CN101207975B - Welding fixture for circuit board - Google Patents

Welding fixture for circuit board Download PDF

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CN101207975B
CN101207975B CN2006101692221A CN200610169222A CN101207975B CN 101207975 B CN101207975 B CN 101207975B CN 2006101692221 A CN2006101692221 A CN 2006101692221A CN 200610169222 A CN200610169222 A CN 200610169222A CN 101207975 B CN101207975 B CN 101207975B
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circuit board
pressing plate
plate
pressing
weld jig
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CN101207975A (en
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杨逸民
杨杰
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State Grid Shanghai Electric Power Co Ltd
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Inventec Corp
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Abstract

一种电路板的焊接夹具,用以在电路板上夹装电子组件,该焊接夹具包括:底座;活动板,其枢设于该底座上方,使该底座与活动板之间形成一夹置空间;压板,其滑动设于该活动板上方,于该压板设有多个压制件,且该压制件穿过活动板而伸入夹置空间垂直压靠在该电路板上的电子组件顶部;定位模块,其设于该活动板侧边,用以定位该压板;以及多个导杆,其设该活动板上方,并穿过该压板,使该压板通过该导杆以上下滑动,并于该导杆上套设一导套,且该导套并固定在该压板上,从而使该压板稳定上下滑动;从而使该压制件垂直向下接触在该些电子组件的顶部,以避免产生侧向推力导致该些电子组件无法紧密贴靠在电路板的缺陷。

Figure 200610169222

A welding fixture for a circuit board is used to clamp electronic components on the circuit board. The welding fixture includes: a base; a movable plate, which is pivotally arranged above the base to form a clamping space between the base and the movable plate; a pressing plate, which is slidably arranged above the movable plate, and a plurality of pressing pieces are arranged on the pressing plate, and the pressing pieces pass through the movable plate and extend into the clamping space to vertically press against the top of the electronic components on the circuit board; a positioning module, which is arranged on the side of the movable plate to position the pressing plate; and a plurality of guide rods, which are arranged above the movable plate and pass through the pressing plate to allow the pressing plate to slide up and down through the guide rods, and a guide sleeve is sleeved on the guide rod, and the guide sleeve is fixed on the pressing plate, so that the pressing plate can slide up and down stably; so that the pressing pieces can vertically contact the tops of the electronic components downward to avoid the defect that the electronic components cannot be tightly attached to the circuit board due to the lateral thrust.

Figure 200610169222

Description

电路板的焊接夹具 Soldering jig for circuit board

技术领域technical field

本发明涉及一种电路板的焊接夹具,更详而言之,涉及一种用以夹装电路板的的夹具。 The invention relates to a soldering fixture for a circuit board, more specifically, a fixture for clamping a circuit board. the

背景技术Background technique

一般印刷电路板在其上插装各式电子组件后,然后进行焊接,而该电子组件为使其能稳固且紧密贴靠在电路板的表面,在电路板上插装该电子组件后,夹装在一焊接夹具上,使该电子组件得以紧密贴靠在电路板上,然后进行焊接作业。 Generally, the printed circuit board is soldered after inserting various electronic components on it, and the electronic component can be firmly and closely attached to the surface of the circuit board. After inserting the electronic component on the circuit board, clip Mounted on a welding fixture, the electronic component can be closely attached to the circuit board, and then the welding operation is performed. the

请参阅图1,现有的焊接夹具,于一底座11的一侧边上方枢设有一压板12,使该底座11与压板12之间形成一夹置空间13,以于该夹置空间13中夹置一电路板14,于该电路板14上已插装完成多个电子组件141,该电子组件如电容、电阻、电感器、变压器及电连接器等,并于该压板12下方设有多个压制件15,而该压制件15设置的位置是位于该些电子组件141的上方。 Please refer to Fig. 1 , the existing welding fixture is pivotally provided with a pressing plate 12 above a side of a base 11, so that a clamping space 13 is formed between the base 11 and the pressing plate 12, so that in the clamping space 13 A circuit board 14 is sandwiched, and a plurality of electronic components 141 have been plugged into the circuit board 14, such as capacitors, resistors, inductors, transformers and electrical connectors, etc. A pressing part 15, and the position of the pressing part 15 is located above the electronic components 141. the

于操作时,先将该压板12向上掀开,然后将该电路板14平放在该底座的预定位置上,再装该压板12盖上,由于该压板12底面的压制件15相对于该电路板14上的电子组件141,而可通过该压制件15将该电子组件141稳固压制在电路板14上,使该电子组件141紧密靠在该电路板14的表面上,以避免该电子组件141与电路板14之间产生过大的间隙,导致该电子组件141于焊接后产生松动的情况。 During operation, first this pressing plate 12 is opened upwards, then this circuit board 14 is placed flat on the predetermined position of this base, and this pressing plate 12 cover is installed again, because the pressed part 15 of this pressing plate 12 bottom surface is relative to this circuit The electronic assembly 141 on the board 14, and the electronic assembly 141 can be firmly pressed on the circuit board 14 by the pressing part 15, so that the electronic assembly 141 is closely attached to the surface of the circuit board 14, so as to avoid the electronic assembly 141 An excessive gap is generated between the circuit board 14 and the electronic component 141 becomes loose after soldering. the

但是该压板12单边枢设于该底座11的一侧边,该压板12盖压在该电路板14上方时,越接近枢设端的电子组件141先接触到该压制件15,而越远离该枢设端的电子组件141越晚接触到该压制件15,即该压制件15与电子组件141之间存在着夹角,使该些压制件15并异步接触该些电子组件141;简言之,即该压制件15并非垂直压触在该些电子组件141的顶部,如此一来,即导致该些电子组件141产生倾斜的情况,使该些电子组件141无法仅密贴靠在该电路板14的表面上,进而导致该些电子组件141于焊接后产生松动的情况。 But the pressing plate 12 is unilaterally pivoted on one side of the base 11. When the pressing plate 12 is pressed on the top of the circuit board 14, the electronic component 141 closer to the pivoting end first contacts the pressing part 15, and the farther it is from the pressing part 15. The later the electronic component 141 at the pivot end contacts the pressing part 15, that is, there is an angle between the pressing part 15 and the electronic component 141, so that the pressing parts 15 contact the electronic components 141 asynchronously; in short, That is, the pressed part 15 is not pressed vertically on the tops of the electronic components 141, so that the electronic components 141 are tilted, so that the electronic components 141 cannot only be tightly attached to the circuit board 14 on the surface, and then lead to loosening of the electronic components 141 after soldering. the

请参阅图2A及图2B,尤其对于一些体积较大,且越靠近枢接处的电子组件,如电感器、变压器或电连接器等,于该压板12向下压靠时,越先接触到该些压制件15(如图2A所示),而在该压板12底面的压制件15全数压靠在该些电子组件141的顶部后,最先被该压制件15接触到的大体积电子组件141即产生侧向推力f,使该些电子组件141与电路板14之间产生间隙G或偏移,如此即产生上述的缺陷。 Please refer to FIG. 2A and FIG. 2B, especially for some electronic components that are larger in size and closer to the pivot joint, such as inductors, transformers or electrical connectors, when the pressing plate 12 is pressed down, the first to contact These pressed parts 15 (as shown in FIG. 2A ), and after the pressed parts 15 on the bottom surface of the pressing plate 12 are all pressed against the tops of the electronic components 141, the bulky electronic components that are first contacted by the pressed parts 15 141 generates a lateral thrust f, causing a gap G or offset between the electronic components 141 and the circuit board 14 , thus causing the above-mentioned defects. the

因此,如何开发一种用以将该电子组件紧密压靠在电路板上的焊接夹具,以避免电子组件与电路板之间产生间隙,使该电子组件紧密贴靠在电路板上,实为目前亟待解决的技术问题。 Therefore, how to develop a soldering fixture for pressing the electronic component tightly against the circuit board, so as to avoid a gap between the electronic component and the circuit board, so that the electronic component is closely attached to the circuit board, is currently a problem. urgent technical issues to be resolved. the

发明内容Contents of the invention

鉴于上述现有技术的缺点,本发明的主要目的在于提供一种电路板的焊接夹具,以紧密将电子组件压靠在电路板表面以避免产生间隙或偏移。 In view of the above-mentioned shortcomings of the prior art, the main purpose of the present invention is to provide a circuit board soldering jig for tightly pressing the electronic components against the surface of the circuit board to avoid gaps or offsets. the

本发明的另一目的在于提供一种电路板的焊接夹具,以避免电子组件于焊接后产生松动。 Another object of the present invention is to provide a soldering fixture for circuit boards to prevent loosening of electronic components after soldering. the

为达上述及其它相关的目的,本发明提供一种电路板的焊接夹具,用以在电路板上夹装电子组件,该焊接夹具包括:底座;活动板,其枢设于该底座上方,使该底座与活动板之间形成一夹置空间,用以夹装该具有电子组件的电路板;压板,其滑动设于该活动板上方,于该压板设有多压制件,且该压制件穿过活动板而伸入夹置空间垂直压靠在该电路板上的电子组件顶部;定位模块,其设于该活动板侧边,用以定位该压板;以及多个导杆,其设该活动板上方,并穿过该压板,使该压板通过该导杆以上下滑动,并于该导杆上套设一导套,且该导套并固定在该压板上,从而使该压板稳定上下滑动。 In order to achieve the above and other related objectives, the present invention provides a circuit board welding fixture for clamping electronic components on the circuit board. The welding fixture includes: a base; a movable plate pivotally arranged above the base, so that A clamping space is formed between the base and the movable plate for clamping the circuit board with electronic components; the pressing plate is slidably arranged above the movable plate, and there are multiple pressing parts on the pressing plate, and the pressing parts pass through The movable plate extends into the clamping space and vertically presses against the top of the electronic component on the circuit board; the positioning module is arranged on the side of the movable plate to position the pressing plate; and a plurality of guide rods are arranged on the movable plate above the plate, and pass through the pressure plate, so that the pressure plate slides up and down through the guide rod, and a guide sleeve is set on the guide rod, and the guide sleeve is fixed on the pressure plate, so that the pressure plate slides up and down stably . the

依上述的构造,本发明还包括有为弹簧的第一弹性组件,其设于该导杆上,并位于该压板与活动板之间,使该压板于向下滑动后回位。 According to the above structure, the present invention also includes a first elastic component as a spring, which is arranged on the guide rod and located between the pressing plate and the movable plate, so that the pressing plate returns after sliding down. the

该定位模块于一座体中设有一伸缩件,于该座体与伸缩件之间设有一为弹簧的第二弹性组件,使该压板向下移动后,该伸缩件之一端向外退出后回位压靠在该压板的边缘上以定位该压板。 The positioning module is provided with a telescopic piece in the base body, and a second elastic component that is a spring is provided between the base body and the telescopic piece, so that after the pressing plate moves downward, one end of the telescopic piece withdraws outward and then returns Press against the edge of the platen to position the platen. the

该伸缩件位于该压板边缘的一端具有一斜面,且该伸缩件位相对于该斜面的一端具有一推压部,通过抽拉该推压部使该伸缩件具有斜面的一端脱离该压板边缘,用以释放该压板,并使该压板通过该第一弹性组件回位上升。 The end of the telescopic element located at the edge of the pressing plate has an inclined surface, and the end of the expanding element opposite to the inclined surface has a pushing portion, and by pulling the pushing portion, the end with the inclined surface of the expanding element is separated from the edge of the pressing plate, and the to release the pressing plate, and make the pressing plate return and rise through the first elastic component. the

相比于现有技术,本发明的电路板的焊接夹具,先将具有电子组件的电路板放置在底座上方,然后放下该活动板,之后将该压板向下推,使该压板底面的压制件垂直向下接触在该些电子组件的顶部,如此一来即可使该压制件同步接触该些电子组件,使该些电子组件紧密贴靠在电路板上,以避免现有的焊接夹具于该压板向下压靠时因接触时间不同,产生侧向推力导致该电子组件与电路板之间产生间隙或偏移而无法紧密贴靠在电路板表面的缺陷。 Compared with the prior art, the circuit board welding jig of the present invention first places the circuit board with electronic components above the base, then puts down the movable plate, and then pushes the pressing plate down, so that the pressed parts on the bottom surface of the pressing plate vertically downward contact on the top of these electronic components, so that the pressing part can contact these electronic components synchronously, so that these electronic components are closely attached to the circuit board, so as to avoid the existing soldering fixture on the When the pressure plate is pressed down, due to the different contact time, a lateral thrust is generated, resulting in a gap or offset between the electronic component and the circuit board, which cannot be tightly attached to the surface of the circuit board. the

附图说明Description of drawings

图1为现有电路板的焊接夹具的侧视示意图; Fig. 1 is the side view schematic diagram of the soldering fixture of existing circuit board;

图2A为现有电路板的焊接夹具的压制件接触在电子组件顶部的示意图; Fig. 2A is the schematic diagram that the pressed part of the welding jig of existing circuit board is contacted on the top of electronic component;

图2B为现有电路板的焊接夹具的压制件接触在电子组件顶部后产生侧向推力的示意图; Figure 2B is a schematic diagram of the lateral thrust generated after the pressing part of the welding fixture of the existing circuit board contacts the top of the electronic component;

图3A为本发明的电路板的焊接夹具的活动件与压板盖在电路板上的侧视示意图;以及 Fig. 3 A is the side view schematic diagram of the movable part and the pressure plate cover of the welding fixture of the circuit board of the present invention on the circuit board; and

图3B为本发明的电路板的焊接夹具的压板底面压制件垂直接触电路板上电子组件的侧视示意图。 FIG. 3B is a schematic side view of the pressing part on the bottom surface of the pressing plate of the soldering fixture for the circuit board of the present invention in vertical contact with the electronic components on the circuit board. the

附图标记说明 Explanation of reference signs

11、21 底座        12、24 压板 11, 21 base 12, 24 pressure plate

13、23 夹置空间    14、3  电路板 13, 23 clamping space 14, 3 circuit board

141、31电子组件    15、26 压制件 141, 31 electronic components 15, 26 pressed parts

2      焊接夹具    f      侧向推力 2 welding fixture f lateral thrust

22     活动板      251    导套22 movable plate 251 guide sleeve

252    第一弹性组件25     导杆 252 first elastic component 25 guide rod

27     定位模块    271    座体 27 Positioning module 271 Seat body

272    伸缩件      272a   斜面 272 telescopic part 272a inclined plane

272b   推压部      G      间隙 272b Push part G Gap

273    第二弹性组件 273 Second elastic component

具体实施方式Detailed ways

以下通过特定具体实例说明本发明的实施方式,本领域技术人员可由本说明书所公开的内容轻易地观察本发明的其它优点与功效。 Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily observe other advantages and effects of the present invention from the content disclosed in this specification. the

请参阅图3A及图3B,为本发明的电路板的焊接夹具的侧视示意图;该焊接夹具2用以在电路板3上夹装电子组件31,该焊接夹具2包括:一底座21;一枢设于该底座21上方的活动板22,而在该底座21与活动板22之间形成有一夹置空间23,用以夹装该具有电子组件31的电路板3;一滑动设于该活动板22上方的压板24,于该活动板22上方设有多个导杆25,且在该导杆25上套设有一导套251并固定在该压板24上,从而使该压板24稳定上下滑动,又于该导杆25上且位于该压板24与活动板22之间设有一为弹簧的第一弹性组件252,使该压板24于向下滑动后通过该第一弹性组件252回位,又于该压板24设有多个压制件26,且该压制件26穿过活动板22而伸入夹置空间23垂直压靠在该电路板3上的电子组件31顶部;以及设于该活动板22侧边的定位模块27,用以定位该压板24。 Please refer to FIG. 3A and FIG. 3B , which are schematic side views of the welding jig of the circuit board of the present invention; the welding jig 2 is used to clamp the electronic component 31 on the circuit board 3, and the welding jig 2 includes: a base 21; The movable plate 22 pivotally arranged on the top of the base 21 forms a clamping space 23 between the base 21 and the movable plate 22 for clamping the circuit board 3 with the electronic component 31; The pressure plate 24 above the plate 22 is provided with a plurality of guide rods 25 above the movable plate 22, and a guide sleeve 251 is set on the guide rod 25 and fixed on the pressure plate 24, so that the pressure plate 24 slides up and down stably , and on the guide rod 25 and between the pressing plate 24 and the movable plate 22, a first elastic component 252 is provided as a spring, so that the pressing plate 24 is returned by the first elastic component 252 after sliding downward, and A plurality of pressing parts 26 are provided on the pressing plate 24, and the pressing parts 26 pass through the movable plate 22 and extend into the clamping space 23 to vertically press against the top of the electronic component 31 on the circuit board 3; The positioning module 27 on the side of 22 is used to position the pressing plate 24. the

该定位模块27于一座体271中设有一伸缩件272,于该座体271与伸缩件272之间设有一为弹簧的第二弹性组件273;且该伸缩件272位于该压板24边缘的一端具有一斜面272a,以通过该伸缩件272具有斜面272a的一端压靠在压板24边缘上,以定位该压板24,于该伸缩件272位相对于该斜面272a的一端具有一推压部272b,通过抽拉该推压部272b,使该伸缩件272具有斜面272a的一端脱离该压板24边缘,用以释放该压板24,并使该压板通过该第一弹性组件252回位上升。 The positioning module 27 is provided with a telescopic part 272 in the base body 271, and a second elastic component 273 which is a spring is arranged between the seat body 271 and the telescopic part 272; An inclined surface 272a is pressed against the edge of the pressing plate 24 by the end of the telescopic member 272 having the inclined surface 272a, so as to locate the pressing plate 24. There is a pushing portion 272b at the end of the telescopic element 272 opposite to the inclined surface 272a. Pulling the pushing portion 272b makes the end of the telescopic member 272 with the inclined surface 272a detached from the edge of the pressing plate 24 to release the pressing plate 24 and make the pressing plate go back and rise through the first elastic component 252 . the

由上述构造,将该电路板3夹装在该焊接夹具2的夹置空间23中的步骤,先确定该活动板22位于开启的状态,然后将该具有电子组件31的电路板3放置于该底座21的预定位置上,接着放下该活动板22, 使该活动板22位于该电路板3的上方;再推压该压板24,使该压板24通过该导杆25以垂直稳定地向下滑动,以使位于该压板24底部的压制件26一致地接触在该电路板3上的电子组件31顶部;而该压板24向下推压时,由于该压板24的边缘的下部靠在该伸缩件272的斜面272a上,从而可通过斜面作用以将该伸缩件272向外推,当该压板24的边缘的下部越过斜面272a最底部时,该伸缩件272通过第二弹性组件273的弹力回位,使该伸缩件272的斜面272a的下部靠在该压板24边缘的上部,从而将该压板24定位在下压的状态,使该压板24底部的压制件26定位压住该电路板3上的该些电子组件,且该些压制件26垂直向下接触在电子组件31顶部,而不会产生侧向推力,使该些电子组件31得以紧密接触在该电路板3的表面上,以避免产生间隙或偏移的状况,而可利于后续进行焊接制造,进而可避免该些电子组件31产生松动的情况;因此,能免除现有构造的缺陷。 From the above structure, the step of clamping the circuit board 3 in the clamping space 23 of the soldering fixture 2 is to first determine that the movable plate 22 is in an open state, and then place the circuit board 3 with the electronic components 31 on the On the predetermined position of base 21, then put down this movable plate 22, make this movable plate 22 be positioned at the top of this circuit board 3; Push this pressing plate 24 again, make this pressing plate 24 slide down vertically and stably by this guide rod 25 , so that the pressing part 26 at the bottom of the pressing plate 24 uniformly contacts the top of the electronic assembly 31 on the circuit board 3; 272 on the inclined surface 272a, so that the telescopic member 272 can be pushed outward by the action of the inclined surface. When the lower part of the edge of the pressing plate 24 crosses the bottom of the inclined surface 272a, the telescopic member 272 returns to its original position through the elastic force of the second elastic component 273 Make the lower part of the inclined surface 272a of the telescopic member 272 lean against the upper part of the edge of the pressing plate 24, thereby positioning the pressing plate 24 in a depressed state, and positioning the pressing part 26 at the bottom of the pressing plate 24 to press the circuit board 3. These electronic components, and these pressings 26 contact vertically downwards on the top of the electronic components 31, without generating lateral thrust, so that these electronic components 31 can be closely contacted on the surface of the circuit board 3, so as to avoid gaps Or offset situation, which can facilitate the subsequent welding manufacturing, thereby avoiding the loosening of these electronic components 31; therefore, the defects of the existing structure can be avoided. the

当完成焊接制造后,欲取下该电路板3时,一通过该推压部272b以将该伸缩件272向外拉出,使该伸缩件272的斜面272a的下部脱离该压板24边缘,而可释放该压板24,此时该压板24通过该第一弹性组件252回位上升,从而使该压板24底部的压制件26不再压靠在该电路板3表面上的电子组件31;最后,再将该活动板22向上掀开,即可取出该完成焊接制造方法的电路板3。 After finishing the welding and manufacturing, when desiring to take off the circuit board 3, the telescopic member 272 is pulled out by the pushing portion 272b, so that the lower part of the inclined surface 272a of the telescopic member 272 is separated from the edge of the pressing plate 24, and The pressing plate 24 can be released, and at this time, the pressing plate 24 returns and rises through the first elastic component 252, so that the pressing part 26 at the bottom of the pressing plate 24 is no longer pressed against the electronic component 31 on the surface of the circuit board 3; finally, Then lift the movable plate 22 upwards to take out the circuit board 3 which has completed the soldering manufacturing method. the

综上可知,本发明的电路板的焊接夹具,该压板垂直滑动设于该活动板上,使该具有电子组件的电路板放置在底座上方后,放下该活动板,再将该压板向下推,使该压板底面的压制件垂直向下接触在该些电子组件的顶部,从而使该压制件同步接触该些电子组件,以将该些电子组件紧密贴靠在电路板上,从而可避免现有的焊接夹具于该压板向下压靠时因接触时间不一,产生侧向推力导致该电子组件与电路板之间产生间隙或偏移而无法紧密贴靠在电路板表面的缺陷。 In summary, in the circuit board welding jig of the present invention, the pressing plate is vertically slid on the movable plate so that the circuit board with electronic components is placed above the base, the movable plate is put down, and the pressing plate is pushed down , so that the pressed part on the bottom surface of the pressing plate contacts the top of the electronic components vertically downwards, so that the pressed part contacts the electronic components synchronously, so that the electronic components are closely attached to the circuit board, thereby avoiding In some welding fixtures, when the pressure plate is pressed down, due to the different contact time, lateral thrust is generated, resulting in a gap or offset between the electronic component and the circuit board, which cannot be tightly attached to the surface of the circuit board. the

以上所述实施例仅为本发明的较佳实施方式而已,并非用以限定本发明的范围,亦即,本发明事实上仍可作其它改变,因此,举凡所属技术领域中具有通常知识者在未脱离本发明所揭示的精神与技术思想下所完成的一切等效修饰或改变,仍应由前述的权利要求书涵盖。The above-described embodiments are only preferred implementations of the present invention, and are not intended to limit the scope of the present invention. All equivalent modifications or changes made without departing from the spirit and technical ideas disclosed in the present invention should still be covered by the preceding claims.

Claims (7)

1. the weld jig of a circuit board in order to clamp electronic building brick on circuit board, is characterized in that, the weld jig of this circuit board comprises:
Base;
Portable plate, it is hubbed at this base top, makes to form one between this base and the portable plate and insert and put the space, in order to clamp the circuit board that this has electronic building brick;
Pressing plate, its slip are located at this portable plate top, are provided with a plurality of rolled-up stocks in this pressing plate, and this rolled-up stock passes portable plate and stretches into and insert and put spatial vertical and be pressed against electronic building brick top on this circuit board;
Locating module, it is located at this portable plate side, in order to locate this pressing plate;
A plurality of guide rods, it establishes this portable plate top, and passes this pressing plate, make this pressing plate by this guide rod to slide up and down; And
Guide pin bushing, it is sheathed on this guide rod and is fixed on this pressing plate, this pressing plate is stable to slide up and down thereby make.
2. the weld jig of circuit board according to claim 1 is characterized in that, also comprises first elastic parts, and it is located on this guide rod, and between this pressing plate and portable plate, makes this pressing plate in return after lower slider.
3. the weld jig of circuit board according to claim 2 is characterized in that, this first elastic parts is a spring.
4. the weld jig of circuit board according to claim 1, it is characterized in that, this locating module is provided with an extensible member in a pedestal, between this pedestal and extensible member, be provided with one second elastic parts, after this pressing plate was moved down, an end of this extensible member outwards withdrawed from the back return and is pressed against on the edge of this pressing plate to locate this pressing plate.
5. the weld jig of circuit board according to claim 4 is characterized in that, this second elastic parts is a spring.
6. the weld jig of circuit board according to claim 4 is characterized in that, the end that this extensible member is positioned at this platen edge has an inclined-plane.
7. the weld jig of circuit board according to claim 6, it is characterized in that, this extensible member position has a pushing portion with respect to an end on this inclined-plane, an end that should pushing portion makes this extensible member have the inclined-plane by pull breaks away from this platen edge, in order to discharging this pressing plate, and this pressing plate is risen by this first elastic parts return.
CN2006101692221A 2006-12-20 2006-12-20 Welding fixture for circuit board Active CN101207975B (en)

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CN102520538B (en) * 2011-12-29 2014-07-02 友达光电(苏州)有限公司 Welding point testing tool
CN104010452B (en) * 2013-12-21 2017-03-15 广西柳州中嘉知识产权服务有限公司 The welding method of power field effect pipe
CN105397471A (en) * 2015-12-18 2016-03-16 候松谊 Mounting and locking component for circuit board
CN105414917A (en) * 2015-12-18 2016-03-23 陈建 Stably-running installing and locking device for circuit board
CN105911456A (en) * 2016-04-25 2016-08-31 昆山瑞鸿诚自动化设备科技有限公司 Touch sound equipment mainboard test tool
CN107570835B (en) * 2017-09-29 2019-11-08 武汉光迅科技股份有限公司 A welding device and method for PCB placement board assembly, circuit board and socket
CN108072521B (en) * 2018-02-09 2020-08-04 深圳创维-Rgb电子有限公司 Vertical terminal detection device

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