CN101274392A - Laser processing device, positioning device; observing device and obserbing method - Google Patents
Laser processing device, positioning device; observing device and obserbing method Download PDFInfo
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- CN101274392A CN101274392A CNA2008100903135A CN200810090313A CN101274392A CN 101274392 A CN101274392 A CN 101274392A CN A2008100903135 A CNA2008100903135 A CN A2008100903135A CN 200810090313 A CN200810090313 A CN 200810090313A CN 101274392 A CN101274392 A CN 101274392A
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- 238000003384 imaging method Methods 0.000 claims description 20
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- 239000002184 metal Substances 0.000 description 4
- 239000010453 quartz Substances 0.000 description 4
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- 229910002601 GaN Inorganic materials 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
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- 150000004767 nitrides Chemical class 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
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Abstract
An observation method and an observation device capable of definitely identifying an opaque device pattern formed on a transparent substrate in an observation image d are provided. A bonding plate (4) is bonded to one side formed with the device pattern (3), the transparent substrate is fixed at a transparent carrying table (7) above which an axial transmission irradiation light (L1) and an inclined transmission irradiation light (L2) irradiate in an overlap manner, and the observation is performed via the carrying table (7) by using a back observation unit (6) from the lower direction of the carrying table (7); in the observation image, the dark (black) device pattern images and the bright part other than the device pattern images are observed corresponding to the device pattern (3). Furthermore, the part corresponding to bubbles are quite bright such that the shape of the device pattern (3) can be definitely determined in the observation image.
Description
Technical Field
The present invention relates to a technique capable of clearly identifying a device pattern (device pattern) provided on a transparent or translucent substrate by observing an image.
Background
A method is known in which a device pattern such as a short-wavelength LD (laser diode) or an LED (light emitting diode) is formed on a substrate using a brittle material such as sapphire having high hardness, and a starting point for division is formed by irradiation with a pulsed laser beam (see, for example, patent document 1).
When the division starting points for dividing the substrate into the device chip units are formed by the apparatus disclosed in patent document 1 or another apparatus, a predetermined position reference object provided on the substrate is observed and imaged by using an observation optical system constituted by a CCD (Charge coupled device) camera or the like, and the division position is specified by arithmetic processing based on the coordinates of the specific position reference object based on the obtained imaging data. Further, as the position reference object, a positioning mark or the like formed in advance may be used, or the device pattern itself may be used as the position reference object.
The accuracy of determination of the division position depends on the state of the image of the position reference object obtained by the observation optical system. Therefore, when observing and imaging using an optical observation system, it is necessary to clearly acquire an image of a position reference object and clearly distinguish the position reference object from foreign matter or the like adhering to a substrate. Therefore, when observation is performed using the observation optical system, the observation surface is generally irradiated with illumination light by coaxial illumination (bright field illumination) and oblique illumination (dark field illumination) at the same time.
Patent document 1: international publication No. 2006/062017 pamplet (pamplet)
For example, when a transparent or translucent substrate such as sapphire (hereinafter referred to as "transparent substrate") needs to be divided at a predetermined position, an arbitrary position on the transparent substrate needs to be accurately determined. In this case, it is generally necessary to first determine the arrangement position and the arrangement state of the opaque portions formed on the transparent substrate. For example, when the formed opaque device pattern such as a metal thin film is divided into individual device units, a predetermined adhesive sheet is attached to the main surface on the side where the device pattern is formed, and the main surface on the side where the device pattern is not formed (the adhesive sheet is not attached) of the transparent substrate is fixed toward the side where the processing unit, the observation optical system, and the like are provided. At this time, the device pattern can be observed from the back side through the transparent substrate by the observation optical system.
In this case, if air bubbles generated due to a defective sealing property of the adhesive sheet are present in the interface portion between the adhesive sheet and the transparent substrate, the end portion of the device pattern, and the like, it may be difficult to recognize the air bubbles and the device pattern due to diffused reflection caused by the air bubbles, and the shape of the device pattern cannot be accurately specified from the observation image (captured image).
Further, if a diffusion layer for diffusing illumination light for observation is provided between the device pattern and the transparent substrate, that is, if a diffusion layer as a base layer is formed on the transparent substrate and the device pattern is provided on the diffusion layer, the device pattern must be observed by the observation optical system not only through the transparent substrate but also through the diffusion layer, which may result in failure to obtain an accurate image. In order to improve the light extraction efficiency of the optical device, a layer formed by embossing the surface of the transparent substrate or the like also corresponds to the diffusion layer.
Fig. 9A and 9B are used to explain the observation images obtained at this time. In addition, here, as shown in fig. 9A, an example of observation using the observation unit 106 is illustrated, in which the structure of the laminated body 100 is: a device pattern 103 is formed on one main surface of a transparent substrate 101 as a base diffusion layer 102, and an adhesive sheet 104 is attached to the main surface on the side where the device pattern 103 is formed, and the adhesive sheet 104 side is attached to a stage 107 by suction. Also, bubbles 105 are present at the interface between the adhesive sheet 104 and the transparent substrate 101, and at the end portion of the device pattern 103.
As shown in fig. 9A, epi-illumination light L1001 is irradiated to the transparent substrate 101, and if observation is performed using the observation unit 106 in this state, the illumination light is absorbed or reflected in the diffusion layer 102. Therefore, as shown in fig. 5(b), the observation image I1001 becomes a bright image as a whole, and the influence of bubbles can be canceled, but the device pattern image IP1001 is unclear.
As a method for solving this problem, a method of observing the device pattern using a transmissive illumination system, that is: the susceptor is made of transparent quartz, and the substrate attached to the adhesive sheet is coaxially illuminated (transmission illumination) from below the susceptor through the susceptor.
Fig. 10A and 10B are used to explain the observed images obtained at this time. As shown in fig. 10A, the observation unit 106 is a unit that irradiates the transparent substrate 101 with transmitted illumination light L1002 from the space on the opposite side through the quartz transparent stage 207, and if observation is performed by the observation unit 106 in this state, although illumination of the device pattern 103 portion is not transmitted, an image generated by the transmitted light L1002t can be observed by the observation unit 106 because the illumination is transmitted through a portion other than the portion. Specifically, as shown in fig. 10B, the observation image I1002 produces light attenuation due to absorption and diffusion (diffuse reflection) by the adhesive sheet 104 or the diffusion layer 102, but can obtain a relatively bright image as a whole. However, a dark (black) device pattern image IP1002 can be observed for the portion of the device pattern 103 through which the illumination light cannot transmit. Therefore, the device pattern 103 itself can be observed and recognized with a high contrast ratio with respect to the transparent substrate 101. However, if the bubble 105 is present, the illumination light is refracted, and the image IB1002 of the portion corresponding to the bubble 105 is dark in view compared with the surroundings. If the irradiation light amount is increased in order to brighten the bubble portion, transmission occurs also in the device pattern 103 portion, resulting in a decrease in contrast. There is still a problem that it is difficult to clearly recognize the bubbles 105 and the device pattern 103 in the observation image I1002.
In the case of such transmission illumination, the determination accuracy of the division position is unstable because the transmission degree is not uniform between the lots (lot) of substrates, and the contrast (the sharpness of the image of the device pattern captured by observation) when the device pattern is observed differs for each transparent substrate.
Disclosure of Invention
The present invention has been made in view of the above problems, and an object of the present invention is to provide an observation method capable of accurately recognizing an opaque device pattern formed on a transparent substrate in an observation image, an observation apparatus capable of accurately specifying a processing position using the observation method, and a laser processing apparatus applied to the observation apparatus.
In order to solve the above problems, according to claim 1 of the present invention, there is provided a laser processing apparatus including an observation device for observing an opaque portion formed on one main surface of a transparent substrate as a workpiece, the observation device including: a support unit that supports the transparent substrate, a coaxial illumination light source that irradiates coaxial illumination light, an oblique illumination light source that irradiates oblique illumination light, and an observation unit that observes the transparent substrate from a first principal surface side of the transparent substrate; wherein the supporting means supports the transparent substrate so as to be observable by the observing means, and the coaxial illumination light source and the oblique light source irradiate the transparent substrate with the coaxial illumination light and the oblique illumination light, respectively, from a second main surface side, which is a main surface of the transparent substrate on a side opposite to the first main surface.
An aspect 4 of the present invention provides a positioning device including an observation device for observing an opaque portion formed on one main surface of a transparent substrate, the observation device including: a support unit that supports the transparent substrate, a coaxial illumination light source that irradiates coaxial illumination light, an oblique illumination light source that irradiates oblique illumination light, and an observation unit that observes the transparent substrate from a first principal surface side of the transparent substrate; wherein the supporting means supports the transparent substrate so as to be observable by the observing means, and the coaxial illumination light source and the oblique light source irradiate the transparent substrate with the coaxial illumination light and the oblique illumination light, respectively, from a second main surface side, which is a main surface of the transparent substrate on a side opposite to the first main surface.
The invention according to claim 5 is the positioning device according to claim 4, wherein the observation means is capable of acquiring an observation image of the transparent substrate on the transparent substrate in a state where the coaxial illumination light and the oblique illumination light are irradiated on the transparent substrate in a superimposed manner.
The positioning device according to claim 6 of the present invention is the positioning device according to claim 4, further comprising a combining unit that acquires a combined image of a first observation image that can be observed by the imaging unit when the transparent substrate is irradiated with the on-axis illumination light and a second observation image that can be observed by the imaging unit when the transparent substrate is irradiated with the oblique illumination light.
An aspect 7 of the present invention provides an observation apparatus for observing an opaque portion formed on one main surface of a transparent substrate, the observation apparatus including: a support unit that supports the transparent substrate, a coaxial illumination light source that irradiates coaxial illumination light, an oblique illumination light source that irradiates oblique illumination light, and an observation unit that observes the transparent substrate from a first principal surface side of the transparent substrate; wherein the supporting means supports the transparent substrate so as to be observable by the observing means, and the coaxial illumination light source and the oblique light source irradiate the transparent substrate with the coaxial illumination light and the oblique illumination light, respectively, from a second main surface side, which is a main surface of the transparent substrate on a side opposite to the first main surface.
Claim 8 of the present invention is the observation device according to claim 7, wherein the observation means is capable of acquiring an observation image of the transparent substrate on the transparent substrate in a state where the coaxial illumination light and the oblique illumination light are irradiated on the transparent substrate in a superimposed manner.
The invention according to claim 10 is the observation device according to claim 7, wherein the amount of light to be observed by the observation means in the observation area is adjustable by adjusting an irradiation state of at least one of the coaxial illumination light and the oblique illumination light on the transparent substrate.
Claim 11 of the present invention is the observation device according to claim 10, wherein a distance between the coaxial illumination light source and the opaque substrate is adjustable with respect to at least one of the coaxial illumination light source and the oblique illumination light source.
Claim 14 of the present invention is the observation device according to claim 7, wherein the support means is a transparent stage, and the observation means is configured to observe the transparent substrate through the stage.
The observation device according to claim 15 of the present invention is the observation device according to claim 7, wherein the coaxial illumination light and the oblique illumination light are irradiated to the transparent substrate from above the transparent substrate supported by the support means, and the observation means is configured to observe the transparent substrate from below the transparent substrate.
An aspect 16 of the present invention provides a method of observing an opaque portion formed on one main surface of a transparent substrate, the method comprising irradiating the transparent substrate with coaxial illumination light and oblique illumination light in a superimposed manner from one side of the transparent substrate while supporting the transparent substrate by a predetermined supporting means, and observing the transparent substrate from the other side of the transparent substrate by a predetermined observing means.
The invention according to claim 17 is the method for observing an opaque portion on a transparent substrate according to claim 16, wherein at least one of the coaxial illumination light and the oblique illumination light is adjusted so that the amount of light of a portion of the transparent substrate within an observation area other than the opaque portion is substantially the same throughout the observation area, the amount of light being grasped by the observation means.
Claim 19 of the present invention is the method of observing an opaque portion on a transparent substrate according to claim 17, wherein the irradiation state is adjusted by adjusting at least one of a luminance of a coaxial illumination light source for irradiating the coaxial illumination light and a luminance of an oblique illumination light source for irradiating the oblique illumination light.
Claim 20 of the present invention is the method of observing an opaque portion on a transparent substrate according to claim 17, wherein the irradiation state is adjusted by adjusting an irradiation angle of the oblique illumination light with respect to the opaque substrate.
Claim 21 of the present invention is the method of observing an opaque portion on a transparent substrate according to claim 16, wherein the supporting means is a transparent stage, the transparent substrate is supported by fixing the transparent substrate to the stage such that the other side faces the stage, and the transparent substrate is observed through the stage by the observing means.
Claim 22 is the method of observing an opaque portion on a transparent substrate according to claim 16, wherein the coaxial illumination light and the oblique illumination light are irradiated to the transparent substrate from above the transparent substrate supported by the supporting means, and the transparent substrate is observed from below the transparent substrate by the observing means.
Claim 23 provides a method of observing an opaque portion formed on one main surface of a transparent substrate, the method including the steps of: (a) a step of irradiating the transparent substrate with coaxial illumination light from one side of the transparent substrate and capturing a first observation image from the other side of the transparent substrate by a predetermined imaging means; (b) a step of irradiating oblique illumination light from one side of the transparent substrate to the transparent substrate and capturing a second observation image from the other side of the transparent substrate by a predetermined imaging means; (c) and generating a composite image of the first observation image and the second observation image.
According to claims 1 to 23 of the present invention, in the case where the opaque portion is formed on the transparent substrate, the shape of the opaque portion such as the device pattern can be clearly specified in the observation image.
In particular, according to claims 1 to 3 of the present invention, when a transparent substrate having an opaque portion is used as a workpiece, the shape of the opaque portion on the transparent substrate can be clearly determined, and high-precision laser processing can be performed.
In particular, according to claims 4 to 7 of the present invention, when positioning a transparent substrate having an opaque portion, the shape of the opaque portion on the transparent substrate can be clearly determined, and high-precision laser processing can be performed.
In particular, according to claims 5 to 13 and 17 to 20 of the present invention, since observation is performed after the light amounts of the coaxial illumination light and the oblique illumination light are appropriately adjusted, the contrast between the transparent portion and the opaque portion can be improved and a good observation result can be obtained.
In particular, according to claim 14 and claim 21 of the present invention, the shape of the opaque portion can be clearly recognized in a state where the transparent substrate is stably held.
Drawings
Fig. 1A and 1B are views for explaining the observation method according to the first embodiment of the present invention.
Fig. 2 shows in more detail the irradiation of the on-axis transmitted illumination light L1 and the irradiation of the oblique-incidence transmitted illumination light L2.
Fig. 3 is a schematic diagram schematically showing the structure of the laser processing apparatus 50.
Fig. 4 is a schematic configuration diagram schematically illustrating a laser processing apparatus 500 according to a second embodiment.
Fig. 5 shows an example of an observation image I2 captured by the CCD camera 6a when the coaxial illumination light L1 is irradiated.
Fig. 6 shows an example of an observation image I3 captured by the CCD camera 6a when the coaxial illumination light L2 is irradiated.
Fig. 7 shows a synthesized image I4 synthesized based on the observed image I2 shown in fig. 5 and the observed image I3 shown in fig. 6.
Fig. 8 is a diagram for explaining an observation method of the modification.
Fig. 9A and 9B are used to explain a case where a stacked body in which a diffusion layer is provided between a device pattern and a transparent substrate is observed using epi-illumination.
Fig. 10A and 10B are used to explain the case of observing a laminated body in which a diffusion layer is provided between a device pattern and a transparent substrate using transmission illumination.
Detailed Description
<1 > first embodiment >
<1.1. schematic Structure for Observation >
Fig. 1A and 1B are views for explaining the observation method according to the first embodiment of the present invention. In the present embodiment, the observation target is a laminate 10 in which a diffusion layer 2 for diffusing observation illumination light is provided as a base layer on one main surface of a transparent substrate 1 such as sapphire and an opaque device pattern 3 such as a metal wiring or an electrode is formed, as shown in fig. 1A, and the description will be given by way of example.
Further, the following form is also possible: a transparent semiconductor layer made of a group III nitride such as GaN (gallium nitride) is provided between the transparent substrate 1 and the device pattern 3.
In the present embodiment, as shown in fig. 1A, the device pattern 3 is observed by attaching an adhesive sheet 4 to the main surface of the laminate 10 on the side where the device pattern 3 is formed, and fixing the adhesive sheet 4 side to a transparent stage 7 made of, for example, quartz. In addition, air bubbles 5 are caused to exist on the interface between the adhesive sheet 4 and the transparent substrate 1, and the end portion of the device pattern 3. The observation method of the present embodiment is more effective in observing the laminate 10 fixed in this manner.
This fixing can be achieved by known methods. For example, in the case of performing suction fixing, a plurality of concentric suction grooves are provided on the upper surface of the stage 7, and radial suction holes are provided in the bottom of the suction grooves, so that suction means such as a suction pump connected to the suction holes is operated in a state where the workpiece is placed on the upper surface of the stage 7, thereby applying a suction force to the workpiece along the suction grooves.
In the present embodiment, the laminated body 10 is irradiated with coaxial illumination light (bright field illumination light) L1 having an incident angle of 90 degrees (having an optical axis substantially perpendicular to the principal surface of the substrate) and oblique illumination light (dark field illumination light) L2 having an acute incident angle simultaneously from above the stage 7, that is, from the back side of the transparent substrate 1, and a back surface observation unit 6 composed of, for example, a CCD camera or a predetermined display device is provided below the stage 7, so that the device pattern 3 can be observed through the stage 7. That is, the coaxial illumination light L1 and the oblique illumination light L2 are simultaneously applied as transmission illumination light, and observation is performed by the back surface observation unit 6. Accordingly, in the following description, the coaxial illumination light L1 and the oblique illumination light L2 are referred to as coaxial transmissive illumination light L1 and oblique transmissive illumination light L2, respectively.
As the light sources of the coaxial illumination light L1 and the oblique illumination light L2, for example, a highly directional (at an irradiation angle of about 15 degrees) high-luminance white LED is preferable. Further, a bulb or an emitting end face of an optical fiber may be used.
Fig. 1B illustrates an observation image I1 obtained by the back surface observation unit 6 at this time. At this time, the coaxial transmission illumination light L1 and the oblique transmission illumination light L2 are not transmitted on the device pattern 3 portion. Therefore, in the observed image I1, a dark (black) device pattern image IP1 is observed corresponding to the device pattern 3. Then, the transmitted light L1t is obtained in the portion other than the device pattern 3. The transmitted light L1t is formed by superimposing a component directly transmitted by the coaxial transmitted illumination light L1 and a component finally transmitted by the oblique transmitted illumination light L2 after being diffused (diffused) in the adhesive sheet 4 and the diffusion layer 2. As a result, the observation image I1 showed: the portion other than the device pattern image IP1 is brighter. In addition, although both the coaxial transmission illumination light L1 and the oblique transmission illumination light L2 are refracted in the bubble 5, the oblique transmission illumination light L2 is diffused as described above, and thus the portion IB1 corresponding to the bubble 5 is sufficiently bright in the observed image I1. This means that: even when the air bubbles 5 and the like are present, the light amount unevenness of the observation image I1 at the portion other than the opaque portion formed by the device pattern 3 can be suppressed by irradiating the oblique transmission illumination light L2. The results were: in the observation image I1, the black device pattern image IP1 has sufficient contrast with other portions and can be clearly recognized.
That is, the laminated body 10 having the device pattern 3 formed on the transparent substrate 1 is fixed to the stage 7 by attaching the adhesive sheet 4 to the side on which the device pattern 3 is formed, irradiated with the coaxial transmission illumination light L1 and the oblique transmission illumination light L2 while being overlapped from above the stage 7, and observed from below the stage 7 through the stage 7 using the back surface observation unit 6, whereby the shape of the device pattern 3 can be clearly specified in the observed image. In addition, the shape of the opaque portion can be clearly recognized by the above method without being limited to the device pattern as long as the opaque portion is formed similarly. In addition, since the adhesive sheet 4 is not necessarily required for observation, the transparent substrate 1 may be placed on the stage 7 directly for observation in principle. In this case, the observation can be prevented from being affected by the diffuse reflection by the adhesive sheet 4.
Fig. 2 more specifically shows an irradiation state of the coaxial transmission illumination light L1 from the coaxial illumination light source S1 and an irradiation state of the oblique transmission illumination light L2 from the oblique illumination light source S2. Specifically, the transparent substrate 1 is irradiated from above the stage 7 with the coaxial transmission illumination light L1 emitted from the coaxial illumination light source S1 and the oblique transmission illumination light L2 emitted from the oblique illumination light source S2.
However, in order to obtain a more preferable effect by improving the contrast of the opaque portion by irradiating the oblique transmission illumination light L2 as described above, it is preferable to have a configuration in which the irradiation state with respect to at least one of the coaxial transmission illumination light L1 and the oblique transmission illumination light L2 can be adjusted so that the light quantity of the transparent substrate 1 other than the opaque portion in the observation region is substantially the same as the light quantity of the entire observation region (at least the brightness in the case of visual observation is the same). For example, in the case of fig. 1A and 1B, by balancing the irradiation of the coaxial transmission illumination light L1 and the oblique transmission illumination light L2, the portion IB1 corresponding to the bubble 5 in the observation image I1 may be observed with a contrast different from that of the portion directly obtained by the transmission light L1. In this case, if the irradiation state is adjusted so that the contrast of both is the same, the opaque portion can be more reliably recognized.
As one of the measures, the distance between at least one of the coaxial illumination light source S1 for emitting the coaxial transmission illumination light L1 and the oblique illumination light source S1 for emitting the oblique illumination light L2 and the transparent substrate 1 may be adjusted so that the light amounts of the entire observation region are substantially the same except for the opaque portions. Fig. 2 illustrates a case where the coaxial illumination light source S1 is farther from the transparent substrate 1 than the oblique illumination light source S2.
Alternatively, the brightness of at least one of the coaxial illumination light source S1 and the oblique illumination light source S2 may be adjusted so that the light quantity is substantially the same in the entire observation region except for the opaque portion. Alternatively, as shown in fig. 2, a diffusion plate D may be provided between the coaxial illumination light source S1 and the irradiation position.
Further, the incident angle θ of the oblique-transmission illumination light L2 may be adjusted so that the light quantity is substantially the same in the entire observation region except for the opaque portion.
In addition, these adjustment methods may be appropriately selected or used in combination according to the observation target.
In addition, when the observation means is an image pickup device such as a CCD camera, for example, the light quantity of the observation region can be numerically grasped in pixel units, and an optimum irradiation state (optimum conditions such as the position, brightness, and angle of the light source) can be determined based on the numerical data obtained by the image pickup device.
In fig. 2, the case where two oblique illumination light sources S2 are provided symmetrically with respect to the irradiation direction of the coaxial transmission illumination light L1 as the axis of symmetry is illustrated, but the number of oblique illumination light sources S2 is not limited to this, and a larger number of oblique illumination light sources S2 may be disposed to face each other with respect to the irradiation direction of the coaxial transmission illumination light L1 as the axis of symmetry.
<1.2 > apparatus for laser processing >
Next, a laser processing apparatus as an example of an observation apparatus capable of observing based on the above principle will be described. Fig. 3 is a schematic view showing a structure of the laser processing apparatus 50. In fig. 3, the case where the object to be processed (the object to be observed) is the laminate 10 bonded to the adhesive sheet 4 is illustrated, but the object is not limited to this. The operations of the respective sections of the laser processing apparatus 50 (irradiation of the laser beam, movement of the stage, irradiation of the illumination light, arithmetic processing for determining the processing position, and the like) described below are all controlled by a predetermined control unit constituted by a computer or the like (not shown).
The laser processing apparatus 50 mainly includes a front surface observation unit 50A, a rear surface observation unit 50B, and a transparent stage 7 made of, for example, quartz or the like, which is movable therebetween. The front surface observation unit 50A is an observation unit for observing the workpiece placed on the stage 7 from the laser beam irradiation side, and the back surface observation unit 50B is an observation unit for observing the laminate 10 from the side placed on the stage 7 (this is referred to as the back surface) via the stage 7. The stage 7 can be moved in the horizontal direction by a moving mechanism 7 m.
The moving mechanism 7m moves the stage 7 in the two XY-axis directions defined in the horizontal plane by the action of a driving means not shown. This enables the stage 7 to move between the front surface observation unit 50A and the back surface observation unit 50B, and the observation position or the laser irradiation position in each observation unit. That is, in the laser processing apparatus 50, the movement mechanism 7m moves the stage 7, and thereby the front side observation by the front side observation unit 50A and the back side observation by the back side observation unit 50B can be switched. This makes it possible to perform optimum observation flexibly and quickly depending on the material and state of the workpiece. The movement mechanism 7m is preferably capable of independently performing a rotation (θ rotation) operation and a horizontal drive operation in a horizontal plane around a predetermined rotation axis, and is preferably capable of performing an operation such as alignment.
The surface observation unit 50A is configured to be able to irradiate the laser beam to the workpiece placed on the stage 7. That is, the front surface observation unit 50A is also a laser irradiation unit in the laser processing apparatus 50. The surface observation unit 50A is configured coaxially with the laser irradiation system and the observation optical system, for example. Specifically, the front surface observation unit 50A may have the same basic structure as that of the laser processing apparatus disclosed in patent document 1.
Specifically, in the surface observation unit 50A, the laser beam LB is emitted from the laser source SL, reflected by the half mirror 51 provided in the lens barrel, not shown, and then condensed by the condenser lens 18, and the laser beam LB is focused on the portion to be processed of the object placed on the stage 7 in a state where the stage 7 is positioned in the surface observation unit 50A, and the object is irradiated with the focused laser beam LB, whereby the object is processed, for example, a melt-modified region serving as a division starting point is formed or ablation is performed.
In the front observation unit 50A, the epi-illumination light L5 emitted from the epi-illumination light source S5 is reflected by a semi-transparent and semi-reflective mirror 52 provided in a lens barrel (not shown) and condensed by the condenser lens 18, and is irradiated to the object to be processed coaxially with the laser beam LB (in a state where the stage 7 is positioned in the front observation unit 50A). The surface observation unit 50A includes a surface observation unit 16 including a CCD camera 16a provided above the half mirror 52 (above the lens barrel) and a monitor 16b connected to the CCD camera 16a, and can observe a bright field image of the workpiece in real time in a state where the epi-illumination light L5 is irradiated.
When the machining position is determined based on the observation image obtained by the surface observation unit 50A, the machining may be performed by irradiating the laser beam LB according to the determined content.
It is preferable that the operator of the laser processing apparatus 50 confirms the captured image captured by the CCD camera 16a displayed on the monitor 16b and specifies the processing position by using a GUI realized by a control unit not shown. That is, it is preferable that the GUI operator provides a predetermined instruction input for specifying the machining position, and the control means performs a predetermined arithmetic processing based on the input content to specify the machining position.
The back surface observation unit 50B is configured based on the above principle, and is configured so that the workpiece placed on the stage 7 is irradiated with the coaxial projection illumination light L1 from the coaxial illumination light source S1 and the oblique projection illumination light L2 from the oblique illumination light source S2 from above the stage 7 while being superimposed on each other with the stage 7 positioned in the back surface observation unit 50B, and the workpiece can be observed from below the stage 7 by the back surface observation unit 6.
Further, the rear observation unit 6 including the CCD camera 6a and the monitor 6B connected to the CCD camera 6a is provided below the stage 7 in the rear observation unit 50B, more preferably below the half mirror 9 (below the lens barrel) described later. The monitor 6b may be shared with the monitor 16b of the surface observation unit 16.
When the object to be processed is the laminated body 10 in which the device pattern 3 is formed on the transparent substrate 1, the adhesive sheet 4 is bonded to the side where the device pattern 3 is formed, and the laminated body is fixed to the stage 7, the stage 7 is arranged at a predetermined observation position of the rear surface observation unit 50B, and the device pattern 3 can be observed with good contrast by observing the object using the rear surface observation unit 6 in a state where the coaxial projection illumination light L1 and the oblique projection illumination light L2 are irradiated in a superimposed manner. That is, an observed image capable of accurately determining the device pattern 3 as shown in fig. 1B, for example, can be acquired.
When the machining position is determined based on the observation image obtained by the back surface observation unit 50B, the stage 7 is then moved toward the front surface observation unit 50A having the laser irradiation unit, and the laser beam LB can be irradiated for machining. In this case, it is also preferable that the machining position be specified by an operator by providing a predetermined instruction input based on the observation image using the GUI.
Preferably, the surface observation unit 50A includes an oblique illumination light source S6, and is capable of irradiating the workpiece on the stage 7 with oblique illumination light L6. When the oblique illumination light L6 is irradiated, a dark field image of the observation target can be acquired by the surface observation unit 16. By appropriately switching between the epi-illumination light L5 and the oblique-illumination light L6 depending on the material and the surface state of the workpiece, an appropriate observation image can be obtained regardless of the material.
Further, under the stage 7, the coaxial illumination light L3 emitted from the coaxial illumination light source S3 is reflected by a semi-transparent and semi-reflective mirror 9 provided in a lens barrel, not shown, and condensed by a condenser lens 8, and then the object can be irradiated through the stage 7. More preferably, the oblique illumination light source S4 is provided below the stage 7, and the workpiece can be irradiated with oblique illumination light L4 through the stage 7. For example, in the case where the front surface of the workpiece has an opaque metal layer or the like, which is reflected from the metal layer and makes it difficult to observe the workpiece from the front surface side using the front observation unit 50A, the coaxial illumination light source S3 and the oblique illumination light source S4 can be used to observe the rear surface side of the workpiece through the rear observation unit 50B.
As described above, the laser processing apparatus 50 of the present embodiment has the front surface observation unit 50A that irradiates illumination light from the front surface side of the workpiece to observe the workpiece during processing using laser light, and the rear surface observation unit 50B that allows observation from the rear surface side while transmitting illumination from the front surface side of the workpiece, and can observe not only from the front surface side but also from the rear surface side of the workpiece by epi-illumination, and can determine a processing position based on each observation result, thereby enabling processing of workpieces of various materials and states. In particular, the shape of the device pattern can be clearly determined by attaching the adhesive sheet 4 to the side of the laminated body 10 having the device pattern formed on the transparent substrate, fixing the laminated body 10 to the stage 7, and observing the laminated body using the rear surface observation unit 50B. This enables the machining position to be determined with high accuracy based on the observation result.
<2 > second embodiment
In the above-described embodiment, the case where the laminated body 10 is observed in a state where, for example, the coaxial illumination light L1 having an emission angle of 90 degrees and the oblique illumination light L2 having an acute incident angle are simultaneously irradiated to the back surface observation unit 50B of the laser processing apparatus 50 has been described, but the observation method is not limited to this, as a matter of course.
Fig. 4 is a schematic configuration diagram schematically illustrating a laser processing apparatus 500 according to a second embodiment. The same components as those of the laser processing apparatus 50 according to the first embodiment are denoted by the same reference numerals, and the description thereof is omitted as appropriate.
The laser processing apparatus 500 includes a control unit C configured by a general computer or the like. The control unit C is connected to each mechanism to which the laser processing apparatus 500 belongs via a cable, not shown, and controls each mechanism of the laser processing apparatus 500 based on an input instruction from an operator or signals from various sensors and the like.
Although not shown in fig. 3, the laser processing apparatus 50 according to the first embodiment also includes a control unit configured by a general computer or the like, and the various kinds of control described above are performed under the control of the control unit. However, the control unit C used in the laser processing apparatus 500 according to the second embodiment is different from the control unit according to the first embodiment in that it is capable of performing alternate irradiation control of two types of irradiation light and performing image combining calculation of two types of observation images when each irradiation light is generated independently, as described later.
Fig. 5 shows an example of an observation image I2 captured by the camera 6a when the coaxial illumination light L1 is irradiated. Fig. 6 shows an example of an observation image I3 captured by the camera 6a when oblique illumination light L2 is emitted.
In the present embodiment, the controller C drives the coaxial illumination light source S1 and the oblique illumination unit S2 independently, and irradiates the layered body 10 with the coaxial illumination light L1 and the oblique illumination light L2 separately, i.e., with a time shift. The controller C stores an observation image I2 captured by the camera 6a when only the laminate 10 is irradiated with the coaxial illumination light L1 and an observation image I3 captured by the camera 6a when only the laminate 10 is irradiated with the oblique illumination light L2 in a storage unit (not shown) included in the controller C. And the order of acquiring the observed image I2 and the observed image I3 is arbitrary.
In the present embodiment, the camera 6a acquires a monochrome (2-value) image using 1-bit representation (2 gradations), but is not limited to this, and may acquire a 2-value image using a monochrome multi-gradation (for example, 4-bit to 16 gradations, 8-bit to 256 gradations) of a plurality of bits. Here, "multi-gradation" means that each pixel is expressed by a plurality of bits, and two levels of "black" and "white" may be used (for example, 4 bits indicate that the middle gradation value is 0 or 15, and 8 bits indicate that the middle gradation value is 0 or 255). Alternatively, the backside observation unit 50B may be configured to take an observation image of gray scale (or full color) by the camera 6a and perform a monochromatization (2-value) process on the observation image by the control unit C.
When the laminated body 10 placed on the stage 7 is irradiated with coaxial illumination light L1 from above and is imaged by the camera 6a from below the laminated body 10 (the side opposite to the irradiation), an observation image I2 of a bright field image can be acquired as shown in fig. 5. In the observed image I2, a dark (black) device pattern image IP2 can be observed for the device pattern 3 portion. That is, the device pattern 3 itself can be observed and recognized with a high contrast ratio with respect to the transparent substrate 101. As shown in fig. 5, a dark image may be observed on the observation image IB2 corresponding to the portion of the bubble 5 due to refraction of the illumination light.
In addition, when oblique illumination light L2 is irradiated from above onto the laminate 10 placed on the stage 7 and an image is picked up from below (the side opposite to the irradiation) of the laminate 10 by the camera 6a, an observation image I3 of a dark field image can be acquired as shown in fig. 6. When compared with the observation image I2, in the observation image I3, as shown in fig. 5, the light and shade of the portion other than the device pattern image IP3 are reversed. That is, a portion corresponding to the device pattern 3 is observed as a dark device pattern image IP3, and a portion IB3 corresponding to the bubble 5 is observed as a bright (white) image.
Fig. 7 shows a synthesized image I4 synthesized based on the observed image I2 shown in fig. 5 and the observed image I3 shown in fig. 6. The control unit C that stores the observation image I2 and the observation image I3 in the storage unit performs bit arithmetic processing (specifically, logical sum arithmetic processing) by an arithmetic unit (not shown) based on the observation image I2 and the observation image I3. Specifically, when both the gradation value of a specific pixel included in the observation image I2 and the gradation value of a pixel included in the observation image I3 corresponding to the specific pixel position are "black" (the gradation value is 0), the arithmetic unit performs a process of making the gradation value of the specific pixel 0. In other combination (that is, when at least one of the gradation value of a specific pixel included in the observation image I2 and the gradation value of a pixel included in the observation image I3 corresponding to the specific pixel position is "white (the gradation value is 1)", the process of making the gradation value of the specific pixel always 1 is performed, and the control unit C performs the above arithmetic process to acquire the composite image I4 shown in fig. 7.
As shown in fig. 7, in the composite image I4, the portion IB4 corresponding to the bubble 5 substantially disappears, and the portion (device pattern image IP4) corresponding to the device pattern 3 can be recognized with a higher contrast with respect to the transparent substrate 1. That is, in the present embodiment, when the laminate 10 is observed by the back surface observation unit 50B, the coaxial illumination light L1 and the oblique illumination light L2 are separately irradiated, the observation images I2 and I3 are acquired and stored in the storage means in the control unit C, and then the observation images I2 and I3 are subjected to image synthesis (logical and arithmetic processing) by arithmetic processing. Thereby, the transparent portion of the transparent substrate 1 and the opaque portion of the device pattern 3 can be clearly recognized.
In the first embodiment, since the coaxial illumination light L1 and the oblique illumination light L2 are simultaneously irradiated, it is necessary to fix and adjust one of the light quantities when adjusting the light quantity. Therefore, for example, when the light amounts of the two illumination lights are adjusted in 3 stages, it is necessary to perform a total of 9 (3 × 3) times of imaging operations. In the present embodiment, by performing the imaging operation 6 times in total (3 +3 times), the control unit C can synthesize images of all 9 patterns, and the adjustment time of the illumination relationship in the back surface observation unit 50B can be shortened.
Although detailed description is omitted, the above observation method can be applied to: the irradiation of the coaxial illumination light L3 and the oblique illumination light L4 to the laminate 10 is observed through the back surface observation unit 50B.
<3. modification >
In the above embodiment, the oblique illumination light source S2 is, for example, a white LED or the like, and is disposed to face each other with the irradiation direction of the coaxial transmission illumination light L1 as the axis of symmetry, but instead of this, a ring-shaped illumination light source or a hemispherical illumination light source around the axis of symmetry may be used as the oblique illumination light source S2.
In the first embodiment, the coaxial illumination light L1 and the oblique illumination light L2 are irradiated as the transmission illumination light from above the stage so as to be superimposed on each other, and the observation is performed by the back surface observation unit provided below the stage, but instead of this, the laminated body 10 having the device pattern 3 formed on the transparent substrate 1 may be fixed to the stage 7 by using the adhesive sheet 4 as in the above case, and in this state, the coaxial illumination light L1 and the oblique illumination light L2 may be irradiated from below the stage 7 so as to be superimposed on each other, and the observation may be performed by the observation unit 26 provided above the stage 7. Fig. 8 is a diagram for explaining an observation method in this case. In this case, a dark (black) device pattern image corresponding to the device pattern 3 can be observed in the observed image, and a portion other than the device pattern image IP1 can be observed brightly. Furthermore, it was observed that the portion IB1 corresponding to bubble 5 was also sufficiently bright. That is, even when the structure shown in fig. 8 is used for observation, the black device pattern can be clearly recognized with a sufficient contrast with other portions. In the observation device structure of this modification, the observation method described in the second embodiment can be applied.
In addition, although this embodiment can be realized by providing the irradiation light sources of the coaxial illumination light L1 and the oblique illumination light L2 below the stage 7 in the front surface observation unit 50A of the laser processing apparatus 50, for example, in this case, the laser light irradiated during processing passes through the stage 7 and reaches these irradiation light sources, and adversely affects these irradiation light sources, and therefore, in the case of adopting such a configuration, at least the arrangement of the irradiation light sources at the time of laser irradiation needs to be carefully considered. This results in a disadvantage of complicating the structure of the apparatus. However, the above-described embodiment is not necessarily considered, and is superior in this respect.
Alternatively, the carrier table need not be horizontally disposed, but may be vertically or obliquely disposed. In this case, the relative positional relationship between the illumination light source and the observation unit and the stage may be arranged in the same manner as in the case shown in fig. 1A and 1B.
In the above-described embodiment, the laminated body to be observed is fixed to the transparent stage, but instead of this, another method may be employed as long as the observation unit can acquire the device pattern in a state of being irradiated with the coaxial transmission illumination light and the oblique illumination light, and the fixing method is not limited to this. For example, the same observation results as those of the above-described embodiments can be obtained by holding the portion (for example, only the end portion) of the laminate other than the observation target together with the adhesive sheet by a predetermined support means so that the observation target portion (the adhesive sheet) is directly exposed to the observation means.
Although the device pattern 3 is mainly observed in the above embodiment, observation for the purpose of identifying an opaque portion formed on a transparent substrate and its surrounding portion can be performed more generally, and the above observation method can be similarly applied.
In the laser processing apparatuses 50 and 500 according to the above embodiments, the position of the device pattern 3 (opaque portion) is specified in advance by the back surface observation unit 50B. Then, the laser processing apparatuses 50 and 500 move the stage 7 toward the front surface observation unit 50A by the moving mechanism 7m, and convey the laminate 10 to the front surface observation unit 50A, thereby performing laser processing for forming division starting points on the transparent substrate 1. That is, in the laser processing apparatuses 50 and 500, the rear surface observation unit 50B and the movement mechanism 7m are mainly used as the positioning mechanism. When an opaque portion such as the device pattern 3 is formed on the transparent substrate 1, the substrate can be precisely positioned by using such a positioning mechanism.
Claims (23)
1. A laser processing apparatus having an observation device for observing an opaque portion formed on one main surface of a transparent substrate as a workpiece,
the observation device includes:
a supporting unit for supporting the transparent substrate,
a coaxial illumination light source for illuminating coaxial illumination light,
an oblique illumination light source for irradiating oblique illumination light, and
an observation unit for observing the transparent substrate from a first main surface side of the transparent substrate; wherein,
the supporting unit supports the transparent substrate so as to be observable by the observing unit,
the coaxial illumination light source and the oblique light source irradiate the transparent substrate with the coaxial illumination light and the oblique illumination light, respectively, from a second main surface side, which is a main surface of the transparent substrate located on an opposite side of the first main surface.
2. The laser processing apparatus according to claim 1, wherein the observation means is capable of acquiring an observation image of the transparent substrate in a state where the coaxial illumination light and the oblique illumination light are irradiated on the transparent substrate in a superimposed manner.
3. The laser processing apparatus according to claim 1, further comprising a combining unit that obtains a combined image of a first observation image that can be observed by the imaging unit when the coaxial illumination light is irradiated onto the transparent substrate and a second observation image that can be observed by the imaging unit when the oblique illumination light is irradiated onto the transparent substrate.
4. A positioning device having an observation device for observing an opaque portion formed on one main surface of a transparent substrate,
the observation device includes:
a supporting unit for supporting the transparent substrate,
a coaxial illumination light source for illuminating coaxial illumination light,
an oblique illumination light source for irradiating oblique illumination light, and
an observation unit for observing the transparent substrate from a first main surface side of the transparent substrate; wherein,
the supporting unit supports the transparent substrate so as to be observable by the observing unit,
the coaxial illumination light source and the oblique light source irradiate the transparent substrate with the coaxial illumination light and the oblique illumination light, respectively, from a second main surface side, which is a main surface of the transparent substrate located on an opposite side of the first main surface.
5. The positioning device according to claim 4, wherein the observation means is capable of acquiring an observation image of the transparent substrate in a state where the coaxial illumination light and the oblique illumination light are irradiated on the transparent substrate in a superimposed manner.
6. The positioning device according to claim 4, further comprising a combining unit that acquires a combined image of a first observation image that can be observed by the imaging unit when the coaxial illumination light is irradiated onto the transparent substrate and a second observation image that can be observed by the imaging unit when the oblique illumination light is irradiated onto the transparent substrate.
7. An observation apparatus for observing an opaque portion formed on one main surface of a transparent substrate, comprising:
a supporting unit for supporting the transparent substrate,
a coaxial illumination light source for illuminating coaxial illumination light,
an oblique illumination light source for irradiating oblique illumination light, and
an observation unit for observing the transparent substrate from a first main surface side of the transparent substrate; wherein,
the supporting unit supports the transparent substrate so as to be observable by the observing unit,
the coaxial illumination light source and the oblique light source irradiate the transparent substrate with the coaxial illumination light and the oblique illumination light, respectively, from a second main surface side, which is a main surface of the transparent substrate located on an opposite side of the first main surface.
8. The observation apparatus according to claim 7, wherein the observation means is capable of acquiring an observation image of the transparent substrate in a state where the coaxial illumination light and the oblique illumination light are irradiated on the transparent substrate in a superimposed manner.
9. The observation apparatus according to claim 7, further comprising a combining means for obtaining a combined image by performing arithmetic combination of a first observation image that can be observed by the imaging means when the transparent substrate is irradiated with the coaxial illumination light and a second observation image that can be observed by the imaging means when the transparent substrate is irradiated with the oblique illumination light.
10. The observation apparatus according to claim 7, wherein the amount of light to be observed by the observation means in the observation area is adjustable by adjusting an irradiation state of at least one of the coaxial illumination light and the oblique illumination light on the transparent substrate.
11. The observation apparatus according to claim 10, wherein a distance between the coaxial illumination light source and the opaque substrate is adjustable with respect to at least one of the coaxial illumination light source and the oblique illumination light source.
12. The observation apparatus according to claim 10, wherein the brightness of at least one of the coaxial illumination light source and the oblique illumination light source can be adjusted.
13. The observation apparatus according to claim 10, wherein an irradiation angle of the oblique illumination light with respect to the opaque substrate can be adjusted.
14. Observation device according to claim 7,
the supporting unit is a transparent bearing table,
the observation unit is used for observing the transparent substrate through the bearing platform.
15. Observation device according to claim 7,
irradiating the transparent substrate with the coaxial illumination light and the oblique illumination light from above the transparent substrate supported by the support unit,
the observation unit is used for observing the transparent substrate from the lower part of the transparent substrate.
16. A method of observing an opaque portion formed on one main surface of a transparent substrate, characterized in that,
the transparent substrate is irradiated with coaxial illumination light and oblique illumination light in a superimposed manner from one side of the transparent substrate while being supported by a predetermined supporting means, and the transparent substrate is observed from the other side of the transparent substrate by a predetermined observing means.
17. The method of observing an opaque portion on a transparent substrate according to claim 16, wherein at least one of the irradiation state of the coaxial illumination light and the irradiation state of the oblique illumination light is adjusted so that the light quantity of the portion of the transparent substrate within the observation area other than the opaque portion is substantially the same throughout the observation area, wherein the light quantity is grasped by the observation means.
18. The method of observing an opaque portion on a transparent substrate according to claim 17, wherein the irradiation state is adjusted by adjusting a distance between the transparent substrate and at least one of a coaxial illumination light source for irradiating the coaxial illumination light and an oblique illumination light source for irradiating the oblique illumination light.
19. The method of observing an opaque portion on a transparent substrate according to claim 17, wherein the irradiation state is adjusted by adjusting at least one of a luminance of a coaxial illumination light source for irradiating the coaxial illumination light and a luminance of an oblique illumination light source for irradiating the oblique illumination light.
20. The method of observing an opaque portion on a transparent substrate according to claim 17, wherein the irradiation state is adjusted by adjusting an irradiation angle of the oblique illumination light with respect to the opaque substrate.
21. The method for observing an opaque part on a transparent substrate as claimed in claim 16,
the supporting unit is a transparent bearing table,
fixing the transparent substrate on the stage so that the other side faces the stage to support the transparent substrate,
the transparent substrate is observed through the stage by the observation unit.
22. The method for observing an opaque part on a transparent substrate as claimed in claim 16,
irradiating the transparent substrate with the coaxial illumination light and the oblique illumination light from above the transparent substrate supported by the support unit,
the transparent substrate is observed from below the transparent substrate by the observation unit.
23. A method for observing an opaque portion formed on one main surface of a transparent substrate, comprising the steps of:
(a) a step of irradiating the transparent substrate with coaxial illumination light from one side of the transparent substrate and capturing a first observation image from the other side of the transparent substrate by a predetermined imaging means;
(b) a step of irradiating oblique illumination light from one side of the transparent substrate to the transparent substrate and capturing a second observation image from the other side of the transparent substrate by a predetermined imaging means;
(c) and generating a composite image of the first observation image and the second observation image.
Applications Claiming Priority (4)
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| JP2007-087508 | 2007-03-29 | ||
| JP2007087508 | 2007-03-29 | ||
| JP2008056422A JP5332238B2 (en) | 2007-03-29 | 2008-03-06 | Laser processing equipment |
| JP2008-056422 | 2008-03-06 |
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| CN101274392A true CN101274392A (en) | 2008-10-01 |
| CN101274392B CN101274392B (en) | 2011-04-06 |
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| CN2008100903135A Active CN101274392B (en) | 2007-03-29 | 2008-03-28 | Laser processing device, positioning device; observing device and observing method |
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| JP (3) | JP5332238B2 (en) |
| CN (1) | CN101274392B (en) |
| TW (1) | TWI344882B (en) |
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| CN101870030A (en) * | 2010-06-29 | 2010-10-27 | 哈尔滨工业大学 | Device and method for detecting visual reverse molten pool images in aluminum alloy TIG welding with additional auxiliary light source |
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| JP5274966B2 (en) * | 2008-09-30 | 2013-08-28 | 株式会社ディスコ | Processing equipment |
| JP5521332B2 (en) * | 2009-01-21 | 2014-06-11 | 三星ダイヤモンド工業株式会社 | Observation device, positioning device, laser processing device, and observation method |
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| JPS6276642A (en) * | 1985-09-30 | 1987-04-08 | Toshiba Corp | Defect inspecting method for semiconductor |
| JP2841214B2 (en) * | 1989-09-27 | 1998-12-24 | 旭化成工業株式会社 | Nonwoven fabric defect detector |
| JP3179963B2 (en) * | 1994-04-26 | 2001-06-25 | 松下電器産業株式会社 | Laser processing device and laser processing method |
| JP2000326085A (en) * | 1999-05-20 | 2000-11-28 | Nec Corp | Laser beam machine and inspection device |
| JP2002310939A (en) * | 2001-04-18 | 2002-10-23 | Nec Corp | Air-bubble inspection system |
| JP2003075725A (en) * | 2001-09-04 | 2003-03-12 | Olympus Optical Co Ltd | Transmitted illumination device |
| CN2535181Y (en) * | 2002-02-07 | 2003-02-12 | 武汉楚天激光（集团）股份有限公司 | Coaxial observation and display device of aser processing |
| JP2004309426A (en) * | 2003-04-10 | 2004-11-04 | Denso Corp | Method and apparatus for evaluating translucent substrate |
| JP4228778B2 (en) * | 2003-05-21 | 2009-02-25 | ウシオ電機株式会社 | Pattern inspection device |
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- 2008-03-26 TW TW097110862A patent/TWI344882B/en active
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Also Published As
| Publication number | Publication date |
|---|---|
| JP5482862B2 (en) | 2014-05-07 |
| JP5332238B2 (en) | 2013-11-06 |
| TWI344882B (en) | 2011-07-11 |
| JP2013079963A (en) | 2013-05-02 |
| JP2013068621A (en) | 2013-04-18 |
| CN101274392B (en) | 2011-04-06 |
| TW200902204A (en) | 2009-01-16 |
| JP5482863B2 (en) | 2014-05-07 |
| JP2008264869A (en) | 2008-11-06 |
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