CN101298115A - Method for welding micro-component based on laser dynamical stress and device - Google Patents
Method for welding micro-component based on laser dynamical stress and device Download PDFInfo
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- CN101298115A CN101298115A CN 200810020643 CN200810020643A CN101298115A CN 101298115 A CN101298115 A CN 101298115A CN 200810020643 CN200810020643 CN 200810020643 CN 200810020643 A CN200810020643 A CN 200810020643A CN 101298115 A CN101298115 A CN 101298115A
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Abstract
The invention relates to the welding field, in particular to a method and device used for the microelectronic device welding on the basis of laser dynamic pressure. A workpiece bumps a basic body by dynamic pressure which is generated by that laser acts on the surface of the workpiece and a high-temperature high-pressure area is formed on the bumping area, thus realizing the welding of the workpiece and the basic body; the device consists of a computer, a laser, a reflection deflection system, a focusing lens, a focusing lens bracket, a focusing lens movable platform, a focusing lens movable platform controller, a clamp fastener, a swivel feeding platform, a stepping motor, a stepping motor controller, a three-dimensional movable worktable and a three-dimensional movable worktable controller. The speed of the laser used for driving the workpiece is controllable by using the computer to precisely control the laser energy and pulse time, thus controlling the bumping speed of the workpiece and the basic body. The method and device of the invention apply the dynamic pressure generated by the action of the laser and the matter to the micro-welding technology, weld the microelectronic devices, and compensate the shortages of the welding method of the conventional microelectronic devices.
Description
Technical field
The present invention relates to welding field, refer in particular to a kind of microelectronic component welding method and device based on laser dynamical stress, the dynamic pressure that produces at surface of the work by laser action makes workpiece collide matrix, thereby produce the welding that HTHP is realized workpiece and matrix at the interface in collision, be applicable to the accurately welding fast of metal microelectronic component.
Background of invention
The welding of microelectronic component is a kind of high-end technology of welding field, because microelectronic component, makes the very important technology in the industrial production that is welded into of microelectronic component being applied to more and more widely of various applications such as Aero-Space, communication, precision instrument and national defence.Microelectronic component welding to as if some tiny element and metallic films, require than higher for welding precision and technological parameter, therefore it is big to weld difficulty, and the quality of welding quality directly has influence on the reliability and stability of microelectronic component, and this forces people more and more to pay close attention to the welding procedure of microelectronic component.
The main method of microelectronic component welding at present has: soldering, melting welding, pressure welding, supersonic welding, laser weld etc.Wherein the method for soldering is to utilize thermal source to melt a kind of low-melting material between the welding body, realize the transition welding of workpiece and matrix, but the low melting material that this method is introduced is different with the material character of workpiece and matrix, when energising owing to the inhomogeneous phenomenon that occurs hot-spot easily of device resistance.Melting welding mainly contains resistance melting welding, plasma arc welding (PAW), electron beam welding etc., and resistance melting welding need be in local heat, the too high serviceability even the damage that can influence electronic device of temperature; The higher while of the cost of PLASMA ARC WELDING is also high for the required precision of welding control; Electron beam welding then need be carried out in vacuum environment, has limited its scope of application.Pressure welding has cold welding and thermocompression bonding, and cold welding requires between workpiece and the matrix tangible deformation to take place, and is very big to the form accuracy influence of microelectronic component, and thermocompression bonding causes the fire damage of microelectronic component easily.Amplitude ratio during ultrasonic bonding is bigger, makes easily to have limited to microminiaturized application by workpiece deformation.Laser weld is a kind of more advanced micro-welding process, but present laser weld mainly is to utilize the heat effect molten material of laser to realize welding, and bigger limitation is also arranged.
At present domestic and international by retrieval little patent report that utilizes laser dynamical stress to weld, the patent of publication number CN1757480 has been introduced a kind of method and apparatus of laser-impact explosive welding, its method is to utilize the laser blasting explosive to make composite bed high-speed impact workpiece, cause that at the bump place material sputter forms welding, but have following problem:
1. the energy that produces of explosive charge is difficult to accurate control, and blast process is repeated very poor, makes the welding condition instability.
2. be subjected to the restriction of explosive volume, be difficult to realize the welding of micro element.
3. because there is pressure minimum critical threshold values in explosive charge, limited the range of application of welding.
4. environment is polluted, the gas after the blast also has certain harm to human body.
5. automation degree is not high enough, is unfavorable for processing in enormous quantities.
Summary of the invention:
The purpose of this invention is to provide a kind of microelectronic component welding method and device based on laser dynamical stress, it is characterized in that utilizing the controlled pulse laser action of high accuracy to produce the blast plasma in surface of the work, the plasma generation active force that expands rapidly, the motion of promotion Work piece high-speed, workpiece flies and bumps with matrix behind the segment distance, produce HTHP at the bump interface, make to reach comprehensive welding effect such as melting, Pressure Welding, diffusion welding (DW), jet between workpiece and the matrix.
Enforcement the inventive system comprises computer, laser instrument, reflection deflection system, condenser lens, condenser lens support, condenser lens mobile platform, condenser lens mobile platform controller, first clamper, second clamper, swivel feeding platform, stepper motor, controllor for step-by-step motor, three-dimensional travelling table, three-dimensional travelling table controller; Computer controlled laser sends pulse laser, and laser is delivered to reflection deflection system, condenser lens successively; Condenser lens is connected with the condenser lens mobile platform by the condenser lens support, and the condenser lens mobile platform is connected with condenser lens mobile platform controller; Be three-dimensional travelling table under the condenser lens, three-dimensional travelling table links to each other with three-dimensional travelling table controller; One of them of clamper that is installed in the swivel feeding platform left and right sides be positioned at condenser lens under, be positioned on the three-dimensional travelling table, on the swivel feeding platform stepper motor is installed, stepper motor is connected with controllor for step-by-step motor.
The present invention realizes by following technical scheme:
(1) utilize computer controlled laser to send pulse laser, laser and surface of the work are made time spent generation blast plasma, plasma promotes workpiece and flies behind the segment distance and the matrix high velocity impact, laser energy and burst length are all accurately controlled by computer, according to the different suitable pulse lasers of welding requirements output, can control the speed of workpiece flight, reach best welding quality.
(2) utilize condenser lens support fixed focus lenses, accurately control moving up and down of condenser lens mobile platform by condenser lens mobile platform controller, condenser lens moves up and down on the drive condenser lens support, can obtain the laser facula of different sizes, thereby satisfy the welding of the microelectronic component of different sizes.
(3) accurately conveying workpieces is to the zone of laser weld to utilize clamper, and clamper does not influence the ability of workpiece high-speed flight after being subjected to laser action.
(4) anglec of rotation of control swivel feeding platform, make the clamper conveying workpieces of one side enter welding region, the clamper of an other side carries out the workpiece to be processed clamping simultaneously, after the welding of welding region is finished, accurately move by controllor for step-by-step motor control step motor, driven rotary feeding platform rotates, and makes workpiece to be processed enter the weld zone.
(5) matrix is positioned over three-dimensional travelling table, by the positional precision of three-dimensional travelling table assurance matrix, regulates three-dimensional travelling table controller and obtains the needed optimum collision distance of welding between workpiece and matrix; In addition, regulate moving of matrix location on the three-dimensional travelling table, can realize the welding of diverse location on the matrix, strengthened the flexibility of welding.
(6) behind the Work piece high-speed collision matrix, workpiece produces high pressure-temperature with matrix collision interface, makes comprehensively welding effect such as melting, Pressure Welding, diffusion welding (DW), jet to take place on workpiece and the weld interface.
Description of drawings:
Fig. 1 is the microelectronic component welder schematic diagram based on laser dynamical stress that proposes according to the present invention.
Fig. 2 is the work schematic diagram of circulation conveying workpieces.
(1) computer, (2) laser instrument, (3) reflection deflection system, (4) condenser lens, (5) condenser lens support, (6) condenser lens mobile platform, (7) condenser lens mobile platform controller, (8) workpiece to be processed, (9) first clampers, (10) three-dimensional travelling table controller, (11) controllor for step-by-step motor, (12) stepper motor, (13) swivel feeding platform, (14) second clampers, (15) workpiece, (16) matrix, (17) three-dimensional travelling table
The specific embodiment:
The flying plate driving type laser microwelding device that the present invention proposes as shown in Figure 1, whole welder is made up of 17 parts.Implementation process is specific as follows, with the diameter for 1mm thickness be the aluminium foil workpiece of 10 μ m and diameter for 4mm thickness be that the aluminium foil matrix of 50 μ m is welded as example.
In conjunction with Fig. 1, carry out the preparation of workpiece 15 and matrix 16 materials earlier, utilize femtosecond laser to cut into the needed profile of welding, be diameter for 1mm thickness be that aluminium foil workpiece 15 and the diameter of 10 μ m is the aluminium foil matrix 16 of 50 μ m for 4mm thickness, use the absolute alcohol clean surface after the annealing in process, back to be dried flattens with two blocks of plane K9 glass.
Utilize 12 actions of controllor for step-by-step motor 11 control step motors then, make swivel feeding platform 13 turn to certain position, to guarantee having enough spaces to realize that workpiece 15 is by 14 clampings of second clamper, utilize controllor for step-by-step motor 11 control step motors 12 driven rotary feeding platforms 13 to rotate again, make second clamper 14 workpiece 15 is transported to the machining area of condenser lens 4 belows.
By of the position decline of three-dimensional travelling table controller 10 with three-dimensional travelling table 17, in the middle of three-dimensional travelling table 17 upper surfaces, place matrix 16, regulate three-dimensional travelling table 17 again and make that distance is necessarily welded in maintenance between matrix 16 and the workpiece 15.
Utilize computer 1 to make laser instrument 2 send the pulsed laser energy that welding needs, the blast plasma workpiece 15 that brings out behind laser emission workpiece 15 surfaces flies to matrix 16 at a high speed, realizes the welding of workpiece 15 and matrix 16 at contact interface.
In conjunction with Fig. 2, after workpiece 15 and matrix 16 welding finished, 12 actions of controllor for step-by-step motor 11 control step motors made swivel feeding platform 13 rotate 180 degree, workpiece to be processed 8 on first clamper 9 is transported to welding region, and second clamper 14 carries out the clamping second time simultaneously.
In sum, a kind of microelectronic component welding method and device based on laser dynamical stress involved in the present invention, the dynamic pressure of laser and material effect generation is applied in the micro-welding process, can weld microelectronic component, remedied the deficiency of conventional microelectronic component welding method, the also perfect welding procedure of microelectronic component.System of the present invention control accuracy height, technology are simple, and welding stability is good, is particularly suitable for the processing and the automated production of fine electronic device.
Claims (6)
1. based on a kind of microelectronic component welding method of laser dynamical stress, it is characterized in that: utilize controlled pulse laser of high accuracy and surface of the work effect to produce the blast plasma, the plasma generation active force that expands rapidly, promote the Work piece high-speed motion and bump, make at bump interface generation HTHP and realize welding between workpiece and the matrix with matrix.
2. a kind of microelectronic component welding method based on laser dynamical stress according to claim 1, it is characterized in that: laser energy and burst length are all accurately controlled by computer, according to the different suitable pulse lasers of welding requirements output, the speed of control workpiece flight.
3. a kind of microelectronic component welding method based on laser dynamical stress according to claim 1, it is characterized in that: accurately control moving up and down of condenser lens mobile platform by condenser lens mobile platform controller, condenser lens moves up and down on the drive condenser lens support, obtain the laser facula of different sizes, thereby satisfy the welding of the microelectronic component of different sizes.
4. a kind of microelectronic component welding method based on laser dynamical stress according to claim 1, it is characterized in that: after the second clamper conveying workpieces of swivel feeding platform one side enters welding region, first clamper of an other side carries out the clamping of workpiece to be processed simultaneously, after the welding of welding region is finished, accurately move by controllor for step-by-step motor control step motor, driven rotary feeding platform rotates, and makes workpiece to be processed enter the weld zone.
5. a kind of microelectronic component welding method based on laser dynamical stress according to claim 1, it is characterized in that: matrix is positioned over three-dimensional travelling table, by the positional precision of three-dimensional travelling table assurance matrix, regulate three-dimensional travelling table controller and obtain the needed bump distance of welding between workpiece and matrix; In addition, regulate moving of matrix location on the three-dimensional travelling table, realize the welding of diverse location on the matrix.
6. realize the device of the described a kind of microelectronic component welding method based on laser dynamical stress of claim 1, it is characterized in that: device comprises computer, laser instrument, reflection deflection system, condenser lens, condenser lens support, condenser lens mobile platform, condenser lens mobile platform controller, first clamper, second clamper, swivel feeding platform, stepper motor, controllor for step-by-step motor, three-dimensional travelling table, three-dimensional travelling table controller; Computer controlled laser sends pulse laser, and laser is delivered to reflection deflection system, condenser lens successively; Condenser lens is connected with the condenser lens mobile platform by the condenser lens support, and the condenser lens mobile platform is connected with condenser lens mobile platform controller; Be three-dimensional travelling table under the condenser lens, three-dimensional travelling table links to each other with three-dimensional travelling table controller; One of them of clamper that is installed in the swivel feeding platform left and right sides be positioned at condenser lens under, be positioned on the three-dimensional travelling table, on the swivel feeding platform stepper motor is installed, stepper motor is connected with controllor for step-by-step motor.
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| CN 200810020643 CN101298115B (en) | 2008-02-19 | 2008-02-19 | Method for welding micro-component based on laser dynamical stress and device |
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| CN 200810020643 CN101298115B (en) | 2008-02-19 | 2008-02-19 | Method for welding micro-component based on laser dynamical stress and device |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102035128A (en) * | 2009-10-05 | 2011-04-27 | 三星移动显示器株式会社 | Laser irradiating system |
| CN102133684A (en) * | 2010-11-25 | 2011-07-27 | 西北工业大学 | Ultrahigh-speed processing platform for high-power laser device |
| CN102274887A (en) * | 2011-08-19 | 2011-12-14 | 江苏大学 | Method and device for forming and assembling microscale part |
| CN101987392B (en) * | 2009-08-04 | 2012-11-21 | 武汉新金首饰制造有限公司 | Solderless automatic welding machine of golden bracelets and welding method |
| CN102974936A (en) * | 2012-11-02 | 2013-03-20 | 中国人民解放军国防科学技术大学 | System for laser focus positioning and method for positioning material on laser focus point |
| CN103316987A (en) * | 2013-05-28 | 2013-09-25 | 江苏大学 | Metal sheet micro-deep drawing automation device and method used under indirect laser shock |
| CN103464888A (en) * | 2012-06-05 | 2013-12-25 | 上海航天设备制造总厂 | Micro stirring welding system integrating laser and mechanical sensors and welding method |
| CN111215743A (en) * | 2020-03-13 | 2020-06-02 | 宁波大学 | Femtosecond laser two-photon micromachining device |
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2008
- 2008-02-19 CN CN 200810020643 patent/CN101298115B/en not_active Expired - Fee Related
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101987392B (en) * | 2009-08-04 | 2012-11-21 | 武汉新金首饰制造有限公司 | Solderless automatic welding machine of golden bracelets and welding method |
| CN102035128A (en) * | 2009-10-05 | 2011-04-27 | 三星移动显示器株式会社 | Laser irradiating system |
| CN102035128B (en) * | 2009-10-05 | 2013-12-04 | 三星显示有限公司 | Laser irradiating system |
| US8320416B2 (en) | 2009-10-05 | 2012-11-27 | Samsung Display Co., Ltd. | Laser irradiation system |
| CN102133684A (en) * | 2010-11-25 | 2011-07-27 | 西北工业大学 | Ultrahigh-speed processing platform for high-power laser device |
| CN102274887B (en) * | 2011-08-19 | 2013-05-08 | 江苏大学 | Method and device for forming and assembling microscale part |
| CN102274887A (en) * | 2011-08-19 | 2011-12-14 | 江苏大学 | Method and device for forming and assembling microscale part |
| CN103464888A (en) * | 2012-06-05 | 2013-12-25 | 上海航天设备制造总厂 | Micro stirring welding system integrating laser and mechanical sensors and welding method |
| CN103464888B (en) * | 2012-06-05 | 2017-10-20 | 上海航天设备制造总厂 | The miniature stirring welding system and welding method of integrated laser and mechanics dual sensor |
| CN102974936A (en) * | 2012-11-02 | 2013-03-20 | 中国人民解放军国防科学技术大学 | System for laser focus positioning and method for positioning material on laser focus point |
| CN102974936B (en) * | 2012-11-02 | 2015-04-22 | 中国人民解放军国防科学技术大学 | System for laser focus positioning and method for positioning material on laser focus point |
| CN103316987A (en) * | 2013-05-28 | 2013-09-25 | 江苏大学 | Metal sheet micro-deep drawing automation device and method used under indirect laser shock |
| CN103316987B (en) * | 2013-05-28 | 2015-03-04 | 江苏大学 | Metal sheet micro-deep drawing automation device and method used under indirect laser shock |
| CN111215743A (en) * | 2020-03-13 | 2020-06-02 | 宁波大学 | Femtosecond laser two-photon micromachining device |
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