CN101274507A - 薄膜输送装置和薄膜输送方法 - Google Patents
薄膜输送装置和薄膜输送方法 Download PDFInfo
- Publication number
- CN101274507A CN101274507A CNA2008100878824A CN200810087882A CN101274507A CN 101274507 A CN101274507 A CN 101274507A CN A2008100878824 A CNA2008100878824 A CN A2008100878824A CN 200810087882 A CN200810087882 A CN 200810087882A CN 101274507 A CN101274507 A CN 101274507A
- Authority
- CN
- China
- Prior art keywords
- film
- conveying roller
- downstream
- film conveying
- roller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H23/00—Registering, tensioning, smoothing or guiding webs
- B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
- B65H23/32—Arrangements for turning or reversing webs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007086403A JP4861873B2 (ja) | 2007-03-29 | 2007-03-29 | フイルム搬送装置及びフイルム搬送方法 |
JP2007-086403 | 2007-03-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN101274507A true CN101274507A (zh) | 2008-10-01 |
Family
ID=39913737
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2008100878824A Pending CN101274507A (zh) | 2007-03-29 | 2008-03-27 | 薄膜输送装置和薄膜输送方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4861873B2 (ja) |
KR (1) | KR20080088372A (ja) |
CN (1) | CN101274507A (ja) |
TW (1) | TW200903178A (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101807529A (zh) * | 2010-03-04 | 2010-08-18 | 成都尚明工业有限公司 | 自动切片分离机 |
CN102381054A (zh) * | 2010-08-26 | 2012-03-21 | 精工爱普生株式会社 | 输送装置、记录装置以及输送方法 |
CN104169053A (zh) * | 2012-03-14 | 2014-11-26 | 亚伊色尔株式会社 | 切断机 |
CN106477377A (zh) * | 2016-12-12 | 2017-03-08 | 深圳市欣中大自动化技术有限公司 | 一种覆盖膜半切装置 |
CN106477370A (zh) * | 2015-08-28 | 2017-03-08 | 株式会社村田制作所 | 卷筒料传送装置 |
CN114311797A (zh) * | 2020-09-29 | 2022-04-12 | 精工爱普生株式会社 | 薄片制造装置 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5801591B2 (ja) * | 2011-04-11 | 2015-10-28 | 日本写真印刷株式会社 | 熱転写装置及び熱転写方法 |
FR3004174B1 (fr) * | 2013-04-09 | 2015-08-21 | Batscap Sa | Dispositif de separation d'au moins deux brins de materiau adjacents et systeme incluant un tel dispositif |
KR101532328B1 (ko) * | 2013-09-30 | 2015-06-30 | 엘아이지인베니아 주식회사 | 초박막 평판표시장치 제조용 봉지필름의 클리닝 장치 |
EP3712077B1 (en) | 2017-11-17 | 2022-03-30 | Tzu-Chung Chen | Parallel method and mechanism for packaging electronic element and coating adhesive on carrier tape and structure thereof |
KR102048466B1 (ko) * | 2017-11-28 | 2019-11-25 | 즈-충 천 | 전자 소자를 테이프에 결합시키는 전자 소자 패키징 기구 |
JP7063596B2 (ja) * | 2017-12-14 | 2022-05-09 | 株式会社アルバック | 透明電極シートの製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2956928B2 (ja) * | 1995-07-06 | 1999-10-04 | ソマール株式会社 | フィルム張付装置におけるフィルム先端処理方法及び装置 |
JP3905605B2 (ja) * | 1997-07-17 | 2007-04-18 | 富士フイルム株式会社 | フィルム張付方法及び装置 |
JP2005347618A (ja) * | 2004-06-04 | 2005-12-15 | Fuji Photo Film Co Ltd | 感光性ウエブユニット、感光性積層体の製造装置及び製造方法 |
JP4881585B2 (ja) * | 2004-07-06 | 2012-02-22 | 富士フイルム株式会社 | 感光性積層体の製造装置及び製造方法 |
-
2007
- 2007-03-29 JP JP2007086403A patent/JP4861873B2/ja not_active Expired - Fee Related
-
2008
- 2008-02-22 KR KR1020080016183A patent/KR20080088372A/ko not_active Application Discontinuation
- 2008-03-19 TW TW097109605A patent/TW200903178A/zh unknown
- 2008-03-27 CN CNA2008100878824A patent/CN101274507A/zh active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101807529A (zh) * | 2010-03-04 | 2010-08-18 | 成都尚明工业有限公司 | 自动切片分离机 |
CN102381054A (zh) * | 2010-08-26 | 2012-03-21 | 精工爱普生株式会社 | 输送装置、记录装置以及输送方法 |
CN104169053A (zh) * | 2012-03-14 | 2014-11-26 | 亚伊色尔株式会社 | 切断机 |
CN106477370A (zh) * | 2015-08-28 | 2017-03-08 | 株式会社村田制作所 | 卷筒料传送装置 |
CN106477370B (zh) * | 2015-08-28 | 2018-06-26 | 株式会社村田制作所 | 卷筒料传送装置 |
CN106477377A (zh) * | 2016-12-12 | 2017-03-08 | 深圳市欣中大自动化技术有限公司 | 一种覆盖膜半切装置 |
CN106477377B (zh) * | 2016-12-12 | 2018-05-11 | 深圳市欣中大自动化技术有限公司 | 一种覆盖膜半切装置 |
CN114311797A (zh) * | 2020-09-29 | 2022-04-12 | 精工爱普生株式会社 | 薄片制造装置 |
US11814791B2 (en) | 2020-09-29 | 2023-11-14 | Seiko Epson Corporation | Sheet manufacturing apparatus |
Also Published As
Publication number | Publication date |
---|---|
JP4861873B2 (ja) | 2012-01-25 |
JP2008242345A (ja) | 2008-10-09 |
TW200903178A (en) | 2009-01-16 |
KR20080088372A (ko) | 2008-10-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20081001 |