CN101266803B - 圆盘状基板的制造方法、清洗装置 - Google Patents
圆盘状基板的制造方法、清洗装置 Download PDFInfo
- Publication number
- CN101266803B CN101266803B CN2008100828897A CN200810082889A CN101266803B CN 101266803 B CN101266803 B CN 101266803B CN 2008100828897 A CN2008100828897 A CN 2008100828897A CN 200810082889 A CN200810082889 A CN 200810082889A CN 101266803 B CN101266803 B CN 101266803B
- Authority
- CN
- China
- Prior art keywords
- porous matter
- matter roller
- disc wafer
- roller
- disc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 title abstract description 27
- 238000005406 washing Methods 0.000 title abstract 6
- 230000007246 mechanism Effects 0.000 claims abstract description 44
- 238000004140 cleaning Methods 0.000 claims description 74
- 238000009991 scouring Methods 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 14
- 239000012530 fluid Substances 0.000 claims description 13
- 230000000694 effects Effects 0.000 claims description 8
- 239000007788 liquid Substances 0.000 abstract description 4
- 239000008187 granular material Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 104
- 239000002245 particle Substances 0.000 description 15
- 238000005507 spraying Methods 0.000 description 9
- 239000004575 stone Substances 0.000 description 6
- 239000004744 fabric Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 238000005201 scrubbing Methods 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 238000007514 turning Methods 0.000 description 3
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 2
- 229910001573 adamantine Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 238000000280 densification Methods 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920003227 poly(N-vinyl carbazole) Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229930182556 Polyacetal Natural products 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000001398 aluminium Chemical class 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- FYIBGDKNYYMMAG-UHFFFAOYSA-N ethane-1,2-diol;terephthalic acid Chemical compound OCCO.OC(=O)C1=CC=C(C(O)=O)C=C1 FYIBGDKNYYMMAG-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000013308 plastic optical fiber Substances 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000001223 reverse osmosis Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Cleaning In General (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007063387A JP2008226349A (ja) | 2007-03-13 | 2007-03-13 | 円盤状基板の製造方法、洗浄装置 |
JP2007-063387 | 2007-03-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101266803A CN101266803A (zh) | 2008-09-17 |
CN101266803B true CN101266803B (zh) | 2011-06-22 |
Family
ID=39761421
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008100828897A Active CN101266803B (zh) | 2007-03-13 | 2008-03-11 | 圆盘状基板的制造方法、清洗装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20080223402A1 (zh) |
JP (1) | JP2008226349A (zh) |
CN (1) | CN101266803B (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4528677B2 (ja) * | 2005-06-24 | 2010-08-18 | 株式会社東芝 | パターンド媒体の製造方法及び製造装置 |
US8250695B2 (en) * | 2009-10-05 | 2012-08-28 | Applied Materials, Inc. | Roller assembly for a brush cleaning device in a cleaning module |
MY167830A (en) * | 2009-12-29 | 2018-09-26 | Hoya Corp | Glass substrate for magnetic disk and manufacturing method thereof |
CN102194473A (zh) * | 2010-03-03 | 2011-09-21 | 株式会社日立高新技术 | 清洗方法及其装置 |
CN104011795B (zh) * | 2011-12-29 | 2017-02-22 | Hoya株式会社 | 磁盘用玻璃基板的制造方法 |
JP5886224B2 (ja) * | 2012-05-23 | 2016-03-16 | 株式会社荏原製作所 | 基板洗浄方法 |
US10269555B2 (en) | 2015-09-30 | 2019-04-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Post-CMP cleaning and apparatus |
JP6877221B2 (ja) * | 2017-04-05 | 2021-05-26 | 株式会社荏原製作所 | 基板洗浄装置、基板洗浄方法および基板洗浄装置の制御方法 |
CN109612253B (zh) * | 2018-11-21 | 2020-09-01 | 深圳市华星光电技术有限公司 | 双滚轮装置 |
CN109724986A (zh) * | 2018-12-12 | 2019-05-07 | 江苏大学 | 一种笔记本电脑顶盖面板缺陷自动检测装置 |
CN112570347A (zh) * | 2020-11-12 | 2021-03-30 | 来有合 | 一种汽车刹车盘清洁去尘装置 |
CN112474462B (zh) * | 2020-12-02 | 2022-06-24 | 浙江汇隆晶片技术有限公司 | 一种半导体晶圆表面清理装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2325852Y (zh) * | 1998-04-22 | 1999-06-23 | 李锦珠 | 径向往复式碟片清洁装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6904637B2 (en) * | 2001-10-03 | 2005-06-14 | Applied Materials, Inc. | Scrubber with sonic nozzle |
-
2007
- 2007-03-13 JP JP2007063387A patent/JP2008226349A/ja active Pending
-
2008
- 2008-03-11 US US12/046,103 patent/US20080223402A1/en not_active Abandoned
- 2008-03-11 CN CN2008100828897A patent/CN101266803B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2325852Y (zh) * | 1998-04-22 | 1999-06-23 | 李锦珠 | 径向往复式碟片清洁装置 |
Also Published As
Publication number | Publication date |
---|---|
CN101266803A (zh) | 2008-09-17 |
US20080223402A1 (en) | 2008-09-18 |
JP2008226349A (ja) | 2008-09-25 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: CITIZEN SEIMITSU CO., LTD. Effective date: 20120628 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20120628 Address after: Tokyo, Japan Patentee after: SHOWA DENKO Kabushiki Kaisha Address before: Tokyo, Japan Co-patentee before: CITIZEN SEIMITSU Co.,Ltd. Patentee before: SHOWA DENKO Kabushiki Kaisha |
|
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: Lishennoco Co.,Ltd. Address before: Tokyo, Japan Patentee before: Showa electrical materials Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230706 Address after: Tokyo, Japan Patentee after: Showa electrical materials Co.,Ltd. Address before: Tokyo Patentee before: SHOWA DENKO Kabushiki Kaisha |
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TR01 | Transfer of patent right |