CN101393900A - 半导体器件及其制造方法 - Google Patents
半导体器件及其制造方法 Download PDFInfo
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- CN101393900A CN101393900A CNA200810210915XA CN200810210915A CN101393900A CN 101393900 A CN101393900 A CN 101393900A CN A200810210915X A CNA200810210915X A CN A200810210915XA CN 200810210915 A CN200810210915 A CN 200810210915A CN 101393900 A CN101393900 A CN 101393900A
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Landscapes
- Engineering & Computer Science (AREA)
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (17)
Priority Applications (1)
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CN201310224828.0A CN103295995B (zh) | 2007-09-20 | 2008-08-12 | 半导体器件及其制造方法 |
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JP2007243944A JP2009076658A (ja) | 2007-09-20 | 2007-09-20 | 半導体装置及びその製造方法 |
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CN101393900A true CN101393900A (zh) | 2009-03-25 |
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JP (1) | JP2009076658A (zh) |
KR (1) | KR20090031279A (zh) |
CN (2) | CN101393900A (zh) |
TW (1) | TW200924145A (zh) |
Cited By (9)
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CN102299132A (zh) * | 2010-06-22 | 2011-12-28 | 松下电器产业株式会社 | 半导体装置用封装及其制造方法、以及半导体装置 |
CN103563063A (zh) * | 2011-05-31 | 2014-02-05 | 住友电木株式会社 | 树脂组合物、使用其的半导体装置和半导体装置的制造方法 |
CN103985675A (zh) * | 2013-02-07 | 2014-08-13 | 精工电子有限公司 | 半导体装置 |
CN104103603A (zh) * | 2013-04-02 | 2014-10-15 | 三菱电机株式会社 | 半导体装置以及半导体模块 |
CN105097431A (zh) * | 2014-05-09 | 2015-11-25 | 中芯国际集成电路制造(上海)有限公司 | 一种晶圆正面的保护方法 |
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WO2021233333A1 (zh) * | 2020-05-22 | 2021-11-25 | 东莞链芯半导体科技有限公司 | 半导体封装结构及其封装方法 |
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CN201838585U (zh) * | 2010-06-17 | 2011-05-18 | 国碁电子(中山)有限公司 | 堆叠式芯片封装结构及其基板 |
JP5437943B2 (ja) * | 2010-07-26 | 2014-03-12 | 日立オートモティブシステムズ株式会社 | パワー半導体ユニット、パワーモジュールおよびそれらの製造方法 |
TWI431218B (zh) * | 2011-03-11 | 2014-03-21 | Lingsen Precision Ind Ltd | The manufacturing method and structure of LED light bar |
JP6076675B2 (ja) | 2011-10-31 | 2017-02-08 | ローム株式会社 | 半導体装置 |
JP5798021B2 (ja) * | 2011-12-01 | 2015-10-21 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US9711424B2 (en) * | 2012-09-17 | 2017-07-18 | Littelfuse, Inc. | Low thermal stress package for large area semiconductor dies |
JP5970316B2 (ja) * | 2012-09-26 | 2016-08-17 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
US9054092B2 (en) * | 2013-10-28 | 2015-06-09 | Texas Instruments Incorporated | Method and apparatus for stopping resin bleed and mold flash on integrated circuit lead finishes |
WO2016101151A1 (en) * | 2014-12-23 | 2016-06-30 | Intel Corporation | Integrated package design with wire leads for package-on-package product |
CN107431060B (zh) * | 2015-06-24 | 2021-01-05 | 瑞萨电子株式会社 | 半导体器件的制造方法 |
JP7182374B2 (ja) * | 2017-05-15 | 2022-12-02 | 新光電気工業株式会社 | リードフレーム及びその製造方法 |
US11735506B2 (en) * | 2018-05-15 | 2023-08-22 | Texas Instruments Incorporated | Packages with multiple exposed pads |
JP2020088066A (ja) | 2018-11-20 | 2020-06-04 | キヤノン株式会社 | 電子部品および機器 |
JP7338204B2 (ja) * | 2019-04-01 | 2023-09-05 | 富士電機株式会社 | 半導体装置 |
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- 2008-09-19 KR KR1020080092006A patent/KR20090031279A/ko not_active Application Discontinuation
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Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102299132A (zh) * | 2010-06-22 | 2011-12-28 | 松下电器产业株式会社 | 半导体装置用封装及其制造方法、以及半导体装置 |
CN102299132B (zh) * | 2010-06-22 | 2014-03-26 | 松下电器产业株式会社 | 半导体装置用封装及其制造方法、以及半导体装置 |
CN103563063A (zh) * | 2011-05-31 | 2014-02-05 | 住友电木株式会社 | 树脂组合物、使用其的半导体装置和半导体装置的制造方法 |
CN103985675A (zh) * | 2013-02-07 | 2014-08-13 | 精工电子有限公司 | 半导体装置 |
CN103985675B (zh) * | 2013-02-07 | 2018-05-01 | 艾普凌科有限公司 | 半导体装置 |
CN104103603B (zh) * | 2013-04-02 | 2018-01-23 | 三菱电机株式会社 | 半导体装置以及半导体模块 |
US9613888B2 (en) | 2013-04-02 | 2017-04-04 | Mitsubishi Electric Corporation | Semiconductor device and semiconductor module |
CN104103603A (zh) * | 2013-04-02 | 2014-10-15 | 三菱电机株式会社 | 半导体装置以及半导体模块 |
CN105097431A (zh) * | 2014-05-09 | 2015-11-25 | 中芯国际集成电路制造(上海)有限公司 | 一种晶圆正面的保护方法 |
CN106057765A (zh) * | 2015-04-13 | 2016-10-26 | 日月光半导体制造股份有限公司 | 半导体封装结构和其制造方法 |
CN108352361A (zh) * | 2015-10-12 | 2018-07-31 | 英帆萨斯公司 | 用于干扰屏蔽的引线接合线 |
CN107230668A (zh) * | 2016-03-23 | 2017-10-03 | 德克萨斯仪器股份有限公司 | 用于在导线键合的半导体器件中稳定引线的结构和方法 |
WO2021233333A1 (zh) * | 2020-05-22 | 2021-11-25 | 东莞链芯半导体科技有限公司 | 半导体封装结构及其封装方法 |
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US20090079051A1 (en) | 2009-03-26 |
US8558362B2 (en) | 2013-10-15 |
KR20090031279A (ko) | 2009-03-25 |
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