CN101228621B - 半导体用粘合剂组合物、使用该组合物的半导体装置及半导体装置的制造方法 - Google Patents

半导体用粘合剂组合物、使用该组合物的半导体装置及半导体装置的制造方法 Download PDF

Info

Publication number
CN101228621B
CN101228621B CN2006800268432A CN200680026843A CN101228621B CN 101228621 B CN101228621 B CN 101228621B CN 2006800268432 A CN2006800268432 A CN 2006800268432A CN 200680026843 A CN200680026843 A CN 200680026843A CN 101228621 B CN101228621 B CN 101228621B
Authority
CN
China
Prior art keywords
semi
conductor
binder composition
semiconductor
plastic film
Prior art date
Application number
CN2006800268432A
Other languages
English (en)
Other versions
CN101228621A (zh
Inventor
藤丸浩一
野中敏央
Original Assignee
东丽株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP165287/2005 priority Critical
Priority to JP2005165287 priority
Application filed by 东丽株式会社 filed Critical 东丽株式会社
Priority to PCT/JP2006/311184 priority patent/WO2006132165A1/ja
Publication of CN101228621A publication Critical patent/CN101228621A/zh
Application granted granted Critical
Publication of CN101228621B publication Critical patent/CN101228621B/zh

Links