CN101274507A - 薄膜输送装置和薄膜输送方法 - Google Patents

薄膜输送装置和薄膜输送方法 Download PDF

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Publication number
CN101274507A
CN101274507A CNA2008100878824A CN200810087882A CN101274507A CN 101274507 A CN101274507 A CN 101274507A CN A2008100878824 A CNA2008100878824 A CN A2008100878824A CN 200810087882 A CN200810087882 A CN 200810087882A CN 101274507 A CN101274507 A CN 101274507A
Authority
CN
China
Prior art keywords
film
conveying roller
downstream
film conveying
roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2008100878824A
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English (en)
Chinese (zh)
Inventor
长谷明彦
森亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of CN101274507A publication Critical patent/CN101274507A/zh
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67132Apparatus for placing on an insulating substrate, e.g. tape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00Registering, tensioning, smoothing or guiding webs
    • B65H23/04Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/32Arrangements for turning or reversing webs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes
CNA2008100878824A 2007-03-29 2008-03-27 薄膜输送装置和薄膜输送方法 Pending CN101274507A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007086403A JP4861873B2 (ja) 2007-03-29 2007-03-29 フイルム搬送装置及びフイルム搬送方法
JP2007-086403 2007-03-29

Publications (1)

Publication Number Publication Date
CN101274507A true CN101274507A (zh) 2008-10-01

Family

ID=39913737

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2008100878824A Pending CN101274507A (zh) 2007-03-29 2008-03-27 薄膜输送装置和薄膜输送方法

Country Status (4)

Country Link
JP (1) JP4861873B2 (ja)
KR (1) KR20080088372A (ja)
CN (1) CN101274507A (ja)
TW (1) TW200903178A (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101807529A (zh) * 2010-03-04 2010-08-18 成都尚明工业有限公司 自动切片分离机
CN102381054A (zh) * 2010-08-26 2012-03-21 精工爱普生株式会社 输送装置、记录装置以及输送方法
CN104169053A (zh) * 2012-03-14 2014-11-26 亚伊色尔株式会社 切断机
CN106477377A (zh) * 2016-12-12 2017-03-08 深圳市欣中大自动化技术有限公司 一种覆盖膜半切装置
CN106477370A (zh) * 2015-08-28 2017-03-08 株式会社村田制作所 卷筒料传送装置
CN114311797A (zh) * 2020-09-29 2022-04-12 精工爱普生株式会社 薄片制造装置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5801591B2 (ja) * 2011-04-11 2015-10-28 日本写真印刷株式会社 熱転写装置及び熱転写方法
FR3004174B1 (fr) * 2013-04-09 2015-08-21 Batscap Sa Dispositif de separation d'au moins deux brins de materiau adjacents et systeme incluant un tel dispositif
KR101532328B1 (ko) * 2013-09-30 2015-06-30 엘아이지인베니아 주식회사 초박막 평판표시장치 제조용 봉지필름의 클리닝 장치
EP3712077B1 (en) 2017-11-17 2022-03-30 Tzu-Chung Chen Parallel method and mechanism for packaging electronic element and coating adhesive on carrier tape and structure thereof
KR102048466B1 (ko) * 2017-11-28 2019-11-25 즈-충 천 전자 소자를 테이프에 결합시키는 전자 소자 패키징 기구
JP7063596B2 (ja) * 2017-12-14 2022-05-09 株式会社アルバック 透明電極シートの製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2956928B2 (ja) * 1995-07-06 1999-10-04 ソマール株式会社 フィルム張付装置におけるフィルム先端処理方法及び装置
JP3905605B2 (ja) * 1997-07-17 2007-04-18 富士フイルム株式会社 フィルム張付方法及び装置
JP2005347618A (ja) * 2004-06-04 2005-12-15 Fuji Photo Film Co Ltd 感光性ウエブユニット、感光性積層体の製造装置及び製造方法
JP4881585B2 (ja) * 2004-07-06 2012-02-22 富士フイルム株式会社 感光性積層体の製造装置及び製造方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101807529A (zh) * 2010-03-04 2010-08-18 成都尚明工业有限公司 自动切片分离机
CN102381054A (zh) * 2010-08-26 2012-03-21 精工爱普生株式会社 输送装置、记录装置以及输送方法
CN104169053A (zh) * 2012-03-14 2014-11-26 亚伊色尔株式会社 切断机
CN106477370A (zh) * 2015-08-28 2017-03-08 株式会社村田制作所 卷筒料传送装置
CN106477370B (zh) * 2015-08-28 2018-06-26 株式会社村田制作所 卷筒料传送装置
CN106477377A (zh) * 2016-12-12 2017-03-08 深圳市欣中大自动化技术有限公司 一种覆盖膜半切装置
CN106477377B (zh) * 2016-12-12 2018-05-11 深圳市欣中大自动化技术有限公司 一种覆盖膜半切装置
CN114311797A (zh) * 2020-09-29 2022-04-12 精工爱普生株式会社 薄片制造装置
US11814791B2 (en) 2020-09-29 2023-11-14 Seiko Epson Corporation Sheet manufacturing apparatus

Also Published As

Publication number Publication date
JP4861873B2 (ja) 2012-01-25
JP2008242345A (ja) 2008-10-09
TW200903178A (en) 2009-01-16
KR20080088372A (ko) 2008-10-02

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Application publication date: 20081001