[0027] 根据本发明的任何前述实施方案的工艺可以包括通过搅拌、机械装置、电磁装置、超声波装置、和/或添加分散剂和/或乳化剂来保持或加强液态镓在液体中的分散。 [0027] The process according to any preceding embodiment of the present invention may comprise by stirring, mechanical means, magnetic means, ultrasonic means and / or addition of dispersants and / or emulsifiers to maintain or enhance liquid gallium dispersed in a liquid. 该工艺可以包括添加选自:铝、碲、或硫的一种或多种单质颗粒的混合物。 The process may include the addition is selected from: aluminum, tellurium, sulfur, or a mixture of one or more elemental particles. 适当的气氛可以含硒、硫、碲、4、0)、456、45、41'、队或其组合或混合物。 Suitable atmosphere may selenium, sulfur, tellurium, 4,0), 456,45,41 ', team, or a combination or mixture thereof. 适当的气氛可以含以下中的至少一种:H2、CO、Ar和N2。 At least one suitable atmosphere may contain of the following: H2, CO, Ar and N2. 一种或多种颗粒可以掺杂有一种或多种无机材料。 One or more particles may be doped with one or more inorganic materials. 任选地,一种或多种颗粒可以掺杂有选自铝(Al)、硫(S)、钠(Na)、钾⑷或锂(Li)的一种或多种无机材料。 Optionally, one or more particles may be doped with an element selected from aluminum (Al), sulfur (S), sodium (Na), potassium ⑷ or lithium (Li) one or more inorganic materials.

[0028] 任选地,本发明的实施方案可以包括具有不立即与In和/或Ga合金化的铜源。 [0028] Optionally, embodiments of the present invention may include not immediately and In / Ga sources or alloyed copper. 一种选择将是使用(略微)氧化的铜。 One option would be to use (slightly) oxidized copper. 另一种选择将是使用CuxSey。 Another option would be to use CuxSey. 请注意,对于(略微)氧化的铜的方法,可能需要还原步骤。 Note that for (slightly) of copper oxidation, reduction step may be required. 基本上,如果在液态In和/或Ga中使用单质铜,则油墨制备与涂覆之间的工艺速度应足以使颗粒不会生长到将导致厚度不均匀涂层的尺寸。 Basically, if the use of elemental copper in the liquid In and / or Ga, then the process speed between ink preparation and the coating should be sufficient to cause the particles do not grow to the size of non-uniform thickness of the coating.

[0029] 应理解的是温度范围可以是衬底的温度范围,仅是因为其通常是不会被加热到其熔点以上的唯一一个。 [0029] It should be understood that the temperature range may be the temperature range of the substrate, because it is typically not heated above its melting point of only a single. 这适用于衬底中的最低熔化材料,即Al及其它适当衬底。 This applies to the lowest melting of the substrate material, i.e., Al or other suitable substrate.

[0030] 本发明的性质和优点的进一步理解将通过参照其余部分的说明和附图而变得显而易见。 [0030] further understanding of the nature and advantages of the present invention will become apparent by reference to the remaining portions of the description and drawings.

附图说明 BRIEF DESCRIPTION

[0031] 图1A-1E是一系列示意横截面图,示出了根据本发明实施方案的光伏活性层的制造。 [0031] FIGS. 1A-1E are a series of schematic cross-sectional view illustrating the manufacturing a photovoltaic active layer embodiment of the present invention.

[0032] 图1F示出了本发明的又一实施方案。 [0032] Fig 1F shows a further embodiment of the present invention.

[0033] 图2A-2F是一系列示意横截面图,示出了根据本发明替代实施方案的光伏活性层的制造。 [0033] Figures 2A-2F are a series of schematic cross-sectional view illustrating an alternative manufacturing a photovoltaic active layer according to an embodiment of the present invention.

[0034] 图2G是可以在本发明实施方案中使用的卷到卷处理设备的示意图。 [0034] FIG. 2G is a schematic view volume may be used in embodiments of the present invention, the device-to-roll process.

[0035] 图3是根据本发明实施方案而制造的具有活性层的光伏器件的横截面示意图。 [0035] FIG. 3 is a cross-sectional schematic view of a photovoltaic device having an active layer according to an embodiment of the present invention is manufactured.

[0036] 图4A不出了根据本发明的一个实施方案用于刚性衬底的系统的一个实施方案。 [0036] FIG. 4A not an embodiment of a system for a rigid substrate according to one embodiment of the present invention.

[0037] 图4B不出了根据本发明的一个实施方案用于刚性衬底的系统的一个实施方案。 [0037] FIG. 4B no one embodiment of a system for a rigid substrate according to one embodiment of the present invention.

[0038] 图5-7示出了根据本发明的实施方案用以形成膜的金属间化合物材料的使用。 [0038] Figures 5-7 illustrate the use of the intermetallic compound material for forming a film according to the embodiment of the present invention.

[0039] 图8是示出了根据本发明的实施方案用以形成膜的多层的使用的横截面图。 [0039] FIG. 8 is a diagram illustrating a cross-sectional view used for forming the film according to the embodiment of the present invention is a multilayer.

[0040] 图9示出了根据本发明实施方案而处理的进料材料。 [0040] FIG. 9 shows the feed material in accordance with embodiments of the present invention and process. 具体实施方式 Detailed ways

[0041] 应理解的是如权利要求的那样,前述一般说明和以下详细说明对于本发明仅是示范性和说明性的,而非限制性的。 [0041] The claim is to be understood as the foregoing general description and the following detailed description of the present invention is merely exemplary and illustrative, and not restrictive. 可以注意到的是当用于说明书和所附权利要求中时,除非文中另外明确规定,单数形式“一”、“一种”和“该”包括复数对象。 It may be noted that when used in this specification and the appended claims, unless the context clearly dictates otherwise, the singular forms "a", "an" and "the" include plural referents. 因此,例如,提及“一种材料”可以包括材料的混合物,提及“一种化合物”可以包括多种化合物,等等。 Thus, for example, reference to "a material" may comprise a mixture of materials, reference to "a compound" may include a variety of compounds, and the like. 此处所引用的文献因而通过引用全部并入本文,除非它们与本说明书中明确阐述的教导内容冲突。 References cited herein are hereby incorporated herein by reference in its entirety, unless they conflict with the teachings of the present specification expressly set forth herein.

[0042] 在本说明书中和随后的权利要求书中,将会参考若干术语,它们应限定为具有以下意义: [0042] In the present specification and the subsequent claims, reference will be a number of terms, which shall be defined to have the following meanings:

[0043] “任选的”或“任选地”意指随后描述的状况可能发生或可能不发生,因此该描述包括该状况发生的情况和不发生的情况。 [0043] "Optional" or "optionally" means that the subsequently described event of circumstances may or may not occur, so that the description includes instances where the circumstance occurs and where it does not. 例如,如果器件任选地含有阻挡膜的特征,这意指该阻挡膜特征可能存在或可能不存在,因此,该描述既包括其中器件具有阻挡膜特征的结构又包括其中阻挡膜特征不存在的结构。 For example, if a device optionally contains a feature barrier film, which means that the barrier film feature may or may not be present, thus, the description includes both barrier film having a characteristic in which the device also includes a structure in which a barrier membrane characteristic does not exist structure.

[0044] 根据本发明的一个实施方案,可以通过首先形成IB-1IIA族化合物层、将VIA族细粒布置在化合物层上并随后加热化合物层和VIA族细粒以形成IB-1IIA-VIA族化合物来制造光伏器件的活性层。 [0044] According to an embodiment of the present invention, by forming first IB-1IIA compound layer, the fine particles are arranged Group VIA compound layer and then heated and VIA compound fine particles in the layer to form the Group IB-1IIA-VIA producing a compound of the active layer of the photovoltaic device. 优选地,IB-1IIA化合物层是CuzInxGah形式的铜(Cu)、铟(In)和镓(Ga)的化合物,其中O彡X彡I且0.5彡z彡1.5。 Preferably, IB-1IIA CuzInxGah compound layer is in the form of copper (Cu), indium (In) and gallium (Ga) compound, wherein X San San I O and 0.5 z San San 1.5. IB-1IIA-VIA族化合物优选地是Culn(1_x)GaxS2(1_y)Se2y形式的Cu、In、Ga和硒(Se)或硫S的化合物,其中O彡x彡I且O彡y彡I。 IB-1IIA-VIA compound is preferably a Culn (1_x) compound GaxS2 (1_y) Se2y form of Cu, In, Ga, and selenium (Se) or sulfur (S), wherein x O San San San I and O y San I. 还应理解的是所得到的IB-1IIA-VIA族化合物可以是CuzIn(1_x)GaxS2(1_y)Se2y形式的Cu、In、Ga和硒(Se)或硫S的化合物,其中0.5彡z彡1.5、0彡x彡1.0且O彡y彡1.0。 It should also be appreciated that the resulting IB-1IIA-VIA compound may be CuzIn (1_x) GaxS2 (1_y) Se2y compound in the form of Cu, In, Ga, and selenium (Se) or sulfur (S), wherein z San San 0.5 1.5 , 0 x San San 1.0 and O y San San 1.0.

[0045] 还应理解的是除Cu、In、Ga、Se、和S之外的IB、IIIA和VIA族元素也可包括在本文所述IB-1IIA-VIA合金的说明中,并且连字符例如Cu-Se或Cu-1n-Se中)的使用不表示化合物,而是表示由连字符连接的元素的共存混合物。 [0045] It should also be understood that in addition to Cu, In, Ga, Se, and S IB, IIIA and VIA elements may also be included in the description of the IB-1IIA-VIA alloys described herein, and the hyphen e.g. Cu-Se or Cu-1n-Se) is not indicate a compound, but indicates a coexisting mixture of the elements connected hyphen. 还应理解的是IB族有时称为第11族,IIIA族有时称为第13族,VIA族有时称为第16族。 It should also be appreciated that the group IB sometimes called Group 11, IIIA group is sometimes referred to as Group 13, VIA Group sometimes referred to as group 16. 此外,VIA(16)族有时称为硫属元素。 Furthermore, VIA (16) is sometimes referred to as Group chalcogen. 在本发明的实施方案中,在几种元素可以相互结合或相互取代的情况下,诸如In和Ga、或Se、和S,在本领域中常见的是在一组括号内包括可以结合或互换的元素,如(In,Ga)或(Se,S)。 In an embodiment of the present invention, in the case where several elements can be combined with each other or substituted each other, such as In and Ga, or Se, and S, common in the art is in a group may be bonded or cross brackets comprising transducer elements, such as (in, Ga), or (Se, S). 本说明书中的描述有时利用了这种方便。 The descriptions in this specification sometimes utilizes this convenience. 最后,也为了方便起见,利用普遍接受的化学符号讨论这些元素。 Finally, also for convenience, using the commonly accepted chemical symbols discuss these elements. 适用于本发明方法的IB族元素包括铜(Cu)、银(Ag)和金(Au)。 The method of the present invention is applicable to the Group IB elements include copper (Cu), silver (Ag) and gold (Au). 优选的IB族元素是铜(Cu)。 The preferred Group IB element is copper (Cu). 适用于本发明方法的IIIA族元素包括镓(Ga)、铟(In)、铝(Al)和铊(Tl)。 The method of the present invention is applicable to Group IIIA elements include gallium (Ga), indium (In), aluminum (Al) and thallium (Tl). 优选的IIIA族元素是镓(Ga)或铟(In)。 The preferred Group IIIA element is gallium (Ga) or indium (In). 感兴趣的VIA族元素包括硒(Se)、硫(S)和締(Te),优选的VIA族元素是Se和/或S。 Group VIA elements of interest include selenium (Se), sulfur (S) and association (Te), the preferred Group VIA element is Se and / or S.

[0046] 根据本发明的第一实施方案,如图1A-1E所不,化合物层可以包括一种或多种IB族元素和两种或更多种不同的IIIA族元素。 [0046] According to a first embodiment of the present invention, are not shown in FIG 1A-1E, the compound layer may include one or more Group IB elements and two or more different group IIIA elements.

[0047] 如图1A所示,可以在衬底102上形成吸收层。 [0047] As shown in FIG. 1A, the absorbent layer may be formed on the substrate 102. 举例来说,衬底102可以由诸如但不限于铝的金属制成。 For example, the substrate 102 may be, but is not limited to be made of metal such as aluminum. 根据衬底102的材料,可能有用的是用接触层104涂覆衬底的表面以促进衬底102与其上形成的吸收层之间的电接触。 The material of the substrate 102, the surface may be useful for coating a substrate contact layer 104 to facilitate electrical contact between the absorbent substrate layer 102 formed thereon. 例如,在衬底102由铝制成的情况下,接触层104可以是钥层。 For example, in a case where the substrate 102 made of aluminum, the contact layer 104 may be a key layer. 对于本讨论,可以将接触层104视为衬底的一部分。 For the present discussion, the contact layer 104 may be considered part of the substrate. 同样,在衬底102上形成或布置材料或材料层的任何讨论包括在接触层104上布置或形成这样的材料或层(如果使用的话)。 Similarly, any discussion or formed material or layer arrangement comprising arrangement or forming such material or layer on the contact layer 104 (if used) on the substrate 102. [0048] 如图1B所示,在衬底上形成前体层106。 [0048] FIG. 1B, the precursor layer 106 is formed on the substrate. 该前体层106含一种或多种IB族元素和两种或更多种不同的IIIA族元素。 The precursor layer 106 comprising one or more Group IB elements and two or more different group IIIA elements. 优选地,所述一种或多种IB族元素包括铜,IIIA族元素包括铟和镓。 Preferably, the one or more Group IB elements include copper, IIIA elements include indium and gallium. 举例来说,前体层106可以是含铜、铟和镓的无氧化合物。 For example, the precursor layer 106 may be oxygen-free copper compound, indium and gallium. 优选地,前体层是CuzInxGa1I形式的化合物,其中O彡x彡I且0.5彡z彡1.5。 Preferably, the precursor layer is CuzInxGa1I form of the compound, San O x wherein I and San San 1.5 0.5 San z. 本领域的技术人员将认识到可以用其它IB族元素代替Cu,以及可以用其它IIIA族元素代替In和Ga。 Those skilled in the art will recognize that may be replaced by other Group IB elements Cu, In and Ga, and may be replaced with other Group IIIA elements. 作为一个非限制性实例,前体层的厚度在约IOnm与约5000nm之间。 As a non-limiting example, the thickness of the precursor layer is between about IOnm and about 5000nm. 在其它实施方案中,前体层的厚度可以在约2.0至约0.4微米之间。 In other embodiments, the thickness of the precursor layer may be between about 2.0 to about 0.4 microns.

[0049] 如图1C所示,层108含有前体层106之上的单质硫属元素颗粒107。 [0049] 1C, the layer 108 containing elemental sulfur precursor layer 106 above the chalcogen particles 107. 举例但不失一般性地说,该硫属元素颗粒可以是硒、硫或締的颗粒。 By way of example but without loss of generality that the chalcogen may be selenium particles, sulfur or associated particles. 如图1D中所示,热量109被施加于前体层106和含有硫属元素颗粒的层108以便将它们加热至足以熔化硫属元素颗粒107并使该硫属元素颗粒107与前体层106中的IB族元素和IIIA族元素反应的温度。 As shown in FIG. 1D, heat 109 is applied to the front layer 106 and the layer containing chalcogen particles 108 so that they are heated to a temperature sufficient to melt the chalcogen particles 107 and the particles 107 and the chalcogen precursor layer 106 temperature in the group IB element and the group IIIA elements of the reaction. 如图1E所示,硫属元素颗粒107与IB族和IIIA族元素的反应形成IB-1IIA族硫属元素化物化合物的化合物膜110。 1E, the reaction chalcogen particles 107 with Group IB and Group IIIA elements forming a compound film 110 IB-1IIA Group chalcogenide compound. 优选地,IB-1IIA族硫属元素化物化合物是CuzIrvxGaxSe2(1_y)Sy形式,其中0〈χ〈1、0彡y彡I且0.5彡z彡1.5。 Preferably, IB-1IIA Group chalcogenide compound is CuzIrvxGaxSe2 (1_y) Sy form, where 0 <χ <1,0 San San y I z San San 0.5 and 1.5.

[0050] 如果硫属元素颗粒107在相对低的温度(例如对于Se为220°C,对于S为120°C )下熔化,则硫属元素已处于液态并与前体层106中的IB族和IIIA族纳米颗粒发生良好的接触。 [0050] If the chalcogen particles 107 at relatively low temperatures (for example, Se to 220 ° C, for S of 120 ° C) under melting, the chalcogen element is in a liquid state and Group IB precursor layer 106 and group IIIA nanoparticles good contact occurs. 如果前体层106和熔融硫属元素随后被充分加热(例如在大约375°C下),则硫属元素与前体层106中的IB族和IIIA族元素反应,在化合物膜110中形成所需的IB-1IIA硫属元素化物材料。 If the precursor layer 106 and the molten chalcogenide is then heated sufficiently Group IB and Group IIIA elements of the reaction (e.g., at about 375 ° C), the chalcogen precursor layer 106 is formed by the compound film 110 IB-1IIA required chalcogenide material. 作为一个非限制性实例,前体层的厚度在约IOnm与约5000nm之间。 As a non-limiting example, the thickness of the precursor layer is between about IOnm and about 5000nm. 在其它实施方案中,前体层的厚度可以在约4.0与约0.5微米之间。 In other embodiments, the thickness of the precursor layer may be between about 4.0 and about 0.5 microns.

[0051] 存在用于形成IB-1IIA前体层106的许多不同技术。 [0051] Many different techniques exist for forming the precursor IB-1IIA layer 106. 例如,该前体层106可以由包括纳米颗粒的纳米细粒膜形成,该纳米颗粒含所需的IB和IIIA族元素。 For example, the precursor layer 106 may be formed of a fine particle film comprising nano nanoparticle, the nanoparticle containing the desired IB and IIIA elements. 纳米颗粒可以是混合的单质纳米颗粒,即只具有单一原子种类的纳米颗粒。 Nanoparticles may be mixed with elemental nanoparticles, i.e. only a single atomic species nanoparticles. 或者,纳米颗粒可以是例如Cu-1n、In-Ga或Cu-Ga的二元纳米颗粒,或诸如但不限于Cu-1n-Ga的三元颗粒,或四元颗粒。 Alternatively, the nanoparticles may, for example, Cu-1n, In-Ga or Cu-Ga binary nanoparticles, or such as but not limited to Cu-1n-Ga ternary particles, granules, or quaternary. 这样的纳米颗粒可以通过对市售的所需单质、二元或三元材料进行球磨得到。 Such nanoparticles may be obtained by milling commercially desired elemental, binary or ternary material. 这些纳米颗粒的尺寸可以在约0.1纳米与约500纳米之间。 The size of the nanoparticles may be between about 0.1 nanometers and about 500 nanometers.

[0052] 使用纳米颗粒基分散体的优点之一是可以通过以一定序列的子层(sub-layer)构建前体层或通过直接改变前体层106中的相对浓度来改变化合物膜110内的元素浓度。 [0052] One advantage of the use of nanoparticles based dispersion can be changed or the compound film 110 directly by changing the relative concentration of the precursor layer 106 by a certain sub-sequence layer (sub-layer) layer precursor construct element concentrations. 构成用于每个子层的油墨的纳米颗粒的相对元素浓度可以改变。 The relative concentration of the elements constituting the nanoparticles used in the ink of each sublayer may vary. 这样,例如,吸收层内镓的浓度可以随吸收层内的深度而变。 Thus, for example, within the absorbent layer of gallium concentration may vary with depth within the absorber layer.

[0053] 含硫属元素颗粒107的层108可以布置在纳米细粒膜之上,并且随后可以与加热硫属元素颗粒107相结合地烧结该纳米细粒膜(或一个或多个其组分子层)。 Particle layer [0053] 107 containing chalcogen elements 108 may be disposed on the nano-fine particle film, and then the nano-fine particle film element 107 in conjunction sintering (or one or more groups which may be the case with the heated sulfur molecules Floor). 或者,可以烧结纳米细粒膜以便形成前体层106随后将含单质硫属元素颗粒107的层108布置在前体层106 上。 Alternatively, the nano-fine particle film may be sintered to form a precursor layer containing layer 106 is subsequently elemental chalcogen particles 107 to 108 disposed on the front layer 106.

[0054] 在本发明的一个实施方案中,用于形成前体层106的纳米细粒膜中的纳米颗粒除作为杂质而不可避免地存在之外不含氧或基本不含氧。 [0054] In one embodiment of the present invention, for forming nanoparticles of fine particle film precursor layer 106 is substantially free of oxygen or oxygen-containing addition unavoidably present as an impurity. 纳米细粒膜可以是分散体的层,诸如但不限于油墨、糊料、涂层或涂料。 Nano-layer film may be a fine dispersion, but not limited to ink, paste, or paint coating. 分散体可以包括纳米颗粒,该纳米颗粒包括溶剂或其它成分中的IB族和IIIA族元素。 Dispersions can include nanoparticles, the nanoparticles comprise a solvent or a Group IB and Group IIIA elements of other ingredients. 硫属元素可能偶然存在于除纳米颗粒本身之外的纳米细粒膜成分中。 Chalcogen nano may occasionally be present in addition to the fine particle film itself nanoparticle component. 可以将分散体膜散布到衬底上并退火以形成前体层106。 Dispersion film may be spread onto the substrate and annealed 106 to form a precursor layer. 举例来说,可以通过形成含有IB族、IIIA族元素的无氧纳米颗粒并将这些纳米颗粒混合并将其添加到液体中来制成分散体。 For example, by forming a Group IB may contain, oxygen-free nanoparticles and mixing of the Group IIIA elements of these nanoparticles and added to the liquid dispersion to be made. 应理解的是在一些实施方案中,颗粒和/或分散体的形成工艺可以包括研磨进料颗粒,由此将颗粒分散在载液和/或分散剂中。 It should be understood that in some embodiments, the particle formation process and / or dispersion of the feed particles may comprise abrasive, whereby the particles are dispersed in a liquid carrier and / or dispersant. 前体层106可以使用多种非真空技术来形成,诸如但不限于湿涂、喷涂、旋涂、刮刀涂覆、接触印刷、顶端进料反转印刷、底部进料反转印刷、喷嘴进料反转印刷、凹版印刷、微凹印刷、反转微凹印刷、逗号直接印刷(commadirect printing)、棍涂、狭缝模压涂覆、Meyer棒式涂覆、压边直接涂覆(lip directprinting)、双压边直接涂覆、毛细管涂覆、喷油墨印刷、射流沉积、喷射沉积等,以及以上和/或相关技术的组合。 Precursor layer 106 may be used to form a variety of non-vacuum techniques, such as, but not limited to, wet coating, spray coating, spin coating, doctor blade coating, contact printing, top feed reverse printing, bottom feed reverse printing, nozzle feed reverse printing, gravure printing, microgravure printing, reverse microgravure printing, comma direct printing (commadirect printing), rod coating, slot die coating, Meyer bar coating, bead coated directly (lip directprinting), double bead coated directly, capillary coating, ink jet printing, jet deposition, spray deposition and the like, and combinations of the above and / or related technologies. 在本发明的一个实施方案中,可以按相互堆叠形成的一定序列子层形成前体层106。 In one embodiment of the present invention, the precursor layer 106 may be formed in a certain sub-sequence layer are stacked is formed. 可以加热纳米细粒膜以排出不意图成为膜一部分的分散体成分并烧结颗粒和形成化合物膜。 It may be heated to discharge nano-fine particle film is not intended to be a part of the dispersion composition of the film and sintered particles and forming a compound film. 举例来说,可以按共同转让的美国专利申请公开20050183767中所述形成含IB和IIIA族元素和/或固溶体的纳米细粒基油墨,通过引用将所述专利申请公开并入本文。 For example, it is possible according to commonly assigned U.S. Patent Application Publication 20050183767 is formed containing the IB and IIIA elements and / or nano-based inks fine solid solution by reference to the patent application is incorporated herein disclosed.

[0055] 构成分散体的纳米颗粒的直径可以在约0.1nm与约500nm之间的所需颗粒尺寸范围内,直径优选地在约IOnm与约300nm之间、更优选地在约50nm与250nm之间。 [0055] The nanoparticle dispersion diameter constituting the desired particle size may be in the range of between about 0.1nm and about 500nm, the diameter is preferably between about IOnm and about 300nm, more preferably from about 50nm to 250nm of between. 在又一实施方案中,颗粒可以在约200nm与约500nm之间。 In yet another embodiment, the particles may be between about 200nm and about 500nm.

[0056] 在一些实施方案中,可以以熔融形式提供一种或多种IIIA族元素。 [0056] In some embodiments, may provide one or more group IIIA elements in molten form. 例如,可以从镓和/或铟的熔融混合物开始制成油墨。 For example, the ink can be made beginning from the molten mixture of gallium and / or indium. 然后可以将铜纳米颗粒添加到该混合物,随后可以将该混合物用作油墨/糊料。 Then the copper nanoparticles may be added to the mixture, the mixture may then be used as an ink / paste. 铜纳米颗粒也是市售的。 Copper nanoparticles are also commercially available. 或者,可以调节(例如冷却)Cu-Ga-1n混合物的温度直到形成固体。 Alternatively, it may be adjusted (e.g., cooling) the temperature of Cu-Ga-1n until the mixture formed a solid. 可以在该温度下研磨所述固体直到出现小的纳米颗粒(例如小于约IOOnm)。 The solid may be ground at this temperature until small nanoparticles (e.g., less than about IOOnm) appears.

[0057] 在本发明的其它实施方案中,可以通过形成含一种或多种IIIA族金属与含IB族元素的金属纳米颗粒的熔融混合物并用由该熔融混合物形成的膜涂覆衬底来制备前体层106。 [0057] In other embodiments of the present invention, by coating a substrate and a film formed from the molten mixture was prepared by forming a molten mixture comprising one or more metals of group IIIA metal nanoparticles containing group IB element precursor layer 106. 该熔融混合物可以包括含IB族元素和(任选地)另一IIIA族元素的纳米颗粒的熔融IIIA族元素。 The molten mixture was melt-IIIA elements may include nanoparticles containing a Group IB element and (optionally) another Group IIIA elements. 举例来说,可以将含铜和镓的纳米颗粒与熔融铟混合以形成熔融混合物。 For example, copper may be gallium and indium nanoparticles melt mixed to form the molten mixture. 也可以从铟和/或镓的熔融混合物开始制成熔融混合物。 It can be started from a molten mixture of a molten mixture of indium and / or gallium. 然后可以将铜纳米颗粒加入该熔融混合物。 The molten mixture may then be added to the copper nanoparticles. 铜纳米颗粒也是市售的。 Copper nanoparticles are also commercially available. 或者,可以使用多种良好确立技术中的任何技术来制成这样的纳米颗粒,所述技术包括但不限于(i)铜丝电爆,(ii)铜颗粒的机械研磨持续足够时间以制造纳米颗粒,或(iii)由有机金属前体或铜盐的还原进行铜纳米颗粒的溶液基合成。 Alternatively, you can use any of a variety of well-established techniques such nanoparticles be made, including but not limited to a (i) wire electrical explosion, (ii) mechanical polishing of the copper particles for a time sufficient to produce nano particles, or (iii) a solution-based synthesis for copper nanoparticles by reduction of organometallic or copper salts. 或者,可以调节(例如冷却)熔融Cu-Ga-1n混合物的温度直到形成固体。 Alternatively, it may be adjusted (e.g., cooling) the temperature of Cu-Ga-1n molten mixture until a solid. 在本发明的一个实施方案中,可以在该温度下研磨固体直到出现目标尺寸的颗粒。 In one embodiment of the present invention, the solid may be ground at this temperature until the target size of the particles occurs. 共同转让的美国专利申请公开2005183768中描述了这种技术的其它细节,通过引用将该专利申请并入本文。 Commonly assigned U.S. Patent Application 2005183768 describe further details of this technique are disclosed, the patent application is incorporated herein by reference. 任选地,熔融之前的硒颗粒可以小于I微米、小于500nm、小于400nm、小于300nm、小于200nm、和/ 或小于lOOnm。 Optionally, the selenium before melting the particles may be less than I micron, less than 500 nm, less than 400 nm, less than 300 nm, less than 200 nm, and / or less than lOOnm.

[0058] 在一个实施方案中,可以使用分散体形式的物质组合物来形成IB-1IIA前体层106,所述分散体含有分散在镓纳米小球的悬浮液中的IB、IIIA的单质纳米颗粒的混合物。 [0058] In one embodiment, the dispersant can be used in the form of a composition of matter to IB-1IIA precursor layer 106 is formed, dispersed in a gallium nanoglobules suspension containing the IB, IIIA elemental nano the dispersion mixture of particles. 基于输入元素的相对比率,含镓纳米小球的分散体可以具有0.01至1.0范围内的Cu/(In+Ga)组成比和从0.01至1.0范围内的Ga/(In+Ga)组成比。 Based on the relative ratio of the input elements, dispersion of the gallium-containing nanoglobules may have Cu / (In + Ga) within the range of 0.01 to 1.0, the composition ratio from the range from 0.01 to 1.0 Ga / (In + Ga) ratio. 共同转让的美国专利申请11/081,163中描述了这种技术,在此通过引用将其并入本文。 Commonly assigned U.S. Patent Application 11 / 081,163 describes such a technique, which is incorporated herein by reference herein.

[0059] 或者,使用共同转让的美国专利申请10/943,657中所述的涂覆纳米颗粒来制造前体层106,其通过引用并入本文。 [0059] Alternatively, commonly assigned U.S. Patent Application of the coated nanoparticles in 10 / 943,657 produced the precursor layer 106, which is incorporated herein by reference. 可以在多层或交替层中逐一地沉积各种厚度的各种涂层。 Individually can be deposited in a variety of coating thicknesses of various layers or alternating layers. 具体地说,可以用含一种或多种IB、IIIA或VIA族元素的一个或多个层涂覆含一种或多种IB和/或IIIA和/或VIA族元素的核纳米颗粒以形成涂覆纳米颗粒。 Specifically, with a contain one or more IB, IIIA or VIA element or a plurality of coating layers containing one or more Group IB and / or IIIA and / or the core of the nanoparticles to form a Group VIA element coated nanoparticles. 优选地,至少一个所述层含有不同于核纳米颗粒中的一种或多种IB、IIIA或VIA族的元素。 Preferably, at least one element comprising a layer different from the core of the nanoparticles of one or more IB, IIIA or VIA Group. 所述核纳米颗粒和层中的IB、IIIA和VIA元素可以是纯单质金属或两种或更多种金属的合金。 The core layer of nanoparticles and IB, IIIA and VIA elements may be pure single metal or an alloy of two or more metals. 举例但非限制性地说,核纳米颗粒可以包括单质铜、或铜与镓、铟或铝的合金,并且该层可以是镓、铟或铝。 By way of example but not limitation that the core of the nanoparticles may include elemental copper, or copper and gallium, indium or alloys of aluminum, and the layer may be gallium, indium, or aluminum. 使用限定表面积的纳米颗粒,可以调整层厚度以便在纳米颗粒的聚集体积内提供适当化学计量比。 Use of nanoparticles defined surface area, the layer thickness may be adjusted to provide the appropriate stoichiometric ratio in the aggregate volume of the nanoparticles. 通过核纳米颗粒的适当涂覆,所得到的涂覆纳米颗粒可以具有纳米颗粒尺度内混合的所需元素,同时涂覆纳米颗粒的化学计量比(及因此的相)可以通过控制(一层或多层)涂层的厚度来调整。 By appropriately coating the core of the nanoparticles, the resulting nanoparticles can be coated with the desired mixed elements within the nanoparticles scale, while the stoichiometric ratio of the coated nanoparticles (and thus phase) can be controlled by (one or more multi-layer) thickness of the coating is adjusted.

[0060] 在某些实施方案中,可以通过在衬底上沉积源材料来形成前体并加热前体以形成膜来形成前体层106(或选定的成分子层,如果有的话)。 [0060] In certain embodiments, to form a precursor and the precursor is heated to form a film precursor layer 106 may be formed by depositing the source material on a substrate (or a selected molecule into a layer, if any) . 源材料可以包括具有至少一个IB-1IIA族相的含IB-1IIA族的颗粒,IB-1IIA族成分贡献源材料中大于约50摩尔百分比的IB族元素和大于约50摩尔百分比的IIIA族元素。 Source material may include at least one particle containing IB-1IIA Group IB-1IIA family phase, IB-1IIA aromatic component contributing source material is greater than 50 mole percent to about the Group IB elements and greater than 50 mole percent to about Group IIIA elements. BasoI的美国专利5,985,691中描述了这种技术的其它细节,其通过引用而并入本文。 U.S. Patent No. 5,985,691 BasoI described Further details of this technique, which is incorporated herein by reference.

[0061] 或者,可以从含有细颗粒形式的一种或多种相稳定前体的前体膜形成前体层106 (或选定的成分子层,如果有的话),所述细颗粒包含至少一种金属氧化物。 [0061] Alternatively, the precursor layer 106 may be formed (or a selected molecule into a layer, if any) from one or more precursor film containing a form of fine particles of a stable phase front body, the fine particles comprising at least one metal oxide. 可以在还原气氛中还原该氧化物。 The oxide can be restored in a reducing atmosphere. 特别是,可以将具有小于约I微米的平均直径的单相混合金属氧化物颗粒用于前体。 Single-phase mixed metal oxide particles in particular, it is possible to have an average diameter less than about I microns for the precursor. 可以通过如下方法制造这样的颗粒:制备包含Cu与In和/或Ga的溶液作为含金属化合物;形成溶液液滴;并在氧化性气氛中加热液滴。 It can be produced by a method such particles: Preparation containing Cu and In and / or Ga as the metal-containing compound solution; solution droplets are formed; and heating the droplets in an oxidizing atmosphere. 加热使液滴的内含物热解,从而形成单相铜铟氧化物、铜镓氧化物或铜铟镓氧化物颗粒。 Heating the droplets so that the contents of the pyrolysis, to form a single-phase copper indium oxide, copper oxide, or copper indium gallium gallium oxide particles. 这些颗粒可以随后与溶剂或其它添加剂混合以形成能够通过例如丝网印刷、浆料喷射等沉积在衬底上的前体材料,并随后退火以形成子层。 These particles may then be mixed with a solvent or other additives to form a precursor material can, for example, by screen printing, injection or the like paste is deposited on the substrate, and subsequently annealed to form sub-layers. Eberspacher的美国专利6,821,559中描述了这种技术的其它细节,其通过引用而并入本文。 U.S. Patent No. 6,821,559 Eberspacher described Further details of this technique, which is incorporated herein by reference.

[0062] 或者,可以使用以受控总组成配制并具有一种固溶体颗粒的纳米粉末材料形式的前体来沉积前体层106 (或所选成分子层,如果有的话)。 [0062] Alternatively, a composition is formulated in a controlled total and having one kind of precursor of the nano particles in the form of solid solution powder material deposited precursor layer 106 (or a selected molecule into a layer, if any). 可以沉积纳米粉末材料前体以形成第一、第二层或随后的子层,并在至少一种适当气氛中反应以形成相应的活性层成分。 Nanopowder may be deposited before the body of material to form a first, second or subsequent sub-layer, and at least one suitable reaction atmosphere to form the corresponding active ingredient layer. 可以由纳米粉末(即具有纳米尺寸颗粒的粉末材料)来配制前体。 Nanopowder may be made (i.e., a powder having a nano-sized particles) to the precursor formulation. 构成前体配制中使用的纳米粉末的颗粒的组成对于工艺的可重复性和得到的化合物膜的品质是重要的。 Nanoparticle composition constituting the powder formulation used in the precursor is important for the quality and repeatability of the obtained compound film process. 构成纳米粉末的颗粒优选地是近球形状,并且其直径小于约200nm,优选地小于约lOOnm。 The particles are preferably configured nanopowder is nearly spherical shape and a diameter less than about 200 nm, preferably less than about lOOnm. 或者,纳米粉末可以含小片晶形式的颗粒。 Alternatively, the powder may contain nano-particles in the form of small platelets. 纳米粉末优选地含铜镓固溶体颗粒,和铟颗粒、铟镓固溶体颗粒、铜铟固溶体颗粒以及铜颗粒中的至少一种。 Preferably, copper nanopowder particles of solid solution of gallium, and indium particles, indium gallium solid solution particles, copper indium solid solution particles and at least one of copper particles. 或者,纳米粉末可以含铜颗粒和铟镓固溶体颗粒。 Alternatively, nano-particles and copper powder may be indium gallium solid solution particles.

[0063] 任何上述各种纳米细粒组合物可以与众所周知的溶剂、载体、分散剂等混合以制备适合于沉积到衬底102上的油墨或糊料。 [0063] Any of the above compositions various nano fine particles may be mixed with the well-known solvents, carriers, dispersants and the like to prepare a suitable ink or paste to be deposited on the substrate 102. 或者,可以制备纳米粉末颗粒以用于通过干法沉积在衬底上,所述干法诸如但不限于干粉末喷涂、静电喷涂、或在复印机中使用并涉及将电荷提供到随后被沉积到衬底上的颗粒上的工艺。 Alternatively, for preparation of nano powder particles by dry deposited on the substrate, the dry process such as a dry powder, but not limited to spraying, electrostatic spraying, or used in a copying machine and to provide a charge to the substrate is then deposited to process on the particles on the bottom. 前体配制之后,可以使用例如干法或湿法将前体及因此的纳米粉末组分以微层形式沉积到衬底102上。 After the precursor formulation can be used, for example, dry or wet, and thus the precursor of the nano powder components deposited onto the substrate 102 to form the microlayer. 干法包括静电粉末沉积法,其中,可以用能够保持电荷的传导性差或绝缘的材料来涂覆所制备的粉末颗粒。 Dry powder comprising an electrostatic deposition method, wherein a difference can be conductive or insulating material capable of holding a charge applied to the powder particles produced. 湿法的实例包括丝网印刷、喷油墨印刷、刮刀涂覆油墨沉积、逆向辊涂等。 Examples of the wet method include screen printing, ink jet printing, knife coating deposited ink, reverse roll coating and the like. 在这些方法中,可以将纳米粉末与载体混合,该载体通常为水基溶剂或有机溶剂,例如水、醇类、乙二醇等等。 In these methods, the nano powder may be mixed with a carrier, the carrier generally is a water-based solvent or an organic solvent, for example, water, alcohols, glycols and the like. 前体配制中的载体及其它制剂可以完全或基本蒸发掉以便在衬底上形成微层。 Formulated in a carrier and other precursor formulation can be substantially or completely evaporated to form a micro-layer on the substrate. 随后可以使该微层反应以形成子层。 The microlayers may then be reacted to form a sub-layer. 该反应可以包括退火工艺,包括但不限于炉退火、RTP或激光退火、微波退火。 The annealing process may include a reaction, including but not limited to furnace annealing, laser annealing, or the RTP, a microwave anneal. 退火温度可以在约350°C至约600°C之间,优选地在约400°C至约550°C之间。 Annealing temperature may range from about 350 ° C to about 600 ° C, preferably between about 550 ° C to about 400 ° C. 退火气氛可以是惰性的,例如氮气或氩气。 The annealing atmosphere can be inert, such as nitrogen or argon. 或者,反应步骤可以采用具有含至少一种VIA族元素(例如Se、S或Te)的蒸气的气氛以便提供吸收层中所需的VIA族元素水平。 Alternatively, the reaction steps may be an atmosphere having a vapor containing at least one Group VIA element (e.g., Se, S or Te) in order to provide the desired level of Group VIA elements absorbing layer. Bulent Basol的美国专利申请公开20040219730中描述了这种技术的更多细节,其通过引用而并入本文。 Bulent Basol U.S. Patent Application No. 20040219730 for more details of this technique are described in the disclosure, which is incorporated herein by reference.

[0064] 在本发明的某些实施方案中,可以顺序地或同时地将前体层106(或其任一子层)退火。 [0064] In certain embodiments of the present invention, it may be sequentially or simultaneously the precursor layer 106 (or any of its layer) annealing. 这样的退火可以通过将衬底102和前体层106快速地从环境温度加热至约200°C与约600°C之间的平稳温度范围来实现。 Such may be accomplished by annealing the substrate 102 and the front layer 106 rapidly heated from ambient temperature to a plateau temperature range of between about 200 ° C and about 600 ° C is achieved. 可以在约几分之一秒至约60分钟范围内的时间段内将温度保持在该平稳范围并随后降低。 May be from about one second to the range of a fraction of a period of about 60 minutes maintaining the temperature in this range and then smoothly decreased. 或者,可以调整退火温度以便在一定温度范围内摆动而不是保持在特定的平稳温度。 Alternatively, the annealing temperature may be adjusted so as to swing rather than maintained at a specific temperature stable in a certain temperature range. 这种技术(此处称为快速热退火或RTA)特别适合于在诸如但不限于铝箔的金属箔衬底上形成光伏活性层(有时称为“吸收”层)。 This technique (referred to herein as rapid thermal annealing or RTA) particularly suitable for the photovoltaic active layer (sometimes referred to as "absorbent" layer) is formed on a metal foil such as but not limited to an aluminum foil substrate. 美国专利申请10/943,685中描述了这种技术的其它细节,其通过引用而并入本文。 U.S. Patent Application 10 / 943,685 describes other details of this technique, which is incorporated herein by reference.

[0065] 本发明的其它替代性实施方案利用印刷工艺之外的其它技术来形成吸收层。 [0065] Other alternative embodiments of the present invention using other techniques than the printing process to form the absorber layer. 例如,可以通过原子层沉积(ALD)将IB族和/或IIIA族元素沉积到衬底的顶面上和/或活性层的一个或多个子层的顶面上。 For example, by an atomic layer deposition (ALD) the group IB and / or IIIA elements deposited onto and / or a top surface of the top surface of the substrate or one or more sub layers of the active layer. 例如,可以在由印刷技术形成的子层叠层顶部进行ALD来沉积Ga薄层。 For example, ALD can be performed at the top sub-layer stack formed by printing technique to deposit a thin layer of Ga. 通过使用ALD,可以以在原子水平或接近原子水平混合的精确化学计量比来沉积铜、铟和镓。 By using ALD, may be at the atomic level exact stoichiometry or near atomic level of the mixing ratio of the deposition of copper, indium and gallium. 此外,通过改变每种前体材料的暴露脉冲的顺序,每个原子层内Cu、In、Ga和Se或S的相对组成可以作为沉积周期及因此的吸收层内深度的函数而系统地改变。 Further, by changing the order of exposure pulses each precursor material, within each atomic layer of Cu, the relative composition of In, Ga and Se or S can be used as the deposition cycle and thus a function of depth within the absorbent layer of the system is changed. 美国专利申请公开20050186342中描述了这样的技术,其通过引用而并入本文。 U.S. Patent Application 20050186342 describes a technique, which is incorporated by reference herein disclosed. 或者,可以通过使用各种真空基沉积技术中的任何技术来涂覆衬底的顶面,所述真空基技术包括但不限于溅射、蒸发、化学气相沉积、物理气相沉积、电子束蒸发等等。 Alternatively, by using any of a variety of vacuum based deposition techniques to coat the top surface of the substrate, the vacuum-based techniques include, but are not limited to sputtering, evaporation, chemical vapor deposition, physical vapor deposition, electron beam evaporation, etc. Wait.

[0066] 层108中的硫属元素颗粒107的尺寸可以在约I纳米与约50微米之间,优选地在约IOOnm与10微米之间,更优选地在约IOOnm和I微米之间,最优选地在约150与300nm之间。 Size [0066] layer 108 chalcogen particles 107 may be between about I nanometer and about 50 microns, preferably between about IOOnm and 10 microns, more preferably between about I and IOOnm microns, most preferably between about 150 and 300nm. 应注意到,硫属元素颗粒107可以大于IB-1IIA-VIA化合物膜110的最终厚度。 It should be noted, elemental chalcogen particles 107 may be greater than the final thickness of IB-1IIA-VIA compound film 110. 硫属元素颗粒107可以与溶剂、载体、分散剂等混合以制备适合于前体层106上的湿法沉积以形成层108的油墨或糊料。 Chalcogen particles 107 may be mixed with a solvent, a carrier, a dispersant to prepare suitable for deposition on a wet precursor layer 106 to form an ink or paste layer 108. 或者,可以制备硫属元素颗粒107以用于通过干法沉积在衬底上以便形成层108。 Alternatively, elemental chalcogen particles 107 may be prepared for deposition by a dry process to form a layer 108 on the substrate. 还应注意到,含硫属元素颗粒107的层108的加热可以通过例如如上所述的RTA工艺来执行。 It should also be noted that the heating layer 107 containing chalcogen element particles 108 may be performed by an RTA process, for example, as described above.

[0067] 可以以几种不同的方式来形成硫属元素颗粒107 (例如Se或S)。 [0067] can be formed in several different ways chalcogen particles 107 (e.g., Se or S). 例如,可以从市售细目粉末(例如200目/75微米)开始来形成Se或S颗粒并将该粉末球磨至所需的尺寸。 For example, the start S or Se particles formed from breakdown of commercial powder (e.g. 200 mesh / 75 microns) was added and the powder was ball milled to the desired size. 典型的球磨程序可以使用填充有研磨陶瓷球和可为粉末形式的进料材料的陶瓷研磨罐在液体介质中进行。 Typical milling procedures can be used and filled with grinding ceramic balls may be carried out in a liquid medium, a feed material in the form of a ceramic powder grinding jars. 当罐旋转或振动时,球振动并研磨液体介质中的粉末以减小进料材料颗粒的尺寸。 Rotating or vibrating when the can, vibration ball milling the liquid medium and the powder to reduce the particle size of the feed material. 任选地,具有特别设计的搅拌器的球磨机可以用来将珠粒移动到要处理的材料中。 Optionally, a ball mill having a specially designed agitator may be used to move the bead material to be treated.

[0068] 市售的硫属元素粉末及其它进料的例子在下表I中列出。 [0068] Examples of commercially available powder and chalcogen other feeds are listed in Table I below.

[0069]表 I[0070] [0069] TABLE I [0070]

Figure CN101443892BD00171

[0071] 或者,可以使用蒸发冷凝法来形成Se或S颗粒。 [0071] Alternatively, it may be formed using Se or S particles evaporation condensation method. 或者,可将Se或S原料熔化并喷射(“雾化”)以形成固化成纳米颗粒的液滴。 Alternatively, the material may be melted and S or Se injection ( "fog") to form droplets solidify into nanoparticles.

[0072] 该硫属元素颗粒107也可以使用基于溶液的技术形成,该技术也被称为“自上而下”方法(Nano Letters, 2004 Vol.4, N0.102047-2050 “Bottom-Up and Top-DownApproaches to Synthesis ofMonodispersed Spherical Colloids of low Melting-PointMetals”-Yuliang Wang and Younan Xia)。 [0072] The chalcogen particles 107 may be formed using solution based techniques, this technique is also called "top-down" approach (Nano Letters, 2004 Vol.4, N0.102047-2050 "Bottom-Up and Top-DownApproaches to Synthesis ofMonodispersed Spherical Colloids of low Melting-PointMetals "-Yuliang Wang and Younan Xia). 这种技术允许处理熔点低于400°C的元素,该元素为单分散的球形胶体,具有从IOOnm到600nm的可控直径,并且以大量方式进行。 This technique allows the processing elements of 400 ° C or a melting point, the element monodisperse spherical colloidal, having a diameter of from IOOnm controlled to 600nm, and carried out in a number of ways. 对于这种技术,将硫属元素(Se或S)粉末直接添加到沸腾的有机溶剂如二(乙二醇)中,并熔化以产生液滴。 For this technique, the chalcogen (Se or S) powder is added directly to boiling organic solvent such as di (ethylene glycol), and melted to produce droplets. 剧烈搅拌反应混合物并因此乳化20分钟后,将以热混合物形式获得的金属的均匀球形胶体倒入到冷的有机溶剂浴(如乙醇)中以便固化硫属元素(Se或Se)液滴。 The reaction mixture was stirred vigorously for 20 minutes and thus emulsified, homogeneous mixture of spherical colloidal will be obtained in the form of hot metal was poured into a cold bath of an organic solvent (e.g. ethanol) to cure chalcogen (Se or Se) droplets.

[0073] 参照图1F,还应理解的是在本发明的某些实施方案中,可以在前体层106下方形成硫属元素颗粒的层108。 [0073] Referring to 1F, a should also be understood that in certain embodiments of the invention, the layer of chalcogen particles 108 may be formed below the front layer 106. 层108的此位置仍允许硫属元素颗粒向前体层106提供充分过量的硫属元素以便与层106中的IB和IIIA族元素完全反应。 This position of the layer 108 still allows the precursor particles chalcogenide layer 106 provides sufficient excess chalcogen for complete reaction with the IB and IIIA element layer 106. 另外,由于从层108释放的硫属元素可以上升通过层106,所以层106下方的层108的此位置可能有益于产生元素之间更大的混合。 Further, since the metal element from the release layer 108 can be increased by a sulfur layer 106, the layer 106 below layer 108 may be greater between the position of this mixing element conducive for production. 层108的厚度可以在约IOnm至约5微米的范围内。 The thickness of layer 108 may be in the range of from about IOnm to about 5 microns. 在其它实施方案中,层108的厚度可以在约4.0微米至约0.5微米的范围内。 In other embodiments, the thickness of the layer 108 may be in the range from about 4.0 micrometers to about 0.5 micrometers within.

[0074] 根据本发明的第二实施方案,化合物层可以包括一种或多种IB族元素和一种或多种IIIA族元素。 [0074] According to a second embodiment of the invention, the compound layer may include one or more Group IB elements and one or more group IIIA elements. 可以如图2A-2F所示地进行制造。 FIG 2A-2F may be produced as shown. 吸收层可以在衬底112上形成,如图2A所示。 Absorbing layer may be formed on the substrate 112, shown in Figure 2A. 衬底112的表面可以涂覆接触层114以促进衬底112与要在其上形成的吸收层之间的电接触。 The surface of the substrate 112 may be coated with a contact layer 114 to facilitate electrical contact between the substrate 112 and the absorption layer to be formed thereon. 举例来说,可以用钥的接触层114来涂覆铝衬底112。 For example, the key may be a contact layer 114 of an aluminum substrate 112 is coated. 如上所述,在衬底112上形成或布置材料或材料层包括在接触层114(如果使用的话)上形成这样的材料或层。 As described above, formation or arrangement comprises a material or a material layer formed of such material or layer on the contact layer 114 (if used) on the substrate 112. 任选地,还应理解的是,还可以在接触层114的顶部和/或直接在衬底112上形成层115。 Optionally, also to be understood that the contact layer may also be the top portion 114 and / or layer 115 is formed directly on the substrate 112. 可以使用基于真空的技术溶液涂覆、蒸发和/或沉积该层。 Solution coating techniques may be used based on vacuum evaporation and / or depositing the layer. 虽然不限于以下说明,但层115可以具有比前体层116小的厚度。 Although not limited to the following description, the layer 115 may have a smaller thickness than the front layer 116. 在一个非限制性实施方案中,该层的厚度可以在约I至约IOOnm之间。 In one non-limiting embodiment, the thickness of the layer may be from about I to about IOOnm. 层115可以由各种材料组成,包括但不限于以下材料中的至少一种:IB族元素、IIIA族元素、VIA族元素、IA族元素(新体例:第I族)、任何前述元素的二元和/或多元合金、任何前述元素的固溶体、铜、铟、镓、硒、铜铟、铜镓、铟镓、钠、钠化合物、氟化钠、硫化钠铟、硒化铜、硫化铜、硒化铟、硫化铟、硒化镓、硫化镓、硒化铜铟、硫化铜铟、硒化铜镓、硫化铜镓、硒化铟镓、硫化铟镓、硒化铜铟镓、和/或硫化铜铟镓。 Layer 115 may be composed of various materials, including but not limited to at least one of the following materials: IB group elements, IIIA group elements, VIA group elements, IA group elements (new style: Group I), any two of the aforementioned elements elements and / or polyhydric alloy, a solid solution of any of the foregoing elements, copper, indium, gallium, selenium, copper, indium, copper, gallium, indium, gallium, sodium, a sodium compound, sodium fluoride, sodium sulfide, indium copper selenide, copper sulfide, indium selenide, indium sulfide, gallium selenide, gallium sulfide, copper indium diselenide, copper indium disulfide, copper selenide, gallium sulfide, copper, gallium, indium selenide, gallium sulfide, indium gallium selenide, copper indium gallium, and / or copper indium gallium disulfide.

[0075] 如图2B中所示,在衬底上形成前体层116。 [0075] As shown in FIG. 2B, the precursor layer 116 is formed on the substrate. 该前体层116含有一种或多种IB族元素和一种或多种IIIA族元素。 The precursor layer 116 comprising one or more Group IB elements and one or more group IIIA elements. 优选地,所述一种或多种IB族元素包括铜。 Preferably, the one or more Group IB elements include copper. 所述一种或多种IIIA族元素可以包括铟和/或镓。 The one or more group IIIA elements may include indium and / or gallium. 前体层可以使用如上所述的任何技术由纳米细粒膜形成。 Precursor layer may be formed using any of the techniques described above, fine particles of nano film. 在一些实施方案中,所述颗粒可以是基本无氧的颗粒,其可以包括含氧量小于约lwt%的那些颗粒。 In some embodiments, the particles may be substantially oxygen-free particles, which may include those particles of less than about lwt% of oxygen. 其它实施方案可以使用具有小于约5wt%的氧的材料。 Other embodiments may use a material having less than about 5wt% oxygen. 还有一些实施方案可以使用具有小于约3wt%氧的材料。 Some embodiments may use a material having less than about 3wt% oxygen. 还有一些实施方案可以使用具有小于约2wt%氧的材料。 Some embodiments may use a material having less than about 2wt% oxygen. 还有一些实施方案可以使用具有小于约0.5wt%氧的材料。 Some embodiments may use a material having less than about 0.5wt% of oxygen. 还有一些实施方案可以使用具有小于约0.1wt %氧的材料。 Some embodiments may use a material having less than about 0.1wt% of oxygen.

[0076] 任选地,如图2B中所示,还应理解的是还可以在前体层116的顶部形成层117。 As shown in [0076] Optionally, FIG. 2B, also be understood that layer 117 may be formed on the front top of the layer 116. 应理解的是该叠层可以具有层115和117两者、仅其中一层、或都没有。 It should be understood that the stack may have both layers 115 and 117, only one of which, or not. 虽然不限于以下说明,但层117可以具有比前体层116小的厚度。 Although not limited to the following description, the layer 117 may have a smaller thickness than the front layer 116. 在一个非限制性实施方案中,该层的厚度可以在约I至约IOOnm之间。 In one non-limiting embodiment, the thickness of the layer may be from about I to about IOOnm. 层117可以包括各种材料,包括但不限于以下材料中的至少一种:IB族元素、IIIA族元素、VIA族元素、IA族元素(新体例:第I族)、任何前述元素的二元和/或多元合金、任何前述元素的固溶体、铜、铟、镓、硒、铜铟、铜镓、铟镓、钠、钠化合物、氟化钠、硫化钠铟、硒化铜、硫化铜、硒化铟、硫化铟、硒化镓、硫化镓、硒化铜铟、硫化铜铟、硒化铜镓、硫化铜镓、硒化铟镓、硫化铟镓、硒化铜铟镓、和/或硫化铜铟镓。 Layer 117 may comprise various materials, including but not limited to at least one of the following materials: A Dual: (new style Group I), any of the aforementioned elements of group IB element, IIIA group elements, VIA group elements, IA elements and / or polyhydric alloy, a solid solution of any of the foregoing elements, copper, indium, gallium, selenium, copper, indium, copper, gallium, indium, gallium, sodium, a sodium compound, sodium fluoride, sodium sulfide, indium copper selenide, copper sulfide, selenide indium sulfide, indium, gallium selenide, gallium sulfide, copper indium diselenide, copper indium disulfide, copper selenide, gallium sulfide, copper, gallium, indium selenide, gallium sulfide, indium gallium selenide, copper indium gallium, and / or sulfide copper indium gallium.

[0077] 在一个实施方案中,可以通过其它方式来形成前体层116,诸如但不限于蒸发、溅射、ALD等等。 [0077] In one embodiment, the precursor layer may be formed by other means 116, such as but not limited to evaporation, sputtering, the ALD and the like. 举例来说,前体层116可以是含铜、铟和镓的无氧化合物。 For example, the precursor compound layer 116 may be oxygen-free copper, indium and gallium. 如图2B-2C所示,施加热量117以便将前体层116烧结成IB-1IIA族化合物膜118。 As shown in FIG. 2B-2C, heat 117 is applied to the precursor layer 116 sintered compound IB-1IIA film 118. 可以例如在如上所述的快速热退火工艺中供应热量117。 For example, heat supply may be a rapid thermal annealing process 117 described above. 具体地说,可以将衬底112和前体层116从环境温度加热至约200°C与约600°C之间的平稳温度范围。 Specifically, the substrate 112 and the front layer 116 is heated from ambient temperature to a plateau temperature range of between about 200 ° C and about 600 ° C. 在约几分之一秒至约60分钟范围内的时间段内将温度保持在该平稳范围内,并随后降低温度。 From about one second to the range of a fraction of a period of about 60 minutes maintaining the temperature within the stable range, and then reduce the temperature.

[0078] 如图2D中所示,在前体层116上方形成含单质硫属元素颗粒的层120。 [0078] As shown in FIG. 2D, a layer 120 containing elemental chalcogen particles formed above the front layer 116. 举例但不失一般性地说,硫属元素的颗粒可以是硒、硫或碲的颗粒。 By way of example but without loss of generality that the chalcogen particles may be of selenium, sulfur or tellurium particles. 可以如上述制得这样的颗粒。 It can be prepared as described above such particles. 虽然不限于以下说明,层120中的硫属元素颗粒的尺寸可以在约I纳米与约25微米之间。 Although not limited to the following description, the chalcogenide layer 120 may be between about I nanometer and about 25 microns particle size of the element. 可以将硫属元素颗粒与溶剂、载体、分散剂等混合以制备适合于在前体层116上进行湿法沉积的油墨或糊料以形成层120。 Sulfur may be chalcogen particles with a solvent, a carrier, a dispersing agent were mixed to prepare suitable for wet ink or paste deposited on the layer 116 to form the front layer 120. 或者,可以制备硫属元素颗粒以便通过干法在衬底上进行沉积以形成层120。 Alternatively, particles may be prepared for chalcogen deposited on the substrate by a dry process to form a layer 120.

[0079] 如图2E所示,将热量119施加于前体层116和含硫属元素颗粒的层120以便将其加热至足以熔化硫属元素颗粒并使硫属元素颗粒与前体层116中的IB族元素和IIIA族元素反应的温度。 [0079] 2E, heat 119 is applied to the layer precursor layer 116, and a sulfur-containing chalcogen particles 120 so as to be heated to a sufficient to melt the chalcogen particles 116 and the particles with the chalcogen precursor layer the group IB element and the group IIIA elements of the reaction temperature. 可以例如在如上所述的快速热退火工艺中施加热量119。 119 may, for example application of heat in a rapid thermal annealing process described above. 如图2F所示,硫属元素颗粒与IB族元素和IIIA族元素的反应形成IB-1IIA族硫属化物化合物的化合物膜122。 2F, the reaction chalcogen with the group IB element particles and IIIA elements forming a Group IB-1IIA chalcogenide compound film 122 thereof. IB-1IIA族硫属化物化合物为CuzIrvxGaxSe2(1_y)Sy的形式,其中O彡x彡1、0彡y彡1、 Group IB-1IIA chalcogenide compound CuzIrvxGaxSe2 (1_y) in the form of Sy, wherein x O San San San 1,0 y San 1,

0.5 ^ z ^1.5o 0.5 ^ z ^ 1.5o

[0080] 仍然参照图2A-2F,应理解的是,还可以是将钠用于前体材料以改善所得到的膜的品质。 [0080] Still referring to FIGS. 2A-2F, it should be understood that the sodium may also be used for the precursor material to improve the quality of the resulting film. 在第一种方法中,如关于图2A和2B所述的,可以在前体层116上方和/或下方形成一个或多个含钠材料层。 In the first method, as described with respect to FIGS. 2A and 2B may be formed of one or more sodium-containing material layer 116 over the front and / or below the layer. 该形成可以通过溶液涂覆和/或其它技术而发生,所述其它技术诸如但不限于溅射、蒸发、CBD、电镀、溶胶-凝胶基涂覆、喷涂、化学气相沉积(CVD)、物理气相沉积(PVD)、原子层沉积(ALD)等等。 The forming may occur by solution coating and / or other techniques, other techniques such as but not limited to the sputtering, evaporation, CBD, electroplating, sol - gel matrix coating, spray coating, chemical vapor deposition (CVD), physical vapor deposition (PVD), atomic layer deposition (ALD) and the like.

[0081] 任选地,在第二种方法中,还可以通过对前体层116中的颗粒进行钠掺杂来将钠引入到叠层中。 [0081] Optionally, in the second method, also by the precursor layer 116 is doped with sodium particles to be introduced into the stack of sodium. 作为非限制性实例,前体层116中的硫属元素化物颗粒和/或其它颗粒可以是含纳材料,诸如但不限于:Cu_Na、In—Na> Ga-Na-, Cu-1n-Na-, Cu-Ga-Na-, In-Ga-Na-,Na-Seλ Cu_Se_Na、In_Se_Na、Ga_Se_Na、Cu_In_Se_Na、Cu_Ga_Se_Na、In_Ga_Se_Na、Cu_In_Ga_Se_Na、Na_S、Cu-S-Na、In_S_Na、Ga-S-Na、Cu_In_S_Na、Cu-Ga-S-Na、In_Ga_S_Na、和/或Cu-1n-Ga-S-Na。 By way of non-limiting example, the precursor layer 116 of chalcogenide particles and / or other particles may be a sodium-containing materials, such as but not limited to: Cu_Na, In-Na> Ga-Na-, Cu-1n-Na- , Cu-Ga-Na-, In-Ga-Na-, Na-Seλ Cu_Se_Na, In_Se_Na, Ga_Se_Na, Cu_In_Se_Na, Cu_Ga_Se_Na, In_Ga_Se_Na, Cu_In_Ga_Se_Na, Na_S, Cu-S-Na, In_S_Na, Ga-S-Na, Cu_In_S_Na, Cu-Ga-S-Na, In_Ga_S_Na, and / or Cu-1n-Ga-S-Na. 在本发明的一个实施方案中,硫属元素化物颗粒和/或其它颗粒中的钠的量可以是约I原子%或更少。 In one embodiment of the present invention, the chalcogenide particles and / or the amount of sodium in other chalcogenide particles may be from about I atomic% or less. 在另一实施方案中,钠的量可以是约0.5原子%或更少。 In another embodiment, the amount of sodium may be about 0.5 atomic% or less. 在又一实施方案中,钠的量可以是约0.1原子%或更少。 In yet another embodiment, the amount of sodium be about 0.1 atomic% or less. 应理解的是可以通过包括将进料材料与含钠材料和/或单质钠一起研磨在内的各种方法来制成掺杂颗粒和/或薄片。 It should be understood that the particles may be made of doped and / or sheet by various methods including the feed material and the sodium material / and or milled together, including elemental sodium.

[0082] 任选地,在第三方法中,可以将钠结合入到油墨本身中,不管颗粒的类型如何,纳米颗粒、微米薄片、和/或分散在油墨中的纳米薄片。 [0082] Optionally, in a third process, sodium can be incorporated into the ink itself, regardless of the type of particles, nanoparticles, microflakes, and / or nano-flakes dispersed in the ink. 作为非限制性实例,油墨可以包括颗粒(Na掺杂或未掺杂)和具有有机抗衡离子的钠化合物(诸如但不限于醋酸钠)和/或具有无机抗衡离子的钠化合物(诸如但不限于硫化钠)。 By way of non-limiting example, the ink may comprise particles (Na doped or undoped) organic compounds having a sodium counter ions (such as, but not limited to, sodium acetate) and / or inorganic compounds having a sodium counter-ion (such as, but not limited to, sodium sulfide). 应理解的是,添加到油墨中的钠化合物(作为单独的化合物)可以作为颗粒存在(例如纳米颗粒)或者溶解。 It should be understood that the sodium compound added to ink (as individual compounds) may be present as particles (e.g., nanoparticles) or dissolved. 钠可以是钠化合物的“聚集体”形式(例如分散的颗粒)和“分子溶解”形式。 Sodium may be in the form of "aggregate" sodium compound (e.g., the dispersed particles) and "molecular dissolution" form.

[0083] 上述三种方法均不是互相排斥的,可以单独地或以任何单一或多重组合应用以便向含前体材料的叠层提供所需的钠量。 [0083] The three methods are not mutually exclusive, may be used alone or in any combination of single or multiple applications to provide the desired amount of sodium-containing precursor to the laminate material. 另外,还可以将钠和/或含钠化合物添加到衬底(例如添加到钥靶中)。 Further, it may also be added sodium and / or sodium-containing compounds to a substrate (e.g., added to the target key). 而且,如果使用多个前体层(使用相同或不同材料),则可以在一层或多层前体层之间形成含钠层。 Further, if a plurality of precursor layers (the same or different materials), the sodium bearing layer can be formed between one or more precursor layers. 还应理解的是钠的来源不限于之前所列的那些材料。 It should also be understood that the source of sodium is not limited to those materials listed previously. 作为非限制性实例,基本上,质子被钠代替的任何去质子化醇类、任何去质子化有机和无机酸、(去质子化)酸的钠盐、(X、y、z、U、V 和w > O 的)NaxHySezSuTevOw、(x、y、z、u、和v > 0 的)NaxCuyInzGauOv、氢氧化钠、醋酸钠、以及下列酸的钠盐:丁酸、己酸、辛酸、癸酸、十二酸、十四酸、十六酸、9-十六碳烯酸、硬脂酸、9-十八碳烯酸、11-十八碳烯酸、9,12-十八碳二烯酸、9,12,15-十八碳三烯酸、和/或6,9,12-十八碳三烯酸。 As non-limiting examples, substantially, any deprotonated alcohols proton is replaced by sodium, any deprotonated organic and inorganic acids, (deprotonated) acid sodium salt, (X, y, z, U, V and w> O's) NaxHySezSuTevOw, (x, y, z, u, and v> 0's) NaxCuyInzGauOv, sodium hydroxide, sodium acetate, and sodium salts of the following acids: butyric acid, caproic acid, caprylic acid, capric acid, lauric acid, myristic acid, palmitic acid, 9-hexadecenoic acid, stearic acid, 9-octadecenoic acid, vaccenic acid, 9,12-octadecadienoic acid , 9,12,15-octadecatrienoic acid, and / or 6,9,12 octadecatrienoic acid.

[0084] 任选地,如图2F所示,还应理解的是可以在烧结或以另外方式处理前体层之后向经处理的硫属元素化物膜添加钠和/或钠化合物。 [0084] Optionally, as shown in FIG. 2F, can also be understood that after the sintering or otherwise treating the precursor film chalcogenide layer added sodium and / or sodium compound to the sulfur-treated. 本发明的此实施方案因而在CIGS形成之后使膜改性。 This embodiment of the present invention thus modifying the membrane after formation of CIGS. 利用钠,与晶界相关的载流子陷阱水平被降低,允许改善膜中的电子特性。 Using the sodium, the carrier traps associated with the level of the grain boundaries is reduced, allowing improvement in the electronic properties of the film. 各种诸如上文所列那些的含钠材料可以作为层132沉积到经处理的膜上并然后退火以处理CIGS膜。 Those listed above, such as the various sodium materials as layer 132 may be deposited onto the film and the treated film is then annealed to CIGS process.

[0085]另外,该钠材料可以与提供带隙展宽效果的其它元素结合。 [0085] Further, the material may be combined with the sodium other bandgap widening elements provide effect. 将实现此效果的两种元素包括镓和硫。 Will achieve this effect include two elements gallium and sulfur. 除钠之外,一种或多种这些元素的使用也可以进一步改善吸收层的品质。 In addition to sodium and one or more of these elements may be used to further improve the quality of the absorption layer. 诸如但不限于Na2S、NaInS2等钠化合物的使用向所述膜提供Na和S,并且可以使用退火例如但不限于RTA步骤来驱入以提供带隙不同于未改性CIGS层或膜的带隙的层。 Of Na2S, such as but not limited to, sodium compound NaInS2 Na and S to provide the film, and may be used, for example, but not limited to RTA anneal step to provide a drive-band gap different from the band gap of the CIGS layer or unmodified membrane layers.

[0086] 参照图2G,应理解的是,本发明的实施方案还与卷到卷制造相容。 [0086] Referring to FIG. 2G, it should be understood that the embodiments of the present invention is also compatible with roll-to-roll manufacturing. 具体地,在卷到卷制造系统200中,例如铝箔的柔性衬底201从供应卷202行进到缠绕卷204。 Specifically, in a reel to reel manufacturing system 200, for example, the flexible substrate 201 of the aluminum foil from the supply roll 202 traveling to the windup roll 204. 在供应卷与缠绕卷之间,衬底201通过多个涂布器206A、206B、206C,例如微凹辊和加热装置208A、208B、208C。 Between the supply roll and the winding roll, the substrate 201 206A, 206B, 206C, and roll heating means e.g. dimples 208A, 208B, 208C through a plurality of applicator. 如上所述,例如,每个涂布器沉积光伏器件活性层的不同层或子层。 As described above, for example, each applicator deposited layers or sublayers of different photovoltaic device active layer. 用加热器单元来使不同的子层退火。 Heater means to cause different sub-layer is annealed. 在图2G中描绘的实例中,涂布器206A和206B可以涂覆前体层(诸如前体层106或前体层116)的不同子层。 In the example depicted in FIG. 2G, the applicator 206A and 206B may be coated with the precursor layer (such as a precursor layer precursor layer 106 or 116) different sub-layers. 加热器单元208A和208B可以在沉积下一子层之前使每个子层退火。 Heater units 208A and 208B may each sub-layer is annealed prior to deposition of the next sub-layer. 或者,可以同时使两个子层退火。 Alternatively, the two sub-layers may be annealed simultaneously. 涂布器206C可以如上所述地涂覆含硫属元素颗粒的材料层。 206C applicator layer of coating material may be chalcogenide containing element particles as described above. 加热器单元208C如上所述地将硫属元素层和前体层加热。 The heater unit 208C as described above chalcogen layer and heating the precursor layer. 请注意,还可以沉积前体层(或子层),然后沉积含硫属元素的层并然后将所有三个层一起加热以形成用于光伏吸收层的IB-1IIA硫属元素化物化合物膜。 Note that, the precursor layer may also be deposited (or sub-layers), then the deposited layer containing chalcogen element and then heating all three layers together to form a sulfur IB-1IIA for a photovoltaic absorber layer metal chalcogenide compound film.

[0087] 可以修改印刷步骤的总数以构建具有微分渐变带隙的吸收层。 [0087] The total number of printing steps can be modified to construct a differential absorption layer having a graded band gap. 例如,可以印刷(并任选地在印刷步骤之间退火)另外的膜(第四、第五、第六等等)以便在吸收层中形成更加细分等级的带隙。 For example, it can be printed (and optionally annealed between printing steps) additional film (fourth, fifth, sixth, etc.) so as to form a band gap greater breakdown level in the absorber layer. 或者,还可以印刷较少的膜(例如双重印刷)以形成较少细分等级的带隙。 Alternatively, the film may be printed with less (e.g. double printing) to form a band gap smaller subdivision level.

[0088] 或者,如图2F所示,可以印刷多个层并在沉积下一层之前使其与硫属元素反应。 [0088] Alternatively, as shown in Figure 2F, a plurality of layers and may be printed before it with a layer of chalcogen deposited in the reaction. 一个非限制性实例是沉积Cu-1n-Ga层,将其退火,然后沉积Se层,并随后用RTA来处理它,其后沉积富含Ga的另一前体层134,并继之以由第二RTA处理结束的Se层136的另一沉积。 A non-limiting example is the deposition of Cu-1n-Ga layer, which is annealed, followed by deposition of Se layer, and then it is treated with RTA, deposition followed by a further enriched Ga precursor layer 134, and followed by the the second RTA treatment ended Se layer 136 of another deposition. 本实施方案可以具有或可以不具有层132,在不具有层132的情况下,层134将直接位于层122上。 This embodiment may or may not have a layer 132, layer 132 having a case, the layer 134 directly positioned on the layer 122 is not. 更具体地说,该方法的一个实施方案包括沉积前体层、将其退火、沉积非氧硫属元素层、用RTA处理所述组合、在现有层上(可能用不同于第一前体层中那些材料的前体材料)形成至少第二前体层、沉积另一非氧硫属元素层、并用RTA处理所述组合。 More specifically, one embodiment of the method involves depositing a layer, which is annealed, non-oxygen chalcogen deposited layer, the RTA treatment with the combination, on an existing layer (which may be different from the first precursor those material layer precursor material) forming at least a second precursor layer, depositing a further layer of non-oxygen chalcogen, and the combined treatment with RTA. 可以重复此顺序以构造多组前体层或前体层/硫属元素层组合(取决于在每个层之后是否使用加热步骤)。 This sequence may be repeated to construct a layer or a plurality of sets of precursor precursor layer / chalcogen layer composition (depending on whether the heating step after each layer).

[0089] 如上所述制造的化合物膜110、122可以充当光伏器件中的吸收层。 [0089] The absorbent layer compound film 110, 122 fabricated as described above may serve as a photovoltaic device. 图3中示出了这样的光伏器件300的实例。 FIG. 3 shows an example of such a photovoltaic device 300. 器件300包括基层衬底302、任选的粘附层303、基底电极304、并入上述类型的化合物膜的吸收层306、窗口层308和透明电极310。 Device 300 includes a base substrate 302, an optional adhesive layer 303, substrate electrode 304, incorporated into the absorbent layer compound film 306 of the type described above, the window layer 308 and the transparent electrode 310. 举例来说,基层衬底302可以由以下材料制成:金属箔,聚合物例如聚酰亚胺(PI)、聚酰胺、聚醚醚酮(PEEK)、聚醚砜(PES)、聚醚酰亚胺(PEI)、聚萘二甲酸乙二醇酯(PEN)、聚酯(PET),相关聚合物,或金属化塑料。 For example, the base substrate 302 may be made of the following materials: a metal foil, a polymer such as polyimide (PI), polyamides, polyether ether ketone (PEEK), polyether sulfone (PES), polyetherimide imine (PEI), polyethylene terephthalate polyethylene naphthalate (PEN), polyester (PET), related polymers, or metallized plastic. 基底电极304由导电材料制成。 Base electrode 304 made of conductive material. 举例来说,基底电极304可以由金属层构成,该金属层的厚度可以选自约0.1微米至约25微米的范围。 For example, the substrate 304 may be made of a metal electrode layer, the thickness of the metal layer may be selected from the range from about 0.1 microns to about 25 microns. 可以在电极304与衬底302之间并入任选的中间层303。 Optionally may be incorporated in the substrate 302 between the electrode 304 and the intermediate layer 303. 任选地,层303可以是扩散阻挡层以防止衬底302与电极304之间的材料扩散。 Optionally, the layer 303 may be a diffusion barrier to prevent the material between the substrate 302 and the electrode 304 diffusion. 扩散阻挡层303可以是导电层,或者其可以是非导电层。 A diffusion barrier layer 303 may be a conductive layer, or it may be a non-conductive layer. 作为非限制性实例,层303可以由多种材料中的任何材料组成,包括但不限于铬、钒、钨和玻璃,或诸如氮化物(包括氮化钽、氮化钨、氮化钛、氮化硅、氮化锆、和/或氮化铪)、氧化物、碳化物的化合物、和/或任何前述材料的单一或多重组合。 By way of non-limiting example, layer 303 may be formed from any of a variety of materials, including but not limited to chromium, vanadium, tungsten, and glass, or compounds such as nitrides (including tantalum nitride, tungsten nitride, titanium nitride, silicon, zirconium nitride, and / or hafnium nitride), oxides, carbides compound, and / or any single or multiple combinations of the foregoing materials. 虽然不限于以下说明,但该层厚度的范围是IOOnm至500nm。 Although not limited to the following description, the range of the layer thickness is IOOnm to 500nm. 在一些实施方案中,该层可以是从IOOnm至300nm。 In some embodiments, the layer may be from IOOnm to 300nm. 任选地,该厚度可以在约150nm至约250nm的范围内。 Optionally, the thickness may range from about 150nm to about 250nm is. 任选地,该厚度可以是约200nm。 Optionally, the thickness may be about 200nm. 在一些实施方案中,可以使用两个阻挡层,衬底302的每侧各一个。 In some embodiments, two barrier layers may be used, one on each side 302 of the substrate. 任选地,界面层可以位于电极304之上,并且其由诸如包括但不限于以下的材料制成:铬、钒、钨和玻璃或诸如氮化物(包括氮化钽、氮化钨、氮化钛、氮化硅、氮化锆、和/或氮化铪)、氧化物、碳化物的化合物、和/或前述材料的任何单一或多重组合。 Optionally, the interface layer may be positioned on the electrode 304, and which consists of such include, but are not limited to, materials made of: chromium, vanadium, tungsten, and glass, or compounds such as nitrides (including tantalum nitride, tungsten nitride, titanium, silicon nitride, zirconium nitride, and / or hafnium nitride), compound oxides, carbides, and / or any single or multiple combinations of the foregoing materials.

[0090] 透明电极310可以包括透明导电层309和金属(例如Al、Ag或Ni)指状物311以降低薄层电阻。 [0090] Transparent electrode 310 may include a transparent conductive layer 309 and a metal (e.g. Al, Ag, or Ni) fingers 311 to reduce sheet resistance. 窗口层308充当化合物膜与透明导电层309之间的结配对。 The window layer 308 acts as a junction partner between the compound film and the transparent conductive layer 309. 举例来说,窗口层308 (有时称为结配对层)可以包括诸如硫化镉(CdS)、硫化锌(ZnS)、氢氧化锌、硒化锌(ZnSe)的无机材料,η型有机材料,或两种或更多这些或类似材料的一些组合,或诸如η型聚合物和/或小分子的有机材料。 For example, the window layer 308 (sometimes referred to as a junction partner layer) may include such as cadmium sulfide (CdS), zinc sulfide (of ZnS), zinc hydroxide, zinc selenide (ZnSe) of inorganic material, organic material, [eta], or Two or more organic material, some combination of these or similar materials, or such, and / or small molecules η polymer. 可以通过化学浴沉积(CBD)或化学表面沉积来沉积这些材料的层至约2nm至约lOOOnm、更优选地约5nm至约500nm、最优选地约IOnm至约300nm的范围内的厚度。 Layer can be deposited to about 2nm to about lOOOnm these materials by chemical bath deposition (CBD) or chemical surface deposition, more preferably from about 5nm to about 500 nm, most preferably in the range of from about IOnm to a thickness of about 300nm.

[0091] 透明导电层309可以是无机物,例如诸如铟锡氧化物(ITO)、氟化的铟锡氧化物、氧化锌(ZnO)或铝掺杂氧化锌、或相关材料的透明导电氧化物(TCO),其可以使用多种手段中的任何手段来沉积,这些手段包括但不限于溅射、蒸发、化学气相沉积(CVD)、物理气相沉积(PVD)、原子层沉积(ALD)等等。 [0091] The transparent conductive layer 309 may be inorganic, for example, such as indium tin oxide (ITO), fluorinated tin oxide, indium zinc oxide (ZnO) or aluminum doped zinc oxide, or a transparent conductive oxide material related (the TCO), which may use any means to deposit a variety of means, these means include, but are not limited to sputtering, evaporation, chemical vapor deposition (CVD), physical vapor deposition (PVD), atomic layer deposition (ALD), etc. . 或者,透明导电层可以包括透明导电聚合物层,例如以下材料的透明层:掺杂PEDOT (聚3,4-乙烯二氧噻吩)、碳纳米管或相关结构、或其它透明有机材料,以单一或组合形式,可以使用旋涂、浸涂或喷涂等等或使用各种气相沉积技术中的任何技术来沉积所述透明导电层。 Alternatively, the transparent conductive layer may include a transparent conductive polymeric layer, a transparent layer of the following materials: doped of PEDOT (poly 3,4-ethylene dioxythiophene), carbon nanotubes or related structures, or other transparent organic material, a single or in combination, may be used spin coating, dipping or spraying or the like using any of a variety of vapor deposition techniques to deposit the transparent conductive layer. 任选地,应理解的是可以在CdS与Al掺杂ZnO之间使用本征(非导电)1-ZnO。 Optionally, it should be appreciated that the use of 1-ZnO doped with an intrinsic (non-conductive) between the CdS and ZnO Al. 任选地,可以在层308与透明导电层309之间包括绝缘层。 Optionally, it may include an insulating layer between the layer 308 and the transparent conductive layer 309. 还可以使用无机和有机材料的组合来形成杂合透明导电层。 It may also be formed a transparent conductive layer using a hybrid combination of inorganic and organic materials. 例如共同转让的美国专利申请公开号20040187917中描述了这样的透明导电层的实例,其通过引用而并入本文。 For example, commonly assigned U.S. Patent Application Publication No. 20040187917 describes examples of such a transparent conductive layer, which is incorporated herein by reference.

[0092] 本领域的技术人员将能够设计这些教导内容范围内的以上实施方案的变体。 [0092] Those skilled in the art will be able to devise variations of these teachings of the above embodiments within the scope. 例如,注意在本发明的实施方案中,可以使用除纳米细粒基油墨之外的技术来沉积IB-1IIA前体层(或前体层的某些子层)。 For example, note that in the embodiment of the present invention may be used in addition to nano-technology-based inks deposited fine IB-1IIA precursor layer (or some sub-layer precursor layer). 例如,使用各种替代沉积技术中的任何技术来沉积前体层或组分子层,所述技术包括但不限于气相沉积技术诸如ALD、蒸发、溅射、CVD、PVD、电镀等。 For example, using any of the techniques, various alternative deposition techniques to deposit the precursor layer or a molecular layer group, including but not limited to the vapor deposition techniques such as ALD, evaporation, sputtering, CVD, PVD, plating or the like.

[0093] 通过使用布置在IB-1IIA前体膜之上的细粒硫属元素层,可以避免慢而昂贵的真空沉积步骤(例如蒸发、溅射)。 Vacuum deposition step [0093] By using the metal element layer disposed over the fine sulfur IB-1IIA precursor film, to avoid the slow and expensive (e.g. evaporation, sputtering). 本发明的实施方案因此可以影响一般与印刷技术且特别地与卷到卷印刷技术相关的规模经济性。 Embodiment of the present invention can thus affect generally and in particular with the printing roll to roll printing techniques associated economies of scale. 这样,可以快速、廉价并且以高生产量制造光伏器件。 This allows for rapid, inexpensive and manufacturing a photovoltaic device with high throughput.

[0094] 现在参照图4A,还应理解的是还可以在刚性衬底1100上使用本发明的实施方案。 [0094] Referring now to Figure 4A, also to be understood that the embodiment may also be used in the embodiment of the present invention on a rigid substrate 1100. 作为非限制性实例,刚性衬底1100可以是玻璃、太阳能玻璃、低铁玻璃、钠钙玻璃、钢、不锈钢、铝、聚合物、陶瓷、涂覆聚合物、或适合于用作太阳能电池或太阳能组件衬底的其它刚性材料。 By way of non-limiting example, the rigid substrate 1100 may be glass, solar glass, low iron glass, soda lime glass, steel, stainless steel, aluminum, polymer, ceramic, polymer coating, or suitable for use as a solar cell or solar other rigid material component of the substrate. 可以用高速拾放机器人1102来将刚性衬底1100从叠层或其它存储区域移动到处理区域上。 It can be a high-speed pick and place robot 1102 to move from the rigid laminated substrate 1100 or other storage area to the treatment area. 在图4A中,将衬底1100放置在输送带上,该输送带随后将它们传送穿过各种处理室。 In FIG. 4A, the substrate 1100 is placed on a conveyor belt which then transmits them through the various processing chambers. 任选地,这时衬底1100可能已经历一些处理并且已在衬底1100上包括前体层。 Optionally, the substrate 1100 at this time may have been subjected to some processing and comprises a precursor layer on a substrate 1100. 本发明的一些实施方案可以在衬底1100穿过室1106时形成前体层。 Some embodiments of the precursor layer of the present invention may be formed when the substrate 1100 through the chamber 1106. 在一个实施方案中,可以通过使用具有在其中或与该室连接的硫属元素源1062的部分或完全封闭的腔室来提供此硫属元素蒸气。 In one embodiment, it is possible to provide this by using a chalcogen or a portion of the sulfur vapor in which the chamber is connected with the metal element source 1062 or completely closed chamber. 在使用更敞开室的另一实施方案中,可以通过供应产生硫属元素蒸气的源来提供硫属元素气氛。 In another embodiment, the use of a more open chamber, may be provided chalcogen atmosphere chalcogen vapor generating source through the supply. 硫属元素蒸气可以帮助将硫属元素保持在膜中。 Chalcogen vapor may help chalcogen remains in the film. 这样,可以使用或可以不使用硫属元素蒸气来提供过量硫属元素。 Thus, use may or may not be provided chalcogen vapor excess chalcogen. 其可以更多用于保持膜中存在的硫属元素而不是向该膜提供更多的硫属元素。 Which may be used to hold more chalcogen film is not present in the membrane to provide more chalcogen. 暴露于硫属元素蒸气可以在非真空环境中发生。 Exposure to chalcogen vapor can occur in a non-vacuum environment. 暴露于硫属元素蒸气可以在大气压力下发生。 Exposure to chalcogen vapor may take place at atmospheric pressure. 这些条件可以适用于本文所述的任何实施方案。 These conditions can apply to any of the embodiments described herein.

[0095] 图4B示出了本系统的另一实施方案,其中,使用拾放机器人1110来将多个刚性衬底放置在载体装置1112上,该载体装置随后如箭头1114所指移动到处理区域。 [0095] FIG 4B shows another embodiment of the present system, wherein, using a pick and place robot 1110 to a plurality of the rigid substrate is placed on the support 1112, the support means is then moved as indicated by arrow 1114 to the processing region . 这允许多个衬底1100在它们一起全部移动之前被加载以经历处理。 This allows a plurality of substrates 1100 are loaded to undergo treatment before they are moved all together.

[0096] 虽然已参照某些特定实施方案描述和说明了本发明,但本领域的技术人员将认识到可以在不脱离本发明的精神和范围的情况下进行工艺和规程的各种调整、改变、改进、替换、省略或添加。 Various adjustments [0096] While the embodiment has been described with reference to certain specific embodiments of the present invention and described, those skilled in the art will recognize that the processes and procedures can be made without departing from the spirit and scope of the present invention, changes , modifications, substitutions, omissions or additions. 例如,对于任何以上实施方案,应理解的是任何以上颗粒可以是球形、椭球状、或其它形状。 For example, for any of the above embodiments, it should be understood that any of the above particles may be spherical, ellipsoid, or other shape. 对于任何以上实施方案,应理解的是可以根据需要将硫属元素源的印刷层和核壳颗粒组合以提供过量的硫属元素。 For any of the above embodiments, it may be understood to provide excess chalcogen composition as needed source of chalcogen printed layer and the core-shell particles. 硫属元素源的层可以在含核壳颗粒的层之上、之下或与之混合。 Source layer chalcogen-containing layer may be above the core-shell particles, or mixed under. 用任何以上实施方案,应理解的是可以将诸如但不限于硒的硫属元素添加到单质和非硫属元素合金前体层顶部或下方。 With any of the above embodiments, it should be understood that may be but not limited to selenium chalcogen elements to elemental sulfur and non-metal elements in the top or below the alloy precursor layer. 任选地,此前体层中的材料是无氧或基本上无氧的。 Optionally, this precursor material is a layer of oxygen-free or substantially oxygen-free.

[0097] 此外,本文中可能以范围形式提及浓度、量和其它数值数据。 [0097] Further, herein may be mentioned concentrations, amounts, and other numerical data in a range format. 应当清楚这种范围形式的使用只是为方便和简洁,并且应灵活地解释为不仅包括作为所述范围界限明确提到的数值,而且还包括所述范围内包含的所有个别数值或子范围,如同每个数值和子范围皆是明确举出的。 It should be clear that such a range format is used merely for convenience and brevity and should be interpreted flexibly to include not only the numerical limits of the range as explicitly mentioned, but also to include all the individual numerical values ​​or sub-ranges included within said range, as each numerical value and sub-range is explicitly cited are. 例如,约Inm到约200nm的尺寸范围应解释为不仅包括明确举出的Inm和约200nm的界限,而且还包括个别的尺寸例如但不限于2nm、3nm、4nm等,以及子范围如IOnm至50nm、20nm 至IOOnm 等。 For example, a size range from about Inm to about 200nm should be interpreted to include not only the explicitly limits include Inm about 200nm, but also include individual sizes such as but not limited to, 2nm, 3nm, 4nm, etc., and sub-ranges such as 50 nm to IOnm, 20nm to IOOnm and so on.

[0098] 此处所讨论或引用的文献仅由于它们的公开在本申请的提交日期之前。 [0098] documents discussed or cited herein disclosed merely by virtue of their prior date of filing of the present application. 这里不应解释为承认本发明没有资格通过在先发明先于这些文献。 Herein should not be construed as an admission that the present inventors are not entitled to antedate such disclosure by prior documents. 此外,提供的公开日期可能与实际公开日期有所不同,这需要独立证实。 In addition, the dates of publication provided may be different from the actual publication dates, which requires independent confirmation. 通过引用将提及的所有文献并入本文,以便公开和描述与所提及文献有关的结构和/或方法。 All documents are incorporated herein by reference in the mentioned order structures and / or methods are disclosed and described in the relevant literature mentioned.

[0099] 现在参照图5,现在将描述本发明的又一实施方案。 [0099] Referring now to Figure 5, yet another embodiment of the present invention will now be described. 在一个实施方案中,用来形成前体层500的颗粒可以包括为金属间颗粒502的颗粒。 In one embodiment, the precursor particles used to form layer 500 may include particles 502 to the intermetallic particles. 在一个实施方案中,金属间材料是含至少两种元素的材料,其中,金属间材料中一种元素的量小于金属间材料的总摩尔量和/或前体材料中该种元素的总摩尔量的约50摩尔百分比。 In one embodiment, the intermetallic material is a material containing at least two elements, wherein the inter-metallic element is less than the total amount of one molar total molar amount of intermetallic material and / or a precursor material of the elements an amount of about 50 mole percent. 第二元素的量是可变的,并且可以在金属间材料的和/或前体材料中该种元素的总摩尔量的小于约50摩尔百分比至约50或以上摩尔百分比的范围内。 Amount of the second element is variable, and may be the total molar amount of an intermetallic material and / or a precursor material of the elements is less than about 50 mole percent to about 50 mole percent of the above or range. 或者,金属间相材料可以由两种或更多种金属组成,其中,以端际固溶体的上限与包含50%的金属间材料中元素之一的合金之间的比率混合该材料。 Alternatively, an intermetallic phase material may be formed from two or more metals, wherein the upper limit of terminal solid solution with the material comprising the mixing ratio between the alloy material of one of the elements among 50% of the metal. 图5的放大图中所示的颗粒分布纯粹是示范性的并且是非限制性的。 As shown in FIG. 5 enlarged particle distribution in the purely non-limiting and exemplary. 应理解的是,一些实施方案可以具有全部含金属间材料的颗粒、金属和金属间材料的混合物的颗粒、金属颗粒和金属间颗粒、或其组合。 It should be understood that some embodiments may have all of the inter-metal-containing particulate material, mixture of particles and intermetallic material, a metal, intermetallic and metal particles, or a combination thereof.

[0100] 应理解的是金属间相材料可以是含两种或更多种金属的化合物和/或中间固溶体,其具有不同于纯金属或端际固溶体的特征性质和晶体结构。 [0100] It should be understood that the intermetallic phase material may be a compound containing two or more metals and / or the intermediate solid solution having the crystal structure and characteristic properties different from the pure metal or the terminal solid solution. 金属间相材料源于一种材料经由因缺陷、污染、杂质、晶界和机械应力而变得可用的晶格空位到另一材料中的扩散。 Intermetallic phase material through defects due to contamination, impurities, grain boundary diffusion and mechanical stresses become available vacancies into another material from one material. 在两种或更多种金属扩散到彼此之中时,产生作为两种材料的组合的中间金属物种。 When two or more metals diffuse into one another, to produce an intermediate metal species as a combination of two materials. 金属间化合物的子类包括电子和间隙化合物。 Subclass intermetallic compound include electron and interstitial compounds.

[0101] 如果两种或更多种混合金属相对于彼此具有不同的晶体结构、价态或正电性,则出现电子化合物;实例包括但不限于硒化铜、硒化镓、硒化铟、碲化铜、碲化镓、碲化铟、以及类似和/或有关的材料和/或这些材料的共混物或混合物。 [0101] If two or more mixed metal have mutually different with respect to the crystal structure, valence, or positively charged, electron-accepting compound occurs; examples include, but are not limited to, indium selenide copper selenide, gallium selenide,, copper telluride, gallium telluride, indium telluride, and and / or related materials and / or blends or mixtures of these materials are similar.

[0102] 间隙化合物源于金属或金属与非金属元素的混合物,其具有足够类似以至允许形成间隙式晶体结构的原子尺寸,该结构中一种材料的原子适合于另一种材料的原子之间的空隙。 [0102] interstitial compounds derived from a mixture of metal or metal and non-metallic elements, which have sufficiently similar between the size of the gaps to the passage of the atoms forming the crystal structure of the atomic structure of a material suitable for another material atoms void. 对于其中每种材料具有单晶相的金属间材料,两种材料通常表现出叠加到相同的谱上的两个衍射峰,每个表示每一种材料。 For each material wherein the single crystalline phase having an intermetallic material, the two materials typically exhibit the same two superimposed on the spectrum of the diffraction peaks, each representing each material. 这样,金属间化合物通常含同一体积所含有的两种材料的晶体结构。 Thus, the intermetallic compound having a crystal structure is generally the same volume of the two materials contained. 实例包括但不限于Cu-Ga、Cu-1n、及类似和/或相关材料和/或这些材料的共混物或混合物,其中,每种元素与另一种元素的组成比将该材料置于端际固溶体之外的其相图区域中。 Examples include, but are not limited to, Cu-Ga, Cu-1n, and the like, and / or related materials and / or blends or mixtures of these materials, wherein the composition of each element to another element is placed over the material FIG occasion relative end region outside the solid solution.

[0103] 金属间材料可用于形成CIGS光伏器件的前体材料,因为金属在相互之间以高度同质和均匀的方式相互散布,并且每种材料以相对于另一种材料基本类似的量存在,由此允许快速反应动力学,这产生高品质的吸收膜,该吸收膜在全部三个维度上和纳米、微米、以及介观尺度上基本均匀的。 [0103] an intermetallic material may be a precursor material for forming a CIGS photovoltaic device, because the metal between each other in a highly homogenous and uniform dispersion of each other, and each material relative to a substantially similar amount of another material present , thereby allowing rapid reaction kinetics, which produces high-quality absorbing film, the absorber film and in all three dimensions of nanometers, micrometers, and the dimensions of the mesoscopic substantially uniform.

[0104] 缺少难以合成和处理的铟纳米颗粒的添加时,端际固溶体不容易允许充分大范围的前体材料以正确的比率(例如Cu/(In+Ga) =0.85)并入前体膜中使得可供形成高度吸收光的光活性吸收层。 [0104] In the absence of added difficult synthesis and handling indium nanoparticles, terminal solid solution is not easily allow a sufficiently large range of the precursor material in the correct ratio (e.g. Cu / (In + Ga) = 0.85) is incorporated precursor film such that for forming the light absorbing layer is highly active absorbing light. 此外,端际固溶体可以具有不同于金属间材料和/或中间固溶体(端际固溶体和/或单质之间的固溶体)的机械特性。 In addition, having a terminal solid solution can be different from the inter-metallic materials and / or intermediate solid solution (solid solution between the terminal solid solution and / or elemental) mechanical properties. 作为非限制性实例,一些端际固溶体的脆性可能不足用于进行粉碎用研磨。 By way of non-limiting example, some of the brittleness terminal solid solution may be insufficient for pulverization by grinding. 其它实施方案也可能太坚硬而无法研磨。 Other embodiments may be too hard and not abrasive. 金属间材料和/或中间固溶体的使用可以解决这些缺点中的一些。 Intermetallic materials used and / or the intermediate solid solution can address some of these disadvantages.

[0105] 具有金属间相的颗粒502的优点是多方面的。 [0105] advantage of having the metal particles 502 are multiple phases. 作为非限制性实例,适合于在薄膜太阳能电池中使用的前体材料可以含IB族和IIIA族元素,分别例如铜和铟。 As non-limiting examples, the precursor material suitable for use in the thin film solar cell may contain Group IB and Group IIIA elements, such as copper and indium, respectively. 如果使用诸如Cu1In2的Cu-1n的金属间相,则铟是富In的Cu材料的一部分并且不作为纯铟来添加。 If such an intermetallic phase Cu1In2 the Cu-1n, the indium material is Cu and In-rich portion not be added as pure indium. 由于实现具有高收率、小和窄的纳米颗粒尺寸分布的In颗粒合成方面的困难以及需要增加更多成本的颗粒尺寸判别,因而添加纯铟作为金属颗粒具有挑战性。 In difficult to achieve due to the particle synthesis with high yield, a small and narrow size distribution of nanoparticles need to add more terms of cost and particle size judgment, and thus the metal particles are added as pure indium challenging. 使用金属间富In的Cu颗粒避免纯单质In作为前体材料。 In use of the Cu-rich intermetallic particles avoid pure elemental In as a precursor material. 另外,由于该金属间材料贫Cu,这也有利地允许单独地添加Cu以便精确地实现前体材料中所需的Cu量。 Further, since the lean Cu intermetallic material, which also advantageously allows a single addition of Cu in order to accurately Cu content required to achieve the precursor material. Cu不依赖于可以由Cu和In形成的合金或固溶体中固定的比率。 Cu ratio may be fixed without depending on an alloy or solid solution formed of Cu and In. 金属间材料和Cu的量可以根据需要来精细调节以达到所需的化学计量比。 And the amount of Cu intermetallic material may be finely adjusted to achieve the desired stoichiometric ratio needed. 这些颗粒的球磨导致不需要颗粒尺寸判别,这降低了成本并改善了材料生产工艺的生产量。 Milling these particles cause unwanted particle size judgment, which reduces production costs and improves the production process the material.

[0106] 在本发明的一些特定实施方案中,具有金属间材料提供更宽范围的灵活性。 [0106] In some particular embodiments of the invention, the flexibility to provide a wider range of the intermetallic material. 由于难以经济地制造单质铟颗粒,所以具有经济上更引人注意的铟源是有利的。 Since it is difficult to economically manufacture elemental indium particles, and therefore have a more noticeable indium source is economically advantageous. 另外,如果该铟源还允许层中的Cu/(In+Ga)和Ga/(In+Ga)相互独立地改变,则将是有利的。 Furthermore, if the indium source allows the Cu layer / (In + Ga) and Ga / (In + Ga) independently varied, it would be advantageous. 作为一个非限制性实例,可以用金属间相在Cu11In9与Cu1In2之间进行区别。 As a non-limiting example, can distinguish between Cu11In9 phase and the intermetallic Cu1In2 used. 如果只使用一层前体材料,则特别如此。 If only one layer of precursor material is particularly so. 对于此特定实例,如果仅由Cu11In9来提供铟,则存在更多对最终IB-1IIA-VIA族化合物中可以产生的化学计量比的限制。 For this particular example, if indium is provided only by the Cu11In9, more restriction stoichiometric final IB-1IIA-VIA compound may be produced than is present. 但是,用Cu1In2作为唯一铟源,在最终IB-1IIA-VIA族化合物中可以产生的大得多的比率范围。 However, as the only Cu1In2 with the indium source, it can be produced in the final Group IB-1IIA-VIA compound a much greater range of ratios. Cu1In2允许在宽范围内独立地改变Cu/ (In+Ga)和Ga/ (In+Ga),而Cu11In9 不能。 Cu1In2 allows independent changes Cu / (In + Ga) and Ga / (In + Ga) within a wide range, but not Cu11In9. 例如,Cu11In9R允许在Cu/ (In+Ga) >0.92的情况下Ga/(In+Ga) = 0.25。 For example, Cu11In9R allowing Cu / (In + Ga)> Ga / (In + Ga) = 0.25 in the case of 0.92. 还有另一个实例,Cu11In9仅允许在Cu/(In+Ga) >0.98的情况下Ga/(In+Ga) = 0.20。 Yet another example, Cu11In9 allowed only Cu / (In + Ga)> 0.98 in the case of Ga / (In + Ga) = 0.20. 还有另一个实例,Cu11In9仅允许在Cu/(In+Ga) >1.04的情况下Ga/(In+Ga) =0.15。 Yet another example, Cu11In9 allowed only Cu / (In + Ga)> 1.04 in the case of Ga / (In + Ga) = 0.15. 因此,对于金属间材料,特别是当金属间材料是最终化合物中的元素之一的唯一来源时,可以产生具有以下化学计量比的最终化合物,该化学计量比更广泛地探索具有约0.7至约1.0的组成范围的Cu/(In+Ga)、和具有约0.05至约0.3的组成范围的Ga/(In+Ga)的极限。 Thus, for intermetallic materials, in particular when the intermetallic material is the sole source of one of the elements when the final compound, the following compounds can be produced a final stoichiometric ratio, the stoichiometric ratio of about 0.7 to about wider Exploration composition range 1.0 Cu / (in + Ga), Ga and having a composition range of from about 0.05 to about 0.3 a / (in + Ga) limit. 在其它实施方案中,Cu/(In+Ga)组成范围可以是约0.01至约1.0。 In other embodiments, Cu / (In + Ga) composition can range from about 0.01 to about 1.0. 在其它实施方案中,Cu/(In+Ga)组成范围可以是约0.0l至约1.1。 In other embodiments, Cu / (In + Ga) composition can range from about 0.0l to about 1.1. 在其它实施方案中,Cu/(In+Ga)组成范围可以是约0.01至约1.5。 In other embodiments, Cu / (In + Ga) composition can range from about 0.01 to about 1.5. 这通常产生额外的CuxSey,如果其在顶面,则可能在之后将其去除。 This typically produces additional CuxSey, if the top surface thereof, may then be removed.

[0107] 此外,应理解的是在处理期间,金属间材料可以比其它化合物产生更多的液体。 [0107] Further, it should be understood that during processing, the material may produce more liquid than other intermetallic compounds. 作为非限制性实例,Cu1In2将在处理期间被加热时比Cu11In9形成更多的液体。 By way of non-limiting example, Cu1In2 more fluid than Cu11In9 formed is heated during processing. 更多的液体促进更多的原子混合,因为材料在处于液态时更易于移动和混合。 More liquid mixing to promote more atoms, since the material when in the liquid state and mixing more mobile.

[0108] 另外,对于诸如但不限于Cu1In2的特殊类型金属间颗粒,还存在特定优点。 [0108] Further, for the particular type of metal among but not limited to Cu1In2 particles, there is particular advantage. Cu1In2是亚稳定材料。 Cu1In2 metastable material. 该材料更易于分解,对于本发明,这将有利地增加反应速率(动力学地)。 The material is more easily decomposed, with the present invention, which will advantageously increase the reaction rate (kinetics ground). 此外,该材料较不易于氧化(例如与纯In相比),并且这进一步简化处理。 In addition, the material is less susceptible to oxidation (e.g., as compared to pure In), and which further simplifies handling. 这种材料也可以是单相的,这将使其作为前体材料更加均匀,产生更好的收率。 This material may be a single phase, which would make it more uniform as a precursor material, resulting in better yields.

[0109] 如图6和7中所示,在将层500沉积在衬底506上之后,可以随后在适当的气氛中将其加热以便与图6中的层500反应并形成图7中所示的膜510。 As shown in Figure [0109] 6 and 7, after the layer 500 is deposited on the substrate 506, may then in a suitable atmosphere and heated to the reaction layer 500 in FIG. 6 and FIG. 7 is formed in FIG. the film 510. 应理解的是如上关于图2A和2B所述的,层500可以与层113和115结合使用。 It should be understood that the described above with respect to FIGS. 2A and 2B, the layer 500 may be used in conjunction with layers 113 and 115. 层113可以由各种材料组成,包括但不限于以下各项中的至少一种:IB族元素、IIIA族元素、VIA族元素、IA族元素(新体例:第I族)、任何前述元素的二元和/或多元合金、任何前述元素的固溶体。 Layer 113 may be composed of various materials, including but not limited to at least one of the following: IB group elements, IIIA group elements, VIA group elements, IA group elements (new style: Group I), any of the aforementioned elements di- and / or polyhydric alloy, a solid solution of any of the foregoing elements. 应理解的是诸如但不限于钠、钠化合物、氟化钠、和/或硫化钠铟的钠或钠基材料也可以用于层113中与前体材料一起改善所得膜的品质。 It should be understood, such as, but not limited to, sodium compound, sodium fluoride, and / or indium sulfide or sodium-based material layer 113 may also be used with the precursor material together improve the quality of the resulting film. 图7显示也可以如关于图2F所示地使用层132。 Figure 7 shows the FIG. 2F may be as described with respect to using layer 132 as shown. 关于钠含量的前面所建议的任何方法也可以适合用于图5-7中所示的实施方案。 Any of the methods previously proposed on sodium content may also be suitable for use in the embodiment shown in Figures 5-7.

[0110] 应理解的是本发明的其它实施方案还公开了包含至少两种元素的材料,其中该材料中至少一种元素的量小于前体材料中该元素的总摩尔量的约50摩尔百分比。 [0110] It should be understood that other embodiments of the present invention also discloses a material comprising at least two elements, wherein the amount of the material is at least one element is less than about 50 mole percent of the total molar amount of the precursor material of the element . 这包括其中IB族元素的量小于金属间材料中IIIA族元素的量的实施方案。 This includes embodiments where the amount of the Group IB element is less than the amount of embodiment IIIA elements intermetallic materials. 作为非限制性实例,这可以包括诸如贫Cu的CuxIny颗粒的其它贫IB族的IB-1IIA族材料(其中x〈y)。 As non-limiting examples, it may include other lean Group IB material such as a Group IB-1IIA CuxIny depleted of Cu particles (where x <y). IIIA族材料的量可以在任何需要范围内(超过前体材料中该元素的约50摩尔百分比或小于50摩尔百分比)。 The amount of Group IIIA material may be in any desired range (over the precursor material to about 50 mole percent or less of the element 50 mole percent). 在另一非限制性实例中,Cu1Ga2可以与单质Cu和单质In—起使用。 In another non-limiting example, Cu1Ga2 may be used with elemental Cu and elemental In- together. 虽然此材料不是金属间材料,但此材料是中间固溶体并且不同于端际固溶体。 While this material is not between a metal material, but this material is a solid solution and is different from the intermediate terminal solid solution. 可以基于Cu1Ga2前体来形成所有固态颗粒。 It can be formed based on all the solid particles Cu1Ga2 precursor. 在本实施方案中,不使用乳液。 In the present embodiment, an emulsion is not used.

[0111] 在本发明的其它实施方案中,可以使用富IB族的IB-1IIA族材料形成其它可行的前体材料。 [0111] In other embodiments of the invention may form the other possible precursor material using a Group IB-1IIA of Group IB-rich material. 作为非限制性实例,可以使用各种中间固溶体。 As non-limiting examples, various intermediate solid solution. Cu-Ga(38原子% Ga)可以在前体层500中与单质铟和单质铜一起使用。 Cu-Ga (38 atomic% Ga) precursor layer 500 may be used in conjunction with elemental copper and elemental indium. 在又一实施方案中,Cu-Ga (30原子% )可以在前体层500中与单质铜和单质铟一起使用。 In yet another embodiment, Cu-Ga (30 atomic%) may be used elemental copper and elemental indium layer 500 along the front. 这两个实施方案描述了其中IIIA族元素小于前体材料中该元素的约50摩尔百分比的富Cu材料。 This embodiment is described in which two embodiments IIIA element less than about 50 mole percent of the precursor material of the Cu-rich material element. 在更进一步的实施方案中,Cu-Ga (多相,25原子% Ga)可以与单质铜和铟一起使用以形成所需的前体层。 In still further embodiments, Cu-Ga (multiphase, 25 atomic% Ga) may be used to form the desired precursor layer together with elemental copper and indium. 应理解的是可以通过机械研磨或其它粉碎方法来形成这些材料的纳米颗粒。 It should be understood that nanoparticles can be formed of these materials by mechanical grinding or other comminution methods. 在其他实施方案中,这些颗粒可以通过电爆丝线(EEW)处理、蒸发冷凝(EC)、脉冲等离子体处理或其它方法来制成。 In other embodiments, these particles may be treated by an electric wire blasting (EEW ​​of), evaporation condensation (EC), a pulsed plasma treatment or other methods be made. 虽然不限于以下说明,但颗粒尺寸可以在约IOnm至约I微米的范围内。 Although the following description is not limited, but the particle size may be from about IOnm to a range of about I micron. 它们可以具有本文所述的任何形状。 They may have any shape described herein.

[0112] 现在参照图8,在本发明的另一实施方案中,可以涂覆、印刷或以另外方式形成两个或更多个材料层以提供具有所需化学计量比的前体层。 [0112] Referring now to Figure 8, in another embodiment of the present invention, may be coated, printed or otherwise form two or more layers of material to provide a precursor layer having the desired stoichiometry. 作为非限制性实例,层530可以含有具有Cu11In9和诸如单质Ga和/或GaxSey的Ga源的前体材料。 By way of non-limiting example, the layer 530 may contain a precursor material and having Cu11In9 such as elemental Ga and / or of the Ga source GaxSey. 可以在层530上印刷含有Cu78In28 (固溶体)及单质铟或InxSey的富铜前体层532。 Printing may contain Cu78In28 (solid solution) and elemental indium or copper-rich InxSey precursor layer 532 over the layer 530. 在这样的实施方案中,所得到的总比率可以具有Cu/(In+Ga) = 0.85和Ga/(In+Ga) =0.19。 In such embodiments, the resulting total rate may have Cu / (In + Ga) = 0.85 and Ga / (In + Ga) = 0.19. 在所得到的膜的一个实施方案中,该膜可以具有组成范围为约0.7至约1.0的Cu/(In+Ga)和组成范围为约0.05至约0.3的Ga/(In+Ga)的化学计量比。 In one embodiment of the film thus obtained, the film may have a composition range of Ga / (In + Ga) is and the composition range from about 0.7 to about 1.0 Cu / (In + Ga) is from about 0.05 to about 0.3 chemical stoichiometry.

[0113] 现在参照图9,应理解的是在本发明的一些实施方案中,将金属间材料用作可以形成颗粒和/或纳米颗粒的进料或起始材料。 [0113] Referring now to Figure 9, it should be understood that in some embodiments of the present invention, a material is used as the intermetallic particles may be formed or nanoparticles and feed or starting material /. 作为非限制性实例,图9示出了被处理以形成其它颗粒的一个金属间进料颗粒550。 By way of non-limiting example, FIG. 9 shows a processed to form inter-metallic particles other feed particles 550. 用于粉碎和/或形状改变的任何方法可以是适当地,包括但不限于研磨、EEW、EC、脉冲等离子体处理、或其组合。 Any method for comminuting and / or shape may be changed appropriately, including but not limited to grinding, EEW, EC, pulsed plasma treatment, or a combination thereof. 可以形成颗粒552、554、556和558。 552,554,556 and 558 may be formed of particles. 这些颗粒具有变化的形状,并且其中一些可以仅含金属间相,而其它的可以含该相及其它材料相。 These particles have a shape change, and only some of the metal-containing phase can be between, while others may contain other material phase and the phase.

[0114] 虽然已参照本发明的某些实施方案描述并说明了本发明,但本领域的技术人员将认识到可以在不脱离本发明的精神和范围的情况下进行工艺和规程的各种改进、变更、修改、替换、省略或添加。 The various [0114] While the embodiment has been described with reference to certain embodiments of the present invention and illustrate the present invention, those skilled in the art will recognize that the processes and procedures can be made without departing from the spirit and scope of the present invention to improve changes, modifications, substitutions, omissions or additions. 例如,本发明的其它实施方案可以使用Cu-1n前体材料,其中,Cu-1n贡献前体材料中发现的Cu和In的小于约百分之50。 For example, other embodiments of the present invention may use Cu-1n precursor material, wherein, Cu-1n contribution precursor material found in Cu and In is less than about 50 percent. 余量以单质形式或非IB-1IIA合金引入。 The remainder is introduced in elemental form or IB-1IIA alloy. 这样,Cu11In9可以与单质Cu、In和Ca —起使用以形成所得到的膜。 Thus, Cu11In9 may be elemental Cu, In and Ca - used to form a film from the resultant. 在另一实施方案中,诸如Cu-Se、In-SejP /或Ga-Se的其它材料可以替代单质Cu、In和Ca作为IB或IIIA族材料的来源。 In another embodiment, such as Cu-Se, In-SejP / or other materials may be substituted for Ga-Se elemental Cu, In and Ca as IB or Group IIIA material source. 任选地,在其它实施方案中,IB源可以是含铜且未与In和Ga合金化的任何颗粒(Cu、Cu-Se)。 Optionally, in other embodiments, IB source may be copper and not alloying with In and Ga any particles (Cu, Cu-Se). IIIA源可以是含In而没有Cu的任何颗粒(In_Se、In-Ga-Se)或含Ga而没有Cu的任何颗粒(Ga、Ga-Se或In-Ga-Se)。 IIIA source may be any particles containing Cu, In and without (In_Se, In-Ga-Se) or a Ga-containing particles without any Cu (Ga, Ga-Se or In-Ga-Se). 其它实施方案可以具有氮化物或氧化物形式的IB材料的这些组合。 These materials IB, other embodiments may have the form of nitride or oxide. 还有其它实施方案可以具有氮化物或氧化物形式的IIIA材料的这些组合。 These combinations of materials IIIA Still other embodiments may have the form of nitride or oxide. 本发明可以使用元素的任何组合和/或可以使用硒化物(二元、三元或多元)。 The present invention may use any combination of elements and / or may use diselenide (binary, ternary or higher). 任选地,一些其它实施方案可以使用诸如In2O3的氧化物以添加所需的材料量。 Optionally, other embodiments may use the amount of material required to add In2O3 oxide such. 对于任何以上实施方案,应理解的是可以使用超过一种的固溶体,还可以使用多相合金、和/或更普通的合金。 For any of the above embodiments, it should be understood that more than one may be used a solid solution, a multiphase alloy, and / or more common alloys may also be used. 一些实施方案可以在经过仅部分烧结或部分加热的前体层上沉积硫属元素颗粒。 Some embodiments may chalcogen deposited particles on sintering or only partially through the portion of the precursor layer is heated. 对于任何以上实施方案,退火工艺还可以包括将化合物膜暴露于诸如H2、C0、N2、Ar、H2Se或Se蒸气的气体。 For any of the above embodiments, the annealing process may further comprise exposing the compound to a membrane gas such as H2, C0, N2, Ar, H2Se or Se vapor.

[0115] 还应理解的是若干中间固溶体可能也适合于根据本发明使用。 [0115] It should also be understood that several intermediate solid solution may also be suitable for use in accordance with the present invention. 作为非限制性实例,Cu-1n (约42.52至约44.3wt% In)的δ相中的组成和/或Cu-1n的δ相和Cu16In9之间的组成可以是供本发明用于形成IB-1IIA-VIA族化合物的适当金属间材料。 By way of non-limiting example, a composition consisting of Cu-1n between (about 42.52 to about 44.3wt% In) of the δ phase and / or Cu-1n and Cu16In9 phase of δ may be used for the present invention is formed IB- among suitable metals 1IIA-VIA compound material. 应理解的是这些金属间材料可以与诸如Cu-Se、In-SejP /或Ga-Se的单质或其它材料混合来提供IB或IIIA族材料的来源以便在最终化合物中达到所需的化学计量比。 It should be understood that the material may be Cu-Se mixed, such as, In-SejP / or elemental Ga-Se, or other material to provide these intermetallic sources IB or Group IIIA material to achieve the desired stoichiometry in the final compound ratio . 金属间材料的其它非限制性实例包括含有下列相的Cu-Ga组成:YI (约31.8至约39.8wt% Ga)、Y 2 (约36.0至约39.9wt% Ga)、Y 3(约39.7至约44.9wt% Ga), Y 2与Y 3之间的相、端际固溶体与YI之间的相、以及Θ (约66.7至约68.7wtGa)。 Other non-limiting examples of intermetallic materials include Cu-Ga containing the following phase composition: YI (from about 31.8 to about 39.8wt% Ga), Y 2 (from about 36.0 to about 39.9wt% Ga), Y 3 (about 39.7 to about 44.9wt% Ga), phase shift between the phases and between 3 Y 2 Y, and the terminal solid solution YI, and [Theta] (from about 66.7 to about 68.7wtGa). 对于Cu_Ga,合适组成还存在于端际固溶体与紧邻它的中间固溶体之间的范围内。 For Cu_Ga, suitable composition is also present in the range between the terminal solid solution and a solid solution close to the middle of it. 有利的是,这些金属间材料中的一些可以是多相的,它们更可能导致可以机械研磨的脆性材料。 Advantageously, some of these intermetallic materials may be heterogeneous, they are more likely to cause brittle material may be mechanically polished. 以下材料的相图可以在ASM International的ASM Handbook、第三卷Alloy Phase Diagrams (1992)中找到,出于一切目的通过引用将其完全并入本文。 The following material may phase diagram, (1992) found in the ASM Handbook ASM International Volume III Alloy Phase Diagrams, for all purposes fully incorporated by reference herein. (通过引用而完全并入本文的)一些特定实例可以在页面2-168、2-170、2-176、2-178、2-208、2-214、2-257、和/ 或2-259 上找到。 (Completely incorporated herein by reference) may be certain instances 2-168,2-170,2-176,2-178,2-208,2-214,2-257 page, and / or 2-259 found on. [0116] 此处所讨论或引用的文献仅由于它们的公开在本申请的提交日期之前。 [0116] documents discussed or cited herein disclosed merely by virtue of their prior date of filing of the present application. 这里不应理解为承认本发明没有资格通过在先发明先于这些文献。 Herein should not be construed as an admission that the present inventors are not entitled to antedate such disclosure by prior documents. 此外,提供的公开日期可能与实际公开日期有所不同,这需要独立证实。 In addition, the dates of publication provided may be different from the actual publication dates, which requires independent confirmation. 通过引用将提及的所有文献并入本文,以便公开和描述与所提及文献有关的结构和/或方法。 All documents are incorporated herein by reference in the mentioned order structures and / or methods are disclosed and described in the relevant literature mentioned. 为了一切目的,通过引用将以下相关申请完全并入本文:美国专利申请N0.11/081, 163,题为“METALLICDISPERSION”,提交于2005 年3 月16 H ;美国专利申请N0.10/782,017,题为“SOLUTION-BASED FABRICATION OFPHOTOVOLTAICCELL”提交于2004年2月19日并且公开为美国专利申请公开20050183767 ;美国专利申请N0.10/943,658,题为“FORMATION OF CIGSABS0RBER LAYER MATERIALS USINGATOMIC LAYER DEPOSITION AND HIGHTHROUGHPUT SURFACE TREATMENT””,提交于2004 年9月18日并且公开为美国专利申请公开20050186342 ;美国专利申请N0.11/243,492,题为“FORMATION OF COMPOUND FILM FOR PH0T0V0LTAICDEVICE”,提交于2005 年10月3 日,以及美国专利申请N0.11/243,492,题为“FORMATION OF COMPOUND FILM FORPH0T0V0LTAICDEVICE”,提交于2005年10月3日,通过引用将前述文献整体并入本文。 For all purposes, by reference to the following related applications are fully incorporated herein: US Patent Application N0.11 / 081, 163, entitled "METALLICDISPERSION", filed in March 2005, 16 H; US Patent Application N0.10 / 782, 017, entitled "SOLUTION-BASED FABRICATION OFPHOTOVOLTAICCELL" filed on February 19, 2004 and published as US Patent application Publication No. 20050183767; US Patent application N0.10 / 943,658, entitled "FORMATION oF CIGSABS0RBER LAYER MATERIALS USINGATOMIC LAYER DEPOSITION aND HIGHTHROUGHPUT SURFACE TREATMENT "", filed on September 18, 2004 and published as US Patent application Publication No. 20050186342; US Patent application N0.11 / 243,492, entitled "FORMATION oF COMPOUND FILM fOR PH0T0V0LTAICDEVICE", filed in October 2005 3, as well as US Patent application N0.11 / 243,492, entitled "FORMATION oF COMPOUND FILM FORPH0T0V0LTAICDEVICE", filed on October 3, 2005, incorporated herein by reference in its entirety aforementioned documents.

[0117] 下列美国申请也通过引用而并入本文:于2005年11月29日提交的题为“CHALC0GENIDE SOLAR CELLS” 的11/290,633,于2004 年9 月18 日提交的题为“COATEDNANOPARTICLES AND QUANTUM DOTS F0RS0LUTION-BASED FABRICATION OF PHOTOVOLTAICCELLS”的10/943,657,以及于2004 年9 月18 日提交的题为“FORMATION OF CIGSABS0RBERLAYERS ON FOIL SUBSTRATES” 的10/943,685,和于2006 年3 月30 日提交的11/395,438。 [0117] The following are also incorporated herein by reference US Application: 2005, entitled, filed November 29 "CHALC0GENIDE SOLAR CELLS" 11 / 290,633, entitled "2004 September 18 filed COATEDNANOPARTICLES aND QUANTUM DOTS F0RS0LUTION-BASED FABRICATION oF PHOTOVOLTAICCELLS "10 / 943,657, entitled to September 18, 2004 filed" FORMATION oF CIGSABS0RBERLAYERS oN FOIL SUBSTRATES "10 / 943,685, and in March 2006 11 / 395,438 filed 30 May. 所有上述申请均出于一切目的通过引用而并入本文。 All of the above applications are incorporated herein for all purposes by reference for.

[0118] 虽然上述是本发明优选实施方案的完整说明,然而有可能使用各种替代、修改和等价物。 [0118] While the above is a complete description of the preferred embodiment of the present invention, however, possible to use various alternatives, modifications, and equivalents thereof. 因此,不应参照上述说明书确定本发明的范围,相反应根据所附权利要求以及它们的等价物的完整范围来确定本发明的范围。 Accordingly, the above description to determine the scope of the present invention, the reaction phase is determined in accordance with the scope of the present invention, the full scope of the appended claims and their equivalents should reference. 任何特征,无论优选与否,均可以与任何其它特征结合,无论优选与否。 Any feature, whether preferred or not, may be combined with any other feature, whether preferred or not. 在下面的权利要求书中,不定冠词“一”或“一种”是指所述冠词后的项目的数量为一个或多个,除非另外明确指出。 In the following claims the claims, the indefinite article "a" or "an" refers to the number of items of the article as one or more unless explicitly stated otherwise. 所附权利要求不应解释为包括装置加功能的限制,除非使用短语“用于...的装置”在给定的权利要求中明确指出这种限制。 Should not be construed as limiting the appended claims means-plus function includes, unless the phrase "means for ..." clear that such a limitation in a given claim.

Claims (65)

1.一种用于形成吸收层的方法,其包括: 由前体材料在衬底上形成前体层,其中,所述前体材料包含: a)含至少一种IB-1IIA族金属间材料的至少第一层; b)含硫属元素颗粒的至少第二层;以及以一个或多个步骤使前体层反应从而形成吸收层,其中所述IB-1IIA族金属间材料选自如下组:Cu1IndtJ δ相的组成、Cu1IndtJ δ相与Cu16In9限定的相之间的组成、Cu1In2,Cu1Ga2, Cu1Ga2的中间固溶体、Cu68Ga38、Cu70Ga30^ Cu75Ga25、端际固溶体和紧邻它的中间固溶体之间的相的Cu-Ga组成、具有31.8至39.8wt% Ga的YI相的Cu-Ga组成、具有36.0至39.9wt% Ga的Y 2相的Cu-Ga组成、具有39.7至44.9wt% Ga的Y 3相的Cu-Ga组成、具有66.7至68.7wt% Ga的Θ相的Cu-Ga组成、Y 2与Y 3之间的相的Cu-Ga组成、端际固溶体与YI之间的相的Cu-Ga组成、和富Cu的Cu-Ga。 1. A method for forming the absorbent layer, comprising: forming a precursor layer on a substrate from a precursor material wherein the precursor material comprises: a) comprising at least one inter-metal material IB-1IIA at least a first layer; b) a sulfur-containing particles is at least a second metal element layer; and one or more step of the reaction to form a precursor layer absorber layer, wherein the IB-1IIA inter-metal material selected from the group : composition Cu1IndtJ δ phase composition between the phases Cu1IndtJ δ phase Cu16In9 defined, Cu1In2, Cu1Ga2, Cu1Ga2 intermediate solid solution, Cu68Ga38, Cu70Ga30 ^ Cu75Ga25, terminal solid solution and immediately phase between its intermediate solid solution Cu -Ga composition, with 31.8 to 39.8wt% Ga Cu-Ga of the YI-phase composition, with 36.0 to 39.9wt% Ga Y 2 of the Cu-Ga-phase composition having a 39.7 to 44.9wt% Ga phase of Cu Y 3 -Ga composition, with 66.7 to 68.7wt% Ga [Theta] of the phase composition of Cu-Ga, Y 2 and Y of the Cu-Ga composition 3 between the phase of the Cu-Ga between the terminal solid solution with the composition YI, and Cu-rich Cu-Ga.
2.权利要求1的方法,其中,硫属元素颗粒包含单质硫属元素。 The method of claim 1, wherein the chalcogen element particles containing elemental chalcogen.
3.权利要求1的方法,其中,在所述第二层之上形成所述第一层。 The method of claim 1, wherein forming the first layer over the second layer.
4.权利要求1的方法,其中,在所述第一层之上形成所述第二层。 The method of claim 1, wherein said second layer is formed over the first layer.
5.权利要求1的方法,其中,所述第一层还含有单质硫属元素颗粒。 The method of claim 1, wherein said first layer further contains elemental chalcogen particles.
6.权利要求1的方法,其中,所述第一层的IB族元素是IB族硫属元素化物形式。 6. The method of claim 1, wherein the Group IB elements of the first layer is a group IB chalcogenide substance.
7.权利要求1的方法,其中,所述第一层的IIIA族元素是IIIA族硫属元素化物形式。 The method of claim 1, wherein the group IIIA elements of the first layer is a Group IIIA chalcogenide substance.
8.权利要求1的方法,其还包括含单质硫属元素颗粒的第三层。 The method of claim 1, further comprising a third layer containing elemental chalcogen particles.
9.权利要求1的方法,其中,所述两种或更多种不同的IIIA族元素包括铟和镓。 9. The method of claim 1, wherein said two or more different group IIIA elements include indium and gallium.
10.权利要求1的方法,其中,所述IB族元素是铜。 10. The method of claim 1, wherein the Group IB element is copper.
11.权利要求1的方法,其中,硫属元素颗粒是硒、硫或碲的颗粒。 11. The method of claim 1, wherein the chalcogen is selenium particles, sulfur or tellurium particles.
12.权利要求1的方法,其中,所述前体层是基本上无氧的。 12. The method of claim 1, wherein said precursor layer is substantially free of oxygen.
13.权利要求1的方法,其中,形成前体层包括形成分散体并将分散体散布到衬底上以形成分散体膜,所述分散体包括含一种或多种IB族元素的纳米颗粒和含两种或更多种IIIA族元素的纳米颗粒。 13. The method of claim 1, wherein forming the precursor layer comprises forming a dispersion and the dispersion was spread on a substrate to form a film of a dispersion, the dispersion comprising comprising one or more elements of Group IB nanoparticles and nanoparticles containing two or more elements in group IIIA.
14.权利要求13的方法,其中,形成前体层包括烧结所述膜以形成前体层。 14. The method of claim 13, wherein the forming of said precursor layer comprises a sintered layer to form a precursor film.
15.权利要求14的方法,其中,烧结前体层在将含有单质硫属元素颗粒的层布置在前体层之上的步骤之前执行。 15. The method of claim 14, wherein the sintered precursor layer before the layer arrangement containing elemental chalcogen particles previous step is performed on the layer.
16.权利要求1的方法,其中,所述衬底是柔性衬底,并且其中,形成前体层和/或在前体层上布置含单质硫属元素颗粒的层和/或加热前体层和硫属元素颗粒包括在柔性衬底上卷到卷制造的使用。 16. The method of claim 1, wherein said substrate is a flexible substrate, and wherein the layer is formed elemental chalcogen particles and / or heating the precursor-containing layer is disposed on the front layer and / or the precursor layer and a chalcogen element particles comprising the use of roll-to-roll manufacturing on a flexible substrate.
17.权利要求1的方法,其中,所述衬底是铝箔衬底。 17. The method of claim 1, wherein said substrate is an aluminum foil substrate.
18.权利要求1的方法,其中,IB-1IIA硫属元素化物化合物为CuzIn(1_x)GaxS2(1_y)Se2y形式,其中,0.5≤z≤1.5、0≤X≤1.0且O≤y≤1.0。 18. The method of claim 1, wherein, IB-1IIA chalcogenide compound is CuzIn (1_x) GaxS2 (1_y) Se2y form, wherein, 0.5≤z≤1.5,0≤X≤1.0 and O≤y≤1.0.
19.权利要求1的方法,其中,前体层和硫属元素颗粒的加热包括将衬底和前体层从环境温度加热至200°C与600°C之间的平稳温度范围,在几分之一秒至60分钟范围内的一段时间内将衬底和前体层的温度保持在该平稳水平,并随后降低衬底和前体层的温度。 19. The method of claim 1, wherein the sulfur precursor layer and chalcogen particles comprises heating the substrate and the precursor layer is heated from ambient temperature to a plateau temperature range of between 200 ° C and 600 ° C, the fraction within a period of time within the range of a second to 60 minutes the temperature of the substrate and the precursor layer is maintained at the stable level, and then reduce the temperature of the substrate and the precursor layer.
20.权利要求14的方法,其中,所述膜包括IB-1IIA-VIA族化合物。 20. The method of claim 14, wherein the film comprises a Group IB-1IIA-VIA compound.
21.权利要求1的方法,其中,所述反应包括在适当气氛中加热所述层。 21. The method of claim 1, wherein the reaction comprises heating the layer in a suitable atmosphere.
22.权利要求1的方法,其中,所述分散体中的至少一组颗粒为纳米小球的形式。 The method of 1, wherein at least one set of particles of the dispersion to form nanoglobules 22. Claim.
23.权利要求1的方法,其中,所述分散体中的至少一组颗粒为纳米小球的形式并含至少一种IIIA族元素。 23. The method of claim 1, wherein said dispersion is in the form of particles of at least one set nanoglobules and containing at least one Group IIIA element.
24.权利要求1的方法,其中,所述分散体中的至少一组颗粒为纳米小球的形式并包含单质形式的IIIA族元素。 24. The method of claim 1, wherein said dispersion is in the form of particles of at least one set nanoglobules and comprising elemental form IIIA elements.
25.权利要求1的方法,其中,所述金属间材料不是端际固溶体相。 25. The method of claim 1, wherein the intermetallic material is not a terminal solid solution phase.
26.权利要求1的方法,其中,所述金属间材料不是固溶体相。 26. The method of claim 1, wherein the intermetallic material is not a solid solution phase.
27.权利要求1的方法,其中,至少一些颗粒具有薄片形状。 27. The method of claim 1, wherein at least some of the particles have a flake shape.
28.权利要求1的方法,其中,大多数颗粒具有薄片形状。 28. The method of claim 1, wherein the majority of the particles have a flake shape.
29.权利要求1的方法,其中,全部颗粒具有薄片形状。 29. The method of claim 1, wherein all of the particles have a flake shape.
30.权利要求13的方法,其中,所述形成步骤包括用所述分散体涂覆衬底。 30. The method of claim 13, wherein said forming step comprises coating a substrate with the dispersion.
31.权利要求13的方法,其中,所述分散体包含乳液。 31. The method of claim 13, wherein said dispersion comprises an emulsion.
32.权利要求1的方法,其中,所述金属间材料是二元材料。 32. The method of claim 1, wherein the intermetallic material is a binary material.
33.权利要求1的方法,其中,所述金属间材料是三元材料。 33. The method of claim 1, wherein the intermetallic material is a ternary material.
34.权利要求1的方法,其中,以纳米小球悬浮液形式将镓引入作为IIIA族元素。 34. The method of claim 1, wherein the nanometer pellet suspension gallium incorporated IIIA elements.
35.权利要求34的方法,其中,通过在溶液中产生液体镓的乳液来形成镓的纳米小球。 35. The method of claim 34, wherein the gallium is formed by producing an emulsion of small nanospheres liquid gallium in the solution.
36.权利要求34的方法,其中,在低于室温下对镓骤冷。 36. The method of claim 34, wherein, at below room temperature quenched gallium.
37.权利要求34的方法,其还包括通过搅拌、机械装置、电磁装置、超声波装置、和/或添加分散剂和/或乳化剂来保持或加强液态镓在溶液中的分散。 37. The method of claim 34, further comprising a stirring, mechanical means, magnetic means, ultrasonic means and / or addition of dispersants and / or emulsifiers to maintain or enhance the dispersion liquid gallium in the solution.
38.权利要求1的方法,还包括添加一种或多种选自铝、碲或硫的单质颗粒的混合物。 38. The method of claim 1, further comprising adding a mixture of one or more selected from aluminum, tellurium, or sulfur elemental particles.
39.权利要求21的方法,其中,所述适当气氛包含下列中的至少一种:硒、硫、碲、H2,CO、H2Se, H2S, Ar、N2或其组合或混合物。 39. The method of claim 21, wherein said suitable atmosphere contains at least one of the following: selenium, sulfur, tellurium, H2, CO, H2Se, H2S, Ar, N2 or a combination or mixture thereof.
40.权利要求21的方法,其中,所述适当气氛含有下列中的至少一种:H2、CO、Ar以及N2。 40. The method of claim 21, wherein said suitable atmosphere contains at least one of the following: H2, CO, Ar and N2.
41.权利要求1的方法,其中,一类或多类颗粒掺杂有一种或多种无机材料。 41. The method of claim 1, wherein the one or more classes of particles doped with one or more inorganic materials.
42.权利要求1的方法,其中,一类或多类颗粒掺杂有选自铝、硫、钠、钾或锂中的一种或多种无机材料。 42. The method of claim 1, wherein the one or more classes of particles doped with one selected from aluminum, sulfur, sodium, potassium or lithium or more inorganic materials.
43.权利要求1的方法,其中,所述颗粒是纳米颗粒。 43. The method of claim 1, wherein said particles are nanoparticles.
44.权利要求1的方法,其还包括由具有金属间相的进料形成颗粒。 44. The method of claim 1, further comprising forming the particles from a feed having intermetallic phases.
45.权利要求1的方法,还包括由具有金属间相的进料形成颗粒,并且通过下列工艺之一来形成纳米颗粒:研磨、电爆丝线处理、蒸发冷凝,脉冲等离子体处理或其组合。 45. The method of claim 1, further comprising a feed having an intermetallic phase particles are formed, and the nanoparticles are formed by one of the following processes: grinding, wire electrical explosion process, evaporation condensation, pulsed plasma treatment, or a combination thereof.
46.权利要求1的方法,其中,硫属元素颗粒包含硫属元素化物颗粒。 46. ​​The method of claim 1, wherein the chalcogen chalcogenide particles contain particles.
47.权利要求1的方法,其中,硫属元素颗粒包含富硫属元素的硫属元素化物颗粒。 47. The method of claim 1, wherein the chalcogen sulfur-rich particles comprising a chalcogen element chalcogenide particles.
48.权利要求1的方法,其中,所述吸收层由所述颗粒的前体层和与前体层接触的含钠材料层形成。 48. The method of claim 1, wherein said absorbent layer is formed from a precursor layer of the particles and the material layer in contact with a sodium-containing precursor layer.
49.权利要求1的方法,其中,所述吸收层由颗粒的前体层和与前体层接触并含有以下材料中的至少一种的层形成:IB族元素、IIIA族元素、VIA族元素、IA族元素、前述元素的二元和/或多元合金、前述元素的固溶体以及钠化合物。 49. The method of claim 1, wherein said absorbent layer is in contact with the particles and the precursor layer precursor layer and at least one layer formed of the following materials comprising: IB group elements, IIIA group elements, VIA group elements , IA group elements, dibasic the elements and / or polyhydric alloy, a solid solution of the element, and a sodium compound.
50.权利要求1的方法,其中,所述吸收层由颗粒的前体层和与前体层接触并含有以下材料中的至少一种的层形成:铜、铟、镓、硒、铜铟、铜镓、铟镓、钠、氟化钠、硫化钠铟、硒化铜、硫化铜、硒化铟、硫化铟、硒化镓、硫化镓、硒化铜铟、硫化铜铟、硒化铜镓、硫化铜镓、硒化铟镓、硫化铟镓、硒化铜铟镓和/或硫化铜铟镓。 50. The method of claim 1, wherein the absorption layer is formed by the first layer in contact with the particles and the precursor layer and at least one layer containing the following materials: copper, indium, gallium, selenium, copper, indium, copper gallium, indium, gallium, sodium, sodium fluoride, sodium sulfide, indium copper selenide, copper sulfide, indium selenide, indium sulfide, gallium selenide, gallium sulfide, copper indium diselenide, copper indium disulfide, copper gallium selenide , copper gallium sulfide, indium selenide, gallium sulfide, gallium, indium, copper indium gallium selenide and / or copper indium gallium disulfide.
51.权利要求1的方法,其中,所述前体层包括含有钠的颗粒。 51. The method of claim 1, wherein said precursor layer comprises particles containing sodium.
52.权利要求51的方法,其中,所述颗粒含有I原子%或更少的钠。 52. The method of claim 51, wherein said particles contain I atomic% or less of sodium.
53.权利要求51的方法,其中,所述颗粒含有以下材料中的至少一种:Cu-Na、In_Na、Ga_Na、Cu_In_Na、Cu_Ga_Na、In_Ga_Na、Na-Se、Cu_Se_Na、In_Se_Na、Ga_Se_Na、Cu_In_Se_Na、Cu_Ga_Se_Na、In_Ga_Se_Na、Cu_In_Ga_Se_Na、Na_S、Cu_S_Na、In_S_Na、Ga_S_Na、Cu_In_S_Na、Cu_Ga_S_Na、In-Ga-S-Na 或Cu-1n-Ga-S-Na0 53. The method of claim 51, wherein said particles contain at least one of the following materials: Cu-Na, In_Na, Ga_Na, Cu_In_Na, Cu_Ga_Na, In_Ga_Na, Na-Se, Cu_Se_Na, In_Se_Na, Ga_Se_Na, Cu_In_Se_Na, Cu_Ga_Se_Na, In_Ga_Se_Na, Cu_In_Ga_Se_Na, Na_S, Cu_S_Na, In_S_Na, Ga_S_Na, Cu_In_S_Na, Cu_Ga_S_Na, In-Ga-S-Na or Cu-1n-Ga-S-Na0
54.权利要求1的方法,其中,所述吸收层由所述颗粒的前体层和含有具有有机抗衡离子的钠化合物或具有无机抗衡离子的钠化合物的油墨形成。 54. The method of claim 1, wherein said absorbent layer precursor layer by the particles and the compound containing sodium counter ion with an organic or inorganic compound having an ink sodium counter-ion form.
55.权利要求1的方法,其中,所述吸收层由以下形成:所述颗粒的前体层以及含有至少一种下列材料的与前体层和/或颗粒接触的含钠材料的层:Cu_Na、In-Na, Ga-Na,Cu_In_Na、Cu_Ga_Na、In_Ga_Na、Na_Se、Cu_Se_Na、In_Se_Na、Ga_Se_Na、Cu_In_Se_Na、Cu_Ga_Se_Na、In_Ga_Se_Na、Cu_In_Ga_Se_Na、Na-SΛ Cu_S_Na、In_S_Na、Ga-S-NaΛCu-1n-S-Na、Cu-Ga-S-Na、In-Ga-S-Na 或Cu-1n-Ga-S-Na ;和/ 或含有所述颗粒和具有有机抗衡离子的钠化合物或具有无机抗衡离子的钠化合物的油墨。 Precursor layer and said particles and / or sodium-containing materials in contact with the layer comprising particles of at least one of the material or the precursor layer:: 55. The method of claim 1, wherein the absorption layer is formed by the following Cu_Na , In-Na, Ga-Na, Cu_In_Na, Cu_Ga_Na, In_Ga_Na, Na_Se, Cu_Se_Na, In_Se_Na, Ga_Se_Na, Cu_In_Se_Na, Cu_Ga_Se_Na, In_Ga_Se_Na, Cu_In_Ga_Se_Na, Na-SΛ Cu_S_Na, In_S_Na, Ga-S-NaΛCu-1n-S-Na, Cu-Ga-S-Na, in-Ga-S-Na or Cu-1n-Ga-S-Na; and / or said particles comprising a sodium compound and an organic compound having a sodium counter ion or an inorganic counterion ink.
56.权利要求14的方法,还包括在加热步骤之后将含钠材料添加到所述膜。 56. The method of claim 14, further comprising, after the step of heating said sodium-containing material is added to the film.
57.一种用于形成IB-1IIA族硫属元素化物化合物膜的方法,该方法包括: 在衬底上形成前体层,该前体层含有一种或多种IB族元素和一种或多种IIIA族元素; 烧结所述前体层; 在烧结前体层之后,在前体层之上形成含有单质硫属元素颗粒的层;以及将前体层和硫属元素颗粒加热至足以熔化硫属元素颗粒并使硫属元素颗粒与前体层中的IB族元素和IIIA族元素反应的温度以形成IB-1IIA族硫属元素化物化合物的膜, 其中,前体层中的至少一组颗粒是含有至少一种IB-1IIA族金属间材料的金属间颗粒,其中所述IB-1IIA族金属间材料选自如下组:Cu1In2的δ相的组成、Cu1In2的δ相与Cu16In9限定的相之间的组成、Cu1In2, Cu1Ga2' Cu1Ga2的中间固溶体、Cu68Ga38^ Cu70Ga30^Cu75Ga25、端际固溶体和紧邻它的中间固溶体之间的相的Cu-Ga组成、具有31.8至39.8wt%Ga的Yl相的Cu-Ga组成、具有36.0至39.9wt% Ga的Y 2相 57. A method for the Group IB-1IIA chalcogenide film-forming compound, the method comprising: forming a precursor layer on a substrate, the precursor layer contains one or more Group IB elements and one or more IIIA elements; sintering the precursor layer; precursor layer after sintering, forming a layer containing elemental chalcogen particles over the precursor layer; and the precursor layer and chalcogen particles are heated to a temperature sufficient to melt chalcogen particles and the temperature chalcogen group IB element and the group IIIA element responsive element particles and the precursor layer to form a film IB-1IIA group chalcogenide compound, wherein the precursor layer is at least one set the phase composition of Cu1In2 δ phase, δ phase of Cu16In9 Cu1In2 defined: between the intermetallic particles containing at least one group IB-1IIA particles of metallic material, wherein the IB-1IIA inter-metal material selected from the group Cu between composition, Cu1In2, Cu1Ga2 'Cu1Ga2 intermediate solid solution, Cu68Ga38 ^ Cu70Ga30 ^ Cu75Ga25, terminal solid solution and immediately phase between its intermediate solid solution Cu-Ga composition, with 31.8 to 39.8wt% Ga of Yl phase -Ga composition, with 36.0 to 39.9wt% Ga phase of Y 2 的Cu-Ga组成、具有39.7至44.9wt% Ga的Y 3相的Cu-Ga组成、具有66.7至68.7wt% Ga的Θ相的Cu-Ga组成、Y 2与Y 3之间的相的Cu-Ga组成、端际固溶体与YI之间的相的Cu-Ga组成、和富Cu的Cu-Ga。 Cu-Ga composition of the Cu-Ga, with 39.7 to 44.9wt% Ga Y 3 of the Cu-Ga-phase composition having a 66.7 to 68.7wt% Ga composition of the phase Θ, Cu phases and between Y 2 Y 3 -Ga composition, Cu-Ga phase between the terminal solid solution with the composition YI, and Cu-rich Cu-Ga.
58.权利要求57的方法,其中,所述衬底是铝箔衬底。 58. The method of claim 57, wherein said substrate is an aluminum foil substrate.
59.权利要求57的方法,其中,硫属元素颗粒是硒、硫或碲的颗粒。 59. The method of claim 57, wherein the chalcogen is selenium particles, sulfur or tellurium particles.
60.权利要求57的方法,其中,所述前体层是基本上无氧的。 60. The method of claim 57, wherein said precursor layer is substantially free of oxygen.
61.权利要求57的方法,其中,形成前体层包括形成分散体并将分散体散布到衬底上以形成分散体膜,所述分散体含有包含一种或多种IB族元素的纳米颗粒和包含两种或更多种IIIA族元素的纳米颗粒。 61. The method of claim 57, wherein forming the precursor layer comprises forming a dispersion and the dispersion was spread to form a dispersion film on a substrate, comprising a dispersion of nanoparticles comprising one or more Group IB elements and nanoparticles comprising two or more group IIIA elements.
62.权利要求57的方法,其中,形成前体层和/或烧结前体层和/或在前体层上布置包含单质硫属元素颗粒的层和/或将前体层和硫属元素颗粒加热至足以熔化硫属元素的温度包括使用在柔性衬底上卷到卷制造。 62. The method of claim 57, wherein forming the precursor layer and / or sintering precursor layer and / or particle-containing layer disposed elemental chalcogen particles and / or the precursor layer on the front and a chalcogen layer heated to a sufficient temperature to melt chalcogen element comprising on a flexible substrate using a roll-to-roll manufacturing.
63.权利要求57的方法,其中,IB-1IIA硫属元素化物化合物为CuzIn(1_x)GaxS2(1_y)Se2y形式,其中,0.5≤z≤1.5、0≤X≤1.0且O≤y≤1.0。 63. The method of claim 57, wherein, IB-1IIA chalcogenide compound is CuzIn (1_x) (1_y) Se2y form GaxS2, wherein, 0.5≤z≤1.5,0≤X≤1.0 and O≤y≤1.0.
64.权利要求57的方法,其中,烧结前体层包括将衬底和前体层从环境温度加热至200°C与600°C之间的平稳温度范围,在几分之一秒至60分钟范围内的一段时间内将衬底和前体层的温度保持在该平稳范围,并随后降低衬底和前体层的温度。 64. The method of claim 57, wherein the sintered precursor layer comprises a substrate and a precursor layer is heated from ambient temperature to a plateau temperature range of between 200 ° C and 600 ° C, in a fraction of a second to 60 minutes over a period of time in the range of the temperature of the substrate and the precursor layer is held in the stable range, and then reducing the temperature of the substrate and the precursor layer.
65.权利要求57的方法,其中,加热前体层和硫属元素颗粒包括将衬底、前体层、以及硫属元素颗粒从环境温度加热至200°C与600°C之间的平稳温度范围,在几分之一秒至60分钟范围内的时间段内将衬底和前体层的温度保持在该平稳范围,并随后降低衬底和前体层的温度。 65. The method of claim 57, wherein heating the precursor layer and chalcogen particles comprising a substrate, a precursor layer, and chalcogen particles are heated from ambient temperature to a plateau temperature between 200 ° C and 600 ° C range, a period in the range of fractions of a second to 60 minutes and the temperature of the precursor substrate layer is held in the stable range, and then reducing the temperature of the substrate and the precursor layer.
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