CN101386723B - 纳米铜导电墨水的制备方法 - Google Patents
纳米铜导电墨水的制备方法 Download PDFInfo
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- CN101386723B CN101386723B CN 200810201967 CN200810201967A CN101386723B CN 101386723 B CN101386723 B CN 101386723B CN 200810201967 CN200810201967 CN 200810201967 CN 200810201967 A CN200810201967 A CN 200810201967A CN 101386723 B CN101386723 B CN 101386723B
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- Prior art keywords
- copper
- conductive ink
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- solution
- ink
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910052802 copper Inorganic materials 0.000 title claims abstract description 49
- 239000010949 copper Substances 0.000 title claims abstract description 49
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 18
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims abstract description 25
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims abstract description 25
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims abstract description 25
- 239000002245 particle Substances 0.000 claims abstract description 22
- 238000000909 electrodialysis Methods 0.000 claims abstract description 13
- 239000012535 impurity Substances 0.000 claims abstract description 12
- 238000004821 distillation Methods 0.000 claims abstract description 11
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims abstract description 7
- 230000002829 reductive effect Effects 0.000 claims abstract description 6
- 238000002360 preparation method Methods 0.000 claims abstract description 5
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims abstract description 3
- 239000013543 active substance Substances 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims description 6
- 230000004044 response Effects 0.000 claims description 6
- 238000010612 desalination reaction Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000012074 organic phase Substances 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 claims description 3
- 239000012141 concentrate Substances 0.000 claims description 2
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 2
- 230000006837 decompression Effects 0.000 claims description 2
- 238000009775 high-speed stirring Methods 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 abstract description 31
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000007641 inkjet printing Methods 0.000 abstract 2
- 239000012190 activator Substances 0.000 abstract 1
- 239000010866 blackwater Substances 0.000 abstract 1
- 239000003638 chemical reducing agent Substances 0.000 abstract 1
- 239000002270 dispersing agent Substances 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- 239000007791 liquid phase Substances 0.000 abstract 1
- 239000002923 metal particle Substances 0.000 abstract 1
- 239000012071 phase Substances 0.000 abstract 1
- 239000002243 precursor Substances 0.000 abstract 1
- 238000007639 printing Methods 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 9
- 238000005303 weighing Methods 0.000 description 8
- 238000009826 distribution Methods 0.000 description 5
- 239000007921 spray Substances 0.000 description 5
- 238000002441 X-ray diffraction Methods 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003760 magnetic stirring Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000003951 lactams Chemical group 0.000 description 1
- 238000009766 low-temperature sintering Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- HZVOZRGWRWCICA-UHFFFAOYSA-N methanediyl Chemical compound [CH2] HZVOZRGWRWCICA-UHFFFAOYSA-N 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
Images
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- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 200810201967 CN101386723B (zh) | 2008-10-30 | 2008-10-30 | 纳米铜导电墨水的制备方法 |
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CN 200810201967 CN101386723B (zh) | 2008-10-30 | 2008-10-30 | 纳米铜导电墨水的制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN101386723A CN101386723A (zh) | 2009-03-18 |
CN101386723B true CN101386723B (zh) | 2011-06-08 |
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CN 200810201967 Expired - Fee Related CN101386723B (zh) | 2008-10-30 | 2008-10-30 | 纳米铜导电墨水的制备方法 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3040140A1 (en) | 2014-12-31 | 2016-07-06 | Institute Of Chemistry, Chinese Academy Of Sciences | Method of preparing nano-copper powder and nano-copper powder prepared with the same |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102198510B (zh) * | 2011-04-27 | 2012-09-12 | 黑龙江大学 | 一种液相法制备纳米铜/碳纳米管复合粉体的方法 |
CN102558944A (zh) * | 2011-06-01 | 2012-07-11 | 上海大学 | 纳米金属铜导电墨水的制备方法 |
CN102407344B (zh) * | 2011-11-13 | 2013-01-23 | 西安科技大学 | 一种纳米铜颗粒的工业生产方法 |
CN102775847B (zh) * | 2012-07-16 | 2014-10-08 | 中国科学院宁波材料技术与工程研究所 | 一种用于制备氧化锌基薄膜的墨水的制备方法 |
CN103540192B (zh) * | 2013-10-11 | 2014-08-06 | 哈尔滨工业大学 | 一种用于印制板表面喷墨印制铜线路图形的离子金属墨水及其制备和印制方法 |
CN103834231B (zh) * | 2014-01-17 | 2015-08-26 | 哈尔滨工业大学 | 一种用于柔性基材表面喷墨印制铜图形的银催化胶体墨水及其制备方法 |
CN105462365A (zh) * | 2014-09-11 | 2016-04-06 | 中国科学院苏州纳米技术与纳米仿生研究所 | 一种导电纳米铜墨水的制备方法 |
CN109385139B (zh) * | 2017-08-03 | 2021-10-12 | 深圳Tcl工业研究院有限公司 | 氧化锌基纳米颗粒墨水的提纯方法 |
CN108652753A (zh) * | 2018-02-02 | 2018-10-16 | 浙江清华柔性电子技术研究院 | 用于形成生物体表面标记的图案材料及标记方法 |
CN111822696B (zh) * | 2019-04-15 | 2023-04-18 | 中国科学院深圳先进技术研究院 | 一种用于导电油墨的单分散纳米铜颗粒及其制备方法和用途 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1653559A (zh) * | 2002-05-07 | 2005-08-10 | 瑞威欧公司 | 导电墨水 |
CN101010388A (zh) * | 2005-03-04 | 2007-08-01 | 韩商英泰股份有限公司 | 导电墨水及其制造方法 |
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2008
- 2008-10-30 CN CN 200810201967 patent/CN101386723B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1653559A (zh) * | 2002-05-07 | 2005-08-10 | 瑞威欧公司 | 导电墨水 |
CN101010388A (zh) * | 2005-03-04 | 2007-08-01 | 韩商英泰股份有限公司 | 导电墨水及其制造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3040140A1 (en) | 2014-12-31 | 2016-07-06 | Institute Of Chemistry, Chinese Academy Of Sciences | Method of preparing nano-copper powder and nano-copper powder prepared with the same |
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CN101386723A (zh) | 2009-03-18 |
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Effective date of registration: 20140516 Address after: 226600 Hainan village, Haian Town, Haian County, Jiangsu City, Nantong province twenty-one Patentee after: NANTONG HENGRUI PLATING Co.,Ltd. Address before: 200444 Baoshan District Road, Shanghai, No. 99 Patentee before: Shanghai University |
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