CN101251565A - Panel test circuit structure - Google Patents
Panel test circuit structure Download PDFInfo
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- CN101251565A CN101251565A CNA200810081826XA CN200810081826A CN101251565A CN 101251565 A CN101251565 A CN 101251565A CN A200810081826X A CNA200810081826X A CN A200810081826XA CN 200810081826 A CN200810081826 A CN 200810081826A CN 101251565 A CN101251565 A CN 101251565A
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Abstract
The invention provides a panel testing circuit structure which comprises a plurality of transmission lines and a display module, wherein the transmission lines are in electrical connection with the display module; each transmission line comprises an input part, a testing part and an output part; both ends of the testing part are respectively in electrical connection with the input part and the output part; one end of the output part is in electrical connection with the display module, while the testing signal, which is used in panel testing and is also provided via a testing circuit board, is input to the testing part by means of a plurality of probes and then is transmitted to the display module via the output part. Panels of number drive modules which have different structures, circuit span and element foot positions can use the same probe and relevant test equipment such as the test circuit board to carry out panel testing.
Description
Technical field
The display device that the invention relates to a kind of panel test circuit structure and use this panel test circuit structure.
Background technology
The flat display apparatus of display panel and use display panel becomes the main flow of all kinds of display device gradually.Display screen of the LCD monitor of the slim TV of family expenses, personal computer and laptop computer, mobile phone and digital camera etc. for example is the product of a large amount of use display panels.
Because price competition fierceness on the present panel market, the key factor that reduces production costs effectively and how in rate war, to win with being, the circuit span of driving element dwindled and increase component pins position (Channels) number simultaneously and can effectively reduce driving element and use number and the employed area of driving element, also and then reduce the cost of the driving element of single panel, yet dwindle and when component pins position (Channels) number increases, also might dwindle having influence on panel test because of the size of driving element (for example drive integrated circult) in the circuit span.
Be illustrated in figure 1 as the synoptic diagram of traditional panel test circuit structure.As shown in the figure, the traditional panel test circuit structure comprises test module 30, display module 50 and transmission line 70.Panel test circuit structure is the some of display device.Before driving element is fixed in test module 30, utilize testing circuit board 91 and a plurality of probe 90 to check all circuits and pixel (Pixel), in the hope of the panel of finding out display module 50 whether unusual array is arranged, wherein, described these probes 90 electrically connect testing circuit board 91.In addition, the method for manufacturing technology of driving element comprises a glass flip chip method (Chip On Glass) and a membrane of flip chip method (Chip On Film).
As shown in Figure 1, panel test circuit structure is to utilize testing circuit board 91 to drive described these probes 90 are moved to suitable test position and height, and then the testing cushion on the engaged test module 30 31, and then utilize testing circuit board 91 to provide test signal to transfer on the testing cushion 31 to probe 90 and with test signal.The notion of this action is that the action of analog-driven element is tested, and wherein testing cushion 31 is by plurality of transmission lines 70 and a display module 50 electrically connects, and by transmission line 70 test signal is transferred to described display module 50.Display module 50 will be estimated the respective pixel that produces relatively with test signal according to the shown pixel of the test signal that is received, and check the whether normal operation of all circuits of display module and pixel by this.
Yet in the known panel test circuit structure, the span between a plurality of testing cushion 31 is limited by the span of probe 90.In other words, if the span of testing cushion 31 is less than probe 90 detectable minimum spans, panel test can't effectively be carried out, span between testing cushion 31 and the probe 90 does not match and will bring the loose contact or the probe 90 of probe 90 and testing cushion 31 to contact simultaneously with above a testing cushion 31, and then cause inaccurate panel test result, or the risk that causes even can't test.In addition, another problem is, when the pin position of the driving element of device increases or kind changes, and the quantity of 30 corresponding testing cushion that are provided with 31 of test module and the transmission line 70 or position is set also needs to change to some extent.At present, need in the manufacturing process with different types of test equipment, testing circuit board 91 or probe 90 with in response to above variation.In brief, the circuit span that different test modules 30 has, component pins position (Channels) number and position are all different, therefore in conversion use test module, therefore panel test also will need to use different testing circuit board 91 and probe 90, thereby the increase production cost, and then cause the reduction of product competitive power on market.
Summary of the invention
The object of the present invention is to provide a kind of panel test circuit structure, testing cushion can be shifted out to carry out panel test under driving element.
Another object of the present invention is to provide a kind of panel test circuit structure, can make the panel of the different display device of the driving element that has different circuit spans carry out panel test with same group of probe.
Another object of the present invention is to provide a kind of panel test circuit structure, can make the driving element framework is that the shared same group of probe of panel of the display device of glass flip chip method or membrane of flip chip method carries out panel test.
Another object of the present invention is to provide a kind of panel test circuit structure, can make the shared same group of probe of panel of the different display device of the driving element that has different elements pin position (Channel) number and position carry out panel test.
Panel test circuit structure of the present invention comprises display module and plurality of transmission lines.And driver module will electrically connect described these transmission lines after panel test is finished, and wherein driver module comprises a plurality of driving elements; Display module acceptance test signal also shows corresponding a plurality of pixel, and described these pixels will be come relatively to determine whether the operating state of display module is normal with the pixel of normal demonstration.Transmission line is arranged between driver module and the display module, each transmission line comprises an input part, a test department and an efferent, the two ends of test department are electrically connected at input part and efferent respectively, one end of input part is electrically connected at driver module, and an end of efferent is electrically connected at display module.In the panel test of panel, test signal will be provided and will be conveyed to display module by probe transmission at last to test department and via efferent by testing circuit board.
Transmission line of the present invention is arranged between an insulation course and the substrate with a fan-shaped state, the area contained greater than input part of the area contained of efferent wherein, and a plurality of through holes are formed at this insulation course and the test department of transmission line are exposed to outside the insulation course, when carrying out panel test, a plurality of testing cushion are passed through hole and are electrically connected at test department, and the probe contact also is electrically connected at testing cushion and test signal is transferred to display module via test department and efferent; And in another preferred embodiment, probe passes a plurality of through holes and is electrically connected at test department, and test signal is transferred to display module via test department and efferent.
The panel that has the number driver module of different frameworks, different circuit span or different elements pin position, relevant testing apparatus such as all can be shared identical probe and testing circuit board is in order to carry out panel test.
Description of drawings
Fig. 1 is the synoptic diagram of traditional panel test circuit structure;
Fig. 2 a is the synoptic diagram of the preferred embodiment of panel test circuit structure of the present invention;
Fig. 2 b is the sectional view of A to A ' tangent line shown in Fig. 2 a;
Fig. 2 c is the synoptic diagram of the alternate embodiment of panel test circuit structure shown in Fig. 2 a;
Fig. 3 a is the synoptic diagram of another embodiment of panel test circuit structure of the present invention;
Fig. 3 b is the sectional view of B to B ' tangent line shown in Fig. 3 a;
Fig. 3 c is the synoptic diagram of the alternate embodiment of panel test circuit structure shown in Fig. 3 a;
Fig. 4 a, Fig. 4 b and Fig. 4 c are the synoptic diagram of the testing cushion of panel test circuit structure shown in Fig. 3 a and the 3c, and wherein Fig. 4 a, Fig. 4 b and Fig. 4 c define the span D1 of testing cushion respectively;
Fig. 5 is the manufacture method process flow diagram of the preferred embodiment of panel test circuit structure of the present invention; And
Fig. 6 is the process flow diagram of the alternate embodiment of manufacture method shown in Figure 5.
Drawing reference numeral:
300 driver modules
310 driving elements
500 display modules
700 transmission lines
710 input parts
720 test departments
730 efferents
740 through holes
750 testing cushion
760 test groups
810 substrates
820 insulation courses
910 probes
920 testing circuit boards
The D1 span
Embodiment
The invention provides the panel of a kind of panel test circuit structure for test display apparatus.Be device driving element (for example drive integrated circult) on the display device that the present invention tested, in general, driving element structure packing technique comprises glass flip chip method and membrane of flip chip method.In addition, display device described herein comprises but does not limit the flat display apparatus that uses display panel.Do not show circuit and test circuit structure of the present invention is not limited to the survey of panel, test circuit structure of the present invention also can be used for other electronic installations of testing to determine element or module operational function.
Fig. 2 a is depicted as the panel test circuit structure of one embodiment of the invention.Panel test circuit structure comprises display module 500 and plurality of transmission lines 700.And all driver modules 300 of the display device that the present invention tested electrically connect transmission line 700 and comprise a plurality of driving elements 310, a plurality of drive signals of driving element 310 outputs.Drive signal is used the actual degree of reversing that produces the liquid crystal molecule of pixel (Pixel) in the control display module 500 for to input to the source electrode of thin film transistor (TFT) in the display module 500 (Thin Film Transistor) and the voltage of grid from driving element 310.But, in preferred embodiment, when carrying out panel test, driving element 310 is not installed in the driver module 300 as yet, therefore, when carrying out panel test, described these drive signals will be replaced by a plurality of test signal, and described these test signals will be provided by testing circuit board 920, rather than are provided by driver module 300.The structure manufacturing process of driver module 300 in the present invention comprises glass flip chip method (Chip On Glass) and membrane of flip chip method (Chip On Film).
Shown in Fig. 2 a, transmission line 700 comprises input part 710, test department 720 and efferent 730.One end of efferent 730 and display module 500 electrically connects, the other end is electrically connected at test department 720; In other words, the two ends of test department 720 are electrically connected at input part 710 and efferent 730 respectively.
In addition, shown in Fig. 2 a, a plurality of testing cushion 750 are electrically connected at the test department 720 of transmission line 700, and testing cushion 750 is preferably transparent conductive body, as electrically conducting transparent materials such as tin indium oxides; And each testing cushion 750 is electrically connected at the single test department 720 of its correspondence, and the height of the testing circuit board 920 control probes 910 of test usefulness and position so that make probe 910 contacts and transmitted test signal to described testing cushion 750; Then this test signal is transferred to the source electrode or the grid of the thin film transistor (TFT) of display module 500 via testing cushion 750, test department 720 and input part 730.Described these testing cushion 750 are preferable to have identical span, and test signal will unified input to the testing cushion 750 of the test department 720 that is arranged at transmission line 700.
Shown in Fig. 2 a, the span of test department 720 is more than or equal to the span of input part 710 and efferent 730, and the difference of input part 710, test department 720 and 730 spans of efferent be for test in be complementary in order to the span of the probe 910 of transmitted test signal and design.Because the distribution area of driver module 300 is usually less than the distribution area of display module 500, therefore, the source electrode of electrically connect each thin film transistor (TFT) (Thin Film Transistor) to the display module 500 and the transmission line 700 of grid must be distributed on the panel with fan-shaped distribution form.In detail, each of the plurality of transmission lines 700 of fan-shaped distribution form to the spacing of adjacent efferent 730 greater than each spacing to adjacent input part 710.Among the different embodiment, the driver module 300 of different frameworks (glass flip chip method or membrane of flip chip method) all can be linked to the input part 710 of transmission line 700, and test department 720 and the efferent 730 via transmission line 700 extends to display module 500 then.In other words, even the design size of driver module 300 changes, the test department 720 of its electrically connect still can be kept Fixed Design and spacing.Therefore, have the panel of the number driver module 300 of different frameworks, different circuit span or different elements pin position (Channels), relevant testing apparatus such as all can be shared identical probe 910 and testing circuit board 920 is to carry out panel test.
Fig. 2 b is the sectional view of preferred embodiment of the present invention A to A ' tangent line in Fig. 2 a.See it by Fig. 2 b, the display device that panel test circuit structure was positioned at of the embodiment of the invention comprises the test department 720 of transmission line 700, substrate 810, insulation course 820, be arranged at the through hole 740 on the test department 720 and be arranged at the testing cushion 750 of through hole 740.The test department 720 of transmission line 700 is arranged between substrate 810 and the insulation course 820, all have through hole 740 to form on it corresponding to the insulation course 820 of test department 720 tops, and testing cushion 750 is passed through hole 740 and be electrically connected at the test department 720 of transmission line 700.Testing cushion 750 is made with conductive material, and to transmit electronic signal, wherein this conductive material comprises tin indium oxide (ITO).The testing circuit board 920 control probes 910 of test usefulness are with engaged test pad 750, and transmitted test signal is to testing cushion 750 by this, and then, test signal transfers to display module 500 via the test department 720 and the efferent 730 of testing cushion 750, transmission line 700.
It shown in Fig. 2 c the alternate embodiment of embodiment shown in Fig. 2 a, wherein said these testing cushion 750 are divided into a plurality of test group 760, the sum of wherein said these test test departments 720 that group 760 has equals to need the grid of thin film transistor (TFT) (Thin Film Transistor) of electrically connect and test or the total quantity of source electrode, each described these test group 760 has described these test departments 720 of similar number, yet in other embodiments, each is tested group 760 and also can have described these test departments 720 of different numbers.Meaning promptly, the usefulness of this alternate embodiment means in single test can use probe 910 maximum quantities and required testing film transistor (Thin Film Transistor) number difference in increasing, the panel test gradation is carried out, perhaps can be tested with testing circuit board 920 with the probe 910 of array correspondingly-sized simultaneously.For example, when probe 910 numbers are that 1000 but transistorized grid of required testing film or source electrode quantity are when being 5000, test department 720 with grid or source electrode electrically connect can be divided into five test groups 760 that have 1000 test departments 720, therefore in the panel test, probe 910 can be divided into five times to carry out in each test group 760 respectively, perhaps, can utilize five groups of testing circuit boards 920 to test simultaneously with 1000 probes 910.
Fig. 3 a is depicted as another embodiment of panel test circuit structure of the present invention.The difference of present embodiment and above-mentioned preferred embodiment is will omit testing cushion 750 and with the test department 720 of the also direct input test signal of probe 910 electrically connects to transmission line 700, by this this test signal be transferred to the source electrode (Source) or the grid (Gate) of the thin film transistor (TFT) (Thin-Film_Transistor) of display module 500 via test department 720 and input part 730.
Be depicted as the sectional view of B to B ' tangent line among Fig. 3 a by Fig. 3 b, see it by Fig. 3 b, the display device that panel test circuit structure was positioned at of the embodiment of the invention comprises the test department 720 of transmission line 700, substrate 810, insulation course 820 and is arranged at through hole 740 on the test department 720.The test department 720 of transmission line 700 is arranged between substrate 810 and the insulation course 820, all have through hole 740 to form on it corresponding to the insulation course 820 of test department 720 tops, and through hole 740 is exposed to test department 720 outside the insulation course 820.And the testing circuit board 920 control probes 910 of test usefulness pass through hole 740 and can contact and electrically connect test department 720, and transmitted test signal is to the test department 720 of transmission line 700, then, the source electrode or the grid of the test signal thin film transistor (TFT) that transfers to display module 500 via the test department 720 and the efferent 730 of transmission line 700.The size of through hole 740 is equal to or greater than the size of probe 910.
Fig. 3 c is depicted as the alternate embodiment of present embodiment.Shown in Fig. 3 c, test department 720 further comprises a plurality of test group 760, and the summation of the number of the test department 720 that wherein said these test groups 760 are had equals the grid of corresponding thin film transistor (TFT) (Thin Film Transistor) or the total quantity of source electrode.Preferably, described test group 760 all has the test department 720 of similar number, yet in other embodiments, each tests the test department 720 that group 760 also can have varying number.The usefulness of this alternate embodiment means in single test can use probe 910 maximum quantities and required testing film transistor (Thin FilmTransistor) number difference in increasing, the panel test gradation is carried out, perhaps can be tested with testing circuit board 920 with the probe 910 of array correspondingly-sized simultaneously.For example, when probe 910 numbers are that 1000 but transistorized grid of required testing film or source electrode quantity are when being 5000, test department 720 with grid or source electrode electrically connect can be divided into five test groups 760 that have 1000 test departments 720, therefore panel test can be divided into five times and carry out in each test group 760 respectively, perhaps, can utilize five groups of testing circuit boards 920 to test with 1000 probes 910.
It shown in Fig. 4 a, 4b and the 4c synoptic diagram of a pair of adjacent testing cushion 750 (or test department 720).The span D1 of the corresponding testing cushion 750 of span palpus of the probe 910 that uses in the panel test, contact with surpassing a testing cushion 750 simultaneously with the loose contact of avoiding probe 910 and testing cushion 750 or probe 910, and then cause the inaccurate of panel test or even cause the risk that to test.The span D1 of every pair of adjacent testing cushion 750 has three kinds of definition modes, be defined as from the distance of the central point of a testing cushion 750 of the central point of each testing cushion 750 and adjacency at the span D1 of the testing cushion 750 shown in Fig. 4 a, be defined as from the distance on one side to same one side of another this testing cushion 750 of adjacency of each testing cushion 750 at the span D1 of two adjacent testing cushion 750 shown in Fig. 4 b and Fig. 4 c.The span of probe 910 must be less than or equal to the span D1 of testing cushion 750 to avoid the situation of above-mentioned probe 910 and testing cushion 750 loose contacts.Wherein each is preferably equal in fact to the distance between the adjacent testing cushion 750.Yet in different embodiment, the distance between the adjacent testing cushion 750 also can be unequal because of the needs of design.In the present embodiment, the span D1 of testing cushion 750 is preferable to be essentially 30 microns (μ m), but this span D1 also can change because of the reduction of the spacing of described these probes 910 or the needs in the design.
Figure 5 shows that the manufacture method process flow diagram of panel test circuit structure preferred embodiment of the present invention.And the structure manufacturing process of the driver module 300 of the display device that panel test circuit structure is tested among the present invention comprises glass flip chip method (Chip On Glass) and membrane of flip chip method (Chip On Film).
At first step 1010 is located in transmission line 740 between insulation course 820 and the substrate 810, insulation course 820 with transmission line 700 electrical isolation in other electronic components.
Step 1040 item is that testing cushion 750 is passed through hole 740 and is electrically connected at test department 720, and testing cushion 750 is electrically connected at the single test department 720 of its correspondence for electric conductor and single testing cushion 750.
As shown in Figure 6, it is that transmission line 700 is located between insulation course 820 and the substrate 810 that the manufacture method process flow diagram in another embodiment of the present invention comprises step 1010, insulation course 820 with transmission line 700 electrical isolation in other electronic components.
The present invention is being described by above-mentioned related embodiment, yet the foregoing description is only for implementing example of the present invention.It must be noted that the embodiment of exposure does not limit the scope of the invention.On the contrary, being contained in the modification of the spirit of claim and scope and equalization is provided with and all is contained in the scope of the present invention.
Claims (21)
1. a panel test circuit structure is used to transmit a test signal, it is characterized in that, described panel test circuit structure comprises:
One display module receives described test signal; And
Plurality of transmission lines, electrically connect described display module, be used to transmit described test signal, and each described these transmission line comprises an input part, a test department and an efferent, two ends of wherein said test department electrically connect with described input part and described efferent respectively, and an end of described efferent and described display module electrically connect.
2. panel test circuit structure as claimed in claim 1 is characterized in that, described these transmission lines have a fan-shaped distribution pattern, and the spacing of described these efferents of described these transmission lines is greater than the spacing of described these input parts of described these transmission lines.
3. as 1 described panel test circuit structure, it is characterized in that, the area that the area that described these efferents of described these transmission lines are contained is contained greater than described these test departments, and the area that the area that described these test departments are contained is contained greater than described these input parts.
4. panel test circuit structure as claimed in claim 1 is characterized in that the width of described these test departments of described these transmission lines is more than or equal to the width of described input part and described these efferents.
5. panel test circuit structure as claimed in claim 1 is characterized in that, described panel test circuit structure further comprises:
One testing circuit board provides described test signal; And
A plurality of probes electrically connect described testing circuit board and accept and transmit described test signal to described test department, and wherein the width of the described test department of each described transmission line is more than or equal to the width of each described these probe.
6. panel test circuit structure as claimed in claim 1, it is characterized in that, described panel test circuit structure further comprises a driver module, electrically connect with the other end of described input part, described driver module is for sending a drive signal, and wherein said driver module comprises a plurality of driving elements.
7. panel test circuit structure as claimed in claim 6 is characterized in that described driving element comprises integrated circuit component, and the set-up mode of described these driving elements comprises a glass flip chip method and a membrane of flip chip method.
8. panel test circuit structure as claimed in claim 1, it is characterized in that, described panel test circuit structure further comprises a substrate and an insulation course, wherein said these transmission lines are arranged between described substrate and the described insulation course, a plurality of through holes are formed on the described insulation course, and described these test departments of described transmission line partly are to be exposed to outside the described insulation course via described these through holes.
9. panel test circuit structure as claimed in claim 8 is characterized in that, described panel test circuit structure further comprises a plurality of test group, and wherein each described test group is made up of a plurality of adjacent described these test departments of part.
10. panel test circuit structure as claimed in claim 9 is characterized in that, each described group that tests has described these test departments that number equates.
11. panel test circuit structure as claimed in claim 9 is characterized in that, each described test group has unequal described these test departments of number.
12. panel test circuit structure as claimed in claim 8 is characterized in that, the bore size of described these through holes is equal to or greater than the described size that waits probe.
13. panel test circuit structure as claimed in claim 8, it is characterized in that, described panel test circuit structure further comprises a plurality of testing cushion, wherein said these testing cushion be pass described these through holes and with described these test department electrically connects of described transmission line.
14. panel test circuit structure as claimed in claim 13 is characterized in that, each is equal to the distance of the central point of another described testing cushion of adjacency to the central point of adjacent described these testing cushion one.
15. panel test circuit structure as claimed in claim 13 is characterized in that, each is unequal to the distance of the central point of another described testing cushion of adjacency to the central point of adjacent described these testing cushion one.
16. panel test circuit structure as claimed in claim 13 is characterized in that, each is equal to the same back gauge of another described testing cushion of adjacency to one side of adjacent described these testing cushion one.
17. panel test circuit structure as claimed in claim 13 is characterized in that, each is unequal to the same back gauge of another described testing cushion of adjacency to one side of adjacent described these testing cushion one.
18. panel test circuit structure as claimed in claim 13 is characterized in that, described testing cushion comprises tin indium oxide or other electrically conducting transparent materials.
19. panel test circuit structure as claimed in claim 13 is characterized in that, described panel test circuit structure further comprises a plurality of testing cushion group, and a plurality of adjacent described these testing cushion of part are formed each described these test group respectively.
20. panel test circuit structure as claimed in claim 19 is characterized in that, each described testing cushion group comprises described these testing cushion of equal number.
21. panel test circuit structure as claimed in claim 19 is characterized in that, each described testing cushion group comprises unequal described these testing cushion of number.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810081826A CN100580465C (en) | 2008-04-08 | 2008-04-08 | Panel test circuit structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810081826A CN100580465C (en) | 2008-04-08 | 2008-04-08 | Panel test circuit structure |
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| CN101251565A true CN101251565A (en) | 2008-08-27 |
| CN100580465C CN100580465C (en) | 2010-01-13 |
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| CN200810081826A Expired - Fee Related CN100580465C (en) | 2008-04-08 | 2008-04-08 | Panel test circuit structure |
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| CN105182213A (en) * | 2015-08-04 | 2015-12-23 | 武汉华星光电技术有限公司 | Display panel and signal test method |
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| CN108052462B (en) * | 2017-12-20 | 2019-12-10 | 苏州华兴源创科技股份有限公司 | OLED substrate identification system and method |
| CN109659277B (en) * | 2018-12-18 | 2020-12-04 | 武汉华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
| CN109659277A (en) * | 2018-12-18 | 2019-04-19 | 武汉华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
| CN111653548A (en) * | 2020-06-18 | 2020-09-11 | 京东方科技集团股份有限公司 | Display substrate, display panel and preparation method thereof |
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